JP5071457B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus in which an electronic component supplied by a tape feeder is attracted to a mounting head and mounted on a substrate.

  2. Description of the Related Art Conventionally, a carrier tape containing an electronic component is used as a component supply means of an electronic component mounting apparatus (hereinafter abbreviated as a mounting apparatus) for mounting an electronic component on a substrate by moving a mounting head having an electronic component suction function. A tape feeder is used which feeds electronic components intermittently to the component take-out port by pitch feeding.

  In the tape feeder, the carrier tape is generally pitched immediately before the mounting operation of the electronic component by the mounting head is started (for example, Patent Document 1), but the size of the electronic component is large and heavy. In this case, when the feeding speed of the carrier tape is slow and the electronic component has not yet been supplied to the component ejecting port when the mounting head arrives at the component ejecting port, the mounting head becomes in a “waiting” state and the tact loss occurs. There are cases where this occurs. For this reason, there is a case where the carrier tape pitch feed is performed immediately after the mounting head performs the electronic component suction operation (so-called “part advance”).

  By the way, the carrier tape is a cover tape (a sealing tape for preventing the electronic component from being dropped on the upper surface of the carrier tape) so that the mounting head can adsorb the electronic component from the component extraction port at the component extraction port. However, when the component is forwarded, the electronic component may fall from the component outlet for some reason when the mounting apparatus is stopped in an emergency. If the mounting device is restarted in this way when the electronic component at the component extraction port falls and no electronic component is present at the component extraction port, a mounting error will occur because the mounting head cannot absorb the electronic component. Inconveniences such as an emergency stop of the device may occur. For this reason, when the parts are forwarded, in order to ensure that the electronic parts are present at the parts take-out port of the tape feeder at the time of starting after the emergency stop, the carrier tape of the tape feeder is loaded with the start of the mounting apparatus. The pitch is fed by the pitch.

JP 2006-173442 A

  However, as described above, when the carrier tape of the tape feeder is fed at a pitch of one pitch at the time of starting after an emergency stop, the tape feeder was originally at the parts feeder outlet of the tape feeder (that is, dropped from the parts outlet). The electronic parts go through the parts outlet and are discarded without being attracted to the mounting head. Therefore, even if the electronic parts are very cheap, the expensive electronic parts have a large financial loss. Therefore, there is a problem that the effect of improving the production efficiency by preventing the tact loss obtained by the part advance is diminished.

  Accordingly, the present invention provides an electronic component capable of improving production efficiency by suppressing monetary loss due to wasteful disposal of expensive electronic components while preventing tact loss by performing part advance. An object is to provide a mounting apparatus.

  The electronic component mounting apparatus according to claim 1, a substrate positioning unit that positions the substrate, a tape feeder that feeds the electronic component intermittently to the component extraction port by pitch-feeding the carrier tape containing the electronic component, An electronic component mounting apparatus comprising a mounting head for adsorbing an electronic component supplied to a component take-out port by a tape feeder and mounting the electronic component on a substrate positioned by a substrate positioning unit. When the storage unit that stores the price of the component and the mounting head picks up the electronic component, the price of the electronic component is read from the storage unit and compared with a predetermined standard price, and the price of the electronic component is the standard price The carrier tape is pitched immediately after the mounting head picks up the electronic component, and the price of the electronic component exceeds the standard price. The, and a tape feeder operation control means for actuating the tape feeder as the carrier tape immediately before mounting head starts suction operation of the electronic component is a pitch feed.

  In the present invention, the price of the electronic component to be mounted on the substrate is stored in the storage unit, and when the mounting head performs suction of the electronic component, the price of the electronic component is read from the storage unit and a predetermined reference price is set. If the price of the electronic component is lower than the standard price, the carrier tape is pitched immediately after the mounting head performs the suction operation of the electronic component, and the price of the electronic component exceeds the standard price. In this case, the carrier tape is pitch-fed immediately before the mounting head starts the suction operation of the electronic component. For this reason, so-called parts are postponed for electronic parts that are cheaper (cheap) than the standard price, and tact loss is prevented. Electronic parts that are higher than the standard price (expensive) at the time of starting after an emergency stop The financial loss caused by wasteful disposal of expensive electronic components, which can be caused by feeding the carrier tape by one pitch, is suppressed. Therefore, according to the present invention, it is possible to improve the production efficiency by suppressing the monetary loss due to the wasteful disposal of the expensive electronic component while preventing the tact loss by performing the forward feeding of the component.

