JP4968533B2 - Copper alloy material for electrical and electronic parts - Google Patents

Description

  The present invention relates to a copper alloy material for electrical / electronic parts having material characteristics such as electrical conductivity, mechanical strength, and bending workability, which is suitable as a metal material for electrical / electronic parts such as connectors and electrical contacts. .

Metal materials that are mainly used as spring materials and contact materials for electrical and electronic parts such as connectors, relays, and switches can be used for long periods of time at high strength and high temperatures to obtain high contact pressure. Strength to maintain contact pressure, high conductivity to suppress the generation of joule heat during energization and easy dissipation of generated heat, bending workability that does not cause damage such as cracking even in complicated bending processes Various characteristics are required.
In recent years, with the miniaturization of electrical / electronic components, the density of current flowing in the metal material used for the electronic / electronic components tends to further increase. In order to cope with this, it is increasingly demanded that metal materials for electric and electronic parts have high conductivity.
In addition, so-called in-vehicle electric / electronic parts are required to withstand use in a higher temperature environment, and therefore are required to have higher stress relaxation resistance.

  However, so-called spring materials, such as brass and phosphor bronze, have been used for such metal materials for electric and electronic parts, but higher conductivity and stress relaxation as described above. It has become increasingly difficult to fully satisfy the demands of sex.

Therefore, a Cu—Cr—Zr-based alloy has been proposed as one of the promising candidates for metal materials that can meet the demands for high conductivity and stress relaxation resistance as described above (Patent Document 1).
A Cu—Cr—Zr alloy is generally a precipitation hardening type alloy in which the alloy components Cr and Zr are precipitated in the matrix alone or in the form of a compound, and can achieve a high conductivity exceeding 70% IACS. In addition, it is known that the stress relaxation resistance can exhibit excellent characteristics exceeding those of conventional phosphor bronze, for example.
However, the increase in strength due to precipitation hardening is small as compared with Cu-Ni-Si series and the like, which are similar precipitation hardening type alloys. For this reason, a method is adopted in which cold rolling is performed and work hardening is performed, and strength is improved by using both precipitation hardening and work hardening.
In such a Cu-Cr-Zr-based alloy, in order to achieve sufficient strength to obtain the high contact pressure as described above, it is necessary to further increase the workability of cold rolling and to work harden it. Become. However, such a large increase in workability is inevitably accompanied by a decrease in the ductility of the material, and therefore tends to deteriorate the bending workability.

Thus, in order to produce a Cu—Cr—Zr alloy material suitable for electric / electronic parts, work hardening while minimizing the deterioration of bending workability due to the ductility reduction of the alloy material. Although it is necessary to improve the strength by this, it was extremely difficult in practice.
Here, as a method of proceeding work hardening while maintaining the bending workability, for Cu-Fe-P-based alloys, the orientation distribution density of Brass orientation, S orientation, and Copper orientation, which are typical textures, is appropriate. A method of achieving both high strength and bending workability by adjusting the value has been proposed (Patent Document 2).

JP 2007-039804 A Japanese Patent No. 3962751

However, the technique proposed in Patent Document 2 described above is for a Cu—Fe—P alloy, and such a technique has not yet been attempted for a Cu—Cr—Zr alloy. . Therefore, whether the method proposed in Patent Document 2 is effective for further improving the strength, conductivity, and bending workability of Cu-Cr-Zr alloys remains unclear. It was.
The present invention has been made in view of such problems, and its object is to provide a copper alloy material for electric and electronic parts having high strength, high electrical conductivity, bending workability, and stress relaxation resistance. There is.

The copper alloy material for electric / electronic parts of the present invention is firstly a Cu—Cr—Zr-based copper alloy material for electric / electronic parts, and the composition of the alloy is 0.1 mass% or more and 0 .4% by mass or less of Cr and 0.02% by mass or more and 0.2% by mass or less of Zr, the balance being made of Cu and inevitable impurities, and in the texture as the alloy The orientation distribution density of the Brass orientation is 20 or less, and the total orientation distribution density of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less.

  Further, in addition to the above composition, one or more components of Fe, Ni, Co, Sn, Zn, and Mg are contained in a total of 0.01% by mass to 1% by mass. .

Further, when the metal plate made of the copper alloy material has a tensile strength of 550 N / mm ² or more, an electrical conductivity of 70% IACS or more, a minimum bending radius R, and a plate thickness t. The bending workability R / t is characterized by being less than 1.0.

