JP5008476B2 - Electrode bonding unit and electrode bonding method - Google Patents

Description

The present invention also relates to another circuit forming body electrodes to the electrodes of the circuit forming body, such as a glass substrate or an electronic component, the electrode assembly unit and the electrode junction how to bond with the insulating adhesive resin.

  In recent years, flat display panels typified by liquid crystal display panels and plasma display panels have been increased in screen size and definition, and are used as display devices such as television receivers and video equipment. In order to realize a high-definition and high-resolution display device using such a flat display panel, it is necessary to increase the number of pixels and increase the number of signal lines. When the number of signal lines is increased, the number of lead electrodes arranged on the peripheral side portion of the display device is increased accordingly, so that the electrode terminals are thinned and the electrode interval is narrowed (narrow pitch). Required.

  However, as the electrode terminals become thinner and the electrode spacing becomes smaller, the bonding reliability at the junction between the lead-out electrode of the display device and the electrode of the substrate on which the driving IC that transmits a signal to the display device is mounted is increased. The problem of deteriorating arises. This will be described in detail below.

  FIG. 7A is a perspective view showing a configuration of a display device 100 of a conventional example. 7B is a partially enlarged cross-sectional view taken along line AA in FIG. 7A, and FIG. 7C is a partially enlarged cross-sectional view taken along line BB in FIG. 7A.

  The display device 100 of the conventional example is configured by bonding two glass substrates 101a and 101b having different sizes. A plurality of substrates on which driving ICs are mounted on the lower side (lower right side in FIG. 7A) of the front glass substrate 101a and the left and right sides (lower left and upper right sides in FIG. 7A) of the rear glass substrate 101b. (Hereinafter referred to as electronic components) 102 are arranged and they are joined to each other via an insulating adhesive resin 103.

  As shown in FIGS. 7B and 7C, the glass substrate 101b and the electronic component 102 are arranged such that a plurality of extraction electrodes 101c of the glass substrate 101b and a plurality of electrodes 102a of the electronic component 102 are opposed to each other with conductive particles 104 interposed therebetween. In this state, they are joined by the insulating adhesive resin 103.

  A conventional electrode joining method between the glass substrate 101b and the electronic component 102 will be described with reference to FIGS. 7C, 8A, and 8B. In addition, illustration of the glass substrate 102a is abbreviate | omitted in FIG. 8A and 8B.

First, as shown in FIG. 8A, an insulating adhesive resin in which conductive particles 104 are dispersed inside the edge region 111a of the facing region 111 between the extraction electrode 101c of the glass substrate 101b and the electrode 102a of the electronic component 102. 103 is arranged.
Next, the crimping tool 105 heated to a certain temperature is brought into contact with the electronic component 102 as shown in FIG. 8B, and the insulating adhesive resin 103 is pressed through the electronic component 102 with a certain pressure for a certain time. Heat.
By this pressurization and heating, the insulating adhesive resin 103 is melted and flows and hardens to the outer regions 112a and 112b adjacent to the opposing region 111 as shown in FIG. 7C. Thereby, the glass substrate 101b and the electronic component 102 are joined by the insulating adhesive resin 103. At this time, the conductive particles 104 in the insulating adhesive resin 103 are disposed between the extraction electrode 101c and the electrode 102a, and the two are electrically connected.

  In the conventional electrode joining method as described above, since the crimping tool 105 is set to a single heating and pressing condition, the conductive particles 104 are excessively pressed and crushed, or the insulating adhesive resin 103 is used. May flow too much into the outer regions 112a and 112b, and the opposing region 111 may not be sufficiently filled with the insulating adhesive resin 103. For this reason, there exists a problem that joining reliability falls. This problem becomes more pronounced as the electrode spacing becomes finer (narrower pitch), because the space in which the insulating adhesive resin 103 accumulates becomes narrower.

  A method for improving the above problem is disclosed in Japanese Patent Application Laid-Open No. 2000-180883. In Patent Document 1, the pressurization by the crimping tool 105 is performed from a first pressurization in which pressurization is performed at a high pressure for a short time and a second pressurization in which pressurization is performed at a lower pressure than the first pressurization for a long time. In addition to pressurization in two stages, the heating by the crimping tool 105 includes a first heating for heating for a short time at a high temperature and a second heating for heating for a long time at a temperature lower than the first heating. A method of heating in two stages is disclosed.