The perspective view of the electronic component mounting apparatus in one embodiment of this invention The block diagram of the tape feeder with which the electronic component mounting apparatus in one embodiment of this invention is provided The block diagram which shows the control system of the electronic component mounting apparatus in one embodiment of this invention The figure which shows an example of the relationship data of the kind and price of an electronic component which RAM of the electronic component mounting apparatus in one embodiment of this invention memorize | stores The flowchart which shows the operation | movement procedure of the mounting | wearing operation | work of the electronic component which the electronic component mounting apparatus in one embodiment of this invention performs

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, an electronic component mounting apparatus 1 according to the present embodiment has a conveyor frame 3 composed of a pair of plate members extending in the horizontal direction at the center of a base 2, and the pair of conveyor frames 3 includes A pair of conveyors (belt conveyors) 4 is provided as a substrate positioning unit that supports both ends of the substrate PB from below and conveys and positions the substrate PB. Hereinafter, for convenience of explanation, the transport direction of the substrate PB by the transport conveyor 4 is defined as the X-axis direction (left-right direction of the base 2), and the direction in the horizontal plane perpendicular to the X-axis direction is defined as the Y-axis direction (front-back direction of the base 2). ). Also, the vertical direction is the Z-axis direction.

In FIG. 1, a plurality of tape feeders 5 as component supply units are provided in the left-right direction (X-axis direction) of the base 2 at both front and rear ends of the base 2 facing each other in the Y-axis direction across a pair of conveyors 4. It is provided side by side. Each tape feeder 5 has a component take-out port 5a provided at an end close to the conveyor 4, and the carrier tape CT containing the electronic component Pt is pitch-fed to the component take-out port 5a. Is supplied intermittently.

  These tape feeders 5 can be exchanged together by a carriage DS that can be attached to and detached from both front and rear ends of the base 2. The feeder base Fb provided at the upper part of the carriage DS has a T-shaped slot (not shown) extending in the front-rear direction of the carriage DS (the Y-axis direction when the carriage DS is attached to the base 2). The tape feeders 5 are arranged side by side in the X-axis direction, and each tape feeder 5 is attached to the carriage DS by horizontally inserting a protrusion 5b (FIG. 2) having a reverse T-shaped cross section provided on the lower surface into the slot. . When the carriage DS is attached to the end of the base 2 and the feeder base Fb is fixed to the base 2, each tape feeder 5 is attached to the base 2 (about the configuration of the tape feeder 5 Will be described later).

  In FIG. 1, a component mounting robot 6 as a component mounting mechanism 6 that sucks (picks up) an electronic component Pt supplied from a tape feeder 5 and mounts it on a substrate PB positioned by a conveyor 4 on a base 2. Is provided. The component mounting robot 6 extends on the base 2 in the Y-axis direction, and extends over the Y-axis table 7a extending in the X-axis direction and extending over the pair of conveyors 4 in the Y-axis direction. An XY robot unit 7 including two X-axis tables 7b provided movably in the Y-axis direction and two moving stages 7c provided movably in the X-axis direction on each X-axis table 7b, and an XY robot unit 7 includes two mounting heads 8 attached to the respective moving stages 7c. Each mounting head 8 is provided with a plurality of suction nozzles 9 which are suction portions for sucking the electronic component Pt, and can be moved up and down with respect to the mounting head 8 and rotatable about a vertical axis (Z axis).

  In FIG. 1, each moving stage 7 c of the XY robot unit 7 is provided with a substrate camera 11 having an imaging field of view downward, and a front and rear region on a base 2 that sandwiches a pair of transfer conveyors 4 in the Y-axis direction. Each is provided with a component camera 12 with the imaging field of view facing upward. Here, the substrate camera 11 captures an image of a substrate mark (not shown) provided on the upper surface of the substrate PB positioned by the conveyor 4 from above, and the component camera 12 is captured by the mounting head 8 (suction nozzle 9). The sucked electronic component Pt is imaged from below.

  In FIG. 2, each tape feeder 5 has a carrier tape CT forward from the rear side of the frame 21 in a frame 21 having a protrusion 5b inserted into a slot on the feeder base Fb of the carriage DS described above (see FIG. 2 is provided in a direction indicated by an arrow A in FIG.

