JP4960194B2 - Method for manufacturing substrate for light emitting device package and light emitting device package - Google Patents

Description

  The present invention relates to a method for manufacturing a light emitting element package substrate used when packaging a light emitting element such as an LED chip, and a light emitting element package using the light emitting element package substrate manufactured by this manufacturing method.

  In recent years, light-emitting diodes have attracted attention as illumination / light-emitting means that can be reduced in weight, thickness, and power. As a mounting form of the light emitting diode, a method of directly mounting the bare chip (LED chip) of the light emitting diode on the wiring board, and bonding the LED chip to a small board so as to easily mount the LED chip on the wiring board are packaged. A method of mounting an LED package on a wiring board is known.

  The conventional LED package has a structure in which the LED chip is die-bonded to a small substrate, the electrode part of the LED chip and the electrode part of the lead are connected by wire bonding or the like, and sealed with a sealing resin having translucency. there were.

  On the other hand, the LED chip has the property that in a normal use temperature range as a lighting fixture, the luminous efficiency increases as the temperature decreases, and the luminous efficiency decreases as the temperature increases. For this reason, in a light source device using a light emitting diode, it is very important to improve the light emission efficiency of the LED chip by quickly radiating the heat generated in the LED chip to the outside and lowering the temperature of the LED chip. It becomes. In addition, by increasing the heat dissipation characteristics, a large current can be applied to the LED chip and the light output of the LED chip can be increased.

  Accordingly, some light source devices have been proposed in which the LED chip is directly die-bonded to a thermally conductive substrate in order to improve the heat dissipation characteristics of the LED chip instead of the conventional light emitting diode. For example, in Patent Document 1 below, a recess is formed by pressing a substrate made of an aluminum thin plate, an insulator thin film is formed on the surface thereof, and then an insulator thin film is interposed on the bottom surface of the recess. The LED chip is die-bonded, the wiring pattern formed on the insulator film layer and the electrode on the surface of the LED chip are electrically connected via bonding wires, and the sealing resin having translucency in the recess Is known. However, this substrate has problems such as a complicated structure and a high processing cost.

  Further, in Patent Document 2 below, as a light emitting element mounting substrate, a metal substrate, a metal columnar body (metal convex portion) formed by etching at a mounting position of the light emitting element on the metal substrate, and the metal columnar body And an electrode layer formed in the vicinity of the metal columnar body are disclosed.

JP 2002-94122 A Japanese Patent Laying-Open No. 2005-167086

  However, according to the study by the present inventors, when mounting an LED chip on a wiring board, it is important to provide a metal columnar body at the mounting position. It has been found that it is not always necessary to provide a metal columnar body. In other words, when mounting an LED package, it has been found that sufficient heat dissipation can be obtained by using a resin containing an inorganic filler with high thermal conductivity as the material of the insulating layer of the substrate on which the LED package is mounted. did.

  From this point of view, referring to Patent Document 2, in the light emitting element mounting substrate described in this document, when LED chips are packaged, a metal columnar through structure, power supply wiring, insulating layer, etc. There was room for further improvement. In addition, as a method for forming a metal columnar body, it has been desired to review the number of manufacturing steps from the viewpoint of reducing manufacturing costs.

  In addition, as a small substrate for packaging LED chips, an insulating layer made of ceramics is known. However, it is advantageous in terms of manufacturing cost because firing of ceramics is necessary during manufacturing. It cannot be said that it was unsuitable for mass production.

  Accordingly, an object of the present invention is to provide a substrate for a light emitting device package that can obtain a sufficient heat dissipation effect from the light emitting device as a substrate for packaging the light emitting device, and can be mass-produced, reduced in cost, and downsized. A method and a light emitting device package using the substrate for a light emitting device package according to the method.

  The above object can be achieved by the present invention as described below.

A substrate for a light emitting device package according to the present invention is a substrate for a light emitting device package including a metal thick portion formed below a mounting position of the light emitting device,
Below the mounting position of the light emitting element, an insulating layer having a thermal conductivity of 1.0 W / mK or more, made of a resin containing a thermally conductive filler,
A metal layer having the metal thick part disposed inside the insulating layer,
A heat conductive mask portion is provided on the top of the thick metal portion.