According to Patent Document 1, the insulating adhesive resin 103 is controlled to have a predetermined thickness by the first pressurization, and a sufficient amount of heat is secured to melt the insulating adhesive resin 103 by the first heating. Then, the insulating adhesive resin 103 is cured by the second pressure and the second heating. This suppresses excessive crushing of the conductive particles 104 and also prevents the insulating adhesive resin 103 from flowing too much into the outer regions 112a and 112b and sufficiently filling the opposing region 111 with the insulating adhesive resin 103. Can do.
JP 2000-180883 A

  However, in Patent Document 1, although the crushing of the conductive particles 104 can be suppressed by performing the pressurization in two stages, the insulating adhesive resin 103 is melted when the heating is performed in two stages. Since the first heating is performed until a sufficient amount of heat is ensured, the insulating adhesive resin 103 may flow too much into the outer regions 112a and 112b in the first heating stage. Therefore, when the second heating is performed, a sufficient amount of the insulating adhesive resin 103 for ensuring the bonding reliability between the glass substrate 101b and the electronic component 102 does not exist in the facing region 111, and as a result, the bonding reliability is increased. There is a possibility that the decline in sex cannot be suppressed. In addition, a part of the insulating adhesive resin 103 that flows by the first heating is not supplied with a sufficient amount of heat to be cured, and there is a possibility that an insufficiently cured part is generated.

Accordingly, an object of the present invention is to solve the above-described problems, and in the electrode bonding in which the electrode of another circuit forming body is bonded to the electrode of the circuit forming body using an insulating adhesive resin, the bonding reliability and to provide a further electrode assembly unit and the electrode junction how that it is possible to suppress a decrease.

In order to achieve the above object, the present invention is configured as follows.
According to the first aspect of the present invention, a first circuit forming body having a plurality of first electrodes, and a second circuit having a plurality of second electrodes arranged to face each of the first electrodes. An electrode joining unit that joins the formed body with a thermosetting insulating adhesive resin and joins the first electrode and the second electrode to each other,
An edge crimping tool unit capable of pressurizing and heating an edge region located on one end side of the second circuit formed body in an opposing region of the first circuit formed body and the second circuit formed body;
An inner crimping tool unit capable of pressurizing and heating an inner region adjacent to the edge region on the inner side in the opposing region;
An electrode joining unit comprising :
The inner crimping tool unit includes an inner crimping head capable of pressurizing and heating the inner region via the first or second circuit forming body, and a first temperature capable of melting the insulating adhesive resin. And an inner heating device for heating the inner crimping head to a second temperature at which the insulating adhesive resin can be cured,
The edge crimping tool unit includes an edge crimping head capable of pressurizing and heating the edge region via the first or second circuit forming body, and an insulating adhesive resin capable of curing the insulating adhesive resin. An edge heating device that heats the edge crimping head to a temperature of 3.
An electrode joining unit is provided.

According to the second aspect of the present invention, the inner heating device heats the inner pressure-bonding head at the second temperature after heating at the first temperature for a predetermined time,
The edge heating device heats the edge crimping head at the third temperature while the inner heating device heats the inner crimping head at the first or second temperature. The electrode joining unit according to the first aspect is provided.

According to the third aspect of the present invention, it is possible to set the pressure of the inner pressure-bonding head and the edge pressure-bonding head to the first pressure and the second pressure lower than the first pressure. An electrode joining unit according to the first aspect, comprising a pressing device.

According to a fourth aspect of the present invention, the pressurizing apparatus sets the inner pressure-bonding head and the edge pressure-bonding head to the first pressure after setting the first pressure for a predetermined time. The electrode joining unit according to the third aspect to be set is provided.

