JP4803329B1 - Contact and manufacturing method thereof - Google Patents

Abstract

A highly durable and low cost contact and a method of manufacturing the contact are provided.
The number of repeated fractures of a contact used for a battery connector was experimentally investigated. A contact having a plate width of 0.1 mm or more and 1 mm or less was used. When the number of repeated fractures was examined using samples having a surface roughness Ra of 0.040 μm, 0.080 μm, 0.120 μm and 0.180 μm, the smaller the surface roughness Ra, the greater the number of repeated fractures. In particular, it was found that the surface roughness Ra should be 0.200 μm or less in order to satisfy the operation frequency of 3000 times for the battery connector. Further, if the safety factor is set to 2 and the operation frequency of 6000 is to be satisfied, the surface roughness Ra may be 0.080 μm or less.
[Selection] Figure 7

Description

  The present invention relates to a contact and a manufacturing method thereof. For example, it relates to a contact that is incorporated into a housing to form a connector, and to a method for manufacturing the contact.

  In order to connect a flexible printed board or the like, a small connector mounted on a wiring board is used. In many cases, a metal plate having a thickness of about 100 μm is used as a contact used in this connector.

  As a method for manufacturing the contact as described above, a method of punching a thin metal plate by a press is general. In the manufacturing method by pressing, for example, as shown in FIG. 1 (A), a thin metal plate 11 is placed on a pressing die 12, the press die 14 is lowered from above the die 12, and FIG. As shown, the metal plate 11 is sheared and broken by the punching hole 13 of the die 12 and the press die 14 to manufacture the contact 15. In the contact 15 punched by press working in this way, fine irregularities are formed on the punched surface. FIG. 2 shows a cut surface (micrograph) of the metal plate punched out by the press. As shown in FIG. 2, the cut surface of the metal plate punched by press working has a sagging surface D <b> 1 having a smooth round shape in order from the upper surface side to the lower side, and has glossy and vertical stripes. A shearing surface D2, a fractured surface D3 from which a metal material has been peeled off, and a return surface D4 with burrs are formed. In particular, in this cut surface, the shear surface indicated by D2 in FIG. 2 has the largest unevenness of the height difference and protrudes highest from the surface. 2 is upside down with respect to FIG. 1 and FIG.

  FIGS. 3A to 3D show the mechanism by which the cut surface as shown in FIG. 2 is formed on the metal plate. As shown in FIG. 3A, when the press die 14 is lowered, the lower surface of the press die 14 contacts the metal plate 11 and pushes the metal plate 11 downward. When the press die 14 lowers the metal plate 11, as shown in FIG. 13B, sagging (D 1) is generated on the blade surface side of the press die 14 and the blade side surface side of the die 12 in the metal plate 11. . When the press die 14 is further lowered, the metal plate 11 is subjected to a shear stress by the press die 14 and the die 12, and a shear surface (D2) is generated following the sag (D1). When the press die 14 is further lowered, cracks 16 are generated in the metal plate 11 from the blade edge of the press die 14 and the blade edge of the die 12 as shown in FIG. At this time, the blade side surface of the press die 14 and the blade side surface of the die 12 become shear surfaces, and the crack 16 becomes a fracture surface (D3). Next, as shown in FIG. 3D, the crack 16 on the press die 14 side and the crack 16 on the die 12 side are connected, and punching is completed. Therefore, the punching process is completed when the press die 14 is about 2/3 in the metal plate 11. In order to connect the crack 16 on the press die 14 side and the crack 16 on the die 12 side, an appropriate gap is required between the side surface of the press die 14 and the side surface of the punching hole 13. Although this gap is called clearance, a burr (D4) is generated at the end of the contact 15 due to the clearance.

  When the contact is repeatedly operated for a long time, the contact suddenly breaks. This is called fatigue failure. Fatigue fracture has several factors, but when a plate such as a contact is subjected to repeated loads, the maximum stress is generated on the surface of the plate, and the stress concentration in the recess due to the surface roughness causes fatigue fracture. One of the main factors.

