JP4945657B2 - LED bulb - Google Patents

Description

  The present invention relates to a so-called LED bulb, which is a bulb-type lamp using an LED (light-emitting diode) as a light source, and more particularly to a cooling structure suitable for reducing heat generation of an LED as a light source.

  In recent years, there has been a significant flow of energy saving (hereinafter simply referred to as “energy saving”) in home appliances, and in light of this, the use of light sources that consume less power instead of conventional incandescent amplifiers is also used for household light bulbs. The spread of type lamps is remarkable.

  More specifically, instead of the conventional incandescent amplifier, a light bulb type lamp that uses a fluorescent lamp as a light source and has the same appearance as a conventional incandescent amplifier, more particularly, in recent years, Patent Documents 2 to 5 listed below. As known from the above, instead of the conventional incandescent amplifier, a light bulb type lamp using an LED (light emitting diode) as a light source has been developed and has been widely put into practical use.

  In addition, according to the inventors of the present application, in place of the conventional incandescent amplifier, instead of the LED, the fluorescent lamp is used as a light source. A device for providing a heat conduction path is already disclosed in Patent Document 5 below.

JP 2005-251637 A JP 2009-37995 A JP 2010-3579 A JP 2010-3580 A JP 2010-10044 A

  By the way, it is known that as the temperature rises, the light output of the LED decreases and its lifetime also shortens. Therefore, according to the above-mentioned Patent Document 1, by disposing the LED in the vicinity of the base that is electrically connected by screwing the LED as the light source into the socket as the power source in the home, It is already known to suppress the temperature rise.

  However, with the structure described above, it is possible to achieve sufficient LED cooling with a light bulb lamp with low power consumption (light output), however, for lighting that requires greater power consumption (light output). In this type of bulb-type lamp, the amount of heat generated by the LED as the light source also increases. Therefore, as is known from Patent Documents 2 to 4 described above, for example, between the base described above and a member for diffusing light from the light source by forming the glass into a substantially spherical outer shape, In addition, a structure in which a heat dissipating member having excellent heat conductivity such as metal is disposed and an LED as a heating element is mounted on the heat dissipating member is already known. That is, according to such a structure, the heat generated from the LED is radiated from the outer peripheral surface of the heat radiating member to the outside of the lamp by a fin or the like, thereby efficiently cooling the LED having a large heat generation amount. As a result, the temperature rise is suppressed, thereby extending the lamp life (resource saving).

  As described above, in the prior arts known from Patent Documents 2 to 4, the surface area of the metal heat dissipating part is proportional to the amount of heat dissipated, so that the heat dissipating part also increases as the amount of heat generated from the LED increases. It gets bigger. For this reason, there is a problem that the outer shape of the lamp is greatly different from that of a conventional light bulb type lamp. For example, in the case of manufacturing a relatively small LED light bulb with a large light emission output, which is an alternative to a mini-krypton light bulb or the like, it is difficult to ensure a sufficient surface area of the light bulb housing for heat dissipation. In the cooling structure according to the prior art, there is a problem that, when attached to a lighting fixture, the fin structure is too large to be attached. Furthermore, the heat conduction path already disclosed in the above-mentioned Patent Document 5 has a problem in use as described in detail below, and further improvement is required when applied to an LED bulb.

  As described above, the LED light bulb related to the present invention is often used in place of, for example, a conventional incandescent lamp in a conventional lighting fixture, and its outer shape is also compared with that of a conventional light bulb type lamp. It is not preferable that they differ greatly.

  Therefore, the present invention has been achieved in view of the above-described problems in the prior art, and more specifically, it is possible to more efficiently diffuse the heat generated from the LED, which is a heating element. An object of the present invention is to provide an LED bulb capable of extending the life (saving resources) by suppressing an increase in temperature while using an LED having a larger light emission amount.

