JP4949937B2 - Component division take-out apparatus and component division take-out method - Google Patents

Description

  The present invention relates to a component division extraction apparatus and a component division extraction method for extracting components by dividing a component assembly having a plurality of components such as a crystal blank.

  2. Description of the Related Art Conventionally, there has been proposed a technique for dividing a crystal wafer into which a plurality of crystal blanks (crystal pieces) are partitioned and dividing them into a plurality of crystal blanks. For example, Patent Document 1 discloses a crystal resonator element having a highly accurate external dimension from a large crystal base material by providing a substantially triangular missing portion at either end of one of a pair of opposing short sides of the crystal resonator element. Is described. In addition, Patent Document 2 discloses a technique in which, when a substrate is cut and divided into individual chips, the substrate is subdivided into final chips having a size that allows the warpage of the substrate to be dispersed. Are listed. Japanese Patent Application Laid-Open No. 2004-228688 describes a technique that can accurately cut out a semiconductor device from an assembly in which semiconductor packages are formed.

JP-A-2005-130070 JP 2000-124161 A JP 2003-218141 A

  However, the techniques described in Patent Documents 1 to 3 described above describe a method for efficiently performing a work of dividing a part and a process of taking out a part from a part assembly in which a plurality of parts are formed. Not.

  Examples of the problem to be solved by the present invention are as described above. An object of the present invention is to provide a component division extraction apparatus and a component division extraction method that efficiently divide and take out components from a component assembly in which a plurality of components are formed.

According to the first aspect of the present invention, there is provided a component dividing / extracting device for extracting a component by dividing a component assembly in which a plurality of components are formed, with respect to the component assembly in a mounted state. A pressing portion that presses the remaining portion other than the component from above in the assembly, and the component assembly that is pressed by the pressing portion from below with respect to the part of the component in the component assembly. A push-up portion that pushes up, and an adsorbing portion that sucks the component divided from the component assembly by being pushed up by the push-up portion, and the pressing portion is a part of the component. The remaining portion in the vicinity of the connection portion with the remaining portion is pressed .
According to a second aspect of the present invention, there is provided a component dividing / extracting device for extracting a component by dividing a component assembly in which a plurality of components are formed, with respect to the component assembly in a mounted state. A pressing portion that presses the remaining portion other than the component from above in the assembly, and the component assembly that is pressed by the pressing portion from below with respect to the part of the component in the component assembly. A push-up portion that pushes up, and an adsorbing portion that adsorbs by sucking the parts divided from the component assembly by being pushed up by the push-up portion, and the pressing portion and the adsorbing portion are integrated The pressing portion is configured as a convex portion.

According to a seventh aspect of the present invention, there is provided a component division / extraction method for extracting a component by dividing a component assembly in which a plurality of components are formed. A pressing step of pressing the remaining part other than the component in the assembly from above, and the component assembly in a state of being pressed by the pressing step, from below with respect to the part of the component in the component assembly. a step push-up performing push-up, the push-up the components divided from the component assembly by being pushed up by the process, and a suction step for sucking by sucking, the pressing step, said component part The remaining portion in the vicinity of the connection portion with the remaining portion is pressed .

  In one embodiment of the present invention, a component dividing and extracting device that extracts components by dividing a component assembly in which a plurality of components are formed is used for the component assembly in a mounted state. A pressing portion that presses the remaining portion other than the component from above in the assembly, and the component assembly that is pressed by the pressing portion from below with respect to the part of the component in the component assembly. A pushing-up portion that pushes up; and an adsorption portion that adsorbs the components divided from the component assembly by being pushed up by the pushing-up portion.