  According to this configuration, the thick metal portion is disposed upright in the insulating layer having good thermal conductivity, and the thermal conductive mask portion is top-coated on the top of the thick metal portion ( For example, when a light-emitting element is mounted on the mounting surface on one side of the insulating layer, the heat generated in the light-emitting element is generated by the insulating layer having high thermal conductivity, the thermally conductive mask portion, and the metal thickness. Heat is transferred efficiently by the part. In addition, when the light emitting element is mounted on the metal layer surface side facing the metal thick part, the heat generated in the light emitting element is efficiently transferred by the heat conductive mask part and the metal thick part, and the heat is further increased. Heat is transferred efficiently by the insulating layer with high thermal conductivity. Thus, a sufficient heat dissipation effect can be obtained as a substrate for packaging.

  For the thermal conductive mask part, for example, it is preferable to use the etching resist in the metal thick part forming process as it is. The resist removal step can be omitted, and the improvement effect is great in terms of work efficiency, manufacturing cost, and the like.

In addition, another method for manufacturing a substrate for a light emitting device package of the present invention is as follows.
A method for manufacturing a substrate for a light emitting element package comprising a metal thick portion formed below a mounting position of a light emitting element,
A laminated body having an insulating adhesive having a thermal conductivity of 1.0 W / mK or more and a metal layer member made of a resin containing a thermally conductive filler, and a thick metal portion provided with a thermally conductive mask portion. It has the lamination process which laminates and integrates the metal layer member which has.

  According to this configuration, the laminated body having the insulating adhesive having good thermal conductivity and the metal layer member and the metal layer member having the metal thick portion provided with the thermally conductive mask portion are laminated and integrated. Can do. By manufacturing the laminated body in advance, it is possible to easily manufacture the substrate for the light emitting element package, and it is excellent in mass productivity, can be reduced in cost, and can be downsized. For example, when the light emitting element is mounted on the mounting surface on one side of the insulating layer, the heat generated in the light emitting element is efficiently transferred to the insulating layer, the heat conductive mask portion, and the metal thick portion with high thermal conductivity. Be heated. In addition, when the light emitting element is mounted on the metal layer surface side facing the metal thick part, the heat generated in the light emitting element is efficiently transferred by the heat conductive mask part and the metal thick part, and the heat is further increased. Heat is transferred efficiently by the insulating layer with conductivity. Thus, a sufficient heat dissipation effect can be obtained as a substrate for packaging.

  Further, as an example of a preferred embodiment of the present invention, a laminate having an insulating adhesive and a metal layer member and / or a metal layer member having a metal thick portion provided with a heat conductive mask portion are It is preferably configured in a roll shape. According to this configuration, it is excellent in continuous productivity and mass productivity, and yield efficiency is good as compared with single wafer production.

  Another light emitting device package of the present invention is configured using the above light emitting device package substrate or the light emitting device package substrate manufactured by the above manufacturing method. Therefore, the light emitting device package can be manufactured at a low cost and in a small size.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are cross-sectional views showing an example of a substrate for a light-emitting element package according to the present invention, showing a state in which the light-emitting element is mounted and packaged.

  As shown in FIG. 1, the substrate for a light emitting device package of the present invention includes an insulating layer 1 made of a resin 1a containing thermally conductive fillers 1b and 1c, and the metal disposed inside the insulating layer 1. A metal layer 21 having a thick portion 2, and a thermally conductive mask portion 22 is provided on the top of the metal thick portion 2. The light emitting element 4 is provided on the mounting side surface of the insulating layer 1, and the surface electrode portion 3 is provided on the mounting side surface of the insulating layer 1.

