JP4979288B2 - 熱圧着ヘッドを用いた実装方法 - Google Patents
熱圧着ヘッドを用いた実装方法 Download PDFInfo
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- JP4979288B2 JP4979288B2 JP2006197275A JP2006197275A JP4979288B2 JP 4979288 B2 JP4979288 B2 JP 4979288B2 JP 2006197275 A JP2006197275 A JP 2006197275A JP 2006197275 A JP2006197275 A JP 2006197275A JP 4979288 B2 JP4979288 B2 JP 4979288B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
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Description
このような電気部品を導電性接着剤等を用いてフリップチップ実装する場合、通常は金属・セラミック等の硬質の圧着ヘッドを用いて熱圧着することが行われている。
このような弾性部材を圧着ヘッドとして用いた場合、高さの異なる複数の電気部品の圧着が可能になるとともに、ICチップの他に抵抗器・コンデンサ等の異なる種類の電子部品を同時に一括に圧着することができるというメリットがある(例えば特許文献1参照)。
一方、上述した弾性体からなる圧着ヘッドを用いた場合には、熱圧着の際に圧着ヘッド側からの加熱が十分でないことから実装に長時間を要するという問題がある。
請求項2記載の発明は、請求項1記載の発明において、前記弾性圧着部材の前記金属押圧部の周囲の部分がテーパ状に形成されており、当該テーパ部によって前記電気部品の側部領域近傍の接着剤を当該側部領域に向って押圧するものである。
また、図2(a)(b)は、同熱圧着ヘッドの押圧面と電気部品の頂部領域の寸法関係を示す説明図である。
これらのうち、異方導電性接着剤は、接続信頼性を向上させる観点から、より好ましいものである。
なお、異方導電性接着剤としては、フィルム状、ペースト状のいずれも使用することができる。
そして、ヘッド本体5の凹部5aの電気部品20に対応する位置(例えば中央部分)には、後述する金属押圧部5bが例えば一体成形によりヘッド本体5と一体的に設けられている。
また、弾性圧着部材7は、金属押圧部5bの周囲において金属押圧部5の押圧面50が凹んだ状態で露出するように装着されている。
この金属押圧部5bは、例えば四角柱状に形成され、その先端部には矩形平面状の押圧面50が形成されている。
すなわち、弾性圧着部材7の開口壁面部分に所定の角度のテーパ部7aを形成し、弾性圧着部材7の押圧面50上の開口部8を電気部品20の頂部領域21の大きさより大きくすることが好ましい。
図3(a)に示すように、まず、本実施の形態では、基台2上に載置された配線基板10の実装領域に接着剤30を配置し、さらにこの接着剤30上の所定の位置に電気部品20を配置する。
そして、図示しない保護フィルムを電気部品20上に配置し、所定の条件で仮圧着(位置決め)を行った後、図3(b)に示すように、ヘッド本体5を下降させ、本圧着として、電気部品20に対して所定時間加熱加圧を行う。
また、図4(b)に示すように、弾性圧着部材7のテーパ部7aの表面によって電気部品20の周囲の接着剤30のフィレット部30fが電気部品20の側部領域22側に向って押圧される。
そして、これにより、図3(c)に示すように、接着剤30のフィレット部30fが十分に押圧された状態で電気部品20が配線基板10上に実装される。
例えば、上述の実施の形態においては、ヘッド本体に金属押圧部を一つ設けて一つの電気部品に対して熱圧着を行うようにしたが、本発明はこれに限られず、ヘッド本体に金属押圧部を複数設け、複数の電気部品を同時に熱圧着することもできる。
さらに、本発明は、ICチップ、コンデンサ等の種々の電気部品に適用することができるものである。
2…基台
3…熱圧着ヘッド
5…ヘッド本体
5a…凹部
5b…金属押圧部
6…ヒーター
7…弾性圧着部材
7a…テーパ部
8…開口部
10…配線基板
20…電気部品
21…頂部領域(被押圧面)
30…接着剤
30f…フィレット部
50…押圧面
Claims (2)
- 加熱可能な金属製のヘッド本体にエラストマーからなる弾性圧着部材を有する熱圧着ヘッドを用いて配線基板上に電気部品を実装する方法であって、
前記配線基板上の実装領域に接着剤を配置した後、前記電気部品を前記実装領域に配置し、前記熱圧着ヘッドを用いて前記電気部品を前記配線基板上に熱圧着する工程を有し、
当該熱圧着の際、前記電気部品の頂部領域を前記ヘッド本体の金属部分によって押圧する一方、前記電気部品の側部領域近傍の接着剤を前記弾性圧着部材によって押圧する実装方法。 - 前記弾性圧着部材の前記金属押圧部の周囲の部分がテーパ状に形成されており、当該テーパ部によって前記電気部品の側部領域近傍の接着剤を当該側部領域に向って押圧する請求項1記載の熱圧着ヘッドを用いた実装方法。
Priority Applications (8)
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JP2006197275A JP4979288B2 (ja) | 2006-07-19 | 2006-07-19 | 熱圧着ヘッドを用いた実装方法 |
PCT/JP2007/064184 WO2008010516A1 (en) | 2006-07-19 | 2007-07-18 | Mounting method using thermocompression head |
US12/374,240 US8114243B2 (en) | 2006-07-19 | 2007-07-18 | Mounting method using thermocompression head |
KR1020097000771A KR101034166B1 (ko) | 2006-07-19 | 2007-07-18 | 열압착 헤드를 사용한 실장 방법 |
CN2007800273967A CN101490831B (zh) | 2006-07-19 | 2007-07-18 | 采用热压接头的安装方法 |
EP07790938A EP2043142B1 (en) | 2006-07-19 | 2007-07-18 | Mounting method using thermocompression head |
TW096126279A TWI411053B (zh) | 2006-07-19 | 2007-07-19 | 使用熱壓接頭之構裝方法 |
HK09110668.1A HK1133738A1 (en) | 2006-07-19 | 2009-11-13 | Mounting method using thermocompression head |
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JP2006197275A JP4979288B2 (ja) | 2006-07-19 | 2006-07-19 | 熱圧着ヘッドを用いた実装方法 |
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JP4979288B2 true JP4979288B2 (ja) | 2012-07-18 |
