JP4822532B2 - Dicing die bond film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dicing die bond film capable of preventing contamination of a dicing ring and of suppressing chip fly by dicing. <P>SOLUTION: The dicing die bond film has a pressure sensitive adhesive layer (2) on a support base material (1) and a die bonding adhesive layer (3) on the pressure sensitive adhesive layer (2), wherein the die bonding adhesive layer (3) is provided on a portion of the pressure sensitive adhesive layer (2) as a workpiece pasting portion (3a) while the workpiece pasting portion (3a) is designed so that the entire surface of the workpiece to be pasted can be pasted thereto, the area thereof is larger than the area of the workpiece surface, and the workpiece pasting portion (3a) is within the inner diameter of the dicing ring to be pasted onto the pressure sensitive adhesive layer (2). <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a dicing die bond film. A dicing die-bonding film is used for dicing a work in a state where an adhesive for fixing a chip-like work (such as a semiconductor chip) and an electrode member is attached to the work (such as a semiconductor wafer) before dicing. It is done. Moreover, this invention relates to the fixing method of the chip-shaped workpiece | work using the said dicing die-bonding film. Furthermore, the present invention relates to a semiconductor device in which a chip-like workpiece is bonded and fixed by the fixing method.

The semiconductor wafer on which the circuit pattern is formed is diced into a chip-shaped workpiece after adjusting the thickness by backside polishing as necessary (dicing step). In the dicing process, the semiconductor wafer is generally washed with an appropriate liquid pressure (usually about 2 kg / cm ² ) in order to remove the cut layer. Next, the chip-shaped workpiece is fixed to an adherend such as a lead frame with an adhesive (mounting process), and then transferred to a bonding process. In the mounting process, an adhesive was applied to the lead frame and the chip-like work. However, with this method, it is difficult to make the adhesive layer uniform, and a special device and a long time are required for applying the adhesive. For this reason, a dicing die-bonding film has been proposed in which a semiconductor wafer is bonded and held in a dicing process, and an adhesive layer for chip fixation necessary for a mounting process is also provided (see, for example, Patent Document 1).

  The dicing die-bonding film described in Patent Document 1 has an adhesive layer that can be peeled off on a support substrate. That is, after the semiconductor wafer is diced while being held by the adhesive layer, the support base is stretched to separate the chip-like work together with the adhesive layer, and this is individually collected and the lead frame is passed through the adhesive layer. It is made to adhere to the adherend such as.

  The adhesive layer of this type of dicing die-bonding film has a good holding power for the semiconductor wafer and a chip-like workpiece after dicing as a support base integrated with the adhesive layer so that dicing is not impossible and dimensional errors do not occur. Good peelability that can be peeled from the material is desired. However, it has never been easy to balance these two characteristics. In particular, when a large holding force is required for the adhesive layer, such as a method of dicing a semiconductor wafer with a rotating round blade, it is difficult to obtain a dicing die-bonding film that satisfies the above characteristics. .

  In order to overcome such problems, various improved methods have been proposed (for example, see Patent Document 2). In Patent Document 2, an ultraviolet curable pressure-sensitive adhesive layer is interposed between a support substrate and an adhesive layer, and this is ultraviolet-cured after dicing, so that an adhesive force between the pressure-sensitive adhesive layer and the adhesive layer is obtained. Has been proposed, and a method of facilitating picking up of a chip-like workpiece by peeling between the two has been proposed.

  The adhesive layer for die bonding of this type of dicing die bond film is often formed on the entire surface of the pressure-sensitive adhesive layer (pressure-sensitive adhesive film) due to restrictions on the manufacturing process. However, in such a case, the dicing ring may be contaminated because the dicing ring is bonded to the die bonding adhesive layer. On the other hand, a method is also known in which a die-bonding adhesive layer is formed on the pressure-sensitive adhesive layer so as to have the same shape as that of the work in accordance with the shape of the work. However, in such a case, chip skipping may occur during dicing.

JP-A-60-57642 JP-A-2-24864

  The present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer on a supporting substrate, and having a die-bonding adhesive layer provided on the pressure-sensitive adhesive layer so as to be peelable, and contamination of the dicing ring An object of the present invention is to provide a dicing die-bonding film that can prevent chipping and can suppress chip jump due to dicing.

  Moreover, an object of this invention is to provide the fixing method of the chip-shaped workpiece | work using the said dicing die-bonding film. It is another object of the present invention to provide a semiconductor device in which a chip-like workpiece is bonded and fixed by the fixing method.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have found the dicing die-bonding film shown below and have completed the present invention.

That is, the present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a pressure-sensitive adhesive layer (3) on the pressure-sensitive adhesive layer (2). And
The die bonding adhesive layer (3) is provided as a work pasting portion (3a) on a part of the pressure-sensitive adhesive layer (2).
The workpiece pasting portion (3a) can be pasted on the entire workpiece surface to be pasted, and is larger than the area of the workpiece surface,
Furthermore, the workpiece pasting part (3a) is designed to fit within the inner diameter of a dicing ring to be pasted on the adhesive layer (2) ,
The pressure-sensitive adhesive layer (2) has a different adhesive force between the part (2a) corresponding to the work pasting part (3a) and the other part (2b),
It is related with the dicing die-bonding film characterized by the adhesive force of an adhesive layer (2b) satisfying the range of 42.2-60 times with respect to the adhesive force of an adhesive layer (2a) .

