JP4922747B2 - 荷電粒子ビーム装置 - Google Patents
荷電粒子ビーム装置 Download PDFInfo
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- JP4922747B2 JP4922747B2 JP2006341754A JP2006341754A JP4922747B2 JP 4922747 B2 JP4922747 B2 JP 4922747B2 JP 2006341754 A JP2006341754 A JP 2006341754A JP 2006341754 A JP2006341754 A JP 2006341754A JP 4922747 B2 JP4922747 B2 JP 4922747B2
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- deflector
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- 239000002245 particle Substances 0.000 title claims description 32
- 230000004075 alteration Effects 0.000 claims description 102
- 230000009467 reduction Effects 0.000 claims description 32
- 206010073261 Ovarian theca cell tumour Diseases 0.000 claims description 7
- 208000001644 thecoma Diseases 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 description 33
- 206010010071 Coma Diseases 0.000 description 29
- 238000009826 distribution Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 17
- 230000003287 optical effect Effects 0.000 description 14
- 230000014509 gene expression Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 201000009310 astigmatism Diseases 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/153—Correcting image defects, e.g. stigmators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
arg(ui3/ui2)<arg(ui3/ui2)+θ<−arg(ui3/ui2)
すなわち、0<θ<2arg(ui2/ui3)である(arg(ui2/ui3)=−arg(ui3/ui2))。このとき、第3の偏向器10の、第2の偏向器7に対する回転の向きは、レンズ磁場により電子ビーム9の軌道が回転する向きに一致する。また、θ=arg(ui2/ui3)のとき、|Ui|は最大となる。
arg(ui3/ui2)>arg(ui3/ui2)+θ>−arg(ui3/ui2)
すなわち、0>θ>2arg(ui2/ui3)となる。
2 電子ビーム源
3 像
4 対物レンズ
5 像
6 材料
7 第2の偏向器
8 第1の偏向器
9 電子ビーム
10 第3の偏向器
Claims (3)
- 荷電粒子ビームを発生する荷電粒子ビーム源と、前記荷電粒子ビーム源からの荷電粒子ビームの寸法を縮小する縮小レンズと、前記縮小レンズによって寸法が縮小された荷電粒子ビームを被ビーム照射物の表面に集束する対物レンズと、前記縮小レンズの前段或いは前記対物レンズの物面近傍に配置される第1の偏向器と、前記対物レンズのレンズ場に対し、自らの発生する偏向場の全て、あるいはその一部が重なるように配置される第2の偏向器と、前記第2の偏向器の後段に配置される第3の偏向器とを備えた荷電粒子ビーム装置において、
前記第1の偏向器のコマ収差係数(複素数)をL 1 、前記第2の偏向器のコマ収差係数(複素数)をL 2 、前記第1の偏向器の色収差係数(複素数)をC 1 、前記第2の偏向器の色収差係数(複素数)をC 2 、前記第3の偏向器の前記第2の偏向器に対する偏向電極の回転角を零にした状態の第3の偏向器のコマ収差係数(複素数)をL 3 、前記状態の前記第3の偏向器の色収差係数(複素数)をC 3 、
前記第2の偏向器に単位偏向電圧を印加したときの前記対物レンズ像面におけるビーム入射位置(複素数)をu i2 、
前記第3の偏向器の前記第2の偏向器に対する偏向電極の回転角を零にした状態で前記第3の偏向器に単位偏向電圧を印加したときの前記対物レンズ像面におけるビーム入射位置(複素数)をu i3 としたとき、
前記第3の偏向器を前記第2の偏向器に対して角度θだけ回転させ、該角度θを
θ=arg((L 1 C 2 −L 2 C 1 )/(L 3 C 1 −L 1 C 3 ))としたとき、
前記対物レンズのレンズ場により前記荷電粒子ビームの軌道が回転する向きが右回りの場合、
0<θ<2arg(u i2 /u i3 )
の条件を満たし、または、
前記対物レンズのレンズ場により前記荷電粒子ビームの軌道が回転する向きが左回りの場合、
0>θ>2arg(u i2 /u i3 )
の条件を満たすことを特徴とする荷電粒子ビーム装置。 - 前記第2の偏向器及び前記第3の偏向器に同一の偏向信号を入力することを特徴とする請求項1記載の荷電粒子ビーム装置。
- 前記第1の偏向器、前記第2の偏向器及び前記第3の偏向器に同一の偏向信号を入力することを特徴とする請求項1記載の荷電粒子ビーム装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006341754A JP4922747B2 (ja) | 2006-12-19 | 2006-12-19 | 荷電粒子ビーム装置 |
