JP5143549B2 - Ledに使用するための蛍光体及びそれらの混合物 - Google Patents
Ledに使用するための蛍光体及びそれらの混合物 Download PDFInfo
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- JP5143549B2 JP5143549B2 JP2007502833A JP2007502833A JP5143549B2 JP 5143549 B2 JP5143549 B2 JP 5143549B2 JP 2007502833 A JP2007502833 A JP 2007502833A JP 2007502833 A JP2007502833 A JP 2007502833A JP 5143549 B2 JP5143549 B2 JP 5143549B2
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- 229910052743 krypton Inorganic materials 0.000 description 1
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- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/66—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
- C09K11/664—Halogenides
- C09K11/665—Halogenides with alkali or alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7737—Phosphates
- C09K11/7738—Phosphates with alkaline earth metals
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- H01L33/502—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L33/504—
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- Chemical & Material Sciences (AREA)
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- Luminescent Compositions (AREA)
Description
米国政府は、NISTによって認められている契約No. 70NANB8H4022の条件によって規定される合理的な条件において、本発明における支払済みのライセンス及び特許権者がその他の者に認可する必要のある限定的な状況における権利を有する。
本発明は、蛍光体組成物に関し、特に電光用途に使用するための蛍光体に関する。さらに詳細には、本発明は、新規蛍光体及びこれらの蛍光体及びそれらの混合物を用いる電光装置に関する。
有色LEDに加え、LEDで生成された光及び蛍光体で生成された光の組み合わせが、白色光を生成するのに用いられ得る。最も一般的な白色LEDは、青色放射性GaInNチップからなる。青色放射性チップは、一部の青色放射線を補色、例えば黄緑色放射に転化する蛍光体で被覆されている。同時に、青色及び黄緑色放射線は、白色光を生成する。UV放射性チップ、及びUV放射線を可視光に転化するように設計された赤色、緑色及び青色放射性蛍光体を含む蛍光体混合物を用いる白色LEDもある。
第一の特徴では、本発明は、約250〜約500nmのピーク放射を有するUV又は青色半導体光源、及び式(Sr,Ba,Ca)2SiO4:Euを有する蛍光体を含む白色発光デバイスを提供する。
第二の特徴では、本発明は、約250〜約400nmのピーク放射を有するUV半導体光源、及び式(Ba,Sr,Ca)SiO4:Eu、及び一般式(Y,Gd,La,Lu,T,Pr,Sm)3(Al,Ga,In)5O12:Ceを有する1種以上のガーネット蛍光体及び式Mg4FGeO6:Mn4+(MFG)を有するマグネシウムフルオロゲルマネート蛍光体を含む蛍光体混合物を含む白色発光デバイスを提供する。
第三の特徴では、約370〜約500nmで放射する半導体光源、及び(Ba,Sr,Ca)SiO4:Eu、及び1種以上の(Sr,Mg,Ca,Ba,Zn)2P2O7:Eu,Mn(“SPP”);(Ca,Sr,Ba,Mg)5(PO4)3(Cl,F,OH):Eu,Mn(“HALO”);(Sr,Ba,Ca)MgAl10O17:Eu,Mn(“BAM,BAMn”);及びMg4FGeO6:Mn4+(MFG)を含む蛍光体混合物を含む白色発光デバイスが提供される。
