JP5257480B2 - 光処理装置 - Google Patents
光処理装置 Download PDFInfo
- Publication number
- JP5257480B2 JP5257480B2 JP2011069688A JP2011069688A JP5257480B2 JP 5257480 B2 JP5257480 B2 JP 5257480B2 JP 2011069688 A JP2011069688 A JP 2011069688A JP 2011069688 A JP2011069688 A JP 2011069688A JP 5257480 B2 JP5257480 B2 JP 5257480B2
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- JP
- Japan
- Prior art keywords
- window member
- light
- lamp
- processing apparatus
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 14
- 230000007261 regionalization Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/06—Silver salts
- G03F7/07—Silver salts used for diffusion transfer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/213—Exposing with the same light pattern different positions of the same surface at the same time
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
ケーシング10の内部には紫外線放射ランプ11(以下、「ランプ」ともいう)が配置されている。ケーシング10の一面には、例えば石英ガラスなどの光透過性部材が装着されて窓部材12となっている。窓部材12の直上には、例えば、ナノインプリントのテンプレートなどのワークWが図示略の保持部材で保持されている。ワークWは例えば正方形であって、窓部材12も同様に正方形で構成される。図8(a)に示すように、ワークWと窓部材12を重ねて眺めると、両者は一辺同士が交差することなく、すなわち、両者の対角線は互いに重なるような位置関係になっている。
いずれも場合であっても、図4の場合と同様であって、ワークWのいずれか一辺を窓部材12のいずれか一辺と平行ではなく交差する関係に配置させることで、ワークWのL領域に配置される面積が小さくなり、放射量の利用効率が高まっていることがわかる。ただ、窓部材12あるいはワークWのいずれか一方が長方形の場合は45°が最適ということにはならず、長方形の縦横比に応じて最適角度が決まる。
11 紫外線放射ランプ
12 窓部材
13 枠部材
20 光源ユニット
21 ランプ収容室
22 電源収容室
23 隔壁
24 昇圧トランス
30 放電容器
31 口金
32 電極
W ワーク
Claims (5)
- 光照射ユニットからの放射光を略矩形状のパターン形成部を有するワークに照射させる光処理装置において、
前記光照射ユニットは、ケーシングと、このケーシングの内部に配置された紫外線放射ランプと、ケーシングの一面に設けられた矩形状の光透過性窓部材とよりなり、
前記光透過性窓部材と前記パターン形成部の一辺同士が平行ではないことを特徴とする光処理装置。 - 前記光透過性窓部材と前記パターン形成部はともに正方形であって、
お互いの対角線同士は45°にて交差していることを特徴とする請求項1の光処理装置。 - 前記ランプの長手方向に伸びる中心線と、前記パターン形成部の一辺が交差していることを特徴とする請求項1の光処理装置。
- 前記ワークはナノインプリント用テンプレートであることを特徴とする請求項1又は請求項2の光処理装置。
- 前記紫外線放射ランプは、外部に一対の電極を有するエキシマランプであることを特徴とする請求項1又は請求項2の光処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011069688A JP5257480B2 (ja) | 2011-03-28 | 2011-03-28 | 光処理装置 |
KR1020120013255A KR20120110001A (ko) | 2011-03-28 | 2012-02-09 | 광처리 장치 |
US13/432,403 US8513631B2 (en) | 2011-03-28 | 2012-03-28 | Light processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011069688A JP5257480B2 (ja) | 2011-03-28 | 2011-03-28 | 光処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012204736A JP2012204736A (ja) | 2012-10-22 |
JP5257480B2 true JP5257480B2 (ja) | 2013-08-07 |
Family
ID=46925983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011069688A Expired - Fee Related JP5257480B2 (ja) | 2011-03-28 | 2011-03-28 | 光処理装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8513631B2 (ja) |
JP (1) | JP5257480B2 (ja) |
KR (1) | KR20120110001A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5257480B2 (ja) * | 2011-03-28 | 2013-08-07 | ウシオ電機株式会社 | 光処理装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3869614A (en) * | 1973-03-16 | 1975-03-04 | Varian Associates | Phosphor assembly for ultraviolet light absorption detector |