  In the enlarged view of FIG. 2, the carrier tape CT has a large number of pockets PC formed of concave portions recessed downward in the longitudinal direction of the carrier tape CT. A cover tape BT for sealing so as not to drop the component Pt is provided so as to be peelable from the carrier tape CT. A rear portion of the frame 21 is provided with a pair of cover tape collecting rollers 23 for winding and collecting the cover tape BT peeled off from the carrier tape CT.

In FIG. 2, the pitch feed unit 22 includes a sprocket 24 provided in front of the frame 21, a lever 25 coupled to the sprocket 24, a ratchet mechanism 26 that regulates the rotation direction of the sprocket 24, and an air supported by the frame 21. A cylinder 27 is provided. When the rod portion 27a of the air cylinder 27 reciprocates in the front-rear direction of the frame 21, the lever 25 connected to the rod portion 27a swings and the sprocket 24 rotates intermittently forward by the action of the ratchet mechanism 26 (in FIG. 2). The arrow B) shown in FIG.
The pitch is fed from the rear to the front.

  In FIG. 2, a guide rail 28 is provided on the front upper surface of the frame 21 so as to extend in the front-rear direction. The guide rail 28 is a guide member that supports the carrier tape CT that is pitch-fed from the rear of the frame 21 toward the front by the pitch feed portion 22 so as to pass through the component take-out port 5a that is the pickup position of the electronic component Pt. The lower surface of the carrier tape CT is guided on the upper surface. A guide rail cover 29 is provided on the upper surface of the guide rail 28, and each pocket PC of the carrier tape CT is applied with an appropriate force to the upper surface of the guide rail 28 by the guide rail cover 29 before and after passing through the component takeout port 5a. Pressed. For this reason, the carrier tape CT is not separated from the upper surface of the guide rail 28 even in the component take-out port 5a in which the upper part is open.

  In FIG. 2, an opening 30 for pulling out the cover tape BT is provided in an intermediate portion of the guide rail cover 29. When the carrier tape CT passes through the opening 30 of the guide rail cover 29, the cover tape BT is folded back to the opening edge portion 30a and peeled off from the upper surface of the carrier tape CT. Then, it is pulled out from the opening 30 to the rear of the frame 21 and taken up by the cover tape collecting roller 23 (arrow C shown in FIG. 2), and collected in a cover tape accommodating space 31 provided in the frame 21.

  When the carrier tape CT is pitch-fed from the rear side to the front side of the frame 21 by the pitch feeding portion 22, each pocket PC of the carrier tape CT advances on the guide rail 28, and the pocket PC reaches the component take-out port 5a. By the way, the mounting head 8 sucks (picks up) the electronic component Pt in the pocket PC by the suction nozzle 9.

  The transport and positioning operation of the board PB by the transport conveyor 4 is performed by controlling the operation of the transport conveyor operating mechanism 41 (FIG. 3) including an actuator or the like not shown by the control device 40 (FIGS. 1 and 3) provided in the electronic component mounting apparatus 1. Made by doing.

  The mounting operation of the electronic component Pt on the substrate PB by the component mounting robot 6, that is, the movement operation of the mounting head 8 by the XY robot unit 7 (the movement operation of each X-axis table 7b relative to the Y-axis table 7a in the Y-axis direction and the X-axis) The movement of each moving stage 7c with respect to the table 7b in the X-axis direction), the lifting and lowering of each suction nozzle 9 with respect to the mounting head 8 and the rotation around the vertical axis, and the suction (pickup) of the electronic component Pt by each suction nozzle 9 and its The release (separation) operation is performed when the control device 40 controls the operation of the component mounting robot operation mechanism 42 (FIG. 3) including an actuator (not shown). The operation of supplying the electronic component Pt to the component take-out port 5a by each tape feeder 5 is performed by controlling the operation of the tape feeder operation mechanism 43 (FIG. 3) including the air cylinder 27 provided in each tape feeder 5. Made.

  In FIG. 3, the imaging operation control of the board camera 11 and the component camera 12 is performed by the control device 40, the board mark image data obtained by the imaging of the board camera 11, and the electronic data obtained by the imaging operation of the component camera 12. Both the image data of the parts Pt are sent to the control device 40.

