JP4891182B2 - Ultrasonic transducer, ultrasonic diagnostic apparatus and ultrasonic microscope - Google Patents

Description

  The present invention relates to a capacitive ultrasonic transducer including an electret, an ultrasonic diagnostic apparatus, and an ultrasonic microscope.

  2. Description of the Related Art An ultrasonic diagnostic method that irradiates a subject with ultrasonic waves and diagnoses the state of the subject from the echo signals has become widespread. One of ultrasonic diagnostic apparatuses used for this ultrasonic diagnostic method is an ultrasonic endoscope used in the medical field.

  Ultrasound diagnostic devices are used not only in the medical field but also in the industrial field to diagnose the presence or absence of defects such as scratches, cracks, cavities, etc. in the specimen (sample). It is known as an inspection device or a nondestructive flaw detection device.

  In addition, a so-called V (z) curve that quantifies the elastic properties of a subject or evaluates the structure of a thin film by irradiating the subject (sample) with ultrasonic waves and evaluating the acoustic characteristics of the subject. The analysis method by is known. An ultrasonic microscope is known as an apparatus for analyzing the properties of a subject from such a V (z) curve.

  These ultrasonic diagnostic apparatuses and ultrasonic microscopes are provided with ultrasonic transducers for converting electric signals into ultrasonic waves and transmitting them, and receiving ultrasonic waves and converting them into electric signals.

  Conventionally, a piezoelectric element such as a ceramic piezoelectric material PZT (lead zirconate titanate) has been mainly used as an ultrasonic transducer. However, in recent years, a micromachining technique disclosed in Japanese translations of PCT publication No. 2005-510264 is known. Capacitive Micromachined Ultrasonic Transducer (hereinafter referred to as c-MUT) is attracting attention.

  The c-MUT includes a pair of flat-plate electrodes (parallel plate electrodes) that are opposed to each other with a gap interposed therebetween, and transmits and receives ultrasonic waves by vibration of a film (membrane) including one electrode. Is to do. The c-MUT converts an ultrasonic signal into an electric signal based on a change in capacitance between a pair of electrodes when receiving an ultrasonic wave. Must be applied.

In order to solve this problem, a c-MUT (electrostatic ultrasonic transducer) that eliminates the need to apply a DC bias voltage by providing an electret (electret insulating film) between a pair of electrodes is disclosed in Japanese Patent Laid-Open No. 2-52599. It is disclosed in the gazette.
JP 2005-510264 Gazette JP-A-2-52599

  By the way, the sound pressure of the ultrasonic wave transmitted by the c-MUT and the sensitivity to the received ultrasonic wave depend on the capacitance between the pair of electrodes. For example, FIG. 14 shows an equivalent circuit diagram in the case where the electret 503 is disposed between the parallel plate electrodes including the pair of electrodes 501 and 502. In this case, the combined capacitance C1 between the pair of electrodes 501 and 502 is a value obtained by combining the capacitance Cmem of the membrane 506, the capacitance Ccav of the cavity 504 (gap), and the capacitance Cele of the electret 503. It becomes.

  Here, since the thickness of the cavity 504 is determined by the required amplitude of the membrane 506, it is constant regardless of the presence or absence of the electret 503. For this reason, when the electret 503 is not disposed between the electrodes 501 and 502, the combined capacitance C0 between the electrodes 501 and 502 is larger than the combined capacitance C1.

  In other words, in the conventional c-MUT, since the thickness of the cavity 504 is increased by arranging the electret, the capacitance between the electrodes is lower than when the electret is not arranged.

  For example, when the c-MUT is used in a body cavity such as for an ultrasonic endoscope, the c-MUT is preferably driven at a low voltage to ensure insulation. In order to obtain a capacitance between electrodes capable of realizing sufficient ultrasonic sound pressure and sensitivity during low voltage driving, the distance between the electrodes of the c-MUT is set to 1 μm or less, preferably 0.5 μm or less. It is desirable.

  On the other hand, an electret made of, for example, a silicon oxide film needs to have a thickness of at least 1 μm in order to stably hold charges over a long period of time.

  That is, when the electret is disposed between the electrodes, the necessary distance between the electrodes cannot be ensured, and it is impossible to transmit and receive ultrasonic waves with sufficient sound pressure and sensitivity using a conventional c-MUT. Met.

  The present invention has been made in view of the above-described problems. An electrostatic device capable of transmitting and receiving ultrasonic waves with sufficient sound pressure and sensitivity while eliminating the need for applying a DC bias voltage by providing an electret. It is an object of the present invention to provide a capacitive ultrasonic transducer, an ultrasonic diagnostic apparatus, and an ultrasonic microscope.

An ultrasonic transducer according to the present invention includes a first electrode, a vibrating membrane disposed on the first electrode with a gap, and a second electrode supported by the vibrating membrane. And an electret layer that holds a charge and applies a predetermined potential difference between the first electrode and the second electrode, wherein the electret includes: The layer is disposed in a region separated from the transducer cell when viewed from a transmission direction of ultrasonic waves generated when the vibrating membrane vibrates , and the electret layer is electrically connected to the first electrode. Interposed between the first conductive layer electrically connected and the second conductive layer disposed above the first conductive layer and electrically connected to the second electrode, The interval between the first conductive layer and the second conductive layer is determined by the transducer cell. And wherein the wider than the distance between definitive the gap the separated by portions the first electrode and the second electrode.

(First embodiment)
A first embodiment of the present invention will be described below with reference to FIGS. In each drawing used for the following description, the scale is different for each member in order to make each member a size that can be recognized on the drawing. FIG. 1 is an explanatory diagram showing a schematic configuration of an ultrasonic endoscope. FIG. 2 is a perspective view showing the configuration of the distal end portion of the ultrasonic endoscope. FIG. 3 is a perspective view of the transducer array.

  In the present embodiment, an example in which the present invention is applied to an ultrasonic endoscope as an ultrasonic diagnostic apparatus will be described. As shown in FIG. 1, an ultrasonic endoscope 1 according to this embodiment includes an elongated insertion portion 2 introduced into a body cavity, an operation portion 3 located at the proximal end of the insertion portion 2, and the operation portion 3. And a universal cord 4 extending from the side of the main body.