  According to the present invention, a Cu-Cr-Zr-based copper alloy material for electric and electronic parts having high strength, high electrical conductivity, and bending workability can be obtained.

  Hereinafter, a copper alloy material for electric / electronic parts according to an embodiment of the present invention will be described with reference to the drawings.

The copper alloy material for electric / electronic parts according to the present embodiment is a Cu-Cr-Zr-based copper alloy material for electric / electronic parts, and the composition of the alloy is 0.1 mass% or more to 0%. .4 mass% or less of Cr and 0.02 mass% or more and 0.2 mass% or less of Zr, and the balance is set to be composed of Cu and inevitable impurities.
And the orientation distribution density of the Brass orientation in the texture as the alloy is 20 or less, and the total of the orientation distribution densities of the Brass orientation, the S orientation and the Copper orientation is set to 10 or more and 50 or less.
Further, in addition to the above composition, one or more kinds of components of Fe, Ni, Co, Sn, Zn, and Mg are contained in a total of 0.01% by mass to 1% by mass.

By setting the orientation distribution density of the composition and texture in this way, the strength of the metal plate made of the copper alloy material for electronic parts is, for example, a tensile strength of 550 N / mm ² or more, and the conductivity is For example, the bending workability R / t when the minimum bending radius is R and the plate thickness is t is 70% IACS or more, for example, less than 1.0.

  In the copper alloy material for electric / electronic parts according to the present embodiment, 0.1% by mass to 0.4% by mass Cr and 0.02% by mass to 0.2% by mass Zr are contained. However, a copper alloy whose balance is made of Cu and inevitable impurities is used as a material. Cr alone precipitates in the matrix phase to improve the strength of the material and improve the heat resistance. Zr also forms a compound with Cu and precipitates in the parent phase, which also improves strength and heat resistance. Each content affects the amount and size of the precipitated particles to be formed. However, inclusion in the above range makes it easy to realize a high level and well-balanced characteristic.

  In addition to the above, by adding one or more components selected from Fe, Ni, Co, Sn, Zn, and Mg in a total range of 0.01% by mass to 1% by mass, -Further enhancement of mechanical strength such as tensile strength and stress relaxation resistance of a metal plate made of a copper alloy material for electronic parts can be achieved. That is, the above component has an effect of improving the strength of the material, and by adding an appropriate amount together with Cr and Zr, further improvement in strength can be achieved.

In the copper alloy material for electric / electronic parts according to the present embodiment, the orientation distribution density of the Brass orientation is set to 20 or less, and the Brass orientation, the S orientation, and the Copper in the texture as the alloy.
The total orientation distribution density of the orientation is set to be in the range of 10 to 50.
Here, the Brass orientation; {110} <112>, the S orientation; {123} <634>, the Copper orientation; {112} <111> are textures developed by cold rolling, respectively, and these are developed. Higher strength can be obtained, but at the same time, ductility is lowered and bending workability is deteriorated. In order to obtain high strength while suppressing deterioration of bending workability, it is effective to control the orientation distribution density within the range specified above so that these textures do not develop excessively. .

The reasons for limiting each of the above conditions will be further described below.
The Cr content is specified to be 0.1% by mass to 0.4% by mass. When the content is less than this specified range, age hardening becomes insufficient due to insufficient Cr precipitates, and sufficient stress relaxation resistance tends not to be obtained. It is in. Conversely, when the content is greater than the specified range, the shape of the Cr precipitates tends to be coarse. When the Cr precipitate becomes coarse, it becomes difficult to obtain the effect of improving the strength, and the probability of becoming the starting point of the crack at the time of bending increases, which tends to cause a decrease in bending workability. It is in. Therefore, by setting the Cr content to 0.1 mass% to 0.4 mass% as described above, both the stress relaxation resistance and the bending workability are sufficiently and surely high. It becomes possible to do. It is more desirable that the stress relaxation resistance and the bending workability can be further improved by setting the content in the range of 0.2% by mass to 0.3% by mass.

  The Zr content is specified to be 0.02% by mass to 0.2% by mass. The content of Zr has the same effect as Cr. When the content is less than the specified range, strength and stress relaxation resistance are insufficient, and when the content is more than the specified range, bending workability is deteriorated. The Zr content is more preferably 0.05% by mass to 0.1% by mass because further improvement in both stress relaxation resistance and bending workability can be achieved. .