  In the present invention, the die bonding adhesive layer (3) is designed to fit within the inner diameter of the dicing ring as a work pasting portion (3a) on a part of the pressure-sensitive adhesive layer (2). Therefore, the dicing ring can be provided on the pressure-sensitive adhesive layer (2) around the workpiece attaching portion (3a), and contamination by the die-bonding adhesive layer (3) can be prevented. The dicing ring can be easily collected without being contaminated by the pressure-sensitive adhesive layer, and the reworkability by repeated use is improved.

  On the other hand, the workpiece pasting portion (3a) is designed so that the entire workpiece surface to be pasted can be pasted and is larger than the area of the workpiece surface. The work pasting portion (3a) was designed in this way because when the size of the work pasting portion (3a) is the same as or smaller than the work surface, the die bonding adhesive layer (3) is an adhesive layer. This is because it has been found that chip skipping occurs during dicing due to the very easy releasability from (2). That is, by making the size of the workpiece pasting portion (3a) larger than the workpiece surface to be pasted as in the present invention, chip jumping can be suppressed during dicing. The work pasting portion (3a) is designed to fit within the inner diameter of the dicing ring so as not to contact the dicing ring.

In the dicing die-bonding film, the pressure-sensitive adhesive layer (2) is different in adhesive force between the part (2a) corresponding to the work pasting part (3a) and the other part (2b),
The adhesive strength of the adhesive strength of the pressure-sensitive adhesive layer (2a) <adhesive layer (2b), which satisfies the.

  The pressure-sensitive adhesive layer (2) has a pressure-sensitive adhesive force of the pressure-sensitive adhesive layer (2a) <the pressure-sensitive adhesive layer (2a) and the other portion (2b) corresponding to the work pasting portion (3a) The adhesive layer (2a) can be designed so that it can be easily peeled off by designing the adhesive strength to be 2b). On the other hand, a wafer ring can be adhered to the pressure-sensitive adhesive layer (2b), and can be fixed so that they do not peel off during dicing or expanding. Therefore, even for a large chip exceeding 10 mm × 10 mm, a dicing die-bonding film can be obtained that can easily peel and pick up the obtained chip-shaped workpiece after dicing without causing dicing failure. . In this way, the dicing die-bonding film can well balance the holding force during dicing and the releasability during pick-up.

  The pressure-sensitive adhesive layer (2) of the dicing die-bonding film is formed of a radiation-curing pressure-sensitive adhesive, and the pressure-sensitive adhesive layer (2a) corresponding to the workpiece attaching portion (3a) is formed by irradiating with radiation. it can.

  The die bonding adhesive layer (3) is preferably formed of a thermosetting die adhesive. The die bonding adhesive layer (3) is preferably non-conductive.

The present invention also uses a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a support substrate (1) and a pressure-sensitive adhesive layer (3) on the pressure-sensitive adhesive layer (2). A chip-shaped workpiece fixing method,
The die bonding adhesive layer (3) is provided as a work pasting portion (3a) on a part of the pressure-sensitive adhesive layer (2).
The workpiece pasting portion (3a) can be pasted on the entire workpiece surface to be pasted, and is larger than the area of the workpiece surface,
Furthermore, the workpiece pasting part (3a) is designed to fit within the inner diameter of a dicing ring to be pasted on the adhesive layer (2),
The pressure-sensitive adhesive layer (2) has a different adhesive force between the part (2a) corresponding to the work pasting part (3a) and the other part (2b),
A dicing die bond film is prepared in which the adhesive strength of the adhesive layer (2b) satisfies the range of 42.2 to 60 times the adhesive strength of the adhesive layer (2a),
On the work attachment portion of the dicing die-bonding film (3a), a step of crimping a workpiece,
A step of pressure bonding a dicing ring to the other portion (2b) in the pressure-sensitive adhesive layer (2);
Dicing the workpiece into chips,
Peeling the chip-shaped workpiece from the pressure-sensitive adhesive layer (2) together with the die-bonding adhesive layer (3a);
Die bonding adhesive layer through the (3a), possess a step of adhering and fixing the chip-shaped workpiece in a semiconductor element,
The present invention relates to a method for fixing a chip-shaped workpiece, which is performed without irradiating the pressure-sensitive adhesive layer (2) from the pressure bonding step to the chip-shaped workpiece peeling step .

  The die bonding adhesive layer (3) is preferably formed of a thermosetting die adhesive. The die bonding adhesive layer (3) is preferably non-conductive.

  Hereinafter, the dicing die-bonding film of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 show an example of a cross-sectional view of the dicing die-bonding film of the present invention, both of which have an adhesive layer (2) on a support substrate (1), and the adhesive A workpiece (W) pasting portion (3a) is provided as a die bonding adhesive layer (3) on a part of the layer (2).

  The surface (A) of the workpiece pasting portion (3a) is designed so that the entire workpiece surface (B) to be pasted can be pasted and is larger than the area of the workpiece surface. The workpiece pasting portion (3a) is usually designed to have a similar shape to the workpiece surface and to have a large area. Further, the work pasting portion (3a) is designed to fit within a frame formed by the inner diameter of the dicing ring (WR). A dicing ring (WR) having a predetermined size is used depending on the size of the work (W).

  For example, when the surface of the workpiece (W) is a circle having a diameter (m1), the workpiece attaching portion (3a) is also a circle, and the diameter (m2) is designed to satisfy m2> m1. . The width difference (m2−m1) is appropriately determined depending on the size of the work surface (B). When the work surface diameter is 1 to 12 inches (about 300 mm), the width difference is usually 0.1 mm. In addition, it is preferable to design so as to be 0.5 mm or more. However, it is designed so that m3> m2 in relation to the inner diameter (m3) of the dicing ring (WR). The difference (m3−m2) is not particularly limited, but is preferably 5 mm or more, and more preferably 10 mm or more.