  According to the present invention, in order to achieve the above-described object, first, a base part and the base part are screwed and attached to a part thereof, and a space for accommodating a lighting circuit is formed therein. A resin base member, a metal outer frame member formed to extend upward from the vicinity of the base portion while increasing its diameter so as to surround the base member, and the outer A glove attached to the upper end portion of the frame member, a light emitting element composed of an LED and driven by the lighting circuit to emit light, and the light emitting element is mounted on the upper surface and attached to the upper end portion of the outer frame member Therefore, in the LED bulb including the mounting plate disposed so that the light emitting surface of the light emitting element faces the inner surface of the globe, the inner periphery of the metal outer frame member, and the base portion Provide heat transfer between inner circumference Rutotomoni, LED bulb is provided in which a heat conductive member having electrical insulating properties.

  According to the present invention, in the LED bulb described above, the heat conducting member contacts a part of the inner peripheral surface of the metal outer frame member and the other part of the inner part of the base part. Preferably, the heat conducting member is formed of a metal plate, and the part of the surface is in contact with the inner peripheral surface of the metal outer frame member. It is preferable to form a film-like member having heat conductivity and electrical insulation. And the said metal plate is a copper plate, The film-like member formed in the one part surface is thicker than a 1st resinous thin film with a heat conductive and insulating 1st resinous thin film, and The second resinous thin film having elasticity, and further, the first resinous thin film and the second resinous thin film forming the film-like member are part of the copper plate. It is preferable that the surface is formed in this order and is provided so that the surface of the second resinous thin film is in contact with the inner peripheral surface of the metal outer frame member. In addition, the other part of the copper plate may be formed with a tongue-like part to contact the inner periphery of the base part, or the first resinous thin film may be a PAI layer, The first resinous thin film is preferably an elastomer layer.

  In addition, according to the present invention, in the LED bulb described above, the resin base member is inserted from an opening formed in an upper portion of the metal outer frame member, or the metal outer member is inserted. The base may be inserted through an opening formed in the lower part of the frame member, and the base is screwed into a socket to which commercial power is supplied.

  According to the present invention described above, it is possible to more efficiently diffuse the heat generated from the LED, which is a heating element, and while suppressing the temperature rise while using the LED having a larger light emission amount. In addition, a practically excellent effect of providing an LED bulb capable of extending the life (saving resources) is exhibited.

BRIEF DESCRIPTION OF THE DRAWINGS It is a side view including the partial cross section which shows the whole structure of the LED bulb which becomes one Example (Example 1) of this invention. It is the partially expanded perspective view which expanded and showed by removing the globe from the LED bulb which becomes the said Example 1. FIG. FIG. 3 is a partially enlarged cross-sectional view showing an enlarged part of the LED bulb of Example 1 to which the present invention relates. It is a perspective view including the partial cross section of the heat conductive member taken out and shown from the LED bulb of the said Example 1. FIG. It is a partially expanded sectional view which shows the detailed structure of the said heat conductive member. It is a partially expanded sectional view which shows the detailed structure of the heat conductive member which shows the other modification of the said Example 1. FIG. It is a partial cross section figure which shows the whole structure of the LED bulb used as the other Example (Example 2) of this invention. It is a perspective view which shows the heat conductive member of the LED bulb which becomes the said Example 2. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  First, in FIG. 1 attached, a part of a bulb-type lamp using an LED (light-emitting diode) as a light source, that is, an LED bulb 1 according to one embodiment (embodiment 1) of the present invention, is shown in cross section. ing. As shown in this figure, the LED bulb 1 is composed of a metal molded product having high conductivity and so-called good thermal conductivity, such as aluminum or magnesium alloy, and the inside thereof. The outer frame member 2 is formed with a conical shape or a hemispherical shape that gradually decreases in diameter from the upper portion toward the lower portion while forming a cavity. A mounting disc 31 having the light emitting element 3 mounted on the surface thereof is attached to the upper surface of the outer frame member 2, and a globe formed in a substantially hemispherical shape by a translucent member on the upper portion thereof. 4 is attached. That is, the entire light emitting surface of the light emitting element 3 is covered with the globe 4, and the light from the light emitting element 3 is applied to the inner surface of the translucent globe 4.

