JP5118279B2 - Adhesion method using spherical body made of silicon rubber - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding method remarkably excellent in cost performance and capable of uniformly pressurizing an adherend by using a silicone rubber-made spherical body. SOLUTION: This bonding method uses the silicone rubber-made spherical body 10 and comprises a lamination process for laminating a plurality of adherends 30 through an adhesive 40, an arrangement process for arranging the plurality of the adherends 30 in a pressurized area of a pressurizing means 20 through the silicone rubber-made spherical body 10, a pressurizing process for pressurizing the plurality of the adherends 30 by deforming the silicone rubber-made spherical body 10 by the pressurizing means 20 and a curing process for curing the adhesive 40.

Description

【００２８】
＜Ａ：一層平積み実験＞
本実験では、まず、図５（ａ）に示すように、万能試験機の容器５００の底壁にシリコンボール１０を一層敷き詰め、この容器５００にピストン６００を挿入してシリコンボール１０の上部に配置し、このピストン６００によって下向きの圧力を加えてシリコンボール１０の高さを押し縮めた状態における、充填率、第１加圧値および第２加圧値を測定した（一層平積み実験）。
【００２９】
なお、本実験では、図５（ａ）、（ｂ）に示すように、シリコンボール１０の初期高さＨ₀に対する押し潰し量ｈの割合（ｈ／Ｈ₀）×１００を「押し潰し率（％）」と称することとする。また、本実験において「充填率」とは、容器５００とピストン６００の下面とによって囲まれた空間の容積に対する、シリコンボール１０の容積の割合を意味することとする。
【００３０】
また、本実験において「第１加圧値」とは、非加熱時（室温時）においてシリコンボール１０がピストン６００の下面に与える圧力の大きさを意味することとし、「第２加圧値」とは、シリコンボール１０を１８０℃で加熱して膨張させた場合に、シリコンボール１０がピストン６００の下面に与える圧力の大きさを意味することとする。この第２加圧値は、後述する第２および第４の実施の形態で使用される。
【００３１】
まず、ピストン６００によって下向きの圧力を加えない状態（押し潰し率０％の状態）では、シリコンボール１０は元の形状が保持されており、この状態におけるシリコンボール１０の充填率は、表−１に示すように５３．６％であった。なお、この状態における第１加圧値は０kPaである（表−１参照）。
【００３２】
次いで、押し潰し率０％の状態から、ピストン６００によってシリコンボール１０に下向きの圧力を加えて、押し潰し率１０％の状態とした。この場合の充填率は、表−１に示すように５９．６％とされ、この状態における第１加圧値は、２２kPaであった（表−１参照）。以下、同様の手順で、押し潰し率１５％および２０％の場合の充填率と、第１加圧値を求めた（表−１参照）。この後、シリコンボール１０を１８０℃で加熱して、押し潰し率０％、１０％、１５％および２０％の状態における第２加圧値を求めた（表−１参照）。
【００３３】
＜Ｂ：フリー積み実験＞
続いて、図５（ｂ）に示すように、万能試験機の容器５００にシリコンボール１０を投入し、振動を与えて調整しながら、この容器５００の底壁から所定の高さ（初期高さＨ₀＝２４（ｍｍ））に達するまでシリコンボール１０をフリーに敷き詰め、この容器５００にピストン６００を挿入してシリコンボール１０の上部に配置し、このピストン６００によって下向きの圧力を加えて種々押し潰し率を変化させた場合において、充填率、第１加圧値および第２加圧値を測定し、実験結果を表−１に示した（フリー積み実験）。用語の定義および測定の手順は、「Ａ：一層平積み実験」と同様であるので説明を省略する。
【００３４】
以上の実験結果の「押し潰し率」と「第１加圧値」との関係を利用して、加圧値を設定することができる。例えば、「Ｂ：フリー積み実験」の実験結果を利用すると、加圧値を３４kPaに設定したい場合には、押し潰し率を１０．４％とすればよく（表−１参照）、加圧値を９８kPa程度に設定したい場合には、押し潰し率を２０％程度とすればよい（表−１参照）。また、実験結果の数値を利用して、補完法などによって「押し潰し率」と「第１加圧値」との相関関係を近似関数で定めると、この近似関数を利用して、所要の加圧値を得るための押し潰し率を近似的に求めることができる。
【００３５】
なお、接着剤がエポキシ系またはゴム系の場合には、圧締条件として、接触圧（６．９kPa〜１３．７kPa）以上で加圧すればよいとされるが、通常、被着体を貼り合せる際に接着剤層に気泡が混入するため、この気泡を除去する目的で前記接触圧の５倍（３４kPa）以上で加圧するのが好ましい。
【００３６】
次いで、前記した加圧工程を行いながら、２枚の平板３０に挟まれた接着剤４０を常温硬化させる（硬化工程）。この硬化に必要な時間は、接着剤４０の種類による。以上の手順によって、２枚の平板３０同士の接着を完了した。
【００３７】
本実施の形態に係る接着方法によれば、シリコンボール１０を介して２枚の平板３０を貼り合わせた積層体Ｐ１を加圧するため、オートクレーブに代表されるような気体による加圧方法を用いることなく積層体Ｐ１に均一な圧力を加えることができる。従って、設備構築コストや運転コストが嵩むことがない。また、シリコンボール１０は回収して再使用可能であるため、この点でもきわめてコスト性に優れる。
【００３８】
また、本実施の形態に係る接着方法によれば、シリコンボール１０を介して積層体Ｐ１を加圧するため、積層体Ｐ１全面に均一な圧力を加えることができる。従って、従来のようにＣ型クランプ２０の可動部２３によって加圧部分の接着剤が局所的に肉痩せすることがなく、充分な接着効果がもたらされる。また、シリコンボール１０を介して積層体Ｐ１を加圧するため、Ｃ型クランプ２０のクランプ腕２１の熱膨張が生じた場合にも、積層体Ｐ１に充分な圧力を加えることができる。
【００３９】
さらに、本実施の形態に係る接着方法によれば、所定の実験結果による「押し潰し率」と「第１加圧値」との関係を利用して、積層体Ｐ１に加える加圧値を容易に設定することができる。
【００４０】
[第２の実施の形態]
