JP5099060B2 - Organic EL device, method for manufacturing organic EL device, electronic device - Google Patents

Description

  The present invention relates to an organic EL device, a method for manufacturing the organic EL device, and an electronic apparatus.

  Organic EL devices are expected to be applied to mobile phones, personal computers, in-vehicle monitors and the like as thin and light self-luminous elements. Recently, development of a flexible and high-functional organic EL device in which a high heat-resistant glass substrate is thinned to about 50 μm to 100 μm and a peripheral drive circuit is built (see Patent Document 1).

  However, the organic EL device using such a thin glass substrate has a problem that it is difficult to handle because it is weak against mechanical shock and is thin. Patent Document 2 proposes a liquid crystal device having a similar structure in which a liquid crystal panel using a thin glass substrate is reinforced with a thick polarizing plate of 0.3 mm and these are integrated with a laminate film. (See FIG. 7 of Patent Document 2).

JP 2008-58489 A Japanese Patent No. 4131639

  However, the organic EL panel covered with the laminate film has a problem that the heat at the time of light emission tends to be trapped, and the light emission characteristics change due to the influence of heat when used for a long time. Patent Document 2 does not consider the problem of heat dissipation during light emission of the organic EL panel, and does not disclose an appropriate heat dissipation means.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an organic EL device having high mechanical strength and excellent heat dissipation, a method for manufacturing the organic EL device, and an electronic apparatus.

  In order to solve the above-described problems, an organic EL device of the present invention has an organic EL panel on which an organic EL element is formed and a surface that is in close contact with the organic EL panel directly or via an adhesive layer, rather than in the layer thickness direction. A heat dissipating member including a heat dissipating sheet having high heat conductivity in the inward direction, and the organic EL panel and the heat dissipating member are disposed so as to sandwich the organic EL panel and the heat dissipating member either directly or as an adhesive layer. A pair of flexible film sheets, at least one of which is transparent and holds them together, wherein the pair of film sheets exposes part of the heat dissipation member to the outside The organic EL panels are bonded to each other at the peripheral edge of the organic EL panel.

  According to this configuration, the heat dissipation member and the organic EL panel are integrated with a pair of film sheets, and a part of the heat dissipation member is exposed to the outside of the film sheet. Can be provided. In this organic EL device, since the heat dissipation member includes a heat dissipation sheet having higher thermal conductivity in the in-plane direction than the layer thickness direction, the heat generated in the organic EL panel is in the surface direction of the heat dissipation sheet. And is promptly released to the outside of the film sheet. Therefore, the inside of the organic EL panel is not heated to a high temperature, and the light emission characteristics can be maintained substantially constant.

  In the organic EL device of the present invention, the heat radiating member is in close contact with the heat radiating sheet made of a graphite sheet that is in close contact with the organic EL panel directly or through an adhesive layer, and the organic EL panel of the heat radiating sheet. A heat sink made of metal that adheres directly or through an adhesive layer to the surface opposite to the side to be used, and a part of the heat sink is exposed to the outside of the pair of film sheets Is desirable.

  According to this configuration, it is possible to provide a thin heat dissipation member that is thin and has high heat dissipation efficiency by combining a graphite sheet with excellent heat dissipation and a metal heat sink that is inexpensive and easily available, while suppressing manufacturing costs. it can. Moreover, since the part exposed to the exterior of a film sheet is a metal heat sink, durability with respect to a fracture | rupture, abrasion, etc. can also be improved.

  The heat dissipation sheet may be exposed to the outside of the pair of film sheets together with the heat dissipation plate. In this case, the mechanical strength of the heat radiating sheet can be increased by the heat radiating plate, and the heat radiating sheet is less likely to be broken than when only the heat radiating sheet is exposed to the outside.

  In the organic EL device of the present invention, the pair of film sheets hermetically enclose the organic EL panel inside, and the pair of film sheets formed on the end surface of the organic EL panel and the organic EL panel. A sealing resin layer is formed in each of the gap between the pair of film sheets formed on the end surface of the heat dissipation member and the heat dissipation member, and the gap is sealed. desirable.

  According to this configuration, since no gap is formed between the film sheet and the heat radiating member, heat transfer from the heat radiating member to the film sheet is promoted, and heat dissipation from the surface of the film sheet is also improved. In addition, since the periphery of the organic EL panel is double-sealed by the sealing resin layer and the film sheet, the sealing performance of the organic EL panel is also improved. Furthermore, since the film sheet and the heat radiating member are fixed, even if tensile stress or the like is applied to the heat radiating member, there is no occurrence of displacement or peeling between the heat radiating member and the organic EL panel. Therefore, stable heat dissipation can be maintained.

  In the organic EL device of the present invention, the organic EL panel includes a base material, a circuit layer provided on the base material, and the organic EL element provided on the circuit layer, The base material is composed of a glass substrate, and the thickness of the base material is preferably 20 μm or more and 50 μm or less.

  According to this structure, the heat dissipation from an organic electroluminescent panel can be improved by using a thin glass substrate. Further, while using a glass substrate with low moisture permeability, high flexibility equivalent to that of a resin substrate such as a plastic film can be imparted, and a flexible organic EL panel can be provided. In addition, since a glass substrate having high heat resistance is used, peripheral drive circuits such as a scanning line drive circuit can be formed on the base material by, for example, a low-temperature polysilicon technique. It can contribute to performance improvement.

  Here, when the thickness of the base material is thinner than 20 μm, defects called dimples and pits increase, and light emission defects become remarkable. If the thickness exceeds 50 μm, sufficient flexibility cannot be imparted, and various resin layers formed on the substrate, for example, a flattened resin layer covering the organic EL element, are expanded by heat during light emission. However, there is a risk of pressing the driving element that drives the organic EL element. However, when the thickness is 20 μm or more and 50 μm or less, the number of light emission defects is one or less, and excellent light emission characteristics with almost no defects are obtained. In the above thickness, the organic EL panel is sandwiched between a pair of film sheets. It was possible to provide an organic EL device with almost no cracking due to pressure and high yield.

  The manufacturing method of the organic EL device of the present invention includes a heat higher in the in-plane direction than the layer thickness direction, which is in close contact with the organic EL panel on which the organic EL element is formed, directly or via an adhesive layer. A method of manufacturing an organic EL device having a heat radiating member including a heat radiating sheet, wherein the organic EL panel and the heat radiating member are disposed between a pair of transparent film sheets. A first step of inserting a laminate of the pair of film sheets, the organic EL panel, and the heat dissipating member between a pair of pressurizing means; an adhesive agent interposed between the pair of film sheets; In a state where a part of the member is exposed to the outside from between the pair of film sheets, the laminated body is pressurized by the pair of pressing means, and the pair of film sheets is attached to the periphery of the organic EL panel. In it characterized in that it comprises a second step of bonding, the.

  According to this method, the heat dissipation member and the organic EL panel are integrated with a pair of film sheets, and a part of the heat dissipation member is exposed to the outside of the film sheet. Can be provided. In this organic EL device, since the heat dissipation member includes a heat dissipation sheet having higher thermal conductivity in the in-plane direction than the layer thickness direction, the heat generated in the organic EL panel is in the surface direction of the heat dissipation sheet. And is promptly released to the outside of the film sheet. Therefore, the temperature of the organic EL panel is not heated to a high temperature, and the light emission characteristics can be maintained substantially constant.

  In the manufacturing method of the organic EL device of the present invention, in the second step, the laminate is pressed by the pair of pressing means, and the adhesive is used as the pair of film sheets, the organic EL panel, and the heat dissipation member. A portion where the pair of film sheets face each other at a peripheral edge of the organic EL panel, a portion where the heat dissipation member and the film sheet face each other It is desirable that the organic EL panel is sealed inside the pair of film sheets by adhering to each other using the adhesive.

  According to this method, since no gap is formed between the film sheet and the heat radiating member, the movement of heat from the heat radiating member to the film sheet is promoted, and the heat dissipation from the surface of the film sheet is also improved. In addition, since the periphery of the organic EL panel is double-sealed by the sealing resin layer and the film sheet, the sealing performance of the organic EL panel is also improved. Furthermore, since the film sheet and the heat radiating member are fixed, even if tensile stress or the like is applied to the heat radiating member, there is no occurrence of displacement or peeling between the heat radiating member and the organic EL panel. Therefore, stable heat dissipation can be maintained.

  In the manufacturing method of the organic EL device of the present invention, the pair of pressing means is a pair of pressing rollers, and in the first step, the laminated body is exposed to the heat dissipation member of the pair of film sheets. It is desirable to insert into the pair of pressure rollers from the end opposite to the side to be performed.

  According to this method, there is little possibility that air bubbles remain on the surface of the organic EL panel or the end portion of the organic EL panel due to the step between the heat dissipation member and the organic EL panel. Therefore, an organic EL device having excellent display quality and sealing performance can be provided, and heat transfer from the heat radiating member to the film sheet is not hindered by the remaining air bubbles. Will also improve.

  In the manufacturing method of the organic EL device of the present invention, the adhesive is a thermoplastic adhesive, and the adhesive faces the mutually opposing surfaces of the pair of film sheets and the film sheet of the heat dissipation member. It is desirable that each of the surfaces to be formed is formed.

  According to this method, since it can manufacture using a normal laminating apparatus, development of a new manufacturing apparatus becomes unnecessary.

  An electronic apparatus according to the present invention includes the above-described organic EL device according to the present invention.

  According to this configuration, an electronic device having high mechanical strength and excellent heat dissipation can be provided.

1 is an exploded perspective view of an organic EL device according to a first embodiment of the present invention. It is sectional drawing which shows schematic structure of a thermal radiation sheet. It is a top view of an organic EL device. It is sectional drawing which follows the AA 'line of FIG. It is sectional drawing of the organic electroluminescent apparatus which shows the detailed structure of an organic electroluminescent panel. It is explanatory drawing of the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing of the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing of the manufacturing method of an organic electroluminescent apparatus. It is explanatory drawing of the manufacturing method of an organic electroluminescent apparatus. It is a disassembled perspective view of the organic electroluminescent apparatus which concerns on 2nd Embodiment of this invention. It is an Example which shows the time-dependent change of the temperature of the display area at the time of light emission. It is an Example which shows the temperature distribution of the display area at the time of light emission. It is a schematic block diagram of the book type display which is an example of the electronic device of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. Such an embodiment shows one aspect of the present invention and does not limit the present invention. In the following embodiments, various shapes, combinations, and the like of the constituent members are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

  In the following description, an XYZ orthogonal coordinate system is set and the positional relationship of each member will be described. At this time, the predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. And In this embodiment, the X-axis direction is the scanning line extending direction, the Y-axis direction is the data line extending direction, and the Z-axis direction is the viewing direction of the organic EL panel by the observer.

