JP5120751B2 - Bonding equipment - Google Patents

Description

  The present invention relates to an improvement in a bonding apparatus that heats and bonds electronic components by irradiating a laser, and more specifically, features in a means for inspecting the quality of a light guide state of a fiber emitting laser in the bonding apparatus. It is what you have.

  Conventionally, as a bonding apparatus for heating and bonding an electronic component by irradiating a laser from the inside of a bonding head (laser head), as shown in Patent Document 1, a bonding tool can transmit a laser, A method is known in which a laser is directly applied to an electronic component, and the electronic component is heated and bonded.

  This type of bonding apparatus has a configuration in which a laser is guided by an optical fiber, but the optical fiber may be broken, broken, or disconnected. In such a state, not only the electronic components cannot be heated and bonded properly, but also there is a danger that the laser leaks to the outside.

  Therefore, a means for detecting a fiber abnormality as shown in Patent Document 2 before processing has been disclosed. In addition, in the method of detecting fiber abnormalities at the time of bonding (processing), detection is performed after electronic parts and substrates are heated and pressurized, and bumps and bonding inclusions (resin, etc.) are deformed and re-used. It becomes impossible to use and is not an effective inspection means.

  However, the inspection means disclosed in Patent Document 2 is an inspection means in a laser device used for laser processing (processing of industrial products or medical treatment), and inspection light that does not contribute to laser processing is processed laser light. In this case, the abnormality of the fiber is detected by detecting the inspection light that is output from another inspection light source and emitted from the other end of the optical fiber for processing laser light.

  However, this type of inspection means is not preferable because it requires a separate light source in addition to the main processing light source, which increases the size and complexity of the apparatus.

Japanese Patent No. 3195970 Japanese Patent Laid-Open No. 2-258185

  In order to solve the above-mentioned problems, the present invention employs a control means that can change the output of the laser emitted from the laser oscillation means, and performs inspection by emitting the laser from the fiber with a laser output lower than that at the time of bonding. Thus, an object of the present invention is to provide a bonding apparatus that can detect an abnormality of a fiber without adversely affecting an electronic component or an object to be bonded before bonding (bonding).

In order to solve the above-mentioned problems, a first invention provides a laser oscillating means, a fiber for guiding a laser from the laser oscillating means, a laser connected to the fiber and capable of emitting a laser from the lower part, and the lower part A bonding apparatus for heating and bonding the electronic component by irradiating a laser beam from the laser head on the bonding stage. The following measures are adopted.
First, control means for making variable the output of the laser emitted from the laser oscillation means;
Light receiving means for receiving the laser emitted from the fiber, a moving mechanism for moving the laser head relative to the bonding stage, and the light guide state of the fiber based on the amount of light received by the light receiving means And inspection means for inspecting.
Second, a light receiving portion of the light receiving means is provided in the laser head, and an electronic component is held under the laser head, and a laser is emitted from the fiber at a laser output lower than that at the time of bonding, and the inspection is performed. And means for inspecting the quality of the light guiding state of the fiber based on the amount of light received including the reflected light from the electronic component received by the light receiving means.

According to a second aspect of the present invention, a laser oscillation means, a fiber for guiding a laser from the laser oscillation means, the laser is emitted from the lower part connected to the fiber, and an electronic component can be held in the lower part A laser head and a bonding stage that supports an object to be bonded of an electronic component are provided, and the following means is adopted in a bonding apparatus that heats and bonds the electronic component by irradiating a laser beam from the laser head on the bonding stage. .
First, the control means for making the output of the laser emitted from the laser oscillation means variable, the light receiving means for receiving the laser emitted from the fiber, and the laser head relative to the bonding stage And a moving mechanism for moving the light receiving means, and inspection means for inspecting the quality of the light guiding state of the fiber based on the amount of light received by the light receiving means.
Second, the light receiving unit of the light receiving unit is provided so as to be movable upward relative to the laser head, and the electronic component is not held below the laser head. Is positioned below the laser head, the laser is emitted from the fiber at a laser output lower than that at the time of bonding, and the light guiding state of the fiber is determined based on the amount of light received by the light receiving means at the inspection means. Inspect the quality.

  According to a third invention, in the first invention or the second invention, the fiber is composed of a plurality of fibers, a predetermined number of lasers are guided to the fiber, and the laser is split into a plurality of times and the laser is split from the fibers. It is a bonding apparatus to which it is emitted and inspected for the quality of the light guide state of the fiber by the inspection means.

