JP4893836B2 - 一液性エポキシ樹脂組成物およびその利用 - Google Patents
一液性エポキシ樹脂組成物およびその利用 Download PDFInfo
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- JP4893836B2 JP4893836B2 JP2010018345A JP2010018345A JP4893836B2 JP 4893836 B2 JP4893836 B2 JP 4893836B2 JP 2010018345 A JP2010018345 A JP 2010018345A JP 2010018345 A JP2010018345 A JP 2010018345A JP 4893836 B2 JP4893836 B2 JP 4893836B2
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- 239000011256 inorganic filler Substances 0.000 claims description 69
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 69
- 125000001931 aliphatic group Chemical group 0.000 claims description 40
- 229920000768 polyamine Polymers 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 34
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- 239000002245 particle Substances 0.000 claims description 25
- -1 cyclic amine compound Chemical class 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 10
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
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- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 6
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Images
Classifications
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- H—ELECTRICITY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明に係る一液性エポキシ樹脂組成物は、(A)エポキシ樹脂と、(B)変性脂肪族ポリアミン化合物と、(C)長鎖炭化水素基含有化合物で処理された無機充填剤とを主成分として含有するものである。
本発明の一液性エポキシ樹脂組成物に含有される(A)エポキシ樹脂は、室温付近(例えば、25℃)において液状であるエポキシ樹脂であることが好ましい。かかるエポキシ樹脂としては、従来公知の一液性エポキシ樹脂組成物において使用される各種エポキシ樹脂を用いることができ、例えば、ベンゼン環、ナフタレン環等の芳香族環、または、水添ベンゼン環等の水添芳香族環に、2個以上のエポキシ基が末端に結合した化合物が挙げられる。
本発明の一液性エポキシ樹脂組成物に含有される変性脂肪族ポリアミン化合物は、室温付近ではエポキシ樹脂との混合系中で安定であり、且つ、80℃以上120℃以下で熱処理することにより、高い熱変形温度を示す硬化物が得られる硬化剤として機能する化合物であることが好ましい。また、上記変性脂肪族ポリアミン化合物は、室温付近では、液状の一般エポキシ樹脂には不溶性の固体であるが、加熱することにより可溶化し本来の機能を発揮する化合物であることが好ましい。
本発明の一液性エポキシ樹脂組成物に含有される上記(C)長鎖炭化水素基含有化合物で処理された無機充填剤は、長鎖炭化水素基含有化合物を用いて無機充填剤を表面処理したものである。
本発明に係る一液性エポキシ樹脂組成物は、(A)エポキシ樹脂と、(B)変性脂肪族ポリアミン化合物と、(C)長鎖炭化水素基含有化合物で処理された無機充填剤とを主成分として含有するものであれば、各成分の含有割合は特に限定されるものではないが、上記(A)の含有量を100重量部としたときに、上記(B)の含有量と上記(C)の含有量との合計が7重量部以上25重量部以下であることがより好ましい。上記(A)の含有量を100重量部としたときに、上記(B)の含有量と上記(C)の含有量との合計が上記範囲内であることにより、粘度と流れ込み性に関してより貯蔵安定性に優れた一液性エポキシ樹脂組成物を実現することができる。
本発明に係る一液性エポキシ樹脂組成物は、(A)エポキシ樹脂と、(B)変性脂肪族ポリアミン化合物と、(C)長鎖炭化水素基含有化合物で処理された無機充填剤とを主成分として含有するものであれば、本発明の効果に好ましくない影響を及ぼさない範囲でその他の成分を含んでいてもよい。
本発明に係る一液性エポキシ樹脂組成物は、(A)エポキシ樹脂と、(B)変性脂肪族ポリアミン化合物と、(C)長鎖炭化水素基含有化合物で処理された無機充填剤とを主成分として含有するものであれば、その製造方法は特に限定されるものではなく、一液性エポキシ樹脂組成物の一般的な方法を適宜用いればよい。かかる方法としては、例えばニーダーやミキシングロール等の従来公知の装置を用いて(A)エポキシ樹脂と、(B)変性脂肪族ポリアミン化合物と、(C)長鎖炭化水素基含有化合物で処理された無機充填剤とを混合する方法、攪拌する方法等を挙げることができる。
本発明に係る一液性エポキシ樹脂組成物は、粘度のみではなく、流れ込み性に関しても貯蔵安定性に優れた一液性エポキシ樹脂組成物であるため、電子部品、電気部品等の部品、或いは、電子部品又は電気部品を封止する封止方法に利用することができる。それゆえ、かかる部品や封止方法も本発明に含まれる。
