JP4830170B2

JP4830170B2 - Transfer device

Info

Publication number: JP4830170B2
Application number: JP2006135778A
Authority: JP
Inventors: 習一庄子; 潤水野; 浩志大野; 誠福原; 誠太田口
Original assignee: Waseda University; Toyo Gosei Co Ltd
Current assignee: Waseda University; Toyo Gosei Co Ltd
Priority date: 2006-05-15
Filing date: 2006-05-15
Publication date: 2011-12-07
Anticipated expiration: 2026-05-15
Also published as: JP2007305944A

Description

本発明は、所望の凹凸パターンが形成された雄型（モールド）を光硬化性樹脂に押付けることによって基板上の樹脂面に凹凸パターンを転写する転写装置に関し、ナノスケールの凹凸の転写に用いて好適である。 The present invention relates to a transfer equipment for transferring the concavo-convex pattern on the resin surface of the substrate by pressing the desired concavo-convex pattern formed male (the mold) to the photocurable resin, the transfer of nanoscale asperities It is suitable for use.

半導体集積回路の高密度化、高速化に伴い、集積回路のパターン線幅が縮小され、製造に関して高性能化が求められている。微細なパターンの型が形成可能な装置として、ナノインプリント装置が種々提案されている（例えば、特許文献１参照）。ナノインプリント装置は、液状の光硬化性樹脂（ＵＶ硬化性樹脂）を凹凸パターンが形成されたモールドと基板で挟み、紫外線光を照射することで樹脂を硬化させてナノスケールのパターンを転写する装置である。 With the increase in density and speed of semiconductor integrated circuits, the pattern line width of integrated circuits has been reduced, and high performance is required for manufacturing. Various nanoimprint apparatuses have been proposed as apparatuses capable of forming a fine pattern mold (see, for example, Patent Document 1). A nanoimprint device is a device that transfers a nanoscale pattern by sandwiching a liquid photocurable resin (UV curable resin) between a mold and a substrate on which an uneven pattern is formed and irradiating ultraviolet light to cure the resin. is there.

ナノインプリント装置では、モールドが基板に押付けられる際、モールドの凹凸面と基板が密着しないと凹凸面がＵＶ硬化性樹脂に転写されない。このため、モールドの凹凸面と基板のＵＶ硬化性樹脂塗布面との平行度合いを正確に調整することが重要である。従来のナノインプリント装置では、機械的な調整機構を備え、モールドが支持される支持台と基板が支持される支持面との位置関係を所望の状態に調整している。 In the nanoimprint apparatus, when the mold is pressed against the substrate, the uneven surface is not transferred to the UV curable resin unless the uneven surface of the mold and the substrate are in close contact. For this reason, it is important to accurately adjust the degree of parallelism between the uneven surface of the mold and the UV curable resin coated surface of the substrate. In the conventional nanoimprint apparatus, a mechanical adjustment mechanism is provided, and the positional relationship between the support base on which the mold is supported and the support surface on which the substrate is supported is adjusted to a desired state.

しかし、機械的な調整機構を備えた場合、装置が大掛かりになりコストが嵩むことになると共に、機械的な調整機構では、調整できる精度に限度があり微調整ができない。また、機械的な調整機構は、モールドが支持される支持台と基板の支持面（装置側）との調整になり、モールドの凹凸面やＵＶ硬化性樹脂の状態等の現物の誤差を反映しての調整はできない。モールドの凹凸面とＵＶ硬化性樹脂の当たり具合を見ながら機械的な調整機構により調整を行うことも可能であるが、時間と手間がかかり、自動化を行うにはコストもかかってしまう。 However, when a mechanical adjustment mechanism is provided, the apparatus becomes large and the cost increases, and the mechanical adjustment mechanism has a limit in accuracy that can be adjusted, and fine adjustment cannot be performed. The mechanical adjustment mechanism adjusts the support base on which the mold is supported and the support surface (device side) of the substrate, and reflects actual errors such as the uneven surface of the mold and the state of the UV curable resin. Cannot be adjusted. While it is possible to perform adjustment by a mechanical adjustment mechanism while observing the contact between the concave and convex surface of the mold and the UV curable resin, it takes time and labor, and automation is also costly.

特開２００５−１０１２０１号公報JP 2005-10201 A

本発明は上記状況に鑑みてなされたもので、大掛かりな調整機構を備えることなく、モールド側の支持部材を基板支持台側に載せるだけで、モールドの凹凸面や光硬化性樹脂の状態に応じ現物の誤差が反映された状態で、モールドの凹凸面と光硬化性樹脂面とを平行状態に調整することができる転写装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and without depending on a large adjustment mechanism, by simply placing the mold-side support member on the substrate support base side, according to the uneven surface of the mold and the state of the photocurable resin. in a state where an error is reflected in kind, and an object thereof is to provide a transfer equipment which is capable of adjusting the uneven surface and a light-curable resin surface of the mold in parallel state.

上記目的を達成するための請求項１に係る本発明の転写装置は、上面に光硬化性樹脂が塗布された基板が保持される載置面を有し上面に連続して上面に交差する角度の周面を有する載置台を備え、凹凸のパターンが形成されたモールドを支持する支持部を有し凹凸のパターンが基板の光硬化性樹脂の面に対向する状態で載置台の周面に嵌合する嵌合部を有するモールド支持部材を備え、載置台の周面にモールド支持部材の嵌合部を嵌合させることにより光硬化性樹脂の面と凹凸のパターンの接触状況に応じて基板の光硬化性樹脂塗布面と凹凸のパターンが平行状態になるようにモールド支持部材の嵌合部が載置台の周面に嵌合することを特徴とする。 In order to achieve the above object, a transfer apparatus according to a first aspect of the present invention has an installation surface having a mounting surface on which a substrate coated with a photocurable resin is held on an upper surface and intersecting the upper surface continuously. The mounting table has a peripheral surface, and has a support portion for supporting the mold on which the concave / convex pattern is formed, and the concave / convex pattern is fitted on the peripheral surface of the mounting table in a state facing the surface of the photocurable resin of the substrate. A mold support member having a fitting portion to be mated, and by fitting the fitting portion of the mold support member to the peripheral surface of the mounting table, depending on the contact state between the surface of the photocurable resin and the uneven pattern, The fitting portion of the mold support member is fitted to the peripheral surface of the mounting table so that the photocurable resin-coated surface and the uneven pattern are in a parallel state.

請求項１に係る本発明では、載置台の周面にモールド支持部材の嵌合部を嵌合させることにより光硬化性樹脂の面と凹凸のパターンの接触状況に応じて嵌合状況が調整され、基板の光硬化性樹脂塗布面と凹凸のパターンが平行状態になる。 In this invention which concerns on Claim 1, a fitting condition is adjusted according to the contact condition of the surface of a photocurable resin, and an uneven | corrugated pattern by fitting the fitting part of a mold support member to the surrounding surface of a mounting base. The photocurable resin-coated surface of the substrate and the uneven pattern are in a parallel state.

そして、請求項２に係る本発明の転写装置は、請求項１に記載の転写装置において、載置台は円柱状とされると共にモールド支持部材は円筒状とされ、円柱状の円柱面が周面となり円筒状の円筒部が嵌合部となり、モールド支持部材は、円筒端面の内側にモールドが支持されると共に円筒筒面の内周面が円柱状の載置台に嵌合されることを特徴とする。 According to a second aspect of the present invention, there is provided the transfer device according to the first aspect, wherein the mounting table has a columnar shape, the mold support member has a cylindrical shape, and the columnar columnar surface is a circumferential surface. The cylindrical cylindrical portion becomes a fitting portion, and the mold support member is characterized in that the mold is supported inside the cylindrical end surface and the inner peripheral surface of the cylindrical cylindrical surface is fitted to a columnar mounting table. To do.

