JP4804407B2 - Liquid processing equipment - Google Patents

Description

  The present invention relates to a liquid processing apparatus that performs predetermined liquid processing on a substrate such as a semiconductor wafer.

  In a semiconductor device manufacturing process and a flat panel display (FPD) manufacturing process, a process of supplying a processing liquid to a semiconductor wafer or a glass substrate, which is a substrate to be processed, and performing liquid processing is frequently used. As such a process, for example, a cleaning process for removing particles or contamination attached to the substrate, a coating process of a photoresist solution or a developing solution in a photolithography process, and the like can be given.

  As such a liquid processing apparatus, a substrate such as a semiconductor wafer is held on a spin chuck, a processing liquid is supplied to the front surface or front and back surfaces of the wafer while the substrate is rotated, and a liquid film is applied to the front or back surface of the wafer. A device that forms a film and performs processing is known.

  In this type of apparatus, the processing liquid is usually supplied to the center of the wafer, and by rotating the substrate, the processing liquid is spread outward to form a liquid film, and the processing liquid is generally released. ing. A member such as a cup surrounding the outside of the wafer is provided so as to guide the processing liquid shaken off the substrate downward, so that the processing liquid shaken off from the wafer is quickly discharged. However, when a cup or the like is provided in this way, the processing liquid may scatter as mist and reach the substrate to cause defects such as watermarks and particles.

As a technique capable of preventing such a problem, Patent Document 1 discloses a processing liquid that receives a processing liquid scattered in the outer peripheral direction from a substrate so as to rotate integrally with a rotation support unit that rotates the substrate while being horizontally supported. There is disclosed a technique in which a receiving member is provided to receive a processing liquid and guide the processing liquid to the outside for recovery. In this Patent Document 1, the processing liquid receiving member includes, in order from the substrate side, a horizontal eaves part, an inclined guide part that guides the processing liquid outward and downward, a horizontal guide part that guides the processing liquid horizontally outward, and a vertical standing part. It has a wall to be installed, and the process liquid is forced into a narrow area and discharged to the horizontal outside through the drain port provided at the corner of the process receiving member while preventing the mist from reattaching to the substrate. Furthermore, the liquid is drained through a groove extending outwardly inside the spacer disposed outside the processing liquid receiving member.
JP-A-8-1064

  However, in Patent Document 1, since the processing liquid receiving member that rotates together with the substrate drives the processing liquid into a narrow area outside the substrate, the spacer portion outside the substrate becomes large, and the footprint of the apparatus is reduced. It will be big. Moreover, exhaust must be performed together with the drainage, and a mechanism for separating the exhaust and drainage is required on the downstream side.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a liquid processing apparatus that can reduce the footprint and does not require a special mechanism for separating exhaust and drainage. .

  In order to solve the above-described problems, the present invention provides a substrate holding unit that holds a substrate horizontally and can rotate with the substrate, a rotating cup that surrounds the substrate held by the substrate holding unit and can rotate with the substrate, A rotation mechanism that integrally rotates the rotary cup and the substrate holding unit, a liquid supply mechanism that supplies a processing liquid to the substrate, and an exhaust / drainage unit that exhausts and drains the rotary cup, The exhaust / drainage part is provided so as to surround the drainage cup outside the drainage cup and an annular drainage cup that mainly takes in and drains the processing liquid shaken off from the substrate. The rotary cup and an exhaust cup that mainly takes in and exhausts gas components from the periphery thereof, and the drainage from the drainage cup and the exhaust from the exhaust cup are performed independently. Liquid processing To provide a device.

  The present invention also includes a substrate holding unit that holds the substrate horizontally and can rotate with the substrate, a rotating cup that surrounds the substrate held by the substrate holding unit and can rotate with the substrate, the rotating cup, A rotating mechanism for integrally rotating the substrate holder, a surface liquid supplying mechanism for supplying a processing liquid to the surface of the substrate, a back surface liquid supplying mechanism for supplying a processing liquid to the back surface of the substrate, and exhaust and exhaust of the rotating cup. An exhaust / drainage portion for performing liquid, the exhaust / drainage portion is formed in an annular drainage cup for draining the processing liquid mainly shaken off from the substrate, and an outer side of the drainage cup. The exhaust cup is provided so as to surround the drain cup, and has an exhaust cup for taking in and exhausting mainly gas components from the rotary cup and its surroundings, and the drain from the drain cup and the exhaust cup The exhaust is Providing a liquid processing apparatus, characterized in that it is carried out independently.