Fe, Ni, Co, Sn, Zn, M preferably added together with these Cr and Zr
The total amount of one or more kinds of components in g is specified in the range of 0.01% by mass to 1% by mass. Here, when the content is less than the specified range, it is difficult to obtain a sufficient effect despite the addition of the component. Or conversely, if the content is more than the specified range, there is a high possibility that adverse effects such as a decrease in conductivity and a deterioration in bending workability will increase.

The texture differs depending on the processing and heat treatment methods. By changing the composition ratio of many orientation factors, anisotropy occurs in plastic deformation and bending workability changes. The Brass orientation, S orientation, and Copper orientation defined as described above in the present embodiment are textures developed by cold rolling, respectively, and by developing these, high strength can be obtained. The ductility of a copper alloy falls and the bending workability of the metal plate material which consists of this copper alloy deteriorates. In the copper alloy material for electric / electronic parts according to the present embodiment, particularly, the development of the Brass orientation greatly affects the bending workability, and when the orientation distribution density exceeds 20, the deterioration of the bending workability becomes a problem. In order to achieve both high strength and good bending workability in a well-balanced manner, it is effective to set the total orientation distribution density of the Brass, S, and Copper orientations within a range of 10 to 50. If this value exceeds 50, the bending workability is greatly deteriorated, and if it is less than 10, the strength is insufficient.

  Here, the measurement of the orientation distribution density as described above is performed by creating complete pole figures of (100), (110), and (111) by the X-ray diffraction method, and using the crystal orientation distribution function from the results, Calculated by calculating the ratio of the intensity peak value of a specific orientation (Brass orientation, S orientation, and Copper orientation) to the total strength peak value ("Texture", edited by Junichi Nagashima (1984, Maruzen Co., Ltd.) Company publication, P8-44), Metallurgical Society seminar “Assembly” (1981, edited by the Japan Institute of Metals, P3-7). Such orientation distribution density can also be obtained from data measured using SEM (Scanning Electron Microscopy) -EBSD (Electron Backscatter Diffraction).

  The present inventors have selected crystal grain refinement, precipitate dispersion state control, texture control, etc. as methods that are considered to be effective for further improving work hardening while maintaining bending workability. Then, various experiments were tried on them, and the results were considered, and the present invention was completed.

Among the above methods, the most approximate one of the texture control is Japanese Patent No. 3962751 as an invention aimed at improving the strength and bending workability of the Cu—Fe—P alloy.
No. has been proposed. This is to achieve both high strength and good bending workability by controlling the orientation distribution density of typical textures, Brass orientation, S orientation, and Copper orientation. However, the method proposed in Japanese Patent No. 3962751 is intended only for Cu—Fe—P based alloys, and whether or not it is effective for Cu—Cr—Zr based alloys as they are. Generally, in the field of alloys, almost in the same way as in the field of compounds, it is unpredictable unless it is proved by experiments.

  Therefore, the present inventors applied the texture control method as described above to a Cu—Cr—Zr alloy, and conducted various experiments and considerations as detailed in the following examples. It was confirmed whether or not the improvement in conductivity, strength, and bending workability of the metal plate made of the Cu—Cr—Zr alloy could be effectively achieved. At the same time, various conditions were examined to ensure that more desirable characteristics could be achieved with respect to conductivity, strength, and bending workability. As a result, the present inventors have obtained a new finding that the above configuration can realize a copper alloy material having conductivity, strength, and bending workability that are dramatically higher than those of the prior art.

Next, an example of the manufacturing method of the copper alloy material for electric / electronic parts according to the present embodiment as described above will be described.
This copper alloy material for electric and electronic parts is subjected to cold rolling and heat treatment at low temperature in the manufacturing process of a Cu-Cr-Zr-based copper alloy strip using an ingot having a composition set as described above. It can manufacture by combining and implementing on suitable conditions.

  First, a copper alloy having a composition as defined above is cast and hot rolled. The heating of the hot rolling at this time has a solution effect of once dissolving Cr and Zr in the alloy, so the temperature immediately after the end of rolling is maintained as high as possible, and then as quickly as possible. It is desirable to cool.