請求項２に係る本発明では、円柱状の載置台の外周に円筒状のモールド支持部材の内周が嵌合することにより光硬化性樹脂の面と凹凸のパターンの接触状況に応じて嵌合状況が調整されて光硬化性樹脂の面と凹凸のパターンが平行状態になる。 According to the second aspect of the present invention, the inner periphery of the cylindrical mold support member is fitted to the outer periphery of the columnar mounting table, and is fitted according to the contact state between the surface of the photocurable resin and the uneven pattern. The situation is adjusted so that the surface of the photo-curable resin and the uneven pattern become parallel.

また、請求項３に係る本発明の転写装置は、請求項１もしくは請求項２に記載の転写装置において、載置台の周面とモールド支持部材の嵌合部との間の嵌合面に移動許容手段を介在させたことを特徴とする。 According to a third aspect of the present invention, in the transfer device according to the first or second aspect, the transfer device moves to a fitting surface between the peripheral surface of the mounting table and the fitting portion of the mold support member. It is characterized by interposing an allowance means.

請求項３に係る本発明では、移動許容手段により嵌合状況の調整が容易に行われる。 In this invention which concerns on Claim 3, adjustment of a fitting condition is easily performed by a movement permissive means.

また、請求項４に係る本発明の転写装置は、請求項１〜３のいずれかに記載の転写装置において、モールド支持部材を載置台側に移動させるねじ部材を備え、モールド支持部材はねじ部材の回転により移動が規制されて載置台側に嵌合し、光硬化性樹脂の面と凹凸のパターンの接触状況に応じてねじ部材のバックラッシによる移動の範囲で光硬化性樹脂の面と凹凸のパターンが平行状態になるようにされることを特徴とする。 A transfer device according to a fourth aspect of the present invention is the transfer device according to any one of the first to third aspects, further comprising a screw member that moves the mold support member toward the mounting table, and the mold support member is a screw member. The movement is regulated by the rotation of the screw and fitted to the mounting table side, and the surface of the photocurable resin and the uneven surface are within the range of movement due to the backlash of the screw member according to the contact state between the surface of the photocurable resin and the uneven pattern. The pattern is made to be in a parallel state.

請求項４に係る本発明では、ねじ部材の回転によりモールド支持部材を移動させてモールドの凹凸面が基板に塗布された光硬化性樹脂に押付けられ、ねじ部材のバックラッシによる移動の範囲で嵌合状況の調整が行われて光硬化性樹脂の面と凹凸のパターンが平行状態になるようにされる。 In the present invention according to claim 4, the mold support member is moved by rotation of the screw member so that the uneven surface of the mold is pressed against the photocurable resin applied to the substrate and fits within the range of movement of the screw member due to backlash. The situation is adjusted so that the surface of the photocurable resin and the uneven pattern are in a parallel state.

また、請求項５に係る本発明の転写装置は、請求項１〜３のいずれかに記載の転写装置において、モールド支持部材を載置台側に移動させる錘を備えたことを特徴とする。 A transfer apparatus according to a fifth aspect of the present invention is the transfer apparatus according to any one of the first to third aspects, further comprising a weight that moves the mold support member to the mounting table side.

請求項５に係る本発明では、錘によりモールド支持部材を載置台側に移動させてモールドの凹凸面が基板に塗布された光硬化性樹脂に押付けられる。 In the present invention according to claim 5, the mold support member is moved to the mounting table side by the weight, and the uneven surface of the mold is pressed against the photocurable resin applied to the substrate.

また、請求項６に係る本発明の転写装置は、請求項１〜５のいずれかに記載の転写装置において、移動許容手段は周面に取り付けられる弾性体部材であることを特徴とする。 According to a sixth aspect of the present invention, in the transfer device according to any one of the first to fifth aspects, the movement allowing means is an elastic member attached to the peripheral surface.

請求項６に係る本発明では、安価な弾性部材により嵌合状況の調整が容易に行われる。 In this invention which concerns on Claim 6, adjustment of a fitting condition is easily performed with an inexpensive elastic member.

また、請求項７に係る本発明の転写装置は、請求項６に記載の転写装置において、弾性体部材はシール機能を有するシール材であり、光硬化性樹脂の面とモールドの凹凸のパターンで囲まれる雰囲気を所定の減圧状態にすることで転写方向の押付け力を得る減圧手段を備えたことを特徴とする。 According to a seventh aspect of the present invention, there is provided the transfer device according to the sixth aspect, wherein the elastic member is a sealing material having a sealing function, and has a pattern of the photocurable resin surface and the unevenness of the mold. It is characterized by comprising a decompression means for obtaining a pressing force in the transfer direction by bringing the enclosed atmosphere into a predetermined decompressed state.

請求項７に係る本発明では、安価な弾性部材により嵌合状況の調整が容易に行われると共に、弾性部材でシールされた部位の雰囲気が減圧手段により所定の減圧状態にされて転写方向の押付け力が得られる。 According to the seventh aspect of the present invention, the fitting state is easily adjusted by an inexpensive elastic member, and the atmosphere of the portion sealed by the elastic member is brought into a predetermined reduced pressure state by the pressure reducing means, and is pressed in the transfer direction. Power is obtained.

また、請求項８に係る本発明の転写装置は、請求項１〜７のいずれかに記載の転写装置において、モールドは透明部材によりなり、凹凸のパターンを転写した後にモールドを通して光硬化性樹脂に光を照射する光照射手段を備えたことを特徴とする。 The transfer device of the present invention according to claim 8 is the transfer device according to any one of claims 1 to 7, wherein the mold is made of a transparent member, and after transferring the uneven pattern to the photo-curable resin through the mold. A light irradiation means for irradiating light is provided.

請求項８に係る本発明では、光照射手段によりモールドを通して光硬化性樹脂に光を照射することができ、光を照射するためのスペースを容易に確保することができる。 In this invention which concerns on Claim 8, light can be irradiated to photocurable resin through a mold with a light irradiation means, and the space for irradiating light can be ensured easily.

また、請求項９に係る本発明の転写装置は、請求項１〜８のいずれかに記載の転写装置において、モールド支持部材の支持部は、内周縁にモールドが載置されるリング状の支持枠を備えると共にモールドを支持枠側に押圧する押え部材を備え、モールドの支持枠への載置部は、支持枠の内周縁に載せられる状態の傾斜面部とされていることを特徴とする。 The transfer device of the present invention according to claim 9 is the transfer device according to any one of claims 1 to 8, wherein the support portion of the mold support member is a ring-shaped support in which the mold is placed on the inner periphery. A holding member that includes a frame and presses the mold toward the support frame is provided, and the placement portion of the mold on the support frame is an inclined surface portion that is placed on the inner periphery of the support frame.

請求項９に係る本発明では、載置台の周面にモールド支持部材の嵌合部を嵌合させることにより光硬化性樹脂の面と凹凸のパターンの接触状況に応じて嵌合状況が調整され、更に、モールドの傾斜面部が押え部材での押圧力の範囲で支持枠に対して移動し、光硬化性樹脂の面と凹凸のパターンが平行状態になる。 In this invention which concerns on Claim 9, a fitting condition is adjusted according to the contact condition of the surface of a photocurable resin, and an uneven | corrugated pattern by fitting the fitting part of a mold support member to the surrounding surface of a mounting base. Furthermore, the inclined surface portion of the mold moves with respect to the support frame within the range of the pressing force of the pressing member, and the surface of the photocurable resin and the uneven pattern become parallel.

本発明の転写装置による転写方法は、転写面に交差する面を基準にして光硬化性樹脂面と凹凸パターン面が平行状態になるように光硬化性樹脂面に凹凸パターンを転写することを特徴とする。 The transfer method by the transfer device of the present invention is characterized in that the concavo-convex pattern is transferred to the photocurable resin surface so that the photocurable resin surface and the concavo-convex pattern surface are in parallel with respect to the surface intersecting the transfer surface. And

これにより、転写面に交差する面を案内として光硬化性樹脂面と凹凸パターン面を相対的に移動させて光硬化性樹脂面と凹凸パターン面を平行状態にすることができる。 Accordingly, the photocurable resin surface and the concavo-convex pattern surface can be moved relative to each other using the surface intersecting the transfer surface as a guide so that the photocurable resin surface and the concavo-convex pattern surface are in a parallel state.