  In the present invention, a guide member is further provided outside the substrate on the holding member so as to rotate together with the holding member and the rotary cup, and guides the processing liquid shaken off from the substrate to the outside of the substrate. It is preferable.

  In addition, the rotating cup has a processing liquid discharge unit that horizontally discharges the processing liquid shaken off from the substrate, and the draining cup is provided so as to surround the outer side of the rotating cup, It can be configured to receive the drained liquid discharged in the direction. The rotating cup has a guide wall that takes in the processing liquid shaken off from the substrate and guides it downward, and an opening that discharges the taken processing liquid downward. It is provided so as to surround the opening, and can be configured to receive the drained liquid discharged downward.

  Further, the exhaust cup may be arranged so that an annular introduction port is formed above the rotary cup, and may have an intake port for taking in the ambient atmosphere into the wall portion.

  According to the present invention, since the rotating cup that rotates together with the rotation of the substrate is provided, centrifugal force acts on the rotating cup, and the rebound of the mist of the processing liquid as in the case where the fixed cup is provided can be prevented. In addition, a drain cup is provided outside the rotary cup. Since there is a low possibility that the mist rebounding from the drain cup will reach the substrate due to the presence of the rotary cup, the rotary cup and the drain cup can be brought close to each other. The drainage cup can be made small. Therefore, even if the exhaust cup is provided so as to surround the drain cup, the footprint of the apparatus can be kept small. In this way, by providing the exhaust cup so as to surround the drain cup outside the drain cup, the drain / exhaust separation can be performed at the base portion, and the drain from the drain cup can be performed. Since the liquid and the exhaust from the exhaust cup are performed independently, there is no need to provide a mechanism for separating the exhaust and drainage on the downstream side. In addition, since the exhaust cup is provided so as to surround the drainage cup, even if the mist of the treatment liquid leaks from the drainage cup, it can be trapped by the exhaust cup, and the mist of the treatment liquid is scattered outside the apparatus. Can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the present invention is applied to a liquid processing apparatus that performs front and back surface cleaning of a semiconductor wafer (hereinafter simply referred to as a wafer) will be described.

  1 is a cross-sectional view showing a schematic configuration of a liquid processing apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view thereof, and FIGS. 3 and 4 are cross-sectional views showing an exhaust / drainage part in an enlarged manner. . The liquid processing apparatus 100 includes a wafer holding unit 1 that rotatably holds a wafer W that is a substrate to be processed, a rotation motor 2 that rotates the wafer holding unit 1, and a wafer W held on the wafer holding unit 1. A rotating cup 3 that is provided so as to rotate together with the wafer holder 1, a surface treatment liquid supply nozzle 4 that supplies a treatment liquid to the surface of the wafer W, and a back surface treatment liquid that supplies the treatment liquid to the back surface of the wafer W It has a supply nozzle 5 and an exhaust / drainage part 6 provided at the peripheral edge of the rotary cup 3. A casing 8 is provided so as to cover the periphery of the exhaust / drainage unit 6 and the upper portion of the wafer W. A fan filter unit (FFU) 9 is provided on the upper portion of the casing 8 so that a downflow of clean air is supplied to the wafer W held by the wafer holder 1.

  The wafer holding unit 1 includes a horizontally-rotating rotating plate 11 having a disk shape, and a cylindrical rotating shaft 12 connected to the center of the back surface and extending vertically downward. A circular hole 11 a that communicates with the hole 12 a in the rotating shaft 12 is formed at the center of the rotating plate 11. And the back surface treatment liquid supply nozzle 5 can be moved up and down in the holes 12a and 11a. As shown in FIG. 2, the rotary plate 11 is provided with three holding members 13 that hold the outer edge of the wafer W at equal intervals. The holding member 13 is configured to hold the wafer W horizontally with the wafer W slightly floating from the rotating plate 11. The holding member 13 is movable between a holding position that holds the wafer W and a release position that rotates backward to release the holding. In the vicinity of the end portion of the rotating plate 11, an inclined portion 11 b is formed by circling so that the outer portion is lower than the central portion. Therefore, the end portion of the rotating plate 11 is formed thinner than the other portions.

