JP4958507B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus, and more particularly, to an improvement in a laser processing apparatus that performs laser processing on a three-dimensional processing surface of an object to be processed by adjusting a focal length of laser light.

  The laser processing apparatus scans a laser beam within a predetermined region and irradiates the surface of a processing target (work) such as a component or product with a laser beam to perform processing such as printing or marking. An example of the configuration of the laser processing apparatus is shown in FIG. The laser processing apparatus shown in FIG. 1 includes a laser output unit 1, a laser control unit 2, and an input unit 3. The pumping light generated by the pumping light generator 23 of the laser controller 2 is irradiated to the laser medium 32 constituting the oscillator by the laser oscillator 10 of the laser output unit 1 to cause laser oscillation. The laser oscillation light is emitted from the emission end face of the laser medium 32, the beam diameter is enlarged by the beam expander 11, reflected by the optical member, and guided to the scanning unit 12. The scanning unit 12 reflects the laser beam L and deflects it in a desired direction, and the laser beam L output from the condensing unit 13 is scanned on the surface of the workpiece W to perform processing such as printing.

  The laser processing apparatus includes a scanning unit 12 as shown in FIG. 5 in order to cause the laser light L to scan on the workpiece W. The scanning unit 12 includes XY-axis scanners 14a and 14b constituting a pair of galvanometer mirrors, and galvano motors 15a and 15b for fixing and rotating each galvanometer mirror to a rotation shaft. As shown in FIG. 5, the XY axis scanners 14a and 14b are arranged in a posture orthogonal to each other, and can scan the laser light L by reflecting it in the X direction and the Y direction. A light collecting unit 13 is provided below the scanning unit 12. The condensing part 13 is comprised with a condensing lens, and an f (theta) lens is used.

  On the other hand, not only a laser processing apparatus that performs processing in such a two-dimensional plane, but also a laser that enables three-dimensional processing by adjusting the focal length of the laser light L in the height direction, that is, the Z-axis direction. Processing equipment has also been developed. FIG. 6 and FIG. 7 show a laser processing apparatus that can change the focal length by adding a beam expander 11 that can adjust the beam diameter, as an example of such a laser processing apparatus that can perform three-dimensional processing. The beam expander 11 includes an incident lens 40 facing the laser oscillating unit 10 and an exit lens 41 facing the laser exit side. These lenses are slid by a drive motor or the like between the lenses. The working distance in the height direction can be adjusted by changing the distance and adjusting the beam diameter.

  When a processing pattern such as a character is printed on the workpiece W, the processing pattern is determined by designating an irradiation position on a reference plane that is usually defined with the condenser lens of the laser output unit 1 as a reference. Since this reference surface is predetermined as a plane perpendicular to the optical axis of the condenser lens, the processed surface on the workpiece W may be inclined relative to the reference surface depending on the mounting state of the laser output unit 1 or the like. It is believed that there is. When the processing surface is tilted with respect to the reference surface, there is a problem that a processing pattern specified on the reference surface and a processing pattern actually printed are displaced in shape and size.

  Further, when printing a machining pattern of the same shape and the same size on the workpiece W having different heights, the maximum area where the laser beam L can be scanned on the machining surface is usually narrower as the height of the machining surface becomes higher. Therefore, depending on the height of the processed surface, there is a problem that a portion that is not scanned and printed is generated.

  The present invention has been made in view of the above circumstances, and provides a laser processing apparatus capable of processing a processing pattern correctly even when the processing surface on the processing object is relatively inclined. The purpose is to do. It is another object of the present invention to provide a laser processing apparatus capable of appropriately processing a processing pattern having the same shape and the same size on a processing surface designated by a user even if the processing objects have different heights.

According to a first aspect of the present invention, there is provided a laser processing apparatus for moving a laser spot within a maximum scanning region composed of a cone having an emission point of a laser beam as a vertex based on position information based on a processing reference plane. A laser oscillation unit that generates laser light, and a beam expander that adjusts a focal length of the laser light by moving an optical lens disposed on the optical axis of the laser light in the optical axis direction ; , using a pair of galvano mirrors, the laser beam transmitted by the beam expander and a two-dimensional scanner for scanning on a plane parallel to the working reference plane, to the maximum scanning area, parallel to the working reference plane And a scanning area limiting means for limiting the scanning area of the laser beam by the two-dimensional scanner to the columnar area. It is.

  In this laser processing apparatus, the focal length of the laser beam is adjusted, and the laser beam is scanned on a plane parallel to the processing reference plane. At this time, a columnar region is formed in a scanning region composed of a cone having the laser beam emission point as a vertex, and the laser light scanning area is limited to this columnar region. With such a configuration, the scanning area is limited within the same area regardless of the position of the plane parallel to the machining reference plane, so that machining patterns can be machined even on workpieces with different heights. The object can be processed correctly.

In the laser processing apparatus according to the second aspect of the present invention, in addition to the above-described configuration, the scanning area limiting unit is configured to scan the laser light by the two-dimensional scanning unit based on a predetermined area determined on the processing reference plane. Configured to restrict.

In addition to the above-described configuration, the laser processing apparatus according to the third aspect of the present invention is configured such that the columnar body has the scanning area of the two-dimensional scanner at the lower limit of the predetermined movable range of the focal length as an end surface.

In addition to the above-described configuration, the laser processing apparatus according to the fourth aspect of the present invention is configured such that the columnar body has an end surface at the scanning area of the two-dimensional scanner at the upper limit of a predetermined movable range of the focal length.

  According to the laser processing apparatus of the present invention, the position coordinates are appropriate based on the position coordinates of the reference point before and after the change even when the processing surface on the workpiece is inclined relative to the reference surface. Therefore, the processing pattern can be processed correctly. In addition, even if the processing objects have different heights, the same shape and the same size surface area is designated as the scanning target area, so that the same shape and the same size processing pattern can be processed correctly into the processing object. it can.

Embodiment 1 FIG.
First, after describing the overall configuration of the laser processing apparatus 100 according to the first embodiment of the present invention, details of the laser oscillation unit 10, the beam expander 11, the scanning unit 12, and the excitation light generation unit 23 included in the laser processing apparatus 100. Will be further described.

  FIG. 1 is a block diagram showing a configuration example of a laser processing apparatus 100 according to Embodiment 1 of the present invention. The laser processing apparatus 100 is an apparatus that performs surface processing by irradiating a workpiece W with laser light L. In addition, surface processing performed using the laser processing apparatus 100 includes peeling processing for thinly peeling the surface of the object W, marking for printing characters and barcodes on the surface of the object W, and thin objects. For example, a drilling process for forming a through hole in the object W is included.

  The laser processing apparatus 100 includes a laser output unit 1 that irradiates a workpiece W with a laser beam L, a laser control unit 2 that controls the operation of the laser output unit 1, and an input unit through which a user inputs setting data. 3.

(Laser output unit 1)
The laser output unit 1 is a laser irradiation device capable of three-dimensionally scanning the laser light L, and includes a laser oscillation unit 10, a beam expander 11, a scanning unit 12, a condensing lens 13, and a scanner driving circuit 16. . The laser light L as the guide radiation emitted from the laser medium 32 in the laser oscillating unit 10 passes through the beam expander 11 and the scanning unit 12 in order, and then is collected on the processing surface of the workpiece W by the condenser lens 13. Lighted. An fθ lens is used as the condenser lens 13.

  The fθ lens is an optical lens having an optical characteristic that does not change the intensity of the emitted light even when the incident angle changes when the light beam incident from the focal position is collected and emitted. Here, it is assumed that the X-axis scanner 14a and the Y-axis scanner 14b are arranged at the focal position of such an fθ lens.

  The beam expander 11 is a Z-axis scanner that moves the focal point of the laser light L in the optical axis direction of the condenser lens 13 by controlling the beam diameter of the laser light L. The scanning unit 9 is a two-dimensional scanner that moves the laser light L in a plane perpendicular to its optical axis, and focuses the laser light L in the X-axis direction and Y-axis in a plane perpendicular to the optical axis of the condenser lens 13. It can be scanned in the axial direction. That is, the laser output unit 1 can perform a three-dimensional scan of the laser light L using the beam expander 11 and the scanning unit 12. The scanner drive circuit 16 is a drive circuit that supplies drive signals to the beam expander 11 and the scanning unit 9 and performs drive control thereof.

(Laser controller 2)
The laser control unit 2 is a control device that controls the operation of the laser output unit 1, and includes a memory unit 21, a control unit 22, an excitation light generation unit 23, and a power source 24. The memory unit 21 is a storage unit that holds setting data input from the input unit 3 and other control data. For example, a semiconductor memory such as a ROM or a RAM is used.

  The control unit 22 is a control unit that controls the excitation light generation unit 23 and the laser output unit 1 based on the data in the memory unit 21. For example, a microprocessor is used. A scanning signal for three-dimensionally scanning the laser light L is generated by the control unit 22 and supplied to the scanner driving circuit 16 in the laser output unit 1. A print signal for controlling the print operation is also generated by the control unit 22 and supplied to the excitation light generation unit 23.

  The excitation light generation unit 23 is applied with a predetermined voltage from a power source 24 as a constant voltage source, and generates excitation light based on a print signal from the control unit 22. This excitation light is supplied to the laser output unit 1 through the optical fiber and input to the laser oscillation unit 10. The print signal is a control signal for switching ON / OFF of the excitation light according to the HIGH / LOW. In other words, the print signal is a PWM (Pulse Wide Modulation) signal in which one pulse corresponds to one pulse of the excitation light, and the intensity of the excitation light can be controlled by the frequency and duty ratio. The intensity (laser power) of the generated laser beam L can be controlled.

(Input unit 3)
The input unit 3 is an input device for a user to input various setting data regarding the operation of the laser processing apparatus 100, and a keyboard, a touch panel, a mouse, or the like can be used. For example, the operating conditions of the laser processing apparatus 100 and the contents of printing are input by the user and output from the input unit 3 to the laser control unit 1. Although not shown, a display unit for confirming the setting data input by the input unit 3 and displaying the state of the laser control unit 2 and the like may be provided separately.