  In addition, as shown in FIG. 2, the other light emitting element package substrate has an insulating layer 1 made of a resin 1a containing thermally conductive fillers 1b and 1c, and a light emitting element 4 below the mounting position. A metal layer 21 having a thick metal portion 2 provided with a heat conductive mask portion 22 on the top and a surface electrode portion 3 formed on the mounting side surface of the insulating layer 1 are provided. The light emitting element 4 is directly mounted on the mounting surface 2 a of the metal layer 21. The thick metal portion 2 is formed thick from the mounting surface 2a toward the back surface side of the insulating layer 1, and the top side is included in the insulating layer 1 (embedded state).

  As described above, in the case where the top side of the thick metal portion 2 does not penetrate the insulating layer 1, it can be manufactured by a press using a roll or the like described later, or an intermittent press. And miniaturization are possible.

  The insulating layer 1 has a thermal conductivity of 1.0 W / mK or higher, preferably has a thermal conductivity of 1.2 W / mK or higher, and more preferably has a thermal conductivity of 1.5 W / mK or higher. preferable. Thereby, the heat from the metal thick part 2 and the heat conductive mask part 22 can be efficiently radiated to the whole package. Here, the thermal conductivity of the insulating layer 1 is appropriately determined by selecting a formulation in consideration of the blending amount and particle size distribution of the thermally conductive filler, but an insulating adhesive before curing (for example, the following In consideration of the coatability of a thermosetting resin or the like, generally, the upper limit is preferably about 10 W / mK.

  The insulating layer 1 is preferably composed of thermally conductive fillers 1b and 1c, which are metal oxides and / or metal nitrides, and a resin 1a. Metal oxides and metal nitrides are preferably excellent in thermal conductivity and electrically insulating. Aluminum oxide, silicon oxide, beryllium oxide, and magnesium oxide are selected as the metal oxide, and boron nitride, silicon nitride, and aluminum nitride are selected as the metal nitride. These can be used alone or in combination of two or more. . In particular, among the metal oxides, aluminum oxide can easily obtain an insulating adhesive layer having good electrical insulation and thermal conductivity, and can be obtained at low cost. Of these materials, boron nitride is preferable because it is excellent in electrical insulation and thermal conductivity and has a low dielectric constant.

  As the heat conductive fillers 1b and 1c, those containing a small diameter filler 1b and a large diameter filler 1c are preferable. Thus, by using two or more kinds of particles having different sizes (particles having different particle size distributions), the heat transfer function by the large-diameter filler 1c itself and the heat transfer property of the resin between the large-diameter filler 1c by the small-diameter filler 1b are obtained. With the function of increasing, the thermal conductivity of the insulating layer 1 can be further improved. From such a viewpoint, the median diameter of the small-diameter filler 1b is preferably 0.5 to 2 μm, and more preferably 0.5 to 1 μm. Moreover, 10-40 micrometers is preferable and, as for the median diameter of the large diameter filler 1c, 15-20 micrometers is more preferable.

  Moreover, the metal thick part 2 and the heat conductive mask part 22 have penetrated into the inside of the insulating layer 1, and the heat conductive mask part 22 and the filler (1b, 1c) of the insulating layer 1 are brought into contact with each other, thereby being generated from the light emitting element. Heat dissipation is improved.

  The resin 1a constituting the insulating layer 1 includes the metal oxide and / or metal nitride, but has excellent bonding strength with the surface electrode portion 3 and the metal pattern 5 in a cured state, and has a withstand voltage. Those that do not impair the properties and the like are selected.

  As such a resin, an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, and among them, an epoxy resin is excellent in bonding strength between metals. preferable. In particular, among epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, hydrogenated bisphenol A-type epoxy resins, hydrogenated, which have high fluidity and excellent mixing properties with the above metal oxides and metal nitrides. Bisphenol F type epoxy resin, triblock polymer having bisphenol A type epoxy resin structure at both ends, and triblock polymer having bisphenol F type epoxy resin structure at both ends are more preferable resins.

  Although various metals can be used for the metal layer 21, the surface electrode part 3, and the metal pattern 5 which have the metal thick part 2 in this invention, they are usually any of copper, aluminum, nickel, iron, tin, silver, and titanium. Alternatively, an alloy containing these metals can be used, and copper is particularly preferable from the viewpoint of thermal conductivity and electrical conductivity.