  A belt 14 is wound around the lower end of the rotary shaft 12, and the belt 14 is also wound around a pulley 15. The pulley 15 can be rotated by the motor 2, and the rotation shaft 12 is rotated via the pulley 15 and the belt 14 by the rotation of the motor 2.

  The surface treatment liquid supply nozzle 4 is held at the tip of the nozzle arm 16 so that the treatment liquid is supplied from a liquid supply tube (not shown), and the treatment liquid is discharged through a nozzle hole provided therein. It has become. Examples of the processing liquid to be discharged include cleaning chemicals, rinsing liquids such as pure water, and dry solvents such as IPA. One type or two or more types of processing liquids can be discharged. As shown in FIG. 2, the nozzle arm 16 is provided so as to be rotatable about a shaft 17, and is driven between a discharge position on the center of the wafer W and a retreat position outside the wafer W by a drive mechanism (not shown). It is possible to move with. The nozzle arm 16 is provided so as to be movable up and down. When the nozzle arm 16 is rotated, the nozzle arm 16 is raised. When the treatment liquid is discharged from the surface treatment liquid supply nozzle 4, the nozzle arm 16 is lowered.

  The backside treatment liquid supply nozzle 5 has a nozzle hole 5a extending along the longitudinal direction thereof. A predetermined processing liquid is supplied from the lower end of the nozzle hole 5a through a processing liquid tube (not shown), and the processing liquid is discharged to the back surface of the wafer W through the nozzle hole 5a. Examples of the treatment liquid to be discharged include cleaning chemicals, rinsing liquids such as pure water, and dry solvents such as IPA, as with the surface treatment liquid supply nozzle 4. The liquid can be discharged. The back surface treatment liquid supply nozzle 5 also has a function as a wafer lifting member, and has a wafer support 18 for supporting the wafer W at the upper end thereof. On the upper surface of the wafer support 18, there are three wafer support pins 19 (only two are shown) for supporting the wafer W. A cylinder mechanism 21 is connected to the lower end of the back surface processing liquid supply nozzle 5 via a connecting member 20. The back surface processing liquid supply nozzle 5 is moved up and down by the cylinder mechanism 21 to move the wafer W up and down. W loading and unloading are performed.

  As shown in FIG. 3, the rotary cup 3 includes a cylindrical vertical wall member 31 provided so as to extend upward from the end of the rotary plate 11 to form a vertical wall, and an inner end from the upper end of the vertical wall member 31. And an annular flange member 32 extending in the direction.

  An annular and plate-shaped guide member 35 whose inner end extends to the vicinity of the periphery of the wafer W is provided at a position of the vertical wall member 31 at almost the same height as the wafer W. The guide member 35 is provided such that the front and back surfaces thereof are substantially continuous with the front and back surfaces of the wafer W. The vertical wall member 31 is provided with a plurality of discharge holes 33 and 34 penetrating from the inside to the outside at the upper and lower positions of the guide member 35 along the circumferential direction. The discharge hole 33 is provided such that the lower surface thereof is in contact with the surface of the guide member 35, and the discharge hole 34 is provided so that the lower surface thereof is in contact with the surface of the rotating plate 11. When the processing liquid is supplied from the surface processing liquid supply nozzle 4 to the center of the surface of the wafer W by rotating the wafer holding member 1 and the rotating cup 3 together with the wafer W by the motor 2, the processing liquid is centrifugally applied to the wafer W. Is spread out from the periphery of the wafer W. The processing liquid shaken off from the surface of the wafer W is guided to the surface of the guide member 35 provided substantially continuously, reaches the vertical wall member 31, passes through the discharge hole 33 by centrifugal force, and is outside the rotary cup 3. To be discharged. Similarly, when the wafer holding member 1 and the rotating cup 3 are rotated together with the wafer W and the processing liquid is supplied from the back surface processing liquid supply nozzle 5 to the center of the back surface of the wafer W, the processing liquid is subjected to centrifugal force by the wafer W. Is spread from the periphery of the wafer W. The processing liquid spun off from the back surface of the wafer W is guided by the back surface of the guide member 35 provided substantially continuously with the back surface of the wafer W and reaches the vertical wall member 31, and passes through the discharge hole 34 by centrifugal force. The rotary cup 3 is discharged to the outside. At this time, the centrifugal force is acting on the vertical wall member 31, so that the mist of the processing liquid is prevented from returning inward.