(Excitation light generator 23)
FIG. 2 is a perspective view showing an example of the inside of the excitation light generator 23. The excitation light generation unit 23 is configured by fixing an excitation light source 25 and an excitation light condensing unit 26 optically joined in a casing 27. The excitation light source 25 is a light source device that generates excitation light to be supplied to the laser oscillation unit 10, and its heat dissipation is efficiently performed by a casing 27 made of metal such as brass having good thermal conductivity. In this example, a laser diode array in which a plurality of semiconductor laser diode elements are arranged in a straight line is used as the excitation light source 25, and the excitation light is condensed as parallel light in which the laser beams generated by the elements are arranged in a straight line. Is output to the unit 26. The excitation light condensing unit 26 is composed of a focusing lens or the like, and makes the excitation light from the excitation light source 25 enter the optical fiber cable 28. The optical fiber 28 is a pumping light transmission path that optically couples the pumping light generator 23 and the laser oscillator 10.

(Laser oscillator 10)
FIG. 3 is a diagram illustrating a configuration example of the laser oscillation unit 10. The laser oscillation unit 10 is a laser oscillation device that generates laser light by irradiating the laser medium 32 with excitation light and amplifying the stimulated emission light in a resonator. The excitation light input from the excitation light generation unit 23 via the optical fiber cable 28 is condensed into the laser medium 32 by the incident lens 30, and the induced emission light is emitted from the laser medium 32. The induced radiation light is reflected by the incident mirror 31 and the output mirror 35 disposed opposite to each other and is incident on the laser medium 32 again.

  The incident mirror 31 is a half mirror that transmits incident light from the incident lens 30 side and totally reflects incident light from the laser medium 32 side. The output mirror 35 is a semi-transmissive mirror that reflects most of the laser light and transmits part of the laser light. The transmitted light of the output mirror 35 is incident on the beam expander 11. The incident mirror 31 and the output mirror 35 arranged opposite to each other form a resonator optical axis 36 for reciprocating laser light, and a laser medium 32, a Q switch 33, and an aperture 34 are sequentially arranged on the resonator optical axis 36. Has been.

  The Q switch 33 is an acoustic optical modulator (AOM: Acoustic Optical Modulator) that diffracts laser light, and the aperture 34 is a stop that blocks laser light that is off the resonator optical axis 36, and the Q switch 33 and aperture 34. Can be used to stop laser oscillation. That is, if the Q switch 33 diffracts the laser light so that the optical axis of the laser light is outside the resonator optical axis 36, the laser light is blocked by the aperture 34 and laser oscillation stops.

(Laser medium 32)
For the laser medium 32, for example, Nd: YVO ₄ (yttrium vanadate doped with neodymium ions) can be used. In this case, excitation light having a wavelength of 809 nm which is the center wavelength of the absorption spectrum of Nd: YVO ₄ is used. Further, rare earth doped YAG, LiSrF, LiCaF, YLF, NAB, KNP, LNP, NYAB, NPP, GGG or the like can also be used as the laser medium 32. Furthermore, the wavelength of the laser beam L to be output can be converted to an arbitrary wavelength by combining a wavelength conversion element with such a solid laser medium.

Further, it is possible to use a wavelength conversion element that performs only wavelength conversion without using a solid-state laser medium, in other words, without having a resonator for laser oscillation. In this case, wavelength conversion is performed on the output light of the semiconductor laser. Examples of the wavelength conversion element include KTP (KTiPO ₄ ), organic nonlinear optical materials and other inorganic nonlinear optical materials such as KN (KNbO ₃ ), KAP (KAsPO ₄ ), BBO, LBO, and bulk polarization inversion elements ( LiNbO ₃ (Periodically Polled Lithium Niobate: PPLN), LiTaO ₃ or the like) can be used. Further, a semiconductor laser for an excitation light source of a laser by up-conversion using a fluoride fiber doped with rare earth such as Ho, Er, Tm, Sm, and Nd can be used. Thus, in this embodiment, various types can be appropriately used as a laser generation source.

Further, the laser oscillation section 10 is not limited to the solid-state laser, CO ₂ and helium - it neon, argon, also use a gas laser using a gas such as nitrogen as a laser medium. For example, when a carbon dioxide laser is used, the laser oscillation unit 10 is filled with carbon dioxide gas (CO ₂ ) and has an electrode built therein. Based on a print signal given from the laser control unit 2, laser oscillation is performed. The carbon dioxide gas in the unit 10 is excited to cause laser oscillation.

(Beam Expander 11)
FIG. 4 is a diagram illustrating a configuration example of the beam expander 11. (A) in the figure is a view of the beam expander 11 viewed from the optical axis direction of the laser light L, and (b) in the figure is a cross section when cut along a plane including the optical axis of the laser light L. FIG.

  The beam expander 11 is configured by arranging two optical lenses, that is, an incident lens 40 and an exit lens 41 on the optical axis of the laser light L. The movable portion 42 is slidably held by a guide shaft 43 disposed in the optical axis direction, and is driven by the interaction between the coil and the magnet, and its position is controlled based on a drive signal from the scanner drive circuit 16. Has been. The exit lens 41 is fixed on the optical axis, whereas the incident lens 40 is held by the movable part 42. Therefore, the distance between the lenses 40, 41 is obtained by moving the movable part 42 in the optical axis direction. Can be changed.

  The laser light L incident from the laser oscillation unit 10 is parallel light having a constant beam diameter regardless of the optical path length, but passes through the incident lens 40 so that the beam diameter changes according to the optical path length. It becomes parallel light. In other words, as the optical path length increases, the beam diameter increases or decreases. The non-parallel light is then returned to parallel light again by passing through the exit lens 41. Accordingly, the beam diameter of the laser light L emitted from the emission lens 41 is different from the beam diameter of the laser light L incident on the incident lens 40, and the difference is determined by the distance between the lenses 40 and 41. In this manner, the beam expander 11 controls the beam diameter of the laser light L by moving the movable portion 42 based on the drive signal from the scanner drive circuit 16.

  If the beam diameter of the laser beam L can be controlled, the focal point of the laser beam L can be moved in the optical axis direction of the condenser lens 13. Accordingly, if the optical axis direction of the condenser lens 13 is the Z direction, the beam expander 11 becomes a Z-axis scanner that scans the laser light in the Z-axis direction. The beam expander 11 only needs to be able to control the distance between the lenses 40 and 41, and may fix the incident lens 40 and move the exit lens 41, or the incident lens 40 and the exit lens 41 may be moved. Both can be movable.

(Scanning unit 12)
FIG. 5 is a perspective view illustrating a configuration example of the scanning unit 12. The scanning unit 12 includes a pair of galvano mirrors 14a and 14b and galvano motors 15a and 15b that rotate the galvano mirrors 14a and 14b, respectively. The galvano mirrors 14a and 14b are total reflection mirrors that reflect laser light, and are attached to the rotation shafts of the galvano motors 15a and 15b, respectively. For example, stepping motors are used as the galvano motors 15a and 15b, and their rotation angles can be freely changed within a range where the galvano mirrors 14a and 14b do not interfere with each other based on a drive signal from the scanner drive circuit 16. .

  The laser light incident on the scanning unit 12 is two-dimensionally scanned in a plane perpendicular to the optical axis of the laser light L by the two galvanometer mirrors 14a and 14b. That is, the laser beam L irradiated to the workpiece W is two-dimensionally scanned in a direction orthogonal to the optical axis of the condenser lens 13. That is, if two axes that are orthogonal to the Z axis and the two orthogonal axes are the X axis and the Y axis, the galvano mirror 14a becomes an X axis scanner that scans the laser light L in the X axis direction, and the galvano mirror 14b becomes the laser light L Is an X-axis scanner that scans in the Y-axis direction.

  Next, the operation of the laser processing apparatus 100 in FIG. 1 will be described. Specifically, the Z-axis scan operation using the beam expander 11, the distance pointer display, the focus correction process, and the installation position correction process will be described in order.

(Z-axis scan operation)
6 and 7 are explanatory diagrams relating to the scanning operation in the Z-axis direction using the beam expander 11, in which a scanning system including the beam expander 11 and the scanning unit 12 is shown, and the condenser lens 13 is omitted. Yes. Here, a case where the beam diameter of the laser light L increases as the distance between the incident lens 40 and the outgoing lens 41 in the beam expander 11 becomes shorter will be described.

  The inter-lens distance Rd1 shown in FIG. 6 is shorter than the inter-lens distance Rd2 in FIG. Therefore, the beam diameter of the laser light L emitted from the beam expander 1 is larger in FIG. 6, and the focal length Ld1 in FIG. 6 is longer than the focal length Ld2 in FIG. That is, the working distance that is the distance from the laser processing apparatus 100 to the workpiece W can be increased by shortening the inter-lens distances Rd1 and Rd2. Conversely, if the distance between the lenses is increased, the beam diameter of the laser light L is reduced, the focal length of the laser light L is shortened, and the working distance can be shortened.

  In recent years, not only a laser processing apparatus capable of scanning in a two-dimensional plane but also a laser processing apparatus capable of adjusting the focal length in the height direction, that is, a laser processing apparatus capable of processing in three dimensions has been developed. However, such a three-dimensional laser marker can only change the height of two-dimensional planar printing stepwise, and performs high-quality printing on curved surfaces such as cans and inclined surfaces. I couldn't. Therefore, the present inventors can adjust the focal position freely by providing a Z-axis scanner as a variable focus optical system in addition to the X-axis scanner and the Y-axis scanner, and thereby, along the surface shape of the workpiece. A laser processing apparatus capable of processing three-dimensionally is realized.

(Distance pointer display)
This laser processing apparatus 100 can irradiate the work W with visible light such as red light and display a distance pointer on the work W. The distance pointer is a visually recognizable pattern whose shape changes according to the distance to the irradiation surface. The irradiation distance can be specified, and the distance to the workpiece W (working distance) matches the irradiation distance. When it is, it becomes a characteristic shape. For this reason, by displaying the distance pointer on the work W, it is possible to visually confirm whether the working distance matches the irradiation distance designated in advance.