[First Embodiment]
FIG. 1 is an exploded perspective view of an organic EL device 1 according to the first embodiment of the present invention. The organic EL device 1 includes an organic EL panel 2, a wiring substrate 3 (wiring substrates 3A, 3B, 3C) connected to the end of the organic EL panel 2, and a back surface of the organic EL panel 2 (the side opposite to the observation side) ) Disposed in the heat dissipation member 5 (heat dissipation sheet 51, heat dissipation plate 52), the organic EL panel 2, the wiring substrate 3, and the heat dissipation member 5. Sheet member 4A and second flexible sheet member 4B). It should be noted that the organic EL device 1 is provided with a frame and other accessory devices as necessary, but these are not shown in FIG.

  The organic EL panel 2 includes a first substrate 10 and a second substrate 20 that face each other. A sealing material 30 having a rectangular frame shape in plan view is provided on the peripheral edge of the facing region where the first substrate 10 and the second substrate 20 face each other. The first substrate 10 and the second substrate 20 are bonded to each other by a sealing material 30. A sealing resin is sealed in a space (cell gap) surrounded by the first substrate 10, the second substrate 20, and the sealing material 30.

  A display area Ad is provided inside the sealing material 30. In the display area Ad, a plurality of scanning lines 12 extending in the X-axis direction and a plurality of data lines 11 extending in the Y-axis direction are provided in a lattice shape in plan view. Sub-pixels corresponding to any one of red, green, and blue are provided at the intersections between the scanning lines 12 and the data lines 11. An organic EL element is formed in each sub-pixel, and emits one of red, green, and blue light. Such subpixels are arranged in a matrix on the first substrate 10, and a display region Ad is formed by the plurality of subpixels. Each sub-pixel is provided with a pixel switching element (driving element) such as a TFT (Thin Film Transistor), which is not shown in FIG.

  Scanning line drive circuits 13A and 13B are provided between the display area Ad and the sealing material 30. One scanning line drive circuit 13A, 13B is provided on each side of the display area Ad in the X direction. The scanning line driving circuits 13A and 13B are formed along the Y direction, and a plurality of scanning lines 12 extending from the display area Ad in the X direction are driven for either one of the left and right scanning lines. It is connected to either of the circuits 13A and 13B. The scanning line drive circuits 13A and 13B are integrally formed on the first substrate 10 together with the pixel switching elements provided in the display area Ad using the low temperature polysilicon technology.

  The first substrate 10 is provided with an overhang portion 10 c that protrudes to the outside of the second substrate 20. The overhanging portion 10c is provided with a plurality of terminal portions 19A, 19B, 19C each consisting of a plurality of external terminals. Of the terminal portions 19A, 19B, 19C, the terminal portion 19A provided at the center portion of the overhang portion 10c includes a plurality of external terminals each connected to the data line 11, and the terminal portions 19B provided on the left and right sides thereof. , 19C each include a plurality of external terminals connected to one of the pair of scanning line driving circuits 13A, 13B.

  One of a plurality of wiring boards 3A, 3B, 3C is connected to each of the terminal portions 19A, 19B, 19C via adhesives 7A, 7B, 7C. A semiconductor chip 6 which is a data line driving circuit is mounted on the wiring board 3A connected to the terminal portion 19A. As the adhesives 7A, 7B, and 7C, conductive adhesives such as ACF (Anisotropic Conductive Film) are used, but the external terminals of the wiring boards 3A, 3B, and 3C and the terminal portions 19A, 19B, In the case where one or both of the 19C external terminals are formed in a projecting shape and are brought into direct contact with each other for conduction, an insulating adhesive such as NCF (Non-Conductive Film) can be used. . As the protruding terminal, a bump electrode in which the surface of the resin core formed in a protruding shape is covered with a conductive film as described in JP-A-2006-196570 can be suitably used.

  In the case where NCF is used, if a translucent NCF is used, the wiring board 3A, 3B, 3C can be aligned with the external terminals of the terminal portions 19A, 19B, 19C. Since the planar overlap between the external terminals of 3A, 3B, and 3C and the external terminals of the terminal portions 19A, 19B, and 19C can be directly confirmed, alignment is facilitated and accuracy can be improved.

  On the back side of the organic EL panel 2 (on the side opposite to the side where the second substrate 20 of the first substrate 10 is disposed), a heat radiation sheet 51 including a high thermal conductivity member such as graphite, and a metal such as aluminum A heat radiating member 5 in which the heat radiating plate 52 is laminated in order from the organic EL panel 2 side is provided.

  The heat radiation sheet 51 has higher thermal conductivity in the in-plane direction (XY plane direction) than in the layer thickness direction (Z direction). For example, a graphite sheet using highly oriented graphite in which the layered structure of graphite is stacked on a macroscopic scale is suitable. As such a heat radiating sheet, those disclosed in Japanese Patent Application Laid-Open Nos. 58-147087, 60-012747, 07-109171, and 3948000 can be used. In particular, PGS graphite sheet (trade name) manufactured by Panasonic Corporation has a high thermal conductivity of 2 to 4 times that of copper (Cu) and 3 to 6 times that of aluminum (Al). Since it has such flexibility (flexibility), it is suitable as the heat dissipation sheet 51 of this embodiment.

  The heat dissipating sheet 51 is provided at a position that overlaps at least the display area Ad, and is desirably provided at a position including peripheral driving circuits such as the scanning line driving circuits 13A and 13B. In this way, heat generated from the display area Ad and the peripheral drive circuit can be efficiently released to the outside. In the present embodiment, the heat radiation sheet 51 covers the display area Ad and the formation area of the scanning line drive circuits 13A and 13B, and is formed with a larger area than the first substrate 10.

  The heat sink 52 is a metal plate having high thermal conductivity made of a metal such as copper or aluminum or an alloy thereof. Although the thermal conductivity in the in-plane direction is smaller than that of the graphite sheet, it is inexpensive and easy to process, so that a heat sink with flexibility can be provided. In the present embodiment, phosphor bronze is used as the heat radiating plate 52, and the flexibility and shape restoring property (spring property) are given by reducing the thickness to about 50 μm.

  The heat radiating plate 52 is provided at least at a position overlapping with the display area Ad, and a part of the heat radiating plate 52 projects outside the projecting portion 10 c of the first substrate 10. The heat radiating plate 52 is desirably provided at a position including peripheral driving circuits such as the scanning line driving circuits 13A and 13B. In this way, heat generated from the display area Ad and the peripheral drive circuit can be efficiently released to the outside. In the present embodiment, the display area Ad and the formation area of the scanning line drive circuits 13A and 13B are covered, and the area is larger than that of the first substrate 10.

  FIG. 2 is a schematic diagram illustrating an example of a cross-sectional structure of the heat dissipation sheet 51. The heat radiating sheet 51 includes a PET separator, a double-sided tape 30 μm (adhesive 13 μm / PET film 4 μm / adhesive 13 μm), a graphite sheet 70 μm, a double-sided tape 10 μm (adhesive 3 μm / PET film 4 μm / adhesive 3 μm), A tacky sheet 53 μm (PET film 38 μm / adhesive resin 15 μm) and a PET separator are laminated in order. When using, after removing one PET separator and closely adhering to the organic EL panel via the adhesive, the other PET separator is removed and closely adhering to the heat sink 52 via the adhesive.

  Returning to FIG. 1, on the outer surface side of the organic EL panel 2, a flexible sealing body 4 that is in close contact with the organic EL panel 2 and encloses the organic EL panel 2 inside is provided. The sealing body 4 includes a pair of first flexible sheet member 4A and second flexible sheet member 4B disposed so as to sandwich the organic EL panel 2, the wiring boards 3A, 3B, 3C, and the heat dissipation member 5. I have. Of the pair of first flexible sheet member 4A and second flexible sheet member 4B, at least the first flexible sheet member 4A arranged on the observation side is made of a transparent material.

  The first flexible sheet member 4A and the second flexible sheet member 4B are configured by flexible film sheets 41A and 41B in which adhesive layers 42A and 42B are formed on one surface side. As the resin constituting the adhesive layers 42A and 42B, various materials such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin can be used. In this embodiment, a thermoplastic resin is used. . A film sheet provided with an adhesive layer made of a thermoplastic resin is generally called a laminate film.

  The first flexible sheet member 4 </ b> A and the second flexible sheet member 4 </ b> B are each formed with a larger area than the organic EL panel 2. The first flexible sheet member 4A and the second flexible sheet member 4B are connected to the end portions (semiconductor chip 6) of the wiring boards 3A, 3B, 3C opposite to the side connected to the terminal portions 19A, 19B, 19C. 42A and the adhesive layer 42A on the outer peripheral portion of the organic EL panel 2 in a state in which the portion protruding to the outside of the protruding portion 10c of the heat radiating member 5 is exposed to the outside. 42B is adhered to each other.

  Also, the front and back surfaces of the wiring boards 3A, 3B, 3C and the heat dissipating member 5 located at the peripheral edge of the organic EL panel 2, that is, the first flexible sheet member 4A and the second flexible sheet member 4B of each member, Adhesive layers 5A, 5B, 8A, 8B, 8C, 9A, 9B, and 9C are provided on the opposing surfaces, respectively. Then, using the adhesive layers 8A, 8B, 8C provided on the wiring boards 3A, 3B, 3C and the adhesive layer 42A provided on the first flexible sheet member 4A, the first flexibility is provided. The sheet member 4A and the wiring boards 3A, 3B, 3C are bonded to each other, and an adhesive layer 5A provided on the heat dissipation member 5 and an adhesive layer 42A provided on the first flexible sheet member 4A are used. The first flexible sheet member 4A and the heat radiating member 5 are bonded to each other, an adhesive layer 5B provided on the heat radiating member 5, and an adhesive layer 42B provided on the second flexible sheet member 4B. , The second flexible sheet member 4B and the heat radiating member 5 are bonded to each other, and the adhesive layers 9A, 9B, 9C provided on the wiring boards 3A, 3B, 3C and the heat radiating member 5 are provided. The wiring board 3A, 3B, 3C and the heat radiating part using the adhesive layer 5A 5 and are bonded to each other. For the adhesive layers 5A, 5B, 8A, 8B, 8C, 9A, 9B, and 9C, various materials such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin can be used. A plastic resin or a thermosetting resin is used.

  3 is a plan view of the organic EL device 1 viewed from the first flexible sheet member 4A side, and FIG. 3B is a plan view of the organic EL device 1 viewed from the second flexible sheet member 4B side. .

  As shown in FIG. 3 (a), the first flexible sheet member 4A (adhesive layer 42A) and the second flexible sheet member are disposed on the periphery of the organic EL panel 2 when viewed from the first flexible sheet member 4A side. Adhesive part 71 with flexible sheet member 4B (adhesive layer 42B), first flexible sheet member 4A (adhesive layer 42A) and wiring boards 3A, 3B, 3C (adhesive layers 8A, 8B, 8C) And an adhesive portion 73 between the first flexible sheet member 4A, the second flexible sheet member 4B (adhesive layer 42A), and the heat dissipation member 5 (adhesive layer 5A). It is continuously formed with no gap along the four sides constituting the outer periphery of the panel 2. Further, although hidden behind the wiring boards 3A, 3B, and 3C, the wiring boards 3A, 3B, and 3C (adhesive layers 9A, 9B, and 9C) and the heat dissipation member 5 (adhesive layer) are overlapped with the bonding portion 72. 5A) is provided, and the adhesive portions 71, 73, 74 are continuously formed along the four sides constituting the outer periphery of the organic EL panel 2 without a gap.