Subsequently, after performing normal primary cold rolling and intermediate annealing, cold rolling with a workability of 10% to 50% is performed, followed by heating at 350 to 600 ° C. for 10 seconds to 10 minutes. Heat treatment is performed.
In this process, if the degree of processing is less than 10%, the total of the azimuth distribution density of the Brass, S, and Copper directions tends to be less than 10, and if the degree of processing exceeds 50%, the azimuth distribution density of the Brass azimuth. Or the sum of the orientation distribution densities of the Brass, S, and Copper orientations exceeds 50. Also, if the heat treatment is at a lower temperature or shorter time than the above conditions, the orientation distribution density of the Brass orientation may exceed 20, or the sum of the orientation distribution densities of the Brass orientation, the S orientation, and the Copper orientation may exceed 50. Becomes higher. Conversely, when the heat treatment is performed at a higher temperature or longer time than the above-mentioned conditions, the total of the orientation distribution density of the Brass orientation, the S orientation, and the Copper orientation tends to be less than 10. The combination of cold rolling and heat treatment performed by specifying the degree of work can be performed twice or three times, and more preferable high strength can be obtained by such repetition.
Thus, the copper alloy material for electric / electronic parts according to the present embodiment can be manufactured.

Conventionally, in a Cu—Cr—Zr alloy, bending workability tends to be lowered when trying to obtain a high strength with a tensile strength of 550 N / mm ² or more. According to the copper alloy material for electric / electronic parts, the composition of the alloy is 0.1 mass% to 0.4 mass% Cr and 0.02 mass% to 0.2 mass% Zr. And the balance is made of Cu and inevitable impurities, the orientation distribution density of the Brass orientation in the texture as the alloy is 20 or less, and the Brass orientation, the S orientation, and the Copper orientation By setting the sum of the orientation distribution densities of 10 to 50 or less, the tensile strength 5
Remarkably higher strength and stress relaxation resistance than conventional, such as 50 N / mm ² or more, and R / t
It is possible to achieve very good bending workability such as less than 0.1 and high conductivity such as 70% IACS or more all together.

The copper alloy material for electrical / electronic parts according to the present embodiment is limited to only those having the composition defined by the numerical values as described above and the characteristics evaluated by the numerical values as described above. It goes without saying that it is not done. In other words, the copper alloy material for electrical / electronic parts according to the present embodiment is more qualitatively, the orientation distribution of the Brass orientation in the texture of the Cu—Cr—Zr alloy. By appropriately controlling the density, and the total orientation distribution density of the Brass, S, and Copper orientations, the strength, stress relaxation resistance, bending workability, and electrical conductivity can be controlled by conventional Cu-Cr-Zr alloys. Can be clearly higher than in the case of.

  The copper alloy material for electric / electronic parts according to the present embodiment is required to be a metal material having high conductivity, stress relaxation resistance and bending workability, such as a switch, a connector or a relay. It is suitable for use as a spring material or contact material for various electrical / electronic parts.

Based on the settings described in the above embodiment, copper alloy materials for electric / electronic parts as Examples 1 to 9 were produced. At the same time, copper alloy materials for electric / electronic parts as Comparative Examples 1 to 12 with settings different from those of the above embodiment were prepared, and various characteristics were compared and examined.
FIG. 1 is a diagram showing the composition of each of the copper alloy material samples for electric / electronic parts according to Examples 1 to 7 and Comparative Examples 1 to 6 of the present invention, and FIG. FIG. 3 is a table showing the texture, bending workability, tensile strength, and electrical conductivity of each sample shown in Table 1, and FIG. 3 shows Examples 1, 8, and 9 of the present invention and Comparative Examples 7 to FIG. 4 is a table showing the cold rolling and heat treatment conditions and the number of repetitions of each of the copper alloy material samples for electrical / electronic parts according to No. 12, and FIG. 4 is a diagram showing each sample shown in FIG. It is a figure which puts together the texture, bending workability, tensile strength, and electrical conductivity for the table.

A copper alloy containing Cr: 0.2% by mass and Zr: 0.1% by mass with an oxygen-free copper as a base material and having a composition as shown in FIG. This was cast into an ingot having a length of 25 mm, a width of 30 mm, and a length of 150 mm. This was heated to 950 ° C., hot-rolled to a thickness of 8 mm, then cold-rolled to a thickness of 1 mm, and annealed at 800 ° C.
Subsequently, cold working with a workability of 40% and heat treatment heated at 500 ° C. for 1 minute are performed.
A metal plate material having a thickness of 0.22 mm was produced by repeating the process, and this was used as the sample of Example 1.