  The above-described component dividing / extracting apparatus is suitably used for extracting components by dividing a component assembly in which a plurality of components are formed. Specifically, the pressing unit presses the remaining portion other than the components in the component assembly from above on the component assembly in the placed state. Further, the push-up portion pushes up the part assembly in the pressed state from below with respect to the parts of the part assembly. Further, the suction part sucks the parts divided from the part assembly by being pushed up. According to the above component splitting and extracting device, since the remaining portion other than the components of the component assembly is mechanically fixed by the pressing part, the effect of the deflection and warpage of the component assembly itself is appropriately suppressed. Can be divided. Further, since suction is performed by the suction portion at the time of division, it is possible to appropriately suppress the jumping out of components. As mentioned above, according to said component division | segmentation taking-out apparatus, it can divide and take out components efficiently from the component aggregate | assembly in which several components were formed.

  In one aspect of the above component splitting and extracting device, at least when the component is split from the component assembly, the suction unit sucks the vicinity of the connection portion between the component portion and the remaining portion of the component assembly Is further provided. Moreover, the said suction part sucks the waste discharged | emitted when the said components are divided | segmented from the said component assembly. Thereby, the waste (contamination) discharged when parts are divided from the part assembly can be appropriately cleaned.

  Preferably, in the above-described component dividing / extracting device, the pressing portion can press the remaining portion in the vicinity of the connecting portion between the component portion and the remaining portion.

  In another aspect of the above-described component splitting and extracting device, a push-up position determination unit that determines a position to be pushed up by the push-up unit with respect to the component assembly by recognizing an image of the component assembly. The push-up unit can perform the push-up based on the position determined by the push-up position determining means. Accordingly, it is possible to effectively suppress the damage of the parts due to the push-up and appropriately divide the parts aggregate.

  In the above-described component splitting and extracting device, preferably, the pressing portion and the suction portion are integrally formed, and the pressing portion can be configured as a convex portion. This makes it possible to more efficiently divide and take out the parts.

  More preferably, in the above-described component splitting and extracting device, a crystal blank can be used as the component.

  In another aspect of the present invention, there is provided a component division extraction method for extracting a component by dividing a component assembly in which a plurality of components are formed, with respect to the component assembly in a placed state. A pressing step of pressing a remaining portion other than the component from above in the body, and the component assembly in a state of being pressed by the pressing step from above with respect to the part of the component in the component assembly And a sucking step for sucking and sucking the parts divided from the part assembly by being pushed up by the push-up process. Also by the above-described component division and extraction method, components can be efficiently divided and extracted from a component assembly in which a plurality of components are formed.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[Device configuration]
FIG. 1 is a block diagram showing a schematic configuration of a component division / extraction device 100 according to an embodiment of the present invention.

  The component dividing / extracting apparatus 100 mainly includes a controller 1, a camera 2, a blank extracting unit 3, and a blank holding unit 4. The component dividing / extracting apparatus 100 basically performs processing for extracting a crystal blank by dividing a crystal blank assembly (not shown) having a plurality of crystal blanks (not shown). Hereinafter, the crystal blank is also simply referred to as “blank”.

  The camera 2 images a crystal blank and supplies image data S2 obtained by the imaging to the controller 1. The blank take-out unit 3 is a unit that takes out the crystal blank from the crystal blank assembly. Specifically, the blank take-out unit 3 mainly adsorbs the crystal blank aggregate by pressing the crystal blank aggregate from above and sucking the crystal blank divided from the crystal blank aggregate. In this case, the blank take-out unit 3 is controlled by a control signal S3 supplied from the controller 1. On the other hand, the blank holding unit 4 is a unit on which a crystal blank is placed and holds the crystal blank. Specifically, the blank holding unit 4 mainly pushes up the crystal blank assembly in the state pressed by the blank take-out unit 3 from below with respect to the portion of the crystal blank in the crystal blank assembly. In this case, the blank holding unit 4 is controlled by a control signal S4 supplied from the controller 1. Thus, the blank take-out unit 3 functions as a pressing part and a suction part, and the blank holding unit 4 functions as a push-up part and a suction part.

  The controller 1 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The controller 1 controls these by supplying control signals S3 and S4 to the blank take-out unit 3 and the blank holding unit 4, respectively. The controller 1 performs image recognition based on the image data S2 supplied from the camera 2. In this case, the controller 1 functions as a push-up position determination unit, and determines a position where push-up should be performed with respect to the crystal blank aggregate.

