JP5011157B2 - Electronic board holding structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce an influence of external force operating on a connector member on the electronic substrate itself or an electronic component mounted on the electronic substrate by reducing a load on the electronic substrate due to the external force. <P>SOLUTION: Disclosed is the holding structure for the electronic substrate mounted with the connector member C, the holding structure including: a bag-like electronic substrate storage case 1 for storing the electronic substrate P in a state wherein the connector member C is exposed; a support means 2 of supporting the electronic substrate P in the electronic substrate storage case 1; and a transmission means 3 of transmitting the external force that the connector member C receives to the electronic substrate storage case 1. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an electronic substrate holding structure.

  For example, when an electronic board for control is installed in a vehicle such as a motorcycle or an automobile, the electronic board on which electronic parts such as a connector member are mounted is connected to a bag-structured electronic board housing case with a connector member. In some cases, the electronic circuit board housing case is installed and held so that is exposed.

When holding an electronic substrate in such a bag-structured electronic substrate housing case, the electronic substrate is held in a state where the electronic substrate is directly supported inside the electronic substrate housing case.
For example, Patent Document 1 discloses a structure in which an electronic substrate is held by holding and supporting the electronic substrate with a guide member inside the electronic substrate housing case.
JP-A-11-289178

By the way, the connector member mounted on the electronic board is connected to an external harness or the like. An external force acts on the connector member when the harness is connected or through the harness. The external force acting on the connector member in this way is transmitted to the electronic board supported by the electronic board housing case, and acts on the electronic board as bending stress on the electronic board.
That is, in the conventional electronic board holding structure, a large load is applied to the electronic board due to the external force acting on the connector member. Therefore, there is a possibility that the electronic substrate itself or an electronic component mounted on the electronic substrate may be adversely affected.
In particular, since a motorcycle has a large vibration and a large external force acting on the connector member, a particularly large load is applied to the electronic board.

  The present invention has been made in view of the above-described problems, and reduces the load on the electronic board caused by the external force acting on the connector member, and the electronic board itself or the electronic board mounted on the electronic board caused by the external force. The purpose is to reduce the influence on parts.

  To achieve the above object, the present invention provides an electronic board holding structure on which a connector member is mounted, and an electronic board housing case having a bag structure for housing the electronic board in a state where the connector member is exposed, The electronic board housing case includes support means for supporting the electronic board and transmission means for transmitting an external force received by the connector member to the electronic board housing case.

  In the present invention, the transmission means may be a metal plate interposed between the connector member and the electronic board housing case.

  In the present invention, the area of the metal plate is set smaller than the area of the opening of the electronic substrate housing case when viewed from the insertion direction when the electronic substrate is inserted into the electronic substrate housing case. Adopt a configuration that

  Moreover, in this invention, the structure that resin is filled between the said electronic substrate storage case and the said electronic substrate is employ | adopted.

According to the present invention, in addition to the support means for supporting the electronic substrate inside the electronic substrate housing case, the transmitting device transmits the external force received by the connector member to the electronic substrate housing case. For this reason, at least a part of the external force received by the connector member by the transmission means is transmitted to the electronic substrate housing case without being transmitted to the electronic substrate.
Therefore, according to the present invention, the load on the electronic board caused by the external force acting on the connector member is reduced, and the influence on the electronic board itself or the electronic component mounted on the electronic board caused by the external force is reduced. It becomes possible to make it.

  Hereinafter, an embodiment of an electronic substrate holding structure according to the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.

FIG. 1 is an exploded perspective view of an electronic substrate holding structure 10 according to the present embodiment. FIG. 2 is an exploded vertical sectional view of the electronic substrate holding structure 10 of the present embodiment. FIG. 3 is an assembled vertical cross-sectional view of the electronic board holding structure 10 of the present embodiment.
1 to 3 show the electronic substrate P together with the electronic substrate holding structure 10.
In the description of the present embodiment, for the sake of convenience, the direction along the front and back surfaces of the electronic substrate P accommodated in a regular position of the electronic substrate housing case 1 described later is defined as the horizontal direction and the direction orthogonal to the front and back surfaces of the electronic substrate P Is described as a vertical direction. However, the posture of the electronic substrate housing case 1 when it is actually attached is free according to the installation location.

  As shown in FIGS. 1 to 3, the electronic board holding structure 10 of this embodiment includes an electronic board housing case 1, a rail pair 2 (support means), and a connector holder 3 (transmission means).