  The metal thick part 2 is provided on the metal layer 21. The thickness of the metal thick portion 2 is larger than the thickness of the metal layer 21. Further, as the thickness of the metal layer 21 (h1: refer to FIG. 3) and the thickness of the metal thick portion 2 and the heat conductive mask portion 22 (h2: refer to FIG. 3), the heat from the light emitting element 4 is sufficiently insulated. From the viewpoint of transferring heat to 1, 31 to 275 μm is preferable, and 35 to 275 μm is more preferable. For the same reason, the thickness of the metal thick portion 2 and the portion of the heat conductive mask portion 22 included in the insulating layer 1 is preferably 30 to 100% of the thickness of the insulating layer 1. 50 to 100% is more preferable.

  Further, from the viewpoint of sufficiently transferring heat from the light emitting element 4 to the insulating layer 1, the planar view shape of the metal thick portion 2 is appropriately selected, but more preferably, a polygon such as a triangle or a quadrangle, , Star polygons such as pentagrams and hexagrams, rounded corners of these with appropriate arcs, and shapes that gradually change from the 2a surface of the thick metal part 2 toward the surface electrode part 3 Is also possible. For the same reason, the maximum width of the metal thick portion 2 in plan view is preferably 1 to 10 mm, and more preferably 1 to 5 mm.

  As a method for forming the metal thick portion 2 on the metal layer 21, a known forming method can be adopted, and for example, it can be formed by etching by photolithography, pressing, printing, adhesion, or a known bump forming method. Further, when the metal thick portion 2 is formed by etching, a protective metal layer may be interposed. As the protective metal layer, for example, gold, silver, zinc, palladium, ruthenium, nickel, rhodium, lead-tin solder alloy, nickel-gold alloy, or the like can be used.

  The thermally conductive mask portion 22 provided on the top of the metal thick portion 2 has a thermal conductivity of 1.0 W / mK or higher, preferably a thermal conductivity of 1.2 W / mK or higher. More preferably, it has a thermal conductivity of 5 W / mK or more. In particular, it is preferable that the thermal conductivity is equal to or higher than that of the insulating layer 1 and the heat capacity is small.

  Moreover, as a method of forming the heat conductive mask part 22 on the top part of the metal thick part 2, printing, adhesion | attachment, etc. are illustrated, for example. When the thick metal portion 2 is formed by etching by photolithography, it is preferable to use a heat conductive mask portion as an etching resist, and the step of removing the heat conductive mask portion can be omitted. .

  The thickness of the heat conductive mask part 22 is 1 μm or more, and for example, 10 to 100 μm is exemplified. If it is too thick, it is not preferable because the shape change of the end portion becomes large at the time of lamination with the insulating layer 1, and if it is too thin, thermal conductivity is lowered, which is not preferable.

  Examples of the material of the heat conductive mask portion 22 include an interlayer insulating material other than the insulating layer 1, an etching resist, a dry film resist, solder, a solder paste, a conductive adhesive, a heat conductive adhesive, or a solder. Examples include resist and flux. Among these, an interlayer insulating material other than the insulating layer 1 and an etching resist are preferably used.

  The thickness of the surface electrode portion 3 is preferably about 25 to 70 μm, for example. Moreover, when providing the metal pattern 5a, about 25-70 micrometers is preferable for the thickness of the metal pattern 5a, for example. The metal pattern 5 a may cover the entire back surface of the insulating layer 1, and may have the thick metal portion 2 as with the metal layer 21. In order to avoid a short circuit of the surface electrode portion 3, the metal pattern 5a is preferably not conductive at least on the back surface of the surface electrode portion 3 on both sides. In particular, when the metal pattern 5a also has the thick metal portion 2, care must be taken not to cause misalignment in the following lamination and integration process. The metal pattern 5a is preferably formed in advance in the B-stage state of the insulating adhesive.