  An endoscope connector 4 a connected to a light source device (not shown) is provided at the base end portion of the universal cord 4. The endoscope connector 4a is detachably connected to a camera control unit (not shown) via an electrical connector 5a and detachably connected to an ultrasound observation device (not shown) via an ultrasonic connector 6a. An ultrasonic cable 6 is extended.

  The insertion portion 2 is located at the distal end rigid portion 20 formed of a hard resin member in order from the distal end side, the bendable bending portion 8 located at the rear end of the distal end rigid portion 20, and the rear end of the bending portion 8. Thus, a flexible tube portion 9 having a small diameter, a long length and flexibility reaching the distal end portion of the operation portion 3 is continuously provided. An ultrasonic transmission / reception unit 30 for transmitting / receiving ultrasonic waves, which will be described in detail later, is provided on the distal end side of the distal rigid portion 20.

  The operation unit 3 includes an angle knob 11 for controlling the bending of the bending portion 8 in a desired direction, an air / water supply button 12 for performing air supply and water supply operations, a suction button 13 for performing suction operations, and a body cavity A treatment instrument insertion port 14 or the like serving as an entrance of a treatment instrument to be introduced into the instrument is provided.

  As shown in FIG. 2, the distal end rigid portion 20 includes an illumination lens (not shown) that constitutes an illumination optical unit that irradiates the observation site with illumination light, and an objective that constitutes the observation optical unit that captures an optical image of the observation site. The lens 21 is provided with a suction and forceps port 22 which is an opening through which the excised site is sucked and the treatment tool protrudes, and an air supply / water supply port (not shown) for air supply and water supply.

  As shown in FIG. 3, the ultrasonic transmission / reception unit 30 provided at the distal end of the distal end rigid portion 20 includes a transducer array 31, a drive circuit 34, and an FPC 35. The FPC 35 is a wiring board (flexible wiring board) having flexibility and mounting surfaces formed on both sides. In the ultrasonic transmitting / receiving unit 30, the FPC 35 is an axis substantially parallel to the insertion axis of the distal end hard part 20. Is arranged in a substantially cylindrical shape with the central axis as the center axis.

  On the outer peripheral surface of the cylindrical FPC 35, a transducer array 31 that is an ultrasonic transducer array is provided. The transducer array 31 includes a plurality of transducer units 32 that are the ultrasonic transducers of the present embodiment arranged in the circumferential direction on the outer peripheral surface of the FPC 35. The transducer units 32 have a substantially rectangular shape when viewed from the normal direction of the outer peripheral surface of the FPC 35, and are arranged on the outer peripheral surface of the cylindrical FPC 35 at equal intervals with the short direction as the circumferential direction. For example, the transducer array 31 includes tens to hundreds of transducer units 32, and the transducer array 31 of the present embodiment includes 128 transducer units 32. Each transducer unit 32 includes 16 transducer elements 33.

  As will be described in detail later, the vibrator unit 32 of the present embodiment is a capacitive ultrasonic transducer formed by a micromachining technique on a silicon substrate made of a low-resistance silicon semiconductor. Belongs to the technical scope of Mechanical Systems). A capacitive ultrasonic transducer formed by such micromachining technology is generally referred to as a c-MUT (Capacitive Micromachined Ultrasonic Transducer).

  In the transducer array 31 of the present embodiment, a plurality of transducer elements 33 arranged in one transducer unit 32 constitute the minimum drive unit for transmitting and receiving ultrasonic waves. Each transducer element 33 transmits an ultrasonic wave in the normal direction of the mounting surface of the FPC 35, that is, in the radial direction outward of the cylindrical FPC 35.

  On the other hand, a plurality of drive circuits 34 are mounted on the inner peripheral surface of the cylindrical FPC 35, that is, on the mounting surface opposite to the mounting surface on which the transducer array 31 is mounted. The drive circuit 34 has an electrical circuit such as a pulser or a selection circuit for driving the transducer element 33, and is electrically connected to each transducer element 33.

  The drive circuit 34 is electrically connected to a plurality of signal electrodes 36 and a ground electrode 37 formed on the outer peripheral surface of the cylindrical FPC 35. The signal electrode 36 and the ground electrode 37 are inserted through the ultrasonic cable 6 and one end thereof is electrically connected to the ultrasonic connector 6a, and the other end of the coaxial cable is electrically connected. Therefore, the drive circuit 34 is electrically connected to the ultrasonic observation apparatus.

  The ultrasonic transmission / reception unit 30 having the above-described configuration is configured such that the ultrasonic wave is transmitted on a plane substantially orthogonal to the insertion axis of the distal end rigid portion 20 by a two-dimensional transducer array 31 disposed on the outer peripheral surface of the cylindrical FPC 35. Electronic radial scanning capable of sector scanning can be performed, which is transmitted and received in a radial manner.

  Next, a detailed configuration of the transducer unit 32 which is a capacitive ultrasonic transducer according to the present embodiment will be described below with reference to FIGS. FIG. 4 is a top view of the transducer unit 32 as viewed from the ultrasonic transmission / reception side. That is, in FIG. 4, ultrasonic waves are transmitted in a direction perpendicular to the paper surface and away from the paper surface. 5 is a cross-sectional view taken along the line V-V in FIG. FIG. 6 is an equivalent circuit diagram of the vibrator unit 32. FIG. 7 is a partial cross-sectional view of a region where an electret layer of the vibrator unit is formed.

  As shown in FIG. 4, the transducer unit 32 of the present embodiment is configured by arranging a plurality of transducer elements 33. In FIG. 4, an elongated region surrounded by a broken line shows one transducer element 33.

  The transducer element 33 includes a plurality of transducer cells 100. The transducer element 33 includes an electret layer 130 electrically connected to each of the plurality of transducer cells 100 constituting the transducer element 33, a signal electrode pad 38, and a ground electrode pad 39. Configured.

  In this embodiment, the transducer element 33 includes eight transducer cells 100 arranged linearly in the longitudinal direction of the elongated region, and eight transducer cells 100 disposed at one end of the elongated region. And an electret layer 130 electrically connected in parallel with all of them.

  In the same transducer element 33, all the transducer cells 100 are electrically connected in parallel, and the drive signal from the ultrasonic observation apparatus is input via the signal electrode pad 38, so Transmit phase ultrasound.

  As shown in FIG. 5, the vibrator element 33 of the present embodiment has a capacitance type having a laminated structure formed on a silicon substrate 101 made of a low-resistance silicon semiconductor by a micromachining technique using a semiconductor process or the like. Is an ultrasonic transducer.