次に、第２の実施の形態について、図２を用いて説明する。本実施の形態は、第１の実施の形態と同様にシリコンボール１０およびＣ型クランプ２０を使用して、被着体である２枚の平板３０同士を接着する方法であり、加熱によって接着剤を硬化させるものである。
【００４１】
本実施の形態においては、鉄合金製のＣ型クランプ２０の可動部２３をネジ式ハンドル２４によって固定部２２側に移動させ、圧力板５０およびシリコンボール１０を介して、積層体Ｐ１を加圧した後、これらＣ型クランプ２０、圧力板５０、シリコンボール１０および積層体Ｐ１を、加熱槽６０によって１８０℃で加熱する（図２参照）。
【００４２】
シリコンボール１０は、その材質から、−５５℃〜２５０℃の温度に耐え得る優れた耐熱性を有し（表−１参照）、かつ、加熱によって膨張するという特性を有するので、加熱槽６０によって加熱されて膨張したシリコンボール１０によって、積層体Ｐ１はさらに加圧される（第２加圧工程）。なお、本実施の形態で使用したシリコンボール１０の熱膨張率は、表−１に示したとおり、３．７５×１０^-4（mm/mm/℃）とした。
【００４３】
ここで、前記したように、「Ａ：一層平積み実験」および「Ｂ：フリー積み実験」では「押し潰し率」毎の「第２加圧値」をも測定している（表−１参照）ので、この「押し潰し率」と「第２加圧値」との関係を利用して、加圧値を設定することができる。
【００４４】
例えば、「Ｂ：フリー積み実験」の実験結果を利用すると、加圧値を１２４kPaに設定したい場合には、室温時の押し潰し率を１３．１％とすればよく（表−１参照）、加圧値を２１２kPaに設定したい場合には、室温時の押し潰し率を２０％程度とすればよい（表−１参照）。また、実験結果の数値を利用して、補完法などによって「押し潰し率」と「第２加圧値」との相関関係を近似関数で定めると、この近似関数を利用して、所要の加圧値を得るための押し潰し率を近似的に求めることができる。
【００４５】
また、本実施の形態においては、熱硬化型の接着剤４０’を使用しており、積層体Ｐを加熱槽６０によって加熱することによって、この熱硬化型の接着剤４０’を硬化させることができる。すなわち、前記した第２加圧工程と硬化工程は、同時に行われることとなる。熱硬化型の接着剤４０’としては、（一液型）エポキシ系、ユリア樹脂系、メラミン樹脂系、フェノール樹脂系などの接着剤を挙げることができる。
【００４６】
本実施の形態に係る接着方法によれば、シリコンボール１０を加熱して膨張させることによって、積層体Ｐ１を確実に加圧することができる。また、接着剤４０’が熱硬化型であるので、この接着剤４０’の硬化と、シリコンボール１０の加熱膨張による加圧とを同時に行うことができ、きわめて効率的である。また、所定の実験結果による「押し潰し率」と「第２加圧値」との関係を利用して、積層体Ｐ１に加える加圧値を容易に設定することができる。
【００４７】
[第３の実施の形態（参考）]
下記本発明の実施の形態（第４の実施の形態）を理解するための参考として、本実施の形態では、図3を用いて、シリコンボール１０およびプレス機７０を使用して、ハニカムコア８０の上下面に外板９１、９２を接着してハニカムサンドイッチパネルを構成する方法について説明する。ハニカムコア８０の上面側には、図３に示すように凹部８１が設けられており、このハニカムコア８０の上面に接着される上側外板９１は、この凹部８１を有する上面形状と同一形状に成形されている。また、ハニカムコア８０の下面には、平板状の下側外板９２が接着される。
【００４８】
まず、ハニカムコア８０、上側外板９１および下側外板９２の各接着面の表面処理を行う。表面処理は、第１の実施の形態で説明したものと同様の手法で行うことができる。次いで、各接着面に接着剤４０を塗布し、ハニカムコア８０の上面に上側外板９１を、ハニカムコア８０の下面に下側外板９２を、それぞれ貼り合わせる（積層工程）。本実施の形態では、第１の実施の形態と同様に常温硬化型の接着剤４０を使用している。
【００４９】
次いで、ハニカムコア８０の上下面に上側外板９１、下側外板９２を貼り合せたもの（以下、「積層体Ｐ２」という）を、図３に示すように、プレス機７０の加圧部に配置する（配置工程）。プレス機７０の加圧部は、上下に移動可能な上側圧力板７１と、固定された下側圧力板７２とから構成されており、これら上側圧力板７１と下側圧力板７２との間に積層体Ｐ２を配置した状態で上側圧力板７１を下側圧力板７２側に移動させることによって、積層体Ｐ２を加圧するものである。
【００５０】
ハニカムコア８０の上面側には凹部８１が設けられているため、積層体Ｐ２の上面とプレス機７０の上側圧力板７１との間には閉空間が形成されることとなる。この閉空間内に、第１の実施の形態で使用したシリコンボール１０を充填する（図３参照）。
【００５１】
次いで、プレス機７０の上側圧力板７１を下側圧力板７２側に移動させ、シリコンボール１０を介して、積層体Ｐ２を加圧する（加圧工程）。この際に、シリコンボール１０が積層体Ｐ２に与える圧力の大きさ（第１加圧値）は、第１の実施の形態で述べたとおり、シリコンボール１０を加圧して押し縮めた割合（押し潰し率）によって設定することができる。
【００５２】
次いで、前記した加圧工程を行いながら、ハニカムコア８０と上側外板９１との間、および、ハニカムコア８０と下側外板９２との間に介在させた接着剤４０を常温硬化させる（硬化工程）。以上の手順によって、ハニカムコア８０と上側外板９１と下側９２とを接着させてハニカムサンドイッチパネルを構成した。
【００５３】
本実施の形態に係る接着方法によれば、シリコンボール１０を介して凹部を有する上面形状を備える積層体Ｐ２を加圧しており、この凹部を有する上面形状に合わせてシリコンゴム製の球状体１０が流動および変形するため、積層体Ｐ２に均一な圧力を加えることができる。従って、プレス機７０の上側圧力板７１を、積層体Ｐ２の上面形状に合わせて製作する必要がなく、コストが嵩むことがない。
【００５４】
[第４の実施の形態]
次に、第４の実施の形態について、図４を用いて説明する。本実施の形態は、第３の実施の形態と同様に、シリコンボール１０およびプレス機７０を使用して、ハニカムコア８０の上下面に外板９１、９２を接着してハニカムサンドイッチパネルを構成する方法であり、加熱によって接着剤を硬化させるものである。
【００５５】
本実施の形態においては、プレス機７０の上側圧力板７１を下側圧力板７２側に移動させ、シリコンボール１０を介して、積層体Ｐ２を加圧した後、これらプレス機７０、シリコンボール１０および積層体Ｐ２を、加熱槽６０によって１８０℃で加熱する（図４参照）。この加熱によって、シリコンボール１０を膨張させて積層体Ｐ２を加圧する（第２加圧工程）。この際に、シリコンボール１０が積層体Ｐ２に与える圧力の大きさ（第２加圧値）は、第２の実施の形態と同様に、シリコンボール１０を加圧して押し縮めた割合（押し潰し率）によって設定することができる。
【００５６】
また、本実施の形態においては、第２の実施の形態と同様に、熱硬化型の接着剤４０’を使用しており、積層体Ｐを加熱槽６０によって加熱することによって、この熱硬化型の接着剤４０’を硬化させることができる。すなわち、前記した第２加圧工程と硬化工程は、同時に行われることとなる。
【００５７】