  In the first invention, the electronic component is held below the laser head, the laser is emitted from the fiber at a laser output lower than that at the time of bonding, and the inspection unit receives the electronic component received by the light receiving unit. Inspecting the quality of the light guide state of the fiber based on the amount of received light including the reflected light of the optical fiber. Therefore, it is possible to check the quality of the light guide state of the fiber before joining the electronic components.

  In a second aspect of the invention, the light receiving portion of the light receiving means is provided so as to be movable upward relative to the laser head, and the light receiving means receives the light without holding an electronic component under the laser head. The laser beam is emitted from the fiber with a laser output lower than that at the time of bonding, and the inspection unit is configured to guide the fiber based on the amount of light received by the light receiving unit. Since it is for checking the quality of the state, the laser is not irradiated to electronic parts or objects to be joined, and further, the low output causes an adverse effect on the surroundings and the light receiving elements constituting the light receiving unit. Therefore, it is possible to inspect the quality of the light guiding state of the fiber before joining the electronic components.

  In addition, when the said fiber consists of a plurality of fibers and only a specific part of them is broken, it becomes difficult to detect which fiber is broken. Accordingly, in the third invention, when the fiber is composed of a plurality of fibers, the laser is guided to the fibers by a predetermined number, and the laser is divided into a plurality of times, and the laser is emitted from the fiber. By examining the quality of the light state, it is possible to detect which fiber is broken.

  Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. The bonding apparatus in the embodiment is an apparatus for bonding a semiconductor chip 1 as an electronic component to a substrate 2 as a bonding target. FIG. 1 is an overall schematic explanatory view showing an embodiment of a bonding apparatus. The bonding apparatus includes a laser head 4 serving as a bonding head for bonding a semiconductor chip 1 to a substrate 2, a chip tray 20 and a substrate mounting stage 21. The table 22 is provided. The chip tray 20 is for chip supply and is not limited to the form of a tray, but may be a wafer itself. The substrate mounting stage 21 constitutes a bonding stage for performing bonding.

  The laser head 4 has a bonding tool 3 for attracting and holding the semiconductor chip 1 at its tip (lower end), and can be moved by an elevating mechanism 31 and a horizontal moving mechanism 32. That is, the laser head 4 sucks and holds the semiconductor chip 1 by the bonding tool 3 on the chip tray 20 which is the chip supply position, moves to the substrate mounting stage 21 which is the bonding position, and descends to the substrate 2. The semiconductor chip 1 is mounted, heated and bonded, fixed after cooling, bonding is completed, and the operation of rising and returning to the chip supply position is repeated.

  In the embodiment, the laser head 4 is provided with the elevating mechanism 31 and the horizontal moving mechanism 32 so that the laser head 4 can be moved. However, the laser head 4 and the chip tray 20 or the substrate mounting stage 21 may be moved relative to each other. Therefore, a drive mechanism is provided on the table 22 on which the chip tray 20 and the substrate placement stage 21 are arranged, and the table 22 is moved to move the table 22 and the laser head 4 relative to each other. The two may be moved relative to each other by moving them.

  The inside of the laser head 4 is an empty portion 5, and a laser heating device 6 for heating the semiconductor chip 1 held by the bonding tool 3 by irradiating a laser 17 from the inside of the laser head 4 is provided in the empty portion 5. Has been placed.

  A bonding tool 3 is attached to the lower end of the laser head 4. In the embodiment, the bonding tool 3 is made of quartz glass that has a small thermal expansion and is highly transmissive to the laser 17. However, any material that transmits the laser 17 may be used, and sapphire can also be used. A suction hole 18 for sucking and holding the semiconductor chip 1 is formed in the center of the bonding tool 3. Further, an antireflection film is formed on the surface (upper surface in FIG. 2) located on the inner side of the laser head 4 of the bonding tool 3.

  A suction passage 7 is formed in the laser head 4, and the hollow portion 5 is sealed except for the suction passage 7 and the suction hole 18 of the bonding tool 3 attached to the lower end of the laser head 4. Furthermore, since the suction passage 7 is connected to the suction device 8, vacuum suction is applied to the empty portion 5 in the laser head 4 by vacuum suction by the suction device 8, and the suction hole 18 of the bonding tool 3. In addition, the semiconductor chip 1 can be held by suction.