  When the workpiece (W) is pasted to the workpiece pasting portion (3a), the outer peripheral width difference (s) between the entire outer circumference of the workpiece pasting portion (3a) and the entire outer circumference of the workpiece surface is all. It is preferable to have the same degree on the outer periphery. That is, it is preferable that the outer circumferential width difference (s) is affixed so that (m2−m1) / 2.

  FIG. 2 shows the pressure-sensitive adhesive layer (2a) in the pressure-sensitive adhesive layer (2) in the part (2a) corresponding to the work (W) attachment part (3a) and the other part (2b). It is an example in the case of being controlled so as to satisfy the adhesive strength of <the adhesive strength of the pressure-sensitive adhesive layer (2b).

  As shown in FIG. 2, as a method for controlling the adhesive strength of the pressure-sensitive adhesive layer (2), for example, the pressure-sensitive adhesive layer (2) is formed of a radiation curable pressure-sensitive adhesive, and the workpiece (W) pasting portion (3a) And a method of irradiating the portion (2a) corresponding to the above. In this case, the pressure-sensitive adhesive layer (2b) that has not been irradiated yet has higher adhesive strength than the pressure-sensitive adhesive layer (2a). When applying the wafer ring to the pressure-sensitive adhesive layer (2b), the wafer ring can be adhered and fixed during dicing or the like, and the wafer ring can be easily peeled off by irradiation with radiation after dicing.

  In FIG. 2, the pressure-sensitive adhesive layer (2a) is set to have the same size as the workpiece (W), and the diameter (m4) of the pressure-sensitive adhesive layer (2a) and the workpiece (W) This is the case where the diameter (m1) is the same. In this case, it is possible to fix the work pasting portion (3a) so as not to be peeled off from the pressure-sensitive adhesive layer (2b) at the time of dicing or the like at the width difference (m2-m4). The diameter (m4) of the pressure-sensitive adhesive layer (2a) is preferably adjusted by m3 ≧ m4 ≧ m1.

  The support substrate (1) is a strength matrix of the dicing die bond film. For example, polyolefins such as low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, polymethylpentene, ethylene-acetic acid Vinyl copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, Polyester such as polyurethane, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylsulfur Id, aramid (paper), glass, glass cloth, fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, metal (foil), paper and the like.

  Examples of the material for the supporting substrate include polymers such as a crosslinked product of the resin. The plastic film may be used unstretched or may be uniaxially or biaxially stretched as necessary. According to the resin sheet imparted with heat shrinkability by stretching or the like, the pressure-sensitive adhesive layer (2) or the pressure-sensitive adhesive layer (2a) and the adhesive layer (3a) It is possible to facilitate the recovery of the chip-like workpiece by reducing the adhesion area of the workpiece.

  The surface of the support substrate is chemically treated with conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, ionizing radiation treatment, etc., in order to improve adhesion and retention with adjacent layers. Alternatively, a physical treatment or a coating treatment with a primer (for example, an adhesive substance described later) can be performed.

  As the support substrate, the same kind or different kinds can be appropriately selected and used, and if necessary, a blend of several kinds can be used. In addition, in order to impart antistatic ability to the support base material, a conductive material vapor deposition layer having a thickness of about 30 to 500 mm and made of metal, alloy, oxide thereof, or the like is provided on the support base material. be able to. The support substrate may be a single layer or two or more layers. In the case where the pressure-sensitive adhesive layer (2) is a radiation curable type, a material that transmits at least part of radiation such as X-rays, ultraviolet rays, and electron beams is used.

  The thickness of the support substrate (1) is not particularly limited and can be determined as appropriate, but is generally about 5 to 200 μm.

  The pressure-sensitive adhesive used for forming the pressure-sensitive adhesive layer (2) is not particularly limited as long as it can control the die-bonding adhesive layer (3a) to be peelable. For example, general pressure-sensitive adhesives such as acrylic adhesives and rubber adhesives can be used. As the pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer from the viewpoint of cleanability of an electronic component that is difficult to contaminate a semiconductor wafer or glass with an organic solvent such as ultrapure water or alcohol. Is preferred.

  Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester , Octadecyl ester, eicosyl ester, etc., alkyl groups having 1 to 30 carbon atoms, especially 4 to 18 carbon atoms, such as linear or branched alkyl esters) Beauty (meth) acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, cyclohexyl ester, etc.), etc. One or acrylic polymer using two or more of the monomer component and the like. In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

  The acrylic polymer includes units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, as necessary, for the purpose of modifying cohesive strength, heat resistance, and the like. You may go out. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; The Sulfonic acid groups such as lensulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalenesulfonic acid Containing monomers; Phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

  Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylates. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.

  The acrylic polymer can be obtained by subjecting a single monomer or a mixture of two or more monomers to polymerization. The polymerization can be performed by any method such as solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. From the viewpoint of preventing contamination of a clean adherend, the content of the low molecular weight substance is preferably small. From this point, the number average molecular weight of the acrylic polymer is preferably 300,000 or more, more preferably about 400,000 to 3,000,000.

  In addition, an external cross-linking agent can be appropriately employed for the pressure-sensitive adhesive in order to increase the number average molecular weight of an acrylic polymer as a base polymer. Specific examples of the external crosslinking method include a method in which a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine crosslinking agent is added and reacted. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked, and further depending on the intended use as an adhesive. Generally, it is preferable to add about 5 parts by weight or less, and further 0.1 to 5 parts by weight with respect to 100 parts by weight of the base polymer. Furthermore, you may use additives, such as conventionally well-known various tackifiers and anti-aging agent, as needed other than the said component for an adhesive.