  Further, as shown in FIG. 3B, the second flexible sheet member 4B (adhesive layer 42B) and the heat radiation are disposed on the peripheral edge of the organic EL panel 2 when viewed from the second flexible sheet member 4B side. An adhesion portion 75 with the member 5 (adhesive layer 5B) is provided, and the adhesion portions 71 and 75 are continuously formed without gaps along the four sides constituting the outer periphery of the organic EL panel 2.

  Further, a third sealing resin layer 43 is sealed in a space surrounded by the adhesive portions 71, 72, 73, 74, 75 and the sealing material 30, and the space is sealed.

  With such a configuration, the organic EL panel 2 is hermetically sealed inside the pair of first flexible sheet member 4A and second flexible sheet member 4B, that is, inside the sealing body 4.

  In FIG. 3, the heat radiating sheet 51 is formed with a smaller area than the first flexible sheet member 4A and the second flexible sheet member 4B, and only the heat radiating plate 52 is provided on the right side of the flexible sheet portion seats 4A and 4B. Although it is assumed that it is exposed to the outside, the configuration of the heat radiating member 5 is not limited to this, and both the heat radiating sheet 51 and the heat radiating plate 52 are connected to the first flexible sheet member 4A and the second flexible sheet. You may expose to the exterior of the sheet | seat member 4B.

  4 is a cross-sectional view taken along the line AA ′ of FIG. The first flexible sheet member 4A and the second flexible sheet member 4B are in close contact with the main surface of the second substrate 20 of the organic EL panel 2 and the main surface of the heat dissipation member 5 (specifically, the heat dissipation plate 52). Are arranged. The first flexible sheet member 4A and the second flexible sheet member 4B are curved at the ends of the organic EL panel 2 and the heat radiating member 5, and directly or directly on the wiring board 3A and / or the heat radiating member 5 (specifically, the heat radiating plate). 52). The portion where the first flexible sheet member 4A and the second flexible sheet member 4B are in close contact with each other is bonded by the adhesive layer 42A and the adhesive layer 42B, and the first flexible sheet member 4A and the wiring board 3A. The part where the second flexible sheet member 4B and the heat dissipating member 5 are in close contact with each other is the adhesive layer 42B and the adhesive layer 5B. The portion where the wiring board 3A and the heat dissipation member 5 are in close contact with each other is bonded by the adhesive layer 9A and the adhesive layer 5A.

  The end of the organic EL panel 2 is caused by the step between the organic EL panel 2 and the wiring board 3A, the step between the organic EL panel 2 and the heat dissipation member 5, and the shape of the end. A gap 4H1 is formed. A first sealing resin layer 43 is provided in the gap 4H1. The first sealing resin layer 43 covers the end surface of the first substrate 10, the end surface of the second substrate 20, and the end surface of the sealing material 30 so as to surround the entire outer periphery of the first substrate 10 and the second substrate 20. Is provided.

  Further, a gap 4 </ b> H <b> 2 generated due to a step between the heat dissipation member 5 and the organic EL panel 2 is formed between the wiring board 3 </ b> A and the heat dissipation member 5. A fourth sealing resin layer 45 is provided in the gap 4H2. The fourth sealing resin layer 45 covers the end surface of the first substrate 10 and is provided in the entire width direction (X direction) of the wiring substrate 3 </ b> A without any gap.

  The first sealing resin layer 43 and the fourth sealing resin layer 45 are provided on the outer peripheral portion of the organic EL panel 2 so as to fill the gaps 4H1 and 4H2. The ends are sealed by the first flexible sheet member 4A, the second flexible sheet member 4B, the wiring board 3A, and the sealing resin layers 43 and 45.

  Moreover, the 2nd sealing resin layer 44 is provided in the end surface of 4 A of 1st flexible sheet members, and the 2nd flexible sheet member 4B covering the boundary part of both. The second sealing resin layer 44 includes a boundary portion between the first flexible sheet member 4A and the second flexible sheet member 4B, and the first flexible sheet member 4A and the second flexible sheet member 4B. Covering each boundary portion with the wiring board 3 </ b> A, it is provided so as to surround the entire outer periphery of the sealing body 4. The first sealing resin layer 43, the fourth sealing resin layer 45, the first flexible sheet member 4A, the second flexible sheet member 4B, and the wiring board 3A cooperate to realize high sealing performance. doing.

  The sealing resin layers 43 and 44 are formed, for example, by softening the adhesive layers 42A and 42B when the pair of first flexible sheet member 4A and second flexible sheet member 4B are heat-pressed. The film thickness of the adhesive layers 42A and 42B is set as described above, or the gap 4H and the end surfaces of the first flexible sheet member 4A and the second flexible sheet member 4B are positively filled with sealing resin. May be. For example, when the organic EL panel 2 is sandwiched between the first flexible sheet member 4A and the second flexible sheet member 4B, a sealing resin is disposed at the end of the organic EL panel 2, and the pair of first flexible sheet members 4A and the second flexible sheet member 4B spread the sealing resin so that the end of the organic EL panel 2 and the first flexible sheet member 4A and the second flexible sheet member 4B The sealing resin layer can be disposed at the boundary without a gap.

  FIG. 5 is a cross-sectional view showing a detailed configuration of the organic EL device 1. In the organic EL panel 2, the first substrate 10 and the second substrate 20 are arranged to face each other, and the first substrate 10 and the second substrate 20 are bonded and integrated through an adhesive layer 36.

  A plurality of organic EL elements 60 are formed on the first substrate 10. The organic EL element 60 has a configuration in which, for example, an organic light emitting layer 17 that generates white light is sandwiched between a first electrode 16 as an anode (pixel electrode) and a second electrode 18 as a cathode (common electrode). A thin film sealing layer 66 is formed on the first substrate 10 so as to cover the plurality of organic EL elements 60.

  The organic EL elements 60 are regularly arranged in a matrix on the first substrate 10 to form a display area Ad. The area outside the display area L is a non-display area. In addition, the organic EL element 60 uses three types of organic materials of R (red), G (green), and B (blue) separately, for example, an organic EL element that generates red light, and green light. An organic EL element that generates blue light or an organic EL element that generates blue light may be used.

  The first substrate 10 includes a first base material 10A. As the first base material 10A, an insulating substrate such as a glass substrate or a plastic substrate, or a conductive substrate such as a stainless steel plate or an aluminum plate can be used. The first base material 10A is given flexibility by reducing the thickness.

  In the present embodiment, an organic EL panel with a built-in peripheral drive circuit is manufactured using low-temperature polysilicon technology, and therefore a glass substrate having high heat resistance is used as the first base material 10A. In this case, the thickness of the first substrate 10A is 10 μm or more and 100 μm or less, preferably 20 μm or more and 50 μm or less, more preferably 20 μm or more and 40 μm or less.

  For example, when the thickness of the first base material 10A is thinner than 20 μm, defects called dimples and pits increase and light emission defects become remarkable.

  Further, when the thickness is greater than 50 μm, sufficient flexibility cannot be imparted to the first base material 10A, and various resin layers formed on the first base material 10A, for example, an organic buffer layer that covers the organic EL element 60 68 and the third sealing resin layer 35 filled between the second substrate 20 and the like may expand due to heat generated during light emission and press the pixel switching element 15 that drives the organic EL element 60. .

  When a glass substrate thinner than 50 μm is used, the pressure applied to the pixel switching element 15 can be relaxed by bending the glass substrate. However, when the flexibility of the glass substrate is reduced, such an effect is obtained. It may be difficult to obtain, and the drive element may be destroyed or the electrical characteristics of the drive element may be deteriorated. In particular, since the organic EL panel 2 covered with the first flexible sheet member 4A and the second flexible sheet member 4B is likely to accumulate heat during light emission, special consideration is given compared to a normal organic EL panel. Necessary.

  The applicant examined the relationship between the thickness of the glass substrate and the number of occurrences of light emitting defects in view of the particularity when the first flexible sheet member 4A and the second flexible sheet member 4B are used. . It was revealed that particularly good mechanical strength and electrical characteristics can be obtained when the thickness of the glass substrate is 20 μm or more and 50 μm or less.

  That is, when the thickness of the glass substrate is less than 20 μm, light emission defects due to the influence of dimples and the like increase, and when it exceeds 50 μm, the pixel switching element 15 such as a TFT is damaged or the electrical characteristics are deteriorated. When the thickness was 20 μm or more and 50 μm or less, the number of light emitting defects was 1 or less, and excellent light emitting characteristics with almost no defects were obtained. In the above thickness, the organic EL panel 2 is hardly cracked by the pressure when the organic EL panel 2 is sandwiched between the pair of first flexible sheet member 4A and second flexible sheet member 4B, and the organic EL panel has a high yield. Device 1 could be provided.

  As described above, by using a glass substrate having a thickness of 20 μm or more and 50 μm or less, the influence of heat during light emission as in the case where the first flexible sheet member 4A and the second flexible sheet member 4B are used. Even in the organic EL device 1 in which the above becomes remarkable, good mechanical strength and excellent electrical characteristics can be obtained.

A circuit layer 64 composed of the inorganic insulating layer 14 and the resin flattening layer 63 is formed on the first base material 10A. The inorganic insulating layer 14 is formed of a silicon compound such as silicon oxide (SiO ₂ ) or silicon nitride (SiN). On the inorganic insulating layer 14, a pixel switching element 15 composed of a plurality of thin film transistors (TFTs) corresponding to the plurality of organic EL elements 60 on a one-to-one basis, and a second electrode 18 connected to the second electrode 18 of the organic EL element 60. An electrode connection wiring 18A is formed. Further, the scanning line 12, the data line 12, the scanning line drive circuits 13A and 13B shown in FIG. 1, the power supply line for supplying current to the first electrode 16, and the like are also formed in this layer.

  On the inorganic insulating layer 14, a resin flattening layer 63 in which a metal reflective layer 62 made of an Al (aluminum) alloy or the like is provided is formed. The resin flattening layer 63 is formed of an insulating resin material such as a photosensitive acrylic resin or a cyclic olefin resin.

  A first electrode 16 (pixel electrode) of the organic EL element 60 is formed in a region overlapping the metal reflective layer 62 on the resin flattening layer 63 in a plane. The first electrode 16 is formed of a metal oxide such as ITO (Indium Tin Oxide) having a high hole injection property. The first electrode 16 is connected to the pixel switching element 15 on the first base material 10 </ b> A via a contact hole (not shown) that penetrates the resin planarization layer 63 and the inorganic insulating layer 14.

  An insulating partition layer 61 made of, for example, acrylic resin is formed on the resin flattening layer 63 (on the circuit layer 64) in order to partition the organic EL element 60. The partition wall layer 61 has a plurality of openings 61 </ b> H that expose the top of the first electrode 16.