The laser heating device 6 is connected to the laser oscillator 14, the control device 16 that can change the output of the laser 17 emitted from the laser oscillator 14, and the laser oscillator 14, guides the laser 17, and the laser 17 from below. An optical fiber 9 in which a laser emission port 10 is positioned in the laser head 4, a condensing lens 11 as a condensing means for focusing the laser 17 emitted from the emission port 10, and an irradiation range of the laser 17 A shielding plate 15 for limiting the above.
Since the laser 17 emitted from the optical fiber 9 is diffused and enters the condenser lens 11, the condensing point of the laser 17 is provided below the focal position of the condenser lens 11.

  In the embodiment, the condensing lens 11 is a single convex lens, but a plurality of lenses may be used. The condenser lens 11 is supported by a holder in the laser head 4. The condensing point of the laser by the condensing lens 11 is set in the empty portion 5 inside the laser head 4. An antireflection film is formed on the front and back surfaces of the condenser lens 11. Moreover, you may use a concave mirror as a condensing means.

  The shielding plate 15 is for preventing the laser 17 that has passed through the condenser lens 11 from protruding from the semiconductor chip 1 to be irradiated. Although the shielding plate 15 exists in the embodiment, it is not necessary to provide the shielding plate 15 when the irradiation range can be adjusted to be limited to the semiconductor chip 1 only by the condenser lens 11.

  If the laser 17 protrudes from the semiconductor chip 1, there is a risk that the substrate 2 is irradiated with the laser 17 and heated to expand. When the substrate 2 is made of a resin, the substrate 2 is greatly expanded as compared with the substrate 2 made of silicone. When bonding is performed in a state where the substrate 2 is heated and expanded, the positions of the bumps and the electrodes are shifted, and even when the substrate 2 is cooled and returned to the original state, the semiconductor chip 1 may bend and become defective. The shielding plate 15 is provided to avoid this danger.

  A reflected light detection photosensor 12 for detecting scattered light such as reflected light of the laser 17 irradiated on the semiconductor chip 1 adsorbed to the bonding tool 3 is obliquely above the bonding tool 3 in the laser head 4. Is provided. The photosensor 12 serves as a light receiving means in the present invention. The light receiving portion 13 of the photosensor 12 serving as the light receiving means is disposed toward the semiconductor chip 1 held at the lower portion in the laser head 4, that is, the lower portion so as to receive the reflected light from the surface of the semiconductor chip 1. A signal from the light receiving unit 13 of the photosensor 12 is input to the control device 16 through a fiber. Note that the photo sensor 12 may be provided in the control device 16 to receive light guided by an optical fiber facing the laser head 4. In this case, the tip of the optical fiber facing the laser head 4 becomes the light receiving unit 13.

  The control device 16 has a built-in inspection device 23, which inspects whether or not the amount of light received by the light receiving unit 13 is greater than or equal to a predetermined amount by comparing with a preset reference value. . If the amount of received light satisfies a predetermined amount, the control device 16 moves the laser head 4 upward and lowers the substrate 2 and instructs to bond the semiconductor chip 1 held by suction to the substrate 2. do. If the amount of received light does not satisfy the predetermined amount, the movement of the laser head 4 is stopped, and an instruction is given to output an alarm of fiber abnormality.

  In the photo sensor 12 and the inspection apparatus 23, since the laser head 4 reciprocates between the chip supply position and the bonding position, the optical fiber 9 may be repeatedly broken and disconnected. Is provided to try to detect.

  Hereinafter, the bonding operation will be described. First, the substrate 2 is supplied onto the substrate placement stage 21 at the bonding position. On the other hand, at the chip supply position, the laser head 4 attracts and holds the semiconductor chip 1 from the chip tray 20 to the bonding tool 3 and moves up. Thereafter, the laser head 4 is moved by the horizontal movement mechanism 32 to the substrate mounting stage 21 which is a bonding position.

  During this moving process, the laser oscillator 14 operates for inspection, and the laser 17 is emitted from the laser emission port 10 of the optical fiber 9 with a laser output having a lower output than that at the time of bonding. At this time, the light receiving unit 13 of the photosensor 12 receives scattered light including reflected light from the upper surface of the semiconductor chip 1. It is inspected whether or not the amount of received light is a predetermined amount or more. If the amount of received light satisfies a predetermined amount, the laser head 4 moves to the bonding position on the substrate 2 and descends to bond the semiconductor chip 1 held by suction to the substrate 2. If the amount of received light does not satisfy the predetermined amount, the movement of the laser head 4 is stopped and a fiber abnormality alarm is output. The bonding may be performed by heat-pressure bonding in which the held semiconductor chip 1 is pressed against the substrate 2 while irradiating the laser, or the semiconductor chip 1 is placed on the substrate 2 and heated without being pressed. You may just do it.