  The pressure-sensitive adhesive layer (2) can be formed of a radiation curable pressure-sensitive adhesive. The radiation-curable pressure-sensitive adhesive can easily reduce its adhesive strength by increasing the degree of crosslinking by irradiation with radiation such as ultraviolet rays. By irradiating only the pressure-sensitive adhesive layer (2a), the pressure-sensitive adhesive layer (2b) ) And a difference in adhesive strength can be provided.

  Further, by curing the radiation curable pressure-sensitive adhesive layer (2) in accordance with the work pasting portion (3a), the pressure-sensitive adhesive layer (2a) having a significantly reduced adhesive force can be easily formed. Since the adhesive layer (3a) is affixed to the adhesive layer (2a) which has been cured and has reduced adhesive strength, the interface between the adhesive layer (2a) and the adhesive layer (3a) is easily peeled off during pickup Have On the other hand, the part which is not irradiated with radiation has sufficient adhesive force, and forms an adhesive layer (2b).

  As described above, in the dicing die-bonding film of FIG. 2, the pressure-sensitive adhesive layer (2b) formed of the uncured radiation-curing pressure-sensitive adhesive can fix the wafer ring and the like.

  As the radiation-curable pressure-sensitive adhesive, those having a radiation-curable functional group such as a carbon-carbon double bond and exhibiting adhesiveness can be used without particular limitation. Examples of the radiation curable pressure-sensitive adhesive include additive-type radiation curable pressure-sensitive adhesives in which a radiation-curable monomer component or oligomer component is blended with a general pressure-sensitive pressure-sensitive adhesive such as the acrylic pressure-sensitive adhesive or rubber-based pressure-sensitive adhesive. An agent can be illustrated.

  Examples of the radiation-curable monomer component to be blended include urethane oligomers, urethane (meth) acrylates, trimethylolpropane tri (meth) acrylates, tetramethylolmethane tetra (meth) acrylates, pentaerythritol tri (meth) acrylates, and pentaerythritol. Examples include stall tetra (meth) acrylate, dipentaerystol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like. Examples of the radiation curable oligomer component include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30000 are suitable. The compounding amount of the radiation-curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the adhesive strength of the pressure-sensitive adhesive layer. Generally, the amount is, for example, about 5 to 500 parts by weight, preferably about 40 to 150 parts by weight with respect to 100 parts by weight of the base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

  In addition to the additive-type radiation-curable adhesive described above, the radiation-curable adhesive has a carbon-carbon double bond in the polymer side chain, main chain, or main chain terminal as a base polymer. Intrinsic radiation curable adhesives using Intrinsic radiation curable adhesives do not need to contain oligomer components, which are low molecular components, or do not contain many, so they are stable without the oligomer components, etc. moving through the adhesive over time. This is preferable because an adhesive layer having a layered structure can be formed.

  As the base polymer having a carbon-carbon double bond, those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, an acrylic polymer having a basic skeleton is preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

  The method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, the carbon-carbon double bond can be easily introduced into the polymer side chain for easy molecular design. . For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation-curable carbon-carbon double bond. Examples of the method include condensation or addition reaction while maintaining the above.

  Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction. In addition, the functional group may be on either side of the acrylic polymer and the compound as long as the acrylic polymer having the carbon-carbon double bond is generated by the combination of these functional groups. In the preferable combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. Further, as the acrylic polymer, those obtained by copolymerizing the above-exemplified hydroxy group-containing monomers, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like are used.

  As the intrinsic radiation-curable pressure-sensitive adhesive, the base polymer (particularly acrylic polymer) having the carbon-carbon double bond can be used alone, but the radiation-curable monomer is not deteriorated in properties. Components and oligomer components can also be blended. The radiation-curable oligomer component or the like is usually in the range of 30 parts by weight, preferably in the range of 0 to 10 parts by weight with respect to 100 parts by weight of the base polymer.

  The radiation curable pressure-sensitive adhesive contains a photopolymerization initiator when cured by ultraviolet rays or the like. Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypropio Α-ketol compounds such as phenone and 1-hydroxycyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- ( Acetophenone compounds such as methylthio) -phenyl] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; ketal compounds such as benzyldimethyl ketal; 2-naphthalenesulfo D Aromatic sulfonyl chloride compounds such as luchloride; Photoactive oxime compounds such as 1-phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3,3′-dimethyl Benzophenone compounds such as -4-methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2 Thioxanthone compounds such as 1,4-diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketone; acyl phosphinoxide; acyl phosphonate. The compounding quantity of a photoinitiator is about 0.05-20 weight part with respect to 100 weight part of base polymers, such as an acryl-type polymer which comprises an adhesive.

  Examples of the radiation curable pressure-sensitive adhesive include photopolymerizable compounds such as an addition polymerizable compound having two or more unsaturated bonds and an alkoxysilane having an epoxy group disclosed in JP-A-60-196956. And a rubber-based pressure-sensitive adhesive and an acrylic pressure-sensitive adhesive containing a photopolymerization initiator such as a carbonyl compound, an organic sulfur compound, a peroxide, an amine, and an onium salt-based compound.