  Further, since the guide member 35 guides the processing liquid shaken off from the front surface and the back surface of the wafer W in this way, the processing liquid detached from the peripheral edge of the wafer W is not easily turbulent and rotates without causing the processing liquid to be misted. Can be led out of the cup. The height of the front and back surfaces of the portion adjacent to the wafer W of the guide member 35 is preferably the same as the height of the front and back surfaces of the wafer W. As shown in FIG. 2, the guide member 35 is provided with a notch 36 at a position corresponding to the wafer holding member 13 so as to avoid the wafer holding member 13.

  The exhaust / drainage section 6 is mainly for collecting exhaust and drainage discharged from the space surrounded by the rotary plate 11 and the rotary cup 3, and as shown in the enlarged views of FIGS. In addition, an annular drainage cup 41 that receives the drainage discharged from the discharge holes 33 and 34 of the vertical wall member 31 in the rotary cup 3, and the drainage cup 41 is surrounded on the outside of the drainage cup 41. And an exhaust cup 42 having an annular shape.

  As shown in FIGS. 1 and 3, a drain port 43 is provided at one position on the bottom of the drain cup 41, and a drain tube 44 is connected to the drain port 43. A suction mechanism (not shown) is provided on the downstream side of the drainage pipe 44, and the drainage collected from the rotary cup 3 to the drainage cup 41 is quickly discharged through the drainage port 43 and the drainage pipe 44. Discarded or recovered. Note that a plurality of drain ports 43 may be provided.

  The exhaust cup 42 also surrounds the rotary cup 3 in addition to the drain cup 41, and its upper wall 42 a is located above the flange member 32. The exhaust cup 42 takes in and exhausts gas components mainly in and around the rotary cup 3 from an annular inlet 42b between the upper wall 42a and the flange member 32. As shown in FIGS. 1 and 4, an exhaust port 45 is provided below the exhaust cup 42, and an exhaust pipe 46 is connected to the exhaust port 45. A suction mechanism (not shown) is provided on the downstream side of the exhaust pipe 46 so that the periphery of the rotary cup 3 can be exhausted. A plurality of exhaust ports 45 are provided, and can be switched and used in accordance with the type of processing liquid.

  In this way, the processing liquid is guided to the drain cup 41 through the rotating cup, the gas component is guided to the exhaust cup 42 from the introduction port 42b, and the drain liquid from the drain cup 41 and the exhaust from the exhaust cup 42 are exhausted. Is performed independently, it is possible to guide the waste liquid and the exhaust gas in a separated state.

  The exhaust cup 42 is provided with a plurality of air intakes 47 along the circumferential direction on the upper wall thereof, and a plurality of air intakes 48 are provided along the circumferential direction in two upper and lower stages on the inner wall thereof. . The air intake 47 sucks the atmosphere in the upper region of the exhaust cup 42, and the air intake 48 sucks the atmosphere of the mechanism part existing below the rotating plate 11, and removes the gasification component of the staying processing liquid. It can be removed. Further, since the exhaust cup 42 is provided outside the drain cup 41 so as to surround it, the mist leaked from the drain cup 41 can be reliably sucked, and the mist of the processing liquid diffuses to the outside. Is prevented.

  Next, the operation of the liquid processing apparatus 100 configured as described above will be described with reference to FIG. First, as shown in FIG. 5A, the wafer W is delivered from the transfer arm (not shown) onto the support pins of the wafer support base 18 with the back surface treatment liquid supply nozzle 5 raised. Next, as shown in FIG. 5B, the back surface treatment liquid supply nozzle 5 is lowered to a position where the wafer W can be held by the holding member 13, and the wafer W is chucked by the holding member 13. Then, as shown in FIG. 5C, the surface treatment liquid supply nozzle 4 is moved from the retracted position to the ejection position on the center of the wafer W.

  In this state, as shown in FIG. 5 (d), the motor 2 rotates the holding member 1 together with the rotary cup 3 and the wafer W while performing predetermined processing from the surface treatment liquid supply nozzle 4 and the back surface treatment liquid supply nozzle 5. The liquid is supplied to perform the cleaning process.