The electronic substrate housing case 1 of the present embodiment is a bag-like structure that houses the electronic substrate P while being held inside, and has an opening 11 for inserting and removing the electronic substrate P. . The electronic substrate housing case 1 is made of, for example, plastic.
The electronic board P is a printed board on which wiring is formed and a plurality of electronic components are mounted, and a connector member C, which is one of the electronic components, is mounted on the surface side of the one end P1. The connector member C includes a plurality of connection terminals arranged on the side portion C1 on the side away from the one end portion P1 of the electronic substrate P. When the electronic board P is housed inside the electronic board housing case 1, only the side part C1 of the connector member C is exposed to the opening 11 (see FIG. 3) of the electronic board housing case 1, Thus, the connector member C and the external harness can be connected.

  The electronic substrate housing case 1 includes an upper wall portion 1a and a lower wall portion 1b that are arranged to face each other in the horizontal direction, side wall portions 1c and 1d that are arranged to face each other in the vertical direction, and an upper wall portion 1a that is arranged in the vertical direction. The bottom wall portion 1b and the back wall portion 1e connected perpendicularly to the side wall portions 1c and 1d have a bag structure, and the shape viewed from the insertion direction of the electronic substrate P is substantially rectangular. ing.

In the electronic substrate housing case 1 of the present embodiment, a rail pair 2 (supporting portion) composed of two rails is installed on the inner side of each of the side wall portions 1c and 1d.
These rail pairs 2 are constituted by an upper rail 2a and a lower rail 2b arranged in the vertical direction.
The upper rail 2a is a rail that is disposed on the surface side of the electronic substrate P and extends in the insertion / extraction direction of the electronic substrate P when the electronic substrate P is accommodated. On the other hand, the lower rail 2b is a rail that is arranged on the back side of the electronic substrate P and extends in the insertion / extraction direction of the electronic substrate P when the electronic substrate P is accommodated.

The upper rail 2a and the lower rail 2b constituting the rail pair 2 function as a guide when the electronic board P is inserted into and removed from the electronic board housing case 1, and when the electronic board P is inserted. It functions to support the electronic substrate P inside the electronic substrate housing case 1.
More specifically, the electronic substrate P is held by being fitted into a groove between the upper rail 2a and the lower rail 2b whose both ends are arranged vertically, and slides along the groove. By doing so, it is guided at the time of insertion.

As shown in FIG. 1, the connector holder 3 is a metal plate whose shape is set corresponding to the upper portion of the connector member C, and is formed of, for example, aluminum.
In the assembled state, the connector holder 3 transmits at least a part of the external force acting on the connector member C to the electronic substrate housing case 1 without transmitting it to the electronic substrate P.

As shown in FIGS. 2 and 3, the connector holder 3 includes a first projecting portion C2 formed on the side surface and upper surface of the connector member C, and the electronic substrate P with respect to the first projecting portion C2. It positions with respect to the connector member C by being spaced apart in the insertion direction and fitting between the second projecting portion C3 formed on the side surface of the connector member C.
As shown in FIGS. 1 and 2, the connector holder 3 has a through hole 3a, and is fixed to the electronic substrate housing case 1 with a screw 4 passing through the through hole 3a.
Thus, in the electronic board holding structure 10 of the present embodiment, the connector holder 3 that is a metal plate is interposed between the connector member C and the electronic board housing case 1.

Further, as shown in FIG. 4, the area of the connector holder 3 is smaller than the area of the opening 11 of the electronic substrate housing case 1 when viewed from the insertion direction when the electronic substrate P is inserted into the electronic substrate housing case 1. Is set.
More specifically, in the electronic substrate holding structure 10 of the present embodiment, the height (distance in the vertical direction) is set lower than the height of the opening 11, so that the area of the connector holder 3 is reduced to the opening 11. It is comprised so that it may become smaller than the area.

Further, in the electronic substrate holding structure 10 of the present embodiment, as shown in FIG. 4, a resin mold is formed by filling the resin 5 between the electronic substrate housing case 1 and the electronic substrate P.
Note that the resin 5 is not shown in FIGS.

In the electronic board holding structure 10 of this embodiment having such a configuration, when an external force acts on the connector member C in the assembled state (the state shown in FIG. 3), at least a part of the external force is It is transmitted to the electronic substrate housing case 1 via the connector holder 3. That is, the connector holder 3 transmits at least a part of the external force received by the connector member C to the electronic substrate housing case 1 without being transmitted to the electronic substrate P.
That is, in the electronic board holding structure 10 of the present embodiment, by providing the connector holder 3, at least a part of the external force received by the connector member C is received by the electronic board housing case 1.
Therefore, according to the electronic board holding structure 10 of this embodiment, the load on the electronic board P caused by the external force acting on the connector member C is reduced, and the electronic board P itself or the electronic board P caused by the external force is reduced. It is possible to reduce the influence on the mounted electronic component.