In FIG. 3, a ROM (Read Only Memory) 44 and a RAM (Random Access Memory) 45 are connected to the control device 40, and the control device 40 is a circuit board of the electronic component Pt based on a mounting program stored in the ROM 44. The mounting operation to PB is performed. The mounting program includes transport and positioning of the substrate PB by the transport conveyor 4, imaging of the substrate mark of the positioned substrate PB by the substrate camera 11, image recognition based on the obtained image data, and the electronic component Pt by the tape feeder 5. Supply, movement of the mounting head 8 by the component mounting robot 6, suction and release of the electronic component Pt by the suction nozzle 9, imaging of the sucked electronic component Pt by the component camera 12, image recognition performed based on the obtained image data, etc. The procedure of each operation is defined. Further, the control device 40 reads necessary information from the RAM 45 in performing each of these operations. The information read out from the RAM 45 by the control device 40 includes the type of electronic component Pt to be mounted on the positioned substrate PB, the mounting position on the substrate PB, the direction of the electronic component Pt at the mounting position (direction at the time of mounting), The place where the electronic component Pt is supplied (the attachment position on the base 2 of the tape feeder 5 that supplies the electronic component Pt, here the slot number) and the direction of the electronic component Pt at that place (at the time of supply) Orientation) and information such as the component shape of each electronic component Pt. Further, the RAM 45 stores data as shown in FIG. 4, for example, showing the relationship between the types and prices of all electronic components Pt scheduled to be mounted on the board PB.

  In FIG. 3, the control device 40 has a function of varying the timing of performing the pitch feed of the carrier tape CT (that is, the electronic component Pt) by the tape feeder 5 that supplies the electronic component Pt according to the type of the electronic component Pt. . That is, when the mounting head 8 picks up the electronic component Pt, the control device 40 reads the price of the electronic component Pt from the RAM 45 and compares it with a predetermined reference price, and the price of the electronic component Pt becomes the reference price. If lower, the carrier tape CT is pitched immediately after the mounting head 8 sucks the electronic component Pt, and if the price of the electronic component Pt exceeds the reference price, the mounting head 8 moves to the electronic component Pt. The tape feeder 5 is operated so that the carrier tape CT is pitch-fed immediately before starting the suction operation.

  In the electronic component mounting apparatus 1 having such a configuration, when the control device 40 performs the mounting operation of the electronic component Pt on the board PB according to the mounting program stored in the ROM 44, the control device 40 first refers to the RAM 45. Then, the type of the electronic component Pt supplied by each tape feeder 5 attached to the base 2 is read, and the price of each electronic component Pt is read based on the read type (step ST1 in FIG. 5). Then, all the tape feeders 5 that compare the read prices of the electronic components Pt with a predetermined reference price (step ST2) and supply electronic components Pt that are lower than the reference price (hereinafter referred to as inexpensive parts). The electronic component Pt is supplied to the component take-out ports 5a of all the tape feeders 5 that supply low-priced components by performing pitch feed for one pitch (step ST3).

  When the controller 40 causes all the tape feeders 5 that supply inexpensive parts to perform pitch feed for one pitch, the controller 40 operates the conveyor 4 to carry in the substrate PB that has been input from the outside (shown in FIG. 1). The substrate PB is positioned at a predetermined position (see arrow D) (step ST4). At the time of positioning the board PB, the control device 40 operates the component mounting robot 6 to position the board camera 11 above the board PB so that the board mark provided on the board PB is imaged. . Then, image recognition of the substrate mark is performed from the obtained captured image, and position shift detection from the reference position of the substrate PB is performed.

  After positioning the substrate PB, the control device 40, along with data relating to the type of electronic component Pt to be mounted on the substrate PB and the mounting position on the substrate PB, and the electronic component to be mounted on the substrate PB from now on The price of Pt is read from the RAM 45 (step ST5), and the price of the read electronic component Pt is compared with the reference price read from the RAM 45 (step ST6). Then, it is determined whether or not the price of the electronic component Pt to be mounted on the board PB is higher than the reference price (expensive) (step ST7).