  In this cleaning process, a processing liquid is supplied to the center of the front and back surfaces of the wafer W, and the cleaning liquid spreads outside the wafer W by centrifugal force and is shaken off from the periphery of the wafer W. In this case, since the cup provided so as to surround the outside of the wafer W is the rotating cup 3 that rotates together with the wafer W, as shown in FIG. Since the centrifugal force acts on the processing liquid when it hits 31 and the liquid film 37 is formed around the discharge holes 33 and 34 of the vertical wall member 31, scattering (misting) as in the case of the fixed cup occurs. hard. Then, the processing liquid that has reached the vertical wall member 31 is discharged to the outside of the rotary cup 3 from the discharge holes 33 and 34 by centrifugal force. Therefore, it is possible to prevent the processing liquid that has been mist from hitting the cup as in the case of providing the fixed cup from returning to the wafer W. When the supply of the processing liquid is stopped, the processing liquid accumulated around the discharge holes 33 and 34 of the vertical wall member 31 as the liquid film 37 is also discharged from the discharge holes 33 and 34, and the processing liquid is put into the rotary cup 3. It is assumed that it does not exist.

  In addition, since the presence of the rotating cup 3 in this way, even if mist is generated in the drain cup 41, there is substantially no possibility that the mist will contaminate the wafer W. Therefore, the drain cup 41 can be drained. Even if the exhaust cup 42 is provided so as to surround the periphery thereof, the apparatus can be reduced in size, and the footprint of the apparatus can be reduced. Since the exhaust cup 42 is provided outside the drain cup 41 so as to surround the drain cup 41 as described above, the drain is provided in the vertical wall member 31 of the rotary cup 3 as described above. , 34 is taken into the drainage cup 41, while the gas component existing in and around the rotary cup 3 is taken into the exhaust cup 42 from the annular inlet 42b, and the drainage / exhaust separation takes place at the base portion. Moreover, since the drainage from the drainage cup 41 and the exhaustion from the exhaust cup 42 are performed independently, a mechanism for separating the exhaust and drainage is provided on the downstream side. There is no need. In addition, since the exhaust cup 42 is provided so as to surround the drainage cup 41, even if the mist of the processing liquid leaks from the drainage cup 41, it can be trapped by the exhaust cup 42, and the processing liquid is discharged to the outside of the apparatus. It is possible to prevent the mist from being scattered and having an adverse effect.

  Further, since the guide member 35 is provided so that the front and back surfaces are substantially continuous with the front and back surfaces of the wafer W, the processing liquid spun off from the periphery on the front and back surfaces of the wafer W by centrifugal force is in a laminar flow state. Are guided to the vertical wall member 31 and discharged to the outside through the discharge holes 33 and 34. Therefore, mist formation of the processing liquid at the time when the processing liquid is shaken off from the wafer W can be extremely effectively suppressed.

Next, a liquid processing apparatus according to a second embodiment of the present invention will be described.
FIG. 7 is an enlarged cross-sectional view showing a main part of the liquid processing apparatus according to the second embodiment of the present invention. In the present embodiment, the structures of the guide member, the rotating cup, and the exhaust / drainage part are different from those of the first embodiment. Hereinafter, although these different parts are mainly demonstrated, other parts other than the part demonstrated below are comprised similarly to 1st Embodiment.

  In the present embodiment, unlike the first embodiment, a rotating cup 3 ′ having a structure for guiding the drainage downward is used instead of the rotating cup 3. Instead of the guide member 35, a guide member 35 'having a structure in which the back surface is inclined downward from the inside toward the outside is used. Further, due to the difference in structure, a drainage cup 41 ′ slightly different in structure from the drainage cup 41 is used. Further, an exhaust cup 42 'having a structure different from that of the exhaust cup 42 is used in order to easily guide the exhaust to an exhaust pipe (not shown).