US11/959,966 US7820978B2 (en) | 2006-12-19 | 2007-12-19 | Charged-particle beam system |
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Application Number | Priority Date | Filing Date | Title |
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JP2006341754A JP4922747B2 (ja) | 2006-12-19 | 2006-12-19 | 荷電粒子ビーム装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008153131A JP2008153131A (ja) | 2008-07-03 |
JP4922747B2 true JP4922747B2 (ja) | 2012-04-25 |
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JP2006341754A Active JP4922747B2 (ja) | 2006-12-19 | 2006-12-19 | 荷電粒子ビーム装置 |
Country Status (2)
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US (1) | US7820978B2 (ja) |
JP (1) | JP4922747B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4822848B2 (ja) * | 2006-01-11 | 2011-11-24 | 日本電子株式会社 | 荷電粒子ビーム装置 |
JP5107812B2 (ja) * | 2008-07-08 | 2012-12-26 | 株式会社日立ハイテクノロジーズ | 検査装置 |
US8101911B2 (en) * | 2008-11-04 | 2012-01-24 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Method and device for improved alignment of a high brightness charged particle gun |
DE102010053194A1 (de) * | 2010-12-03 | 2012-06-06 | Carl Zeiss Nts Gmbh | Teilchenstrahlgerät mit Ablenksystem |
JP5836773B2 (ja) * | 2011-11-25 | 2015-12-24 | キヤノン株式会社 | 描画装置、及び物品の製造方法 |
US10090131B2 (en) | 2016-12-07 | 2018-10-02 | Kla-Tencor Corporation | Method and system for aberration correction in an electron beam system |
JP7531067B2 (ja) | 2021-12-07 | 2024-08-08 | 株式会社日立ハイテク | 多極子レンズおよび荷電粒子線装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853466B2 (ja) * | 1977-12-15 | 1983-11-29 | 理化学研究所 | 荷電粒子ビ−ム集束偏向装置 |
JPS5983336A (ja) * | 1982-11-02 | 1984-05-14 | Jeol Ltd | 荷電粒子線集束偏向装置 |
JPH06224108A (ja) * | 1993-01-26 | 1994-08-12 | Fujitsu Ltd | 電子ビーム露光装置及び電子ビーム露光方法 |
JPH09223475A (ja) * | 1996-02-19 | 1997-08-26 | Nikon Corp | 電磁偏向器、及び該偏向器を用いた荷電粒子線転写装置 |
JP3772067B2 (ja) * | 2000-03-30 | 2006-05-10 | 株式会社東芝 | 荷電粒子ビーム照射装置 |
JP4316394B2 (ja) * | 2004-01-21 | 2009-08-19 | 株式会社東芝 | 荷電ビーム装置 |
JP4822848B2 (ja) | 2006-01-11 | 2011-11-24 | 日本電子株式会社 | 荷電粒子ビーム装置 |
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2006
- 2006-12-19 JP JP2006341754A patent/JP4922747B2/ja active Active
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2007
- 2007-12-19 US US11/959,966 patent/US7820978B2/en active Active
Also Published As
Publication number | Publication date |
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US20080142723A1 (en) | 2008-06-19 |
US7820978B2 (en) | 2010-10-26 |
JP2008153131A (ja) | 2008-07-03 |
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