本発明の転写装置は、大掛かりな調整機構を備えることなく、モールド側の支持部材を基板支持台側に載せるだけで、モールドの凹凸面や光硬化性樹脂の状態に応じ現物の誤差が反映された状態で、モールドの凹凸面と光硬化性樹脂面とを平行状態に調整することができる。 Transfer equipment of the present invention, without providing a large-scale adjusting mechanism, by a support member of the mold side by placing the substrate support side, the error of the kind is reflected according to the state of the mold of the uneven surface and the photocurable resin In this state, the uneven surface of the mold and the photocurable resin surface can be adjusted to a parallel state.

以下図面に基づいて本発明の実施形態例を説明する。本実施形態例は、紫外線硬化樹脂をモールドとシリコンの基板で挟み、紫外線を照射することでナノスケールのパターンを転写するナノインプリント装置を転写装置として適用した例を示してある。そして、本実施形態例で形成した樹脂のパターンをマスクとして、高アスペクト比シリコンナノ構造体を作製する技術に適用される。 Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows an example in which a nanoimprint apparatus that transfers a nanoscale pattern by sandwiching an ultraviolet curable resin between a mold and a silicon substrate and irradiating ultraviolet rays is applied as a transfer apparatus. And it applies to the technique which produces the high aspect-ratio silicon nanostructure by using the resin pattern formed in this embodiment as a mask.

図１〜図８に基づいて第１実施形態例を説明する。 A first embodiment will be described with reference to FIGS.

図１には本発明の第１実施形態例に係る転写装置としてのナノインプリント装置の分解斜視、図２にはナノインプリント装置の外観、図３にはナノインプリント装置の断面、図４〜図６にはモールド支持部材の外観、図７にはモールドの外観、図８にはナノ構造体の作製工程を示してある。 FIG. 1 is an exploded perspective view of a nanoimprint apparatus as a transfer apparatus according to a first embodiment of the present invention, FIG. 2 is an external view of the nanoimprint apparatus, FIG. 3 is a cross-section of the nanoimprint apparatus, and FIGS. FIG. 7 shows the appearance of the support member, FIG. 7 shows the appearance of the mold, and FIG. 8 shows the fabrication process of the nanostructure.

図１〜図３に基づいてナノインプリント装置を説明する。 The nanoimprint apparatus will be described with reference to FIGS.

図に示すように、基台１には円柱状の載置台２が備えられ、載置台２のフランジ部２ａが基台１に固定されている。載置台２の上面（円柱の上端面）にはシリコン製の基板３が載置され、基板３には光硬化性樹脂（ＵＶ硬化性樹脂）が、例えば、スピンコートにより塗布されている。基台１と載置台２とにわたり吸着流路４が形成され、吸着流路４の先端は載置台２の上面（基板３の載置面）に開口している。吸着流路４には図示しない真空装置が接続され、真空装置により吸着流路４を所定の真空状態にすることで、載置台２の上面に基板３が吸着される。 As shown in the figure, the base 1 is provided with a columnar mounting table 2, and the flange portion 2 a of the mounting table 2 is fixed to the base 1. A silicon substrate 3 is placed on the upper surface of the mounting table 2 (the upper end surface of the cylinder), and a photocurable resin (UV curable resin) is applied to the substrate 3 by, for example, spin coating. An adsorption channel 4 is formed between the base 1 and the mounting table 2, and the tip of the adsorption channel 4 is open to the upper surface of the mounting table 2 (the mounting surface of the substrate 3). A vacuum device (not shown) is connected to the adsorption channel 4, and the substrate 3 is adsorbed on the upper surface of the mounting table 2 by bringing the adsorption channel 4 into a predetermined vacuum state by the vacuum device.

基台１の載置台２の周囲には３本の支柱６が立設され、支柱６にはモールド支持部材としてのトッププレート７が昇降自在に支持される。即ち、トッププレート７は中心がくり抜かれた円盤状のフランジ部８を備え、フランジ部８の内周縁に円筒部９が一体に設けられている。フランジ部８には支柱６に挿通される挿通穴１０が支柱６に対応して形成され、挿通穴１０にはガイドベアリング１９が設けられている。フランジ部８の挿通穴１０に支柱６を挿通させることにより、トッププレート７が支柱６に案内されて基台１に対して昇降する。 Three support columns 6 are erected around the mounting table 2 of the base 1, and a top plate 7 as a mold support member is supported by the support columns 6 so as to be movable up and down. That is, the top plate 7 is provided with a disc-shaped flange portion 8 with the center cut out, and a cylindrical portion 9 is integrally provided on the inner peripheral edge of the flange portion 8. In the flange portion 8, an insertion hole 10 to be inserted into the column 6 is formed corresponding to the column 6, and a guide bearing 19 is provided in the insertion hole 10. By inserting the support 6 into the insertion hole 10 of the flange portion 8, the top plate 7 is guided by the support 6 and moves up and down with respect to the base 1.

トッププレート７の円筒部９の筒面の内周面は円柱状の載置台２の周面に嵌合自在とされ、円筒部９の上端部近傍には支持部１１を介して透明なモールド１２が支持されている。モールド１２の下面、即ち、基板３に対向する面には凹凸パターンが形成されている。円筒部９の上端部には窓フランジ１３が固定され、窓フランジ１３にはモールド１２を支持部１１側に押圧する押え部材としての石英ガラス板１４が固定されている。 The inner peripheral surface of the cylindrical surface of the cylindrical portion 9 of the top plate 7 can be fitted to the peripheral surface of the columnar mounting table 2, and a transparent mold 12 is provided near the upper end of the cylindrical portion 9 via a support portion 11. Is supported. An uneven pattern is formed on the lower surface of the mold 12, that is, the surface facing the substrate 3. A window flange 13 is fixed to the upper end portion of the cylindrical portion 9, and a quartz glass plate 14 as a pressing member that presses the mold 12 toward the support portion 11 is fixed to the window flange 13.

円柱状の載置台２の周面には周溝１５が形成され、周溝１５には弾性部材としてのＯリング１６（シール材）が嵌合している。円筒部９の筒面の内周面は、Ｏリング１６を介して弾性変形の範囲で移動が許容されて円柱状の載置台２の周面に嵌合している。つまり、周溝１５及びＯリング１６により移動許容手段が構成され、転写面に直交する面（交差する面）を基準に基板３のＵＶ硬化性樹脂面とモールド１２の凹凸パターン面が平行状態になるようにされる。 A circumferential groove 15 is formed on the circumferential surface of the columnar mounting table 2, and an O-ring 16 (seal material) as an elastic member is fitted in the circumferential groove 15. The inner peripheral surface of the cylindrical surface of the cylindrical portion 9 is allowed to move within the range of elastic deformation via the O-ring 16 and is fitted to the peripheral surface of the columnar mounting table 2. That is, the peripheral groove 15 and the O-ring 16 constitute movement permitting means, and the UV curable resin surface of the substrate 3 and the concave / convex pattern surface of the mold 12 are in a parallel state with respect to the surface orthogonal to the transfer surface (intersecting surface). To be.

尚、シール材としてはＯリング１６に限定されず、弾性体製のリップシールリング等のシール材を適用することも可能である。また、載置台２の形状は円柱状に限定されず、断面を台形状にして上面に連続して上面に交差する角度の面を有する載置台とすることも可能である。この場合、トッププレート７の円筒部９の形状も台形状の載置台に嵌合する円錐状の筒部材が採用される。 The sealing material is not limited to the O-ring 16, and a sealing material such as a lip seal ring made of an elastic material can also be applied. Moreover, the shape of the mounting table 2 is not limited to a columnar shape, and the mounting table 2 may be a mounting table having a trapezoidal cross section and a surface having an angle that intersects the upper surface continuously with the upper surface. In this case, the cylindrical part 9 of the top plate 7 adopts a conical cylindrical member that fits into the trapezoidal mounting table.