  On the other hand, the lower part of the outer frame member 2 will be described in detail later, and a resin base member 5 for housing and protecting the lighting circuit 7 is attached to the inside, and further, A base portion 6 is provided at a lower portion of the base member 5. The resin base member 5 is made of, for example, an electrically insulating member such as polycarbonate, and thereby protects the lighting circuit housed therein from heat.

  Here, the light emitting element 3 mounted on the surface of the disk 31 attached to the upper surface of the outer frame member 2 is, for example, a plurality of (for example, 100) blue colors on one semiconductor substrate (one chip). It is a so-called light-emitting diode formed by forming an LED and applying a yellow light-transmitting coating (converting to white light) on the entire surface. The light-emitting element 3 is, for example, a heat-conductive element. The ceramic material is mounted (adhered) in close contact with a good heat conducting member on a mounting disk 31 formed in a substantially disk shape. Examples of the good heat conducting member include grease-like silicon resin and epoxy resin mixed with metal oxide, and according to this, the heat generated in the semiconductor substrate of the light emitting element 3 It will be transmitted to the board 31 satisfactorily. In the present invention, the light-emitting element 3 is not limited to one light-emitting diode formed on one chip as described above. For example, a plurality of blue LEDs are formed on one chip. A plurality of (a plurality of chips) light emitting diodes having a light-transmitting coating on the surface may be mounted on the upper surface of the disk 31 attached to the upper end of the outer frame member 2. Reference numeral 71 in the drawing indicates a part of a connection line for transmitting a drive signal from the lighting circuit 7 to the light emitting element 3.

  In addition, a groove portion 21 is formed on the outer peripheral portion of the upper end surface of the outer frame member 2 described above, while a step portion 41 is formed around the lower end of the globe 4, which are fitted to each other so as to be integrally attached. It is supposed to be. The globe 4 is formed by forming a so-called translucent body such as glass or resin in a substantially hemispherical shape, and having a diffusion surface for diffusing light on the inner surface side thereof. is there. Thereby, the light (converted white light) from the light emitting element 3 accommodated in the internal space is uniformly diffused to the surroundings by the diffusion surface, so that uniform illumination is possible.

  Next, FIG. 2 attached herewith shows a partially enlarged perspective view in which a portion obtained by removing the globe 4 from the LED bulb 1 shown in FIG. 1 is enlarged. As is clear from this figure, as described above, the disc 32 having the light emitting element 3 mounted on the surface thereof is mounted on the upper end portion of the conical outer frame member 2 by, for example, a good heat conducting member ( Further, an opening 22 is formed at the lower end of the resin base member 5 for housing and protecting the above-described lighting circuit 7 from the formed opening 22. A part, that is, a circuit accommodating portion 51 formed in a substantially cylindrical shape is inserted. In general, the outer peripheral surface of the outer frame member 2 is painted in order to maintain its decorativeness.

  That is, the resin base member 5 is formed with a cylindrical hollow portion in the upper portion thereof, and constitutes a circuit accommodating portion 51 for accommodating the lighting circuit 7 described above. A screwing portion 52 to which the above-described base portion 6 is screwed is formed on the outer periphery. Further, a flange 53 protruding to the outer periphery is formed between them. According to the base member 5 having such a configuration, when the circuit housing portion 52 is inserted into the opening 21 formed at the lower end of the outer frame member 2 and reaches a predetermined position, the flange portion 53 becomes the outer frame member. 2 are in contact with the lower end surfaces of the two, and are thus positioned at predetermined positions. Therefore, for example, the base member 5 and the outer frame member 2 can be fixed in close contact with each other by an adhesive member such as an adhesive. Further, as shown in the figure, the above-described screwed portion 52 of the base is formed at the lower portion of the resin base member 5, and the screwed portion 53 is connected to a socket which is a household power source. The base 6 that is electrically connected by screwing is attached by rotating along the spiral groove formed along the outer peripheral surface while pressing in the direction indicated by the arrow in the drawing.