As a result of the determination in step ST7, if the price of the electronic component Pt to be mounted on the board PB is higher (expensive) than the standard price, the electronic component Pt is supplied (the mounting head 8). Is trying to pick up the electronic component Pt), and the tape feeder 5 is fed by one pitch (step ST8), and then the component mounting robot 6 is operated to move the mounting head 8 above the tape feeder 5. The electronic component Pt moved and supplied to the component take-out port 5a is adsorbed by the adsorption nozzle 9 (step ST9). Then, the mounting head 8 is moved so that the sucked electronic component Pt is positioned immediately above the component camera 12, and the component camera 12 performs image recognition (component recognition) of the electronic component Pt. Perform (step ST10). In this electronic component Pt, the electronic component Pt is based on whether there is no abnormality in the electronic component Pt attracted by the mounting head 8, or whether the suction state of the electronic component Pt to the suction nozzle 9 by the mounting head 8 is normal. In the pass / fail determination, if it is determined that the state before the mounting of the electronic component Pt attracted by the mounting head 8 on the substrate PB is good, Based on the obtained image recognition result of the electronic component Pt, position displacement (suction displacement) of the electronic component Pt with respect to the suction nozzle 9 is detected.

  After performing image recognition of the electronic component Pt, the control device 40 moves the mounting head 8 above the substrate PB and separates the electronic component Pt sucked by the suction nozzle 9 at the target mounting position on the substrate PB. The electronic component Pt is mounted on the substrate PB (step ST11). When the electronic component Pt is mounted on the board PB, the control device 40 corrects the positional deviation from the reference position of the board PB obtained at the time of positioning the board PB and the adsorption deviation of the electronic part Pt obtained at the time of component recognition. As described above, the relative position of the suction nozzle 9 with respect to the substrate PB is corrected.

  On the other hand, if the price of the electronic component Pt to be mounted on the board PB is lower than the reference price (inexpensive) in the determination of step ST7, the control device 40 determines that electronic component Pt. The tape feeder 5 to be supplied (the mounting head 8 is about to take out the electronic component Pt) has already been pitch-fed and the electronic component Pt has been supplied to the component pickup port 5a. Is operated to move the mounting head 8 above the tape feeder 5, and the electronic component Pt supplied to the component take-out port 5a is adsorbed to the adsorption nozzle 9 (step ST12). Then, the tape feeder 5 to which the electronic component Pt sucked by the suction nozzle 9 is supplied is fed by one pitch (step ST13), and the sucked electronic component Pt is positioned immediately above the component camera 12. The mounting head 8 is moved so that the component camera 12 images the electronic component Pt to perform image recognition (component recognition) of the electronic component Pt (step ST14).

  Here, the RAM 45 of the electronic component mounting apparatus 1 stores the relationship data between the type and price of the electronic component Pt shown in FIG. 4, and the reference price is set to 100 yen. In such a case, for the tape feeder 5 that supplies the electronic component a and the electronic component b, which are cheaper than 100 yen, after the electronic component Pt is adsorbed by the mounting head 8 (step ST12), it corresponds to one pitch. The pitch feed is performed (step ST13), and the tape feeder 5 that supplies the electronic component c and the electronic component d, which is more expensive than 100 yen, is fed by one pitch (step ST8), and then the mounting head. 8, the electronic component Pt is sucked (step ST9).

  In the image recognition, whether or not the electronic component Pt is mounted on the substrate PB is determined to be good or bad, and the electronic component Pt attracted by the mounting head 8 is determined to be good on the substrate PB. If it is determined that the electronic component Pt is misaligned with respect to the suction nozzle 9 based on the obtained image recognition result of the electronic component Pt (suction displacement), it is the same as in step ST10. .

When the image recognition of the electronic component Pt is completed, the control device 40 moves the mounting head 8 above the substrate PB and separates the electronic component Pt sucked by the suction nozzle 9 at the target mounting position on the substrate PB. The electronic component Pt is mounted on the substrate PB (step ST15). When the electronic component Pt is mounted on the board PB, the control device 40 corrects the positional deviation from the reference position of the board PB obtained when the board PB is positioned and the adsorption deviation of the electronic part Pt obtained when the part is recognized. As described above, the correction of the relative position of the suction nozzle 9 with respect to the substrate PB is performed in the same manner as in step ST11.