また、基台１と載置台２とにわたり減圧流路１７が形成され、減圧流路１７の先端は載置台２の円柱面の周溝１５の上側に開口している。減圧流路１７には図示しない真空装置が接続され、真空装置により減圧流路１７を所定の真空状態にすることで、Ｏリング１６で密閉された基板３のＵＶ硬化性樹脂の面とモールド１２の凹凸パターンで囲まれる空間の雰囲気が所定の減圧状態にされる。つまり、基板３のＵＶ硬化性樹脂の面とモールド１２の凹凸パターンの間が減圧されることで、モールド１２に転写方向（ＵＶ硬化性樹脂が塗布された基板３側）への押付け力が働く。 A decompression channel 17 is formed between the base 1 and the mounting table 2, and the tip of the decompression channel 17 opens above the circumferential groove 15 on the cylindrical surface of the mounting table 2. A vacuum device (not shown) is connected to the decompression channel 17, and the vacuum channel is placed in a predetermined vacuum state by the vacuum device, so that the surface of the UV curable resin of the substrate 3 sealed with the O-ring 16 and the mold 12. The atmosphere in the space surrounded by the concavo-convex pattern is brought to a predetermined reduced pressure state. That is, the pressure between the surface of the UV curable resin of the substrate 3 and the concavo-convex pattern of the mold 12 is depressurized, so that the pressing force in the transfer direction (the substrate 3 side coated with the UV curable resin) acts on the mold 12. .

一方、トッププレート７のフランジ部８の外周縁には雄ねじ２１が形成され、フランジ部８の外方にはねじ部材としてのねじ筒２２が配置されている。ねじ筒２２の内周には雌ねじ２３が形成され、雌ねじ２３はフランジ部８の雄ねじ２１に螺合している。そして、ねじ筒２２の下面は帯状円形に配置されたニードル２４を介して基台１の上面に回転自在に保持されている。ねじ筒２２の回転によりフランジ部８、即ち、円筒部９が円柱状の載置台２に嵌合して昇降（移動）が規制される。円筒部９は、雄ねじ２１と雌ねじ２３のバックラッシによる昇降の範囲でＯリング１６の弾性変形により移動が許容される。 On the other hand, a male screw 21 is formed on the outer peripheral edge of the flange portion 8 of the top plate 7, and a screw cylinder 22 as a screw member is disposed outside the flange portion 8. A female screw 23 is formed on the inner periphery of the screw cylinder 22, and the female screw 23 is screwed into the male screw 21 of the flange portion 8. The lower surface of the screw cylinder 22 is rotatably held on the upper surface of the base 1 via a needle 24 arranged in a belt-like circle. The rotation of the screw cylinder 22 causes the flange portion 8, that is, the cylindrical portion 9 to be fitted to the columnar mounting table 2, and ascending / descending (moving) is restricted. The cylindrical portion 9 is allowed to move by elastic deformation of the O-ring 16 within a range in which the male screw 21 and the female screw 23 are lifted and lowered by backlash.

尚、ねじ筒２２には目盛２２ａが設けられ、ねじ筒２２の回転量を目盛２２ａで把握することにより円筒部９の昇降量を定量的に把握することができる。 The screw cylinder 22 is provided with a scale 22a, and by ascertaining the amount of rotation of the screw cylinder 22 with the scale 22a, the ascending / descending amount of the cylindrical portion 9 can be quantitatively grasped.

図３〜図７に基づいてモールド１２の支持構造を説明する。図４（ａ）にはモールドを組み付けた状態の断面視、図４（ｂ）にはモールドを組み付けた状態の底面視、図５（ａ）には支持リングの断面視、図５（ｂ）には支持リングの底面視、図６（ａ）には支持プレートの断面視、図６（ｂ）には支持プレートの底面視、図７（ａ）にはモールドの側面視、図７（ｂ）にはモールドの底面視を示してある。 A support structure for the mold 12 will be described with reference to FIGS. 4 (a) is a cross-sectional view with the mold assembled, FIG. 4 (b) is a bottom view with the mold assembled, FIG. 5 (a) is a cross-sectional view of the support ring, and FIG. 5 (b). Is a bottom view of the support ring, FIG. 6A is a cross-sectional view of the support plate, FIG. 6B is a bottom view of the support plate, FIG. 7A is a side view of the mold, and FIG. ) Shows a bottom view of the mold.

図３に示すように、モールド１２は支持部１１によりトッププレート７の円筒部９に保持されている。支持部１１が備えられる部位の円筒部９の内周には内周溝２６が形成され、内周溝２６には押えリング２７が嵌合している。支持部１１（リング材３１）は周縁部が押えリング２７の内周に押えられて円筒部９に保持される。円筒部９には押えリング２７を押付ける押付けねじ２８が、例えば、周方向に３個設けられ、押付けねじ２８を締め付けることにより押えリング２７に所望の締め付け力を周方向から均等に生じさせ、所定の状態で支持部１１を円筒部９に固定することができる。 As shown in FIG. 3, the mold 12 is held by the cylindrical portion 9 of the top plate 7 by the support portion 11. An inner peripheral groove 26 is formed on the inner periphery of the cylindrical portion 9 at a portion where the support portion 11 is provided, and a presser ring 27 is fitted in the inner peripheral groove 26. The support portion 11 (ring material 31) is held by the cylindrical portion 9 with the peripheral edge being pressed by the inner periphery of the presser ring 27. The cylindrical portion 9 is provided with, for example, three pressing screws 28 for pressing the pressing ring 27 in the circumferential direction. By tightening the pressing screw 28, a desired tightening force is uniformly generated in the pressing ring 27 from the circumferential direction. The support part 11 can be fixed to the cylindrical part 9 in a predetermined state.

尚、上述した実施形態例では、押えリング２７を３個の押付けねじ２８で周方向から均等に締め付けることにより支持部１１（リング材３１）を円筒部９に固定する構成としたが、押えリング２７に代えてすり割り状のリングを配置し、一つの押付けねじによりリングに締め付け力を生じさせたり、複数分割にしたリング片をそれぞれ押付けねじにより締め付けて締め付け力を生じさせる構成を適用することも可能である。また、押付けねじによらず、楔構造の固定手段や弾性力により固定力を得る手段等を用いて支持部１１（リング材３１）を円筒部９に固定することも可能である。 In the above-described embodiment, the support portion 11 (ring material 31) is fixed to the cylindrical portion 9 by uniformly tightening the presser ring 27 with the three pressing screws 28 from the circumferential direction. Applying a configuration in which a slit-shaped ring is arranged instead of 27 and a tightening force is generated on the ring by one pressing screw, or a plurality of divided ring pieces are tightened by pressing screws to generate a tightening force. Is also possible. Further, it is possible to fix the support portion 11 (ring material 31) to the cylindrical portion 9 by using a fixing means having a wedge structure, a means for obtaining a fixing force by an elastic force, or the like without using a pressing screw.

支持部１１は、図５に示した筒状のリング材３１の下面に図６に示したリング盤状の支持枠３２が固定されることにより構成される。リング材３１及び支持枠３２は、例えば、アルミ製で、支持枠３２にはモールド１２が載置される爪部３２ａが８個形成されている。図７に示すように、モールド１２は上面が円形をなし、下面側に支持枠３２の爪部３２ａに当接する傾斜面部１２ａが周方向に８箇所形成されている。即ち、モールド１２は、図７に示すように、上面が円形で底面が八角形となる傾斜面部１２ａを備えた形状とされ、傾斜面部１２ａが支持枠３２の爪部３２ａに載置される（図４参照）。モールド１２の底面には凹凸パターンが形成されている。 The support part 11 is configured by fixing a ring-shaped support frame 32 shown in FIG. 6 to the lower surface of the cylindrical ring material 31 shown in FIG. The ring material 31 and the support frame 32 are made of, for example, aluminum, and the support frame 32 is formed with eight claw portions 32a on which the mold 12 is placed. As shown in FIG. 7, the mold 12 has a circular upper surface, and eight inclined surface portions 12 a that contact the claw portions 32 a of the support frame 32 are formed on the lower surface side in the circumferential direction. That is, as shown in FIG. 7, the mold 12 has a shape including an inclined surface portion 12 a having a circular upper surface and an octagonal bottom surface, and the inclined surface portion 12 a is placed on the claw portion 32 a of the support frame 32 ( (See FIG. 4). An uneven pattern is formed on the bottom surface of the mold 12.