  The organic light emitting layer 17 is formed so as to cover the upper surface of the partition layer 61 and the first electrode 16 along the uneven shape formed by the opening 61H and the partition layer 61.

  The organic light emitting layer 17 includes a light emitting layer that emits light when excited by recombination of holes and electrons injected by an electric field. The organic light emitting layer 17 may have a multilayer structure including layers other than the light emitting layer. As a layer other than the light emitting layer, a hole injection layer for facilitating injection of holes, a hole transport layer for facilitating transport of injected holes to the light emitting layer, and for facilitating injection of electrons. Examples include an electron injection layer and a layer that contributes to the recombination, such as an electron transport layer for easily transporting injected electrons to the light emitting layer.

  Examples of the light emitting layer of the organic light emitting layer 17 include a low molecular weight organic EL material or a high molecular weight organic EL material.

  The low molecular weight organic EL material has a relatively low molecular weight among organic compounds that emit light by being excited by recombination of holes and electrons. The high molecular weight organic EL material has a relatively high molecular weight among organic compounds that emit light when excited by recombination of holes and electrons.

  These low molecular weight organic EL materials or high molecular weight organic EL materials are substances corresponding to the color light (white light) emitted by the organic EL element 60. The material of the layer contributing to recombination in the light emitting layer is a substance corresponding to the material of the layer in contact with this layer.

  On the organic light emitting layer 17, the 2nd electrode 18 is formed so that the organic light emitting layer 17 may be covered along the uneven | corrugated shape. The second electrode 18 includes, for example, an electron injection buffer layer for facilitating injection of electrons into the organic light emitting layer 17 and a conductive layer having a low electrical resistance formed on the electron injection buffer layer.

  The electron injection buffer layer is made of, for example, LiF (lithium fluoride), Ca (calcium), or MgAg (magnesium-silver alloy). In addition, the conductive layer is a conductive layer with a small electrical resistance formed of a metal such as ITO or Al. The conductive layer may not be formed on the entire surface of the display region Ad. For example, a first conductive layer having a high transparency made of an alloy of Mg and Ag is formed on the entire surface of the display region Ad, and the low conductive layer made of Al or the like is formed. A second conductive layer having low resistance and low transparency may be formed in a stripe shape on the portion overlapping with the partition wall layer 61 as an auxiliary electrode.

  The second electrode 18 is connected to the second electrode connection wiring 18 </ b> A made of an inorganic conductive film such as Al formed in the peripheral portion (non-display region) of the display region Ad. The second electrode connection wiring 18A is connected to the terminal portions 19B and 19C (see FIG. 1) via a routing wiring (not shown). The second electrode connection wiring 18A is continuously formed along the three sides of the rectangular display area Ad (side where the terminal portion 19A shown in FIG. 1 is not formed).

  The second electrode 17 is connected to the second electrode connection wiring 12 that covers the entire surface of the display area Ad and surrounds the display area Ad. The second electrode 17 is a part of the partition wall layer 61 that forms the outermost periphery, that is, a part that surrounds the outer side of the organic light emitting layer 17 at the outermost peripheral position (hereinafter also referred to as an enclosing member). The second electrode 18 is formed on the outside of the plurality of organic EL elements 60 provided in the display area Ad together with the surrounding member. It is sealed. In particular, since the organic EL element 60 is formed on the inorganic insulating layer 14 and the outer peripheral portion of the second electrode 18 is in contact with the inorganic insulating layer 14, all of the bottom surface, top surface, and side surfaces of the plurality of organic EL elements 60. Is covered with an inorganic film, and high sealing performance is realized.

  A thin film sealing layer 66 that covers the inorganic insulating layer 14, the resin flattening layer 63, and the second electrode 18 of the organic EL element 60 is formed on the second electrode 18. The thin film sealing layer 66 covers the entire portion of the second electrode 17 exposed on the circuit layer 64 and is in contact with the inorganic insulating layer 14, and a portion formed in at least the display region Ad of the electrode protective layer 67. An organic buffer layer (flattening resin layer) 68 that covers the organic buffer layer 68 and an inorganic gas barrier layer 69 that covers the entire portion of the organic buffer layer 68 exposed on the circuit layer 64 and is in contact with the electrode protective layer 67 or the inorganic insulating layer 14. ing.

  The electrode protective layer 67 is made of a non-base material, for example, a silicon compound such as silicon oxynitride (SiON).

  The organic buffer layer 68 is formed so as to fill the uneven shape formed by the partition wall layer 61 and the opening 61H, and the unevenness on the circuit layer 64 is flattened. Further, it is in close contact with the inorganic gas barrier layer 69 and has a buffering function against mechanical impact. As a material constituting the organic buffer layer 68, for example, a highly transparent resin with low moisture permeability such as an epoxy compound can be used.

  The inorganic gas barrier layer 69 is formed of a non-base material, in particular, for example, SiON in consideration of translucency, gas barrier properties, and water resistance.

  The thin film sealing layer 66 functions together with the second electrode 17 as a sealing member for preventing moisture and oxygen from entering the organic EL element from the outside. Of the thin-film sealing layer 66, the inorganic gas barrier layer 69 is formed on a surface flattened by the organic buffer layer 67, and has better step coverage than the electrode protective layer 67, and a high sealing function is obtained. In particular, since the mechanical shock is relieved by the organic buffer layer 68, cracks and the like are hardly generated, and excellent sealing performance can be maintained over a long period of time.

  In addition, since the inorganic gas barrier layer 69 is in contact with the inorganic insulating layer 14 directly or through the electrode protective layer 67 that is an inorganic film, moisture and oxygen enter from the interface between the inorganic gas barrier layer 69 and the inorganic insulating layer 14. There is little concern. Therefore, extremely high sealing performance can be realized in cooperation with the second electrode 17 that is also formed in contact with the inorganic insulating layer 14.

  The second substrate 20 is disposed on the surface of the first substrate 10 on which the thin film sealing layer 66 is formed. The second substrate 20 is bonded to the thin film sealing layer 66 on the first substrate 10 via the adhesive layer 36.

  The second substrate 20 includes a second base material 20A made of a light transmissive material such as a transparent glass substrate or a transparent plastic substrate. In the present embodiment, in order to improve the sealing performance by the second substrate 20, a glass substrate having a lower moisture permeability than a plastic substrate is used, and the flexibility is given by thinning the glass substrate. In this case, the thickness of the second substrate 20A is 10 μm or more and 100 μm or less, preferably 20 μm or more and 50 μm or less, and more preferably 20 μm or more and 40 μm or less.

  A color filter layer 21 is formed on the surface of the second substrate 20A facing the first substrate 10. The color filter layer 21 has a configuration in which the red coloring layer 22R, the green coloring layer 22G, and the blue coloring layer 22B are regularly arranged in a matrix corresponding to the red subpixel, the green subpixel, and the blue subpixel, respectively. . In addition, the color filter layer 21 includes a black matrix layer (light-shielding layer) 23 in a region surrounding each colored layer 22R, 22G, and 22B, more specifically in a region corresponding to the partition wall layer 61. As a material constituting the black matrix layer 23, for example, Cr (chromium) or the like can be used.

  The colored layers 22R, 22G, and 22B are disposed so as to overlap the white organic light emitting layer 17 formed on the first electrode 16 in a planar manner. Thereby, the light emitted from the plurality of organic light emitting layers 17 passes through the corresponding colored layers 22R, 22G, and 22B, and is emitted to the viewer side as each color light of red light, green light, and blue light. It is like that.

  The color filter layer 21 includes an overcoat layer 24 that covers the colored layers 22R, 22G, and 22B and the black matrix layer 23, and an inorganic gas barrier layer 25 that covers the overcoat layer 24.

  The overcoat layer 24 extends from the inside of the display area Ad to the vicinity of the formation area of the sealing material 30 around the non-display area. The overcoat layer 24 is formed of a resin material such as acrylic or polyimide. The inorganic gas barrier layer 25 is formed of a non-base material, for example, a silicon compound such as silicon oxynitride (SiON).

  The adhesive layer 36 includes a sealing material 30 that is formed in a frame shape along the outer periphery of the second substrate 20, and a third sealing resin layer 35 that is filled in a region within the frame of the sealing material 30 without a gap. ing.

  The third sealing resin layer 35 is provided between the first substrate 10 and the second substrate 20 and covers at least a portion of the thin film sealing layer 66 corresponding to the display region Ad. As a material of the third sealing resin layer 35, for example, a low-elasticity resin in which an isocyanate is added as a curing agent to a urethane resin or an acrylic resin can be used.

  The sealing material 30 is provided in the non-display area so as to surround the third sealing resin layer 35 between the first substrate 10 and the second substrate 20. As the material of the sealing material 30, a material having a low moisture permeability, for example, a highly adhesive adhesive in which an acid anhydride is added as a curing agent to an epoxy resin and a silane coupling agent is added as an accelerator is used. it can.

  On the outer surface of the first base material 10, a heat dissipation sheet 51 and a heat dissipation plate 52 are arranged in close contact with each other in order from the first base material 10A side. Further, the second flexible sheet member 4B and the first flexible sheet member 4A are in close contact with the outer surfaces of the heat sink 52 and the second base material 20A, respectively.

  6-9 is explanatory drawing of the manufacturing method of the organic electroluminescent apparatus 1. FIG. 6 to 9, in the manufacturing method of the organic EL device 1, the organic EL panel 2, the wiring boards 3 </ b> A, 3 </ b> B, 3 </ b> C and the heat radiating member 5 are combined with the first flexible sheet member 4 </ b> A and the second flexible sheet. The process of integrating with the member 4B will be mainly described. The following description will be given with reference to FIG.

  First, as shown in FIG. 6, the wiring substrates 3A, 3B, 3C are connected to the end portions of the organic EL panel 2 which is made flexible by thinning the glass substrate, and the organic EL panel 2 and the wiring substrates 3A, 3B are connected. , 3C and the heat dissipation member 5 are disposed between the first flexible sheet member 4A and the second flexible sheet member 4B. As a method for producing the organic EL panel 2 using a thin glass substrate, known methods described in Patent Documents 1 and 2 can be used.

  Next, as shown in FIG. 7, the laminate is arranged in the Y positive direction side (the end of the organic EL panel 2 opposite to the side to which the wiring boards 3A, 3B, 3C are connected, and the heat radiating member 5 The first flexible sheet member 4A and the second flexible sheet member 4B are inserted between the pair of pressure rollers 81 and 82 from the end opposite to the side exposed to the outside. The adhesive layers 42A and 42B, the adhesive layers 8A, 8B, 8C, 9A, 9B, and 9C and the adhesive are formed on the mutually opposing surfaces of the first flexible sheet member 4A and the second flexible sheet member 4B. With the layers 5A and 5B interposed, a part of the wiring boards 3A, 3B, and 3C (the end opposite to the side connected to the terminal parts 19A, 19B, and 19C) and a part of the heat radiation member 5 (the overhanging part 10c) While the laminated body is heated by the pair of pressure rollers 81 and 82 in a state where the portion projecting outward from the first flexible sheet member 4A and the second flexible sheet member 4B is exposed to the outside. Pressurize.