本発明に係る部品は、電子部品又は電気部品であって、上述した一液性エポキシ樹脂組成物によって、少なくとも2つの部材が接着されているものであればよい。
本発明に係る封止方法は、上述した一液性エポキシ樹脂組成物によって、少なくとも2つの部材を接着させることにより、電子部品又は電気部品を封止する工程を含んでいればよい。
調製した直後の一液性エポキシ樹脂組成物を、回転粘度計(E型粘度計、RE215型、東機産業(株)社製)で測定して初期粘度とした。一液性エポキシ樹脂組成物を所定温度(40℃)の恒温槽で1ヶ月保管した後、同様にして粘度を測定し、初期粘度に対する変化率を評価した。変化率が150%未満の場合「◎」、150%以上200%未満の場合「○」、200%以上の場合「×」とした。
寸法が26mm×76mm×0.9mmのB270ガラス(白板ガラス、松浪硝子工業(株)社製)を垂直に取り付け具に固定した。調製した直後の一液性エポキシ樹脂組成物を、ディスペンサーを用いてガラス板上部に約30mg滴下し、ガラス板を100℃のオーブン中で1時間加熱した。一液性エポキシ樹脂組成物が流動した跡の上端から下端までの長さをノギスで計測して初期タレ長さとした。一液性エポキシ樹脂組成物を所定温度(40℃)の恒温槽で1ヶ月保管した後、同様にしてタレ長さを測定し、初期タレ長さに対する変化率を評価した。変化率が150%未満の場合「◎」、150%以上200%未満の場合「○」、200%以上の場合「×」とした。
エポキシ樹脂としてビスフェノールAジグリシジルエーテルを用い、ビスフェノールAジグリシジルエーテル100重量部に対して、変性脂肪族ポリアミン化合物(商品名:フジキュアFXE−1000、富士化成工業(株)製)20重量部を加え、長鎖炭化水素基含有化合物で処理された無機充填剤として平均粒子径が10〜50nmで主鎖の炭素数8〜20個の長鎖炭化水素基を含有する化合物で処理したシリカ0.5重量部を混合した後、ミキシングロールを使って混練し、一液性エポキシ樹脂組成物を調製した。なお、長鎖炭化水素基含有化合物で処理された無機充填剤は、シリカに、オクタデシルトリエトキシシランを触媒ジエチルアミンと共に溶剤ヘキサンに溶解したものをスプレーし、200℃に加熱して得られたものである。
表1または表2に記載された成分及び仕込み量で混合を行ったこと以外は、実施例1と同様にして一液性エポキシ樹脂組成物をそれぞれ調製し、得られた一液性エポキシ樹脂組成物について、粘度とタレ長さの貯蔵安定性評価試験を行った。
硬化剤として変性脂肪族ポリアミン化合物6重量部の代わりに2−ヘプタデシルイミダゾール(C17Z、四国化成工業(株)社製)を20重量部用いたこと以外は、実施例3と同様にして一液性エポキシ樹脂組成物を調製し、得られた一液性エポキシ樹脂組成物について、粘度とタレ長さの貯蔵安定性評価試験を行った。結果を表2に示す。
硬化剤として変性脂肪族ポリアミン化合物6重量部の代わりにエポキシ樹脂アミンアダクト化合物(ノバキュア(登録商標)HX−3721、旭化成工業(株)社製)を20重量部用いたこと以外は、実施例3と同様にして一液性エポキシ樹脂組成物を調製し、得られた一液性エポキシ樹脂組成物について、粘度とタレ長さの貯蔵安定性評価試験を行った。結果を表2に示す。
無機充填剤として長鎖炭化水素基含有化合物で処理シリカ(主鎖の炭素数:8〜20個、平均粒子径:10〜50nm)0.5重量部の代わりに表面処理無しシリカを1重量部用いたこと以外は、実施例1と同様にして一液性エポキシ樹脂組成物を調製し、得られた一液性エポキシ樹脂組成物について、粘度とタレ長さの貯蔵安定性評価試験を行った。結果を表2に示す。
2 成形材
3 一液性エポキシ樹脂組成物塗布面
4 一液性エポキシ樹脂組成物が流動した跡の下端
Claims (4)
- 硬化剤として(B)変性脂肪族ポリアミン化合物を用い、無機充填剤として(C)長鎖炭化水素基含有化合物で処理された無機充填剤を用い、
(A)エポキシ樹脂と、
(B)変性脂肪族ポリアミン化合物と、
(C)長鎖炭化水素基含有化合物で処理された無機充填剤と、
を、80重量%以上の割合で含有することを特徴とし、
前記変性脂肪族ポリアミン化合物は、(i)ジアルキルアミノアルキルアミン化合物と、(ii)分子内に活性水素を有する窒素原子を1個または2個以上有する環状アミン化合物と、(iii)ジイソシアネート化合物との反応生成物、又は、(i)、(ii)および(iii)の3成分に加えてさらに(iv)エポキシ化合物を第4成分として反応させて得られる反応生成物であり、
前記長鎖炭化水素基含有化合物は、主鎖の炭素数が8個以上20個以下の炭化水素基を有する長鎖アルキルシラン系の長鎖アルキル基含有化合物、又は、主鎖の炭素数が8個以上20個以下の炭化水素基を有する飽和脂肪酸であって、
(A)の含有量を100重量部としたとき、(B)の含有量と(C)の含有量との合計が7重量部以上25重量部以下であり、かつ、
(C)の含有量/(B)の含有量が0.025以上1.000以下である一液性エポキシ樹脂組成物。 - レーザー回折散乱法(D50)を原理とした粒度分布測定装置によって測定した、上記長鎖炭化水素基含有化合物で処理された無機充填剤の平均粒子径が10nm以上50nm以下であることを特徴とする請求項1に記載の一液性エポキシ樹脂組成物。
- 請求項1に記載の一液性エポキシ樹脂組成物によって、少なくとも2つの部材が接着されていることを特徴とする部品。
- 請求項1に記載の一液性エポキシ樹脂組成物によって、少なくとも2つの部材を接着させることにより、電子部品又は電気部品を封止する工程を含むことを特徴とする封止方法。
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CN2010800596787A CN102762659B (zh) | 2010-01-29 | 2010-12-08 | 单液性环氧树脂组合物及其利用 |
US13/519,328 US20130022818A1 (en) | 2010-01-29 | 2010-12-08 | One-pack epoxy resin composition, and use thereof |
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