  Next, with reference to FIG. 2, the structure of the crystal blank will be described in detail.

  FIG. 2A and FIG. 2B show an example of the crystal blank aggregate, and show the crystal blank aggregates 6a and 6b observed from above, respectively. The crystal blank aggregate 6a has a substantially circular outer shape, and a plurality of crystal blanks 7 are formed in a substantially rectangular portion indicated by reference numeral 6d. The crystal blank aggregate 6b has a substantially rectangular outer shape, and a plurality of crystal blanks 7 are formed in a substantially rectangular portion indicated by reference numeral 6d. 2 (a) and 2 (b), the portion indicated by reference numeral 6c in the crystal blank aggregates 6a and 6b is a portion that is not a target to be taken out by the above-described component splitting take-out device 100. This is the portion that remains after the crystal blank 7 is taken out from the crystal blank aggregates 6a and 6b. Hereinafter, the portion indicated by reference numeral 6c is referred to as “residual portion 6c”. Further, when the crystal blank aggregates 6a and 6b are used without being distinguished from each other, they are simply expressed as “crystal blank aggregate 6”.

  FIG. 2 (c) shows an enlarged region X in FIG. 2 (a), and FIG. 2 (d) shows a set of crystal blanks along the cutting line A1-A2 in FIG. 2 (c). A cross-sectional view of the body 6 is shown. As shown in FIG. 2C, a plurality of crystal blanks 7 are formed in a substantially rectangular portion indicated by reference numeral 6d. Further, as shown in FIGS. 2C and 2D, the crystal blank 7 is connected to the remaining portion 6c through the connecting portion 7a. The connecting portion 7a is configured to be thinner than other portions. When the crystal blank 7 is divided from the crystal blank aggregate 6, the crystal blank 7 is cut off from the connecting portion 7a.

  Next, with reference to FIG. 3, the structure of the blank taking-out unit 3 and the blank holding unit 4 will be described.

  FIG. 3 shows a side view of the blank take-out unit 3 and the blank holding unit 4. Here, the figure of the state in which the crystal blank aggregate 6 was mounted on the blank holding unit 4 is shown. Moreover, in FIG. 3, the crystal blank aggregate 6 is shown with sectional drawing. This cross-sectional view is the same as that shown in FIG.

  The blank take-out unit 3 is configured to be movable in directions indicated by arrows B1 and B2. That is, the blank take-out unit 3 moves in the substantially vertical direction of the blank holding unit 4 and approaches or leaves the blank holding unit 4. Note that such movement of the blank take-out unit 3 is controlled by a control signal S3 supplied from the controller 1.

  Further, the blank take-out unit 3 has a pressing portion 3a formed at a portion facing the blank holding unit 4, and a vacuum line 3b (shown by a broken line in FIG. 3). The pressing portion 3 a is configured as a convex portion in the blank take-out unit 3 and protrudes in the direction of the blank holding unit 4. As described above, when the blank take-out unit 3 moves in the arrow B1 direction, the blank take-out unit 3 comes into contact with the crystal blank aggregate 6 on the blank holding unit 4 at the portion of the pressing portion 3a. Specifically, the pressing portion 3 a is formed at a position where the remaining portion 6 c in the vicinity of the connecting portion 7 a of the crystal blank assembly 6 can be pressed. By pressing the quartz blank aggregate 6 with the pressing portion 3a as described above, the quartz blank assembly 6 can be appropriately fixed by the pressing portion 3a and the blank holding unit 4. Moreover, handling is facilitated by fixing the assembly in this manner.

  Further, the vacuum line 3b of the blank take-out unit 3 becomes a passage through which air flows as shown by a broken line arrow C1 when suction is performed by a suction device (not shown) or the like. Specifically, the vacuum line 3b is formed as a hollow portion in the blank take-out unit 3 in which the pressing portion 3a is not provided. The blank take-out unit 3 sucks the crystal blank 7 divided from the crystal blank aggregate 6 by performing suction with the vacuum line 3b. Note that suction by the vacuum line 3 b is also controlled by the controller 1.