  When the contact is manufactured by press working, this cut surface becomes the outer peripheral surface of the contact. When the contact point of the contact is brought into pressure contact with the counterpart electrode part, the contact spring part (elastic deformation part) is bent by the reaction force. In particular, if the contact pressure is increased, the bending moment applied to the spring portion also increases accordingly. For this reason, a large load is applied to the contact part and the spring part. However, if the surface of the contact part or the spring part is a cut surface during pressing, stress concentration occurs on the unevenness of the shear surface, and the contact There is a problem of reducing the number of times of repeated fracture.

  In particular, as the connector becomes lighter and shorter, the contacts are also downsized. Therefore, the dimensional ratio of the unevenness with respect to the component cross-sectional area of the maximum stress portion in the contact also increases, and the contact easily breaks.

JP 2010-86878 A

  The present invention has been made in view of the technical problems as described above, and an object of the present invention is to provide a contact having a high durability and a low cost, and a manufacturing method thereof.

A first manufacturing method of a contact according to the present invention is a method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less , Forming a resist film on the electrode plate; exposing and developing the resist film to open a cavity; forming a contact in the cavity by electroforming; and separating the resist film And a step of etching or polishing the surface of the contact so that the surface roughness Ra is 0.2 μm or less. If the contact surface roughness Ra is 0.2 μm or less, the contact is less likely to break due to stress concentration, and the battery connector can be operated more than 3,000 times. Moreover, if the plate width of the contact is 0.1 mm or more and 1 mm or less, the durability is almost the same and the quality can be stabilized. According to the first manufacturing method of the contact, after the contact is produced by photolithography and electroforming, the surface roughness Ra can be easily obtained by etching (chemical polishing) or polishing (buff polishing, electrolytic polishing, etc.). Can be small.

A second method for manufacturing a contact according to the present invention is a method for manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less . Adhering and attaching a dry film resist on the electrode plate, opening a cavity by exposing and developing the dry film resist while leaving a protective film on the surface of the dry film resist, and the cavity And a step of forming a contact by electroforming, and a step of etching or polishing the surface of the contact separated from the dry film resist so that the surface roughness Ra is 0.2 μm or less. It is said. If the contact surface roughness Ra is 0.2 μm or less, the contact is less likely to break due to stress concentration, and the battery connector can be operated more than 3,000 times. Moreover, if the plate width of the contact is 0.1 mm or more and 1 mm or less, the durability is almost the same and the quality can be stabilized. Then, when exposure and development is performed with the protective film remaining on the dry film resist by the second manufacturing method of the contact, unevenness is generated on the surface of the contact, but etching (chemical polishing) or polishing (buff polishing, electrolytic polishing, etc.) ) Can reduce the contact surface roughness Ra.

A third method for manufacturing a contact according to the present invention is a method for manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less . A step of forming a resist film by applying a resist solution on the electrode plate; a step of opening a cavity in the resist film by a LIGA process; and a step of forming a contact in the cavity by electroforming. It is characterized by that. If the contact surface roughness Ra is 0.2 μm or less, the contact is less likely to break due to stress concentration, and the battery connector can be operated more than 3,000 times. Moreover, if the plate width of the contact is 0.1 mm or more and 1 mm or less, the durability is almost the same and the quality can be stabilized. According to the LIGA process in the third manufacturing method of such a contact, since the wall surface of the cavity can be formed smoothly, a contact with a small surface roughness Ra can be manufactured without performing etching or polishing in a subsequent process. can do.

A fourth method for producing a contact according to the present invention is a method for producing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less , A step of forming a resist film by applying a resist solution on the electrode plate, a step of opening a cavity in the resist film by a UV-LIGA process, and a step of forming a contact in the cavity by electroforming It is characterized by having prepared. If the contact surface roughness Ra is 0.2 μm or less, the contact is less likely to break due to stress concentration, and the battery connector can be operated more than 3,000 times. Moreover, if the plate width of the contact is 0.1 mm or more and 1 mm or less, the durability is almost the same and the quality can be stabilized. According to the fourth manufacturing method of the contact , according to the UV-LIGA process, the wall surface of the cavity can be formed smoothly, so that the contact having a small surface roughness Ra can be performed without performing etching or polishing in a subsequent process. Can be manufactured.