  The thick metal portion 2, the metal layer 21, and the surface electrode portion 3 are preferably plated with a noble metal such as silver, gold, or nickel in order to increase reflection efficiency. Further, a solder resist may be formed as in the case of a conventional wiring board, or solder plating may be partially performed.

(Production method)
Next, a preferred method for manufacturing the light emitting device package substrate of the present invention as described above will be described with reference to FIG. As shown in FIG. 3, a metal layer roll body 211 is prepared by winding a long metal layer 21 on which a thick metal portion 2 having a heat conductive mask portion 22 provided on the top is formed. The size in the width direction, the arrangement of the metal thick portion 2 and the like are set as appropriate. The thick metal portion 2 is formed by etching using a photolithography method, and the thermal conductive mask portion 22 is the one used as the etching resist.

  Moreover, the insulating layer roll body 241 which wound up the laminated body 24 of the elongate insulating layer 1 of a B-stage state and the elongate metal layer 5 is prepared. The width direction size is appropriately set, but is preferably approximately the same as the width direction size of the metal layer roll body 211. A peel protection layer may be provided on the surface of the long insulating layer 1. In this case, the peel protection layer is peeled off when the metal layer 21 is laminated.

  The roll for laminating | stacking is comprised with a pair of roll (30a, 30b), as shown in FIG. The roll pair (30a, 30b) may be composed of a plurality of roll pairs. Further, the roll pair (30a, 30b) can be configured to press the metal layer 21 and the laminated body 24 via a plate-like body (one side or both sides: not shown). Moreover, the structure which combined the roll pair and the plate-shaped body interposed roll pair is also possible. The roll material, the size of the roll, and the like are appropriately set according to the specifications of the laminate 25 (substrate member) in which the metal layer 21 and the laminate 24 are laminated and integrated. The plate-like body has good flatness and can be exemplified by a hard metal plate and a hard resin plate. It is also possible to use a belt press. Furthermore, an intermittent press machine can be used by stepping out the metal layer 21 and the laminate 24 in a stepping manner.

  The distance between the roll pair (30a, 30b) is configured to be adjustable. This distance depends on conditions such as the thickness of the laminated body 25 in which the metal layer 21 and the laminated body 24 are laminated, the thickness of the metal thick portion 2 included in the insulating layer 1, the lamination process operating conditions (conveying speed, etc.), etc. Is set. The pressing force of the roll pair (30a, 30b) is set according to the specifications of the metal layer 21, the insulating layer 1 constituting the laminated body 24, and the laminated body 25 obtained by laminating them. The distance between the roll pairs (30a, 30b) may be fixed when the stacked body 25 is formed, or may be configured to be movable in the vertical direction with respect to the stacked body 25. When configured to be movable in the vertical direction, known means can be applied, and examples thereof include a spring, a hydraulic cylinder, an elastic member, and the like.

  Hereinafter, the manufacturing method shown in FIG. 3 will be described. First, the long metal layer 21 is unwound from the metal layer roll body 211 and fed to the roll pair (30a, 30b) side. In synchronism with this, the long laminated body 24 is fed out from the roll body 241 of the laminated body 24 of the insulating layer 1 and the metal layer 5 in the B stage state, and is sent out to the roll pair (30a, 30b) side. Subsequently, it is conveyed between the roll pair (30a, 30b), the metal layer 21 and the laminate 24 are pressed by the roll pair (30a, 30b), and the metal layer 21 and the laminate 24 are laminated and integrated. The laminated body 25 is formed. In FIG. 3, the laminated body 25 is formed in a state where the thermally conductive mask portion 22 and the metal thick portion 2 are embedded in the insulating layer 1 of the laminated body 24.

  Moreover, the structure which heats the roll itself and presses it while making the heat act (simultaneous heating press) is possible. This is effective when the bonding property with the metal layer 21 is improved when the insulating layer 1 is heated. Furthermore, it can comprise so that a heating apparatus may be installed in the upstream of the roll pair (30a, 30b) and / or the downstream, and, thereby, joining of the insulating layer 1 and the metal layer 21 can be performed efficiently.