本実施の形態に係る接着方法によれば、シリコンボール１０を加熱して膨張させることによって、積層体Ｐ２を確実に加圧することができる。また、接着剤４０’が熱硬化型であるので、この接着剤４０’の硬化と、シリコンボール１０の加熱膨張による加圧とを同時に行うことができ、きわめて効率的である。また、所定の実験結果による「押し潰し率」と「第２加圧値」との関係を利用して、積層体Ｐ２に加える第２加圧値を容易に設定することができる。
【００５８】
なお、第３および第４の実施の形態においては、ハニカムコア８０の凹部８１の形状を、図３および図４に示すように断面形状が台形状のものとしたが、これに限られるものではなく、積層体Ｐ２とプレス機７０の上側圧力板７１との間に閉空間が形成されるものであれば、いかなる形状でも、シリコンボール１０を適用して、均一な圧力を加えることができる。
【００５９】
以上の実施の形態において、シリコンボール１０の充填率、押し潰し率、直径、硬度、熱膨張率、加熱温度を変更すると、このシリコンボール１０による加圧力の大きさ（加圧値）が変化するが、図５および表−１に示したフリー積み実験で得た実験結果によって適切な加圧値を設定することができる。実際の製造過程では、室温下における押し潰し率を設定することによって加圧値を設定することができ、作業が容易となる。
【００６０】
ここで、シリコンボール１０の積込高さは充填率に関係し、充填率は加圧値に関係するが、この充填率は、積込高さをある程度増加させるとほぼ一定の値に収束する。従って、シリコンボール１０の積込高さが一定の値以上になると、加圧値の変化は無視できる程度まで小さくなる。このため、シリコンボール１０の積込高さを前記フリー積み実験における値（２４ｍｍ）と同一の値に設定する必要はなく、この値以上にシリコンボール１０を積み込んだ場合においても、前記フリー積み実験における値とほぼ等しい加圧値を得ることができる。
【００６１】
また、一層平積み実験における加圧値は、フリー積み実験における加圧値と比較すると小さいが、これらの差が最大となる押し潰し率１０％の場合においても、一層平積み実験における加圧値は、フリー積み実験における加圧値の６０％程度の大きさを有し、これらの差はさほど大きくなく、複数層積み重ねればこれらの差はさらに小さくなる。このため、シリコンボール１０の積込高さが前記フリー積み実験における値（２４ｍｍ）以下であっても、前記した最小接触圧の範囲を考慮すれば、接着に著しい不都合をもたらすものではない。
【００６２】
すなわち、実物の加圧値と押し潰し率とを決定するのにその実物に模して試験を行う必要はなく、図５の（ａ）または（ｂ）に示すように、断面積一定の容器にシリコンゴム製の球状体を充填して負荷を一様に分布させて圧縮するモデル試験を行えば充分である。
【００６３】
また、本実施の形態で使用したシリコンボール１０は、複合材成形の際の中子としても利用することができる。具体的には、シリコンボール１０を袋体に充填し、治具によって所定形状に整えた状態で袋体内を排気して形状を固定し、離型剤を介してプリプレグを外側に配置し、これらを真空バッグフィルムで被覆し、この被覆した部分を排気しつつ加熱してプリプレグを硬化させる。プリプレグに小孔を設けておき、破った袋体とシリコンボール１０とをこの小孔から取り出せばよい。
【００６４】
【発明の効果】
請求項１記載の発明によれば、シリコンゴム製の球状体を介して被着体を加圧するため、従来使用していたオートクレーブを使用せずに被着体に均一な圧力を加えることができる。従って、設備構築コストや運転コストが嵩むことがなく、きわめてコスト性に優れる。
【００６５】
また、請求項１記載の発明によれば、シリコンゴム製の球状体を介して被着体を加圧するため、被着体全体に均一な圧力を加えることができる。従って、被着体の一部のみが加圧されて局所的に接着剤の肉痩せが生じることがない。この結果、充分な接着効果がもたらされる。
【００６６】
さらに、請求項１記載の発明によれば、シリコンゴム製の球状体を介して被着体を加圧するため、シリコンゴム製の球状体の直径、硬度、押し潰し率などを適宜変更することによって、被着体に加える圧力の大きさ（加圧値）を自在に設定することができる。従って、被着体や接着剤の種類に応じて適切な加圧値を設定することができる。
【００６７】
さらにまた、請求項１記載の発明によれば、シリコンゴム製の球状体を介して被着体を加圧するため、被着体の接着面が曲面形状を呈する場合であっても、その曲面形状に合わせてシリコンゴム製の球状体が流動および変形するため、均一な圧力を加えることができる。従って、被着体の曲面状の接着面に合わせて治具を製作する必要がなく、コストが嵩むことがない。
【００６８】
請求項２記載の発明によれば、請求項１記載の発明の効果を奏するのは勿論のこと、シリコンゴム製の球状体を加熱して膨張させることによって被着体を加圧する工程を備えるため、被着体を確実に加圧することができる。また、シリコンゴム製の球状体の押し潰し率によって、被着体に加える圧力の大きさ（加圧値）をより精確に設定することができる。従って、被着体や接着剤の種類に応じて最適な加圧値を設定して、きわめて高精度に接着を行うことができる。
【００６９】
請求項３記載の発明によれば、請求項２記載の発明の効果を奏するのは勿論のこと、（加圧値を設定する）圧縮変形量を、シリコンゴム製の球状体を断面積一定の容器に任意の高さまで充填し加圧して計測するため、きわめて容易に加圧値を設定することができる。
【図面の簡単な説明】
【図１】本発明の第１の実施の形態に係る接着方法を説明するためのものであり、Ｃ型クランプとシリコンボールとを用いて積層体を加圧している状態を示す側面図である。
【図２】本発明の第２の実施の形態に係る接着方法を説明するためのものであり、積層体を加熱槽によって加熱してさらに加圧している状態を示す側面図である。
【図３】本発明の第３の実施の形態に係る接着方法を説明するためのものであり、プレス機とシリコンボールとを用いて積層体を加圧している状態を示す側面図である。
【図４】本発明の第４の実施の形態に係る接着方法を説明するためのものであり、積層体を加熱槽によって加熱してさらに加圧している状態を示す側面図である。
【図５】本発明の実施の形態に係る接着方法で利用するシリコンボールの押し潰し率と加圧値との関係を調べる実験を説明するためのものであり、（ａ）は一層平積み実験の概念図であり、（ｂ）はフリー積み実験の概念図である。
【図６】Ｃ型クランプを使用した従来の接着方法を説明するための斜視図である。
【図７】プレス機を使用した従来の接着方法を説明するための側面図である。
【符号の説明】
１０ シリコンボール
２０ Ｃ型クランプ
２１ クランプ腕
２２ 固定部
２３ 可動部
２４ ネジ式ハンドル
３０ 平板
４０ 常温硬化型の接着剤
４０’ 熱硬化型の接着剤
５０ 圧力板
６０ 加熱槽
７０ プレス機
７１ 上側圧力板
７２ 下側圧力板
８０ ハニカムコア
８１ 凹部
９１ 上側外板
９２ 下側外板
１００ Ｃ型クランプ
１１０ 可動部
１２０ クランプ腕
２００ プレス機
２１０ 上側圧力板
２２０ 下側圧力板
３００ 被着体
５００ 万能試験機の容器
６００ 万能試験機のピストン
Ｐ１ 積層体
Ｐ２ 積層体
Ｈ₀ 初期高さ
ｈ 押し潰し量[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesion method using a spherical body made of silicon rubber.