  8 to 10 are explanatory views of the distance pointer. FIG. 8 is a perspective view showing the optical system of the laser processing apparatus 100. FIG. 9 is a perspective view of FIG. 8 viewed from the opposite direction. These are sectional drawings by the cut surface containing the optical axis of the condensing lens 13. FIG. In these drawings, in addition to the beam expander 11 and the X-axis / Y-axis scanners 14a and 14b, a guide light source 60, a guide light mirror 62, a pointer light source 64, a pointer scanner mirror 14d, and a distance control mirror 66 are shown. It is shown. Note that the condensing lens 13 is omitted.

  The guide light source 60 is a light source device that generates guide light G composed of visible light, and for example, a red laser diode is used. The guide light G emitted from the guide light source 60 is reflected by the guide light mirror 62 provided on the optical path of the laser light L and enters the optical path of the laser light L. The guide light mirror 62 is a half mirror that transmits the laser light L incident from the laser oscillation unit 10 side and totally reflects the guide light G incident on the opposite surface. The guide light G that has entered the optical path of the laser light L is irradiated onto the workpiece W while being scanned in the X-axis direction by the X-axis scanner 14a. At this time, on the irradiated surface, a linear guide pattern GP extending in the X-axis direction is displayed so as to be visible using an afterimage phenomenon.

  If the guide light G is two-dimensionally scanned using the XY scanners 14a and 14b, the guide light G can be irradiated at the same position as the irradiation position of the laser light L. For this reason, the irradiation position of the laser beam L can be visually confirmed in advance by irradiating the guide beam G before the irradiation of the laser beam L and performing XY scanning similar to that at the irradiation of the laser beam L.

  The pointer light source 64 is a light source device that generates pointer light P made of visible light, and a red laser diode can be used as in the case of the guide light source 60. The pointer light P emitted from the pointer light source 64 is sequentially reflected by the pointer scanner mirror 14d and the distance control mirror 66, and is irradiated onto the workpiece W. At this time, a dotted pointer pattern PP is displayed on the irradiation surface so as to be visible. The pointer scanner mirror 14d is a mirror formed on the back surface of the Y-axis scanner 14b, and the distance control mirror 66 is fixed at a position shifted in the Y-axis direction from the optical axis (that is, the Z-axis) of the condenser lens 13. ing.

  The pointer light P reflected by the distance control mirror 66 has an angle with respect to the guide light G in the YZ plane, and crosses the guide light G through an optical path corresponding to this angle. This angle is controlled by the inclination of the distance control mirror 66. Therefore, if the distance control mirror 66 is controlled based on the distance of the distance pointer designated by the user, the guide light G and the pointer light P can be crossed at a position away from the laser processing apparatus 100 by the irradiation distance. .

  FIG. 11 is a diagram illustrating an example of a distance pointer. Here, two guide patterns GP extending in the X-axis direction displayed by the guide light G and one point-like pointer pattern PP displayed by the pointer light P are shown. (B) in the figure shows a case where the irradiation distance designated by the user matches the actual distance to the irradiation surface. Also, (a) shows the case where the actual distance is shorter than the irradiation distance, and (c) shows the case where the actual distance is farther than the irradiation distance.

  That is, if the pointer pattern PP is located at the center of the two guide patterns GP, it can be confirmed that the distance distance of the distance pointer designated by the user and the actual working distance match. Even if they do not match, it is possible to know whether they are too close or too far away. For this reason, if the irradiation distance is changed while displaying the distance pointer, the actual distance (working distance) to the workpiece W can be measured.

<Offset adjustment in height direction>
FIG. 12 is a block diagram showing a configuration example of a laser marking system including the laser processing apparatus 100 of FIG. This laser marking system includes a laser processing apparatus 100, a work sensor 101, a height measuring instrument 102, and an external device 200 connected to the laser processing apparatus 100 via a communication cable. The laser output unit 1 of the laser processing apparatus 100 is arranged on a production line, for example, irradiates the workpiece W flowing through the production line with the laser light L, and processes a processing pattern such as letters on the surface of the workpiece W.

  The workpiece sensor 101 is an object detection unit that detects the workpiece W on the production line, generates a detection signal, and outputs the detection signal to the laser controller 2. For example, the workpiece detection light is irradiated to the workpiece W, the reflected light from the workpiece W is received, and the presence or absence of the workpiece W is detected based on the intensity change of the reflected light.

  The height measuring device 102 is a sensor that measures the height of the workpiece W on the production line, and is disposed on the upper side of the workpiece W. For example, the light for detecting the height is irradiated onto the workpiece W, the reflected light from the workpiece W is received, and the height of the workpiece W is detected based on the intensity of the reflected light. Here, it is assumed that a voltage signal (analog signal) whose voltage changes according to the height of the workpiece W is output to the laser control unit 2 as a height measurement result.

  The height measurement by the height measuring device 102 is performed in synchronization with the detection signal of the work sensor 101. That is, it is performed at the timing when the workpiece W detected by the workpiece sensor 101 moves below the height measuring device 102.

  In the laser control unit 2, based on a trigger signal input from the external device 200, control is sequentially performed on a plurality of workpieces W having different machining surface A heights. Here, it is assumed that a personal computer 210, a console 220, and a PLC 230 are connected as external devices. The personal computer 210 is an information processing terminal for generating processing pattern information for printing characters or the like, or for instructing the laser processing apparatus 100 with control parameters specified by the user.

  A PLC (Programmable Logic Controller) 230 controls a driving device of the production line, various sensors, etc., instructs the laser processing apparatus 100 on control parameters specified by the user, or starts irradiation of the laser light L. This is a rewritable control device for generating a trigger signal for instructing. The console 220 is a display capable of displaying the operation state of the PLC 230 on the screen and inputting various control parameters by operating icons on the screen.

  In the laser processing apparatus 100, the height of the processed surface is adjusted using the detection signal from the work sensor 101 as a strobe signal, and the irradiation of the laser light L is started based on the trigger signal from the PLC 230.

  FIG. 13 is a block diagram showing a configuration example of the laser control unit 2 in the laser processing apparatus 100 of FIG. The laser control unit 2 includes an identification information acquisition unit 111, a height information storage unit 112, an offset designation generation unit 115, a processing pattern storage unit 116, a processing pattern change processing unit 117, a post-change pattern storage unit 118, and a beam diameter adjustment unit. 119 and the scanning control unit 120.

  The identification information acquisition unit 111 transmits an identification information transmission request of the work W to the external device 200 and performs an operation of acquiring the identification information from the external device 200. The identification information acquisition unit 111 acquires the identification information in synchronization with the strobe signal from the work sensor 101, and the acquired identification information is output to the offset designation generation unit 115. That is, identification information is acquired at the timing when the workpiece W is detected by the workpiece sensor 101.

  The height information storage unit 112 is a memory that stores a plurality of height information 114 in association with the identification information 113 of the workpiece W. The height information 114 is information indicating the height of the machining surface when machining the machining pattern on the workpiece W. Here, the height information 114 is assumed to be designated in advance by the user for each piece of identification information 113 such as a workpiece number.

  The offset designation generation unit 115 performs an operation for generating an offset designation according to an operation mode designated by the user. The offset designation is information for designating an offset amount of the machining surface with respect to the machining reference surface, and the generated offset designation is output to the machining pattern change processing unit 117.

  The processing reference plane is a plane that serves as a reference for position information used in laser processing, and is determined in advance based on the emission point from which the laser beam L is emitted from the laser output unit 1. Here, it is assumed that the processing reference plane is determined based on the fθ lens of the condensing unit 13 disposed at the exit point, and is a plane perpendicular to the optical axis of the fθ lens. The position of the processing reference plane is determined based on an adjustable range with respect to the focal length of the laser light L. Laser processing is performed based on position information with reference to such a processing reference surface. The offset amount in the offset designation is defined as a deviation between the processing reference surface and the processing surface in the optical axis direction of the fθ lens.

  Here, it is assumed that three operation modes of “Z value selection”, “strobe”, and “real operation” are defined as operation modes that can be specified by the user. In the operation mode “Z value selection”, the height information 114 is read from the height information storage unit 112 based on the identification information acquired by the identification information acquisition unit 111, and based on the read height information 114. An offset specification is generated. In “strobe”, an offset designation is generated based on the voltage signal from the height measuring device 102. In the “real operation”, the height measuring device 102 performs height measurement a plurality of times with different positions on the same workpiece W, and an offset designation is generated for each height measurement.

  The machining pattern storage unit 116 is a memory that stores machining pattern information including position information with reference to the machining reference plane. Specifically, the position on the processing reference plane that is the irradiation target of the laser beam L and the focal length of the laser beam L at this position are defined for each irradiation spot and stored as processing pattern information.

  Here, the intensity of the irradiation light on the processing reference surface does not change even if the irradiation position on the processing reference surface changes due to the optical characteristics of the fθ lens. Changes need not be taken into account. Therefore, here, as the focal length of the laser light L associated with the irradiation position, a deviation from the reference value, that is, a deviation of the focal position in the optical axis direction of the fθ lens with respect to the processing reference plane is defined.

  The machining pattern change processing unit 117 reads the machining pattern information from the machining pattern storage unit 116 and performs a process of changing the focal length in the machining pattern information based on the offset designation from the offset designation generation unit 115. Specifically, the three-dimensional position coordinates for each irradiation spot are changed based on the offset designation, and the height of the processed surface is adjusted.

  The post-change pattern storage unit 118 is a memory that stores processing pattern information after the focal length is changed by the processing pattern change processing unit 117.

  The beam diameter adjustment unit 119 controls the beam expander 11 based on the processing pattern information read from the post-change pattern storage unit 118 and performs an operation for adjusting the beam diameter of the laser light L. The scanning control unit 120 controls the X-axis scanner 14a and the Y-axis scanner 14b based on the processing pattern information read from the post-change pattern storage unit 118, and performs an operation of scanning the laser light L on the processing reference plane. .