  Moreover, it can comprise so that an adhesive agent may be apply | coated to the lamination surface side of the metal layer 21 and / or the insulating layer 1, and, thereby, joining force can be strengthened.

  In addition, a plurality of roller pairs (pressing roller pairs) and / or flat plate portion pairs can be installed on the downstream side of the roll pairs (30a, 30b) for the purpose of thickness maintenance and stabilization. The thickness accuracy of the laminate 25 can be made high. Moreover, a cooling roller, a cooling device, etc. can be provided in the downstream of the roll pair (30a, 30b) for cooling purposes.

  The laminated body 25 obtained by laminating the metal layer 21 and the laminated body 24 using a roll is introduced into a heating device having an appropriate condition and passed therethrough, so that the insulating layer 1 in the B stage state is brought into the C stage state. Harden. Next, this is cut into a predetermined size using a cutting device such as a dicer, a router, a line cutter, or a slitter. The laminated body 25 can be cured after cutting, and after curing, after curing, it can be further cured. In this case, it is possible to provide an in-line heating device before cutting, or it is possible to conduct a curing reaction off-line with a heating device after winding in a roll.

  Subsequently, the laminated body 25 forms the surface electrode part 3 and the metal pattern 5a by patterning both surfaces by etching or the like by a photolithography method, thereby obtaining the light emitting element package substrate of the present invention. . Further, for example, as shown in FIG. 1, a part of the metal layer 21 is removed, the remaining part forms the metal pattern 5 a, a part of the metal layer 5 is removed, and the remaining part forms the surface electrode part 3. You may comprise. Further, as shown in FIG. 2, a part of the metal layer 21 is removed, the remaining part forms the surface electrode part 3, the part of the metal layer 5 is removed, and the remaining part forms the metal pattern 5a. May be.

  As shown in FIGS. 1 and 2, the substrate for a light emitting element package of the present invention may be a type in which a single light emitting element is mounted or a type in which a plurality of light emitting elements are mounted. Particularly in the latter case, it is preferable to have a wiring pattern for wiring between the surface electrode portions 3.

  For example, as shown in FIG. 2, the light emitting element package substrate has the light emitting element 4 mounted on the metal layer 21 above the metal thick portion 2 of the light emitting element package substrate, and the light emitting element is sealed by the sealing resin 7. 4 is sealed and used.

  In other words, the light emitting element package has a metal layer 21 provided with an insulating layer 1 composed of a resin 1a including thermally conductive fillers 1b and 1c and a metal thick portion 2 formed below the mounting position of the light emitting element 4. And a substrate for a light emitting element package including a surface electrode portion 3 formed on a mounting side surface of the insulating layer 1, a light emitting element 4 mounted above the metal thick portion 2, and a seal for sealing the light emitting element 4 And a stop resin 7.

  Examples of the light emitting element 4 to be mounted include an LED chip and a semiconductor laser chip. The LED chip includes a face-up type in which both electrodes are present on the upper surface, a cathode type, an anode type, a face-down type (flip chip type), etc., depending on the electrode on the back surface. In the present invention, the use of the face-up type is excellent from the viewpoint of heat dissipation.

  The light emitting element 4 can be mounted on the mounting surface of the metal layer 21 by any method such as conductive paste, double-sided tape, solder bonding, a heat radiating sheet (preferably a silicone heat radiating sheet), a silicone or epoxy resin material. However, metal bonding is preferable from the viewpoint of heat dissipation.

  The light emitting element 4 is electrically connected to the surface electrode portions 3 on both sides. This conductive connection can be performed by connecting the upper electrode of the light emitting element 4 and each surface electrode portion 3 by wire bonding or the like using a thin metal wire 8. As wire bonding, ultrasonic waves or a combination of this and heating can be used.

  Although the light emitting element package of the present embodiment shows an example in which the dam portion 6 is provided when potting the sealing resin 7, the dam portion 6 may be omitted. Examples of the method for forming the weir portion 6 include a method of bonding an annular member, a method of applying and curing an ultraviolet curable resin or the like in a three-dimensional manner with a dispenser, and the like.