  On the other hand, in the blank holding unit 4, the crystal blank aggregate 6 is placed and holds the crystal blank aggregate 6. Specifically, the blank holding unit 4 is configured to have a shape that can reliably fix the crystal blank aggregates 6a and 6b as described above. For example, the blank holding unit 4 is configured to have a “dent” or the like capable of appropriately fitting a crystal blank aggregate 6a, a crystal blank aggregate 6b, or the like. A plurality of blank holding units can be selected and used according to the external shape of the quartz crystal blank aggregate.

  The blank holding unit 4 mainly includes a push-up pin 4a, a vacuum line 4b, and a push-up pin passage 4c. The push-up pin passage 4c (indicated by a broken line in FIG. 3) is formed inside the blank holding unit 4, and stores the push-up pin 4a. The operation of the push-up pin 4a is controlled by the controller 1 and moves in the push-up pin passage 4c. When the crystal blank assembly 6 is placed on the blank holding unit 4 so that the division is performed properly, the push-up pin 4a and the push-up pin passage 4c are located with respect to the position in the crystal blank 7 that is separated from the connecting portion 7a to some extent So that it can be pushed up. Here, the push-up by the push-up pin 4a will be described. The push-up pin 4a pushes up the crystal blank assembly 6 in a state of being pressed by the pressing portion 3a from below as shown by an arrow B3. In this case, only the remaining portion 6 c is pressed by the pressing portion 3 a in the crystal blank assembly 6, and a gap (space) is formed between the crystal blank 7 of the crystal blank assembly 6 and the blank take-out unit 3. Therefore, when the crystal blank 7 is pushed up from below by the push-up pins 4 a, only the crystal blank 7 is divided from the crystal blank assembly 6.

  Furthermore, a vacuum line 4b (shown by a broken line in FIG. 3) in the blank holding unit 4 becomes a passage through which air flows as shown by a broken line arrow C2 when suction is performed by a suction device (not shown). The vacuum line 4b is provided at a position spaced apart from the push-up pin passage 4c to some extent. Specifically, the vacuum line 4b is a connecting portion 7a between the crystal blank 7 and the remaining portion 6c when the crystal blank assembly 6 is placed on the blank holding unit 4 so that the crystal blank 7 is appropriately divided. It is provided so that it may be located in the vicinity. The blank holding unit 4 performs suction by the vacuum line 4 b when at least the crystal blank 7 is divided from the crystal blank assembly 6. Thereby, the dust (contamination) discharged when the crystal blank 7 is divided from the crystal blank assembly 6 can be sucked by the vacuum line 4b.

  Note that suction by the vacuum line 4 b is also controlled by the controller 1. Further, the suction force by the vacuum line 4b is set to be weaker than the suction force by the vacuum line 3b. This is to prevent the suction / adsorption of the crystal blank 7 by the vacuum line 3b from being hindered by the suction by the vacuum line 4b.

[Blank split extraction method]
Next, with reference to FIG. 4, a blank divided extraction method according to the present embodiment will be described. FIG. 4 is a diagram showing a procedure for dividing and taking out the crystal blank 7.

  First, as shown in FIG. 4A, the crystal blank aggregate 6 is photographed by the camera 2. Then, the controller 1 performs image recognition based on the image taken by the camera 2. Specifically, the controller 1 recognizes an image of the crystal blank 7 to be divided and taken out. Then, the controller 1 determines a position (hereinafter also referred to as “push-up position”) to be pushed up by the push-up pin 4 a of the blank holding unit 4 based on the image recognition result. Next, as shown in FIG. 4B, the crystal blank aggregate 6 and the blank holding unit 4 are arranged so that the push-up pins 4a are appropriately positioned at the determined push-up positions. By doing so, it becomes possible to appropriately push up the portion of the crystal blank 7 in the crystal blank assembly 6 by the push-up pins 4a. In addition, when arrangement | positioning is performed as mentioned above, the connection part 7a of the quartz crystal blank aggregate | assembly 6 will be located in the vicinity of the vacuum line 4b of the blank holding | maintenance unit 4. FIG.