  In the present invention, the flange portion 53 of the base member 5 is formed with a plurality of through grooves (slits) 55, 55 penetrating in the thickness direction of the flange portion (in this example, four locations). As shown by arrows in the figure through the through grooves 55 and 55, the details will be described below. However, a part of the heat from the light emitting element 3 transmitted to the outer frame member 2 is obtained. A member for forming a heat conduction path to be transmitted to the base 6, that is, a heat conduction member 7 is attached.

  In other words, in the present invention, the outer frame member 2 constituting the LED bulb 1 is not so large, however, the heat generated in the light emitting element 3 which is enlarged (increased in output) can be efficiently discharged to the outside. For the purpose, a heat conduction path for releasing a part of the heat of the outer frame member 2 to the cap portion 6 is further provided. As a result, both heat radiation from the outer peripheral side surface of the outer frame member 2 and heat transfer to the cap portion 6 can be taken, and the temperature rise of the LED portion that is the light source can be more effectively suppressed. Is. As described above, in order to solve the above-described problems, a structure for effectively releasing heat by providing a heat conducting member in the base has already been proposed (Patent Document 5: JP 2010-2010 A). No. 10044).

  However, for example, a heat conductive member having good heat conductivity such as copper (Cu) is also a good conductive member, and the heat conductive member 7 for releasing heat to the base portion 6 is formed using this heat conductive member. In this case, there is a problem in that the base 6 and the outer frame member 2 are at the same potential due to the heat conducting member 7, which is not preferable in terms of product safety. That is, for example, when an LED bulb is to be inserted into a socket as a power source in a home, a commercial power supply voltage flowing through the socket is applied from the base 6 to the outer frame member 2. At that time, the outer peripheral surface of the outer frame member 2 is painted, and therefore, normally, no leakage occurs to the person who is replacing the LED bulb, however, the outer peripheral surface of the outer frame member 2 If a part of the paint is peeled off or insufficient, there is a risk that a person who is replacing the LED bulb will be electrocuted. Therefore, a new structure is required to avoid such danger.

  Therefore, in the present invention, by configuring the above-described heat conducting member 7 as described below, a part of the heat of the outer frame member 2 is efficiently transmitted to the base portion 6 thermally. Electrically, the outer frame member 2 can be reliably insulated from the base portion 6.

  More specifically, the heat conductive member 7 of the present invention is, for example, a substantially annular shape in which a plate of a good heat conductive material such as copper (Cu) is cut out as shown in FIG. Main body portion (connecting portion with the outer frame member) 71 and a plurality (four in this example) of tongue-like portions 72 and 72 formed to extend downward from the main body portion 71. Further, as will be described in detail later, the outer peripheral surface of the main body 71 is excellent in thermal conductivity, but is coated with a coating 73 that is electrically insulating. The heat conducting member 7 is configured such that when the circuit accommodating portion 52 of the resin base member 5 is inserted into the opening 21 formed at the lower end of the outer frame member 2, the main body portion 71 is the base member. 5, and the tongue-like portions 72 and 72 are attached in a state of being inserted into through grooves (slits) 55 and 55 formed in the flange portion 53 of the base member 5.

  As a result, as is clear from the partially enlarged sectional view of FIG. 3 attached, the heat conducting member 7 of the present invention has its main body portion 71 and the outer peripheral surface of the circuit accommodating portion 52 constituting the base member 5. The outer frame member 2 is sandwiched between the inner peripheral surface of the opening 21 formed at the lower end of the outer frame member 2. Further, the tongue-like portions 72, 72 are bent along the lower surface of the flange portion 54 of the resin base member 5 and further along the outer peripheral surface of the screwing portion 53 as indicated by arrows in the drawing. It is done. Thereafter, the base part 6 is attached thereon, and as a result, the tongue-like part 72 comes into close contact with the upper part of the base part 6. As a result, the heat conducting member 7 is connected between the outer frame member 2 and the base 6, whereby a part of the heat of the outer frame member 2 passes through the heat conducting member 7. A path for transmitting (releasing) to the base 6 is formed. At this time, the heat conduction member 7 is electrically insulated (blocked) from the outer frame member 2 by the coating 73 formed in advance on the outer peripheral surface of the main body 71 of the heat conduction member 7. Will be.