  Here, even if the height of the processed surface, that is, the position of the processed surface in the optical axis direction of the fθ lens changes, the shape, size, and position of the irradiation spot in the direction perpendicular to the optical axis do not change. It is assumed that the rotation angles of the X-axis scanner 14a and the Y-axis scanner 14b are controlled.

FIG. 14 is a perspective view showing an example of the operation in the laser processing apparatus 100 of FIG. 12, and shows the state of the processing reference plane C defined as a plane perpendicular to the optical axis B of the fθ lens 13a. The processing reference plane C is determined such that the distance from the disk-shaped fθ lens 13a is a predetermined value, and is a plane parallel to the fθ lens 13a. In the processing pattern information indicating the processing pattern such as characters, the irradiation position D (x ₀ , y ₀ ) of the laser beam L on the processing reference plane C and the optical axis B direction at the irradiation position D (x ₀ , y ₀ ). focal position _{z 0} is defined.

  Here, it is assumed that the three-dimensional position coordinates of the irradiation spot are determined with the direction parallel to the processing reference plane C as the x-axis direction and the y-axis direction and the direction parallel to the optical axis B as the z-axis direction.

FIG. 15 is a diagram illustrating a configuration example of the machining pattern change processing unit 117 in the laser control unit 2 of FIG. When printing a print pattern such as a character, for example, when two-dimensional position information (x ₀ , y ₀ ) of the print pattern is input on the personal computer 210, the three-dimensional information is converted based on the shape information z ₀ of the workpiece. Conversion is performed, and three-dimensional irradiation position information (x ₀ , y ₀ , z ₀ ) is generated. The shape information z ₀ of the processing target is height difference information indicating the unevenness of the print target surface in the processing target, and is specified in advance in association with a two-dimensional position in a direction parallel to the processing reference surface C. The shape information z ₀ is one-dimensional information that differs for each two-dimensional position (x ₀ , y ₀ ).

In the processing pattern change processing unit 117 of the laser processing apparatus 100, irradiation position information for each irradiation spot is set as an input value (x ₀ , y ₀ , z ₀ ), and this input value (x ₀ , y ₀ , z ₀ ) and the offset amount z ₁ are added to output an output value (x ₀ , y ₀ , z ₀ + z ₁ ). Such an addition process is performed for all irradiation positions D (x ₀ , y ₀ ) on the processing reference plane C. In this case, the offset amount z ₁ is a one-dimensional position information determined according to the actual workpiece to be printed from now print pattern, machining a machining reference surface C, the shape information z ₀ is a reference It is the height difference information from the reference point on the object. This offset amount z ₁ is a common value for all irradiation positions D (x ₀ , y ₀ ).

According to such a configuration, when printing a common printing pattern into a plurality of workpieces W of different heights, since the irradiation position information is appropriately changed based on the offset amount z _1, printing accuracy between the workpiece And variations in print quality can be prevented.

(Z value selection)
FIG. 16 is a diagram showing an example of the operation in the laser processing apparatus 100 of FIG. 12, and shows the state of offset adjustment in the height direction in the Z value selection mode. In this example, processing for adjusting the height of the processed surface, that is, the printing height, is performed in synchronization with the strobe signal from the workpiece sensor 101. The machining surface offset amount z ₁ is changed based on a trigger signal from the PLC 230. The trigger signal from the PLC 230 is a timing signal for starting a printing operation, and scanning control of the laser light L is performed in synchronization with the trigger signal, and a processing pattern is printed on the workpiece W.

  Specifically, when information specifying an operation mode, control parameters, processing pattern information, and the like are transferred from the personal computer 210 as print data, the operation mode is switched. In the Z value selection mode, the print height adjustment process is started based on the strobe signal input from the work sensor 101.

  In this print height adjustment process, first, the work number (identification information of the work W) read from the work W by the external device 200, for example, the PLC 230 using the sensor, is acquired from the PLC 230 and associated with the work number. Height information 114 is read out. Then, an offset designation is generated based on the read height information 114, and the focal length in the processing pattern information is changed.

  Steps S101 to S108 in FIG. 17 are flowcharts showing an example of the operation in the Z value selection mode in the laser processing apparatus 100 in FIG. First, when the laser processing apparatus 100 acquires print data from the personal computer 210, the laser processing apparatus 100 switches the operation mode (step S101). At this time, when a strobe signal is input from the work sensor 101, the identification information acquisition unit 111 transmits a transmission request to the PLC 230 in synchronization with the strobe signal, and acquires a work number from the PLC 230 (steps S102 and S103). .

  Next, the offset specification generation unit 115 reads the height information 114 associated with the work number acquired by the identification information acquisition unit 11 from the height information storage unit 112, and generates an offset specification (step S104). The machining pattern change processing unit 117 calculates the Z value (Z component) in the three-dimensional position coordinates of the machining pattern information based on this offset designation, and the modified machining pattern information is generated (step S105).

  Next, when a trigger signal is input from the PLC 230, the beam diameter adjusting unit 119 and the scanning control unit 120 start a printing operation based on the changed pattern information (steps S106 and S107). The processing procedure from step S101 to step S107 is repeated until the end of printing is instructed from the external device 200, for example, the PLC 230.

(Strobe)
The strobe mode, the height of the workpiece W in synchronization with the strobe signal inputted from the work sensor 101 is measured, the offset amount z ₁ of the processing surface is changed. Then, scanning control of the laser light L is performed in synchronization with a trigger signal from the PLC 230 that is input after the adjustment of the printing height, and a machining pattern is printed on the workpiece W.

Specifically, when information specifying an operation mode, control parameters, processing pattern information, and the like are transferred from the personal computer 210 as print data, the operation mode is switched. The strobe mode, the control parameters of the height gauge 102 is acquired from the personal computer 210, the voltage signal from the height gauge 102 based on the acquired control parameters are converted to the offset amount z ₁ of the processing surface.

  Here, it is assumed that the input range of the voltage signal is +10 V (volt) to −10 V, and the zero point adjustment of the voltage signal is performed in advance based on the height of the reference plane.

  Steps S201 to S209 in FIG. 18 are flowcharts showing an example of the operation in the strobe mode in the laser processing apparatus 100 in FIG. First, when the laser processing apparatus 100 acquires print data and control parameters of the height measuring device 102 from the personal computer 210, the laser processing apparatus 100 switches the operation mode (steps S201 and S202). At this time, when the strobe signal is input from the work sensor 101, the offset designation generation unit 115 determines the height of the work W in synchronization with the strobe signal and generates an offset designation (steps S203 to S205). The machining pattern change processing unit 117 calculates the Z value (Z component) in the three-dimensional position coordinates of the machining pattern information based on the offset designation, and the modified machining pattern information is generated (step S206).

  Next, when a trigger signal is input from the PLC 230, the beam diameter adjusting unit 119 and the scanning control unit 120 start a printing operation based on the changed pattern information (steps S207 and S208). The processing procedure from step S201 to step S208 is repeated until the end of printing is instructed from the external device 200, for example, the PLC 230.

(Real operation)
The real operation mode, the height of the workpiece W in synchronization with the strobe signal inputted from the work sensor 101 is measured, the offset amount z ₁ of the processing surface is changed. At that time, the height measuring device 102 performs a plurality of height measurements on the same workpiece W with different positions in the moving direction of the workpiece W, and an offset designation is generated for each height measurement. .

Specifically, the height is measured by changing the position in the moving direction of the workpiece W according to the flow of the production line. Then, the offset amount z ₁ of the processing surface in accordance with the movement of the workpiece W is adjusted. The offset amount is adjusted every scanning cycle in the movement direction.

FIG. 19 is a perspective view showing an example of the operation in the real operation mode in the laser processing apparatus 100 of FIG. 12, and shows a state in which printing is performed on the same workpiece W while changing the position in the moving direction. Has been. The workpiece W has different heights of the machining surface A at predetermined intervals in the direction of the flow of the production line. In real operation mode, the height of the working surface A in accordance with the movement of the workpiece W is measured, the offset amount z ₁ of the processing surface A is appropriately adjusted.

  In this example, different processing patterns (here, letters “A”, “B”, etc.) are sequentially printed on four processing surfaces A having different heights.

  Steps S301 to S308 in FIG. 20 are flowcharts showing an example of the operation in the real operation mode in the laser processing apparatus 100 in FIG. First, when the laser processing apparatus 100 acquires print data and control parameters of the height measuring device 102 from the personal computer 210, the laser processing apparatus 100 switches the operation mode (steps S301 and S302). At this time, when the strobe signal is input from the work sensor 101, the offset designation generation unit 115 determines the height of the processing surface A, that is, the printing height in synchronization with the strobe signal, and generates the offset designation. (Steps S303 to S305). The machining pattern change processing unit 117 calculates the Z value (Z component) in the three-dimensional position coordinates of the machining pattern information based on this offset designation, and the modified machining pattern information is generated (step S306).

  Next, when the trigger signal is input from the PLC 230, the beam diameter adjusting unit 119 and the scanning control unit 120 start a printing operation based on the changed pattern information (step S307). The processing procedure from step S301 to step S307 is repeated until the end of printing is instructed from the external device 200, for example, the PLC 230.

  In FIG. 19 and FIG. 20, an example has been described in which an offset designation is generated for each measurement of height that is measured a plurality of times with different positions in the moving direction of the workpiece W with respect to the same workpiece W. The present invention is not limited to this. For example, the height of the same workpiece W may be varied in the direction crossing the moving direction of the workpiece W, the height measurement may be performed a plurality of times, and an offset designation may be generated for each height measurement.

  FIG. 21 is a perspective view showing another example of the operation in the real operation mode in the laser processing apparatus 100 of FIG. 12, and printing is performed while changing the position in the direction crossing the moving direction with respect to the same workpiece W. Is shown. The workpiece W has different heights on the machining surface A at predetermined intervals in the direction intersecting the flow direction of the production line (moving direction of the workpiece W), and printing is performed while changing the position in the intersecting direction. Is called. In this example, the direction perpendicular to the moving direction of the workpiece W is set as the printing direction, and printing is performed while changing the position in this printing direction.