When the texture of the sample of Example 1 was examined, as shown in FIG. 2, the orientation distribution density of the Brass orientation was 17, and the total of the orientation distribution densities of the Brass orientation, the S orientation, and the Copper orientation was 44. It was confirmed that the sample had a texture as defined in the above embodiment.
In this texture evaluation, complete pole figures of (100), (110), and (111) are prepared by a normal X-ray diffraction method, and the intensity peak of each orientation is obtained from the result using a crystal orientation distribution function. The ratio of the intensity peak of a specific orientation to the sum of the peak values was calculated, and the orientation distribution density of the Brass orientation, and the sum of the orientation distribution densities of the Brass orientation, the S orientation, and the Copper orientation were obtained.

Further, the bending workability of the sample of Example 1 was evaluated. This bending workability was evaluated by a W bending test specified in JIS H3100. That is, the bending axis is taken in the rolling parallel direction (Bad way direction), and the minimum bending radius R that does not cause cracks on the surface of the sample
(Mm) was measured, and the ratio to the plate thickness t (mm) was evaluated by the value of R / t. It can be said that the smaller the value of R / t, the better the bending workability and the better the bending workability.
As a result, as shown in FIG. 2, it was confirmed that the sample of Example 1 did not generate cracks even in W bending with a bending radius of 0 mm and had good bending workability.

Further, the tensile strength and conductivity of the sample of Example 1 were measured. As a result, the tensile strength was 556 N / mm ² and the conductivity was 80% IACS.
From these results, the sample of Example 1 maintains a very good bending workability with an R / t of almost 0, and has a high strength with a tensile strength of 550 N / mm ² or more and 80% IACS (70%
It was confirmed that the copper alloy material for electric / electronic parts had high conductivity (which clearly exceeded IACS).

Next, each of the copper alloys added with Fe, Ni, Co, Sn, Zn, and Mg respectively in the same composition as in the case of the above-described Example 1 at a ratio as shown in FIG. By passing through the rolling process similar to Example 1, the sample was produced so that the orientation distribution density in a texture might become equivalent to Example 1, and they were set as Examples 2-7. And also about these Examples 2-7, each characteristic of a texture, bending workability, tensile strength, and electrical conductivity was evaluated similarly to the case of Example 1.
As a result, as shown in FIG. 2, in any of the samples of Examples 2 to 7, the R / t was almost 0 and extremely high exceeding 550 N / mm ² while maintaining extremely good bending workability. It was confirmed that the strength and the high conductivity exceeding 70% IACS were combined.

The reason why the composition of the copper alloy material for electric / electronic parts according to Examples 1 to 7 of the present invention as an alloy is defined in the numerical range as described in the above embodiment is Comparative Example 1. It demonstrates by comparing and contrasting with the result of ~ 6.
In the samples of Comparative Examples 1 to 4, the contents of Cr and Zr were each set to values deviating from the specified ranges of Examples 1 to 7.
More specifically, in Comparative Examples 1 and 2, the amount of Cr and Zr added is set to be too low. In this case, as shown in FIG. 2, the tensile strength was lower than those of Examples 1 to 7, and thus the strength was lower than that of Examples 1 to 7.
In Comparative Examples 3 and 4, the amount of Cr and Zr added is set excessively. In this case, bending workability was particularly deteriorated.
In Comparative Examples 5 and 6, subcomponents (Fe, Ni, Co, Sn, Zn, Mg) other than Cr and Zr are excessively added. In this case, the tensile strength was increased, but the conductivity was clearly reduced. Moreover, it became a result which worsened also about bending workability compared with Examples 1-7.

  From the comparison between the experimental results of Comparative Examples 1-6 and those of Examples 1-7, the Cr content is 0.1 mass% to 0.4 mass%, and the Zr content is It was confirmed that it is desirable to set it to 0.02 mass% or more and 0.2 mass% or less. In addition, it was confirmed that the total addition amount (content) of Fe, Ni, Co, Sn, Zn, and Mg added as subcomponents is desirably 0.01% by mass to 1% by mass. It was.

  Next, the orientation distribution density of the texture can be changed variously according to the setting of rolling and heat treatment. Therefore, after casting and hot-rolling a material having the same composition as in Example 1, it is cold-rolled to a thickness of 1 mm and annealed at 800 ° C., and further, with different setting conditions as shown in FIG. The samples of Examples 8 to 9 and Comparative Examples 7 to 12 were produced by repeatedly performing cold rolling and heat treatment. For each material, the orientation distribution density, bending workability, tensile strength, and conductivity of the texture are measured, and the results are compared and contrasted. Was evaluated and considered.

