JP4918351B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for performing a solder bump shaping process on a substrate provided with solder bumps.

  As a conventional substrate processing apparatus, there is an apparatus that performs metal bump shaping by press shaping on a substrate provided with metal bumps (for example, Patent Document 1).

  After the shaping of the bumps, an inspection regarding the state (shape or the like) of the shaped bumps is performed based on the captured image or the like. The inspection device for inspecting the state of the bump after shaping and the shaping device for performing the bump shaping have separate device configurations, and the substrate is transferred between these devices manually.

Further, when a shaping defect or the like is found by inspection of the bump after shaping, the substrate is manually set on the shaping device, and the shaping process for the substrate is performed again.
JP 2003-133369 A

  However, in the above-described conventional apparatus configuration, since the substrate is manually transported between the shaping device and the inspection device, it is time-consuming to manually transport the substrate and the processing efficiency is poor. In particular, when a defective shaping of the bump is found in the inspection device, it is necessary to manually set the substrate again on the shaping device and cause the shaping device for the substrate to perform shaping processing, which greatly reduces the efficiency. In addition, the conventional apparatus configuration is inefficient in terms of apparatus introduction cost and installation space.

  Accordingly, the problem to be solved by the present invention is that the bump shaping process and the inspection process regarding the state of the bump after shaping can be performed quickly and efficiently in a series of steps including the re-shaping process performed when the bump shaping defect occurs. At the same time, it is to provide a substrate processing apparatus that can improve efficiency in terms of equipment cost, installation area, and the like, and can reduce the labor of an operator.

In order to solve the above-mentioned problems, the invention according to claim 1 is a substrate processing apparatus for performing a solder bump shaping process on a substrate provided with a solder bump, and for shaping the solder bump applied to the substrate. An inspection unit that inspects the state of the solder bump after shaping by the bump shaping unit based on a captured image by the imaging device, and a conveyance mechanism that conveys the substrate between the bump shaping unit and the image inspection unit A control unit configured to return a substrate, which has been determined to be poorly shaped solder bumps, to the bump shaping unit by the transport mechanism and to cause the solder bump shaping unit to reshape the solder bumps on the substrate. The bump shaping unit includes at least one shaping roller, and the shaping roller is pressed against a solder bump applied to the substrate. The pressure portion is provided at both ends of the pressing portion in the rotation axis direction, and has an outer diameter larger than the outer diameter of the pressing portion by a predetermined dimension, and is pressed against a region where no solder bump is provided on the surface of the substrate. And a buttock to be provided .
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the bump shaping unit performs a roller process on the solder bump by the shaping roller in a plurality of directions.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect of the present invention, the transport mechanism has a substrate set portion on which a substrate is set, and is set on the substrate set portion. A turntable is provided that rotates and conveys the substrate between the bump shaping unit and the inspection unit, the bump shaping unit smoothes a curved upper portion of the solder bump, and the inspection unit Inspect the appearance shape or height .

  According to the first to third aspects of the present invention, the bump shaping process and the inspection process relating to the state of the bump after shaping are performed quickly and efficiently in a series of steps including the re-shaping process performed when the bump shaping defect occurs. In addition to being able to do this, it is possible to improve efficiency in terms of equipment cost, installation area, etc., and to reduce the labor of the operator.

According to the invention described in claim 3 , by using the turntable, it is possible to carry the substrate between the bump shaping unit and the inspection unit with a simple configuration. Further, when the bump shaping failure occurs, the substrate can be returned smoothly and easily from the inspection unit to the bump shaping unit.

  FIG. 1 is a plan view schematically showing a configuration of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 1 includes a bump shaping unit 11, an inspection unit 12, an air blow unit 13, a transport mechanism 14, and a control unit 15, and a solder bump 21 (see FIG. 3). ) Is applied to the substrate 22 to which () is applied.

  The transport mechanism 14 includes tray transport mechanisms 31 to 33, a turntable 34, a substrate transfer mechanism 35, and two robot arms 36 and 37.

  The tray transport mechanisms 31 to 33 transport the substrate tray 23 in which a plurality of substrates 22 are accommodated in the directions indicated by arrows A1 to A4.

  The turntable 34 is provided with a plurality of (for example, four) substrate setting portions 34a on the upper surface side thereof at intervals in the circumferential direction. A plurality of (for example, four) substrates 22 are arranged (set) in a planar manner (for example, in a matrix of a plurality of rows and a plurality of columns) in each substrate setting portion 34a. The turntable 34 is rotationally driven in the direction of arrow A5, so that the substrate 22 set on the substrate setting portion 34a is transferred to the bump shaping portion 11, the inspection portion 12, and the air blow portion 13 in the order described here. It is supposed to be sent.