  Next, as shown in FIG. 4C, the controller 1 moves the blank take-out unit 3 in the direction indicated by the arrow D1. That is, the blank take-out unit 3 is moved in a direction approaching the crystal blank aggregate 6. Specifically, the controller 1 moves the blank take-out unit 3 until the pressing portion 3 a of the blank take-out unit 3 contacts the crystal blank aggregate 6 on the blank holding unit 4. Thereby, the quartz blank aggregate 6 placed on the blank holding unit 4 is pressed by the pressing portion 3 a of the blank take-out unit 3. Specifically, the remaining portion 6c in the vicinity of the connecting portion 7a of the crystal blank assembly 6 is pressed by the pressing portion 3a. By pressing the crystal blank aggregate 6 by the pressing portion 3 a in this way, the crystal blank aggregate 6 is fixed by the pressing portion 3 a and the blank holding unit 4.

  Next, as illustrated in FIG. 4D, the controller 1 performs push-up by the push-up pin 4 a of the blank holding unit 4. In this case, only the remaining portion 6 c is pressed by the pressing portion 3 a in the crystal blank assembly 6, and a gap is formed between the crystal blank 7 of the crystal blank assembly 6 and the blank take-out unit 3. By pushing up the crystal blank 7 from below with the push-up pin 4a (see arrow D2), only the crystal blank 7 is divided from the crystal blank assembly 6. Further, the controller 1 performs suction by the vacuum line 3b of the blank take-out unit 3 as indicated by the arrow E1 while performing the push-up by the push-up pin 4a. As a result, the crystal blank 7 divided by the push-up by the push-up pin 4 a can be quickly sucked by the blank take-out unit 3. Furthermore, the controller 1 performs suction by the vacuum line 4b of the blank holding unit 4 as indicated by an arrow E2 when the push-up is performed by the push-up pin 4a. Thereby, it becomes possible to suck the dust discharged when the crystal blank 7 is divided from the crystal blank assembly 6 by the vacuum line 4b. In addition, after the crystal blank 7 is adsorbed by the blank take-out unit 3, the controller 1 sets the suction by the vacuum line 4b to OFF. This is to prevent the crystal blank 7 adsorbed by the vacuum line 3b from being pulled away from the blank take-out unit 3 due to suction by the vacuum line 4b.

  Next, as shown in FIG.4 (e), the controller 1 moves the blank pick-up unit 3 which adsorb | sucked the crystal blank 7 to the direction shown by arrow D3. That is, the blank take-out unit 3 is moved in a direction away from the crystal blank aggregate 6. Thereafter, the controller 1 transports the crystal blank 7 adsorbed by the blank take-out unit 3 to a predetermined place.

  According to the above blank dividing and extracting method, the crystal blank 7 can be efficiently divided and extracted from the crystal blank assembly 6 in which a plurality of crystal blanks 7 are formed. Further, in this embodiment, the blanking unit 3 performs the division while the vicinity of the connecting portion 7a of the crystal blank assembly 6 is mechanically fixed, so that the influence of the deflection and warpage of the crystal blank assembly 6 itself is suppressed. Can be divided appropriately. Furthermore, according to the present embodiment, since the suction is performed by the vacuum line 3b of the blank take-out unit 3 at the time of division, the crystal blank 7 can be appropriately prevented from jumping out. Furthermore, since suction is performed by the vacuum line 4b of the blank holding unit 4 at the time of division, dust discharged at the time of division can be cleaned.

[Blank segment removal processing]
Next, with reference to FIG. 5, the blank divided extraction process according to the present embodiment will be described. FIG. 5 is a flowchart showing the blank divided extraction process. This process is mainly executed by the controller 1.

  First, in step S <b> 101, the controller 1 recognizes the crystal blank 7 in the crystal blank aggregate 6 by the camera 2. Specifically, the controller 1 recognizes the crystal blank 7 based on the image taken by the camera 2. Next, the process proceeds to step S102.