  The radiation curable pressure-sensitive adhesive layer (2) may contain a compound that is colored by radiation irradiation, if necessary. By including the compound to be colored in the pressure-sensitive adhesive layer (2) by irradiation, only the irradiated portion can be colored. That is, the pressure-sensitive adhesive layer (2a) corresponding to the workpiece pasting part (3a) can be colored. Therefore, it can be immediately determined by visual observation whether or not radiation has been applied to the pressure-sensitive adhesive layer (2), the workpiece pasting portion (3a) can be easily recognized, and the workpieces can be easily bonded together. Further, when detecting a semiconductor element by an optical sensor or the like, the detection accuracy is increased, and no malfunction occurs when the semiconductor element is picked up.

  A compound that is colored by radiation irradiation is a compound that is colorless or light-colored before radiation irradiation, but becomes colored by radiation irradiation. Preferable specific examples of such compounds include leuco dyes. As the leuco dye, conventional triphenylmethane, fluoran, phenothiazine, auramine, and spiropyran dyes are preferably used. Specifically, 3- [N- (p-tolylamino)]-7-anilinofluorane, 3- [N- (p-tolyl) -N-methylamino] -7-anilinofluorane, 3- [ N- (p-tolyl) -N-ethylamino] -7-anilinofluorane, 3-diethylamino-6-methyl-7-anilinofluorane, crystal violet lactone, 4,4 ', 4 "-tris Examples thereof include dimethylaminotriphenylmethanol and 4,4 ′, 4 ″ -trisdimethylaminotriphenylmethane.

  Developers preferably used together with these leuco dyes include conventionally used initial polymers of phenol formalin resins, aromatic carboxylic acid derivatives, electron acceptors such as activated clay, and further change the color tone. In some cases, various known color formers can be used in combination.

  Such a compound colored by irradiation with radiation may be once dissolved in an organic solvent and then included in the radiation curable adhesive, or may be finely powdered and included in the pressure-sensitive adhesive. The proportion of this compound used is desirably 10% by weight or less, preferably 0.01 to 10% by weight, more preferably 0.5 to 5% by weight in the pressure-sensitive adhesive layer (2). If the ratio of the compound exceeds 10% by weight, the radiation applied to the pressure-sensitive adhesive layer (2) is absorbed too much by the compound, so that the pressure-sensitive adhesive layer (2a) is not sufficiently cured and is sufficiently sticky. Power may not decrease. On the other hand, in order to sufficiently color, it is preferable that the ratio of the compound is 0.01% by weight or more.

  When the pressure-sensitive adhesive layer (2) is formed of a radiation curable pressure-sensitive adhesive, the pressure-sensitive adhesive layer (2) is adjusted so that the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer (2a) <the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer (2b). It is preferable to irradiate a part. In the dicing die-bonding film of FIG. 2, for example, the adhesive strength of the adhesive layer (2a) <the adhesive strength of the adhesive layer (2b) in relation to the SUS304 plate (# 2000 polishing) as the adherend. To do.

  As a method of forming the pressure-sensitive adhesive layer (2a), after forming the radiation curable pressure-sensitive adhesive layer (2) on the supporting base material (1), a part corresponding to the work pasting part (3a) is partially A method of forming the pressure-sensitive adhesive layer (2a) by irradiating and curing the radiation is exemplified. The partial radiation irradiation can be performed through a photomask in which a pattern corresponding to a portion (3b or the like) other than the workpiece pasting portion (3a) is formed. In addition, a method of curing by irradiating ultraviolet rays in a spot manner can be used. The radiation curable pressure-sensitive adhesive layer (2) can be formed by transferring what is provided on the separator onto the support substrate (1). Partial radiation curing can also be performed on the radiation curable pressure-sensitive adhesive layer (2) provided on the separator.

  When the pressure-sensitive adhesive layer (2) is formed of a radiation curable pressure-sensitive adhesive, all or one of the portions other than the portion corresponding to the workpiece pasting portion (3a) on at least one side of the support substrate (1). The part where the part was shielded from light was used, and after the radiation-curable pressure-sensitive adhesive layer (2) was formed thereon, the part was irradiated with radiation to cure the part corresponding to the work pasting part (3a), thereby reducing the adhesive strength. An adhesive layer (2a) can be formed. As the light shielding material, a material that can be a photomask on a support film can be formed by printing or vapor deposition. According to this manufacturing method, the dicing die-bonding film of the present invention can be efficiently manufactured.

  In addition, when hardening inhibition by oxygen occurs at the time of radiation irradiation, it is desirable to block oxygen (air) from the surface of the radiation curable pressure-sensitive adhesive layer (2) by some method. For example, a method of covering the surface of the pressure-sensitive adhesive layer (2) with a separator, a method of irradiating radiation such as ultraviolet rays in a nitrogen gas atmosphere, and the like can be mentioned.

  The thickness of the pressure-sensitive adhesive layer (2) is not particularly limited, but is preferably about 1 to 50 μm from the viewpoints of chipping prevention of the chip cut surface and compatibility of fixing and holding of the adhesive layer. Preferably it is 2-30 micrometers, Furthermore, 5-25 micrometers is preferable.

  The die bonding adhesive layer (3) supports the workpiece (semiconductor wafer, etc.) to be pressure-bonded on the adhesive layer (3) in close contact with the workpiece, and supports the cut piece. When mounting the chip-shaped workpiece (semiconductor chip or the like), a material that functions as an adhesive layer for fixing the chip-shaped workpiece to a semiconductor element (substrate, chip or the like) is used. In particular, it is important that the die bonding adhesive layer (3) has an adhesive property that does not cause the cut pieces to scatter when the workpiece is diced. In the dicing die-bonding film of the present invention, the die-bonding adhesive layer (3) is provided as a work pasting portion (3a) formed in advance.