A fifth manufacturing method of a contact according to the present invention is a method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less , Adhering and attaching a dry film resist on the electrode plate, removing the protective film on the surface to expose the photosensitive layer, and exposing and developing the photosensitive layer in a non-oxygen atmosphere to open the cavity And a step of forming a contact in the cavity by electroforming. If the contact surface roughness Ra is 0.2 μm or less, the contact is less likely to break due to stress concentration, and the battery connector can be operated more than 3,000 times. Moreover, if the plate width of the contact is 0.1 mm or more and 1 mm or less, the durability is almost the same and the quality can be stabilized. Then, in the fifth manufacturing method of such a contact, if the dry film resist is adhered and pasted, and the protective film on the surface is removed and exposed, the wall surface of the cavity can be formed smoothly. A contact having a small surface roughness Ra can be produced without polishing. However, if the protective film is removed, oxygen inhibition occurs depending on the photosensitive layer, and exposure development is performed in a non-oxygen atmosphere to prevent this.

  The means for solving the above-described problems in the present invention has a feature in which the above-described constituent elements are appropriately combined, and the present invention enables many variations by combining such constituent elements. .

FIG. 1A and FIG. 1B are schematic views for explaining a contact manufacturing method using a press. FIG. 2 shows a cross section of a metal part stamped out by a press. FIG. 3A to FIG. 3D are diagrams for explaining a mechanism in which a cut surface is generated in a metal plate. FIG. 4 is a perspective view of the connector contact according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view of a connector incorporating the contact of FIG. FIG. 6 is a cross-sectional view of the battery connector. FIG. 7 is a diagram showing the relationship between the surface roughness Ra and the number of repeated fractures. FIG. 8 is a diagram illustrating the relationship between the contact plate width w and the number of repeated breaks. FIGS. 9A to 9D are schematic diagrams for explaining a contact manufacturing method 1. FIGS. 10A to 10G are schematic diagrams for explaining a contact manufacturing method 4.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments, and various design changes can be made without departing from the gist of the present invention.

(Contact for connector)
The connector contact will be described with reference to FIGS. FIG. 4 is a perspective view of the connector contact 31 (connector connection terminal). FIG. 5 is a cross-sectional view of a connector 41 incorporating this contact 31.

  As shown in FIG. 4, in the contact 31, the fixed piece 32 and the movable piece 33 are arranged substantially in parallel, and the upper surface of the substantially central portion of the fixed piece 32 and the lower surface of the substantially central portion of the movable piece 33 are substantially in contact with both pieces 32 and 33. It is a shape connected by a vertical connecting portion 34. A movable contact 35 having a triangular protrusion shape is provided on the lower surface of the distal end portion of the movable piece 33, and the rear end portion of the movable piece 33 serves as an operation receiving portion 36 for tilting the movable piece 33 by the cam portion. Yes. A groove 37 and a retaining projection 38 are provided on the upper surface of the fixed piece 32 at a position facing the movable contact 35.

  As shown in FIG. 5, the contact 31 is incorporated in the housing 42 of the connector 41. The contact 31 is fixed by press-fitting the fixing piece 32 into the insertion hole 43 of the housing 42. A cam portion 44 for pushing up the operation receiving portion 36 is located between the upper surface of the rear end portion of the fixed piece 32 and the lower surface of the operation receiving portion 36. The cam portion 44 is formed integrally with the operation lever 45, and the cam portion 44 rotates by raising or lowering the operation lever 45. In the state where the operation lever 45 is raised, the cam portion 44 falls to the side and does not exert a force on the operation receiving portion 36. Therefore, at this time, the gap between the movable contact 35 and the fixed piece 32 is wide, and the end portion of the flexible printed circuit board 46 can be inserted into and removed from the gap between the movable contact 35 and the fixed piece 32.

  When the operation lever 45 is standing and the gap between the movable contact 35 and the fixed piece 32 is wide, the end of the flexible printed board 46 is inserted into this gap, and the operation lever 45 is tilted, the flexible printed board 46. Is connected to the connector 41. That is, when the end of the flexible printed circuit board 46 is inserted into the gap and the operation lever 45 is tilted, the cam portion 44 is rotated thereby, and the cam portion 44 becomes vertical. As a result, the operation receiving portion 36 is pushed up by the cam portion 44, the movable piece 33 is tilted, and the movable contact 35 is lowered downward. Then, the movable contact 35 is pressed against an electrode portion (not shown) of the flexible printed circuit board 46, and the flexible printed circuit board 46 is gripped while being bent between the movable contact 35, the groove portion 37, and the retaining projection 38. Is prevented from coming off.