  Then, the adhesive layers 42A, 42B and the adhesive layers 8A, 8B, 8C, 9A, 9B, 9C are used as the first flexible sheet member 4A, the second flexible sheet member 4B, the organic EL panel 2, and the wiring board 3A. , 3B, and 3C, the gap 4H1 is pushed and expanded to seal the gap 4H1, and at the periphery of the organic EL panel 2, the first flexible sheet member 4A and the second flexible sheet are sealed. A portion facing the member 4B, a portion facing the first flexible sheet member 4A and the wiring boards 3A, 3B, and 3C, and a portion facing the second flexible sheet member 4B and the heat dissipation member 5. The portions where the wiring boards 3A, 3B, 3C and the heat dissipating member 5 are opposed to the adhesive layers 42A, 42B, the adhesive layers 8A, 8B, 8C, 9A, 9B, 9C, and the adhesive layers 5A, 5B. And bonding the organic EL panel 2 to the first flexible sheet portion 4A, seals the interior of the second flexible sheet member 4B.

  In this step, a part of the adhesive layers 42A and 42B and the adhesive layers 8A, 8B, 8C, 9A, 9B, and 9C are external to the first flexible sheet member 4A and the second flexible sheet member 4B. A second sealing resin layer 44 that seals the boundary between the first flexible sheet member 4A and the second flexible sheet member 4B is formed on the end surfaces of the first flexible sheet member 4A and the second flexible sheet member 4B.

  8A and 8B, the first flexible sheet member 4A and the second flexible sheet member 4B are advanced along the conveying direction of the pressure rollers 81 and 82, and the first flexible sheet member 4A and the second flexible sheet member 4B are advanced. It is a figure which shows the state which adhere | attached to the edge part by the side of the wiring board 3A, 3B, 3C of the adhesive sheet member 4B. In this state, the peripheral portion of the organic EL panel 2 includes the first flexible sheet member 4A, the second flexible sheet member 4B, the wiring boards 3A, 3B, 3C, the adhesive layers 42A, 42B, and the adhesive layer 8A. , 8B, 8C, 9A, 9B, 9C and the adhesive layers 5A, 5B are hermetically sealed inside the pair of first flexible sheet member 4A and second flexible sheet member 4B. Further, a part of the adhesive layers 42A and 42B and the adhesive layers 8A, 8B, 8C, 9A, 9B, and 9C flows, and the first and second flexible sheet members 4A and 4B and the organic EL. By filling the gap between the panel 2 and the periphery of the organic EL panel 2 is sealed.

  Thus, the organic EL device 1 is completed. When the sealing step shown in FIGS. 7 and 8 is completed, as shown in FIG. 9, the pressure roller is rotated in the reverse direction, and the organic EL device 1 is taken out in the direction opposite to the loading direction.

  In the above manufacturing method, the pair of pressure rollers 81 and 82 is used as the pair of pressure means for pressing the laminated body. However, the pressure means is not limited to this, and various types of pressure can be applied. Pressure means can be used. For example, flat pressure members may be arranged on both sides of the laminate, and the laminate may be pressed between them. Further, the pressure applied while being heated by the pressure rollers 81 and 82 is a thermoplastic or thermosetting adhesive as the adhesive layers 42A, 42B, 8A, 8B, 8C, 9A, 9B, 9C, 5A, 5B. However, when UV curable adhesive layers are used as the adhesive layers 42A, 42B, 8A, 8B, 8C, 9A, 9B, 9C, 5A, 5B, no heat treatment is required. .

  Furthermore, in the manufacturing method described above, the adhesive layers 42A, 42B, 8A, 8B, 8C, 9A, 9B, 9C, 5A, and 5B are preliminarily formed into the film sheets 41A and 41B, the wiring boards 3A, 3B, and 3C, and the heat radiating member 5. However, the film sheets 41A and 41B may be bonded together while applying or dropping an adhesive between the film sheets 41A and 41B. A bright display is possible by directly bringing the film sheet 41A and the organic EL panel 2 into close contact with each other without the adhesive layers 42A and 42B.

  According to the organic EL device 1 and the manufacturing method thereof according to the present embodiment described above, the heat radiating member 5 and the organic EL panel 2 are integrated by a pair of the first flexible sheet member 4A and the second flexible sheet member 4B. In addition, since part of the heat dissipation member 5 is exposed to the outside of the first flexible sheet member 4A and the second flexible sheet member 4B, an organic EL device having excellent heat dissipation can be provided. In this organic EL device 1, since the heat radiating member 5 includes a heat radiating sheet 51 having higher thermal conductivity in the in-plane direction than in the layer thickness direction, the heat generated in the organic EL panel 2 is radiated. It is transmitted in the surface direction of the sheet 51 and is promptly released to the outside of the first flexible sheet member 4A and the second flexible sheet member 4B. Therefore, the inside of the organic EL panel 2 is not heated to a high temperature, and the light emission characteristics can be maintained substantially constant.

  Further, as the heat radiating member 5, a heat radiating sheet 51 made of a graphite sheet having excellent heat radiating properties and a metal heat radiating plate 52 which is inexpensive and easily available are used, so that the heat radiating efficiency is low while reducing the manufacturing cost. High heat dissipation member 5 can be provided. Moreover, since the part exposed to the exterior of 4 A of 1st flexible sheet members and the 2nd flexible sheet member 4B is the metal heat sink 52, durability with respect to a fracture | rupture, abrasion, etc. can also be improved.

  In the organic EL device according to the present embodiment, the first flexible sheet member 4A and the second flexible sheet member 4B are bonded to the heat dissipation member 5 and the wiring boards 3A, 3B, and 3C to form an organic EL panel. 2 is hermetically sealed inside, and the first flexible sheet member 4A, the second flexible sheet member 4B formed on the end surface of the organic EL panel 2 and the gap 4H1 between the organic EL panel 2 and heat dissipation. The first flexible sheet member 4 </ b> A, the gap 4 </ b> H <b> 1 between the second flexible sheet member 4 </ b> B and the heat radiation member 5 formed on the end surface of the member 5, and the wiring boards 3 </ b> A, 3 </ b> B, 3 </ b> C and Sealing resin layers 43 and 45 are respectively formed in the gap 4H2 formed therebetween, and the gaps 4H1 and 4H2 are sealed. Therefore, the periphery of the organic EL panel 2 can be double sealed with the first flexible sheet member 4A, the second flexible sheet member 4B, and the first sealing resin layer 43. As a result, the machine The organic EL device 1 having high mechanical strength and excellent sealing performance can be provided.

  That is, in the organic EL device of Patent Document 2, there is an air layer in the gap between the laminate film (corresponding to the first flexible sheet member 4A and the second flexible sheet member 4B of this embodiment) and the organic EL panel. For this reason (FIG. 7 of Patent Document 2), the periphery of the organic EL panel is sealed with a laminate film through an air layer. In this case, the laminate film can protect the internal organic EL panel from the external air layer, but cannot protect the organic EL panel from the air layer already formed in the gap between the laminate film and the organic EL panel. . Therefore, the sealing function by the laminate film is also limited.

  On the other hand, in the organic EL device 1 of the present embodiment, an air layer is not interposed between the organic EL panel 2 and the first flexible sheet member 4A and the second flexible sheet member 4B. The periphery of the panel 2 is double-sealed by the first flexible sheet member 4A, the second flexible sheet member 4B, and the first sealing resin layer 43. Therefore, the first flexible sheet member 4A and the second flexible sheet member 4B can sufficiently function as the sealing members, and high sealing performance is realized.

  Further, in the organic EL device 1 of the present embodiment, the wiring boards 3A, 3B, 3C, the heat radiating member 5, the first flexible sheet member 4A, and the second flexible sheet member 4B are bonded to each other. The periphery of the organic EL panel 2 is sealed without a gap, and the interfaces between the wiring boards 3A, 3B, 3C and the first flexible sheet member 4A, the second flexible sheet member 4B, and the heat dissipation member Water or oxygen does not enter from the interface with the flexible sheet members 4A and 4B.

  That is, in the organic EL device of Patent Document 2, a wiring substrate is interposed between a pair of laminate films, but the thermoplastic adhesive formed on the inner surface of the laminate film is a wiring formed of polyimide resin or the like. It does not have a substantial adhesive force with the substrate, and is easily peeled off from the wiring substrate to form a gap with the wiring substrate. For this reason, when the organic EL panel is bent or a mechanical impact such as dropping is applied, peeling occurs between the wiring board and the laminate film, and moisture and oxygen enter through the gap.

  On the other hand, in the organic EL device 1 according to the present embodiment, the first flexible sheet member 4A, the second flexible sheet member 4B, the wiring boards 3A, 3B, 3C, and the heat dissipation member 5 are firmly bonded to each other. Therefore, even if the organic E panel 2 is bent or a mechanical impact such as dropping is applied, the first flexible sheet member 4A, the second flexible sheet member 4B and the wiring boards 3A, 3B, Peeling does not occur between 3C and the heat dissipation member 5, and high sealing performance can be maintained.

  Further, the first flexible sheet member 4A and the second flexible sheet member 4B cover the connecting portion between the wiring boards 3A, 3B, 3C and the organic EL panel 2, and are bonded to the wiring boards 3A, 3B, 3C. Therefore, even if a mechanical impact such as dropping is applied to the organic E panel 2, the connection between the wiring boards 3A, 3B, 3C and the organic EL panel 2 is not damaged, and the first flexible Since the conductive sheet member 4A, the second flexible sheet member 4B, and the wiring boards 3A, 3B, 3C are fixed, even if a tensile stress or the like is applied to the wiring boards 3A, 3B, 3C, the wiring boards 3A, 3B, The connection between 3C and the organic EL panel 2 does not peel off.

  That is, in the organic EL device of Patent Document 2, since the laminate film and the wiring substrate are not substantially bonded, when tensile stress is applied to the wiring substrate, the stress is directly connected between the wiring substrate and the organic EL panel. It will cause parting and peeling. On the other hand, in the organic EL device 1 of the present embodiment, such stress is absorbed by the first flexible sheet member 4A and the second flexible sheet member 4B, so that the wiring boards 3A, 3B, 3C and A strong stress is not applied to the connection portion with the organic EL panel 2.

  Therefore, according to the organic EL device 1 of the present embodiment, the organic EL device not only has excellent mechanical strength and sealing performance, but also has improved connection reliability between the wiring boards 3A, 3B, 3C and the organic EL panel 2. Can be provided.

  Further, in the organic EL device 1 of the present embodiment, the first flexible sheet member 4A, the second flexible sheet member 4B, and the heat radiating member 5 are fixed, so that a tensile stress or the like is applied to the heat radiating member 5. However, there is no occurrence of displacement or peeling between the heat dissipation member 5 and the organic EL panel 2. Therefore, stable heat dissipation can be maintained.