  Specifically, the rotating cup 3 ′ prevents the processing liquid spattered from the wafer W from scattering and guides the processing liquid downward, between the heel member 51 and the guide member 35 ′, and the guide. Between the member 35 ′ and the rotating plate 11, a plurality of spacer members 55 and 56 for forming a plurality of slits 53 and 54 through which the processing liquid passes are provided. The flange member 51, the spacer member 55, the guide member 35 ', the spacer member 56, and the rotating plate 11 are integrally fixed by screwing or the like, and these are rotated integrally. A plurality of slits 53 and 54 are arranged along the circumferential direction, and a plurality of spacer members 55 and 56 are arranged along the circumferential direction in order to form the plurality of slits 53 and 54. Instead of such a spacer member, a plate in which holes are formed as in the first embodiment may be used.

  The flange 51 has an inner wall that curves downward from the inside toward the outside, and a lower end that extends below the rotating plate 11. An annular opening 57 is formed downward at the lower end of the rotary plate 11, that is, at the lower end of the rotary cup 3 ′, so that the drainage is discharged downward. . A drainage cup 41 ′ is disposed so as to receive the opening 57, that is, so as to surround the opening 57. Thus, by extending the lower end of the flange member 51 to the lower side of the rotary plate 11, the liquid discharge portion from the rotary cup 3 'can be moved away from the wafer, and the return of mist can be reduced. From this point of view, it is preferable that the position of the lower end of the flange member 51 extends as far as possible from the wafer W as far as possible. The drainage cup 41 'is different from the drainage cup 41 only in the configuration of the drainage receiving portion, and the other configuration is almost the same as the drainage cup 41, and a drainage port 43 is provided to drain the liquid there. The same is true in that the tube 44 is connected.

  The outer surface of the flange member 51 is inclined downward from the tip toward the outer peripheral side, and a curved line directed downward is formed continuously with the inclination. The exhaust cup 42 ′ has an upper wall 42 a ′ that is inclined downward toward the outer peripheral side corresponding to the inclination of the flange member 51, and a curve is formed continuously downward from the inclined portion. Yes. This makes it easy to guide the gas sucked from the opening 42b ′ formed between the upper wall 42a ′ and the flange member 51 to the exhaust pipe (not shown).

In the liquid processing apparatus configured as described above, as in the first embodiment, the front surface processing liquid supply nozzle 4 and the back surface processing liquid supply are performed while the holding member 1 is rotated together with the rotating cup 3 ′ and the wafer W by the motor 2. A predetermined processing solution is supplied from the nozzle 5 to perform a cleaning process. At this time, the processing liquid shaken off from the periphery on the front and back surfaces of the wafer W is guided along the front and back surfaces of the guide member 35 ′ and passes through the slits 53 and 54, respectively. Then, the liquid is guided downward, discharged downward from an annular opening 57 formed in the lower end portion of the rotating cup 3 ', and taken into the drain cup 41'. In this case, in this embodiment, since the processing liquid is guided from the lower end of the rotating cup 3 ′ to the lower draining cup 41 ′, even if the processing liquid is misted by the draining cup 41 ′, the position thereof is the wafer W. Are greatly separated and the height position is also different, so that the influence of mist on the wafer W can be reduced.
Accordingly, similarly to the first embodiment, the drainage cup 41 'can be made small, and even if the exhaust cup 42' is provided so as to surround the periphery thereof, the apparatus can be made compact. The footprint of the device can be reduced. In addition, by providing the exhaust cup 42 'so as to surround the drain cup 41' in this way, the drain and exhaust separation can be performed at the base as in the first embodiment. Since the drainage from the liquid cup 41 ′ and the exhaustion from the exhaust cup 42 ′ can be performed independently, there is no need to provide a mechanism for separating the exhaust and drainage downstream, and the mist of the processing liquid Even if the liquid leaks out from the drainage cup 41 ', it can be trapped by the exhaust cup 42', and the mist of the processing liquid can be prevented from being scattered outside the apparatus and adversely affecting it.

  The present invention can be variously modified without being limited to the above embodiment. For example, the guide member is provided to prevent the generation of mist due to turbulent flow, but it is not always necessary. In the above embodiment, the liquid processing apparatus for cleaning the front and back surfaces of the wafer is shown as an example. However, the present invention is not limited to this, and may be a liquid processing apparatus for performing a surface cleaning process. The process is not limited to the cleaning process, and other liquid processes such as a resist liquid coating process and a subsequent development process may be used. In the above embodiment, the case where a semiconductor wafer is used as the substrate to be processed has been described. However, other substrates such as a flat panel display (FPD) substrate represented by a glass substrate for a liquid crystal display device (LCD) are used. Needless to say, it is applicable.