第四の特徴では、(Sr,Ba,Ca)2SiO4:Eu及び(Sr,Mg,Ca,Ba,Zn)2P2O7:Eu,Mn(“SPP”);(Ca,Sr,Ba,Mg)5(PO4)3(Cl,F,OH):Eu,Mn(“HALO”);(Sr,Ba,Ca)MgAl10O17:Eu,Mn(“BAM,BAMn”);及びMg4FGeO6:Mn4+(MFG)の少なくとも1種;及び一般式(Y,Gd,La,Lu,T,Pr,Sm)3(Al,Ga,In)5O12:Ceを有する1種以上のガーネット蛍光体を含む蛍光体混合物が提供される。
蛍光体は、放射線(エネルギー)を可視光に転化する。蛍光体の異なる組み合わせは、異なる有色発光を提供する。蛍光体から生じる有色光は、色温度を提供する。新規蛍光体組成物は、LED及び他の光源におけるそれらの使用と同様にここで示される。
(Ba,Sr,Ca)5(PO4)3(Cl,F,Br,OH):Eu2+,Mn2+,Sb3+
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+
(Ba,Sr,Ca)BPO5:Eu2+,Mn2+
(Sr,Ca)10(PO4)6 *nB2O3:Eu2+
2SrO*0.84P2O5 *0.16B2O3:Eu2+
Sr2Si3O8*2SrCl2:Eu2+
Ba3MgSi2O8:Eu2+
Sr4Al14O25:Eu2+(SAE)
BaAl8O13:Eu2+
Sr4Al14O25:Eu2+
BaAl8O13:Eu2+
2SrO-0.84P2O5-0.16B203:Eu2+
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+
(Ba,Sr,Ca)5(PO4)3(Cl,F,OH):Eu2+,Mn2+,Sb3+
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+(BAMn)
(Ba,Sr,Ca)Al2O4:Eu2+
(Y,Gd,Lu,Sc,La)BO3:Ce3+,Tb3+
Ca8Mg(SiO4)4Cl2:Eu2+,Mn2+
(Ba,Sr,Ca)2(Mg,Zn)Si2O7:Eu2+
(Sr,Ca,Ba)(Al,Ga,In)2S4:Eu2+
(Y,Gd,Tb,La,Sm,Pr,Lu)3(Al,Ga)5O12:Ce3+
(Ca,Sr)8(Mg,Zn)(SiO4)4Cl2:Eu2+,Mn2+(CASI)
Na2Gd2B2O7:Ce3+,Tb3+
(Ba,Sr)2(Ca,Mg,Zn)B2O6:K,Ce,Tb
(Sr,Ca,Ba,Mg,Zn)2P2O7:Eu2+,Mn2+(SPP);
(Ca,Sr,Ba,Mg)10(PO4)6(F,Cl,Br,OH):Eu2+,Mn2+(HALO);
(Gd,Y,Lu,La)2O3:Eu3+,Bi3+
(Gd,Y,Lu,La)2O2S:Eu3+,Bi3+
(Gd,Y,Lu,La)VO4:Eu3+,Bi3+
(Ca,Sr)S:Eu2+
SrY2S4:Eu2+
CaLa2S4:Ce3+
(Ca,Sr)S:Eu2+
3.5MgO*0.5MgF2 *GeO2:Mn4+
(Ba,Sr,Ca)MgP2O7:Eu2+,Mn2+
(Y,Lu)2WO6:Eu3+,Mo6+
(Ba,Sr,Ca)xSiyNz:Eu2+
Claims (7)
- 可視白色光を放射するための電光装置であって、
UVの放射線を放射する半導体光源;及び
前記光源によって放射されたUV光が蛍光体組成物に対して放射されて白色光を発光するように前記光源と結合されている蛍光体組成物であって、(Ba,Sr,Ca)2SiO4:Eu、一般式(Y,Gd,La,Lu,T,Pr,Sm)3(Al,Ga,In)5O12:Ceを有する1種以上のガーネット蛍光体、及び(Sr,Mg,Ca,Ba,Zn)2P2O7:Eu,Mn、(Ca,Sr,Ba,Mg)5(PO4)3(Cl,F,OH):Eu,Mn、(Sr,Ba,Ca)MgAl10O17:Eu,Mn及びMg4FGeO6:Mn4+から成る群から選択される少なくとも1つの蛍光体を含み、前記(Ba,Sr,Ca)SiO4:Eu蛍光体が(Sr0.95Ba0.025Eu0.025)2SiO4又は(Sr0.58Ca0.36Eu0.06)2SiO4を含む蛍光体組成物、
を含む前記装置。 - 可視白色光を放射するための電光装置であって、
UV範囲の放射線を放射するUV光源;及び
前記光源によって放射されたUV光が蛍光体組成物に対して放射されて白色光を発光するように前記光源と結合されている蛍光体組成物であって、(Ba,Sr,Ca)2SiO4:Eu、一般式(Y,Gd,La,Lu,T,Pr,Sm)3(Al,Ga,In)5O12:Ceを有する1種以上のガーネット蛍光体及び式Mg4FGeO6:Mn4+を有するマグネシウムフルオロゲルマネート蛍光体を含み、前記(Ba,Sr,Ca)SiO4:Eu蛍光体が(Sr0.95Ba0.025Eu0.025)2SiO4又は(Sr0.58Ca0.36Eu0.06)2SiO4を含む蛍光体組成物、