  Further, the turntable 34 can be moved in two axial directions (xy directions) parallel to the substrate 22 set on the turntable 34 in order to adjust the position of the substrate 22 in the bump shaping unit 11 and the like which will be described later. It may be.

  The substrate transfer mechanism 35 moves the substrate transfer unit 35a back and forth in the direction indicated by arrow A6 and in the opposite direction, while moving the substrate 22 set in the substrate transfer unit 35a outside the turntable 34 to the arrow A6. As shown in FIG. 4, the substrate is transferred to the substrate setting unit 34a on the turntable 34. The substrate 22 is transferred by the substrate transfer mechanism 35 in units of a plurality of (for example, four) substrates 22, for example.

  The robot arm 36 takes out the substrate 22 from the substrate tray 23 on the tray transfer mechanism 32 and sets the substrate 22 on the substrate transfer portion 35a of the substrate transfer mechanism 35 outside the turntable 34, as indicated by an arrow A7. .

  The robot arm 36 takes out the substrate 22 from the substrate setting portion 34a of the turntable 34 and stores the substrate 22 in the substrate tray 23 on the tray transport mechanism 32, as indicated by an arrow A8.

  As shown in FIGS. 2 and 3, the bump shaping unit 11 includes at least one (for example, plural) shaping rollers 41 that press the solder bumps 21 of the substrate 22 to shape the solder bumps 21 into a substantially flat shape. It is configured. The shaping roller 41 includes a pressing portion 41a that is pressed by the solder bump 21 and a flange portion 41b that is provided at both ends of the pressing portion 41a in the rotation axis direction. The flange portion 41b has an outer diameter larger than the outer diameter of the pressing portion 41a, and the flange portion 41b is pressed against a region (for example, an outer edge portion) on the surface of the substrate 22 where the solder bumps 21 are not provided. Thus, the solder bump 21 is shaped by the pressing portion 41a. That is, the outer diameter (radius) of the pressing portion 41a is set smaller than the outer diameter (radius) of the flange portion 41b by a predetermined dimension D, and the protrusion of the solder bump 21 from the surface of the substrate 22 after shaping by this dimension D. Height is specified. By this shaping process, the curved upper portion of the solder bump 21 is pressed and smoothed (flattened) by the shaping roller 41, and the shape of the solder bump 21 is shaped from the shape shown in FIG. 3 to the shape shown in FIG. Is done.

In the bump shaping unit 11 according to the present embodiment, for example, two shaping rollers 41 are arranged on the substrate setting unit 34a of the turntable 34 so as to correspond to the four substrates 22 arranged in a matrix of 2 rows and 2 columns. They are arranged in parallel corresponding to 22 rows or columns of matrix arrangement. Then, the two shaping rollers 41 perform roller processing on the four substrates 22 arranged in a matrix in the column direction and the row direction of the matrix.

  At the time of the bump shaping process, as shown in FIG. 3, the shaping roller 41 is set so that the flange 41b passes through the area on the surface of the substrate 22 where the solder bump 21 is not provided (for example, the outer edge). Is done. Then, while the shaping roller 41 is rotated in the direction of the arrow A11, the substrate 22 and the shaping roller 41 are relatively moved in the direction of the arrow A12, whereby the solder bump 21 is pressed by the pressing portion 41a of the shaping roller 41 and is substantially omitted. It is shaped into a flat shape. The relative movement between the substrate 22 and the shaping roller 41 may be configured such that the shaping roller 41 is moved relative to the substrate 22, and conversely, the turntable 34 on which the substrate 22 is set with respect to the shaping roller 41. It is good also as a structure which moves.

  In such roller processing by the shaping roller 41, distortion of the solder bump 21 after shaping may occur in accordance with the direction of the roller processing. Therefore, in this embodiment, as shown in FIG. 4, the roller processing is performed in four directions as indicated by arrows A14a to A14d while changing the direction of the shaping roller 41 with respect to the substrate 22 as indicated by the arrow A13. Thus, the distortion of the solder bump 21 after shaping is reduced. In this embodiment, the roller processing is performed in the four directions indicated by the arrows A14a to A14d. However, the roller processing is performed in any one of these four directions, two directions, or three directions. Also good. Further, in this embodiment, by changing the direction of the shaping roller 41, the roller processing in the four directions indicated by the arrows A14a to A14d is performed by one shaping roller 41. However, the direction of the shaping roller 41 is changed. Instead, two shaping rollers 41 having different directions are provided, and roller processing in the directions indicated by arrows A14a and A14b and roller processing in the directions indicated by arrows A14c and A14d are performed using separate shaping rollers 41. May be.