  In addition, the coating 73 provided by the coating provided on the heat conducting member 7 described above, in particular, the outer peripheral surface of the main body 71 (that is, the contact surface with the inner peripheral surface of the outer frame member 2), Also has an effect. That is, between the opening 21 formed at the lower end of the outer frame member 2 and the outer peripheral surface of the circuit housing portion 52 of the base member 5, for example, tolerance in the case of making each by injection molding or the like For example, a gap is generated. Due to this gap, there is a possibility that the heat conducting member 7 may not be attached in a sufficiently close contact state between the outer peripheral surface of the circuit housing portion 52 and the inner peripheral surface of the opening 21. There is. In that case, it is not preferable because the function of the heat conducting member 7 (that is, letting a part of heat of the outer frame member 2 escape to the base 6) is impaired. Therefore, the covering 73 by the coating fills the gap (gap) by having a predetermined elasticity, so that the heat conducting member 7 is connected to the opening 21 formed at the lower end of the outer frame member 2 and the base. The function of the heat conducting member 7 is secured by closely contacting each other with the outer peripheral surface of the circuit housing portion 52 of the base member 5 (that is, ensuring high adhesion).

  Next, details of the above-described heat conducting member 7 will be described with reference to FIGS. 4 and 5. FIG. 4 shows the heat conducting member 7 attached between the base member 5 and the outer frame member 2, and FIG. 5 shows a plate material for manufacturing the heat conducting member 7. It is a partially expanded sectional view which expands and shows a part of.

  As such a heat conducting member 7, for example, an epoxy resin mixed with a metal oxide can be considered. However, in general, a material having a relatively high thermal conductivity is often a metal, and in that case, there are many materials in which current flows simultaneously with heat. Therefore, it is difficult to find a material that satisfies the conditions of high thermal conductivity, an electrically insulating material, and high adhesion, and is expensive and difficult to apply to a product.

  Therefore, in the present invention, as a practical configuration that satisfies the above-described conditions required for the heat conducting member 7, the main body 71 of the heat conducting member 7 and its tongues 72, 72 are made to have a thermal conductivity. It forms with the board | plate material of copper (Cu) which is a high metal. And the following coating | coated 73 is given to the outer peripheral surface of the main-body part 71 of the heat conductive member 7 by coating. That is, the outer peripheral surface of the main body 71 is first coated with, for example, a polyamideimide (PAI) coating (hereinafter referred to as “first resinous thin film 731”), for example, about 0. Apply at a thickness of 02 mm. After that, a polyimide film having a thickness of about 0.25 mm is formed on the formed polyimide amide coating with a high flexibility, a high thermal conductivity, and an insulating elastomer (hereinafter referred to as “second resinous thin film 732”). Apply it.

  In other words, the heat conducting member 7 is formed of the above-described three layers (that is, a copper plate, a PAI layer, and an elastomer layer) between the circuit accommodating portion 52 of the base member 5 and the opening 21 of the outer frame member 2. ) Form with structure. According to this, the first resinous thin film 731 excellent in heat resistance, adhesion, high thermal conductivity, and insulation is first formed on the outside of the main body 71 of the heat conducting member 7 which is a metal heat transfer plate. Furthermore, in order to maintain the adhesiveness with the outer frame member 2, there is a thickness five times or more than the first resinous thin film 731, and heat resistance, adhesiveness, high thermal conductivity, A second resinous thin film 732 is provided that is highly insulating and elastic, and also excellent in resilience against temperature changes. By adopting such a configuration, even when the temperature rises or falls and the heat conducting member 7 expands or shrinks, the second resinous thin film 732 is deformed. It is possible to always maintain good adhesion between the member 5 and the outer frame member 2. In other words, this enables part of the heat from the light emitting element 3 transmitted to the outer frame member 2 to escape to the cap portion 6 via the heat conducting member 7.