  At that time, the height measuring device 102 performs a plurality of height measurements on the same workpiece W with different positions in the printing direction, and an offset designation is generated for each height measurement.

  Steps S311 to S320 in FIG. 22 are flowcharts showing another example of the operation in the real operation mode in the laser processing apparatus 100 in FIG. First, when the laser processing apparatus 100 acquires the print data and the control parameters of the height measuring instrument 102 from the personal computer 210, the laser processing apparatus 100 switches the operation mode (steps S311 and S312).

  When a trigger signal is input from the PLC 230, the offset designation generation unit 115 acquires a height measurement value in synchronization with the strobe signal from the work sensor 101, determines the print height, and generates an offset designation ( Steps S313 to S316). The machining pattern change processing unit 117 calculates a Z value (Z component) at the three-dimensional position coordinates of the machining pattern information based on this offset designation, and generates machining pattern information after the change (step S317).

  Next, the beam diameter adjusting unit 119 and the scanning control unit 120 start a printing operation based on the changed pattern information (step S318). At this time, the processing procedure from step S314 to step S318 is repeated while changing the scanning position in the printing direction until printing of the machining pattern is completed. When printing of the machining pattern is completed, the next trigger signal is output. The process shifts to an input standby state (step S319).

  The processing procedure from step S313 to step S319 is repeated until the end of printing is instructed by the external device 200, and when the end of printing is instructed, this processing ends (step S320).

In FIG. 15, three-dimensional irradiation position information (x ₀ , y ₀ , z ₀ ) is input as an input value, and an output value (x ₀ , y ₀ , z ₀ + z) obtained by adding the offset amount z ₁ to this input value. _Although an example in which ₁ ) is output has been described, the present invention is not limited to this. For example, identifying the type of object to be processed, shifting the irradiation position information according to the type of object to be processed, and further correcting the variation in height for each object to be processed and outputting the irradiation position information It may be.

FIG. 23 is a diagram illustrating another configuration example of the laser control unit 2 in FIG. 13, in which a processing pattern change processing unit 117 a including adders 122 and 123 is illustrated. In this example, the two-dimensional position information (x ₀ , y ₀ ) of the print pattern is input as an input value. The adder 122 adds the shift amount z ₁ corresponding to the type of the work W and the shape information z ₀ to the input value (x ₀ , y ₀ ) and outputs the result. The adder 123 adds the variation information z ₂ of the workpiece W to the output value of the adder 122 and outputs the result as an output value (x ₀ , y ₀ , z ₀ + z ₁ + z ₂ ).

The shift amount z ₁ is one-dimensional position information determined in advance for each type of workpiece W, and includes height difference information between the processing reference plane C and a reference point on the processing object on which the shape information z ₀ is a reference. It has become. The shift amount z ₁ is common to all irradiation positions D (x ₀ , y ₀ ) and is a common value for the same type of workpiece. Here, it is assumed that the shape information z ₀ is determined for each type of workpiece.

Variation information z ₂ of the workpiece W is a one-dimensional position information determined based on the height information measured for the actual workpiece to be printed from now printing pattern, and the working reference plane C, the shape The information z ₀ is the height difference information from the reference point on the workpiece to be processed. This variation information z ₂ is a common value for all irradiation positions D (x ₀ , y ₀ ). Here, (shape information z ₀ + shift amount z ₁ + variation information z ₂ ) is an offset amount, and is one-dimensional information that differs for each irradiation position D (x ₀ , y ₀ ).

According to such a configuration, when printing a print pattern common to a plurality of workpieces W of different types, the shift amount z ₁ and the shape information z ₀ corresponding to the type of the workpiece W are added to the irradiation position information. Therefore, the irradiation position is appropriately shifted according to the type of the workpiece W, and the height variation for each workpiece W can be corrected appropriately.

(User interface)
FIG. 24 is a diagram showing an example of the operation of the personal computer 210 in the laser marking system of FIG. 12, and shows a display screen 300 displayed on the display. This display screen 300 is an input screen displayed by an application program for performing various settings of the laser processing apparatus 100.

  In the display screen 300, a display area of a scanning area 301 for designating the position of a processing pattern on the reference plane, an input area of the processing pattern, and display areas of a transfer button 305 and a line setting button 306 are arranged. Yes.

  The scanning area 301 is the maximum area to be scanned with the laser light L on the reference plane, and is a rectangular area with the center (origin) at the center of the area. In this example, the scanning area 301 is a range from +60 mm to −60 mm in the x-axis direction and the y-axis direction, respectively.

  The processing pattern input area is arranged on the right side of the display area of the scanning area 301. In the area, input fields 302a and 302b for specifying the type of processing pattern, and an input field for specifying the type of character data are shown. 303, a character input field 304 is provided. As the type of processing pattern, a logo mark or a figure can be selected in addition to a character string.

  The transfer button 305 is an operation icon for transferring print data such as processing pattern information and control parameters set on the display screen 300 from the personal computer 210 to the laser processing apparatus 100.

  The line setting button 306 is an operation icon for displaying a line setting screen. This line setting screen is an input screen for designating control parameters that define the machining conditions of the workpiece W, and is displayed based on the operation of the line setting button 306. The display area of the transfer button 305 and the line setting button 306 is arranged below the display area of the scanning area 301 and the input area of the processing pattern. When the close button 307 on the display screen 300 is operated, the setting mode of the laser processing apparatus 100 can be ended.

  FIG. 25 is a diagram showing an example of the operation of the personal computer 210 in the laser marking system of FIG. 12, and shows a line setting screen 310 displayed on the display screen 300. In the line setting screen 310, a display area for displaying input fields 311 and 312 for designating movement conditions in the XY direction and the Z direction, and an input field 321 for designating control parameters in the still printing mode. 322, a display area 330 for designating control parameters in the XY movement printing mode, and a display area 340 for designating control parameters in the Z movement printing mode.

  The input field 311 is an input field for designating movement conditions in the XY directions, and can select any of stationary, constant speed, and encoder as the movement conditions. The stationary printing is an operation mode in which a machining pattern is printed on the workpiece W placed on the stage. The constant speed printing is an operation mode for printing on the workpiece W moving at a constant speed on the production line. The encoder printing is an operation mode in which the moving speed of the workpiece W moving on the production line is determined based on the pulse signal input from the rotary encoder, and printing is performed according to the moving speed.

  The input field 312 is an input field for designating a moving condition in the Z direction. As the moving condition, any of stationary, constant speed, encoder, Z value selection, strobe, and real operation can be designated. The display areas of the input fields 311 and 312 are arranged in the upper stage.

  The input field 321 is an input field for designating a trigger delay time in the still printing mode. The input field 322 is an input field for designating a printing time in the still printing mode. The display areas 320 of the input fields 321 and 322 are arranged in the middle stage.

  In the display area 330, an input field 331 for designating a trigger delay time in the XY movement printing mode, an input field 332 for designating a minimum distance between the workpieces in the XY movement printing mode, and constant speed printing. An input area 333 for designating control parameters for the mode and an input area 334 for designating control parameters for the encoder print mode are arranged.

  In the input area 333, an input field 333a for designating a line speed in the constant speed printing mode is provided. Further, in the input area 334, an input field 334a for designating the number of pulses in the encoder print mode and an input field 334b for designating the maximum line speed are provided.

  In the display area 340, there are an input field 331 for designating a trigger delay time in the Z movement printing mode, an input field 332 for designating a minimum distance between the workpieces in the Z movement printing mode, and constant speed printing. An input area 333 for designating control parameters for the mode and an input area 334 for designating control parameters for the encoder print mode are arranged.

  The display area 330 is disposed on the lower left side, and the display area 340 is disposed on the lower right side. In this example, when the operation icon 312a in the input field 312 is operated, a pull-down menu is displayed, and a moving condition can be selected. When the “OK” button 313 on the line setting screen 310 is operated, the data designated on this screen can be registered as a control parameter. If the close button 314 is operated, the line setting mode can be ended.

  FIG. 26 is a diagram showing an example of the operation of the personal computer 210 in the laser marking system of FIG. 12, and shows a pull-down menu 312b displayed when the operation icon 312a on the line setting screen 310 is operated. . The pull-down menu 312b displays identification information (mode name and the like) for each print mode of stationary, constant speed, encoder, Z value selection, strobe, and real operation as selectable movement conditions in the Z direction.

  The identification information of the selected state is displayed in reverse video, for example, and the moving condition being selected can be identified. The user can switch the operation mode to one of these print modes by operating a direction key or the like.

  According to the present embodiment, when a character or the like is processed on a workpiece W having a different height, the focal length in the processing pattern information is automatically changed by the offset designation generated based on the detection signal of the workpiece W. Since the beam diameter is adjusted, it is possible to suppress variations in printing accuracy and printing quality between the workpieces W. Even if the height changes within the same workpiece W, an offset designation is generated for each height measurement that is measured multiple times at different positions. Accordingly, the focal length of the processing pattern information can be appropriately changed.

  To summarize the main features of the laser processing apparatus according to the present embodiment, first, a processing reference surface is determined in advance based on the emission point of the laser beam in the laser processing apparatus, and position information based on this processing reference surface. An offset amount designating unit for designating an offset amount of a machining surface with respect to the machining reference surface based on a detection result by an object detection unit for detecting a workpiece. Based on the offset amount designated by the offset amount designation means, position information changing means for changing the position information, and scanning control for scanning the laser light based on the position information changed by the position information changing means. And focal length control means for controlling the focal length of the laser beam based on the positional information changed by the positional information changing means. Provided.

  Second, height information storage means for storing height information with respect to the processing reference surface in association with identification information provided on each of the two or more processing objects, and acquiring the identification information from an external device Identification information acquisition means that reads out the height information based on the identification information acquired by the identification information acquisition means, and specifies the offset amount based on the read height information. .

  Thirdly, the offset amount designating unit designates an offset amount based on a height measurement result by a height measuring unit that measures the height of the workpiece.

  Fourth, the offset amount designating unit designates the offset amount for each measurement of the height measured twice or more by changing the position in the moving direction of the workpiece with respect to the same workpiece.