  The die bonding adhesive layer (3) can be formed of a normal die bonding agent. As the die adhesive, one that can be formed into a sheet shape is preferable. As a specific die adhesive, for example, a die adhesive made of a thermoplastic resin or a thermosetting resin can be suitably used. In particular, a thermosetting resin die adhesive is preferable because it can lower the bonding temperature to the workpiece and is excellent in heat resistance by curing. The die adhesives can be used alone or in combination of two or more. Further, the adhesive layer for die bonding is preferably one that can adhere to a workpiece such as a semiconductor wafer at 70 ° C. or lower. Furthermore, the thing which can adhere at normal temperature is preferable.

  Examples of the thermoplastic resin (thermoplastic die adhesive) used as the die adhesive include saturated polyester resins, thermoplastic polyurethane resins, amide resins (nylon resins), and imide resins. Examples of the thermosetting resin (thermosetting die adhesive) include an epoxy resin, an unsaturated polyester resin, a thermosetting acrylic resin, and a phenol resin. As the thermosetting resin, a thermosetting resin that has been desolvated, formed into a sheet, and made into a B-stage is preferable. A mixture of these thermosetting resin and thermoplastic resin can also be used in a B-staged state. In the present invention, silicone, rubber, urethane, imide, and acrylic resins having a high glass transition temperature can also be used as the die adhesive.

  The die bonding adhesive layer (3) may have a multilayer structure of two or more layers by appropriately combining thermoplastic resins having different glass transition temperatures and thermosetting resins having different thermosetting temperatures. In addition, since cutting water is used in the dicing process of a workpiece (semiconductor wafer or the like), the die bonding adhesive layer (3) may absorb moisture, resulting in a moisture content higher than normal. If it is bonded to a substrate or the like with such a high water content, water vapor may accumulate at the bonding interface at the stage of after-curing and floating may occur. Therefore, as a die-bonding adhesive, it is possible to avoid such problems by diffusing water vapor through the film at the after-curing stage by adopting a structure in which a highly moisture-permeable film is sandwiched between the die adhesives. It becomes. Therefore, the die bonding adhesive layer (3) may have a multilayer structure in which an adhesive layer, a film, and an adhesive layer are laminated in this order.

  The thickness of the die bonding adhesive layer (3) is not particularly limited, but is, for example, about 5 to 100 μm, preferably about 10 to 50 μm.

  In this way, a dicing die-bonding film having the pressure-sensitive adhesive layer (2) on the support substrate (1) and the die-bonding adhesive layer (3a) on the pressure-sensitive adhesive layer (2) is obtained.

  The dicing die-bonding film can have antistatic ability for the purpose of preventing the generation of static electricity at the time of adhesion or peeling and the destruction of the circuit due to the charging of the workpiece (semiconductor wafer, etc.) due to this. . The antistatic ability can be imparted by adding an antistatic agent or a conductive material to the support base material (1), the pressure-sensitive adhesive layer (2) or the adhesive layer (3a), or transferring the charge to the support base material (1). An appropriate method such as attachment of a conductive layer made of a complex or a metal film can be used. These systems are preferably systems that do not easily generate impurity ions that may alter the semiconductor wafer. Conductive substances (conductive fillers) formulated for the purpose of imparting conductivity and improving thermal conductivity include spherical, acicular, and flaky shapes such as silver, aluminum, gold, copper, nickel, and conductive alloys. Examples thereof include metal powders, metal oxides such as alumina, amorphous carbon black, and graphite. However, the die bonding adhesive layer (3a) is preferably non-conductive from the viewpoint of preventing electrical leakage.

  The die bonding adhesive layer (3a) of the dicing die bond film may be protected by a separator (not shown). That is, the separator can be provided arbitrarily. The separator has a function as a protective material that protects the adhesive layers (3) and (3a) for die bonding until they are put to practical use. In addition, a separator can be used as a support base material at the time of transferring the die-bonding adhesive (3a) to an adhesive layer (2) further. The separator is peeled off when a workpiece is stuck on the die bonding adhesive layer (3a) of the dicing die bond film. Examples of the separator include polyethylene, polypropylene, a plastic film or paper whose surface is coated with a release agent such as a fluorine-type release agent or a long-chain alkyl acrylate release agent.

  The dicing die-bonding film of the present invention is used as follows by appropriately separating the separator arbitrarily provided on the adhesive layer (3a). That is, the workpiece is pressure-bonded onto the die-bonding adhesive layer (3a) of the dicing die-bonding film, and the workpiece is bonded and held on the adhesive layer (3a) and fixed. A dicing ring is pressure-bonded to the pressure-sensitive adhesive layer (2). The pressure bonding of the present invention is performed by a conventional method. In the invention, a semiconductor wafer can be suitably used as the workpiece. Next, the workpiece is diced into chips. Examples of the work include a semiconductor wafer, a multilayer substrate, a batch sealing module, and the like. In the present invention, a semiconductor wafer can be suitably used as the workpiece. In dicing, the work including the adhesive layer (3a) is made into a chip-like work (semiconductor chip or the like) by an appropriate means such as a rotating round blade.

  Next, the chip-like workpiece is peeled from the pressure-sensitive adhesive layer (2a) together with the die-bonding adhesive layer (3a). The picked-up chip-shaped workpiece is bonded and fixed to a semiconductor element as an adherend through a die bonding adhesive layer (3a). Examples of the semiconductor element include a lead frame, a TAB film, a substrate, and a separately manufactured chip-like work. The adherend may be, for example, a deformable adherend that can be easily deformed, or a non-deformable adherend (such as a semiconductor wafer) that is difficult to deform. The adherend is preferably a semiconductor wafer. In the case where the adhesive layer (3a) is a thermosetting type, the work is bonded and fixed to the adherend by heat curing to improve the heat resistance strength. In addition, what the chip-shaped work was adhere | attached and fixed to the board | substrate etc. via the adhesive bond layer (3a) can be used for a reflow process.