[0002]
[Prior art]
Conventionally, various methods of bonding adherends using an adhesive have been proposed and put into practical use in various transport equipment industries such as airplanes, automobiles, ships, and general industries. In this bonding, (1) a surface treatment process for performing a surface treatment on the adhesion surface of the adherend, (2) adhesion to either the adhesion surface of one adherend or both adhesion surfaces. Adhesive application (applying) step for applying (attaching) the agent, (3) Adhering step for adhering the adherends together, (4) Pressing step for pressing and fixing the adhering adherends (pressing) (5) It is common to go through a process of curing the adhesive by heating or curing.
[0003]
Here, the pressing step (4) is an indispensable step for forming an optimum adhesive layer and removing bubbles mixed in the adhesive, and the bonded adherend is uniformly formed. Is required to be pressurized. The pressing step (4) is normally performed in parallel with the adhesive curing step (5) until the curing of the adhesive is completed. For example, when manufacturing aircraft parts, it is called an autoclave. Using a pressure cooker that can be pressurized and heated, it is performed simultaneously with pressing and adhesive curing. In general, a C-type clamp (see FIG. 6), a press machine (see FIG. 7), or the like is used for pressure clamping.
[0004]
[Problems to be solved by the invention]
Autoclaves used in the manufacturing process of aircraft parts are effective in that they can apply uniform pressure to curved adhesive surfaces, but the equipment is large and has a special structure. Cost was high. For this reason, in order to use it for adhesion | attachment of small parts and adhesion | attachment of general purpose parts, cost was too bulky and unsuitable.
[0005]
In addition, when the C-type clamp 100 as shown in FIG. 6 is used, since the pressurizing unit 110 presses only a part of the adherend 300, a uniform pressure can be applied to the entire adherend 300. could not. In addition, when the pressure is applied, the adhesive at the portion to be pressed of the adherend 300 may be pressed and flow to the surroundings. After this, if volume shrinkage occurs due to the curing reaction of the adhesive, this applied In some cases, the adhesive in the pressed portion was thinned, and as a result, sufficient adhesion was not achieved.
[0006]
In addition, when the adhesive is heat-cured simultaneously with the pressing, the clamp arm 120 of the C-type clamp 100 is thermally expanded and the pressurizing unit 110 moves in the direction opposite to the pressurizing direction, resulting in sufficient pressurization. In some cases, no pressure was applied. The pressurizing unit 110 pressurizes the adherend 300 by moving it up and down with a screw or the like, but the magnitude of the pressure applied at this time (hereinafter referred to as “pressurized value”) is unknown. The pressure of an appropriate magnitude could not be applied depending on the type of adherend and adhesive.
[0007]
A press 200 as shown in FIG. 7 is effective when bonding adherends 300 having a flat adhesive surface, but adheres adherends having curved adhesive surfaces. In this case, it is necessary to manufacture the upper and lower pressure plates 210 and 220 in accordance with the curved adhesive surfaces, which increases the manufacturing cost.
[0008]
An object of the present invention is to provide a bonding method using a spherical body made of silicon rubber that is extremely cost-effective and capable of uniformly pressing an adherend.
[0009]
[Means for Solving the Problems]
  In order to solve the above problems, the invention described in claim 1 is a bonding method using a spherical body made of silicon rubber, for example, as shown in FIG. 1 and FIG.ThermosettingA laminating step of laminating a plurality of adherends via an adhesive, an arrangement step of disposing the plurality of adherends on a pressure part of a clamp or a pressing machine via a spherical body made of silicon rubber, and the clamp Or a first pressurizing step of pressurizing the plurality of adherends by compressing and deforming the spherical body by moving a movable part of a press machine;For example, as shown in FIGS.After the first pressurizing step, a second pressurizing step of pressurizing the plurality of adherends by heating and expanding the spherical body;By heating the plurality of adherends stacked via the adhesiveThe adhesiveheatA curing process for curingThe second pressurizing step and the curing step are performed simultaneously.It is characterized by that.
[0010]
According to the first aspect of the present invention, since the adherend is pressurized through the spherical body made of silicon rubber, it is uniform on the adherend without using the fluid pressurization method used in an autoclave or the like. Pressure can be applied. Therefore, the equipment construction cost and the operation cost are not increased and the cost is extremely excellent.
[0011]
According to the first aspect of the present invention, since the adherend is pressurized via the spherical body made of silicon rubber, a uniform pressure can be applied to the entire adherend. Therefore, only a part of the adherend is pressurized and local thinning of the adhesive does not occur. This results in a sufficient adhesive effect.
[0012]
Furthermore, according to the first aspect of the present invention, since the adherend is pressed through the silicon rubber spherical body, the diameter, hardness, crushing amount, etc. of the silicon rubber spherical body are appropriately changed and added. If the pressure value is obtained, the magnitude of the pressure applied to the adherend can be easily set according to the deformation amount of the silicon rubber spherical body.