  In addition, about the coating | coated 73 of the main-body part 71 of the heat conductive member 7 mentioned above, it is not necessarily limited to the structure mentioned above, For example, even what is shown to attached FIG. 6 (A)-(C). Good. That is, for example, FIG. 6A shows the first resinous thin film 731 and the second resinous thin film 732 formed on both surfaces of the main body 71, and FIG. The first resinous thin film 731 is disposed on one surface of the main body 71 (particularly, the surface in contact with the inner periphery of the outer frame member 2), and the second resinous thin film 732 is disposed on the opposite surface. , Respectively. That is, the covering 73 of the main body 71 allows a part of the heat of the outer frame member 2 to escape to the base 6 via the heat conducting member 7, and electrically between the outer frame member 2. Insulate. Furthermore, as shown in FIG. 6C, the first resinous thin film 731 is formed on one surface of the main body 71 (particularly, the surface that contacts the inner periphery of the outer frame member 2). For example, an O-ring 733 formed of rubber or the like can be used on the opposite surface.

  Further, another embodiment (embodiment 2) of the present invention will be described below with reference to the attached FIG. 7 and FIG. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted to avoid duplication.

  As is apparent from the figure, in the second embodiment, in particular, the resin base member 5 for housing and protecting the lighting circuit 7 is different from the first embodiment in that aluminum or magnesium is used. It is composed of a metal molded product having high conductivity, such as an alloy having good heat conductivity, and the upper surface of the outer frame member 2 to which the mounting disk 31 on which the light emitting element 3 is mounted is attached. It is structured to be inserted and attached from above. That is, in the structure of the second embodiment, the resin base member 5 in which the lighting circuit 7 is accommodated in the internal space is inserted into the outer frame member 2 from above, and further from above, A mounting disc 31 on which the light emitting element 3 is mounted is placed on the upper surface. Thereafter, for example, the mounting disk 31 is fixed to the outer frame member 2 with screws 33. For this reason, the above-described flange portion 53 is not formed on the resin base member 5 and, as is apparent from the drawing, a relatively large circuit housing portion 51 can be secured.

  In the second embodiment, the difference between the structures described above, in particular, the absence of the flange 53 formed at the substantially central portion of the base member 5, is between the base member 5 and the outer frame member 2. The heat conducting members 7 ′ and 7 ″ attached by being sandwiched have a shape as shown in FIG. 8 attached. For example, FIG. A main body portion 71 sandwiched (inserted) between the outer frame member 2 is formed, and a plurality of (four in this example) tongue-like portions 72, 72 are formed in the lower portion thereof in the same manner as described above. Alternatively, as shown in Fig. 8 (B), the main body 71 is separated into a plurality of pieces (in this example, two pieces), and a plurality of pieces (in this example, in this example) Two tongue-like portions 72, 72 may be formed, and the outer peripheral surface of the main body 71 (contact surface with the outer frame member 2) is the same as described above. Thus, a coating 73 made of the first resinous thin film and the second resinous thin film is formed, and rotated while pressing the base 6 along the outer peripheral surface of the screwing portion 53 of the base member 5. The tongue portion 72 and the base portion 6 are in close contact with each other by being attached in the same manner as described above.

  It should be noted that the above-described heat conducting members 7 ′ and 7 ″ also allow the opening 21 formed at the lower end of the outer frame member 2 and the base as in the above-described embodiment to be clear as shown in FIG. The base member 5 is in close contact with the outer peripheral surface of the circuit housing portion 52 (that is, high adhesion is ensured), thereby ensuring the function of the heat conducting member 7. That is, the outer frame member 2 is provided. Forming a path for transferring (releasing) a part of heat to the base part 6 via the heat conducting member, and electrically insulating the outer frame member 2 from the base part 6 7, for example, a notch 25 is provided at the lower end portion of the outer frame member 2 formed of aluminum or the like, thereby increasing the outer frame member 2 with respect to the base portion 6. This ensures more reliable insulation, that is, replace the LED bulb. When you are a human, even touches the outer frame member 2 made of a metal such as aluminum and magnesium alloys, are eliminated from the risk of electric shock.