  Fifth, the offset amount designating unit sets the offset amount for each measurement of the height measured twice or more by changing the position in the direction intersecting the moving direction of the processing target with respect to the same processing target. specify.

  Sixth, there is provided a laser processing apparatus in which a processing reference plane is determined in advance based on a laser beam emission point in the laser processing apparatus, and laser processing is performed based on position information with reference to the processing reference plane. Based on the height information acquisition means for acquiring the height information of the object to be processed with respect to the reference surface and the height information acquired by the height information acquisition means, the offset amount of the processing surface with respect to the processing reference surface is designated. An offset amount specifying means; a position information changing means for changing the position information based on the offset amount specified by the offset amount specifying means; and the laser based on the position information changed by the position information changing means. Scanning control means for scanning light, and focal length for controlling the focal length of the laser beam based on the position information changed by the position information changing means. And a control unit.

  Seventh, a height information storage unit that stores two or more pieces of height information in association with the identification information of the processing object is provided, and the height information acquisition unit receives height information from the height information storage unit. To get.

  Eighth, the offset amount designating unit designates an offset amount every time the height information obtaining unit obtains height information, and the position information changing unit is scanning the laser light by the scanning control unit. Change location information.

Embodiment 2. FIG.
In the first embodiment, an example has been described in which, when characters and the like are printed on workpieces having different heights, variations in printing accuracy and print quality between the workpieces are suppressed. On the other hand, in the present embodiment, when printing a machining pattern on a workpiece whose machining surface is inclined relative to the machining reference plane, the position of machining pattern information is used in order to correctly print the machining pattern. A case where coordinates are converted will be described.

<Scanning area adjustment>
FIG. 27 is a block diagram illustrating a configuration example of a main part of the laser processing apparatus according to the second embodiment of the present invention, in which a laser control unit 400 is illustrated. The laser control unit 400 includes a reference point storage unit 401, a reference position change processing unit 402, a post-change reference point storage unit 403, a coordinate conversion processing unit 404, a processing pattern storage unit 405, a post-change pattern storage unit 406, and a scan control unit. 407 and a beam diameter adjusting unit 408.

  The reference point storage unit 401 is a memory that stores the position coordinates of three or more reference points provided on the processing reference surface. The reference points are a plurality of points determined in advance on the processing reference surface in order to indicate the maximum area to be scanned with the laser light L. The maximum area is defined by the range of rotation angles of the X-axis scanner 14a and the Y-axis scanner 14b, the position of the reference plane in the optical axis direction of the fθ lens 13a, and the like.

  Here, such a maximum area is referred to as a scanning area, and it is assumed that the position coordinates of a reference point including four vertices of a rectangular scanning area are stored in the reference point storage unit 401. Further, three processing reference surfaces 401a are determined by varying the distance from the emission point of the laser light L, that is, the distance from the fθ lens 13a, and reference points provided in association with these processing reference surfaces 401a. Is assumed to be stored. That is, a reference point is provided at a corresponding position on each processing reference surface 401a, and the position coordinates are stored in association with the reference surface.

  The scanning control unit 407 controls the X-axis scanner 14a and the Y-axis scanner 14b, and performs an operation of scanning the laser light L on the processing reference plane. At the time of adjusting the scanning area, control is performed to print on the workpiece W using a line segment connecting any two of the reference points as a test pattern. The line segment to be printed as the test pattern is determined in advance so that the inclination of the machining surface with respect to the machining reference surface can be detected in any direction.

  Instead of displaying the test pattern on the workpiece W by irradiating the workpiece W with the laser beam L and printing the surface, the workpiece W is irradiated with the guide beam G and scanned on the machining reference plane. A test pattern may be displayed on the workpiece W as the guide pattern GP. The user sees the display of such a test pattern, determines the inclination of the machining surface, and changes the position of the reference point.

  The reference position change processing unit 402 performs processing for changing the position of the reference point within the machining reference plane based on a user operation. More specifically, position difference information between a reference point printed as a test pattern and a reference point on the processing reference plane corresponding to this reference point is designated on the console 220, and is controlled from the console 220 as a control parameter. The data is transferred to the reference position change processing unit 402. Then, based on the control parameter transferred from the console 220, a process for changing the position of the reference point is performed. Here, the reference point position changing process is performed on the reference plane scanned with the laser beam L, and the position coordinates of the reference point after the changing process are stored in the changed reference point storage unit 403. .

  The processing pattern storage unit 405 is a memory that stores processing pattern information in which an irradiation position on the processing reference surface is defined. Specifically, a position on the processing reference plane that is an irradiation target of the laser beam L is defined for each irradiation spot.

  The coordinate conversion processing unit 404 converts the position coordinates of the processing pattern information based on the position coordinates of the reference point after the position change by the reference position change processing unit 402 and the position coordinates of each reference point before the position change. It is a conversion means. Specifically, the scanning area is changed based on the position coordinates of each reference point stored in the reference point storage unit 403 and the position coordinates of each reference point stored in the reference point storage unit 401. A process for converting the coordinates of the processing pattern information in the processing pattern storage unit 405 is performed so that the processing pattern is correctly reflected.

  Here, the position coordinates between the machining reference planes are interpolated based on the position coordinates of the reference points on each machining reference plane for any plane that is parallel to each machining reference plane and specified by the user. It is assumed that the position coordinates of the processing pattern information are converted into position coordinates on the processing surface.

  The post-change pattern storage unit 406 is a memory that stores processing pattern information after the position coordinates are changed by the coordinate conversion processing unit 404. The beam diameter adjustment unit 408 controls the beam expander 11 based on the processing pattern information read from the post-change pattern storage unit 406 and performs an operation of adjusting the beam diameter of the laser light L. The scanning control unit 407 performs control of scanning the laser beam based on the processing pattern information read from the post-change pattern storage unit 406 when the processing pattern is printed.

FIG. 28 is a perspective view showing an example of the operation in the laser processing apparatus of FIG. 27 , and shows the states of the scanning areas C1 to C3 on each processing reference plane defined as a plane perpendicular to the optical axis B of the fθ lens 13a. It is shown. Each processing reference surface is determined such that the distance from the disk-shaped fθ lens 13a is a predetermined value. Here, regarding the optical axis B direction, the processing reference surface located at the lower limit position of the focal length of the laser light L is defined as a first reference surface, and the area to be scanned on the first reference surface is defined as a scanning area C1.

  In addition, regarding the optical axis B direction, the processing reference surface located at the upper limit position of the focal length of the laser light L is defined as a third reference surface, and the area to be scanned on the third reference surface is defined as a scanning area C3. Further, with respect to the direction of the optical axis B, the processing reference surface located at the center between the upper limit position and the lower limit position of the focal length of the laser beam L, that is, the center between the first reference surface and the third reference surface is defined as the second reference surface. An area to be scanned on the second reference plane is defined as a scanning area C2.

  The scanning areas C1 to C3 are rectangular areas having the same shape, the same size, and the same position in the direction perpendicular to the optical axis B between the reference planes. Each of the scanning areas C1 to C3 is a rectangular area whose position in the direction parallel to the emission surface is the same because the optical axis B is perpendicular to the emission surface of the laser light L. Here, it is assumed that each of the scanning areas C1 to C3 has a square shape, and reference points P1 to P3 are arranged at the midpoints of four vertices and four sides. In the scanning areas C1 and C3, a reference point is also arranged at the center of the area.

  In this example, the scanning area C1 on the first reference surface is the maximum area that can be scanned when the laser light L is scanned on the reference surface. Here, the first reference plane is called a near plane, the second reference plane is called a center plane, and the third reference plane is called a far plane. Position change processing is performed for such reference points P1 to P3.

FIG. 29 is a plan view showing a reference point Pk arranged in each of the scanning areas C1 to C3 of FIG. 28 and a line segment Lk connecting the two reference points. For the scanning area Ck (k = 1, 2, 3), eight reference points Pk are arranged at the midpoints of the vertices and the sides. In the scanning areas C1 and C3, the reference point Pkc is arranged at the center of the area. Here, it is assumed that the position coordinates of each reference point Pk are determined with the position of the reference point Pkc as the origin of the two-dimensional position coordinates on the kth reference plane. The center of each scanning area Ck is the intersection of the reference plane and the optical axis B.

Specifically, among the vertices, the vertex arranged in the first quadrant is set as the reference point Pkx _p y _p , the vertex arranged in the second quadrant is set as the reference point Pkx _n y _p, and arranged in the third quadrant. that vertex as the reference point _pKX n _{y n} and the vertex is positioned in the fourth quadrant and the reference point _pkx p _{y n.} Of the midpoints of each side, a point arranged in the positive region on the y-axis is set as a reference point Pky _p , a point arranged in the negative region on the y-axis is set as a reference point Pky _n, and the point on the x-axis A point arranged in the positive region is set as a reference point Pkx _p, and a point arranged in the negative region on the x axis is set as a reference point Pkx _n .

A line segment Lk connecting two of these reference points is printed on the workpiece W as a test pattern. Here, it is assumed that four sides of a square and two diagonal lines are printed as test patterns. Specifically, a line segment connecting the reference points Pkx _p y _p and Pkx _n y _p is Lky _p , a line segment connecting the reference points Pkx _p y _n and Pkx _n y _n is Lky _n , and the reference point Pkx _p y A line segment connecting _p and Pkx _p y _n is Lkx _p, and a line segment connecting the reference points Pkx _n y _p and Pkx _n y _n is Lkx _n , and these sides are printed as a test pattern.

Further, a line segment connecting the reference points Pkx _p y _p and Pkx _n y _n is Lk2, and a line segment connecting the reference points Pkx _n y _p and Pkx _p y _n is Lk1, and these diagonal lines are printed as a test pattern. The user determines the amount of movement of each reference point in the scanning area by looking at the test pattern printing result.

FIG. 30 is a diagram showing an example of the operation in the laser processing apparatus of FIG. 27 , and shows the direction in which the position can be changed with respect to each reference point Pk on the kth reference plane. Each reference point Pk can be moved independently and independently. Here, it is assumed that the position can be changed by a desired amount in the x-axis direction and the y-axis direction.