尚、支持部１１及びモールド１２の構造は図示例に限定されず、漸次径が小さくなる上面及び下面を備えた形状の部分円錐状のモールドを適用し、円錐面（傾斜面部）をリング材３１の内周上縁に載置する構造とすることも可能である。 In addition, the structure of the support part 11 and the mold 12 is not limited to the example of illustration, The partial cone-shaped mold of the shape provided with the upper surface and lower surface where a diameter becomes small gradually is applied, and a conical surface (inclined surface part) is made into the ring material 31. It is also possible to adopt a structure that is placed on the inner periphery upper edge.

図３に示すように、トッププレート７の円筒部９の上端にはリング状の窓フランジ１３が固定され、窓フランジ１３には円盤状の石英ガラス板１４が接着固定されている。窓フランジ１３が円筒部９の上端に固定されることにより、石英ガラス板１４がモールド１２の上面に面接触してモールド１２が支持部１１の支持枠３２に押圧される（押え部材）。 As shown in FIG. 3, a ring-shaped window flange 13 is fixed to the upper end of the cylindrical portion 9 of the top plate 7, and a disk-shaped quartz glass plate 14 is bonded and fixed to the window flange 13. By fixing the window flange 13 to the upper end of the cylindrical portion 9, the quartz glass plate 14 comes into surface contact with the upper surface of the mold 12 and the mold 12 is pressed against the support frame 32 of the support portion 11 (pressing member).

モールド１２を支持部１１に装着する手順の一例を説明する。 An example of a procedure for mounting the mold 12 to the support portion 11 will be described.

トッププレート７の円筒部９に支持部１１を固定する。即ち、支持枠３２が固定されたリング材３１を押えリング２７の内周側にセットし、押付けねじ２８により押えリング２７を締め付けて支持部１１を円筒部９に固定する。円筒部９の上端の窓フランジ１３を外してモールド１２を挿入し、傾斜面部１２ａを支持枠３２の爪部３２ａに載置する。窓フランジ１３を円筒部９の上端に固定することにより、石英ガラス板１４をモールド１２の上面に面接触させてモールド１２を支持枠３２に押圧する。この時、石英ガラス板１４とモールド１２の上面のクリアランスの範囲でモールド１２の傾斜面部１２ａが支持枠３２に対して摺動する。 The support portion 11 is fixed to the cylindrical portion 9 of the top plate 7. That is, the ring material 31 to which the support frame 32 is fixed is set on the inner peripheral side of the presser ring 27, and the presser ring 27 is tightened by the presser screw 28 to fix the support part 11 to the cylindrical part 9. The window flange 13 at the upper end of the cylindrical portion 9 is removed, the mold 12 is inserted, and the inclined surface portion 12 a is placed on the claw portion 32 a of the support frame 32. By fixing the window flange 13 to the upper end of the cylindrical portion 9, the quartz glass plate 14 is brought into surface contact with the upper surface of the mold 12 and the mold 12 is pressed against the support frame 32. At this time, the inclined surface portion 12 a of the mold 12 slides with respect to the support frame 32 within the range of the clearance between the quartz glass plate 14 and the upper surface of the mold 12.

基台１の載置台２の上に基準となる基板３をセットする。この時、基板３の上面にはＵＶ硬化性樹脂が所定の状態で塗布されたものと同一状態とされる（例えば、樹脂と同類のシート等が供えられている）。トッププレート７の円筒部９を載置台２に嵌合し、ねじ筒２２を回転させることによりトッププレート７を下降させてモールド１２の凹凸パターンを基板３に当接させる。この時、基板３の表面（例えば、所定のシート面）とモールド１２の凹凸パターンが平行を保つように石英ガラス板１４とモールド１２の上面のクリアランスの範囲でモールド１２の傾斜面部１２ａが支持枠３２に対して摺動し（移動し）、基板３に対してモールド１２の所定の姿勢が得られる。クリアランスの範囲で平行が保たれない場合、押付けねじ２８を緩めて押えリング２７によるリング材３１の拘束を解くことにより、リング材３１の姿勢が変化し、基板３に対してモールド１２の所定の姿勢が得られる。この状態で、再度、押付けねじ２８を締め付けて押えリング２７によりリング材３１を固定する。 A substrate 3 serving as a reference is set on the mounting table 2 of the base 1. At this time, the upper surface of the substrate 3 is in the same state as that in which the UV curable resin is applied in a predetermined state (for example, a sheet similar to the resin is provided). The cylindrical portion 9 of the top plate 7 is fitted to the mounting table 2, and the top plate 7 is lowered by rotating the screw cylinder 22 to bring the concave / convex pattern of the mold 12 into contact with the substrate 3. At this time, the inclined surface portion 12a of the mold 12 supports the support frame within the clearance of the quartz glass plate 14 and the upper surface of the mold 12 so that the surface of the substrate 3 (for example, a predetermined sheet surface) and the uneven pattern of the mold 12 are kept parallel. A predetermined posture of the mold 12 is obtained with respect to the substrate 3. If parallelism is not maintained within the clearance range, the posture of the ring material 31 is changed by loosening the pressing screw 28 and releasing the restraint of the ring material 31 by the presser ring 27, so that the predetermined shape of the mold 12 with respect to the substrate 3 is changed. Posture is obtained. In this state, the pressing screw 28 is tightened again and the ring material 31 is fixed by the pressing ring 27.

上述した支持構造とすることにより、石英ガラス板１４とモールド１２の上面のクリアランスの範囲でモールド１２の傾斜面部１２ａが支持枠３２に対して摺動し、基板３に対してモールド１２の所定の姿勢を得ることができる。また、クリアランスの範囲でモールド１２の所定の姿勢を得ることができない場合であっても、押えリング２７によるリング材３１の拘束を解くことによりリング材３１の姿勢を変化させることができ、リング材３１の姿勢を変化させることでモールド１２の所定の姿勢を確実に得ることができる。 With the above-described support structure, the inclined surface portion 12a of the mold 12 slides with respect to the support frame 32 within the range of the clearance between the quartz glass plate 14 and the upper surface of the mold 12, and the mold 12 has a predetermined shape with respect to the substrate 3. You can get a posture. Even when the predetermined posture of the mold 12 cannot be obtained within the clearance range, the posture of the ring material 31 can be changed by releasing the restraint of the ring material 31 by the presser ring 27, and the ring material The predetermined posture of the mold 12 can be reliably obtained by changing the posture of 31.

図３に示すように、石英ガラス板１４の上側にはライト３６が配置され、ライト３６は光ファイバ３７を介して光源３８から紫外光が送られる。ライト３６からの紫外光は石英ガラス板１４及びモールド１２を通して基板３のＵＶ硬化性樹脂に照射される。 As shown in FIG. 3, a light 36 is disposed on the upper side of the quartz glass plate 14, and ultraviolet light is sent from the light source 38 through the optical fiber 37 to the light 36. The ultraviolet light from the light 36 is applied to the UV curable resin of the substrate 3 through the quartz glass plate 14 and the mold 12.

上述したナノインプリント装置の作用を説明する。 The operation of the nanoimprint apparatus described above will be described.

