JP4885107B2 - 蒸着装置 - Google Patents
蒸着装置 Download PDFInfo
- Publication number
- JP4885107B2 JP4885107B2 JP2007277825A JP2007277825A JP4885107B2 JP 4885107 B2 JP4885107 B2 JP 4885107B2 JP 2007277825 A JP2007277825 A JP 2007277825A JP 2007277825 A JP2007277825 A JP 2007277825A JP 4885107 B2 JP4885107 B2 JP 4885107B2
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- JP
- Japan
- Prior art keywords
- substrate
- support
- vapor deposition
- deposition apparatus
- auxiliary support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007740 vapor deposition Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims description 203
- 238000000034 method Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
図1を参照すれば、基板支持装置100はチャンバ110と、前記チャンバ110内部でチャンバ110内部に搬入される基板140の二つの辺を支持する基板支持部120を含む。
また、基板の垂れ現象を防止して基板前面に合着されるマスクのアレイは、工程時間を減少させることができ、基板上に薄膜を形成する場合、生産性を向上させることができる。
一方、基板支持部220の少なくとも一側には基板260を補助支持する基板補助支持部240が具備される。
また、支持片241c、固定片241b、及び連結台241aを含む支持台241は、基板260の第2辺262と第4辺264とを間に置いて互いに同じ構造体で形成されて、基板260の第2辺262と第4辺264を均一に支持することができる。
220 基板支持部
230 器具部
240 基板補助支持部
250 駆動部
Claims (6)
- 基板支持手段を具備する蒸着装置において、
前記基板支持手段は、チャンバ内部で、前記チャンバ内部に搬入される基板の搬入方向と一致する基板の側辺を支持する基板支持部と、
前記基板支持部で支持されない基板の他の側辺を支持する基板補助支持部と、
を含み、
前記基板支持手段と前記基板補助支持部とは、別々に、基板の厚さ方向に昇降移動させられるようになっていることを特徴とする蒸着装置。 - 前記基板補助支持部は、
前記基板の少なくとも一側辺を支持する支持台と、
前記支持台を上部または下部に移動させる駆動部と、
を含むことを特徴とする請求項1に記載の蒸着装置。 - 前記支持台は、
前記基板の底面と接触する支持片が具備された固定片と、
前記固定片と駆動部とを連結する連結台を含むことを特徴とする請求項2に記載の蒸着装置。 - 前記連結台は、前記基板の両側辺へ延長された一対の構造体であることを特徴とする請求項3に記載の蒸着装置。
- 前記固定片は、前記連結台に接続され、複数から成ることを特徴とする請求項3に記載の蒸着装置。
- 請求項1ないし請求項5のいずれか一項の蒸着装置において、
前記基板補助支持部は、
前記基板の側辺を支持する第1基板補助支持部と、
前記第1基板補助支持部と対向されて位置し、前記基板の同じ側辺を支持する第2基板補助支持部を含むことを特徴とする請求項1ないし請求項5のいずれか一項に記載の蒸着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070089932A KR100947425B1 (ko) | 2007-09-05 | 2007-09-05 | 증착장치 |
KR10-2007-0089932 | 2007-09-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009062608A JP2009062608A (ja) | 2009-03-26 |
JP4885107B2 true JP4885107B2 (ja) | 2012-02-29 |
Family
ID=40471927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007277825A Active JP4885107B2 (ja) | 2007-09-05 | 2007-10-25 | 蒸着装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8123863B2 (ja) |
JP (1) | JP4885107B2 (ja) |
KR (1) | KR100947425B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103305798B (zh) | 2013-05-21 | 2015-08-26 | 上海和辉光电有限公司 | 蒸镀装置及利用该蒸镀装置进行的蒸镀工艺 |
KR101512140B1 (ko) * | 2013-11-15 | 2015-04-16 | 코닉이앤씨 주식회사 | 원자층 증착 장치 및 방법 |
KR102371101B1 (ko) * | 2015-06-30 | 2022-03-10 | 주식회사 선익시스템 | 증착 장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH044061U (ja) * | 1990-04-25 | 1992-01-14 | ||
JP2001181821A (ja) * | 1999-12-20 | 2001-07-03 | Murata Mfg Co Ltd | 真空成膜装置 |
CA2408759A1 (en) * | 2000-06-21 | 2001-12-27 | Exatec, L.L.C. | Method and apparatus for printing on a curved substrate |
JP4707271B2 (ja) * | 2001-06-29 | 2011-06-22 | 三洋電機株式会社 | エレクトロルミネッセンス素子の製造方法 |
JP2003017255A (ja) | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置の製造方法 |
KR100647577B1 (ko) | 2002-06-12 | 2006-11-17 | 삼성에스디아이 주식회사 | 기판정렬장치 및 기판정렬방법 |
US20040086639A1 (en) * | 2002-09-24 | 2004-05-06 | Grantham Daniel Harrison | Patterned thin-film deposition using collimating heated mask asembly |
KR100636482B1 (ko) * | 2005-07-18 | 2006-10-18 | 삼성에스디아이 주식회사 | 유기 발광표시장치 제조용 홀더 |
-
2007
- 2007-09-05 KR KR1020070089932A patent/KR100947425B1/ko active IP Right Grant
- 2007-10-25 JP JP2007277825A patent/JP4885107B2/ja active Active
-
2008
- 2008-09-04 US US12/230,803 patent/US8123863B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR100947425B1 (ko) | 2010-03-12 |
JP2009062608A (ja) | 2009-03-26 |
US8123863B2 (en) | 2012-02-28 |
US20090081364A1 (en) | 2009-03-26 |
KR20090024940A (ko) | 2009-03-10 |
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