  In each of the above-described embodiments, the lighting circuit 7 is stored in the space of the circuit housing portion 52 of the base member 5, but the space other than the lighting circuit 7 is not shown here. However, for example, by embedding a highly conductive resin, the heat generated by the lighting circuit 7 can be efficiently transferred to the outside of the circuit housing portion 52 and released.

  As described above in detail, according to the LED bulb according to the present invention, a part of the heat generated inside is released to the base by a relatively simple and inexpensive structure, and the metal outer frame member 2 is Radiation from the outer peripheral surface is ensured at the same time. Thereby, in particular, it becomes possible to effectively release the heat of the light emitting element portion, and thus it is possible to achieve a long life of the LED bulb by suppressing the temperature rise.

  DESCRIPTION OF SYMBOLS 1 ... LED bulb, 2 ... Outer frame member, 22 ... Opening part, 3 ... Light emitting element, 31 ... Mounting disk, 4 ... Globe, 5 ... Base member, 51 ... Circuit accommodating part, 53 ... Screwing part, 6 ... base, 7 ... lighting circuit.

Claims (10)

The base part,
A base member made of resin, which is formed by screwing the base part into a part thereof, and forming a space for accommodating the lighting circuit therein,
A metal outer frame member formed to extend upward while increasing its diameter from the vicinity of the base portion so as to surround the base member,
A glove attached to the upper end of the outer frame member;
A light emitting element configured by an LED and driven by the lighting circuit to emit light;
An LED bulb including a light-emitting element mounted on an upper surface of the light-emitting element and a mounting plate attached to an upper end portion of the outer frame member and disposed so that a light-emitting surface of the light-emitting element faces an inner surface of the globe. In addition,
An LED light bulb characterized in that a heat conducting member having heat conductivity and electrical insulation is provided between an inner periphery of the metal outer frame member and an inner periphery of the base part.   2. The LED bulb according to claim 1, wherein a part of the heat conducting member is in contact with an inner peripheral surface of the metal outer frame member, and another part is in contact with an inner peripheral surface of the base part. An LED bulb characterized by being provided.   The LED light bulb according to claim 2, wherein the heat conducting member is formed of a metal plate, and the surface of the part contacting the inner peripheral surface of the metal outer frame member has heat conductivity. An LED bulb characterized by comprising a film-like member having electrical insulation properties.   4. The LED bulb according to claim 3, wherein the metal plate is a copper plate, and a film-like member formed on a part of the surface is a thermally conductive and insulating first resinous thin film; An LED bulb characterized by being formed of a second resinous thin film that is thicker than one resinous thin film and has elasticity.   The LED light bulb according to claim 4, wherein the first resinous thin film and the second resinous thin film forming the film-like member are formed in a certain order on a part of the surface of the copper plate. And the LED bulb | ball characterized by being provided so that the surface of the said 2nd resinous thin film may contact the inner peripheral surface of the said metal outer frame member.   5. The LED bulb according to claim 4, wherein a tongue-like portion is formed on another portion of the copper plate so as to come into contact with an inner periphery of the base portion.   5. The LED bulb according to claim 4, wherein the first resinous thin film is a PAI layer, and the first resinous thin film is an elastomer layer.   2. The LED bulb according to claim 1, wherein the resin base member is inserted from an opening formed in an upper portion of the metal outer frame member.   2. The LED bulb according to claim 1, wherein the resin base member is inserted from an opening formed in a lower portion of the metal outer frame member.   2. The LED light bulb according to claim 1, wherein the base is screwed into a socket to which commercial power is supplied.

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