  In the bump shaping unit 11 according to the present embodiment, the bump shaping process for the substrate 22 can be performed at the two rotational positions Pr1 and Pr2 of the turntable 34. In this case, for example, the roller processing for the substrate 22 is performed in the direction indicated by arrows A14a and 14b in FIG. 4 at the rotational position Pr1, and the roller processing for the substrate 22 is performed in the direction indicated by arrows A14c and 14d in FIG. You may do it. Alternatively, as a modification of the configuration shown in FIG. 1, the bump shaping process may be performed only on one of the rotational positions Pr1 and Pr2, and the process other than the bump shaping process may be performed on the other rotational position Pr1 and Pr2. .

  As illustrated in FIG. 5, the inspection unit 12 includes a light source unit 51, an image sensor (for example, a CCD or MOS image sensor) 52, first and second beam splitters 53 and 54, and first and second. Lens units 55 and 56, and a mirror member 57. In the inspection unit 12, irradiation light (for example, white light, ultraviolet light, etc.) emitted from the light source unit 51 is reflected (for example, reflected at a right angle) toward the substrate 22 by the second beam splitter 54, and The light enters the first beam splitter 53 through one lens unit (for example, objective lens unit) 55. Part of the irradiation light incident on the first beam splitter 53 passes through the beam splitter 53 and is irradiated on the region where the solder bumps 21 of the substrate 22 are provided, while the irradiation light incident on the first beam splitter 53 The remaining portion is reflected toward the mirror member 57 by the beam splitter 53 (for example, reflected at a right angle) and enters the mirror member 57.

  A part of the irradiation light irradiated on the substrate 22 is reflected on the surface of the substrate 22, and the first beam splitter 53, the first lens unit 55, the second beam splitter 54, and the second beam are reflected as the first reflected light. Through the lens unit (for example, an image lens unit) 56 and enters the image sensor 52. At this time, if the positional relationship among the lens system (55, 56), the image sensor 52, and the substrate 22 is consistent with the imaging conditions of the lens system (55, 56), the light received by the image sensor 52 by the first reflected light. An image related to the state of the surface of the substrate 22 is formed on the surface. Further, a part of the irradiation light incident on the mirror member 57 is reflected (for example, reflected at a right angle) by the first beam splitter 53 toward the image sensor 52 as second reflected light, and the second beam splitter. 54 and a second lens unit (for example, an image lens unit) 56, and enter the image sensor 52.

  The first and second reflected lights incident on the image sensor 52 have different optical path lengths from the light source unit 51 to the image sensor 52 after being emitted from the light source unit 51. Interference of reflected light occurs. Further, the optical path length from the light source unit 51 of the first reflected light to the image sensor 52 via the surface of the substrate 22 is due to the uneven shape on the surface of the substrate 22 (particularly, the uneven shape due to the solder bumps 21). It depends on which part of the surface is reflected. As a result, an interference pattern of the first and second reflected lights related to the uneven shape on the surface of the substrate 22 is generated on the light receiving surface of the image sensor 52.

  In addition, since at least a part of the lens elements (in the present embodiment, the first lens unit 55) of the first and second lens units 55 and 56 makes the focal length of the lens system variable, the arrow 20 As shown in the figure, the light beam is driven along the optical path of the irradiation light and the reflected light. Further, the movable lens element is provided with a sensor for detecting the position thereof, so that the position of the movable lens element can be detected.

  When the movable lens element (in this embodiment, the first lens unit 55) is driven along the optical path, the state of the interference pattern of the first and second reflected lights generated on the light receiving surface of the image sensor 52 However, the state is changed so that the focused state and the out-of-focus state are repeated. Therefore, the three-dimensional shape of the surface of the substrate 22 (solder bump 21) can be known by using the captured image and the position information of the movable lens element.

  With such a configuration, the inspection unit 12 performs imaging with the imaging element 22 while driving the movable lens element (in the present embodiment, the first lens unit 55) along the optical path, and the captured image. The surface of the substrate 22 (solder bump 21) on the basis of a plurality of captured images extracted from the above-described in-focus images (highly focused) and position information of movable lens elements corresponding to the plurality of captured images. ) Is acquired. Based on the information obtained thereby, the suitability of the three-dimensional shape of the solder bump 21 (for example, the height and shape of the shaped bump 21) is inspected. Information processing necessary for the control of the inspection unit 12, acquisition of information regarding the three-dimensional shape of the solder bumps 21, and determination of suitability is performed by the control unit 15 or the control unit provided in the inspection unit 12.