  When the mounting process of the electronic component Pt to the substrate PB in step ST11 or step ST15 is completed, the control device 40 puts all the electronic components Pt to be mounted on the substrate PB currently positioned by the transport conveyor 4 on the substrate PB. It is determined whether or not it is attached (step ST16). As a result, when there is an electronic component Pt that is not yet mounted on the substrate PB, the process returns to step ST5, and the electronic component Pt that is not yet mounted on the substrate PB is mounted on the substrate PB. Has been mounted on the board PB, the conveyor 4 is operated to carry the board PB out of the electronic component mounting apparatus 1 (step ST17). Then, it is determined whether or not the mounting of the electronic components Pt on all the planned substrates PB has been completed (step ST18). As a result, the mounting of the electronic components Pt on all the planned substrates PB is performed. Is not completed, the process returns to step ST4 to carry in and position a new board PB. In step ST18, when the mounting of the electronic components Pt on all the planned boards PB is completed, The mounting operation of the electronic component Pt on the substrate PB is completed.

  As described above, the electronic component mounting apparatus 1 according to the present embodiment picks up a component by pitch-feeding the substrate positioning unit (conveyor 4) for positioning the substrate PB and the carrier tape CT containing the electronic component Pt. The tape feeder 5 that intermittently supplies the electronic component Pt to the port 5a, and the electronic component Pt that is attracted by the tape feeder 5 to the component takeout port 5a and positioned by the substrate positioning unit is placed on the substrate PB. A storage unit (RAM 45) having a mounting head 8 to be mounted and storing the price of the electronic component Pt mounted on the substrate PB, and when the mounting head 8 sucks the electronic component Pt, the electronic component Pt Is read from the storage unit and compared with a predetermined reference price. If the price of the electronic component Pt is lower than the reference price, The carrier tape CT is pitch-fed immediately after the magnetic head 8 performs the suction operation of the electronic component Pt, and when the price of the electronic component Pt exceeds the reference price, the mounting head 8 starts the suction operation of the electronic component Pt. A control device 40 is provided as a tape feeder operation control means for operating the tape feeder 5 so that the carrier tape CT is pitched immediately before.

  That is, in the electronic component mounting apparatus 1 in the present embodiment, the price of the electronic component Pt to be mounted on the substrate PB is stored in the storage unit, and when the mounting head 8 sucks the electronic component Pt, the electronic component Pt Is read from the storage unit and compared with a predetermined reference price. If the price of the electronic component Pt is lower than the reference price, the carrier tape immediately after the mounting head 8 performs the suction operation of the electronic component Pt. When CT is pitch-fed and the price of the electronic component Pt exceeds the reference price, the carrier tape CT is pitch-fed immediately before the mounting head 8 starts the suction operation of the electronic component Pt.

  For this reason, the electronic parts Pt that are cheaper (cheap) than the reference price are postponed so-called tact loss, and the electronic parts Pt that are higher (expensive) than the reference price are started after an emergency stop. The financial loss caused by wasteful disposal of the expensive electronic component Pt, which can be caused by feeding the pitch of the carrier tape CT at that time, is suppressed. For this reason, according to the electronic component mounting apparatus 1 in the present embodiment, while preventing tact loss by performing component advance feeding, production is performed while suppressing monetary loss due to wasteful disposal of expensive electronic components Pt. Efficiency can be improved.

  Provided is an electronic component mounting apparatus capable of improving production efficiency by suppressing monetary loss due to wasteful disposal of expensive electronic components while preventing tact loss by performing part advance. .

1 Electronic component mounting device 4 Conveyor (board positioning part)
5 Tape Feeder 5a Parts Extracting Port 8 Mounting Head 40 Control Device (Tape Feeder Operation Control Unit)
45 RAM (storage unit)
PB substrate CT Carrier tape Pt Electronic component

Claims (1)

A substrate positioning unit for positioning a substrate, a tape feeder that pitch-feeds a carrier tape containing electronic components and intermittently supplies electronic components to the component extraction port, and an electronic component that is supplied to the component extraction port by the tape feeder An electronic component mounting apparatus comprising a mounting head for adsorbing and mounting an electronic component on a substrate positioned by a substrate positioning unit,
A storage unit storing the price of electronic components mounted on the board;
When the mounting head picks up an electronic component, the price of the electronic component is read from the storage unit and compared with a predetermined standard price. If the price of the electronic component is lower than the standard price, the mounting head The carrier tape is pitched immediately after the component suction operation is performed, and if the price of the electronic component exceeds the reference price, the carrier tape is pitched immediately before the mounting head starts the electronic component suction operation. An electronic component mounting apparatus comprising a tape feeder operation control means for operating the tape feeder as described above.

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