(Battery connector)
Next, a connector for charging the battery by making contact with an electrode pad of a battery used in, for example, a portable electronic device will be described. FIG. 6 is a cross-sectional view of the battery connector 51.

  As shown in FIG. 6, the connector 51 includes a plurality of contacts 53 housed in a connector housing 52 and a part of the contacts 53 protruding from the front surface of the connector housing 52.

  The contact 53 includes a fixed portion 54, an elastic portion 55, a contact portion 56, and a latching portion 57. The fixing portion 54 of the contact 53 extends along the inner surface of the connector housing 52, and the lower end portion is fixed to the connector housing 52.

  The elastic portion 55 of the contact 53 has a substantially S shape, so that the contact 53 can generate a sufficient urging force in the front-rear direction.

  The contact portion 56 of the contact 53 is curved backward from the front end of the elastic portion 55 in a substantially U shape or arc shape.

  The latching portion 57 of the contact 53 is formed by folding back further downward from the end portion of the contact portion 56, and the latching portion 57 is latched on a contact support portion 58 provided in the opening of the connector housing 52. Has been.

  The connector 51 is in contact with a battery 59 for portable devices. That is, when the battery 59 is pressed against the connector 51, the contact portion 56 comes into contact with the electrode portion 60 of the battery 59 and bends, and a charging current is supplied from the connector 51 to the battery 59.

(Contact surface roughness)
Taking such a contact for a battery connector as an example, the relationship between the surface roughness Ra (surface roughness Ra on the outer peripheral surface perpendicular to both side surfaces) and the number of repeated fractures was examined. Here, the surface roughness (arithmetic average roughness) Ra is defined as follows. When considering the surface shape of a certain cross section, the y-axis is taken in the direction perpendicular to the surface (height direction), the x-axis is taken in the direction parallel to the surface, and the surface shape is represented by a roughness curve y = f (x) It expresses by. However, the x-axis is determined so as to coincide with the average line. That is, the origin in the height direction (the position where y = 0) is determined so as to satisfy the following formula 1 in the region where the surface roughness is considered (from x = 0 to x = L). And what expressed the value calculated | required by following Numerical formula 2 in the said area [0, L] in a micrometer unit is called average roughness Ra.

  FIG. 7 shows the relationship between the surface roughness Ra obtained by experiments and the number of repeated fractures. In this experiment, a contact for a battery connector as shown in FIG. 6 having a plate thickness of 250 μm made of a Ni-based alloy was used. Then, four types of samples having surface roughness Ra of 0.040 μm, 0.080 μm, 0.120 μm and 0.180 μm were produced. For each surface roughness sample, 6 types of samples with a surface roughness Ra = 0.040 μm and one type of sample with a surface roughness Ra = 0.080 μm within a plate width range of 0.1-1.0 mm. One sample having a surface roughness Ra = 0.120 μm and seven samples having a surface roughness Ra = 0.180 μm were prepared. Then, a load was applied so that the maximum stress was 1000 MPa (spring limit value), the contact was repeatedly elastically deformed, and the number of times until the contact was broken was measured. The individual data measured in this way are indicated by black circles in FIG. Since the repeated fracture test is a test method with large variations, the minimum value was taken as the number of repeated fracture tests. A straight line K in FIG. 7 shows the relationship between the surface roughness Ra and the number of repeated fractures.

  As shown in FIGS. 6 and 4, the contact thickness T is the thickness of the contact in the direction perpendicular to the surface when the contact is deformed (when the contact is stamped by a press). If so, the thickness of the metal plate as the material), and the plate width w is the width of the contact in the plane.

  According to FIG. 7, in order to satisfy the battery connector operation frequency of 3,000, the contact surface roughness Ra needs to be 0.2 μm or less. In addition, in order to satisfy the 6,000 times of repeated breaking, which is approximately twice the safety factor of the battery connector operation frequency, the contact surface roughness Ra should be 0.1 μm or less, preferably 0.08 μm or less. It is necessary to.

  On the other hand, as will be described later, the surface roughness Ra can be reduced to 0.04 μm or less by the method of reducing the unevenness of the contact surface by etching. However, it takes time to completely remove the unevenness by etching, and when the etching is performed until the surface roughness Ra becomes 0.04 μm or less, the plate width w and the plate thickness T necessary for maintaining the function as a contact are small. So it is not realistic. Accordingly, the surface roughness Ra of the contact is desirably 0.04 μm or more.