  In the following description of the laminated structure, regarding the vertical relationship of each layer, the direction away from the surface of the silicon substrate 101 in the normal direction is the upward direction. For example, in the cross-sectional view of FIG. 5, it is assumed that the upper electrode 120 is disposed above the lower electrode 110. The thickness of each layer refers to the dimension of each layer in the normal direction on the surface of the silicon substrate 101. In the following description, for convenience, the surface of the silicon substrate 101 on which the transducer cell 100 is formed is defined as the cell formation surface, and the surface opposite to the surface on which the transducer cell 100 is formed. This is called the back side.

  The silicon substrate 101 is made of conductive low-resistance silicon, and a first insulating film 102 and a back insulating film 109, which are silicon oxide films having electrical insulating properties, are formed on both surfaces. The first insulating film 102 and the back surface insulating film 109 are high-temperature oxide films formed by thermally oxidizing the silicon substrate 101. The first insulating film 102 and the back surface insulating film 109 may be silicon nitride films.

First, the structure of the transducer cell 100 will be described in detail below.
The transducer cell 100 has a pair of parallel plate electrodes facing each other through a cavity 107 that is a substantially cylindrical gap, and includes a lower electrode 110 (first electrode) and an upper electrode 120 (second electrode). Configured. The transducer element 33 including the transducer cell 100 is caused by the vibration of the membrane 100a (vibration membrane) that is an elastic film-like structure including the upper electrode 120 of the transducer cell 100. It transmits and receives ultrasonic waves.

  On the first insulating film 102, a lower electrode 110, which is a conductive layer, is formed in a substantially circular shape when viewed from above. The lower electrode 110 is formed by depositing and patterning Mo (molybdenum) by sputtering. In the lower electrode 110, the lower electrodes 110 of the adjacent transducer cells 100 as viewed from above are electrically connected by a lower electrode wiring 111.

  The material constituting the lower electrode 110 which is the lower layer portion of the laminated structure and is formed on the silicon oxide film is a high material such as W (tungsten), Ti (titanium), Ta (tantalum) other than Mo. Although it is desirable to use a melting point metal or an alloy thereof, the material is not limited to this as long as high-temperature heat treatment can be avoided in the subsequent manufacturing process, and Al (aluminum), Cu (copper), etc. It may be. The lower electrode 110 may have a multilayer structure in which two or more kinds of conductive materials are stacked.

  A through-wafer electrode 112 formed through the silicon substrate 101 is provided at the end of the transducer element 33 having an elongated shape when viewed from above, on the side opposite to the end where the electret layer 130 is disposed. The transducer element 33 is provided in units. The through-wafer electrode 112 is electrically insulated from the silicon substrate 101 and electrically connected to the lower electrode 110 and the signal electrode pad 38 formed on the back surface insulating film 109.

  That is, all the lower electrodes 110 in the same transducer element 33 are electrically connected to the signal electrode pad 38 formed on the back surface of the silicon substrate 101 via the lower electrode wiring 111 and the wafer through electrode 112. Yes.

  A second insulating film 103 having electrical insulation is formed on the lower electrode 110 so as to cover the lower electrode 110. The second insulating film 103 is a silicon oxide film in this embodiment, and is formed by a plasma CVD method. Note that the second insulating film 103 may be a silicon nitride film, hafnium nitride (HfN), hafnium oxynitride (HfON), or the like.

  On the second insulating film 103, a third insulating film 104 having electrical insulating properties is formed over the cavity 107. The third insulating film 104 is a silicon oxide film in this embodiment, and is formed by a plasma CVD method. Note that the third insulating film 104 may be a silicon nitride film.

  Between the second insulating film 103 and the third insulating film 104, a cavity 107, which is a sealed void layer in an atmospheric pressure, pressurized or reduced pressure state, is formed. Here, the reduced pressure state refers to a state where the pressure is lower than the atmospheric pressure, and includes a so-called vacuum state. The cavity 107 has a substantially cylindrical shape, and is provided substantially concentrically with the lower electrode 110 when viewed from above.

  In this embodiment, the cavities 107 are formed by sacrificial layer etching, which is a known technique, and sacrifices for communicating the inside of the cavities 107 used during the sacrificial layer etching with the upper layer of the third insulating film 104. The layer removal hole is sealed with a plug (not shown). The cavity 107 may be formed by a method of bonding wafers after mechanical or chemical microfabrication.

  On the third insulating film 104, an upper electrode 120, which is a substantially circular conductive layer as viewed from above, is formed. The upper electrode 120 is provided substantially concentrically with the lower electrode 110 when viewed from above, that is, at a position facing the lower electrode 110. In the present embodiment, the upper electrode 120 is formed by depositing and patterning Al by sputtering.

  The upper electrodes 120 of the adjacent transducer cells 100 as viewed from above are electrically connected to each other by the upper electrode wiring 121. In addition to Al, the material which comprises the upper electrode 120 should just have electroconductivity, such as Cu, W, Ti, Ta, for example. The upper electrode 120 may have a multilayer structure in which two or more kinds of conductive materials are stacked.

  The upper electrode wiring 121 is electrically connected to the through electrode 122 at the end of the transducer element 33 having an elongated shape when viewed from above, on the side opposite to the end where the electret layer 130 is disposed. Yes. The through electrode 122 is formed through the same process as the upper electrode 120 and the upper electrode wiring 121 through the first insulating film 102, the second insulating film 103, and the third insulating film 104. Are electrically connected to the silicon substrate 101 via an ohmic contact region 122a.

  A ground electrode pad 39 is formed on the back surface insulating film 109, and the ground electrode pad 39 is electrically connected to the silicon substrate 101 through an ohmic contact region 123a.

  That is, all the upper electrodes 120 in the same transducer element 33 are electrically connected to the ground electrode pad 39 formed on the back surface of the silicon substrate 101 via the upper electrode wiring 121, the through electrode 122, and the silicon substrate 101. It is connected.

  A protective film 105 having electrical insulation is formed on the upper electrode 120. In this embodiment, the protective film 105 is a silicon nitride film, and is formed by a plasma CVD method. In addition to the silicon nitride, the protective film 105 may be composed of a silicon oxide film, hafnium nitride (HfN), hafnium oxynitride (HfON), or the like. In particular, HfN and HfON are preferable as a protective film because a high-density film can be obtained.