  Examples of the present invention will be described below to explain the present invention more specifically. In the following, “parts” means parts by weight.

  For ultraviolet irradiation, an ultraviolet (UV) irradiation apparatus: NEL UM-110 (manufactured by Nitto Seiki Co., Ltd.) was used.

Production example (production of adhesive layer for die bonding)
A composition of die-bonding adhesives A to C was prepared by blending the components consisting of epoxy resin, phenol resin, acrylic rubber, silica and curing accelerator shown in Table 1 in the proportions shown in the table, and the composition Was dissolved in toluene. This mixed solution was applied onto a release-treated polyester film (separator). Next, the polyester film coated with the mixed solution was dried at 120 ° C., and toluene was removed to obtain 20 μm thick B-staged adhesive layers for die bonding A to C on the polyester film.

  In Table 1, <epoxy resin (a1)> bisphenol A type epoxy resin (epoxy equivalent: 186 g / eq, viscosity: 10 Pa · s / 25 ° C.), <epoxy resin (a2)> triphenolmethane type epoxy resin (epoxy equivalent) : 170 g / eq, softening point: 80 ° C., viscosity: 0.08 Pa · s / 150 ° C., <phenolic resin> novolac type phenolic resin (hydroxyl equivalent: 104 g / eq, softening point: 80 ° C., viscosity: 0.1 Pa · s / 150 ° C), <acrylic rubber> (Mooney viscosity: 50), <spherical silica> average particle size: 1 μm, maximum particle size: 10 μm, <curing accelerator> triphenylphosphine.

Example 1
(Preparation of radiation curable acrylic adhesive)
A blended composition comprising 70 parts of butyl acrylate, 30 parts of ethyl acrylate and 5 parts of acrylic acid is copolymerized in a conventional manner in ethyl acetate, and a solution of an acrylic polymer having a weight average molecular weight of 400,000 and a concentration of 30% by weight Got. To the acrylic polymer solution (solid content: 100 parts by weight), 50 parts of dipentaerythritol monohydroxypentaacrylate as a photopolymerizable compound and 3 parts of α-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator were blended. These were uniformly dissolved in toluene to prepare a radiation curable acrylic pressure-sensitive adhesive solution having a concentration of 25% by weight.

(Production of dicing die bond film)
The radiation curable acrylic pressure-sensitive adhesive solution was applied onto a supporting substrate made of a polyethylene film having a thickness of 80 μm and dried to form a pressure-sensitive adhesive layer having a thickness of 5 μm. Hereinafter, this is referred to as an adhesive film B. Next, only 500 mJ / cm ² (ultraviolet irradiation integrated light amount) is irradiated with ultraviolet rays only on the wafer pasting corresponding part (6 inch diameter circle) on the adhesive layer of the adhesive film B, and the wafer pasting corresponding part is radiation-cured. A film having an adhesive layer was obtained. Subsequently, the adhesive layer B for die bonding was transferred to the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive film B to obtain a dicing die-bonding film. The shape of the adhesive layer B for die bonding was transferred such that the diameter was 20 mm larger than the workpiece surface (diameter 6 inches).

Example 2
In Example 1, except that changing the die bonding adhesive B on the die bonding adhesive layer C in the same manner as in Example 1, to prepare a dicing die-bonding film.

Example 3
In Example 1, except that changing the die bonding adhesive B on the die bonding adhesive layer A in the same manner as in Example 1, to prepare a dicing die-bonding film.

Comparative Example 1
(Preparation of acrylic adhesive)
A blended composition consisting of 100 parts of butyl acrylate, 5 parts of acrylonitrile and 5 parts of acrylic acid was copolymerized in a toluene solution to obtain an acrylic polymer solution having a weight average molecular weight of 800,000 and a concentration of 35% by weight. 5 parts of a polyisocyanate crosslinking agent (Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd.) was blended with the acrylic polymer solution (solid content: 100 parts by weight). These were uniformly dissolved in toluene to prepare an acrylic pressure-sensitive adhesive solution having a concentration of 25% by weight.

(Production of dicing die bond film)
  On the support base material which consists of a 60-micrometer-thick polyethylene film, the said acrylic adhesive solution was apply | coated and dried, and the 5-micrometer-thick adhesive layer was formed. Hereinafter, this is referred to as an adhesive film A. Subsequently, the adhesive layer A for die bonding was transferred to the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive film A to obtain a dicing die-bonding film. The adhesive layer A for die bonding was transferred with the same size as the work surface (diameter 6 inches).

Comparative Example 2
In Comparative Example 1, a die bonding adhesive layer A, than the work face (diameter 6 inches), except that the diameter was changed to that of 2mm smaller size in the same manner as in Comparative Example 1, a dicing die-bonding film Was made.

Comparative Example 3
In Comparative Example 1, a die bonding adhesive layer A, the adhesive film except that it has transferred to the entire surface of the adhesive layer side of A in the same manner as in Comparative Example 1 to prepare a dicing die-bonding film.

  About the dicing die-bonding film obtained by the Example and the comparative example, it measured according to each adhesive force JISZ0237 shown below with the adhesive film and adhesive layer for die-bonding used in each example. The results are shown in Table 2.