  The present invention is effective for a cleaning apparatus for removing particles and contamination adhering to a semiconductor wafer.

1 is a cross-sectional view showing a schematic configuration of a liquid processing apparatus according to a first embodiment of the present invention. 1 is a schematic plan view showing a liquid processing apparatus according to a first embodiment of the present invention with a part cut away. Sectional drawing which expands and shows the exhaust_gas | exhaustion / drainage part of the liquid processing apparatus of FIG. Sectional drawing which expands and shows the exhaust_gas | exhaustion / drainage part of the liquid processing apparatus of FIG. The figure for demonstrating the processing operation of the liquid processing apparatus which concerns on the 1st Embodiment of this invention. The figure for demonstrating the state of the processing liquid shaken off from the wafer. Sectional drawing which expands and shows the principal part of the liquid processing apparatus which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Wafer holding part 2; Rotary motor 3, 3 '; Rotary cup 4; Surface treatment liquid supply nozzle 5; Back surface treatment liquid supply nozzle 6; Exhaust / drainage part 8; Casing 9;
11; rotating plate 12; rotating shaft 13; holding member 31; vertical wall member 32, 51; eaves member 33, 34; discharge hole 35, 35 '; guide member 41, 41'; drainage cup 42, 42 '; Cup 42b; introduction port 43; drainage port 44; drainage tube 45; exhaust port 46; exhaust tube 57; opening 100; liquid processing apparatus W;

Claims (7)

A substrate holding unit that holds the substrate horizontally and can rotate with the substrate;
A rotating cup that surrounds the substrate held by the substrate holding unit and is rotatable together with the substrate;
A rotation mechanism for integrally rotating the rotary cup and the substrate holding part;
A liquid supply mechanism for supplying a processing liquid to the substrate;
An exhaust / drainage unit for exhausting and draining the rotating cup;
The exhaust / drainage part is provided so as to surround the drainage cup outside the drainage cup and an annular drainage cup that mainly takes in and drains the processing liquid shaken off from the substrate. The rotary cup and an exhaust cup that mainly takes in and exhausts gas components from the periphery thereof, and the drainage from the drainage cup and the exhaust from the exhaust cup are performed independently. Liquid processing equipment. A substrate holding unit that holds the substrate horizontally and can rotate with the substrate;
A rotating cup that surrounds the substrate held by the substrate holding unit and is rotatable together with the substrate;
A rotation mechanism for integrally rotating the rotary cup and the substrate holding part;
A surface liquid supply mechanism for supplying a treatment liquid to the surface of the substrate;
A back surface liquid supply mechanism for supplying a processing liquid to the back surface of the substrate;
An exhaust / drainage unit for exhausting and draining the rotating cup;
The exhaust / drainage part is provided so as to surround the drainage cup outside the drainage cup and an annular drainage cup that mainly takes in and drains the processing liquid shaken off from the substrate. The rotary cup and an exhaust cup that mainly takes in and exhausts gas components from the periphery thereof, and the drainage from the drainage cup and the exhaust from the exhaust cup are performed independently. Liquid processing equipment.   A guide member is further provided outside the substrate on the holding member so as to rotate together with the holding member and the rotary cup, and guides the processing liquid shaken off from the substrate to the outside of the substrate. The liquid processing apparatus according to claim 1 or 2.   The rotating cup has a processing liquid discharge part that discharges the processing liquid shaken off from the substrate in the horizontal direction, and the draining cup is provided so as to surround the outer side of the rotating cup, and is arranged in the horizontal direction. The liquid processing apparatus according to any one of claims 1 to 3, wherein the discharged liquid is received.   The rotating cup has a guide wall for taking in the processing liquid shaken off from the substrate and guiding it downward, and an opening for discharging the taken processing liquid downward, and the draining cup has the opening. The liquid processing apparatus according to any one of claims 1 to 3, wherein the liquid processing apparatus is provided so as to surround the liquid and receives a drained liquid discharged downward.   The liquid processing apparatus according to claim 1, wherein the exhaust cup is disposed so that an annular introduction port is formed above the rotary cup.   The liquid processing apparatus according to claim 1, wherein the exhaust cup has an intake port that takes in an ambient atmosphere into a wall portion.

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