  Furthermore, since a gap (air layer) is not formed between the first flexible sheet member 4A, the second flexible sheet member 4B, and the heat radiating member 5, the first flexible sheet member 4A, The movement of heat to the second flexible sheet member 4B is promoted, and heat dissipation from the surfaces of the first flexible sheet member 4A and the second flexible sheet member 4B is also improved.

  Further, in the organic EL device 1 of the present embodiment, the surface on which the light emitting element portion 65 is formed is sealed with the second substrate 20 including the glass substrate with low moisture permeability, so that the sealing performance can be further improved. In addition, since the second substrate 20 protects the organic EL element 60, the organic EL element 60 is damaged when the organic EL panel 2 is sandwiched between the first flexible sheet member 4A and the second flexible sheet member 4B. It becomes difficult to receive. Therefore, the light emission characteristics of the organic EL element 60 can be maintained satisfactorily, and the manufacturing yield can be improved.

  Furthermore, in the organic EL device 1 of the present embodiment, the organic EL element 60 is formed on the inorganic insulating layer 14, and the inorganic gas barrier layer 69 of the thin film sealing layer 66 covering the organic EL element 60 is directly or an electrode that is an inorganic film. Since it is in contact with the inorganic insulating layer 14 via the protective layer 67, the periphery of the organic EL element 60 can be wrapped with an inorganic film, and the sealing performance is further improved. In addition, in the present embodiment, the surface of the thin film sealing layer 66 is covered with the third sealing resin layer 35 and the periphery of the third sealing resin layer 35 is sealed with the sealing material 30 having low moisture permeability. Therefore, the first sealing resin layer 44 provided adjacent to the sealing material 30, the adhesive layers 42A and 42B adjacent thereto, the first flexible sheet member 4A, and the second flexible sheet member 4B are organic. The periphery of the EL element 60 can be sealed several times, and the organic EL device 1 with extremely high sealing performance can be obtained.

[Modification]
In the first embodiment, the wiring substrates 3A, 3B, 3C are connected to the end portions of the organic EL panel 2 that is made flexible by thinning the glass substrate, and the organic EL panel 2 and the wiring substrates 3A, 3B, 3C are connected. And the heat dissipating member 5 are disposed between the first flexible sheet member 4A and the second flexible sheet member 4B, and the organic EL panel 2 is disposed in the first flexible sheet member 4A and the second flexible sheet member. It was set as the structure sealed inside the flexible sheet | seat member 4B.

  However, the wiring boards 3A, 3B, and 3C are connected in advance to the surface of the first flexible sheet member 4A that is connected to the organic EL panel 2, and the wiring boards 3A, 3B, and 3C are connected. The organic EL panel 2 and the heat dissipation member 5 are disposed between the flexible sheet member 4A and the second flexible sheet member 4B, and the organic EL panel 2 is connected to the side to which the wiring boards 3A, 3B, 3C are connected. Is inserted between the pair of pressure rollers 81 and 82 from the opposite end, so that the organic EL panel 2 is sealed inside the first flexible sheet member 4A and the second flexible sheet member 4B. Anyway.

  Since the organic EL panel 2 is very thin and flexible, handling is not easy. For this reason, in this modification in which the wiring boards 3A, 3B, 3C are connected to the first flexible sheet member 4A in advance, the wiring boards 3A, 3B, 3C are connected to the organic EL panel 2 and then the wiring board is connected. Opportunities to handle the organic EL panel 2 are reduced compared to the case where the organic EL panel 2 to which 3A, 3B, 3C is connected is sealed with the first flexible sheet member 4A and the second flexible sheet member 4B. Easy to manufacture.

  In the case where an ACF is used for connection between the organic EL panel 2 and the wiring boards 3A, 3B, 3C, in the case of connecting the wiring boards 3A, 3B, 3C to the organic EL panel 2 in advance, the organic EL panel 2 Since the first substrate 10 is very thin, the ACF protruding from the first substrate 10 does not stop at the end surface (side surface) of the first substrate 10 but on the stage where the organic EL panel 2 is installed. When the organic EL panel 2 is moved from the stage, the first substrate 10 may be broken by the ACF attached to the stage and the first substrate 10.

  On the other hand, in the present embodiment in which the wiring boards 3A, 3B, 3C are connected to the first flexible sheet member 4A in advance, the organic EL panel 2 is made the first possible using the pressure rollers 81, 82. Simultaneously with sealing with the flexible sheet member 4A and the second flexible sheet member 4B, the organic EL panel 2 and the wiring boards 3A, 3B, 3C are connected. Therefore, when connecting the organic EL panel 2 and the wiring boards 3A, 3B, 3C, there is no need to install the organic EL panel 2 on the stage, and the protruding ACF is connected to the wiring boards 3A, 3B, 3C and the second wiring board 3A, 3B, 3C. Since the first flexible sheet member 4 </ b> A and the second flexible sheet member 4 </ b> B are within the connection region, the possibility of the first substrate 10 being broken can be eliminated.

  In this embodiment, the example in which the wiring boards 3A, 3B, and 3C are connected in advance to the first flexible sheet member 4A has been described. However, the wiring and external terminals are previously connected to the first flexible sheet member 4A. The first flexible sheet member 4A may be used as a wiring board by patterning.

  According to this configuration, the wiring boards 3A, 3B, and 3C and the adhesive layers 8A, 8B, 8C, 9A, 9B, and 9C formed on the surface are not necessary, and the number of components can be greatly reduced. . Further, since there is no step due to the wiring boards 3A, 3B, 3C and the adhesive layers 8A, 8B, 8C, 9A, 9B, 9C, the organic EL panel 2, the first flexible sheet member 4A, and the second flexible The air layer is less likely to be mixed into the gap with the sheet member 4B, and extremely high sealing performance is obtained.

[Second Embodiment]
FIG. 10 is an exploded perspective view of an organic EL device 110 according to the second embodiment of the present invention. The organic EL device 110 according to the present embodiment enables double-sided display using two organic EL panels 201 and 202.

  The organic EL device 101 includes a first organic EL panel 201, a first wiring substrate 301 (301A, 301B, 301C) connected to an end of the first organic EL panel 201, and a back surface ( The heat dissipating member 500 (first heat dissipating sheet 511, heat dissipating plate 520, second heat dissipating sheet 512) disposed on the side opposite to the observation side and the first organic EL panel 201 of the heat dissipating member 500 are disposed on the opposite side. The second organic EL panel 202, the second wiring substrate 302 (302A, 302B, 302C) connected to the end of the second organic EL panel 202, the first organic EL panel 201, the first wiring substrate 301, and heat dissipation. The sealing body 400 (the first flexible sheet member 400A, the second flexible sheet), which holds the member 501, the second organic EL panel 202, and the second wiring board 302 in a sandwiched manner. And preparative member 400B), and a.

  The difference between the organic EL device 110 of the present embodiment and the organic EL device 1 of the first embodiment is that a pair of organic EL panels 201 and 202 are arranged on both sides of the heat dissipation member 500 and the pair of first EL devices are sandwiched therebetween. The flexible sheet member 400A and the second flexible sheet member 400B are disposed. The configurations of the first organic EL panel 201 and the second organic EL panel 202 are the same as those of the organic EL panel 2 of the first embodiment, and the configurations of the first wiring substrate 301 and the second wiring substrate 302 are both. This is the same as the wiring board 3 of the first embodiment.

  The heat radiating member 500 includes a metal heat radiating plate 520 and a pair of heat radiating sheets 511 and 512 disposed on both sides thereof. The configuration of the heat dissipation plate 520 is the same as that of the heat dissipation plate 52 of the first embodiment, and the configuration of the heat dissipation sheets 511 and 512 is the same as that of the heat dissipation sheet 51 of the first embodiment.

  The first organic EL panel 201 and the second organic EL panel 202 are formed with the same structure and the same size as each other. When viewed from the Z direction, the first organic EL panel 201 and the second organic EL panel 202 The structural members corresponding to each other are arranged so as to completely overlap each other. The first wiring boards 301A, 301B, and 301C and the second wiring boards 302A, 302B, and 302C are also formed with the same structure and size, and when viewed from the Z direction, the first wiring boards 301A, 301B, and 301C are formed. And the second wiring boards 302A, 302B, 302C corresponding to each other are disposed so as to completely overlap each other.

  The first organic EL panel 201 and the second organic EL panel 202 are arranged with the first substrates 105 and 205 on which organic EL elements are formed facing each other, and a heat dissipation member 500 is sandwiched therebetween.

  The heat radiating member 500 has a three-layer structure of a first heat radiating sheet 511, a heat radiating plate 520, and a second heat radiating sheet 512, and the first heat radiating sheet 511 and the first organic EL panel 201 are in close contact with each other. And the second organic EL panel 202 are in close contact with each other.

  The first heat dissipation sheet 511 is provided at a position that overlaps at least the display area Ad1 of the first organic EL panel 201, and is preferably provided at a position including peripheral drive circuits such as the scanning line drive circuits 131A and 131B. . Similarly, the second heat radiation sheet 512 is provided at a position that overlaps at least the display area Ad2 of the second organic EL panel 202, and preferably provided at a position including peripheral drive circuits such as the scanning line drive circuits 132A and 132B. It has been. Thus, heat generated from the display areas Ad1 and Ad2 and the peripheral drive circuit can be efficiently released to the outside. In the present embodiment, the heat radiation sheets 511 and 512 cover the display areas Ad1 and Ad2 and the formation areas of the scanning line drive circuits 131A, 131B, 132A, and 132B, and the first substrates 105 of the organic EL panels 201 and 202, respectively. , 205 in a larger area.

  The heat radiating plate 520 is provided at a position that overlaps at least the display areas Ad1 and Ad2, and a part of the heat radiating plate 520 projects outside the projecting portions 105c and 205c of the first substrates 105 and 205. The heat radiating plate 520 is desirably provided at a position including peripheral driving circuits such as the scanning line driving circuits 131A, 131B, 132A, 132B. Thus, heat generated from the display areas Ad1 and Ad2 and the peripheral drive circuit can be efficiently released to the outside. In the present embodiment, the display areas Ad1 and Ad2 and the formation areas of the scanning line drive circuits 131A, 131B, 132A, and 132B are covered, and the area is larger than that of the first substrates 105 and 205.

  On the outer surface side of the first organic EL panel 201 (Z positive direction side of the second substrate 106) and the outer surface side of the second organic EL panel 202 (Z negative direction side of the second substrate 206), the organic EL panel 2 and A flexible sealing body 400 is provided that closely contacts and encloses the inside. The sealing body 400 includes a pair of first flexible sheet members 400A and a first flexible sheet member 400A disposed so as to sandwich the organic EL panels 201 and 202, the wiring boards 301A, 301B, 301C, 302A, 302B, and 302C and the heat dissipation member 500. Two flexible sheet members 400B are provided. The pair of first flexible sheet member 400A and second flexible sheet member 400B are each made of a transparent material.