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US (1) | US8114243B2 (ja) |
EP (1) | EP2043142B1 (ja) |
JP (1) | JP4979288B2 (ja) |
KR (1) | KR101034166B1 (ja) |
CN (1) | CN101490831B (ja) |
HK (1) | HK1133738A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101689516B (zh) | 2007-06-28 | 2011-09-14 | 松下电器产业株式会社 | 半导体元件的安装构造体的制造方法及加压工具 |
JP2011009357A (ja) * | 2009-06-24 | 2011-01-13 | Fujitsu Ltd | 実装装置 |
JP5608545B2 (ja) * | 2010-12-24 | 2014-10-15 | デクセリアルズ株式会社 | 熱圧着ヘッド、実装装置及び実装方法 |
JP2013191669A (ja) * | 2012-03-13 | 2013-09-26 | Shinkawa Ltd | 電子部品実装ツール |
US9093549B2 (en) * | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
US20150262966A1 (en) * | 2014-03-15 | 2015-09-17 | Dong Guan Cowell Optic Electronics Limited | Method and apparatus for bonding a semiconductor device or component to a substrate |
GB2525605B (en) * | 2014-04-28 | 2018-10-24 | Flexenable Ltd | Method of bonding flexible printed circuits |
DE102014114097B4 (de) | 2014-09-29 | 2017-06-01 | Danfoss Silicon Power Gmbh | Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe |
DE102014114095B4 (de) * | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Sintervorrichtung |
DE102014114093B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
DE102014114096A1 (de) | 2014-09-29 | 2016-03-31 | Danfoss Silicon Power Gmbh | Sinterwerkzeug für den Unterstempel einer Sintervorrichtung |
US11024595B2 (en) | 2017-06-16 | 2021-06-01 | Micron Technology, Inc. | Thermocompression bond tips and related apparatus and methods |
CN111526673A (zh) * | 2019-02-01 | 2020-08-11 | 泰拉丁公司 | 保持电路板的形状 |
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US4963208A (en) * | 1987-10-06 | 1990-10-16 | Muncy Charles W | System for applying decorative devices to garments and the like |
JPH0418840A (ja) * | 1990-05-11 | 1992-01-23 | Fujitsu Ltd | メモ再生制御方式 |
JPH04188840A (ja) * | 1990-11-22 | 1992-07-07 | Toshiba Corp | ダイボンディング方法 |
JP3017485B2 (ja) * | 1998-01-23 | 2000-03-06 | アピックヤマダ株式会社 | 半導体装置の樹脂封止方法及び樹脂封止装置 |
JP2001160564A (ja) * | 1999-12-03 | 2001-06-12 | Apic Yamada Corp | 樹脂封止装置 |
JP4718734B2 (ja) * | 2001-09-12 | 2011-07-06 | 日機装株式会社 | 回路素子の実装方法 |
JP4288026B2 (ja) * | 2001-09-28 | 2009-07-01 | パナソニック株式会社 | 装着ツール及びicチップの装着方法 |
JP2005032958A (ja) | 2003-07-11 | 2005-02-03 | Nikon Corp | 荷電粒子線装置の照明条件調整方法、及び露光方法 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
TWI241720B (en) * | 2004-01-16 | 2005-10-11 | Super Nova Optoelectronics Cor | Replaceable light emitting diode packaging structure |
WO2006082744A1 (ja) * | 2005-02-02 | 2006-08-10 | Sony Chemical & Information Device Corporation | 電気部品の実装装置 |
JP2007324413A (ja) * | 2006-06-01 | 2007-12-13 | Sony Chemical & Information Device Corp | 熱圧着ヘッド及びこれを用いた実装装置 |
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US8114243B2 (en) | 2012-02-14 |
KR20090031902A (ko) | 2009-03-30 |
TWI411053B (zh) | 2013-10-01 |
KR101034166B1 (ko) | 2011-05-12 |
CN101490831B (zh) | 2011-09-28 |
TW200829106A (en) | 2008-07-01 |
US20090261149A1 (en) | 2009-10-22 |
HK1133738A1 (en) | 2010-04-01 |
CN101490831A (zh) | 2009-07-22 |
EP2043142A1 (en) | 2009-04-01 |
EP2043142A4 (en) | 2009-12-02 |
EP2043142B1 (en) | 2011-10-19 |
JP2008028039A (ja) | 2008-02-07 |
WO2008010516A1 (en) | 2008-01-24 |
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