  Further, on the protective film 105, a paraxylylene-based resin film 106 having water resistance, chemical resistance, and the like and excellent in biocompatibility and electrical insulation is formed.

  The vibrator unit 32 is mounted on the FPC 35 by a known method such as solder bonding, anisotropic conductive film bonding, or ultrasonic bonding. Thereby, the transducer cell 100 of the transducer element 33 described above is electrically connected to the drive circuit 34 mounted on the opposite side of the FPC 35 via the signal electrode pad 38 and the ground electrode pad 39.

  As described above, in this embodiment, the substrate on which the transducer cell 100 is formed is the low-resistance silicon substrate 101, and the noise that comes from the back side is shielded by setting the silicon substrate 101 to the ground potential, thereby further reducing the S / N. An ultrasonic image with a high ratio can be obtained. Further, by providing the signal electrode pad 38 and the ground electrode pad 39 on the back surface side of the transducer cell 100, the mounting area can be reduced, and the distal end rigid portion 20 can be configured to be short. The operability of the mirror 1 is improved.

  In the above-described configuration, the lower electrode 110, the upper electrode 120, and the cavity 107 have a substantially circular shape when viewed from above. However, these shapes are not limited to the present embodiment. It may be a polygonal shape such as a rectangle or other shapes. The dimensions of the membrane 100a and the cavity 107 are determined by the wavelength and output of the ultrasonic wave used at the time of observation.

Next, the configuration of the region where the electret layer 130 of the ultrasonic transducer of this embodiment is disposed will be described in detail below.
In the present embodiment, as described above, the electret layer 130 serving as a charge holding unit is disposed at the end of the transducer element 33 having an elongated shape when viewed from above. The electret layer 130 has a function of permanently holding a positive or negative charge.

  The electret layer 130 of the present embodiment is made of an inorganic film, and is specifically formed by charging a silicon oxide film formed by a plasma CVD method or the like by corona discharge. The electret layer 130 may be composed of another inorganic film such as a silicon nitride film, Hf (hafnium) oxide such as an HfO 2 film or an HfAl 2 O 5 film. Moreover, the electret layer 130 may be configured by laminating a plurality of types of the inorganic films.

  As shown in the equivalent circuit diagram of FIG. 6, in the single transducer element 33, the side that holds the negative charge of the electret layer 130 is electrically connected to the lower electrode 110 of each of the plurality of transducer cells 100. It is connected to the. Since the upper electrode 120 of the transducer cell is grounded, the electret layer 130 gives a potential difference between the lower electrode 110 and the upper electrode 120 which are a pair of electrodes of the transducer cell 100.

  That is, the transducer cell 100 is electrically equivalent to a state in which a DC bias voltage is applied between the lower electrode 110 and the upper electrode 120, and the transducer unit 32, which is an ultrasonic transducer of this embodiment, has a DC bias voltage. It is possible to transmit and receive ultrasonic waves without applying externally. That is, the effective voltage value of the signal for driving the transducer cell 100 can be lowered.

  Therefore, the ultrasonic diagnostic apparatus including the transducer cell 32 that is the ultrasonic transducer of the present embodiment does not require a circuit or wiring for applying a DC bias voltage unlike the conventional c-MUT, and is small in size of the apparatus. Can be achieved. In addition, since the effective voltage value of the drive signal for driving the transducer cell 100 can be kept low, the current value flowing through the drive circuit and the wiring can be reduced, and the power consumption can be reduced. As a result, the drive circuit can be further miniaturized, and fluctuations in the characteristics of the transducer cell due to heat generated by the drive circuit can be prevented.

  Specifically, the electret layer 130 of the present embodiment includes a lower conductive layer 114 (first conductive layer) electrically connected to the lower electrode 110 of the transducer cell 100 as shown in the partial cross-sectional view of FIG. And an upper conductive layer 124 (second conductive layer) electrically connected to the upper electrode 120. In the present embodiment, the lower conductive layer 114 is a conductive layer made of Mo formed by the same semiconductor process as the lower electrode 110. The upper conductive layer 124 is a conductive layer made of Al formed by the same semiconductor process as the upper electrode 120.

  In addition, a gap 131 that is an insulating layer is interposed between the electret layer 130 and the upper conductive layer 124. The gap 131 is formed by sacrificial layer etching, which is a known technique in this embodiment. The gap 131 may be another insulating film such as a silicon oxide film or a silicon nitride film as long as it electrically insulates the electret layer 130 and the upper conductive layer 124.

  A protective film 105 having electrical insulating properties is formed above the upper conductive layer 124 as in the case of the transducer cell 110 portion. As described above, the protective film 105 is a silicon nitride film in the present embodiment.

  The upper conductive layer 124 and the protective film 105 disposed above the electret layer 130 are provided with innumerable fine through holes 132 that penetrate the upper conductive layer 124 and the protective film 105 in the thickness direction. Has been. The through hole 132 is formed only in a region overlapping the electret layer 130 when viewed from above the upper conductive layer 124 and the protective film 105. In the present embodiment, the through holes 132 have a diameter on the order of μm (diameter of several μm), and are scattered randomly at a predetermined distribution density.

  The form of the through holes 132 formed in the upper conductive layer 124 and the protective film 105 is not limited to this embodiment, and the through holes 132 are regularly formed, for example, arranged in a matrix. There may be.

  A paraxylylene-based resin film 106 is formed above the protective film 105 as in the case of the vibrator cell 110 portion.

  Further, as shown in FIG. 7, in the transducer element 33, the region where the electret layer 130 is disposed protrudes upward (in the ultrasonic transmission direction) from the region where the transducer cell 100 is formed. Is formed. Specifically, the thickness We of the region where the electret layer 130 of the transducer element 33 is disposed is larger than the thickness Wc of the region where the transducer cell 100 is formed.

  As described above, the transducer unit 32 of the present embodiment has a configuration in which the transducer cell 100 protrudes in the ultrasonic wave transmission direction in the region adjacent to the transducer cell 100 from the region where the transducer cell 100 is formed. It is possible to prevent the membrane 100a of the transducer cell 100 from being damaged due to contact with other objects.