According to the fifth aspect of the present invention, a first circuit forming body having a plurality of first electrodes, and a second circuit having a plurality of second electrodes arranged to face each of the first electrodes. An electrode joining method in which the formed body is joined with a thermosetting insulating adhesive resin, and the first electrode and the second electrode are joined to each other.
Insulating adhesive resin disposed on the inner side of the edge region located on one end side of the second circuit forming body in the opposing region of the first circuit forming body and the second circuit forming body, It is cured by pressurizing and melting with a crimping tool unit for curing,
Insulating adhesive resin that has been melted by the pressure heating and flowed to the edge region is cured by pressure heating with a crimping tool unit for the edge ,
The inner crimping tool unit pressurizes and heats the insulating adhesive resin for a predetermined time at a first temperature at which the insulating adhesive resin can be melted, and then melts the insulating adhesive resin. Pressurizing and curing the molten adhesive adhesive resin at a second temperature capable of curing the adhesive resin,
The edge crimping tool unit is heated by pressurizing and curing the insulating adhesive resin that has been melted and flowed to the edge region at a third temperature at which the insulating adhesive resin can be cured.
An electrode bonding method is provided.

  According to the electrode bonding unit according to the present invention, the edge region located on the one end side of the second circuit forming body in the region facing the first circuit forming body and the second circuit forming body is used as an edge crimping tool. The unit is configured to be heated by pressure, and the inner region adjacent to the edge region on the inner side can be pressurized and heated by the inner crimping tool unit. In other words, in order to perform electrode bonding of a set of circuit formed bodies, two crimping tool units are provided for each region where the state of the insulating adhesive resin is different. Thereby, since optimal pressurization heating can be performed according to the state of insulating adhesive resin, the fall of joining reliability can be suppressed further than before.

  According to the electrode bonding method according to the present invention, the insulating adhesive resin disposed on the inner side of the edge region is pressurized and heated by the inner pressure-bonding tool unit to be cured, and then the edge region. The insulative adhesive resin that has flowed into the pressure is cured by being pressurized and heated by the crimping tool unit for the edge. That is, the insulating adhesive resin melted by the inner crimping tool unit and flowing into the edge region is cured in the edge region by the edge crimping tool unit. The insulating adhesive resin cured in the edge region becomes a barrier for the insulating adhesive resin melted by the inner crimping tool unit after the curing. Thereby, it can suppress that insulating adhesive resin flows too much to the outer side area | region adjacent to the said edge part area | region. Therefore, it is possible to suppress a decrease in bonding reliability.

Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.
The best mode for carrying out the present invention will be described below with reference to the drawings.

<< First Embodiment >>
The configuration of the electrode bonding unit according to the first embodiment of the present invention will be described with reference to FIGS. 1A to 1C. FIG. 1A is a front view showing a configuration of an electrode bonding unit 20 according to the first embodiment of the present invention, and FIG. 1B is a side view thereof. FIG. 1C is a partially enlarged cross-sectional view illustrating a state in which the electrode bonding unit 20 performs electrode bonding.

  1A to 1C, an electrode bonding unit 20 includes a first circuit forming body 1 having a plurality of first electrodes 1a, and a plurality of second electrodes 2a arranged to face the first electrodes 1a. Is a unit for joining the first electrode 1a and the second electrode 2a to each other by joining the second circuit forming body 2 having the above-mentioned with a thermosetting insulating adhesive resin. Here, the electrode joining unit 20 shall perform the electrode joining of the glass substrate and electronic component which are the junction structure of the terminal part of a flat display panel as an example. That is, the first circuit forming body 1 is a glass substrate, and the second circuit forming body 2 is an electronic component.

  The electrode bonding unit 20 includes an edge crimping tool unit 22 capable of pressurizing and heating an edge region 11A located on one end side of the electronic component 2 in the facing region 11 between the glass substrate 1 and the electronic component 2, and a facing region. 11 is provided with an inner crimping tool unit 21 capable of pressurizing and heating an inner region 11B adjacent to the edge region 11A on the inner side.

  Here, the “opposing region 11” means a region where the glass substrate 1 and the flexible substrate 2 face each other, but includes a region where one end 1A of the glass substrate 1 and the flexible substrate 2 shown in FIG. 1C face each other. Absent. One end portion 1A of the glass substrate 1 is provided to prevent the insulating adhesive resin from flowing down due to gravity when the insulating adhesive resin flows into the portion, as will be described in detail later. is there. Therefore, although the glass substrate 1 is extended here and the one end part 1A is comprised, it may be comprised with another member. Further, when there is no fear that the insulating adhesive resin flows down due to gravity, the one end portion 1A may not be provided.