例えば、スピンコートによりＵＶ硬化性樹脂が塗布された基板３を載置台２に載置し、吸着流路４を介して真空引きすることにより基板３を載置台２の上面に吸着する。Ｏリング１６を介して、載置台２の周面にトッププレート７の円筒部９を嵌合させた状態でねじ筒２２を回転させることにより、モールド１２が保持されたトッププレート７が下降してモールド１２の凹凸パターンが基板３のＵＶ硬化性樹脂面に当接する。当接の状態は石英ガラス板１４及び透明なモールド１２を通して目視確認することができる。 For example, the substrate 3 on which the UV curable resin is applied by spin coating is placed on the mounting table 2, and the substrate 3 is adsorbed on the upper surface of the mounting table 2 by being evacuated through the adsorption channel 4. By rotating the screw cylinder 22 with the cylindrical portion 9 of the top plate 7 fitted to the peripheral surface of the mounting table 2 via the O-ring 16, the top plate 7 holding the mold 12 is lowered. The concave / convex pattern of the mold 12 comes into contact with the UV curable resin surface of the substrate 3. The state of contact can be visually confirmed through the quartz glass plate 14 and the transparent mold 12.

モールド１２の凹凸パターン面と基板３のＵＶ硬化性樹脂面との当接状態に応じて、雄ねじ２１と雌ねじ２３のバックラッシによる昇降の範囲でＯリング１６の弾性変形により円筒部９が移動して誤差が吸収され、基板３のＵＶ硬化性樹脂面とモールド１２の凹凸パターン面が平行状態になるように調整される。 The cylindrical portion 9 is moved by the elastic deformation of the O-ring 16 within the range where the male screw 21 and the female screw 23 are raised and lowered by backlash according to the contact state between the concave / convex pattern surface of the mold 12 and the UV curable resin surface of the substrate 3. The error is absorbed, and the UV curable resin surface of the substrate 3 and the concavo-convex pattern surface of the mold 12 are adjusted to be in a parallel state.

このため、転写面に直交する面（交差する面）を基準に基板３のＵＶ硬化性樹脂面とモールド１２の凹凸パターン面が平行状態になるようにされ、特別な機械的な調整機構を用いることなく、モールド１２の凹凸パターン面やＵＶ硬化性樹脂面の状態に応じ現物の誤差が反映された状態で、モールド１２の凹凸パターン面とＵＶ硬化性樹脂面とが平行状態に調整される。 For this reason, the UV curable resin surface of the substrate 3 and the concavo-convex pattern surface of the mold 12 are made parallel with respect to the surface orthogonal to the transfer surface (the intersecting surface), and a special mechanical adjustment mechanism is used. Instead, the concave / convex pattern surface of the mold 12 and the UV curable resin surface are adjusted to be in a parallel state in a state in which the error of the actual product is reflected according to the state of the concave / convex pattern surface of the mold 12 and the UV curable resin surface.

この状態で、もしくは、必要に応じてねじ筒２２を回転させてねじ筒２２の回転量を目盛２２ａで把握しながら所望の位置までトッププレート７を下降させ、図示しない真空装置により減圧流路１７を所定の真空状態にする。これにより、モールド１２が所定の圧力で加圧されると同時に、Ｏリング１６で密閉された基板３のＵＶ硬化性樹脂の面とモールド１２の凹凸パターンで囲まれる空間の雰囲気が所定の減圧状態にされ、モールド１２に転写方向（ＵＶ硬化性樹脂が塗布された基板３側）への押付け力が働く。 In this state, or if necessary, the screw cylinder 22 is rotated and the top plate 7 is lowered to a desired position while grasping the rotation amount of the screw cylinder 22 with the scale 22a. To a predetermined vacuum state. As a result, the mold 12 is pressurized with a predetermined pressure, and at the same time, the atmosphere of the space surrounded by the UV curable resin surface of the substrate 3 sealed with the O-ring 16 and the uneven pattern of the mold 12 is in a predetermined reduced pressure state. Thus, a pressing force in the transfer direction (on the side of the substrate 3 coated with the UV curable resin) acts on the mold 12.

減圧によりモールド１２の凹凸パターンとＵＶ硬化性樹脂とが接触する際の気泡の混入が防止され、モールド１２の凹凸パターン面とＵＶ硬化性樹脂面が平行に接触して密着し、ＵＶ硬化性樹脂がモールド１２の凹凸パターン面の凹部に充填された状態になりモールド１２の凹凸パターンがＵＶ硬化性樹脂に転写される。凹凸パターンが転写された状態で、光ファイバ３７及びライト３６を介して光源３８からの紫外光を基板３の表面に照射することで、凹凸パターンが転写されたＵＶ硬化性樹脂が硬化して基板３上に所望の凹凸パターンが形成された状態になる。 When the concave / convex pattern of the mold 12 and the UV curable resin are brought into contact with each other due to the reduced pressure, mixing of bubbles is prevented, and the concave / convex pattern surface of the mold 12 and the UV curable resin surface are in contact with each other in parallel to be in close contact with each other. Is filled in the concave portion of the concave-convex pattern surface of the mold 12, and the concave-convex pattern of the mold 12 is transferred to the UV curable resin. In a state where the concavo-convex pattern is transferred, the surface of the substrate 3 is irradiated with ultraviolet light from the light source 38 via the optical fiber 37 and the light 36, whereby the UV curable resin to which the concavo-convex pattern has been transferred is cured. A desired uneven pattern is formed on the surface 3.

上述したナノインプリント装置を用いることにより、大掛かりな調整機構を備えることなく、トッププレート７の円筒部９を円柱状の載置台２に嵌合させることで、モールド１２の凹凸パターン面やＵＶ硬化性樹脂面の状態に応じ現物の誤差が反映された状態で、即ち、微調整された状態で、モールド１２の凹凸パターン面とＵＶ硬化性樹脂面とが平行状態に調整される。このため、装置を大掛かりにすることなく基板３上に所望の凹凸パターンを精度良く形成することが可能になる。また、転写方向の押付け力を真空引きにより得ているので、転写時の気泡の混入やコンタミの発生を防止することができる。 By using the nanoimprint apparatus described above, the concave and convex pattern surface of the mold 12 and the UV curable resin can be obtained by fitting the cylindrical portion 9 of the top plate 7 to the columnar mounting table 2 without providing a large adjustment mechanism. The uneven pattern surface of the mold 12 and the UV curable resin surface are adjusted to be in a parallel state in a state in which an error of the actual product is reflected according to the state of the surface, that is, in a finely adjusted state. For this reason, it becomes possible to form a desired uneven | corrugated pattern on the board | substrate 3 with sufficient precision, without enlarging an apparatus. Further, since the pressing force in the transfer direction is obtained by evacuation, it is possible to prevent air bubbles from being mixed and contamination from occurring during transfer.

図８を参照してナノ構造体の作製状況を説明する。 With reference to FIGS. 8A and 8B, the fabrication status of the nanostructure will be described.

図８（ａ）に示すように、モールド１２の凹凸パターンが基板３のＵＶ硬化性樹脂４１に押付けられ、凹凸パターンが転写される。紫外光が照射されてＵＶ硬化性樹脂４１が硬化し、モールド１２を基板３から引き離すことで、図８（ｂ）に示すように、基板３上に凹凸パターン４１ａが形成される。この時、モールド１２の凸部で押された部分に残膜４１ｂが残るため、残膜４１ｂをドライエッチング（Ｏ_２エッチング）により除去する。 As shown in FIG. 8A, the uneven pattern of the mold 12 is pressed against the UV curable resin 41 of the substrate 3 to transfer the uneven pattern. By irradiating with ultraviolet light, the UV curable resin 41 is cured, and the mold 12 is pulled away from the substrate 3, thereby forming an uneven pattern 41 a on the substrate 3 as shown in FIG. At this time, since the remaining film 41b remains in the portion pressed by the convex portion of the mold 12, the remaining film 41b is removed by dry etching (O ₂ etching).