[0013]
Furthermore, according to the invention described in claim 1, since the adherend is pressurized through the spherical body made of silicon rubber, even if the adhesion surface of the adherend has a curved shape, the silicon rubber Since the spherical body made of the material supports the adherend and deforms in accordance with the curved surface shape, a uniform pressure can be applied. Therefore, it is not necessary to manufacture a jig in accordance with the curved adhesive surface of the adherend, and the cost does not increase.
[0014]
  Furthermore, according to the first aspect of the present invention, the spherical body made of silicon rubber has a higher coefficient of thermal expansion than the material constituting the normal pressure jig, and is higher than the curing temperature of the thermosetting adhesive. Since it has heat resistance even under temperature and the coefficient of thermal expansion does not decrease, the adherend can be reliably pressurized.
  The invention according to claim 2 is an adhesion method using the spherical body made of silicon rubber according to claim 1,Second pressurizationThe pressure value of the process is set by the amount of compressive deformation of the spherical body at room temperature.
[0015]
  According to the second aspect of the invention, in addition to the function and effect of the first aspect of the invention,MessengerIf the material and dimensions of the heating jig to be used are the same, the pressure value in the heating process can be examined by a model test, and the value can be set by the amount of compressive deformation of the spherical body at room temperature. As a result, the pressure value can be easily set.
[0016]
According to a third aspect of the present invention, in the bonding method using the spherical body made of silicon rubber according to the second aspect, for example, as shown in FIG. 5, the amount of compressive deformation is up to an arbitrary height in a container having a constant cross-sectional area. Measured by pressurizing the filled spherical body.
[0017]
According to the invention described in claim 3, in addition to the function and effect of the invention described in claim 2, the amount of compressive deformation (setting the pressurization value) can be arbitrarily set in a spherical body made of silicon rubber in a container having a constant cross-sectional area. Therefore, the pressure value can be set very easily.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0019]
[First embodiment(reference)]
  As a reference for understanding the following embodiments (second and fourth embodiments) of the present invention,In the present embodiment, a method of bonding two flat plates 30 as adherends to each other using a silicon rubber spherical body 10 and a C-shaped clamp 20 will be described with reference to FIG.
[0020]
First, the surface treatment of each bonding surface of the two flat plates 30 is performed. This surface treatment is performed for the purpose of removing inorganic substances such as rust that adhere to each adhesion surface and inhibit adhesion, and organic substances such as hand dust. Examples of the surface treatment method include a mechanical method in which each adhesive surface is polished and then degreased with a solvent, and a chemical method in which a chemical solution is applied through solvent degreasing.
[0021]
Next, the adhesive 40 is applied to each adhesive surface of the two flat plates 30, and these adhesive surfaces are bonded to each other (lamination process). In the present embodiment, a room temperature curable adhesive 40 such as an epoxy two-part adhesive, a polyurethane two-part adhesive, or a modified acrylic resin two-part adhesive is used.
[0022]
Next, a laminate of the two flat plates 30 (hereinafter referred to as “laminated body P1”) is placed in the pressure part of the C-type clamp 20 as shown in FIG. 1 (placement step). The pressurizing part of the C-type clamp 20 is composed of a clamp arm 21, a fixed part 22 disposed below the clamp arm 21, and a movable part 23 disposed on the upper side. The movable part 23 can be moved up and down by the screw type handle 24, and the movable part 23 is moved downward (fixed part 22 side) by the screw type handle 24 in a state where the laminated body P1 is disposed between the fixed part 22 and the movable part 23. By doing so, the laminated body P1 is pressurized.
[0023]
When the laminated body P1 is disposed in the pressure part of the C-type clamp 20, a plurality of spherical balls made of silicon rubber are provided between the laminated body P1 and the movable part 23 of the C-type clamp 20, as shown in FIG. A body (hereinafter referred to as “silicon ball”) 10 and a pressure plate 50 are arranged. The silicon ball 10 is a substantially spherical pressure transmission medium that transmits the pressure applied by the movable portion 23 of the C-shaped clamp 20 to the laminated body P1 side. In this embodiment, the silicon ball 10 has a diameter of 4 mm and a hardness of Hs (durometer hardness) 50.
[0024]
As the pressure plate 50, a flat plate reinforced thickly so as not to be easily deformed is used. As shown in FIG. 1, the pressure plate 50 is disposed on the upper side of the silicon ball 10 and functions to uniformly transmit the pressure of the movable portion 23 of the C-type clamp 20 to the silicon ball 10. Although not shown, side walls are provided around the multilayer body P1 so that the silicon balls 10 disposed above the multilayer body P1 do not jump out.
[0025]
Next, the movable portion 23 of the C-type clamp 20 is moved to the fixed portion 22 side by the screw type handle 24, and the laminate P1 is pressurized via the pressure plate 50 and the silicon ball 10 (pressurizing step). At this time, the magnitude of the pressure (pressurized value) applied to the stacked body P1 by the silicon ball 10 can be set by a ratio (crushing rate) of pressing and compressing the silicon ball 10 as will be described later. it can.
[0026]
Here, experimental results showing the relationship between the “crushing rate” and the “pressurized value” of the silicon ball 10 will be described with reference to FIG. 5 and Table-1.
[0027]
[Table-1]

[0028]
<A: Layer stacking experiment>
In this experiment, first, as shown in FIG. 5A, the silicon ball 10 is further spread on the bottom wall of the container 500 of the universal testing machine, and the piston 600 is inserted into the container 500 to be disposed on the upper part of the silicon ball 10. Then, the filling rate, the first pressurization value, and the second pressurization value were measured in a state in which the downward pressure was applied by the piston 600 and the height of the silicon ball 10 was compressed (a further flat stacking experiment).
[0029]
In this experiment, as shown in FIGS. 5A and 5B, the initial height H of the silicon ball 10 is set.₀Of crushing amount h with respect to h (H / H₀) × 100 is referred to as “crushing rate (%)”. Further, in this experiment, the “filling rate” means the ratio of the volume of the silicon balls 10 to the volume of the space surrounded by the container 500 and the lower surface of the piston 600.
[0030]
Further, in this experiment, the “first pressurization value” means the magnitude of the pressure applied to the lower surface of the piston 600 by the silicon ball 10 at the time of non-heating (at room temperature). The term “pressure” means the magnitude of pressure that the silicon ball 10 applies to the lower surface of the piston 600 when the silicon ball 10 is expanded by heating at 180 ° C. This second pressurization value is used in the second and fourth embodiments described later.