  Further, the “edge region 11A” refers to a region sandwiched between the glass substrate 1 and the electronic component 2 in the thickness direction of the glass substrate 1 or the electronic component 2 (vertical direction in FIG. 1C) and a region not sandwiched between them. This is a region that is on the inner side (on the side of the sandwiched region) than the boundary part and has little influence on the conduction between the entire electrodes. For example, when the length of the region that requires conduction between the electrodes in the facing region 11 (lateral direction in FIG. 1C) is 3 mm, the length of the edge region 11A is about 0.1 mm to 1.0 mm. is there.

  The inner crimping tool unit 21 and the edge crimping tool unit 22 are integrally attached to a pressurizing device 23, and are configured to be movable up and down when the pressurizing device 23 is driven. The pressure device 23 is fixed to the guide rail 24 b of the elevating unit 24. The guide rail 24b is configured to move up and down when the drive motor 24a of the elevating unit 24 is driven. That is, when the drive motor 24a of the elevating unit 24 is driven, the pressurizing device 23, the inner crimping tool unit 21, and the edge crimping tool unit 22 move up and down integrally with the vertical movement of the guide rail 24b. Is configured to do.

  The inner crimping tool unit 21 is fixed to the inner crimping head 25 capable of pressurizing and heating the inner region 11B via the electronic component 2 (or the glass substrate 1) and the upper part of the inner crimping head 25 and pressurizing. An inner heating device 26 that is attached to the lower part of the device 23 and supplies a heating force to the inner crimping head 25 is provided.

  The inner heating device 26 includes a heater (not shown) and is configured to heat the inner crimping head 25 with a first temperature profile as shown in FIG. 2A. More specifically, the inner heating device 26 is configured to heat the inner crimping head 25 in two stages of a first temperature T1 and a second temperature T2. The first temperature T1 is a temperature in a temperature region in which the insulating adhesive resin can be melted, and the second temperature is higher than the first temperature T1 and the temperature region in which the insulating adhesive resin can be cured. At a certain temperature.

  The edge crimping tool unit 22 is fixed to the edge crimping head 27 capable of pressurizing and heating the inner region 11B via the electronic component 2, and the edge crimping head 27. And an edge heating device 28 for supplying heating power to the head.

  The edge heating device 28 incorporates a heater (not shown), and heats the edge crimping head 27 with a second temperature profile different from the first temperature profile as shown in FIG. 2B. It is configured. More specifically, the edge heating device 28 is configured to heat the edge crimping head 27 to the third temperature T3. The third temperature T3 is a temperature that is higher than the first temperature T1 and is in a meltable temperature range where the insulating adhesive resin can be cured. Note that the third temperature T3 may be the same as the second temperature T2.

  The pressurizing device 23 and the driving motor 24a are connected to the pressurizing control unit 31a of the control unit 31, and the inner heating device 26 and the edge heating device 28 are connected to the heating control unit 31b of the control unit 31. Yes. The pressurization control unit 31a and the heating control unit 31b of the control unit 31 are configured to control the operation of each unit and each device connected thereto based on an operation program and mounting data stored in advance. .

  Below the inner pressure-bonding head 25 and the edge pressure-bonding head 27, a pressure-bonding stage 30 is arranged so as to face the head and support the glass substrate 1 from below.

  Hereinafter, an electrode bonding method and an electrode bonding structure according to a first embodiment of the present invention will be described with reference to FIGS. 1A to 4. 3A to 3C are cross-sectional views illustrating the procedure of the electrode bonding method according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view showing the configuration of the electrode joint structure according to the first embodiment of the present invention. The following electrode bonding operation is performed under the control of the control unit 31.

  First, as shown in FIG. 3A, the first electrode 1a of the glass substrate 1 and the second electrode 2a of the electronic component 2 are arranged to face each other, and the inner region 11B of the facing region 11 between the glass substrate 1 and the electronic component 2 is placed. Insulating adhesive resin 3 in which conductive particles 4 are dispersed is disposed. At this time, as shown in FIG. 1B, the glass substrate 1 is supported from below by the crimping stage 30.

  Next, the driving motor 24a of the elevating unit 24 shown in FIGS. 1A and 1B is driven, and the inner side crimping tool unit 21 and the edge crimping tool unit 22 are lowered to near the upper part of the electronic component 2. Thereafter or simultaneously with this, the pressure device 23 is driven, and as shown in FIG. 3B, the inner pressure-bonding head 25 and the edge pressure-bonding head 27 are applied to the electronic component 2 at a constant pressure (for example, 30 kg / cm 2). ). Thereby, the inner side crimping head 25 is positioned at a position where the inner region 11B can be pressurized and heated, and the edge crimping head 27 is positioned at a position where the edge region 11A can be pressurized and heated.