  In the first embodiment, a single-core optical fiber 9 connected to a single laser oscillator 14 is used, and a laser 17 is emitted from a single laser emission port 10. As shown in FIG. 3, a fiber bundle 19 is formed by bundling a plurality of thin optical fibers 9 connected to a plurality of individually controllable laser oscillators 14, and lasers 17 are respectively emitted from a plurality of laser emission ports 10. A second embodiment is also conceivable.

  When the laser 17 is emitted from the plurality of laser emission ports 10 of the fiber bundle 19 as described above, even if the abnormality of the fiber is detected by the detection means shown in the first embodiment, any one of the optical fibers 9 is abnormal. It is not possible to specify whether it is. Therefore, when lasers 17 are emitted from a plurality of laser emission ports 10 of the fiber bundle 19 as shown in FIG. 3, one laser oscillator 14 is operated, and one optical fiber 9 connected thereto is operated. A laser 17 is emitted from the laser emission port 10, and whether or not the amount of light received from the light receiving unit 13 is equal to or greater than a predetermined amount is guided one by one and divided into a plurality of times to sequentially inspect the fiber bundle 19. Of which optical fibers 9 are abnormal.

  At this time, the laser 17 may be emitted with a low laser output one by one, but the laser 17 is emitted only from the laser emission port 10 of one optical fiber 9 in the fiber bundle 19. Therefore, since the output is lower than the laser output at the time of joining the fiber bundle 19 as a whole, it is not necessary to set the output of each optical fiber 9 to be inspected to be lower than that at the time of joining. It may be the same as the output at the time of joining.

Further, as shown in FIG. 4, a fiber bundle 19 is formed by bundling a plurality of thin optical fibers 9 connected to a plurality of laser oscillators 14 that can be controlled for each group, and a laser 17 is emitted from a plurality of laser emission ports 10. A third embodiment is also conceivable.
When the laser 17 is emitted from the plurality of laser emission ports 10 of the fiber bundle 19 as described above, even if the abnormality of the fiber is detected by the detecting means shown in the first embodiment, It is not possible to determine whether it is abnormal.

  Therefore, when the lasers 17 are emitted from the plurality of laser emission ports 10 of the fiber bundle 19 as shown in FIG. 4, the group of laser oscillators 14 are operated and the lasers of the group of optical fibers 9 connected thereto. A laser 17 is emitted from the emission port 10, and whether or not the amount of light received from the light receiving unit 13 is equal to or greater than a predetermined amount is guided in a plurality of times by guiding the laser beam by a group of a plurality of predetermined numbers and sequentially inspecting. Then, it is inspected which group of optical fibers 9 in the fiber bundle 19 is abnormal.

  Also in this case, the lasers 17 may be emitted with a low laser output one group at a time, but the laser 17 is only emitted from the laser emission ports 10 of the group of optical fibers 9 in the fiber bundle 19. As a whole, the output is lower than the laser output when the fiber bundle 19 is joined. For this reason, it is not necessary to make the output of each group of fibers 9 to be inspected lower than that at the time of bonding, and the output for each group may be the same as the output at the time of bonding. In the third embodiment, a switch circuit is provided in each laser oscillator 14 so that the laser oscillator 14 can be individually operated in each fiber 9 group, and the second embodiment is performed for each fiber 9 group. You may make it test | inspect one by one similarly to an example.

  In the first to third embodiments, the light receiving unit 13 of the photosensor 12 serving as the light receiving unit is provided in the laser head 4 so as to face the lower part. However, the light receiving unit 13 of the photosensor 12 serving as the light receiving unit is provided in the laser head. 4 may be installed upward on the table 22 as shown in FIG. In the fourth embodiment, the lower end of the laser head 4 is observed by the light receiving unit 13 installed externally.

When such a configuration is adopted, the operation is as follows.
First, when the bonding apparatus is started before the production operation is started, or after the semiconductor chip 1 is bonded to the substrate 2 and the laser head 4 is raised and before reaching the chip tray 20, that is, the laser head 4 is connected to the semiconductor chip. 1 is not held, the laser head 4 moves horizontally, and the laser head 4 is positioned above the light receiving unit 13.

  At this position, the laser 17 is irradiated with a laser output lower than the output at the time of bonding. At this time, it is inspected whether the amount of light received from the light receiving unit 13 is greater than or equal to a predetermined value. As a result of the inspection, if the predetermined amount is satisfied, the semiconductor chip 1 is held and the bonding operation is performed, and if not satisfied, the semiconductor chip 1 is stopped and an abnormality of the optical fiber 9 is output as an alarm.