  In step S102, the controller 1 determines the position (push-up position) to be pushed up by the push-up pin 4a of the blank holding unit 4 based on the recognition data in step S101. Then, the process proceeds to step S103. In step S103, the controller 1 arranges the crystal blank aggregate 6 and the blank holding unit 4 so that the push-up pin 4a is appropriately positioned at the push-up position determined in step S102. Then, the process proceeds to step S104.

  In step S <b> 104, the controller 1 moves the blank take-out unit 3 in a direction approaching the crystal blank aggregate 6. Specifically, the controller 1 moves the blank take-out unit 3 until the pressing portion 3 a of the blank take-out unit 3 contacts the crystal blank aggregate 6 on the blank holding unit 4. Thereby, the quartz blank aggregate 6 placed on the blank holding unit 4 is pressed by the pressing portion 3 a of the blank take-out unit 3. Specifically, the remaining portion 6c in the vicinity of the connecting portion 7a of the crystal blank assembly 6 is pressed by the pressing portion 3a. Thus, the controller 1 fixes the crystal blank aggregate 6 by the pressing portion 3 a and the blank holding unit 4 by performing control to move the blank take-out unit 3. When the above process ends, the process proceeds to step S105.

  In step S <b> 105, the controller 1 executes push-up by the push-up pin 4 a of the blank holding unit 4. In this case, only the remaining portion 6 c is pressed by the pressing portion 3 a in the crystal blank assembly 6, and a gap is formed between the crystal blank 7 of the crystal blank assembly 6 and the blank take-out unit 3. By pushing up the crystal blank 7 from below with the push-up pins 4 a, only the crystal blank 7 is divided from the crystal blank aggregate 6. Further, the controller 1 performs suction by the vacuum line 3b of the blank take-out unit 3 while performing push-up by the push-up pin 4a. This is because the divided crystal blank 7 is quickly adsorbed. Further, the controller 1 performs suction by the vacuum line 4b of the blank holding unit 4 while performing the push-up by the push-up pin 4a. Thereby, it becomes possible to suck the dust discharged when the crystal blank 7 is divided from the crystal blank assembly 6 by the vacuum line 4b. When the above process ends, the process proceeds to step S106.

  In step S <b> 106, the controller 1 sucks the crystal blank 7 divided by the push-up by the push-up pin 4 a by the blank take-out unit 3. Specifically, the controller 1 sucks the divided crystal blank 7 by performing suction using the vacuum line 3 b of the blank take-out unit 3. Thereafter, the controller 1 transports the crystal blank 7 adsorbed by the blank take-out unit 3 to a predetermined place. In addition, after the crystal blank 7 is adsorbed by the blank take-out unit 3, the controller 1 sets the suction by the vacuum line 4 b of the blank holding unit 4 to be off. When the above process ends, the process exits the flow.

  According to the above-described blank division extraction processing, the crystal blank 7 can be efficiently divided and extracted from the crystal blank aggregate 6 in which a plurality of crystal blanks 7 are formed.

  As described above, in the present embodiment, the component divided take-out apparatus for taking out a component by dividing a crystal blank assembly in which a plurality of crystal blanks are formed is a crystal blank assembly in a mounted state. On the other hand, in the crystal blank assembly, the blank take-out unit that presses the remaining part other than the crystal blank in the crystal blank assembly from above and the crystal blank assembly that is pressed by the blank take-out unit. A blank holding unit that pushes up a portion of the crystal blank from below, and a blank take-out unit that sucks and sucks the crystal blank divided from the crystal blank aggregate by being pushed up by the blank holding unit. . Thereby, the crystal blank can be efficiently divided and taken out from the crystal blank aggregate in which a plurality of crystal blanks are formed.