(1) Measurement of adhesive strength of adhesive film to SUS304 plate (# 2000 polishing) (wafer attaching part)
The adhesive film A was cut into strips with a width of 10 mm without being irradiated with ultraviolet rays. About the adhesive film B, after irradiating an ultraviolet-ray (500 mJ / cm < ² >) from the support base material side, it cut | disconnected in strip shape with a width of 10 mm. After that, the adhesive film (10 mm width) was affixed to a SUS304 plate (# 2000 polishing) at 23 ° C. (room temperature) and allowed to stand at room temperature for 30 minutes, and then the adhesive film was peeled off at a constant temperature room at 23 ° C. The adhesive strength when peeled at 90 ° was measured (adhesive film tensile speed 300 mm / min).

(Other than the wafer sticking part)
The adhesive films A and B were cut into strips with a width of 10 mm. After that, the adhesive film (10 mm width) was affixed to a SUS304 plate (# 2000 polishing) at 23 ° C. (room temperature) and allowed to stand at room temperature for 30 minutes, and then the adhesive film was peeled off at a constant temperature room at 23 ° C. The adhesive strength when peeled at 90 ° was measured (adhesive film tensile speed 300 mm / min).

Using the dicing die-bonding films of Examples 1 to 3 and Comparative Examples 1 to 3 described above, the semiconductor wafer was actually diced and die-bonded in the following manner, and its performance was evaluated. The results are shown in Table 2.

<Chip fly during dicing>
A mirror wafer having a thickness of 0.15 mm was obtained by polishing a back surface of a 6-inch diameter semiconductor wafer on which a circuit pattern was formed. The separator was peeled off from the dicing die-bonding film, and the mirror wafer was roll-bonded to the exposed adhesive layer at 40 ° C., followed by full dicing to a 1 mm square chip size. The presence or absence of chip jumping during dicing was evaluated. In this operation, none of the dicing die-bonding films of Examples and Comparative Examples caused defects such as chip fly during dicing.

<Contamination of dicing ring>
After dicing, the dicing ring was visually observed for contamination.

(Dicing conditions)
Dicing machine: DFD-651, manufactured by Disco Corporation
Dicing speed: 80 mm / second Dicing blade: 2050HECC manufactured by Disco Corporation
Rotation speed: 40,000 rpm
Cutting depth: 20 μm
Cutting method: Full cut A mode Chip size: As appropriate (1 to 15 mm square) (wafer grinding conditions)
Grinding device: DFG-840 manufactured by DISCO
Wafer: 6 inch diameter (back grinding from 0.6mm to 0.15μm)
Wafer bonding apparatus: DR-8500II (Nitto Seiki Co., Ltd.) (expanding conditions)
Dicing ring: 2-6-1 (Disco, 19.5 cm inner diameter)
Withdrawal amount: 5mm
Die bonder: CPS-100 (NEC machine)

In the dicing die-bonding films of Examples 1 to 3 and Comparative Example 3, no defects such as chip jumping occurred during dicing. On the other hand, chip fly occurred in Comparative Examples 1 and 2. In Examples 1 to 3 and Comparative Examples 1 and 2, contamination of the dicing ring was not observed. On the other hand, in Comparative Example 3, the adhesive layer was adhered to the entire surface of the dicing ring contact portion, and the dicing ring was contaminated. As is clear from these test results, as in the dicing die-bonding film of the present invention, the pressure-sensitive adhesive layer is interposed between the support substrate and the adhesive layer, and the adhesive layer has a predetermined size. It can be seen that the product can prevent the dicing ring from being contaminated and can suppress chip jumping.

It is an example of sectional drawing of the dicing die-bonding film of this invention. It is an example of sectional drawing of the dicing die-bonding film of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support base material 2 Adhesive layer 3 Die-bonding adhesive layer W Workpiece (wafer)
WR wafer ring

Claims (3)

A dicing / dicing having a pressure-sensitive adhesive layer (2) formed of a radiation-curable pressure-sensitive adhesive on the support substrate (1), and having a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2). A die bond film,
The die bonding adhesive layer (3) is provided as a work pasting portion (3a) on a part of the pressure-sensitive adhesive layer (2).
The workpiece affixing part (3a) can affix the entire work surface to be affixed, and the work surface is a circle having a diameter m1 (where 1 inch ≦ m1 ≦ 12 inches). When 3a) is a circle having a diameter m2, m2> m1 is satisfied, and the width difference (m2−m1) is 0.1 mm ≦ (m2−m1),
Furthermore, the work pasting portion (3a) is designed to be within the inner diameter of the dicing ring to be pasted on the pressure-sensitive adhesive layer (2), and m3> m2 when the inner diameter of the dicing ring is m3. Satisfying the relationship, and 5 mm ≦ (m3−m2),
The pressure-sensitive adhesive layer (2) is formed of an acrylic pressure-sensitive adhesive, and a part (2a) corresponding to the work pasting part (3a) is pre-cured by irradiation with a circle having a diameter of m4. In the case of satisfying the relationship of m2> m4, the adhesive force of the other part (2b) is 42.2 to the adhesive force of the part (2a) corresponding to the work pasting part (3a). satisfy 60 fold range, adhesive strength is 0.065~0.09N / 10mm der part (2a) corresponding to the work attachment portion (3a) is, the adhesive strength of the portion (2b) is 3. dicing die-bonding film according to claim 55~4.8N / 10mm der Rukoto.   The dicing die-bonding film according to claim 1, wherein the die-bonding adhesive layer (3a) is formed of a thermosetting die adhesive.   The dicing die-bonding film according to claim 1 or 2, wherein the die-bonding adhesive layer (3a) is non-conductive.

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