  In this example, the laser head 4 is moved. However, since the laser head 4 and the light receiving unit 13 may be moved relative to each other, the table 22 on which the light receiving unit 13 is installed is moved. Alternatively, they may be moved, or the light receiving unit 13 may move alone. As described above, even if the light receiving unit 13 is installed outside the laser head 4, there may be one that emits the laser 17 from the plurality of laser emission ports 10.

The first is a fiber bundle 19 in which a plurality of thin optical fibers 9 connected to a plurality of individually controllable laser oscillators 14 are bundled, and a laser 17 is emitted from a plurality of laser emission ports 10. It is an example. The laser output port 10 is similar to the laser output port 10 shown in FIG.
The second is a fiber bundle 19 in which a plurality of thin optical fibers 9 connected to a plurality of laser oscillators 14 that can be controlled for each group are bundled, and a laser 17 is emitted from a plurality of laser emission ports 10. This is an example. The laser output port 10 is the same as the laser output port 10 shown in FIG.
Even in these cases, the inspection method and the output level are the same as those in the second and third embodiments.

Overall schematic diagram of the bonding apparatus when the light receiving means is provided in the laser head It is explanatory drawing which showed the inside of a laser head, (A) at the time of a test | inspection, (B) shows the time of joining. It is explanatory drawing of the bonding apparatus in the case of test | inspecting for each optical fiber unit, (A) shows the time of test | inspection and (B) shows the time of joining. It is explanatory drawing of the bonding apparatus in the case of test | inspecting per optical fiber group, (A) at the time of test | inspection, (B) shows the time of joining. Overall explanatory diagram of the bonding apparatus when the light receiving means is provided outside the laser head

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip 2 ... Board | substrate 3 ... Bonding tool 4 ... Laser head 5 ... Empty part 6 ... Laser heating apparatus 7. ·················································································· 8 Suction Device 9. Light receiving unit 14... Laser oscillator 15... Shield plate 16... Control device 17 ... Laser 18 ... Adsorption hole 19 ... Fiber bundle 20 ... Chip tray 21... Substrate placement stage 22... Table 23... Inspection device 31.

Claims (3)

A laser oscillating means, a fiber for guiding a laser from the laser oscillating means, a laser head connected to the fiber and capable of emitting a laser from the lower part and holding an electronic part in the lower part, and an electronic part A bonding stage that supports a bonding object of the above, and a laser beam irradiation from the laser head on the bonding stage to heat and bond the electronic component,
Control means for making variable the output of the laser emitted from the laser oscillation means;
Light receiving means for receiving the laser emitted from the fiber, a moving mechanism for moving the laser head relative to the bonding stage, and the light guide state of the fiber based on the amount of light received by the light receiving means And inspection means for inspecting
A light receiving portion of the light receiving means is provided in the laser head,
With the electronic component held under the laser head, the laser is emitted from the fiber with a laser output lower than that at the time of bonding,
A bonding apparatus characterized in that the inspection means inspects the quality of the light guide state of the fiber based on the amount of received light including the reflected light from the electronic component received by the light receiving means.
A laser oscillating means, a fiber for guiding a laser from the laser oscillating means, a laser head connected to the fiber and capable of emitting a laser from the lower part and holding an electronic part in the lower part; A bonding stage that supports a bonding object of the above, and a laser beam irradiation from the laser head on the bonding stage to heat and bond the electronic component,
Control means for making variable the output of the laser emitted from the laser oscillation means, light receiving means for receiving the laser emitted from the fiber, and movement for moving the laser head relative to the bonding stage A mechanism, and inspection means for inspecting the quality of the light guide state of the fiber based on the amount of light received by the light receiving means,
The light receiving unit of the light receiving unit is provided so as to be relatively movable upward with respect to the laser head, and the electronic unit is not held below the laser head, and the light receiving unit of the light receiving unit is installed Positioned below, the laser is emitted from the fiber at a lower laser power than at the time of bonding,
A bonding apparatus characterized in that the inspection means inspects the quality of the light guiding state of the fiber based on the amount of light received by the light receiving means.
The fiber is composed of a plurality of fibers,
3. The laser according to claim 1 or 2, wherein a predetermined number of lasers are guided through the fiber, the laser is emitted from the fiber divided into a plurality of times, and the optical guiding state of the fiber is inspected by the inspection means. Bonding equipment.

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