  FIG. 8 shows the relationship between the contact width w and the number of repeated breaks. Also in this measurement, a contact for a battery connector as shown in FIG. 6 having a plate thickness of 250 μm made of a Ni-based alloy was used. Samples with different plate widths w were produced one by one in the range of plate widths w of 0.1 to 1.0 mm. The surface roughness of each sample was set to Ra = 0.18 μm so that the influence appears remarkably. Then, a load was applied so that the maximum stress was 1000 MPa (spring limit value), the contact was repeatedly elastically deformed, and the number of times until the contact was broken was measured. The individual data measured in this way are indicated by black circles in FIG. According to FIG. 8, there is no significant difference in the number of repeated fractures when the plate width w is in the range of 0.1 mm to 1 mm.

  From the above, in order to achieve the required number of repeated fractures, the contact preferably has a plate width of 0.1 mm or more and 1 mm or less, and its surface roughness (particularly, surface roughness at the stress concentration location) Ra Is preferably 0.04 μm or more and 0.2 μm or less, and particularly preferably the surface roughness Ra is 0.04 μm or more and 0.080 μm or less.

(Contact manufacturing method)
Since there are various methods for producing a contact having the above plate width and surface roughness Ra, these will be described.

[Production Method 1]
The method shown in FIGS. 9A to 9D is a press method. That is, FIG. 9A shows a metal plate 61 having a plate thickness T of about 100 μm. The metal plate 61 is punched into a contact shape as shown in FIG. When the surface roughness Ra of the contact at this stage was measured, the surface roughness Ra of the shearing surface of phosphor bronze was 0.23 μm. Next, the surface of the contact 62 in FIG. 9C was etched, and the surface irregularities were removed and smoothed as shown in FIG. 9D. As the etching solution used at this time, for example, etching solution E-screen S-710 manufactured by Sasaki Chemical Co., Ltd. was used. As a result, a contact 62 having a surface roughness Ra of 0.04 μm or less could be produced. However, if the surface roughness Ra is set to 0.04 μm or less, the plate thickness and the plate width of the contact 62 are considerably reduced. Therefore, it is necessary to set the dimensions to allow for the reduction when punching with a press.

[Production Method 2]
As shown in FIGS. 9A to 9C, after the contact 62 is punched from the metal plate 61, the surface of the contact 62 may be polished so that the surface roughness Ra falls within a predetermined range. As a polishing method, electrolytic polishing or buffing can be used.

[Production Method 3]
After the contact 62 is punched out from the metal plate 61 as shown in FIGS. 9A to 9C, the surface of the contact 62 may be coated with metal. For example, a metal material can be plated on the surface of the contact 62 or vacuum deposited. When the contact 62 having a large surface roughness Ra is coated with a metal, the coated metal is buried in the recess, so that the surface roughness Ra is reduced.

[Production Method 4]
10A to 10G illustrate a method using photolithography and an electroforming method. First, a negative resist is applied to the upper surface of the electrode plate 71 as shown in FIG. 10A, and a resist film 72 is formed as shown in FIG. As shown in FIG. 10C, a photomask 73 is superimposed on the resist film 72 and exposed, and then developed as shown in FIG. 10D. Since the exposed area is insolubilized, the resist film 72 in the area that is covered with the mask and is not exposed is removed, and a contact-shaped cavity 74 is formed at the trace. Thereafter, as shown in FIG. 10E, a metal material is deposited in the cavity 74 using the electrode plate 71 as an electrode, and the contact 75 is formed in the cavity 74. After removing the resist film 72 on the electrode plate 71 as shown in FIG. 10 (F), the contact 75 is released from the electrode plate 71 as shown in FIG. 10 (G). According to such a method, a contact having a surface roughness Ra of 0.2 μm or less or 0.080 μm or less can be directly produced without requiring post-treatment.

  In detail, this method can be further divided into several methods. The first is a method of patterning a resist film by a UV-LIGA process using a resist for thick film such as Su-8 manufactured by Kayaku Microchem Co., Ltd. as a resist. According to this method, a smooth contact having no irregularities on the outer peripheral surface can be produced.