  In the present embodiment, the distance De between the upper conductive layer 124 and the lower conductive layer 114 that are parallel plate electrodes facing each other in the region where the electret layer 130 is formed is equal to the upper electrode 120 and the lower electrode of the transducer cell 100. It is formed to be wider than the interval Dc of 110. For this reason, it is possible to suppress the generation of parasitic capacitance in a region that does not contribute to transmission and reception of ultrasonic waves, and to increase the driving efficiency of the ultrasonic unit.

  Here, the electrification process by the corona discharge of the electret layer 130 of the vibrator unit 32 which is the ultrasonic transducer of the present embodiment is performed on the silicon oxide film to be the electret layer 130 with the gap 131, the upper conductive layer 124 and the protective film. 105 is formed, and further, a through hole 132 penetrating the upper conductive layer 124 and the protective film 105 in the thickness direction is formed.

  That is, the electrification process of the electret layer 130 by corona discharge is such that at least a part of the electret layer 130 is exposed upward through the through-hole 132 after all the semiconductor processes for forming the layer structure after the electret layer 130 are completed. In the state of

  Then, after the electret layer 130 is charged, the paraxylylene-based resin film 106 is formed by spin coating or the like, thereby completing the structure on the cell formation surface side of the vibrator unit 32.

  The effects of the ultrasonic transducer and the ultrasonic diagnostic apparatus according to this embodiment having the above-described configuration will be described below.

  In the transducer unit 32 of the present embodiment, the electret layer 130 includes the transducer cell when viewed from the ultrasonic transmission direction, that is, the stacking direction of the lower electrode 110 and the upper electrode 120 that are a pair of electrodes of the transducer cell 100. They are arranged in areas separated from each other that do not overlap with 100. For this reason, in the vibrator unit 32 of the present embodiment, the thickness of the electret layer 130 and the distance between the lower electrode 110 and the upper electrode 120 can be set independently.

  For example, as compared with the conventional capacitive ultrasonic transducer in which the electret 503 is disposed between the electrodes 501 and 502 which are a pair of parallel plate electrodes as shown in FIG. 32 can reduce the distance (gap) between the pair of parallel plate electrodes (the lower electrode 110 and the upper electrode 120 in the present embodiment), and can increase the thickness of the electret layer 130 serving as the charge holding means.

  Therefore, according to the present embodiment, the distance between the lower electrode 110 and the upper electrode 120 is reduced to increase the capacitance between the two electrodes, and the sound pressure of the transmission ultrasonic wave and the reception ultrasonic wave are reduced. In addition to improving the sensitivity, the thickness of the electret layer 130 can be set to a thickness that allows the electret layer 130 to hold a charge stably and permanently.

  Further, in the vibrator unit 32 of the present embodiment, the lower electrode 110 and the upper electrode 120 and the electret layer 130 are not laminated and disposed in the thickness direction, and therefore, more than a conventional capacitive ultrasonic transducer. It can be made thin.

  Similarly, the transducer unit 32 of the present embodiment transmits ultrasonic waves as compared with a conventional capacitive ultrasonic transducer configured by stacking transducer cells and electrets in the thickness direction. It is possible to make the thickness in the direction thinner.

  Therefore, the transducer unit 32 that is the ultrasonic transducer of the present embodiment is thinner than the conventional one, and has higher sound pressure of transmitted ultrasonic waves and higher sensitivity of received ultrasonic waves when driven by a low voltage. In addition, its characteristics can be maintained permanently.

  In other words, the present embodiment maintains the initial performance over a long period of time when exerting the sound pressure of the predetermined transmission ultrasonic wave and the sensitivity of the reception ultrasonic wave, is thinner than the conventional one, and has a low voltage. An ultrasonic transducer that can be driven by is realized.

  In addition, according to the present embodiment, the ultrasonic diagnostic apparatus that includes the transducer unit 32 that is thin and can be driven by a low voltage can be configured to have a longer life and a smaller size than the conventional one. . For example, in the case of the ultrasonic endoscope 1 as shown in FIG. 1, the outer diameter of the transducer array 31 can be made smaller than before, and a diagnosis with less burden on the subject can be realized. Can do.

  Further, in the vibrator unit 32 of the present embodiment, the upper conductive layer 124 and the protective film 105 disposed in the upper layer of the electret layer 130 penetrate through the upper conductive layer 124 and the protective film 105 in the thickness direction. A hole 132 is formed. At the time when the formation process of the upper conductive layer 124 and the protective film 105 is completed, the electret layer 130 is disposed in a region separated from the transducer cell 100 when viewed from the transmission direction of the ultrasonic wave. At least a portion is exposed upward (in the transmission direction of the ultrasonic wave) via.

  In the vibrator unit 32 of this embodiment having such a configuration, the process of performing the charging process by corona discharge on the electret layer 130 is easily performed after the upper conductive layer 124 and the protective film 105 are formed. Is possible. In this charging process, the charge generated by the corona discharge is not completely captured by the upper conductive layer 124 that is a conductive layer covering the electret layer 130, but a part of the charge is generated on the electret layer 130 through the through hole 132. To reach. After the electret layer 130 is charged, a paraxylylene-based resin film 106 is formed, and the structure on the cell formation surface side of the vibrator unit 32 is completed. In addition, the paraxylylene resin preferably contains fluorine (F) because of high chemical resistance.

  In other words, in the present embodiment, the electret layer 130 is charged after all the layer structures formed by the semiconductor process are formed. After the electret layer 130 is charged, the electret layer 130 is charged. There is no process for raising the temperature of the layer 130, such as CVD.

  In general, electrets as charge holding means have the property of releasing charges when the temperature is raised and reducing the amount of charges held. For example, the electret layer 130 made of the silicon oxide film according to the present embodiment causes a decrease in charge amount when the temperature is about 400 ° C. or higher. When the amount of electric charge held by the electret layer 130 is reduced, the direct current voltage component applied between the lower electrode 110 and the upper electrode 120 is reduced. Resulting in.

  For example, when a capacitive ultrasonic transducer in which an electret 503 is disposed between a pair of parallel plate electrodes 501 and 502 as shown in FIG. 14 is formed by a semiconductor process, the electret 503 is charged. If a process performed at a temperature of 400 ° C. or higher is used for forming the upper layer electrode 501 or the insulating film after the process is performed, the electret 503 has a reduced charge amount and the sensitivity of the ultrasonic transducer is decreased. It will end up. After the electret 503 is charged, it is possible to prevent the electret 503 from having a reduced charge amount by performing all steps of manufacturing the ultrasonic transducer at 400 ° C. or lower. There is a problem that the cost increases because the number of manufacturing apparatuses increases and the process becomes complicated.