  Next, the inner heating device 26 and the edge heating device 28 shown in FIGS. 1A and 1B are driven to supply heating force to the inner pressure bonding head 25 and the edge pressure bonding head 27. At this time, the inner heating device 26 supplies a heating force to the inner pressure-bonding head 25 so as to change according to the first temperature profile shown in FIG. 2A. That is, in the first stage (for example, 2 to 3 seconds) from the start of driving to a predetermined time, a heating force is supplied so that the temperature of the inner pressure-bonding head 25 is maintained at the first temperature T1, In the second stage from the elapse of a predetermined time until the end of driving, the heating force is supplied so that the temperature of the inner pressure-bonding head 25 is maintained at the second temperature T2. On the other hand, the edge heating device 28 supplies heating power so that the temperature of the edge crimping head 27 changes in the second temperature profile shown in FIG. 2B. That is, the heating power is supplied so that the temperature of the edge crimping head 27 is maintained at the third temperature T3 throughout the period from the first stage to the second stage from the start of driving to the end of driving.

  In the first stage, the insulating adhesive resin 3 melted by pressure heating by the inner pressure-bonding head 25 set at the first temperature T1 flows into the edge region 11A on one end side of the electronic component 2 and It flows to the outer region 12B adjacent to the inner region 11B. As shown in FIG. 3C, the insulating adhesive resin 3 that has flowed to the edge region 11 </ b> A is outside the edge region 11 </ b> A by pressure heating by the edge crimping head 27 set to the third temperature T <b> 3. And does not flow to the adjacent outer region 12A, but is cured in the edge region 11A. The insulating adhesive resin 3 cured in the edge region 11A serves as a barrier, and thereafter the insulating adhesive resin 3 melted by pressure heating by the inner pressure-bonding head 25 flows to the outer region 12B side. The direction of flow is controlled.

  Thereafter, in the second stage, by pressure heating of the inner crimping head 25 whose temperature setting is switched to the second temperature T2 and the edge crimping head 27 whose temperature is set to the third temperature T3. The insulating adhesive resin 3 is cured as shown in FIG. 4 to join the glass substrate 1 and the electronic component 2 together. At this time, the electroconductive particle 4 is arrange | positioned between the 1st electrode 1a and the 2nd electrode 2a, and both are electrically connected. Thereby, the electrode junction structure concerning a 1st embodiment of the present invention is produced.

  In the above description, the insulating adhesive resin 3 does not flow and harden in the outer region 12A adjacent to the edge region 11A. However, the present invention is not limited to this. It is only necessary that the insulating adhesive resin 3 cured in the edge region 11A acts as a barrier, and the size of the edge adhesive resin 3 that flows and cures in the outer region 12A can be made smaller than before. Even in this case, it is possible to suppress a decrease in bonding reliability as compared with the conventional case.

  In addition, when the insulating adhesive resin 3 is hardened in the edge region 11A as described above (see FIG. 4), it is possible to further suppress a decrease in bonding reliability. This will be described below. Here, as shown in FIG. 4, a region where the insulating adhesive resin 3 exists in the edge region 11 </ b> A is referred to as a first region, and the insulating adhesive resin 3 is adjacent to the first region on the inner side. An area where the sigma exists is called a second area.

FIG. 5 is a cross-sectional view showing a part of the configuration of a display device such as a flat display panel using the electrode joint structure according to the first embodiment of the present invention.
When producing a display device such as a flat display panel using the electrode bonding structure according to the first embodiment of the present invention, the glass substrate 1 may be, for example, another glass substrate having a different size as shown in FIG. After 5 is bonded, the electronic component 2 is pressure-bonded with a gap from the glass substrate. If this gap is left exposed to the outside, water, corrosive gas or the like may enter from the gap, and the first and second electrodes 1a and 2A existing in the gap may be oxidized. For this reason, a migration failure may occur, and electrical conduction may be hindered. In this case, highly reliable joining quality cannot be realized.