Figure 31 is a diagram showing a configuration example of the reference position changing section 402 in the laser controller 400 of FIG. 27. The input value Pk (x ₀ , y ₀ , z ₀ ) is added to the user designation (x ₁ , y ₁ ) by the adder 411 regarding the three-dimensional position coordinates of the reference point Pk designated as the position change target by the user. , An output value Pk (x ₀ + x ₁ , y ₀ + y ₁ , z ₀ ) is output. The user designation (x ₁ , y ₁ ) is a change amount of the position designated by the user, that is, difference information of the position of the reference point Pk.

FIG. 32 is a diagram showing an example of the operation of the coordinate conversion processing unit 404 in the laser control unit 400 of FIG. 27 , and the conversion of the position coordinates when the position of the reference point P2x _p y _p in the scanning area C2 is changed. The state of processing is shown. The coordinate conversion processing unit 404 converts the position coordinates in the processing pattern information based on the position coordinates of the reference point Pk after the position change by the reference position change processing unit 402 and the position coordinates of each reference point Pk before the position change. Processing is performed.

For example, the scan area C2 on the center plane (second reference plane), in the case of the position of the first quadrant of the reference point P2x _p y _p moved by y1 in the positive direction of the y-axis direction, the first quadrant, x-axis The other points in the scanning area C2 on the upper and y axes are moved in the y axis direction according to the position.

Specifically, when the two-dimensional position coordinates of the reference point _P2x p _{y p} and _{(a 1,} a 1), any point on the straight line _{y = a 1 (a 2,} a 1) is in the y-axis direction It is moved by y ₂ = y ₁ × (a ₂ / a ₁ ). Further, an arbitrary point (a ₁ , a ₃ ) on the straight line x = a ₁ is moved by y ₃ = y ₁ × (a ₃ / a ₁ ) in the y-axis direction. Accordingly, the point (a ₂ , a ₃ ) on the straight line y = a ₃ is y ₄ = y ₂ × (a ₃ / a ₁ ) = y 1 × (a ₂ / a ₁ ) × (a _{3 in} the y-axis direction. / A ₁ ).

FIG. 33 is a diagram showing an example of the operation of the coordinate conversion processing unit 404 in the laser control unit 400 of FIG. 27. When the position of the reference point P2x _p y _p is changed, the processing reference plane is interpolated. A state in which position coordinate conversion processing is performed is shown. The scanning area C2 on the center plane, when the position of the first quadrant of the reference point P2x _p y _p are moved by y1 in the positive direction of the y-axis direction, any inter-near surfaces (first reference surface) and the center plane Is interpolated based on the position coordinates of the reference points on the near surface and the center surface, and the position coordinates of the processing pattern information are converted into the position coordinates on the processing surface. Here, the processed surface is a plane parallel to each reference surface, and is specified by the user, for example.

This interpolation process is obtained by extending the coordinate transformation on the two-dimensional plane shown in FIG. 30 to the three-dimensional space.

  Similarly, an arbitrary processing surface between the center surface and the far surface (third reference surface) is subjected to interpolation processing based on the position coordinates of the reference point on the center surface and the far surface, and the position coordinates of the processing pattern information are Converted to position coordinates on the machining surface.

FIG. 34 is a diagram showing an example of the operation in the laser processing apparatus of FIG. 27 , and the laser beam L for the workpiece W whose processing surface A is inclined relative to the processing reference surface C of the laser output unit 1. The state of irradiation is shown. When a line segment of length L is printed on the machining surface A in the direction of the maximum inclination of the machining surface A on the machining reference surface C, the inclination angle of the machining surface A with respect to the machining reference surface C is defined as θ on the machining surface A. Is printed as a line segment of length L × (1 / cos θ). For this reason, the processing pattern designated on the processing reference plane C and the processing pattern that is actually printed will be displaced in shape and size.

  In the present embodiment, in such a case, the shift as described above occurs by changing the position of the reference point in the scanning area on the processing reference plane C and converting the position coordinates in the processing pattern information. Can be suppressed.

(User interface)
FIG. 35 is a view showing an example of the operation of the console 220 in the laser marking system including the laser processing apparatus of FIG. 27 , and shows a display screen 421 displayed on the display. The display screen 421 is an input screen for performing various settings of the laser marking system, and a plurality of icons 422 to 430 for displaying the various setting screens are arranged. Here, such a display screen 421 is referred to as a console menu screen.

  Specifically, a hardware information display icon 422, an operation information display icon 423, a timing information display icon 424, a laser setting information display icon 425, a pointer LD information display icon 426, an offset and gain information display icon 427, a far plane information display icon 428a, a center plane information display icon 428b, a near plane information display icon 428c, a communication setting display icon 429, and an end icon 430 are arranged in the menu screen.

  The hardware information display icon 422 is an icon for displaying a setting screen indicating a connection state of devices connected to the system. The operation information display icon 423 is an icon for displaying a setting screen indicating the operation state of each device in the system. The timing information display icon 424 is an icon for displaying a setting screen such as workpiece detection and laser irradiation timing.

  The laser setting information display icon 425 is an icon for displaying a setting screen of the laser processing apparatus. The pointer LD information display icon 426 is an icon for displaying a pointer LD (laser diode) setting screen. The offset and gain information display icon 427 is an icon for displaying various offset amount and gain setting screens.

  The far surface information display icon 428a is an icon for displaying a reference point position setting screen on the far surface. The center surface information display icon 428b is an icon for displaying a reference point position setting screen on the center surface. The near plane information display icon 428c is an icon for displaying a reference point position setting screen on the near plane.

  The communication setting display icon 429 is an icon for displaying a communication setting screen in the system. The end icon 430 is an icon for ending the display of this menu screen. By operating the far plane information display icon 428a, the center plane information display icon 428b, or the near plane information display icon 428c on such a menu screen, a reference point position setting screen can be displayed. Note that this menu screen can also be terminated by operating the close button 431 on the display screen 421.

FIG. 36 is a diagram showing an example of the operation of the console 220 in the laser marking system including the laser processing apparatus of FIG. 27 , and shows a setting screen 441 for the position of each reference point on the far surface. The setting screen 441 is an input screen for changing the positions of nine reference points on the far plane. Here, an input field 442 for inputting a change amount from a predetermined position is provided for each reference point. In addition, for each reference point, the amount of change in position can be specified independently for the x-axis direction and the y-axis direction.

For example, an input column of "far surface XpYnX direction offset" is an input field for offsetting the position of the reference point _P3x p _{y n} on the far side in the x-axis direction.

  In this example, when the up and down buttons of the input field 442 are operated, the change amount of the position, that is, the difference information of the position of the reference point can be designated as the offset amount. If the close button 444 on the setting screen 441 is operated, the display of the setting screen 441 can be ended.

(Scanning area shape)
FIG. 37 is a perspective view showing an example of the operation in the laser processing apparatus of FIG. 27 , and shows the state of the scanning region formed with the optical axis B of the fθ lens 13a as the central axis. In general, the maximum scanable area of the laser light L on the processing surface parallel to the processing reference surface C becomes narrower as the processing surface height increases, that is, the closer to the fθ lens 13a. For this reason, the region formed by the maximum scanable area (referred to as the maximum scan area) of the laser beam L on an arbitrary processed surface has a pyramid shape with the fθ lens 13a as a vertex.

  More specifically, since there is an upper limit and a lower limit in the adjustable range of the focal length of the laser beam L, the above region has the maximum scanning area on the near plane as the upper base and the maximum scanning area on the far plane below. The bottom is a truncated pyramid. When processing patterns having the same shape and the same size are printed on the workpieces W having different heights, if the maximum scanning area is designated as a printing target, a portion that is not scanned and is not printed is generated depending on the height of the processing surface.

  On the other hand, in the present embodiment, the position of the processing surface in the optical axis B direction is determined based on the position information with reference to the processing reference surface, and the focal length of the laser light L is adjusted. The laser beam L is scanned in the scanning area on the processing surface based on the position information. At that time, regardless of the position of the processing surface in the direction of the optical axis B, the scanning area on the processing surface is limited to an area having the same shape and the same size. That is, the scanning area of the laser beam L is limited to a spatial area composed of scanning areas of the same shape and the same size within the adjustable focal length range.

  As a result, the scanning area is limited to an area of the same shape and the same size that can be scanned regardless of the position of the processing surface. Can be processed correctly. The spatial region formed by the scanning area on an arbitrary processed surface is a prismatic body inscribed in the pyramid.

  Such a scanning region is determined by, for example, the print quality and resolution required for the near and far surfaces. Specifically, with respect to the spot shape of the laser beam L, the near surface has a larger distortion of the spot shape at the end with respect to the center than the far surface. A scanning area is defined on the near plane, and a scanning area is defined by the scanning area on the near plane. Alternatively, with respect to the scanning pitch of the laser beam L, the far surface has a larger amount of increase in the scanning pitch at the end with respect to the central portion than the near surface. The scanning area is determined by this, and the scanning area is defined by the scanning area on the far surface.

FIG. 38 is a diagram showing an example of the operation of the personal computer in the laser marking system including the laser processing apparatus of FIG. 27 , and shows a display example of the scanning area 301 on the setting screen. In this example, the maximum scanning area on the processing surface at the height specified by the user is displayed as the scanning area 301, and a rectangular frame 301 a indicating the second scanning area is displayed in the scanning area 301.

  The second scanning area is a rectangular area having the same shape, the same size, and the same position in the direction perpendicular to the optical axis B as the scanning areas C1 to C3 on each processing reference plane, and the area outside the frame 301a is Depending on the height of the processed surface, this area may not be printed. By displaying such a frame 301a in the scanning area 301, when specifying and printing the maximum scanning area as a printing target, the user can recognize that the printing area cannot be printed depending on the height of the processed surface. Can do.

  Here, when printing of a printing pattern is designated outside the second scanning area, if the position of this printing pattern is within the maximum scanning area on the processing surface, printing of the printing pattern is performed. . On the other hand, when printing of the print pattern is specified outside the second scanning area and protruding from the frame 301a, the print pattern protruding from the frame 301a is not printed regardless of the height of the processing surface. Also good. In other words, the scanning area may be limited within the frame 301a so that the print pattern is correctly printed on the processing object of any height.