[0031]
First, in a state where no downward pressure is applied by the piston 600 (a state where the crushing rate is 0%), the original shape of the silicon balls 10 is maintained, and the filling rate of the silicon balls 10 in this state is shown in Table-1. As shown in the figure, it was 53.6%. In addition, the 1st pressurization value in this state is 0 kPa (refer Table-1).
[0032]
Next, from the state where the crushing rate was 0%, downward pressure was applied to the silicon balls 10 by the piston 600 to obtain a state where the crushing rate was 10%. The filling rate in this case was 59.6% as shown in Table 1, and the first pressure value in this state was 22 kPa (see Table 1). Hereinafter, in the same procedure, the filling rate when the crushing rate was 15% and 20% and the first pressure value were obtained (see Table 1). Thereafter, the silicon ball 10 was heated at 180 ° C., and the second pressurization values in the state of the crushing rate of 0%, 10%, 15% and 20% were obtained (see Table-1).
[0033]
<B: Free loading experiment>
Subsequently, as shown in FIG. 5 (b), the silicon ball 10 is put into the container 500 of the universal testing machine and adjusted by applying vibration to the container 500 with a predetermined height (initial height) from the bottom wall. H₀= 24 (mm)), the silicon balls 10 are spread freely, the piston 600 is inserted into the container 500 and placed on top of the silicon balls 10, and downward pressure is applied by the piston 600 to various crushing rates. Was changed, the filling rate, the first pressure value, and the second pressure value were measured, and the experimental results are shown in Table 1 (free stacking experiment). The definition of terms and the measurement procedure are the same as in “A: Layered stacking experiment”, and thus the description thereof is omitted.
[0034]
The pressurization value can be set using the relationship between the “crushing rate” and the “first pressurization value” in the above experimental results. For example, using the experimental result of “B: free stacking experiment”, when the pressure value is set to 34 kPa, the crushing rate may be set to 10.4% (see Table 1). When it is desired to set the value to about 98 kPa, the crushing rate may be set to about 20% (see Table 1). In addition, if the correlation between the “crushing rate” and the “first pressurization value” is determined by an approximation function using the numerical value of the experimental result, the required function can be added using this approximation function. The crushing rate for obtaining the pressure value can be approximately obtained.
[0035]
When the adhesive is epoxy or rubber, it is sufficient to press the contact pressure (6.9 kPa to 13.7 kPa) or higher as the pressing condition. Since air bubbles are mixed into the adhesive layer when combining, it is preferable to pressurize at a pressure of 5 times (34 kPa) or more of the contact pressure for the purpose of removing the air bubbles.
[0036]
Next, the adhesive 40 sandwiched between the two flat plates 30 is cured at room temperature while performing the pressurizing step (curing step). The time required for this curing depends on the type of adhesive 40. The adhesion between the two flat plates 30 was completed by the above procedure.
[0037]
According to the bonding method according to the present embodiment, in order to pressurize the laminated body P1 in which the two flat plates 30 are bonded through the silicon balls 10, a pressurizing method using gas such as an autoclave is used. And uniform pressure can be applied to the laminate P1. Therefore, the equipment construction cost and the operation cost are not increased. Further, since the silicon ball 10 can be collected and reused, this point is extremely cost effective.
[0038]
In addition, according to the bonding method according to the present embodiment, since the stacked body P1 is pressed through the silicon balls 10, a uniform pressure can be applied to the entire surface of the stacked body P1. Therefore, unlike the conventional case, the adhesive of the pressurizing portion is not locally thinned by the movable portion 23 of the C-type clamp 20, and a sufficient adhesive effect is provided. Further, since the stacked body P1 is pressed through the silicon ball 10, even when the thermal expansion of the clamp arm 21 of the C-type clamp 20 occurs, a sufficient pressure can be applied to the stacked body P1.
[0039]
Furthermore, according to the bonding method according to the present embodiment, the pressure value applied to the laminate P1 can be easily obtained using the relationship between the “crushing rate” and the “first pressure value” based on the predetermined experimental result. Can be set to
[0040]
[Second Embodiment]
Next, a second embodiment will be described with reference to FIG. The present embodiment is a method of bonding two flat plates 30 as adherends to each other using a silicon ball 10 and a C-type clamp 20 as in the first embodiment. Is to cure.
[0041]
In the present embodiment, the movable part 23 of the iron alloy C-type clamp 20 is moved to the fixed part 22 side by the screw type handle 24, and the laminate P1 is pressurized via the pressure plate 50 and the silicon ball 10. After that, the C-type clamp 20, the pressure plate 50, the silicon ball 10 and the laminated body P1 are heated at 180 ° C. by the heating tank 60 (see FIG. 2).
[0042]
The silicon ball 10 has excellent heat resistance that can withstand a temperature of −55 ° C. to 250 ° C. from its material (see Table 1), and has a characteristic of expanding by heating. The stacked body P1 is further pressurized by the silicon ball 10 that has been heated and expanded (second pressurizing step). The thermal expansion coefficient of the silicon ball 10 used in the present embodiment is 3.75 × 10 6 as shown in Table-1.^-Four(Mm / mm / ° C.).
[0043]
Here, as described above, in “A: one layer flat stacking experiment” and “B: free stacking experiment”, “second pressing value” for each “crushing rate” is also measured (see Table 1). Therefore, the pressure value can be set using the relationship between the “crushing rate” and the “second pressure value”.
[0044]
For example, using the experimental result of “B: free stacking experiment”, when the pressure value is set to 124 kPa, the crushing rate at room temperature may be 13.1% (see Table 1). In order to set the pressure value to 212 kPa, the crushing rate at room temperature may be about 20% (see Table 1). In addition, if the correlation between the “crushing rate” and the “second pressurization value” is determined by an approximation function using the numerical value of the experimental result by a complementation method, etc., the required function can be added using this approximation function. The crushing rate for obtaining the pressure value can be approximately obtained.
[0045]
Further, in the present embodiment, a thermosetting adhesive 40 ′ is used, and the thermosetting adhesive 40 ′ can be cured by heating the laminate P by the heating tank 60. it can. That is, the above-described second pressurizing step and curing step are performed simultaneously. Examples of the thermosetting adhesive 40 'include (one-component) epoxy, urea resin, melamine resin, phenol resin, and the like.