  However, the vibrator unit 32 having the configuration of the present embodiment heats the electret layer 130 that has been charged as described above to a temperature at which the amount of charge held by the electret layer 130 is reduced. It has the structure which can be manufactured without it.

  Therefore, the vibrator unit 32 which is the ultrasonic transducer of the present embodiment can increase the amount of electric charge held by the electret layer 130 as compared with the conventional case, and can receive higher when driven by a low voltage. It has ultrasonic sensitivity. Further, since the vibrator unit 32 of the present embodiment does not require a semiconductor process performed at a relatively low temperature, for example, a processing temperature of 400 ° C. or less, it can be manufactured by a more general-purpose semiconductor manufacturing apparatus at a low cost. It is.

  In the above-described embodiment, the electret layer 130 is described as a single-layer or multiple-layer inorganic film such as a silicon oxide film, but the electret layer 130 is in this form. It is not limited.

  For example, the electret layer 130 is made of an organic film, and may be specifically formed by charging a fluororesin generally called FEP by corona discharge, or may be a fluororesin other than FEP, , Other organic films such as polyimide, polypropylene, and polymethylpentene may be used.

  Electrets made of these organic films have been used in other fields in the past, and are known to be able to hold charges stably over a long period of time. However, the electret made of an organic film has a property that the amount of charge to be retained is lowered by increasing the temperature, and the decrease in the amount of retained charge is particularly lower than that of the electret made of an inorganic film at 100 ° C. to 200 ° C. Since it occurs at about 0 ° C., it has been difficult to apply to a capacitive ultrasonic transducer formed by a semiconductor process.

  However, in the vibrator unit 32 of the present embodiment, since the electret is charged after the semiconductor process as described above, even if the electret is formed of an organic film, the amount of charge held by the electret is reduced. There is no end to it.

  Therefore, according to the present embodiment, the electret of the vibrator unit 32 can be constituted by an organic film that can hold charges more stably than in the past, and has a longer lifetime than in the past. It is possible to provide a capacitive ultrasonic transducer.

  Further, in the above-described embodiment, the electret layer 130 that holds negative charges is formed in contact with the lower conductive layer 114 that is electrically connected to the lower electrode 110 of the transducer cell 100. A gap 131 that is an insulating layer is interposed between the electret layer 130 and the upper conductive layer 124.

  Such a configuration is particularly effective when the voltage signal output from the drive circuit 34 and applied to the lower electrode 110 during transmission of ultrasonic waves from the transducer unit 32 has a negative polarity. This is because, in such a configuration, a negative polarity DC voltage component is applied between the lower electrode 110 and the upper electrode 120 by the electret layer 130, and the charge held by the electret layer 130 is the ground potential. This is because it can be prevented from flowing out of the conductive layer 124.

  Further, in order to more reliably retain the electric charge by the electret layer 130, it is effective to cover the entire periphery of the electret layer 130 with an insulating film. Needless to say, the insulating film covering the entire surface of the electret layer 130 may be divided into a plurality of insulating films.

  For example, as shown in FIG. 8 as a modification of the present embodiment, insulating layers 138 and 139 are formed on the lower layer side and the upper layer side of the electret layer 130 to cover the entire surface of the electret layer 130 with an insulating film. If it is a structure, the electric charge retention by the electret layer 130 can be made more reliable. In the modification of the present embodiment shown in FIG. 8, when the electret layer 130 is made of a silicon oxide film, the second insulating film 104, the protective film 105, and the insulating layers 138 and 139 covering the electret layer 130 are made of silicon. A nitride film is preferably used.

  Note that, depending on the polarity of the signal output from the drive circuit 34 and whether the signal is applied to the lower electrode 110 or the upper electrode 120, the polarity of the charge held by the electret layer 130 and the gap portion 131 which is an insulating layer. The position where the is interposed is appropriately changed, and is not limited to the above-described embodiment.

  Further, in an ultrasonic diagnostic apparatus configured to include an ultrasonic transducer, a conductive layer that is electrically grounded independently from the ultrasonic transducer in order to shield external noise and improve the S / N ratio. The ultrasonic transducer may be covered with a shield layer.

  In the case where the shield layer is applied to the above-described embodiment, for example, the step of covering the vibrator cell 32 with the shield layer is performed at a temperature at which the charge amount held by the electret layer 130 is reduced. For example, a through hole is formed in the shield layer on the electret layer 130 in the same manner as the upper conductive layer 124, and the electret layer 130 is charged through the through hole.

  For example, if the step of covering the transducer cell 32 with the shield layer is performed at a temperature lower than the temperature at which the amount of charge held by the electret layer 130 is reduced, the shield layer is transferred to the electret layer 130. It is formed after the charging process is performed, and it is not necessary to form a through hole.

  Note that the vibrator unit of the present embodiment is configured using the conductive silicon substrate 101 as a base material, but the vibrator unit includes quartz, sapphire, crystal, alumina, zirconia, You may form on the base material comprised with insulating materials, such as glass and resin.

  Moreover, although the ultrasonic endoscope of the present embodiment has been described as performing electronic radial scanning, the scanning method is not limited to this, and linear scanning, convex scanning, mechanical scanning, and the like are performed. It may be adopted. Further, the transducer array may be a two-dimensional array in which a plurality of transducer elements are arranged two-dimensionally, or may be a single transducer element as well as a form in which the transducer elements are arranged in an array. The form using may be sufficient.

  Further, the ultrasonic diagnostic apparatus according to the present embodiment may be an ultrasonic probe type that does not include an optical observation window, or may be a capsule type ultrasonic endoscope. Further, the ultrasonic diagnostic apparatus may be a so-called extracorporeal ultrasonic diagnostic apparatus that performs ultrasonic scanning from the body surface of the subject toward the body cavity. The ultrasonic diagnostic apparatus may be a nondestructive inspection apparatus or a nondestructive flaw detection apparatus used in the industrial field.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view of the transducer element according to the second embodiment.

  In the second embodiment, only the configuration of the region where the electret layer is formed is different from the configuration of the first embodiment. Therefore, only this difference will be described below, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

  As compared with the first embodiment, the vibrator unit of the present embodiment has a region where the electret layer 130 of the vibrator element 33a is formed as shown in FIG. The configuration does not protrude in the ultrasonic wave transmission direction.