The second method uses a dry film resist. In the dry film resist, a protective film is pasted on the surface of the photosensitive layer. Since this protective film contains a lubricant, when exposed while the protective film is stuck, a streak is formed on the wall surface of the cavity due to the lubricant, and this is transferred to the contact. Therefore, when a dry film resist is used, if the protective film is peeled off and only the photosensitive layer is used as the resist film, a contact with a smooth outer peripheral surface that does not have a streak on the outer peripheral surface can be manufactured. When the photosensitive layer of the dry film resist has a characteristic of causing oxygen inhibition, the protective film may be peeled off from the photosensitive layer, and the exposure may be performed in an oxygen-free environment such as N ₂ atmosphere or in a vacuum atmosphere.

The third method is a method using a LIGA process. In this method, using a polymethylmethacrylate (PMMA) as a resist, irradiated with SR light X-rays instead of ultraviolet radiation at the time of exposure, by transferring the pattern of X-ray absorber on a photomask to the resist film Create metal parts that are not uneven on the wall.

[Production Method 5]
In this manufacturing method, a dry film resist is pasted on the electrode plate 71 in the process of FIG. At this time, the protective film is left on the photosensitive layer (resist film) without removing the protective film of the dry film resist. Next, the contact 75 is manufactured through the photolithography and electroforming processes shown in FIGS. 10C to 10G as in the manufacturing method 4.

  However, since the dry film resist is rolled up in the manufacturing process, particles called a lubricant are mixed in the protective film for the purpose of improving the slipperiness at that time. When a dry film resist is used to form a resist film, the photosensitive layer of the dry film resist has oxygen inhibition characteristics, so that exposure is performed while leaving the protective film so as not to touch oxygen. At the time of exposure, the lubricant causes light scattering, and the light intensity distribution is changed to generate vertical stripes at the boundary between the hardened portion and the uncured portion of the resist film.

  Therefore, in this manufacturing method 5, the surface roughness Ra of the outer peripheral surface of the contact 75 at the stage of FIG. Therefore, in the manufacturing method 5, the contact 75 is etched in the next step of FIG. As an etchant, for example, if an etchant E-screen MY-28 manufactured by Sasaki Chemical Co., Ltd. is used, the contact surface roughness Ra can be reduced to 0.04 μm or less. Alternatively, the surface roughness Ra may be reduced by performing electropolishing or buffing without using etching (chemical polishing).

31, 62, 75 Contact 32 Fixed piece 33 Movable piece 34 Connecting portion 35 Movable contact 41 Connector 42 Housing 51 Connector 52 Connector housing 53 Contact 59 Battery 61 Metal plate 71 Electrode plate 72 Resist film 73 Photomask 74 Cavity

Claims (5)

A method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less ,
Forming a resist film on the electrode plate;
Exposing and developing the resist film to open a cavity;
Forming a contact in the cavity by electroforming;
Etching or polishing the surface of the contact separated from the resist film so that the surface roughness Ra is 0.2 μm or less;
A method of manufacturing a contact comprising: A method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less ,
A process of attaching a dry film resist in close contact with the electrode plate; and
A step of exposing and developing the dry film resist while leaving a protective film on the surface of the dry film resist to open a cavity; and
Forming a contact in the cavity by electroforming;
Etching or polishing the surface of the contact separated from the dry film resist so that the surface roughness Ra is 0.2 μm or less;
A method of manufacturing a contact comprising: A method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less ,
Applying a resist solution on the electrode plate to form a resist film;
Opening a cavity in the resist film by a LIGA process;
Forming a contact in the cavity by electroforming;
A method of manufacturing a contact comprising: A method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less ,
Applying a resist solution on the electrode plate to form a resist film;
Opening a cavity in the resist film by a UV-LIGA process;
Forming a contact in the cavity by electroforming;
A method of manufacturing a contact comprising: A method of manufacturing a contact having a plate width of 0.1 mm or more and 1 mm or less and a surface roughness Ra at a stress concentration location of 0.2 μm or less ,
Adhering and attaching a dry film resist on the electrode plate, removing the protective film on the surface and exposing the photosensitive layer;
Exposing and developing the photosensitive layer in a non-oxygen atmosphere to open a cavity;
Forming a contact in the cavity by electroforming;
A method of manufacturing a contact comprising:

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