US4455090A (en) * | 1979-07-26 | 1984-06-19 | The Wiggins Teape Group Limited | Apparatus for measuring surface reflectance characteristics |
JP2803335B2 (ja) * | 1990-06-29 | 1998-09-24 | 松下電器産業株式会社 | レジストのアッシング方法及びその装置 |
JPH05223998A (ja) * | 1992-02-12 | 1993-09-03 | Mitsubishi Heavy Ind Ltd | 電子線照射装置 |
US5393980A (en) * | 1993-05-11 | 1995-02-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Quality monitor and monitoring technique employing optically stimulated electron emmission |
JP2000194142A (ja) | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | パタ―ン形成方法及び半導体装置の製造方法 |
DE19964181B4 (de) * | 1999-02-10 | 2005-12-08 | Steag Rtp Systems Gmbh | Vorrichtung zum Messen der Tempertur von Substraten |
US7052369B2 (en) * | 2002-02-04 | 2006-05-30 | Kla-Tencor Technologies Corp. | Methods and systems for detecting a presence of blobs on a specimen during a polishing process |
JP2004056086A (ja) * | 2002-05-31 | 2004-02-19 | Ushio Inc | ランプ点灯制御装置および光照射装置 |
KR100575230B1 (ko) * | 2002-12-28 | 2006-05-02 | 엘지.필립스 엘시디 주식회사 | 노광 장치를 이용한 노광 방법 |
US7132648B2 (en) * | 2003-04-15 | 2006-11-07 | Science & Technology Corporation@Unm | Uniform, non-disruptive, and radiometrically accurate calibration of infrared focal plane arrays using global scene motion |
JP4483290B2 (ja) * | 2003-12-26 | 2010-06-16 | 株式会社ジーエス・ユアサコーポレーション | エキシマランプ照射装置 |
JP2005294801A (ja) * | 2004-03-11 | 2005-10-20 | Advanced Lcd Technologies Development Center Co Ltd | レーザー結晶化装置及びレーザー結晶化方法 |
US7248332B2 (en) * | 2004-07-13 | 2007-07-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
NL1036272A1 (nl) * | 2007-12-19 | 2009-06-22 | Asml Netherlands Bv | Radiation source, lithographic apparatus and device manufacturing method. |
JP2009164525A (ja) * | 2008-01-10 | 2009-07-23 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
TWI437609B (zh) * | 2008-05-30 | 2014-05-11 | Gs Yuasa Int Ltd | 外部電極型放電燈以及使用該放電燈之紫外線照射裝置 |
KR101333239B1 (ko) * | 2008-12-11 | 2013-11-26 | 오스람 게엠베하 | 특히 기술 제품 프로세싱에 사용되는, 복수의 uv 램프들을 구비하는 uv 조명기구 |
JP2010205577A (ja) * | 2009-03-04 | 2010-09-16 | Ushio Inc | 光源装置を点灯する方法 |
JP5317852B2 (ja) * | 2009-06-29 | 2013-10-16 | 株式会社クォークテクノロジー | 紫外線照射装置 |
JP5348156B2 (ja) * | 2011-03-01 | 2013-11-20 | ウシオ電機株式会社 | 光照射装置 |
JP5257480B2 (ja) * | 2011-03-28 | 2013-08-07 | ウシオ電機株式会社 | 光処理装置 |
-
2011
- 2011-03-28 JP JP2011069688A patent/JP5257480B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-09 KR KR1020120013255A patent/KR20120110001A/ko not_active Application Discontinuation
- 2012-03-28 US US13/432,403 patent/US8513631B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20120248339A1 (en) | 2012-10-04 |
US8513631B2 (en) | 2013-08-20 |
JP2012204736A (ja) | 2012-10-22 |
KR20120110001A (ko) | 2012-10-09 |
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