  In the transducer element 33a of the present embodiment, the concave portion 101a is formed in the region where the electret layer 130 of the silicon substrate 101 is formed, thereby eliminating the irregularities on the surface on the ultrasonic wave transmitting side.

  With such a configuration, the transducer unit that is the ultrasonic transducer of the present embodiment improves the patterning accuracy in the semiconductor process for forming the transducer cell 100.

  That is, the transducer unit of the present embodiment can improve the dimensional accuracy of the transducer cell 100 as compared with the first embodiment, and can form the transducer cell 100 with uniform acoustic characteristics. It becomes possible.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 10 and 11. FIG. 10 is a top view of the ultrasonic transducer unit 233 of the present embodiment. 11 is a cross-sectional view taken along the line XI-XI in FIG.

  The third embodiment differs from the configuration of the first embodiment only in the positional relationship between the regions where the transducer cells and the electret layers are formed. Therefore, only this difference will be described below, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

As shown in FIG. 10, the transducer unit 233 of the present embodiment includes a plurality of transducer cells 200 arranged in a matrix when viewed from above (the transmission direction of ultrasonic waves), and the transducer cells 200 are And a plurality of electret layers 230 formed in regions separated from each other. In FIG. 10, for the sake of explanation, a pattern formed by the same conductive layer as the upper electrode 220 of the transducer cell 200 is indicated by a solid line, a pattern formed by the same conductive layer as the lower electrode 210 is indicated by a broken line, A region where the electret layer 130 is disposed is indicated by a two-dot chain line. Specifically, four transducer cells 200 arranged adjacent to each other in two rows and two columns, which are a part of the transducer unit 233. In particular, the electret layer 230 is disposed at a position that is equal to the distance from all of the four transducer cells 200 in the direction orthogonal to the ultrasonic transmission direction. That is, in a cross section (FIG. 11) by a plane including the centers of two transducer cells 200 positioned diagonally of the four transducer cells 200 in 2 rows and 2 columns and parallel to the ultrasonic transmission direction. Are arranged alternately with regions where the transducer cells 200 and the electret layers 230 are disposed.

  As shown in FIG. 11, similarly to the first embodiment, the vibrator unit 233 of the present embodiment has a first insulating film 202 and a back insulating film 209 that are silicon oxide films having electrical insulation properties on both surfaces. Is formed by a micromachining technique using a semiconductor process or the like on a silicon substrate 201 made of a low-resistance silicon semiconductor.

  Since the configuration of the region where the transducer cell 200 and the electret layer 230 are disposed is the same as that of the first embodiment, a detailed description thereof will be omitted, and only the configuration will be described below.

  The transducer cell 200 includes a lower electrode 210, which is a substantially circular conductive layer when viewed from above, and an upper electrode 220, which is a substantially circular conductive layer, which is disposed so as to face the lower electrode. And a cavity 207 which is a substantially cylindrical gap portion interposed between the lower electrode 210 and the upper electrode 220. For the purpose of electrically insulating the lower electrode 210 and the upper electrode 220, the second insulating film 203 and the third insulating film 204 are disposed on the cavity 207 side of the lower electrode 210 and the upper electrode 220, respectively. A protective film 205 and a paraxylylene resin film 206 are disposed on the upper electrode 220.

  The vibrator cell 200 of the present embodiment is an elastic film-like structure including the upper electrode 220, the third insulating film 204, the protective film 205, and the paraxylylene resin film 206 of the vibrator cell 200 described above. Ultrasound is transmitted and received by the vibration of the membrane 200a (vibrating membrane).

  On the other hand, the region where the electret layer 230 is disposed includes a lower conductive layer 214 electrically connected to the lower electrode 210 of the transducer cell 200, an upper conductive layer 224 electrically connected to the upper electrode 220, The electret layer 230 is interposed between the lower conductive layer 214 and the upper conductive layer 224. Further, a gap 231 that is an insulating layer is interposed between the electret layer 230 and the upper conductive layer 224.

  The upper conductive layer 224 and the protective film 205 disposed above the electret layer 230 are provided with countless fine through holes 232 that penetrate the upper conductive layer 224 and the protective film 205 in the thickness direction. Has been.

  Further, as shown in FIG. 10, in this embodiment, a pattern (in FIG. 10) formed by the same conductive layer as that of the upper electrode 220 except for the region where the transducer cell 200 and the electret layer 230 are disposed. ) And a pattern (broken line in FIG. 10) formed by the same conductive layer as the lower electrode 210 are arranged so as not to overlap each other.

  That is, in the present embodiment, the upper electrode wiring 221 that electrically connects the plurality of upper electrodes 220 and the plurality of upper conductive layers 224, and the plurality of lower electrodes 210 and the plurality of lower conductive layers 214 are electrically connected. The lower electrode wirings 211 to be connected are arranged alternately or at different angles in different regions as viewed from above.

  Thus, by arranging the upper conductive layer 224 and the lower conductive layer 214 so as not to overlap each other when viewed from above, it is possible to prevent the occurrence of parasitic capacitance in the wiring portion.

  The vibrator unit according to this embodiment including the vibrator element 233 having the above-described configuration has the same effects as those of the first embodiment described above, and further has the following effects.

  The vibrator unit according to the present embodiment contributes to the transmission and reception of ultrasonic waves when the electret layer 230 is disposed between the plurality of vibrator cells 200 when the vibrator unit is viewed from the ultrasonic transmission direction. It is possible to make the area of the area not to be smaller than that of the first embodiment. In other words, the utilization efficiency of the ultrasonic transmission / reception surface of the transducer unit can be improved.

  Therefore, the transducer unit of this embodiment can transmit and receive ultrasonic waves with higher efficiency, and can provide a more compact ultrasonic diagnostic apparatus.

  Note that the electret layer 230 only needs to hold an amount of charge sufficient to apply a DC voltage to the transducer cell 200 of the transducer unit. As shown in FIG. It does not have to be arranged in all areas.

  Further, in the present embodiment described above, the electret layer is divided into a plurality of regions, but the electret layer is in a separate region different from the region where the transducer cells are formed. If so, it may be arranged in a single continuous shape.

  For example, as shown in FIG. 12, the electret layer 230a may be disposed in a lattice-shaped region that fills the region between the plurality of transducer cells 200 arranged in a matrix.