  As a method for preventing the above problems, for example, a thermosetting or photocurable insulating sealing resin 6 having water resistance is applied so as to seal the gap using a dispenser, and is heated or irradiated with light. There is a method of closing the gap by curing. When the insulating sealing resin 6 is applied to the electrode bonded structure according to the first embodiment by the above method, the insulating bonding is performed in the first region located in a part of the edge region 11A. When the agent resin 3 is cured, as shown in FIG. 5, the insulating sealing resin 6 can enter the region 13 adjacent to the first region in the edge region 11A. At this time, since it is not necessary to disperse the conductive particles 4 having no adhesive force in the insulating sealing resin 6, the adhesion between the glass substrate 1 and the electronic component 2 by the insulating sealing resin 6 is improved. In addition, it is possible to suppress a decrease in bonding reliability.

  On the other hand, when the insulating adhesive resin 3 flows to the outer region 12A (see FIG. 4) and is cured, a large number of conductive particles 4 are present in the edge region 11A and the outer region 12A. It exists and there exists a possibility that the adhesiveness of the glass substrate 1 and the electronic component 2 by the insulating adhesive resin 3 may fall by these electroconductive particle 4. FIG.

  According to the electrode joining unit 20 according to the first embodiment of the present invention, the edge region 11A can be pressurized and heated by the edge crimping tool unit 22, and the inner region 11B can be pressurized and heated by the inner crimping tool unit 21. It is configured. Thereby, according to the state of insulating adhesive resin 3, optimal pressurization heating can be performed and the fall of joining reliability can be suppressed. In addition, since it is possible to suppress a decrease in bonding reliability, it is possible to cope with miniaturization of the electrode interval.

  In addition, according to the electrode bonding unit 20 according to the first embodiment of the present invention, the inner crimping head 25 is heated at the first temperature T1 and the second temperature T2, and the edge crimping head 27 is 3 is heated at a temperature T3. That is, the inner crimping head 25 and the edge crimping head 27 are configured to be heated independently of each other. Thereby, according to the state of insulating adhesive resin 3, optimal pressurization heating can be performed and the fall of joining reliability can be suppressed.

  The first temperature T1 prevents the insulating adhesive resin 3 from flowing into the outer region 12A before the insulating adhesive resin 3 hardens within the edge region 11A because the flowing speed of the insulating adhesive resin 3 is too high. The temperature is preferably set to a lower temperature in the temperature range in which the insulating adhesive resin 3 can be melted.

  Moreover, according to the electrode joining method concerning 1st Embodiment of this invention, the insulating adhesive resin 3 arrange | positioned at the inner side area | region 11B is pressurized and heated with the crimping | compression-bonding tool unit 21 for inner side, and is then hardened. At the same time, the insulating adhesive resin 3 that has flowed to the edge region 11A due to the melting is pressurized and heated by the edge crimping tool unit 22 to be cured. Thus, the insulating adhesive resin 3 melted by the inner crimping tool unit 21 and flowing into the edge region 11A is cured by the edge crimping tool unit 22 in the edge region 11A. The insulating adhesive resin 3 cured in the edge region 11A becomes a barrier of the insulating adhesive resin 3 melted by the inner crimping tool unit 21 after the curing. Thereby, it can suppress that the insulating adhesive resin 3 flows too much into the outer side area | region 12A adjacent to the edge part area | region 11A. In addition, the flow rate of the insulating adhesive resin 3 can be reduced, and in particular, the insulating adhesive resin 3 located in the inner region 11B where bonding reliability is required is given a sufficient amount of heat to be cured. The occurrence of insufficiently cured portions can be suppressed. Therefore, it is possible to suppress a decrease in bonding reliability, and to cope with miniaturization of the electrode interval.

  In addition, the form of the insulating adhesive resin 3 before pressurization heating may be a paste form or a sheet (film) form. For example, an anisotropic conductive paste, an anisotropic conductive film, or an anisotropic conductive sheet may be used. Among them, it is preferable to use an anisotropic conductive sheet because of excellent workability and handleability. In the above description, the electrode bonding is performed using the insulating adhesive resin 3 in which the conductive particles 4 are dispersed. However, the present invention is not limited to this. For example, electrode bonding may be performed using NCF (non-conductive film), NCP (non-conductive paste), or the like as the insulating adhesive resin 3.