図８（ｃ）に示すように、残膜４１ｂが除去されることにより、基板３の表面に樹脂のマスク４１ｃが形成された状態になり、所望のエッチングガスによるドライエッチングによりマスク４１ｃ以外の部分の基板３をエッチングし、例えば、高アスペクト比のホール４４（貫通孔）を形成してシリコン構造体を得る。最後に、Ｏ_２エッチングによりマスク４１ｃを除去する。 As shown in FIG. 8C, by removing the remaining film 41b, a resin mask 41c is formed on the surface of the substrate 3, and parts other than the mask 41c are formed by dry etching with a desired etching gas. The substrate 3 is etched to form, for example, a high aspect ratio hole 44 (through hole) to obtain a silicon structure. Finally, the mask 41c is removed by O ₂ etching.

これにより、ナノインプリント装置を用いてナノオーダーの凹凸パターン（ホールパターン）を作製し、高アスペクト比のシリコンナノ構造体を得ることができる。本実施形態例のナノインプリント装置を用いることにより、気泡の混入がなく高い平行度で密着性良く転写を行うことができるため、精度の高い凹凸パターンを転写することが可能になる。この結果、残膜４１ｂを薄くしてＯ_２エッチングにより除去した後も樹脂の凹凸パターンを維持することができ、短時間で高アスペクト比のシリコンナノ構造体を得ることができる。 Thereby, a nano-order concavo-convex pattern (hole pattern) can be produced using a nanoimprint apparatus, and a silicon nanostructure having a high aspect ratio can be obtained. By using the nanoimprint apparatus of the present embodiment example, it is possible to perform transfer with high parallelism and good adhesion without mixing bubbles, and thus it is possible to transfer a highly accurate uneven pattern. As a result, the uneven pattern of the resin can be maintained even after the remaining film 41b is thinned and removed by O ₂ etching, and a silicon nanostructure having a high aspect ratio can be obtained in a short time.

図９に基づいて第２実施形態例を説明する。 A second embodiment will be described with reference to FIG.

図９には本発明の第２実施形態例に係る転写装置としてのナノインプリント装置の断面を示してある。尚、図３に示した部材と同一部材には同一符号を付して重複する説明は省略してある。 FIG. 9 shows a cross section of a nanoimprint apparatus as a transfer apparatus according to a second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same member as the member shown in FIG. 3, and the overlapping description is abbreviate | omitted.

第２実施形態例のナノインプリント装置は、図３に示した第１実施形態例の装置に対して、トッププレート７に錘が載置できる構造となっている。その他の構成は第１実施形態例と同一である。 The nanoimprint apparatus according to the second embodiment has a structure in which a weight can be placed on the top plate 7 as compared with the apparatus according to the first embodiment shown in FIG. Other configurations are the same as those of the first embodiment.

即ち、基台１には支柱４５が立設され、支柱４５にはトッププレート７が昇降自在に支持される。支柱４５はトッププレート７の挿通穴１０の上部に十分に突出する部位を有する長さとされ、トッププレート７の上部に突出した部位の支柱４５には錘４６の挿通穴４７が挿通されている。錘４６は中心がくり抜かれた円盤状とされ、石英ガラス板１４の上面に載置されるようになっている。錘４６の上面には光透過穴４８を有する円盤状の錘４９が載せられ、更に、錘４９の上面には光透過穴５０を有する円盤状の錘５１が載せられている。 That is, the support column 45 is erected on the base 1, and the top plate 7 is supported by the support column 45 so as to be movable up and down. The support column 45 has a length that has a portion sufficiently protruding above the insertion hole 10 of the top plate 7, and the insertion hole 47 of the weight 46 is inserted into the support column 45 protruding at the upper portion of the top plate 7. The weight 46 has a disk shape with a hollowed center, and is placed on the upper surface of the quartz glass plate 14. A disk-shaped weight 49 having a light transmission hole 48 is placed on the upper surface of the weight 46, and a disk-shaped weight 51 having a light transmission hole 50 is placed on the upper surface of the weight 49.

第２実施形態例のナノインプリント装置では、第１実施形態例のナノインプリント装置と同様にトッププレート７の円筒部９を円柱状の載置台２に嵌合させてねじ筒２２の回転によりトッププレート７を下降させることで、モールド１２の凹凸パターン面やＵＶ硬化性樹脂面の状態に応じ現物の誤差が反映された状態で、モールド１２の凹凸パターン面とＵＶ硬化性樹脂面とが平行状態に調整される。そして、真空引き及び錘４６、４９、５１によりトッププレート７を加圧して転写時の押し圧力を得ている。このため、装置を大掛かりにすることなく基板３上に所望の凹凸パターンを確実に、しかも、精度良く形成することが可能になる。 In the nanoimprint apparatus according to the second embodiment, similarly to the nanoimprint apparatus according to the first embodiment, the cylindrical portion 9 of the top plate 7 is fitted to the columnar mounting table 2 and the top plate 7 is rotated by rotating the screw cylinder 22. By lowering, the concave / convex pattern surface of the mold 12 and the UV curable resin surface are adjusted to be in a parallel state in a state in which an error of the actual product is reflected according to the state of the concave / convex pattern surface of the mold 12 and the UV curable resin surface. The Then, the top plate 7 is pressurized by evacuation and weights 46, 49, 51 to obtain a pressing force during transfer. For this reason, it is possible to reliably and accurately form a desired concavo-convex pattern on the substrate 3 without enlarging the apparatus.

尚、所望の加圧力を得るために少なくとも一つの錘４６を用いることができる。また、錘４６、４９、５１により十分な加圧力を得ることができる場合、真空引きによる押付け力を得る構成（減圧流路）を省略することも可能である。 Note that at least one weight 46 can be used to obtain a desired pressure. Moreover, when sufficient pressurizing force can be obtained by the weights 46, 49, 51, it is possible to omit the configuration (decompression flow path) for obtaining the pressing force by evacuation.

図１０に基づいて第３実施形態例を説明する。 A third embodiment will be described based on FIG.

図１０には本発明の第３実施形態例に係る転写装置としてのナノインプリント装置の断面を示してある。尚、図３、図９に示した部材と同一部材には同一符号を付して重複する説明は省略してある。 FIG. 10 shows a cross section of a nanoimprint apparatus as a transfer apparatus according to a third embodiment of the present invention. The same members as those shown in FIGS. 3 and 9 are denoted by the same reference numerals, and redundant description is omitted.

第３実施形態例のナノインプリント装置は、図９に示した第２実施形態例の装置に対して、ねじ筒２２が設けられておらず、トッププレート７を手動及び錘４６、４９、５１を用いて載置台２に嵌合させる構成となっている。その他の構成は第２実施形態例と同一である。尚、図１０には図９に示した支柱４５は省略してある。 The nanoimprint apparatus according to the third embodiment is different from the apparatus according to the second embodiment shown in FIG. 9 in that the screw cylinder 22 is not provided, and the top plate 7 is manually used and weights 46, 49, 51 are used. Thus, the mounting table 2 is fitted. Other configurations are the same as those of the second embodiment. In FIG. 10, the support 45 shown in FIG. 9 is omitted.

即ち、基台１には図示しない支柱（図９の支柱４５参照）が立設され、支柱にはトッププレート７が昇降自在に支持される。トッププレート７のフランジ部８の外周縁には、第１実施形態例、第２実施形態例の雄ねじ２１は形成されていない。 That is, a support (not shown) (see support 45 in FIG. 9) is erected on the base 1, and the top plate 7 is supported by the support so as to be movable up and down. The external thread 21 of the first embodiment and the second embodiment is not formed on the outer peripheral edge of the flange portion 8 of the top plate 7.