(Fourth embodiment)
Hereinafter, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the above-described ultrasonic transducer of the present invention is applied to an ultrasonic microscope. FIG. 13 is a diagram illustrating the configuration of the ultrasonic microscope according to the present embodiment.

  The ultrasonic microscope 300 applies the high-frequency signal generated by the high-frequency oscillator 301 to the ultrasonic transducer 303 according to the present invention via the circulator 302 and converts it into ultrasonic waves. The ultrasonic wave is converged by the acoustic lens 304, and the sample 305 is disposed at the convergence point. The sample 305 is held by a sample holder 306, and a coupler 307 such as water is filled between the sample 305 and the lens surface of the acoustic lens 304. The reflected wave from the sample 305 is received by the transducer 303 via the acoustic lens 304 and converted into an electrical reflected signal. An electrical signal corresponding to the received ultrasonic wave output from the ultrasonic transducer 303 is input to the display device 308 via the circulator 302. The sample holder 306 is driven in the XY biaxial directions in the horizontal plane by the scanning device 310 controlled by the scanning circuit 309.

  The ultrasonic microscope 300 configured as described above quantifies the elastic properties of the sample 305 and evaluates the structure of the thin film by irradiating the sample 305 with ultrasonic waves and evaluating the acoustic characteristics of the sample 305. Is possible.

Based on the embodiment described above, the following configuration can be proposed. That is,
(Appendix 1)
In capacitive ultrasonic transducers using micromachine processes,
It is composed of a large number of transducer cells disposed on a substrate, and the transducer cell includes at least an upper electrode and a vibration film made of an insulating film,
A gap in contact with the vibrating membrane;
A lower electrode disposed opposite to the upper electrode and spaced apart from the gap,
An electret layer holding a charge is disposed at a position where it does not overlap the vibrator cell on the same substrate as the vibrator cell, and between the upper electrode and the lower electrode in a direction substantially perpendicular to the vibration film. A capacitive ultrasonic transducer having a configuration of being sandwiched.

(Appendix 2)
The capacitive ultrasonic transducer according to appendix 1, wherein the electret layer protrudes from the vibrating membrane portion toward the acoustic radiation portion.

(Appendix 3)
2. The capacitive ultrasonic transducer according to appendix 1, wherein the electret layer is made of a silicon compound or a hafnium compound.

(Appendix 4)
The capacitive ultrasonic transducer according to appendix 1, wherein the electret layer is made of at least a fluorine-based resin.

(Appendix 5)
2. The capacitive ultrasonic transducer according to appendix 1, wherein the electret layer portion has a concave substrate and the surface of the vibrator is substantially flat.

(Appendix 6)
An intracorporeal insertion type ultrasonic diagnostic apparatus comprising the capacitive ultrasonic transducer according to appendix 1 at a distal end of an insertion portion to be inserted into a body cavity.

  Note that the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification. A transducer, an ultrasonic diagnostic apparatus, and an ultrasonic microscope are also included in the technical scope of the present invention.

It is explanatory drawing which shows schematic structure of an ultrasonic endoscope. It is a perspective view which shows the structure of the front-end | tip part of an ultrasonic endoscope. It is a perspective view of a vibrator array. It is the top view which looked at a vibrator unit from the transmitting direction of an ultrasonic wave. It is VV sectional drawing of FIG. It is an equivalent circuit diagram of a vibrator unit. It is a fragmentary sectional view of the field in which the electret layer of the vibrator unit was formed. FIG. 6 is a partial cross-sectional view of a region where an electret layer according to a modification of the first embodiment is formed. It is sectional drawing of the vibrator | oscillator element of 2nd Embodiment. It is a top view of the vibrator unit according to the third embodiment. It is XX sectional drawing of FIG. FIG. 10 is a top view of a transducer unit according to a modification of the third embodiment. It is explanatory drawing which shows schematic structure of an ultrasonic microscope. It is an equivalent circuit diagram of a conventional capacitive transducer.

Explanation of symbols

100 vibrator cell, 100a membrane, 101 silicon substrate, 102 first insulating film, 104 second insulating film, 105 protective film, 107 cavity, 109 back surface insulating film, 110 lower electrode, 111 lower electrode wiring, 114 lower conductive layer, 120 upper electrode, 121 upper electrode wiring, 124 upper conductive layer, 130 electret layer, 131 gap, 132 through hole

Claims (9)

A vibrator cell comprising: a first electrode; a vibration film disposed on the first electrode with a gap; and a second electrode supported by the vibration film;
An electret layer that retains a charge and provides a predetermined potential difference between the first electrode and the second electrode;
An ultrasonic transducer comprising:
The electret layer is disposed in a region separated from the transducer cell when viewed from the transmission direction of ultrasonic waves generated by the vibration film vibrating ,
The electret layer includes a first conductive layer electrically connected to the first electrode, and a second conductive layer disposed above the first conductive layer and electrically connected to the second electrode. Between the conductive layer and
The distance between the first conductive layer and the second conductive layer is wider than the distance between the first electrode and the second electrode separated by the gap in the transducer cell. > Ultrasonic transducer characterized by that. Before Symbol second conductive layer, wherein the area overlapping the electret layer when viewed from the transmission direction of ultrasonic waves, according to claim 1, characterized in that the through hole is formed super Sonic transducer.   The insulating layer is interposed between the electret layer and the first conductive layer, or between the electret layer and the second conductive layer, according to claim 1 or 2. Ultrasonic transducer.   A protective film disposed on the transducer cell and on the second conductive layer, wherein the region of the protective film on the second conductive layer is more than the region on the transducer cell; The ultrasonic transducer according to claim 1, wherein the ultrasonic transducer protrudes in an ultrasonic wave transmission direction.   A protective film is provided on the transducer cell and the second conductive layer, and a surface of the protective film opposite to the second conductive layer is planar. The ultrasonic transducer according to any one of claims 1 to 3. The ultrasonic transducer according to claim 1, wherein the electret layer is made of at least one of a silicon compound and a hafnium oxide. The ultrasonic transducer according to claim 1, wherein the electret layer is made of a resin film. An ultrasonic diagnostic apparatus comprising the ultrasonic transducer according to claim 1. An ultrasonic microscope comprising the ultrasonic transducer according to any one of claims 1 to 7.

Images