Further, in the electronic board holding structure 10 of the present embodiment, at least an external force acting on the connector member C in the connector holder 3 which is a metal plate interposed between the connector member C and the electronic board housing case 1 is used. A part was transmitted to the electronic substrate housing case 1.
By using the connector holder 3 having higher rigidity than the electronic substrate housing case 1, more external force acting on the connector member C can be transmitted to the electronic substrate housing case 1, and the load on the electronic substrate P is increased. Can be further reduced.
Further, since the connector member C is fixed to the electronic substrate housing case 1 by a highly rigid member, the connector member C is firmly fixed, and the position of the connector member C relative to the electronic substrate housing case 1 can be stabilized. It becomes possible.

Further, in the electronic substrate holding structure 10 of the present embodiment, the connector holder 3 has an area as viewed from the insertion direction when the electronic substrate P is inserted into the electronic substrate housing case 1 as shown in FIG. It is set smaller than the area of the opening 11 of the substrate housing case 1.
For this reason, even when the connector holder 3 is fitted to the connector member C and is further screwed to the electronic board housing case 1, as shown in FIG. A region A communicating with the inside of the electronic substrate housing case 1 can be formed.
Therefore, the resin can be injected from the region A into the electronic substrate housing case 1, and the resin 5 can be easily filled between the electronic substrate housing case 1 and the electronic substrate P.

Further, in the electronic substrate holding structure 10 of the present embodiment, the resin 5 is filled between the electronic substrate housing case 1 and the electronic substrate P.
For this reason, it is possible to disperse the external force acting on the electronic substrate P and to prevent the electronic components mounted on the electronic substrate P from falling off.

  The preferred embodiment of the electronic substrate holding structure according to the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiment. Various shapes, combinations, and the like of the constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above-described embodiment, the configuration using the connector holder 3 that is a metal plate interposed between the connector member C and the electronic substrate housing case 1 as the transmission means in the present invention has been described.
However, the present invention is not limited to this, and the transmission means does not necessarily need to be a metal plate, and can transmit at least part of the external force acting on the connector member C to the electronic board housing case. Can be used. For example, a plastic member, a rubber member, or the like can be used as the transmission means.

In the above embodiment, the area of the connector holder 3 is set smaller than the area of the opening 11 of the electronic substrate housing case 1 when viewed from the insertion direction when the electronic substrate P is inserted into the electronic substrate housing case 1. Explained the configuration.
However, the present invention is not limited to this, and when the resin 5 is not filled or when the resin 5 is injected from an injection port separately provided in the electronic substrate housing case 1, the area of the connector holder 3 is the electronic substrate. It may be set equal to or larger than the area of the opening 11 of the housing case 1.

Moreover, in the said embodiment, the structure with which the resin 5 was filled between the electronic substrate storage case 1 and the electronic substrate P was demonstrated.
However, the present invention is not limited to this, and the space between the electronic substrate housing case 1 and the electronic substrate P is not necessarily filled with the resin 5.

Moreover, in the said embodiment, the structure which uses the rail pair 2 as a support means in this invention was demonstrated.
However, the present invention is not limited to this, and any mechanism that can directly support the electronic substrate P inside the electronic substrate housing case 1 can be used as the indicating means.

It is a disassembled perspective view of the holding structure of the electronic substrate in one Embodiment of this invention. It is a decomposition | disassembly vertical sectional view of the holding structure of the electronic substrate in one Embodiment of this invention. It is an assembly vertical sectional view of the holding structure of the electronic board in one embodiment of the present invention. It is the figure which looked at the holding structure of the electronic substrate in one Embodiment of this invention from the insertion direction of the electronic substrate.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic board accommodation case, 2 ... Rail pair (support means), 3 ... Connector holder (transmission means), 5 ... Resin, 10 ... Electronic board holding structure, P ... Electronic board, C ... ... Connector members

Claims (3)

An electronic board holding structure on which a connector member is mounted,
An electronic board housing case having a bag structure for housing the electronic board in a state where the connector member is exposed;
A support means for supporting the electronic substrate inside the electronic substrate housing case;
E Bei and transmitting means for transmitting the external force received in the connector member to the electronic substrate housing case,
A first projecting portion formed on a side surface and an upper surface of the connector member;
A second projecting portion formed on a side surface of the connector member and spaced from the first projecting portion in the insertion direction of the electronic board;
The transmission means is a metal plate that is interposed between the connector member and the electronic substrate housing case and fitted between the first projecting portion and the second projecting portion.
An electronic substrate holding structure characterized by the above. The transmission means is a metal plate whose area is set smaller than the area of the opening of the electronic substrate housing case when viewed from the insertion direction when the electronic substrate is inserted into the electronic substrate housing case,
2. The electronic substrate holding structure according to claim 1 , wherein a region communicating with the inside of the electronic substrate housing case is formed in a part of the opening of the electronic substrate housing case . 3. The electronic substrate holding structure according to claim 1, wherein a resin is filled between the electronic substrate housing case and the electronic substrate.

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