を含む前記装置。 - 前記(Ba,Sr,Ca)2SiO4:Eu蛍光体が、(Sr0.95Ba0.025Eu0.025)2SiO4を含む、請求項1又は2記載の電光装置。
- 前記蛍光体組成物が、(Sr0.58Ca0.36Eu0.06)2SiO4を含み、且つ0.5286のccx値及び0.4604のccy値を有するカラーポイントを有する請求項1又は2記載の電光装置。
- 前記蛍光体組成物が、1種以上の追加の蛍光体をさらに含む、請求項1〜4のいずれか1項に記載の電光装置。
- 前記1種以上の追加の蛍光体が、
(Ba,Sr,Ca)5(PO4)3(Cl,F,Br,OH):Eu2+,Mn2+,Sb3+;
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+;
(Ba,Sr,Ca)BPO5:Eu2+,Mn2+;
(Sr,Ca)10(PO4)6 *nB2O3:Eu2+;
2SrO*0.84P2O5 *0.16B2O3:Eu2+;
Sr2Si3O8*2SrCl2:Eu2+;
Ba3MgSi2O8:Eu2+;
Sr4Al14O25:Eu2+;
BaAl8O13:Eu2+;
Sr4Al14O25:Eu2+;
BaAl8O13:Eu2+;
2SrO-0.84P2O5-0.16B203:Eu2+;
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+;
(Ba,Sr,Ca)5(PO4)3(Cl,F,OH):Eu2+,Mn2+,Sb3+;
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+;
(Ba,Sr,Ca)Al2O4:Eu2+;
(Y,Gd,Lu,Sc,La)BO3:Ce3+,Tb3+;
Ca8Mg(SiO4)4Cl2:Eu2+,Mn2+;
(Ba,Sr,Ca)2(Mg,Zn)Si2O7:Eu2+;
(Sr,Ca,Ba)(Al,Ga,In)2S4:Eu2+;
(Y,Gd,Tb,La,Sm,Pr,Lu)3(Al,Ga)5O12:Ce3+;
(Ca,Sr)8(Mg,Zn)(SiO4)4Cl2:Eu2+,Mn2+;
Na2Gd2B2O7:Ce3+,Tb3+;
(Ba,Sr)2(Ca,Mg,Zn)B2O6:K,Ce,Tb;
(Sr,Ca,Ba,Mg,Zn)2P2O7:Eu2+,Mn2+;
(Ca,Sr,Ba,Mg)10(PO4)6(F,Cl,Br,OH):Eu2+,Mn2+;
(Gd,Y,Lu,La)2O3:Eu3+,Bi3+;
(Gd,Y,Lu,La)2O2S:Eu3+,Bi3+;
(Gd,Y,Lu,La)VO4:Eu3+,Bi3+;
(Ca,Sr)S:Eu2+;
SrY2S4:Eu2+;
CaLa2S4:Ce3+;
(Ca,Sr)S:Eu2+;
3.5MgO*0.5MgF2 *GeO2:Mn4+;
(Ba,Sr,Ca)MgP2O7:Eu2+,Mn2+;
(Y,Lu)2WO6:Eu3+,Mo6+;
(Ba,Sr,Ca)xSiyNz:Eu2+;
からなる群から選択される、請求項5記載の電光装置。 - (Sr,Ba,Ca)2SiO4:Euと、(Sr,Mg,Ca,Ba,Zn)2P2O7:Eu,Mn;(Ca,Sr,Ba,Mg)5(PO4)3(Cl,F,OH):Eu,Mn;(Sr,Ba,Ca)MgAl10O17:Eu,Mn;及びMg4FGeO6:Mn4+の少なくとも1種と、一般式(Y,Gd,La,Lu,T,Pr,Sm)3(Al,Ga,In)5O12:Ceを有する1種以上のガーネット蛍光体とを含み、前記(Sr,Ba,Ca)2SiO4:Eu蛍光体が(Sr0.95,Ba0.025Ca0.025)2SiO4又は(Sr0.58,Ca0.036,Eu0.06)2SiO4を含む蛍光体混合物であって、前記蛍光体混合物が、UVの範囲におけるピーク放射を有する光源によって放射される放射線を吸収し、及び、前記光源からの前記放射線と組み合わされるとき、可視白色光を生成する放射線を放射することができる、蛍光体混合物。
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PCT/US2005/005546 WO2005091862A2 (en) | 2004-03-10 | 2005-02-22 | Phosphor and blends thereof for use in leds |
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EP (1) | EP1735816B1 (ja) |
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