  Moreover, according to the electrode bonding structure according to the first embodiment of the present invention, in the facing region 11, the first region located in the edge region 11A and the second region adjacent to the first region on the inner side. Insulating adhesive resin 3 is arranged over. In other words, the insulating adhesive resin 3 is not present in the outer region 12A adjacent to the edge region 11A. As a result, the insulating adhesive resin 3 does not flow to the outer region 12A during pressurization and is hardened at the edge region 11A to become a barrier, and a sufficient amount of the insulating adhesive resin to ensure bonding reliability. 3 is estimated to be filled in the facing region. Further, when the electrode bonded structure is used for a display device, the insulating sealing resin 6 can enter the region 13 between the glass substrate 1 and the electronic component 2, so that the bonding reliability is further reduced. Can be suppressed, and it is possible to cope with the miniaturization of the electrode interval.

<< Second Embodiment >>
An electrode joining method according to the second embodiment of the present invention will be described with reference to FIG.
In the electrode joining method according to the second embodiment of the present invention, the pressure applied to the insulating adhesive resin 3 by the inner crimping head 25 and the edge crimping head 27 is as shown in the graph of FIG. It differs from the said 1st Embodiment by the point which drives the pressurization apparatus 23 so that it may change in two steps, 1 pressure P1 and 2nd pressure P2. Since the other points are the same, redundant description will be omitted, and differences will be mainly described below.

  As shown in FIG. 6, in the second embodiment, in the first stage (for example, 2 to 3 seconds) in which the insulating adhesive resin 3 is melted, the pressure of the inner crimping head 25 and the edge crimping head 27 is increased. Is driven (lowered) so that is maintained at the first pressure P1. The first pressure P1 sets the thickness of the insulating adhesive resin 3 to an appropriate thickness and crushes the conductive particles 4 (the conductive particles 4 are brought into contact with both the glass substrate 1 and the electronic component 2). It is preferable to set the pressure necessary for securing the electrical connection between them. Thereby, the insulating adhesive resin 3 is further prevented from flowing into the outer region 12A (see FIG. 3C) than in the first embodiment, and the first electrode 1a of the glass substrate 1 and the second of the electronic component 2 are suppressed. The electrical connection with the second electrode 2a can be ensured.

  Further, in the second stage in which the insulating adhesive resin 3 is cured, the pressure device 23 is driven so that the pressures of the inner pressure bonding head 25 and the edge pressure bonding head 27 are maintained at the second pressure P2. (Descent). The second pressure P2 is preferably set to a pressure that is lower than the first pressure P1 and does not cause distortion in the insulating adhesive resin 3. Thereby, it can prevent that the electroconductive particle 4 is crushed too much and can suppress the fall of joining reliability further.

  According to the electrode joining method according to the second embodiment of the present invention, the first pressure P1 is applied to the insulating adhesive resin 3 in the first stage, and the second pressure P2 in the second stage. By imparting, optimal pressurization can be performed in accordance with the state of the insulating adhesive resin 3, and further reduction in bonding reliability can be suppressed.

  In addition, this invention is not limited to said each embodiment, It can implement in another various aspect. For example, in the above description, the glass substrate and flexible substrate bonding structure, which is the bonding structure of the terminal portion of the flat display panel, has been described as an example, but the present invention is not limited to this. For example, the technology of the present invention is also applied to the field of electronic equipment that requires high bonding reliability, such as a bonding structure between flexible substrates typified by an organic EL panel and a bonding structure between a glass epoxy wiring substrate and a flexible substrate. can do.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

Electrode assembly unit and the electrode junction how according to the present invention, the bonding because the reduction in reliability can be suppressed, the electrodes of the other circuits forming body on the electrode of the circuit forming body, using an insulating adhesive resin It is useful for electrode bonding in the field of electronic equipment that requires high bonding reliability, such as bonding technology, particularly flat display panels, organic EL panels, and liquid crystal panels.