  The first flexible sheet member 400A and the second flexible sheet member 400B are configured by flexible film sheets 410A and 410B in which adhesive layers 420A and 420B are formed on one surface side. As the resin constituting the adhesive layers 420A and 420B, various materials such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin can be used. In this embodiment, a thermoplastic resin is used. .

  The first flexible sheet member 400A and the second flexible sheet member 400B are formed with a larger area than the organic EL panels 201 and 202, respectively. The first flexible sheet member 400A and the second flexible sheet member 400B are connected to the terminal portions 191A, 191B, 191C, 192A, 192B, 192C of the wiring boards 301A, 301B, 301C, 302A, 302B, 302C. With the end opposite to the side (including the portion where the semiconductor chips 601 and 602 are mounted) and the portion protruding outside the protruding portions 105c and 205c of the heat dissipation member 500 being exposed to the outside, The organic EL panels 201 and 202 are bonded to each other by adhesive layers 420A and 420B at the peripheral edge portions that are outside.

  In addition, adhesive layers 500A, 500B, 801A, 801B, and 801B are provided on the front and back surfaces of the wiring boards 301A, 301B, 301C, 302A, 302B, 302C and the heat dissipating member 500, respectively, located at the peripheral edge of the organic EL panels 201, 202. 801C, 802A, 802B, 802C, 901A, 901B, 901C, 902A, 902B, 902C are provided.

  Between the first flexible sheet member 400A, the first wiring boards 301A, 301B, 301C, and the heat dissipation plate member 500, adhesive layers 801A, 801B, 801C provided on the wiring boards 301A, 301B, 301C and The first flexible sheet member 400A and the first wiring boards 301A, 301B, and 301C are bonded to each other using the adhesive layer 420A provided on the first flexible sheet member 400A, and the heat dissipation member 500. The first flexible sheet member 400A and the heat dissipation member 500 are bonded to each other using the adhesive layer 500A provided on the adhesive layer and the adhesive layer 420A provided on the first flexible sheet member 400A. Adhesive layers 901A, 901B, and 901C provided on the first wiring boards 301A, 301B, and 301C, and an adhesive layer 50 provided on the heat dissipation member 500. By using the A, the first wiring board 301A, 301B, and the heat dissipation member 500 and 301C are bonded to each other.

  Further, between the second flexible sheet member 400B, the second wiring boards 302A, 302B, and 302C and the heat dissipation member 500, adhesive layers 802A, 802B, and 802C provided on the twelfth wiring boards 302A, 302B, and 302C. And the adhesive layer 420B provided on the second flexible sheet member 400B, the second flexible sheet member 400B and the second wiring boards 302A, 302B, 302C are bonded to each other, and the heat dissipation member The second flexible sheet member 400B and the heat radiating member 500 are bonded to each other using the adhesive layer 500B provided on the 500 and the adhesive layer 420B provided on the second flexible sheet member 400B. The adhesive layers 902A, 902B, and 902C provided on the second wiring boards 302A, 302B, and 302C, and the adhesive layer 5 provided on the heat dissipation member 500, respectively. Using a 0B, the second wiring board 302A, 302B, and the heat dissipation member 500 and 302C are bonded to each other.

  The adhesive layers 500A, 500B, 801A, 801B, 801C, 802A, 802B, 802C, 901A, 901B, 901C, 902A, 902B, and 902C are made of various materials such as thermoplastic resin, thermosetting resin, and ultraviolet curable resin. In this embodiment, a thermoplastic resin or a thermosetting resin is used.

  Then, on the same principle as described in the first embodiment, the adhesive layers 420A and 420B of the first flexible sheet member 400A and the second flexible sheet member 400B and the wiring boards 301A, 301B, 301C, 302A, 302B, 302C and the adhesive layers 500A, 500B, 801A, 801B, 801C, 802A, 802B, 802C, 901A, 901B, 901C, 902A, 902B, 902C provided on the heat dissipation member 500 are the organic EL panel 201, 201, the gap between the first flexible sheet member 400A and the second flexible sheet member 400B, the wiring boards 301A, 301B, 301C, 302A, 302B, 302C and the first flexible sheet member 400A, the second flexible sheet. Gap between the conductive sheet member 400B, the heat radiating member 500 and the first flexible sheet member 400A, The gap between the flexible sheet member 400B, and enters the heat dissipation member 500 and the wiring board 301A, 301B, 301C, 302A, 302B, the gap between 302C respectively, to seal the gap. With such a configuration, the organic EL panels 201 and 202 are hermetically sealed inside the pair of first flexible sheet member 400A and second flexible sheet member 400B, that is, inside the sealing body 400. Yes.

  The manufacturing method of the organic EL device 110 is the same as the method described in the first embodiment. That is, the first wiring boards 301A, 301B, and 301C and the second wiring boards 302A and 302B are respectively attached to the end portions of the first organic EL panel 201 and the second organic EL panel 202 that are made flexible by thinning the glass substrate. , 302C are connected, and the first organic EL panel 201, the wiring boards 301A, 301B, 301C, the heat radiation member 500, the second organic EL panel 202, and the wiring boards 302A, 302B, 302C are laminated to the first flexible sheet. It arrange | positions between the member 400A and the 2nd flexible sheet | seat member 400B.

  Next, the laminate is placed on the Y positive side (the end of the organic EL panels 201 and 202 opposite to the side where the wiring boards 301A, 301B, 301C, 302A, 302B, and 302C are connected, and the heat dissipation member 500. Is inserted between the pair of pressure rollers from the end of the first flexible sheet member 400A and the second flexible sheet member 400B opposite to the side exposed to the outside. Then, adhesive layers 420A and 420B, adhesive layers 801A, 801B, 801C, 802A, 802B, 802C, 901A, and the like on the surfaces of the first flexible sheet member 400A and the second flexible sheet member 400B facing each other. 901B, 901C, 902A, 902B, 902C and adhesive layers 500A, 500B are interposed, and part of the wiring boards 301A, 301B, 301C, 302A, 302B, 302C (terminal portions 191A, 191B, 191C, 192A, 192B, 192C) The first flexible sheet member 400A, the second flexible sheet member, and a part of the heat radiating member 500 (the part projecting outward from the projecting parts 105c, 205c). While heating the laminated body with a pair of pressure rollers in a state exposed to the outside of 400B Pressure.

  The adhesive layers 420A and 420B and the adhesive layers 801A, 801B, 801C, 802A, 802B, 802C, 901A, 901B, 901C, 902A, 902B, and 902C are used as the first flexible sheet member 400A and the second flexible member. The sheet member 400B, the organic EL panels 201 and 202, and the wiring boards 301A, 301B, 301C, 302A, 302B, and 302C are pushed and expanded to seal the gaps, and the peripheral portions of the organic EL panels 201 and 202 The first flexible sheet member 400A and the second flexible sheet member 400B face each other, the first flexible sheet member 400A, the second flexible sheet member 400B, and the wiring boards 301A, 301B, 301C. , 302A, 302B, 302C, the first flexible sheet member 400A, Adhesive layers 420A and 420B are bonded to a portion where the flexible sheet member 400B and the heat dissipation member 500 are opposed to each other, and a portion where the wiring boards 301A, 301B, 301C, 302A, 302B and 302C and the heat dissipation member 500 are opposed to each other. Adhesive layers 801A, 801B, 801C, 802A, 802B, 802C, 901A, 901B, 901C, 902A, 902B, 902C, and adhesive layers 500A, 500B are used to bond the organic EL panels 201, 202 to the first flexible layer. The sealing sheet member 400A and the second flexible sheet member 400B are sealed.

  In this step, a part of the adhesive layers 420A and 420B, adhesive layers 801A, 801B, 801C, 802A, 802B, 802C, 901A, 901B, 901C, 902A, 902B, and 902C is used as the first flexible sheet member. 400A, a second sealing resin that protrudes to the outside of the second flexible sheet member 400B and seals the boundary portion between the end surfaces of the first flexible sheet member 400A and the second flexible sheet member 400B Form a layer.

  When this sealing process is completed, the pressure roller is rotated in the reverse direction, and the organic EL device 110 is taken out in the direction opposite to the carry-in direction. Thereby, the organic EL device 110 is completed.

  According to the organic EL device 110 and the manufacturing method thereof according to the present embodiment described above, the heat radiating member 500 and the organic EL panels 201 and 202 are paired with the first flexible sheet member 400A and the second flexible sheet member 400B. And a part of the heat dissipation member 500 is exposed to the outside of the first flexible sheet member 400A and the second flexible sheet member 400B, so that an organic EL device having excellent heat dissipation can be provided. . In this organic EL device 110, since the heat radiating member 500 includes the heat radiating sheets 511 and 512 having higher thermal conductivity in the in-plane direction than in the layer thickness direction, the heat radiating member 500 is generated in the organic EL panels 201 and 202. The heat thus transmitted is transmitted in the surface direction of the heat radiation sheets 511 and 512 and quickly released to the outside of the first flexible sheet member 400A and the second flexible sheet member 400B. Therefore, the inside of the organic EL panels 201 and 202 is not heated to a high temperature, and the light emission characteristics can be maintained substantially constant.

  In addition, the first flexible sheet member 400A and the second flexible sheet member 400B are bonded to the heat dissipation member 500 and the wiring boards 301A, 301B, 301C, 302A, 302B, and 302C, whereby the organic EL panels 201 and 202 are bonded. Between the first flexible sheet member 400A and the second flexible sheet member 400B formed on the end surfaces of the organic EL panels 201 and 202 and the organic EL panels 201 and 202. , Gaps between the first flexible sheet member 400A, the second flexible sheet member 400B and the heat radiating member 500 formed on the end surface of the heat radiating member 500, and the wiring boards 301A, 301B, 301C, 302A, 302B. , 302C and the heat radiating member 500, a sealing resin layer is formed in each gap, and the gap is sealed.Therefore, the periphery of the organic EL panels 201 and 202 can be double-sealed by the first flexible sheet member 400A, the second flexible sheet member 400B, and the sealing resin layer. An organic EL device having high mechanical strength and excellent sealing performance can be provided.

  Further, since the wiring boards 301A, 301B, 301C, 302A, 302B, 302C and the first flexible sheet member 400A and the second flexible sheet member 400B are fixed, the wiring boards 301A, 301B, 301C, 302A, There is little possibility of peeling at the connection part between 302B and 302C and the organic EL panels 201 and 202, and the heat dissipation member 500, the first flexible sheet member 400A, and the second flexible sheet member 400B are fixed. Therefore, positional displacement between the heat dissipation member 500 and the organic EL panels 201 and 202 hardly occurs, and stable heat dissipation is obtained.

  In the second embodiment, the first wiring substrate 301 (301A, 301B, 301C), the end portion of the first organic EL panel 201 and the second organic EL panel 202, which are made flexible by thinning the glass substrate, The second wiring board 302 (302A, 302B, 302C) is connected, the first organic EL panel 201, the second organic EL panel 202, the first wiring board 301 (301A, 301B, 301C), the second wiring board 302 (302A). , 302B, 302C) and the heat radiating member 501 are disposed between the first flexible sheet member 400A and the second flexible sheet member 400B, and the first organic EL panel 201 and the second organic EL panel are disposed. 202 is sealed inside the first flexible sheet member 400A and the second flexible sheet member 400B.