[0046]
According to the bonding method according to the present embodiment, the stacked body P1 can be reliably pressurized by heating and expanding the silicon ball 10. Further, since the adhesive 40 ′ is a thermosetting type, the curing of the adhesive 40 ′ and the pressurization by the thermal expansion of the silicon ball 10 can be performed at the same time, which is extremely efficient. Moreover, the pressure value applied to the laminated body P1 can be easily set using the relationship between the “crushing rate” and the “second pressure value” based on a predetermined experimental result.
[0047]
[Third Embodiment(reference)]
  As a reference for understanding the following embodiment (fourth embodiment) of the present invention,In the present embodiment, a method for forming a honeycomb sandwich panel by bonding the outer plates 91 and 92 to the upper and lower surfaces of the honeycomb core 80 using the silicon ball 10 and the press machine 70 will be described with reference to FIG. . A concave portion 81 is provided on the upper surface side of the honeycomb core 80 as shown in FIG. 3, and the upper outer plate 91 bonded to the upper surface of the honeycomb core 80 has the same shape as the upper surface shape having the concave portion 81. Molded. A flat lower outer plate 92 is bonded to the lower surface of the honeycomb core 80.
[0048]
First, the surface treatment of the bonding surfaces of the honeycomb core 80, the upper outer plate 91, and the lower outer plate 92 is performed. The surface treatment can be performed by the same method as that described in the first embodiment. Next, the adhesive 40 is applied to each bonding surface, and the upper outer plate 91 is bonded to the upper surface of the honeycomb core 80 and the lower outer plate 92 is bonded to the lower surface of the honeycomb core 80 (laminating step). In the present embodiment, the room temperature curable adhesive 40 is used as in the first embodiment.
[0049]
Next, a structure in which the upper outer plate 91 and the lower outer plate 92 are bonded to the upper and lower surfaces of the honeycomb core 80 (hereinafter referred to as “laminated body P2”), as shown in FIG. (Arrangement process). The pressurizing unit of the press machine 70 is composed of an upper pressure plate 71 that can move up and down and a fixed lower pressure plate 72, and between these upper pressure plate 71 and lower pressure plate 72. The stacked body P2 is pressurized by moving the upper pressure plate 71 toward the lower pressure plate 72 in a state where the stacked body P2 is disposed.
[0050]
Since the concave portion 81 is provided on the upper surface side of the honeycomb core 80, a closed space is formed between the upper surface of the stacked body P <b> 2 and the upper pressure plate 71 of the press machine 70. This closed space is filled with the silicon ball 10 used in the first embodiment (see FIG. 3).
[0051]
Next, the upper pressure plate 71 of the press machine 70 is moved to the lower pressure plate 72 side, and the laminate P2 is pressurized via the silicon balls 10 (pressurizing step). At this time, the magnitude of the pressure (first pressurization value) applied to the stacked body P2 by the silicon ball 10 is the ratio (pressing force) of pressing and shrinking the silicon ball 10 as described in the first embodiment. The crushing rate can be set.
[0052]
Next, the adhesive 40 interposed between the honeycomb core 80 and the upper outer plate 91 and between the honeycomb core 80 and the lower outer plate 92 is cured at room temperature (curing) while performing the pressing step described above. Process). By the above procedure, the honeycomb core 80, the upper outer plate 91, and the lower side 92 were bonded to form a honeycomb sandwich panel.
[0053]
According to the bonding method according to the present embodiment, the laminated body P2 having an upper surface shape having a recess is pressed through the silicon ball 10, and the spherical body 10 made of silicon rubber is matched to the upper surface shape having the recess. Flows and deforms, a uniform pressure can be applied to the laminate P2. Therefore, it is not necessary to manufacture the upper pressure plate 71 of the press machine 70 in accordance with the upper surface shape of the laminated body P2, and the cost does not increase.
[0054]
[Fourth embodiment]
Next, a fourth embodiment will be described with reference to FIG. In the present embodiment, similarly to the third embodiment, the silicon sandwich plate 10 is formed by bonding the outer plates 91 and 92 to the upper and lower surfaces of the honeycomb core 80 using the silicon ball 10 and the press 70. This is a method for curing an adhesive by heating.
[0055]
In the present embodiment, after the upper pressure plate 71 of the press machine 70 is moved to the lower pressure plate 72 side and the laminate P2 is pressurized via the silicon balls 10, the press machine 70, the silicon balls 10 And the laminated body P2 is heated at 180 degreeC with the heating tank 60 (refer FIG. 4). By this heating, the silicon ball 10 is expanded to pressurize the stacked body P2 (second pressurizing step). At this time, the magnitude of the pressure applied to the stacked body P2 by the silicon ball 10 (second pressurization value) is the ratio (crushing) by pressing the silicon ball 10 and compressing it, as in the second embodiment. Rate).
[0056]
Further, in the present embodiment, similarly to the second embodiment, a thermosetting adhesive 40 ′ is used, and the thermosetting type is obtained by heating the laminated body P by the heating tank 60. The adhesive 40 'can be cured. That is, the above-described second pressurizing step and curing step are performed simultaneously.
[0057]
According to the bonding method according to the present embodiment, the laminated body P2 can be reliably pressurized by heating and expanding the silicon balls 10. Further, since the adhesive 40 ′ is a thermosetting type, the curing of the adhesive 40 ′ and the pressurization by the thermal expansion of the silicon ball 10 can be performed at the same time, which is extremely efficient. Moreover, the 2nd pressurization value added to the laminated body P2 can be easily set using the relationship between the "crushing rate" and the "2nd pressurization value" by a predetermined experimental result.
[0058]
In the third and fourth embodiments, the shape of the recess 81 of the honeycomb core 80 is a trapezoidal cross section as shown in FIGS. 3 and 4. However, the present invention is not limited to this. As long as a closed space is formed between the stacked body P2 and the upper pressure plate 71 of the press machine 70, the silicon ball 10 can be applied and uniform pressure can be applied in any shape.
[0059]
In the above embodiment, when the filling rate, crushing rate, diameter, hardness, thermal expansion rate, and heating temperature of the silicon balls 10 are changed, the magnitude of the pressure applied by the silicon balls 10 (pressure value) changes. However, an appropriate pressure value can be set according to the experimental results obtained in the free stacking experiment shown in FIG. 5 and Table-1. In the actual manufacturing process, the pressing value can be set by setting the crushing rate at room temperature, and the work becomes easy.
[0060]
Here, the loading height of the silicon balls 10 is related to the filling rate, and the filling rate is related to the pressurization value, but this filling rate converges to a substantially constant value when the loading height is increased to some extent. . Therefore, when the loading height of the silicon balls 10 exceeds a certain value, the change in the pressurization value is reduced to a negligible level. For this reason, it is not necessary to set the loading height of the silicon balls 10 to the same value as the value (24 mm) in the free stacking experiment. Even when the silicon balls 10 are loaded beyond this value, the free stacking experiment is performed. A pressure value approximately equal to the value at can be obtained.