  As the resin used for potting, a silicone resin, an epoxy resin, or the like can be suitably used. The potting of the sealing resin 7 is preferably formed with a convex upper surface from the viewpoint of imparting the function of a convex lens, but may be formed with a flat or concave upper surface. The top surface shape of the potting sealing resin 7 can be controlled by the viscosity of the material used, the coating method, the affinity with the coating surface, and the like.

  In the present invention, a convex transparent resin lens may be provided above the sealing resin 7. Since the transparent resin lens has a convex surface, light may be efficiently emitted upward from the substrate. Examples of the lens having a convex surface include a circular shape and an elliptical shape in plan view. The transparent resin and the transparent resin lens may be colored or contain a fluorescent material. In particular, when a yellow fluorescent material is included, white light can be generated using a blue light emitting diode.

[Another embodiment]
(1) In the above-described embodiment, an example in which the face-up type light emitting element is mounted has been described. However, in the present invention, a face-down type light emitting element having a pair of electrodes on the bottom surface may be mounted. In that case, wire bonding or the like may be unnecessary by performing solder bonding or the like. Further, when electrodes are provided on the front and back surfaces of the light emitting element, it is possible to use one wire bonding or the like.

  (2) In the above-described embodiment, an example in which a light emitting element is mounted on a wiring board having a single wiring layer is shown. However, in the present invention, light is emitted to a multilayer wiring board having two or more wiring layers. An element may be mounted. Details of the method of forming the conductive connection structure in that case are described in International Publication No. WO 00/52977, and any of these can be applied.

  (3) Moreover, as another embodiment, the laminated body 24 may not be configured in a roll shape. In this case, the laminate 24 is configured by continuously applying the insulating adhesive to the surface while feeding the roll-shaped metal layer 5. Using this process, the metal layer 21 is continuously laminated on the laminate 24 to obtain a laminate 25. At this time, the insulating adhesive of the laminate 24 can be semi-cured in a B-stage state before being laminated with the metal layer 21.

  (4) As another embodiment, the metal thick portion is continuously formed using the above process while the base metal of the metal layer 21 is fed out to obtain the metal layer 21. A laminate 24 is obtained by continuously laminating the laminate 24 on the metal layer 21 using the process described above.

Sectional drawing which shows an example of the board | substrate for light emitting element packages of this invention Sectional drawing which shows the other example of the board | substrate for light emitting element packages of this invention. The figure which shows an example of the manufacturing method of the board | substrate for light emitting element packages of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulating layer 2 Metal thick part 3 Surface electrode part 4 Light emitting element 7 Sealing resin 21 Metal layer 22 Thermally conductive mask part 24 Laminated body 25 Laminated body (board | substrate member)
30a, 30b roll

Claims (5)

A substrate for a light emitting device package comprising a metal thick portion formed below the mounting position of the light emitting device,
Below the mounting position of the light emitting element, an insulating layer having a thermal conductivity of 1.0 W / mK or more, made of a resin containing a thermally conductive filler,
A metal layer having the metal thick part disposed inside the insulating layer,
A substrate for a light emitting device package, wherein a thermally conductive mask portion is provided on top of the thick metal portion. A method for manufacturing a substrate for a light emitting element package comprising a metal thick portion formed below a mounting position of a light emitting element,
A laminated body having an insulating adhesive having a thermal conductivity of 1.0 W / mK or more and a metal layer member made of a resin containing a thermally conductive filler, and a thick metal portion provided with a thermally conductive mask portion. A method for manufacturing a substrate for a light emitting device package, comprising a lamination step of laminating and integrating a metal layer member having the laminate.   The light emitting device according to claim 2, wherein the laminate having the insulating adhesive and the metal layer member and / or the metal layer member having the metal thick portion provided with the heat conductive mask portion are in a roll shape in advance. A method for manufacturing a package substrate.   A light emitting device package using the light emitting device package substrate according to claim 1.   A light emitting device package using the light emitting device package substrate manufactured according to claim 2.

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