  The inspection unit 12 can use a three-dimensional imaging method using a confocal microscope or an interference microscope as described above.

  The air blower 13 removes foreign matter adhering to the substrate 22 and the like by blowing air onto the substrate 22.

  The control unit 15 controls the bump shaping unit 11, the inspection unit 12, the air blow unit 13, and the transport mechanism 14 in an integrated manner, and operates the functional elements provided in the substrate processing apparatus 1 according to the processing procedure. ing.

  As the control operation by the control unit 15, the following points should be noted. That is, as a result of the inspection by the inspection unit 12 on the four substrates 22 set on the substrate setting unit 34a, it is determined that the solder bump 21 is not well shaped (for example, the height of the bump 21 after shaping is larger than a specified value). When the four substrates 22 are included in the four substrates 22, the four substrates 22 are sent again to the bump shaping unit 11 by the turntable 34, and the bump shaping process for these substrates 22 is performed again. It is like that.

  Below, the processing procedure of this substrate processing apparatus 1 performed by control of this control part 15 is demonstrated in detail.

  When the substrate tray 23 is transferred from the predetermined tray carry-in position to the substrate take-out position P1 by the tray transfer mechanisms 31 and 32, the substrate 22 is moved from the substrate tray 23 by the robot arm 36 at the substrate take-out position P1. The substrate is taken out and set in the substrate transfer part 35 a of the substrate transfer mechanism 35 that is retracted out of the turntable 34. When the four substrates 22 are set in the substrate transfer unit 35a, the substrates 22 are set in the substrate setting unit 43a of the turntable 34 by the substrate transfer unit 35a as indicated by an arrow A6.

  The substrate 22 set on the substrate setting unit 34a is sent to the bump shaping unit 11 by the turntable 34 and subjected to bump shaping processing as described above. Subsequently, the substrate 22 is sent to the inspection unit 12 by the turntable 34, and the suitability of the three-dimensional shape of the shaped solder bump 21 is inspected as described above.

  As a result of the inspection by the inspection unit 12, when it is determined that the bump shaping process is normally performed for the four substrates 22 in the substrate setting unit 34 a, the substrates 22 are connected to the air blow unit by the turntable 34. 13 is removed from the turntable 34 by the robot arm 37 after the foreign matter is removed by air discharge. The taken-out substrate 22 is inserted into the substrate tray 23 being conveyed from the substrate removal position P1 to the substrate accommodation position P2 by the tray conveyance mechanism 32. The substrate tray 23 into which the substrate 22 is inserted is transported to a predetermined tray unloading position by the tray transport mechanisms 32 and 33.

  On the other hand, as a result of the inspection by the inspection unit 12, if any of the four substrates 22 in the substrate setting unit 34 a is determined to be defective in bump shaping, the turntable 34 is rotated and the substrates 22 are rotated. When the robot arm 37 arrives at the take-out position, the four substrates 22 including the substrate 22 with poorly shaped bumps are not taken out by the robot arm 37 and sent again to the bump shaping unit 11 to perform bump shaping processing. It is to be given. When the re-bump shaping process is completed, the substrates 22 are sent again to the inspection unit 12, and re-inspection is performed for the presence or absence of bump shaping defects.

  As a result of this re-inspection, when the bump shaping defect is eliminated, the substrates 22 are taken out from the turntable 34 by the robot arm 37 and placed on the substrate tray 23 in the same manner as the normal substrates 22 described above. Inserted. Further, as a processing operation when it is determined again as a defective bump shaping as a result of the re-examination, a configuration in which the bump shaping process is performed again on those substrates 22 or a substrate 22 determined as a defective bump shaping again is used as the defective substrate 22. For example, a configuration for sorting from the normal substrate 22 can be adopted.

  As processing when the four substrates 22 including the substrate 22 determined to be defective in shaping the bumps pass through the air blowing unit 13, an air blowing process may be performed or an air blowing process may not be performed. .

  As described above, according to the present embodiment, the bump shaping process and the inspection process regarding the state of the bump after shaping can be quickly and efficiently performed in a series of steps including the re-shaping process performed when the bump shaping defect occurs. In addition, it is possible to improve efficiency in terms of equipment cost, installation area, etc., and to reduce the labor of the operator.

  Further, by using the turntable 34, it is possible to carry the substrate between the bump shaping unit 11 and the inspection unit 12 with a simple configuration. In addition, when the bump shaping failure occurs, the substrate 22 can be returned from the inspection unit 12 to the bump shaping unit 11 smoothly and easily.