[0061]
In addition, the pressure value in the single-layer experiment is smaller than the pressure value in the free-stack experiment, but even when the crushing rate is 10%, the difference between them is the maximum. Has a size of about 60% of the pressurization value in the free stacking experiment, and these differences are not so large. If a plurality of layers are stacked, these differences become even smaller. For this reason, even if the loading height of the silicon balls 10 is equal to or less than the value (24 mm) in the free stacking experiment, there is no significant inconvenience in bonding in view of the above-described range of the minimum contact pressure.
[0062]
That is, it is not necessary to conduct a test in the same way as the actual product in order to determine the pressurization value and crushing rate of the actual product. As shown in FIG. It is sufficient to perform a model test in which a spherical body made of silicon rubber is filled and the load is uniformly distributed and compressed.
[0063]
Further, the silicon ball 10 used in the present embodiment can be used as a core in molding a composite material. Specifically, the silicon ball 10 is filled into a bag body, and the bag body is evacuated and fixed in a predetermined shape with a jig, and the prepreg is disposed outside via a release agent. Is coated with a vacuum bag film, and the coated portion is heated while evacuating to cure the prepreg. A small hole is provided in the prepreg, and the broken bag body and the silicon ball 10 may be taken out from the small hole.
[0064]
【The invention's effect】
According to the invention described in claim 1, since the adherend is pressurized through the spherical body made of silicon rubber, it is possible to apply a uniform pressure to the adherend without using a conventionally used autoclave. . Therefore, the equipment construction cost and the operation cost are not increased and the cost is extremely excellent.
[0065]
According to the first aspect of the present invention, since the adherend is pressurized via the spherical body made of silicon rubber, a uniform pressure can be applied to the entire adherend. Therefore, only a part of the adherend is pressurized and local thinning of the adhesive does not occur. This results in a sufficient adhesive effect.
[0066]
Further, according to the invention described in claim 1, since the adherend is pressed through the silicon rubber spherical body, the diameter, hardness, crushing rate, etc. of the silicon rubber spherical body are appropriately changed. And the magnitude | size (pressurization value) of the pressure applied to a to-be-adhered body can be set freely. Therefore, an appropriate pressure value can be set according to the type of adherend and adhesive.
[0067]
Furthermore, according to the invention described in claim 1, since the adherend is pressurized through the spherical body made of silicon rubber, even if the adhesion surface of the adherend exhibits a curved shape, the curved shape Since the spherical body made of silicon rubber flows and deforms in accordance with the above, uniform pressure can be applied. Therefore, it is not necessary to manufacture a jig in accordance with the curved adhesive surface of the adherend, and the cost does not increase.
[0068]
According to the second aspect of the invention, the effect of the first aspect of the invention can be obtained, and the step of pressurizing the adherend by heating and expanding the spherical body made of silicon rubber is provided. The adherend can be reliably pressurized. Moreover, the magnitude | size (pressurization value) applied to a to-be-adhered body can be set more correctly with the crushing rate of the spherical body made from silicon rubber. Therefore, it is possible to set an optimum pressure value according to the type of adherend and the adhesive and perform bonding with extremely high accuracy.
[0069]
According to the invention described in claim 3, not only the effect of the invention described in claim 2 is obtained, but also the amount of compressive deformation (setting the pressurizing value) is reduced, and the spherical body made of silicon rubber has a constant cross-sectional area. Since the container is filled up to an arbitrary height and measured by pressurization, the pressurization value can be set very easily.
[Brief description of the drawings]
FIG. 1 is a side view for explaining a bonding method according to a first embodiment of the present invention and showing a state in which a laminated body is pressurized using a C-type clamp and a silicon ball. .
FIG. 2 is a side view for explaining an adhesion method according to a second embodiment of the present invention and showing a state in which a laminated body is heated and further pressurized by a heating tank.
FIG. 3 is a side view for explaining an adhesion method according to a third embodiment of the present invention and showing a state in which a laminated body is being pressed using a press machine and a silicon ball.
FIG. 4 is a side view for explaining an adhesion method according to a fourth embodiment of the present invention and showing a state in which a laminated body is heated and further pressurized by a heating tank.
FIG. 5 is a diagram for explaining an experiment for examining a relationship between a crushing rate of a silicon ball and a pressure value used in the bonding method according to the embodiment of the present invention, and FIG. (B) is a conceptual diagram of a free stacking experiment.
FIG. 6 is a perspective view for explaining a conventional bonding method using a C-type clamp.
FIG. 7 is a side view for explaining a conventional bonding method using a press.
[Explanation of symbols]
10 Silicon ball
20 C type clamp
21 Clamp arm
22 fixed part
23 Moving parts
24 Screw type handle
30 flat plate
40 Room temperature curing adhesive
40 'thermosetting adhesive
50 pressure plate
60 Heating tank
70 Press machine
71 Upper pressure plate
72 Lower pressure plate
80 Honeycomb core
81 recess
91 Upper skin
92 Lower skin
100 C type clamp
110 Movable parts
120 Clamp arm
200 Press machine
210 Upper pressure plate
220 Lower pressure plate
300 adherend
5 Universal testing machine container
6 Universal testing machine piston
P1 laminate
P2 laminate
H₀      Initial height
h Crushing amount

Claims (3)

A laminating step of laminating a plurality of adherends via a thermosetting adhesive;
An arrangement step of arranging the plurality of adherends on a pressure part of a clamp or a press through a spherical body made of silicon rubber, and the spherical body is compressed and deformed by movement of a movable part of the clamp or the press. A first pressurizing step of pressurizing the plurality of adherends;
After the first pressurizing step, a second pressurizing step of pressurizing the plurality of adherends by heating and expanding the spherical body;
And a curing step of thermally curing the adhesive by heating the plurality of adherend laminated via the adhesive,
A bonding method using a spherical body made of silicon rubber, wherein the second pressing step and the curing step are performed simultaneously . Pressurization value of the second pressurization step,
The bonding method using the spherical body made of silicon rubber according to claim 1, which is set by the amount of compressive deformation of the spherical body at room temperature. The amount of compressive deformation is
3. The bonding method using spherical bodies made of silicon rubber according to claim 2, wherein measurement is performed by pressurizing the spherical bodies filled to an arbitrary height in a container having a constant cross-sectional area.

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