The front view which shows the structure of the electrode joining unit concerning 1st Embodiment of this invention. The side view which shows the structure of the electrode joining unit concerning 1st Embodiment of this invention. The partially expanded view which shows the state when the electrode joining unit concerning 1st Embodiment of this invention performs electrode joining Graph showing the temperature profile of the inner crimping head Graph showing temperature profile of crimping head for edge Sectional drawing which shows the procedure of the electrode joining method concerning 1st Embodiment of this invention. Sectional drawing which shows the procedure following FIG. 3A Sectional drawing which shows the procedure following FIG. 3B Sectional drawing which shows the structure of the electrode junction structure concerning 1st Embodiment of this invention. Sectional drawing which shows a part of structure of the display device using the electrode junction structure concerning 1st Embodiment of this invention. The graph which shows the pressure profile of the crimping head for inner sides, and the crimping head for edge parts in the electrode joining method concerning 2nd Embodiment of this invention. The perspective view which shows the structure of the display device of a prior art example. AA sectional view of FIG. 7A BB sectional view of FIG. 7A Sectional drawing which shows the procedure of the electrode joining method of a prior art example Sectional drawing which shows the procedure following FIG. 8A

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 1a 1st electrode 2 Electronic component 2a 2nd electrode 3 Insulating adhesive resin 4 Conductive particle 5 Other glass substrate 6 Insulating sealing resin 11 Opposite area | region 11A Edge area 11B Inner area | region 12A, 12B Outer region 20 Electrode bonding unit 21 Inner crimping tool unit 22 Edge crimping tool unit 23 Pressurizing device 24 Lifting unit 25 Inner crimping head 26 Inner heating device 27 Edge crimping head 28 Edge heating device 30 Crimping Stage 31 control unit

Claims (5)

A first circuit forming body having a plurality of first electrodes and a second circuit forming body having a plurality of second electrodes arranged opposite to the first electrodes are thermosetting insulating. An electrode bonding unit that bonds the first electrode and the second electrode by bonding with an adhesive resin,
An edge crimping tool unit capable of pressurizing and heating an edge region located on one end side of the second circuit formed body in an opposing region of the first circuit formed body and the second circuit formed body;
An inner crimping tool unit capable of pressurizing and heating an inner region adjacent to the edge region on the inner side in the opposing region;
An electrode joining unit comprising :
The inner crimping tool unit includes an inner crimping head capable of pressurizing and heating the inner region via the first or second circuit forming body, and a first temperature capable of melting the insulating adhesive resin. And an inner heating device for heating the inner crimping head to a second temperature at which the insulating adhesive resin can be cured,
The edge crimping tool unit includes an edge crimping head capable of pressurizing and heating the edge region via the first or second circuit forming body, and an insulating adhesive resin capable of curing the insulating adhesive resin. An edge heating device that heats the edge crimping head to a temperature of 3.
Electrode bonding unit. The inner heating device heats the inner pressure-bonding head at the second temperature after heating at the first temperature for a predetermined time,
The edge heating device heats the edge crimping head at the third temperature while the inner heating device heats the inner crimping head at the first or second temperature. The electrode joining unit according to claim 1 . Further comprising a first pressure, to the above lower than the first pressure second pressure, the pressure device capable of pressure setting of the inner crimp head and the edge for crimping head, according to claim 1 The electrode joining unit described in 1. The electrode according to claim 3 , wherein the pressurizing device sets the inner pressure-bonding head and the edge pressure-bonding head to the first pressure after setting the first pressure for a predetermined time. Bonding unit. A first circuit forming body having a plurality of first electrodes and a second circuit forming body having a plurality of second electrodes arranged opposite to the first electrodes are thermosetting insulating. It is an electrode bonding method for bonding the first electrode and the second electrode by bonding with an adhesive resin,
Insulating adhesive resin disposed on the inner side of the edge region located on one end side of the second circuit forming body in the opposing region of the first circuit forming body and the second circuit forming body, It is cured by pressurizing and melting with a crimping tool unit for curing,
Insulating adhesive resin that has been melted by the pressure heating and flowed to the edge region is cured by pressure heating with a crimping tool unit for the edge ,
The inner crimping tool unit pressurizes and heats the insulating adhesive resin for a predetermined time at a first temperature at which the insulating adhesive resin can be melted, and then melts the insulating adhesive resin. Pressurizing and curing the molten adhesive adhesive resin at a second temperature capable of curing the adhesive resin,
The edge crimping tool unit is heated by pressurizing and curing the insulating adhesive resin that has been melted and flowed to the edge region at a third temperature at which the insulating adhesive resin can be cured.
Electrode bonding method.

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