In Examples 1, 8, and 9, the orientation distribution density in the texture as an alloy of each sample is set within the range defined in the above embodiment, but those Examples 1, 8, and 9 are set. As shown in FIG. 4, it was confirmed that none of the samples had cracks even in W-bending with a bending radius of 0 mm and had extremely good bending workability. It was also confirmed that the properties of tensile strength of 550 N / mm ² or more and electrical conductivity of 70% IACS or more were achieved at the same time.

On the other hand, the samples of Comparative Examples 7 and 8 exceeded the range defined in the above embodiment, with the azimuth distribution density of the Brass azimuth and the sum of the azimuth distribution densities of the Brass azimuth, S azimuth, and Copper azimuth. It is set to an excessive value. In this case, as shown in FIG. 4, the bending workability deteriorated remarkably.
In the samples of Comparative Examples 9 and 10, either the orientation distribution density of the Brass orientation or the sum of the orientation distribution densities of the Brass orientation, the S orientation, and the Copper orientation deviated from the range defined in the above embodiment. Set to value. Also in this case, the bending workability was clearly deteriorated as compared with Examples 1, 8, and 9.
In the samples of Comparative Examples 11 to 12, the total of the orientation distribution density of the Brass orientation, the S orientation, and the Copper orientation is set to a value that falls below the specified range. In this case, bending workability was good as in Examples 1, 8, and 9, but the tensile strength was significantly reduced.

From the consideration by comparison of the experimental results of Examples 1, 8, and 9 and Comparative Examples 7 to 12, even if the composition is the same Cu—Cr—Zr alloy, the texture as the alloy By setting the orientation distribution density of the Brass orientation at 20 or less and the total orientation distribution density of the Brass orientation, S orientation, and Copper orientation at 10 to 50, the conventional Cu-Cr-Zr alloy can be obtained. It was also confirmed that it was possible to have both clearly high electrical conductivity, stress relaxation resistance (tensile strength) and good bending workability.

  As described above, the copper alloy material for electrical / electronic parts according to the present embodiment balances characteristics such as high conductivity, high strength, high bending workability, and stress relaxation resistance at a high level compared to conventional materials. It is well combined. As a result, the copper alloy material for electric / electronic parts according to the present embodiment is supported by the improvement of the manufacturing technology of electric / electronic parts from the aspect of supplying copper alloy materials with high characteristics. It greatly contributes. More specifically, the copper alloy material for electric / electronic parts according to the present embodiment is optimal for use in electric / electronic parts used under harsh environments such as in-vehicle connectors. It can be expected to bring about a great effect on downsizing and high functionality of the parts.

It is a figure which shows the composition about each of the sample of the copper alloy material for electrical / electronic components which concerns on Examples 1-7 of this invention, and Comparative Examples 1-6 collectively on a table | surface. FIG. 2 is a table showing the texture, bending workability, tensile strength, and conductivity of each sample shown in FIG. 1 in a table. Table 1 summarizes cold rolling, heat treatment conditions, and the number of repetitions of each of the copper alloy material samples for electric and electronic parts according to Examples 1, 8, and 9 and Comparative Examples 7 to 12 of the present invention. FIG. FIG. 4 is a table showing the texture, bending workability, tensile strength, and conductivity of each sample shown in FIG. 3 in one table.

Claims (4)

A Cu-Cr-Zr-based copper alloy material for electric and electronic parts,
The composition as the alloy contains 0.1% by mass or more and 0.4% by mass or less of Cr and 0.02% by mass or more and 0.2% by mass or less of Zr, with the balance being Cu and inevitable impurities. And
In addition, the orientation distribution density of the Brass orientation in the texture as the alloy is 20 or less, and the total orientation distribution density of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less. Copper alloy material for electronic parts. In the copper alloy material for electric / electronic parts according to claim 1,
In addition to the above-mentioned composition, one or more kinds of components of Fe, Ni, Co, Sn, Zn, and Mg are contained in a total of 0.01% by mass to 1% by mass. Copper alloy material for electronic parts. In the copper alloy material for electric / electronic parts according to claim 1 or 2,
Bending when the metal plate made of the copper alloy material has a tensile strength of 550 N / mm ² or more, an electrical conductivity of 70% IACS or more, a minimum bending radius of R, and a plate thickness of t. A copper alloy material for electrical and electronic parts, wherein the property R / t is less than 1.0. In the copper alloy material for electric / electronic parts according to any one of claims 1 to 3 ,
A copper alloy material for electrical and electronic parts, wherein the metal plate material made of the copper alloy material is used as a contact material or a spring material for a switch or a connector.

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