  Hereinafter, modified examples of the configuration according to the above-described embodiment will be described.

  FIG. 6 is a diagram showing a modification of the bump shaping unit 11 shown in FIGS. In the bump shaping unit 11a according to this modification, as shown in FIG. 6, the bump shaping process is performed using the press head 61 instead of the above-described shaping roller 41. The press head 61 incorporates a heater (not shown) for heating the press head 61 so that the solder bump 21 can be easily shaped. And by pressing the area | region in which the solder bump 21 of the board | substrate 22 is provided with the press head 61 as shown by arrow A21, the solder bump 21 is shape | molded by the substantially flat shape.

  Further, the press head 61 is rotatable around the vertical axis as indicated by an arrow A22. Then, the direction is changed so that the predetermined direction indicated by the arrow 62 of the press head 61 is directed to the directions of 0 °, 90 °, 180 ° and 270 ° as indicated by the arrows A23a to A24a. The press process is performed a plurality of times (for example, four times). As a result, the influence of the temperature deviation of the press surface of the press head 61 is reduced. The number of presses is not limited to four times of 0 °, 90 °, 180 °, and 270 °, and may be two times of, for example, 0 ° and 90 °, or may be only once of 0 °.

  In the above-described embodiment, the substrate 22 is transported between the bump shaping unit 11 and the inspection unit 12 using the turntable 34. However, the substrate 22 is not limited to the turntable 34, and a transport conveyor (for example, a belt). You may employ | adopt other conveyance mechanisms, such as a conveyor and a robot arm.

Moreover, the conveyance conveyor which has an endless track | orbit which goes through via the bump shaping part 11 and the test | inspection part 12 may be provided, and the bump shaping part 11 and the test | inspection part 12 may be installed along the track | orbit of the conveyance conveyor. In this case, until the solder bumps 21 of the substrate 22 is shaped into a predetermined shape, so as to reciprocate the inspection unit 12 and the bump shaping unit 11, the solder bump the endless track substrate 22 is moved, in a predetermined shape 21 After being shaped, it may be transported so as to be taken out from the endless track.

It is a top view which shows typically the structure of the substrate processing apparatus which concerns on one Embodiment of this invention. It is the front view and side view of the shaping roller with which a bump shaping part is equipped. It is explanatory drawing at the time of shaping of the bump by the shaping roller of FIG. It is explanatory drawing at the time of shaping of the bump by the shaping roller of FIG. It is a figure which shows the structure of a test | inspection part typically. It is a figure which shows the modification of a bump shaping part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 11, 11a Bump shaping part, 12 Inspection part, 13 Air blow part, 14 Conveyance mechanism, 15 Control part, 21 Solder bump, 22 Substrate, 23 Substrate tray, 31-33 Tray conveyance mechanism, 34 Turntable, 34a Substrate setting unit, 35 Substrate transfer mechanism, 36, 37 Robot arm, 41 Shaping roller, 61 Press head.

Claims (3)

A substrate processing apparatus for performing a solder bump shaping process on a substrate provided with a solder bump,
A bump shaping section for shaping a solder bump applied to the substrate;
An inspection unit that inspects the state of the solder bump after shaping by the bump shaping unit based on a captured image by the imaging element;
A transport mechanism for transporting the substrate between the bump shaping section and the image inspection section;
As a result of the inspection by the inspection unit, a control unit that returns the substrate determined to be poorly shaped solder bumps to the bump shaping unit by the transport mechanism, and causes the solder bump shaping unit to reshape the solder bumps on the substrate;
Equipped with a,
The bump shaping section includes at least one shaping roller,
The shaping roller is
A pressing portion pressed against a solder bump applied to the substrate;
A flange that is provided at both ends in the rotation axis direction of the pressing portion, has an outer diameter that is larger than the outer diameter of the pressing portion by a predetermined dimension, and is pressed against a region on the surface of the substrate where no solder bump is provided. ,
Substrate processing apparatus, characterized in that it comprises a. The substrate processing apparatus according to claim 1,
The said bump shaping part performs the roller process with respect to the said solder bump by the said shaping roller about several directions, The board | substrate processing apparatus characterized by the above-mentioned . In the substrate processing apparatus of Claim 1 or Claim 2,
The transport mechanism is
A substrate set unit on which a substrate is set, and a turntable that conveys the substrate set in the substrate set unit between the bump shaping unit and the inspection unit by rotating;
The bump shaping part smoothes the curved upper part of the solder bump,
The substrate processing apparatus, wherein the inspection unit inspects the appearance shape or height of the solder bump.

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