  According to the present embodiment, even if the machining surface on the workpiece W is inclined relative to the machining reference surface, the position coordinates are appropriately converted based on the position coordinates of the reference point before and after the change. Therefore, the processing pattern can be processed correctly. In addition, even with workpieces W having different heights, surface areas having the same shape and the same size are designated as the scanning target area, so that processing patterns having the same shape and the same size can be processed correctly into the processing object. .

37 and 38 , an example in which a pyramid-shaped scanning region having the fθ lens 13a as a vertex has been described, but the present invention is not limited to this. For example, the shape of the maximum scanning area may be circular on an arbitrary processed surface. In this case, the region formed by the maximum scanning area has a conical shape with the fθ lens 13a as a vertex. Further, when the laser light L is scanned using a circular area having the same shape, the same size, and the same position in the direction perpendicular to the optical axis B as the scanning area, it is formed by the scanning area on an arbitrary processed surface. The region is a cylindrical body inscribed in the cone.

  In the present embodiment, an example in which a columnar region is formed based on a predetermined area on the processing reference plane and the scanning area of the laser light L is limited to the columnar region has been described. It is not limited to this. For example, a columnar region having an arbitrary cross section parallel to the processing reference plane is formed in a scanning region formed of a cone having an emission point of the laser beam L as a vertex, and the scanning area of the laser beam L is formed in such a columnar shape. The columnar region may be determined by another method as long as it is limited within the region.

  Specifically, a plane perpendicular to the optical axis B defined by the upper limit of the adjustable range of the focal length by the beam diameter adjusting unit 408 in the scanning region formed of a cone having the emission point of the laser beam L as the apex. An upper predetermined area is defined, and based on the predetermined area, the scanning area of the laser light L is limited to an area having the same shape, the same size and the same position on an arbitrary plane perpendicular to the optical axis B. May be. Alternatively, a predetermined area on a plane perpendicular to the optical axis B defined by the lower limit of the adjustable range of the focal length by the beam diameter adjusting unit 408 is defined in the scanning region, and the laser beam L of the laser light L is determined based on the predetermined area. The scanning area may be limited to an area having the same shape, the same size and the same position on an arbitrary plane perpendicular to the optical axis B.

In the present embodiment, an example in which the line segment Lk shown in FIG. 29 is printed on the workpiece W as a test pattern and the deviation of the reference point is determined based on the printing result has been described. Is not limited to this. For example, a sheet on which a test pattern is printed in advance may be arranged on the workpiece W, and the guide light G may be irradiated on the sheet to determine the deviation of the reference point.

  Note that the “cone” in this specification means a space realized by two-dimensional scanning. Therefore, if the maximum focal length is constant, the bottom surface is a part of a spherical surface. In this case, the cross section passing through the central axis has a fan shape.

It is the block diagram which showed one structural example of the laser processing apparatus 100 by Embodiment 1 of this invention. 5 is a perspective view showing an example of the inside of an excitation light generator 23. FIG. 2 is a diagram illustrating a configuration example of a laser oscillation unit 10. FIG. FIG. 3 is a diagram illustrating a configuration example of a beam expander 11. FIG. 3 is a perspective view illustrating a configuration example of a scanning unit 12. FIG. 10 is an explanatory diagram regarding a scanning operation in the Z-axis direction using the beam expander 11. FIG. 10 is an explanatory diagram regarding a scanning operation in the Z-axis direction using the beam expander 11. It is explanatory drawing about a distance pointer, and is the perspective view which showed the optical system of the laser processing apparatus. It is explanatory drawing about a distance pointer and is the perspective view which looked at FIG. 8 from the reverse direction. It is explanatory drawing about a distance pointer, and is sectional drawing by the cut surface containing the optical axis of the condensing lens. It is the figure which showed an example of the distance pointer. It is the block diagram which showed the structural example of the laser marking system containing the laser processing apparatus 100 of FIG. It is the block diagram which showed the structural example of the laser control part 2 in the laser processing apparatus 100 of FIG. FIG. 13 is a perspective view showing an example of the operation in the laser processing apparatus 100 of FIG. 12, and shows a state of a processing reference plane C perpendicular to the optical axis B of the fθ lens 13a. It is the figure which showed the structural example of the process pattern change process part 117 in the laser control part 2 of FIG. It is the figure which showed an example of the operation | movement in the laser processing apparatus 100 of FIG. 12, and the mode of offset adjustment of the height direction at the time of Z value selection mode is shown. 13 is a flowchart showing an example of an operation in a Z value selection mode in the laser processing apparatus 100 of FIG. 13 is a flowchart showing an example of an operation in a strobe mode in the laser processing apparatus 100 of FIG. FIG. 13 is a perspective view showing an example of an operation in the real operation mode in the laser processing apparatus 100 of FIG. 12 and shows a state in which printing is performed while changing the position. 13 is a flowchart showing an example of an operation in a real operation mode in the laser processing apparatus 100 of FIG. It is the perspective view which showed another example of the operation | movement at the time of the real operation mode in the laser processing apparatus 100 of FIG. 13 is a flowchart showing another example of the operation in the real operation mode in the laser processing apparatus 100 of FIG. FIG. 14 is a diagram illustrating another configuration example of the laser control unit 2 in FIG. 13, in which a processing pattern change processing unit 117 a including adders 122 and 123 is illustrated. It is the figure which showed an example of operation | movement of the personal computer 210 in the laser marking system of FIG. 12, and the display screen 300 on a display is shown. It is the figure which showed an example of operation | movement of the personal computer 210 in the laser marking system of FIG. 12, and the line setting screen 310 is shown. It is the figure which showed an example of operation | movement of the personal computer 210 in the laser marking system of FIG. 12, and the pull-down menu 312b is shown. It is the block diagram which showed the structural example in the principal part of the laser processing apparatus by Embodiment 2 of this invention, and the laser control part 400 is shown. It is the perspective view which showed an example of the operation | movement in the laser processing apparatus of FIG. 27, and the mode of the scanning areas C1-C3 on each reference plane is shown. FIG. 29 is a plan view showing a reference point Pk arranged in each of the scanning areas C1 to C3 in FIG. 28 and a line segment Lk connecting the two reference points. It is the figure which showed an example of the operation | movement in the laser processing apparatus of FIG. 27, and the direction which can change a position with respect to each reference point Pk on a kth reference plane is shown. It is the figure which showed the structural example of the reference position change process part 402 in the laser control part 400 of FIG. It is a diagram illustrating an example of the operation of the coordinate conversion processing unit 404 in the laser controller 400 of FIG. 27, state of coordinate transformation position of the reference point P2x _p y _p is shown. It is the figure which showed an example of operation | movement of the coordinate transformation process part 404 in the laser control part 400 of FIG. 27, and the mode of the interpolation process between reference planes is shown. FIG. 28 is a diagram illustrating an example of an operation in the laser processing apparatus of FIG. 27, and illustrates a state of laser irradiation on a workpiece W whose processing surface A is inclined with respect to the processing reference surface C. It is the figure which showed an example of operation | movement of the console 220 in the laser marking system containing the laser processing apparatus of FIG. 27, and the display screen 421 is shown. It is the figure which showed an example of operation | movement of the console 220 in the laser marking system containing the laser processing apparatus of FIG. 27, and the setting screen 441 of the reference point is shown. FIG. 28 is a perspective view showing an example of an operation in the laser processing apparatus of FIG. 27, and shows a state of a scanning region formed with the optical axis B of the fθ lens 13a as a central axis. It is the figure which showed an example of operation | movement of the personal computer in the laser marking system containing the laser processing apparatus of FIG. 27, and the scanning area 301 is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser output part 2 Laser control part 3 Input part 11 Beam expander 12 Scan part 13 Condensing part 13a f (theta) lens 14a X axis scanner 14b Y axis scanner 16 Scanner drive circuit 21 Memory part 22 Control part 23 Excitation light generation part 24 Power supply 32 Laser medium 100 Laser processing apparatus 101 Work sensor 102 Height measuring device 111 Identification information acquisition unit 112 Height information storage unit 115 Offset designation generation unit 116 Processing pattern storage unit 117 Processing pattern change processing unit 118 Modified pattern storage unit 119 Beam Diameter adjustment unit 120 Scan control units 121 to 123 Adder 200 External device 210 Personal computer 220 Console 230 PLC
400 Laser control unit 401 Reference point storage unit 402 Reference position change processing unit 403 Changed reference point storage unit 404 Coordinate conversion processing unit 405 Processing pattern storage unit 406 Changed pattern storage unit 407 Scanning control unit 408 Beam diameter adjustment unit

Claims (4)

In a laser processing apparatus that moves a laser spot in a maximum scanning region composed of a cone having a laser beam emission point as a vertex based on position information with respect to a processing reference plane ,
A laser oscillation unit for generating laser light;
A beam expander that adjusts a focal length of the laser beam by moving an optical lens arranged on the optical axis of the laser beam in the optical axis direction ;
Using a pair of galvano mirrors, the two-dimensional scanner for scanning the laser beam transmitted by the beam expander on a plane parallel to the working reference plane,
Scanning area limiting means for forming a columnar region having an arbitrary cross section parallel to the processing reference plane in the maximum scanning region and limiting the scanning area of the laser beam by the two-dimensional scanner within the columnar region. A laser processing apparatus comprising: 2. The laser processing apparatus according to claim 1, wherein the scanning area limiting unit limits the scanning area of the laser beam by the two-dimensional scanning unit based on a predetermined area defined on the processing reference plane. . 2. The laser processing apparatus according to claim 1, wherein the columnar body has an end surface that is a scanning area of the two-dimensional scanner at a lower limit of a predetermined movable range of the focal length. 2. The laser processing apparatus according to claim 1, wherein the columnar body has a scanning area of the two-dimensional scanner at an upper limit of a predetermined movable range of the focal length as an end surface.

Images