第３実施形態例のナノインプリント装置では、第１実施形態例、第２実施形態例のナノインプリント装置と同様にトッププレート７の円筒部９を円柱状の載置台２に嵌合させて所定の高さまで手動によりトッププレート７を下降させることで、モールド１２の凹凸パターン面やＵＶ硬化性樹脂面の状態に応じ現物の誤差が反映された状態で、モールド１２の凹凸パターン面とＵＶ硬化性樹脂面とが平行状態に調整される。そして、真空引き及び錘４６、４９、５１によりトッププレート７を加圧して転写時の押し圧力を得ている。このため、装置を大掛かりにすることなく基板３上に所望の凹凸パターンを確実に、しかも、精度良く形成することが可能になる。 In the nanoimprint apparatus of the third embodiment, the cylindrical portion 9 of the top plate 7 is fitted to the columnar mounting table 2 to a predetermined height in the same manner as the nanoimprint apparatus of the first embodiment and the second embodiment. By manually lowering the top plate 7, the concavo-convex pattern surface of the mold 12 and the UV curable resin surface are reflected in a state in which an error of the actual product is reflected according to the state of the concavo-convex pattern surface of the mold 12 or the UV curable resin surface. Are adjusted to be parallel. Then, the top plate 7 is pressurized by evacuation and weights 46, 49, 51 to obtain a pressing force during transfer. For this reason, it is possible to reliably and accurately form a desired concavo-convex pattern on the substrate 3 without enlarging the apparatus.

尚、所望の加圧力を得るために少なくとも一つの錘４６を用いることができる。また、錘４６、４９、５１により十分な加圧力を得ることができる場合、真空引きによる押付け力を得る構成（減圧流路）を省略することも可能である。また、錘４６、４９、５１を設けずに真空引きによる押付け力だけで転写を行うことも可能である。 Note that at least one weight 46 can be used to obtain a desired pressure. Moreover, when sufficient pressurizing force can be obtained by the weights 46, 49, 51, it is possible to omit the configuration (decompression flow path) for obtaining the pressing force by evacuation. Further, it is possible to perform transfer only by pressing force by vacuuming without providing the weights 46, 49, 51.

上述した実施形態例では、モールドとして石英を例に挙げて説明したが、紫外線に対して透明なプラスチックやサファイアを使用することが可能である。また、基板としてシリコン製の基板を例に挙げて説明したが、ＧａＡｓ基板、ＩｎＡｓ基板、ＧａＮ基板、金属基板、ガラス基板、石英基板、サファイア基板、プラスチック基板等を使用することが可能である。また、用途の適用例としてナノ構造体を例に挙げて説明したが、半導体加工、光学部材、パタードメディア、ＭＥＭＳ、マイクロ流路等の用途として適用することが可能である。 In the embodiment described above, quartz is described as an example of the mold, but plastic or sapphire transparent to ultraviolet rays can be used. Further, although a silicon substrate has been described as an example of the substrate, a GaAs substrate, an InAs substrate, a GaN substrate, a metal substrate, a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, or the like can be used. In addition, although nanostructures have been described as examples of application, the present invention can be applied to applications such as semiconductor processing, optical members, patterned media, MEMS, and microchannels.

本発明は、所望の凹凸パターンが形成された雄型（モールド）を光硬化性樹脂に押付けることによって基板上の樹脂面に凹凸パターンを転写する転写装置の産業分野で利用することができる。 The present invention can be utilized in the industrial field of the transfer equipment for transferring the concavo-convex pattern on the resin surface of the substrate by pressing the desired concavo-convex pattern formed male (the mold) to the photocurable resin .

本発明の第１実施形態例に係るナノインプリント装置の分解斜視図である。1 is an exploded perspective view of a nanoimprint apparatus according to a first embodiment of the present invention. ナノインプリント装置の外観図である。It is an external view of a nanoimprint apparatus. ナノインプリント装置の断面図である。It is sectional drawing of a nanoimprint apparatus. モールド支持部材の外観図である。It is an external view of a mold support member. モールド支持部材の外観図である。It is an external view of a mold support member. モールド支持部材の外観図である。It is an external view of a mold support member. モールドの外観図である。It is an external view of a mold. ナノ構造体の作製工程を説明する図である。It is a figure explaining the preparation process of a nanostructure. 本発明の第２実施形態例に係るナノインプリント装置の断面図である。It is sectional drawing of the nanoimprint apparatus which concerns on the 2nd Example of this invention. 本発明の第３実施形態例に係るナノインプリント装置の断面図である。It is sectional drawing of the nanoimprint apparatus which concerns on the example of 3rd Embodiment of this invention.

Explanation of symbols

１基台
２載置台
３基板
４吸着流路
６、４５支柱
７トッププレート
８フランジ部
９円筒部
１０、４７挿通穴
１１支持部
１２モールド
１３窓フランジ
１４石英ガラス板
１５周溝
１６Ｏリング
１７減圧流路
１９ニードル
２１雄ねじ
２２ねじ筒
２３雌ねじ
２６内周溝
２７押えリング
２８押付けねじ
３１リング材
３２支持枠
３６ライト
３７光ファイバ
３８光源
４１ＵＶ硬化性樹脂
４６、４９、５１錘
４８、５０光透過穴
DESCRIPTION OF SYMBOLS 1 Base 2 Mounting base 3 Substrate 4 Adsorption flow path 6, 45 Column 7 Top plate 8 Flange part 9 Cylindrical part 10, 47 Insertion hole 11 Support part 12 Mold 13 Window flange 14 Quartz glass plate 15 Circumferential groove 16 O-ring 17 Decompression Flow path 19 Needle 21 Male screw 22 Screw cylinder 23 Female screw 26 Inner peripheral groove 27 Press ring 28 Press screw 31 Ring material 32 Support frame 36 Light 37 Optical fiber 38 Light source 41 UV curable resin 46, 49, 51 Weight 48, 50 Light transmission hole

Claims

A mounting table having a mounting surface on which a substrate coated with a photocurable resin is held on the upper surface and having a peripheral surface that intersects the upper surface continuously with the upper surface;
A mold support member having a support portion for supporting a mold on which an uneven pattern is formed and having a fitting portion that fits on the peripheral surface of the mounting table in a state where the uneven pattern faces the surface of the photocurable resin of the substrate With
By fitting the fitting part of the mold support member to the peripheral surface of the mounting table, the coated surface of the photocurable resin on the substrate and the uneven pattern are parallel according to the contact state between the surface of the photocurable resin and the uneven pattern. A transfer device, wherein the fitting portion of the mold support member is fitted to the peripheral surface of the mounting table so as to be in a state.

The transfer device according to claim 1,
The mounting table has a columnar shape and the mold support member has a cylindrical shape. The columnar columnar surface is a circumferential surface and the cylindrical cylindrical portion is a fitting portion.
The mold supporting member has a mold supported on the inner side of a cylindrical end surface, and an inner peripheral surface of the cylindrical cylindrical surface is fitted to a columnar mounting table.

In the transfer device according to claim 1 or 2,
A transfer apparatus characterized in that a movement allowing means is interposed on a fitting surface between a peripheral surface of a mounting table and a fitting portion of a mold support member.

In the transfer device according to any one of claims 1 to 3,
Provided with a screw member that moves the mold support member to the mounting table side,
The mold support member is restricted in movement by the rotation of the screw member and fits on the mounting table side. It is photocurable within the range of movement due to backlash of the screw member according to the contact state of the photocurable resin surface and the uneven pattern. A transfer apparatus characterized in that the resin surface and the uneven pattern are in a parallel state.

In the transfer device according to any one of claims 1 to 3,
A transfer apparatus comprising a weight for moving the mold support member toward the mounting table.

In the transfer device according to any one of claims 1 to 5,
The transfer apparatus, wherein the movement permitting means is an elastic member attached to the peripheral surface.

The transfer device according to claim 6,
The elastic member is a sealing material having a sealing function,
A transfer device comprising pressure reducing means for obtaining a pressing force in the transfer direction by bringing the atmosphere surrounded by the surface of the photo-curable resin and the pattern of projections and depressions of the mold into a predetermined reduced pressure state.

In the transfer device according to any one of claims 1 to 7,
The mold is made of a transparent member, and includes a light irradiation means for irradiating light to the photocurable resin through the mold after transferring the uneven pattern.

In the transfer device according to any one of claims 1 to 8,
The support portion of the mold support member includes a ring-shaped support frame on which the mold is placed on the inner peripheral edge and a pressing member that presses the mold to the support frame side.
The transfer device, wherein the mounting portion of the mold on the support frame is an inclined surface portion that is placed on the inner periphery of the support frame.