  However, as in the modification of the first embodiment, the first wiring substrate 301 (301A, 301B, 301C) is placed on the surface of the first flexible sheet member 400A that is connected to the first organic EL panel 201 in advance. The second wiring board 302 (302A, 302B, 302C) is connected in advance to the surface of the second flexible sheet member 400B on the side connected to the second organic EL panel 202, and the first wiring is connected. Between the first flexible sheet member 400A to which the substrate 301 (301A, 301B, 301C) is connected and the second flexible sheet member 400B to which the second wiring substrate 302 (302A, 302B, 302C is connected). The first organic EL panel 201 and the second organic EL panel 202 are arranged, and the first organic EL panel 201 and the second organic EL panel 202 are connected to the first wiring board 301 (301A). 301B, 301C) and the second wiring substrate 302 (302A, 302B, 302C) are inserted between the pair of pressure rollers from the end opposite to the side to which the first wiring board 302 (302A, 302B, 302C) is connected. The organic EL panel 202 may be sealed inside the first flexible sheet member 400A and the second flexible sheet member 400B.

  In addition, as in the modification of the first embodiment, the first flexible sheet member 400A and the second flexible sheet member 400B are pre-patterned with wiring and external terminals, and the first flexible sheet member 400A and the second flexible sheet member 400B are patterned. 2 The flexible sheet member 400B may be used as a wiring board.

[Example]
Next, the effect of this invention is demonstrated using FIG.11 and FIG.12.

  FIG. 11 is a diagram showing a change over time in the temperature of the display region when the organic EL device emits light. In FIG. 11, the horizontal axis represents time, and the vertical axis represents the temperature of the display area (the temperature of the surface of the flexible sheet member) when the entire surface (all pixels) of the display area is caused to emit light.

  As the organic EL device that is a measurement object, an organic EL panel having 9 pixels of 3 rows × 3 columns integrated with a heat radiating member with a pair of laminate films was used. The experiment was performed in a room temperature environment (23 ° C.), and light was emitted continuously for 100 minutes starting from a non-lighting state.

  In FIG. 11, “single side: no” means a case where no heat radiating sheet is provided (a case where only a heat radiating plate is provided) in the one-side light emission type configuration of the first embodiment (Example 1). “Single-sided: 25 μm” means a case where a PGS graphite sheet (trade name, manufactured by Panasonic Corporation) having a thickness of 25 μm is used as a heat dissipation sheet in the single-sided light emitting configuration of the first embodiment (Example 2). “One side: 70 μm” means a case where a PGS graphite sheet (trade name, manufactured by Panasonic Corporation) having a thickness of 70 μm is used as a heat dissipation sheet in the single-sided light emission type configuration of the first embodiment (Example 3). “Double-sided: 25 μm single-sided lighting” uses a PGS graphite sheet (trade name, manufactured by Panasonic Corporation) with a thickness of 25 μm as the heat dissipation sheet in the double-sided light emitting type configuration of the second embodiment, and uses only one organic EL panel. This means the case where light is emitted (Example 4). “Double-sided: 25 μm double-sided lighting” uses a PGS graphite sheet (trade name, manufactured by Panasonic Corporation) with a thickness of 25 μm as the heat dissipation sheet in the double-sided light emission type configuration of the second embodiment, and emits two organic EL panels. (Example 5).

  As shown in FIG. 11, in the organic EL panels of Examples 1 to 5, the temperature rises only to about 55 ° C. even when light is emitted for a long time. In the conventional organic EL device not provided with the heat radiating member, when the light is emitted for a long time, the temperature of the display region reaches nearly 100 ° C., which may adversely affect the light emission characteristics of the organic EL element. In the organic EL devices of ˜5, the temperature could be kept much lower than that and the influence on the light emission characteristics was very small.

  In particular, in the organic EL devices of Examples 2 to 5 provided with the heat dissipation sheet, the temperature of the display region was less than 40 ° C., and could be suppressed to a very low temperature. At this temperature, the light emission characteristics are hardly affected.

  FIG. 12 is a diagram showing the temperature distribution of the display region in the organic EL devices of Examples 1, 2, 4, and 5. FIG. 12A to FIG. 12D are diagrams corresponding to Examples 1, 2, 4, and 5, respectively. 12A to 12D, the upper side is a portion where the heat dissipation member is exposed from the laminate film.

  As shown in FIG. 12, the temperatures of the nine pixels provided in the display area are substantially uniform within the surface of the organic EL device of each embodiment. There is no large temperature distribution such that the temperature of the central pixel is much higher than the peripheral pixels, and the temperature distribution is generally uniform. Therefore, the light emission characteristics of each pixel are substantially uniform, and the influence on the light emission characteristics is also uniform.

  In particular, in the organic EL devices of Examples 2, 4, and 5 provided with the heat dissipation sheet, the heat generated in each pixel is dispersed over the entire display area via the heat dissipation sheet, and the heat dissipation sheet of Example 1 without the heat dissipation sheet is provided. Compared to the configuration, the temperature of each pixel is also reduced. For example, in the organic EL device of Example 2 provided with the heat dissipation sheet, the temperature of each pixel is about 20 ° C. lower than that of the organic EL device of Example 1 where no heat dissipation sheet is provided.

  As described above, according to the organic EL device of the present invention, it is possible to provide an organic EL device having a high heat dissipation effect and uniform emission characteristics of each pixel.

  FIG. 13 is a schematic configuration diagram of a book-type display 1000 that is an example of an electronic apparatus including the organic EL device 1. FIG. 13A is a perspective view of the display 1000, and FIG. 13B is a schematic cross-sectional view showing the configuration of the connector portion of the electronic display.

  The display 1000 is a book-type display using the organic EL device 1 as electronic paper. The display 1000 is provided with a hinge portion 1001 having a connector 1002 that can be connected to the wiring board 3 of the electronic paper 1 at a portion corresponding to the binding margin of the book. A connector 1002 is attached to the hinge portion 1001 so as to be rotatable about a rotation axis Ax. By rotating the connector 1002, the electronic paper 1 is turned so as to turn a normal paper.

  A plurality of electronic papers 1A and 1B may be detachably connected to the hinge portion 1001. As a result, the necessary number of electronic papers can be removed and carried as in a loose leaf.

  The organic EL device of the present invention is not limited to the book type display described above, and can be mounted on various electronic devices. Examples of such electronic devices include personal computers, digital still cameras, viewfinder type or monitor direct view type digital video cameras, car navigation systems, in-vehicle displays, pagers, electronic notebooks, calculators, word processors, workstations, videophones, POSs. There are terminals, devices equipped with a touch panel, and the like, and the organic EL device can be suitably used as these display means. Furthermore, the organic EL device of the present invention can also be used as a light source for an exposure head of a device other than a display device, for example, a printer head.

DESCRIPTION OF SYMBOLS 1 ... Organic EL apparatus, 2 ... Organic EL panel, 4 ... Sealing body, 4A, 4B ... Flexible sheet member, 4H1 ... Gap, 5 ... Heat radiation member, 5A, 5B ... Adhesive layer, 10 ... 1st board | substrate DESCRIPTION OF SYMBOLS 10A ... 1st base material, 41A, 41B ... Film sheet, 42A, 42B ... Adhesive layer, 43 ... 1st sealing resin layer, 51 ... Radiation sheet, 52 ... Radiation plate, 60 ... Organic EL element, 64 ... Circuit layer, 81, 82 ... Pressure roller (pressure means), 1000 ... Book type display (electronic device)

Claims (9)

An organic EL panel on which an organic EL element is formed;
A heat dissipating member including a heat dissipating sheet that is in close contact with the organic EL panel directly or through an adhesive layer and that has higher thermal conductivity in the in-plane direction than the layer thickness direction;
The organic EL panel and the heat radiating member are disposed so as to be sandwiched therebetween, and the organic EL panel and the heat radiating member are in close contact with each other directly or through an adhesive layer, and at least one of them is transparent. A pair of flexible film sheets,
The pair of film sheets are bonded to each other at a peripheral edge portion of the organic EL panel with a part of the heat dissipation member exposed to the outside. The heat dissipating member is formed on a surface of the heat dissipating sheet opposite to a side where the organic EL panel is in close contact with the heat dissipating sheet composed of a graphite sheet that is in close contact with the organic EL panel directly or through an adhesive layer. A heat sink made of metal that adheres directly or through an adhesive layer,
The organic EL device according to claim 1, wherein a part of the heat radiating plate is exposed to the outside of the pair of film sheets. The pair of film sheets hermetically enclose the organic EL panel inside,
A gap between the pair of film sheets formed on the end surface of the organic EL panel and the organic EL panel, and a space between the pair of film sheets formed on the end surface of the heat dissipation member and the heat dissipation member. The organic EL device according to claim 1, wherein a sealing resin layer is formed in each gap, and the gap is sealed. The organic EL panel has a base material, a circuit layer provided on the base material, and the organic EL element provided on the circuit layer,
The organic EL device according to any one of claims 1 to 3, wherein the base material is composed of a glass substrate, and the thickness of the base material is 20 µm or more and 50 µm or less. An organic EL panel in which an organic EL element is formed, and a heat dissipation member including a heat dissipation sheet that is in close contact with the organic EL panel directly or via an adhesive layer and that has higher thermal conductivity in the in-plane direction than in the layer thickness direction; A method of manufacturing an organic EL device having
The organic EL panel and the heat dissipating member are disposed between a pair of transparent film sheets, at least one of which is transparent, and the laminate of the pair of film sheets, the organic EL panel, and the heat dissipating member is paired with a pressurizing unit. A first step of inserting between
An adhesive is interposed between the pair of film sheets, and the laminated body is pressed by the pair of pressing means in a state where a part of the heat radiating member is exposed to the outside from between the pair of film sheets. And a second step of bonding the pair of film sheets at the peripheral edge of the organic EL panel.   In the second step, the laminate is pressurized by the pair of pressing means, and the adhesive is pushed and spread in a gap between the pair of film sheets, the organic EL panel, and the heat dissipation member. By sealing and bonding the part where the pair of film sheets face each other at the peripheral part of the organic EL panel and the part where the heat radiating member and the film sheet face each other using the adhesive. The method for producing an organic EL device according to claim 5, wherein the organic EL panel is sealed inside the pair of film sheets. The pair of pressure means are a pair of pressure rollers,
The said 1st step WHEREIN: The said laminated body is inserted in a pair of said pressure roller from the edge part on the opposite side to the side where the said heat radiating member of the said pair of film sheet exposes. The manufacturing method of the organic electroluminescent apparatus of description.   The adhesive is a thermoplastic adhesive, and the adhesive is formed on a surface of the pair of film sheets facing each other and a surface of the heat dissipation member facing the film sheet, respectively. The method for manufacturing an organic EL device according to claim 5, wherein the method is characterized in that:   An electronic apparatus comprising the organic EL device according to claim 1.