[Modification]
Although the example which presses the crystal blank aggregate 6 by the press part 3a was shown above, it is not limited to this. That is, the pressing portion 3a is not limited to mechanically fixing the vicinity of the connecting portion 7a of the crystal blank assembly 6. In another example, a flat plate configured to cover the upper surface of the crystal blank aggregate 6 can be used instead of the pressing portion 3a. For example, this flat plate is configured so as to be able to press the upper part of the crystal blank assembly 6, and corresponds to the crystal blank 7 in the crystal blank assembly 6 in a state where the crystal blank assembly 6 is covered. A hole or the like is formed in the part. When such a flat plate is used, the flat plate functions as a pressing portion that presses the remaining portion 6c of the crystal blank assembly 6 from above, and the crystal blank assembly 6 itself is sandwiched between the flat plate and the blank holding unit 4 described above. Can be held in. Also in this manner, the vicinity of the connecting portion 7a of the crystal blank assembly 6 can be appropriately fixed, and the crystal blank 7 can be appropriately divided by the push-up by the push-up pin 4a of the blank holding unit 4.

It is a block diagram which shows schematic structure of the component division | segmentation taking-out apparatus which concerns on a present Example. It is a figure for demonstrating concretely about the structure of a crystal blank, etc. FIG. It is a figure which shows the side view of a blank taking-out unit and a blank holding unit. It is a figure which shows the procedure which divides | segments and takes out a crystal blank. It is a flowchart which shows the blank division | segmentation extraction process which concerns on a present Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Controller 2 Camera 3 Blank taking-out unit 3a Press part 3b, 4b Vacuum line 4 Blank holding unit 4a Push-up pin 6 Crystal blank aggregate 6c Remaining part 7 Crystal blank 7a Connection part 100 Parts division taking-out apparatus

Claims (7)

A component dividing and extracting device that extracts components by dividing a component assembly in which a plurality of components are formed,
A pressing unit that presses the remaining part other than the parts in the component assembly from above, with respect to the component assembly in the placed state,
A push-up part that pushes up the part assembly in a state of being pressed by the pressing part from below with respect to the part of the part in the part assembly;
An adsorbing part that adsorbs by sucking the parts divided from the part assembly by being pushed up by the push-up part ,
The component dividing / extracting device , wherein the pressing portion presses a remaining portion in the vicinity of a connection portion between the component portion and the remaining portion .   A component dividing and extracting device that extracts components by dividing a component assembly in which a plurality of components are formed,
  A pressing unit that presses the remaining part other than the parts in the component assembly from above, with respect to the component assembly in the placed state,
  A push-up part that pushes up the part assembly in a state of being pressed by the pressing part from below with respect to the part of the part in the part assembly;
  An adsorbing part that adsorbs by sucking the parts divided from the part assembly by being pushed up by the push-up part,
  The component dividing and extracting device, wherein the pressing portion and the suction portion are integrally formed, and the pressing portion is configured as a convex portion. 2. The apparatus according to claim 1, further comprising a suction part that sucks a vicinity of a connecting portion between the part and the remaining part of the part assembly when at least the part is divided from the part assembly. Or the component division | segmentation taking-out apparatus of 2. The component suction / extraction apparatus according to claim 3 , wherein the suction unit sucks dust discharged when the component is divided from the component assembly. Further comprising a push-up position determining means for recognizing the component assembly to determine a position to be pushed up by the push-up unit with respect to the component assembly;
5. The component dividing and extracting device according to claim 1, wherein the push-up unit performs the push-up based on a position determined by the push-up position determining unit. The component splitting and extracting device according to any one of claims 1 to 5 , wherein the component is a crystal blank. A component division extraction method for extracting a component by dividing a component assembly in which a plurality of components are formed,
A pressing step of pressing the remaining parts other than the parts in the parts assembly from above with respect to the parts assembly in a placed state,
A push-up step of pushing up the part assembly in the state pressed by the pressing step from below with respect to the part of the component in the part assembly;
An adsorption step of adsorbing by sucking the parts divided from the part assembly by being pushed up by the push-up process ,
The component dividing and extracting method , wherein the pressing step presses a remaining portion in the vicinity of a connecting portion between the component portion and the remaining portion .

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