JP4793981B2 - EXPANDING DEVICE CONTROL METHOD AND CONTROL DEVICE THEREOF - Google Patents

Description

  The present invention relates to a control method for an expanding apparatus for expanding a chip interval of a plate-like member separated into chips, for example, a semiconductor wafer, and a control apparatus therefor.

  Conventionally, this type of expanding apparatus is described in Patent Document 1, for example. As shown in FIGS. 1 and 2, the expanding apparatus of the same document is a plate-like member that is supported by a first frame (4) via a first UV tape (3) and separated into chips. Before transferring each chip, that is, the chip of the semiconductor wafer (1) after dicing to the second UV tape (9), the chip of the semiconductor wafer (1) after dicing is drawn by stretching the first UV tape (3) in advance. The interval has been expanded.

  Then, each chip after extending the chip interval as described above is transferred from the first UV tape (3) to the second UV tape (9) and picked up by the pickup device in the next process. In addition, the code | symbol in the said parenthesis is a code | symbol used by patent document 1. FIG.

  However, according to the expanding apparatus of Patent Document 1, the chip interval is not measured when the chip interval of the semiconductor wafer (1) separated into chips is expanded. For this reason, when the chip is picked up, a recognition device of the pickup device, for example, when the position of the chip is confirmed by a camera, a process for recognizing the position of the chip or a correction process for aligning the position of the collet for pickup with the recognized position There is a problem that it takes time and the processing capacity is lowered.

Japanese Patent No. 3064979

  The present invention has been made to solve the above-mentioned problems, and its object is to improve the pick-up processing capability when picking up each chip of a plate-like member separated into chips. It is another object of the present invention to provide an expansion device control method and a control device thereof.

In order to achieve the above object, a method for controlling an expanding device according to the present invention includes a method of controlling each chip interval of a plate-like member that is supported by a ring frame via a first sheet and separated into chips. A method of controlling an expanding apparatus that stretches and expands a first sheet , wherein the control method measures the chip interval by an image processing unit after stretching the first sheet to a predetermined position at a first speed. However, the first sheet is stretched at a second speed slower than the first speed, and the chip interval is expanded by a predetermined amount.

  In the control method for an expanding device according to the present invention, the chip interval may be measured at a plurality of locations, and the average value of the measurement data at the plurality of locations may be compared with the set value.

  In the control method for an expanding apparatus according to the present invention, the plate member may be a semiconductor wafer or a compound wafer.

In order to achieve the above object, the control device of the expanding device according to the present invention provides each chip interval of the plate-like member that is supported by the ring frame via the first sheet and separated into a chip shape. A control device for an expanding device that expands and expands a first sheet , wherein the control device sends a signal for stretching the first sheet to a predetermined position at a first speed with respect to the expanding device; Output means for outputting a signal for stretching the first sheet at a second speed slower than the first speed after completion of stretching at a speed of 1, and an image of the plate-like member on the first sheet; Image processing means for capturing and measuring the chip interval from the image; and determining means for determining whether or not the measured chip interval has reached a predetermined amount, and at the first speed, After stretching one sheet to a predetermined position, the image processing means starts the stretching operation of the first sheet at the second speed, and the image processing means performs the stretching operation at the second speed. Capturing an image of the shaped member, measuring the chip interval from the image, and when the determining means determines that the chip interval has reached a predetermined amount, ends the stretching operation at the second speed, When the determination unit determines that the chip interval has not reached the predetermined amount, the second processing is performed by repeatedly performing a series of processing operations of capturing the image, measuring the chip interval, and determining the chip interval. The chip interval is extended by a predetermined amount by a stretching operation at a speed.

  In the control device for an expanding apparatus according to the present invention, the chip interval may be measured at a plurality of locations, and an average value of the measurement data at the plurality of locations may be compared with a set value.

  In the control device for an expanding apparatus according to the present invention, the plate member may be a semiconductor wafer or a compound wafer.

  In the present invention, as described above, after the first sheet is stretched to a predetermined position at the first speed, each chip interval of the plate-like member separated into chips is measured by the image processing means. However, a configuration is adopted in which the first sheet is stretched at a second speed slower than the first speed, and the chip interval is expanded by a predetermined amount. Therefore, when the chip is picked up, the space between the chips is expanded by a predetermined amount of chip interval set in advance. Therefore, when the chip is picked up, a recognition device of the pickup device, for example, when checking the position of the chip with a camera The time for the position recognition process and the correction process for aligning the position of the pickup collet to the recognized position can be shortened, and the effect of improving the pickup processing capability can be obtained.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is an explanatory diagram of an expanding apparatus and its control apparatus to which the present invention is applied, FIG. 2 is a plan view of the expanding apparatus, FIG. 3 is a hardware configuration diagram of the control apparatus, and FIG. 4 is a flowchart showing processing operations of the control apparatus. FIG. 5 is an explanatory diagram of the measurement position of the chip interval.

  The expanding apparatus 1 shown in FIG. 1 has an expanding table 3 mounted and fixed on a frame 2, and a pair of ring frame holding means 4 arranged on both sides of the expanding table 3 is composed of a ball screw mechanism 5 as an elevating means. It has a structure that moves up and down via.

  The ball screw mechanism 5 includes a screw shaft 6 disposed so as to penetrate the frame 2 in the vertical direction, and a pulley 9A rotatably fixed to the lower surface of the frame 2, and the screw shaft 6 is moved up and down by the rotation of the pulley 9A. It is comprised with the bearing part 7 supported so that it is possible. The pulley 9 </ b> A is wound around a driving pulley 9 fixed to the output shaft of the pulse motor 8 by an endless belt 10. As a result, the screw shaft 6 and the ring frame holding means 4 attached to the tip of the screw shaft 6 move up and down together with the rotation of the pulse motor 8.

  The semiconductor wafer 11 as a plate-like member is placed on the upper surface of the expanding table 3 while being supported by the first ring frame 12 via the first sheet 13 and separated into chips. At this time, the first ring frame 12 is set in a form in which both edge portions 12a and 12a are inserted into the holding grooves 14 and 14 of the ring frame holding means 4 as shown in FIG. Note that the first sheet 13 includes an ultraviolet curable adhesive layer, and the semiconductor wafer 11 is adhered to the adhesive layer, and ultraviolet rays are already irradiated to reduce the adhesive strength.

  An image processing unit 16 including a camera 15 is installed above the expanding table 3, and the image processing unit 16 photographs the semiconductor wafer 11 on the first sheet 13 placed on the expanding table 3 with the camera 15. Then, the image is captured, and the chip interval G (see FIG. 5) is measured from the captured image. The chip interval measurement data is output from the image processing means 16 to the control device 17.

  In the case of the present embodiment, the measurement of the chip interval G is performed at a plurality of locations as indicated by arrows in FIG. 5, and the average value and the set value of the measurement data at the plurality of locations are compared. At this time, in order to improve the reliability of the average value, the measurement data (D1 to D9 in FIG. 5) related to the missing portion C1 of the chip C and the dropout portion C2 of the chip C is not adopted. The “set value” is a desired chip interval G to be actually expanded by the expanding apparatus 1 from now on, and can be appropriately changed as necessary.

  As shown in FIG. 3, the control device 17 is composed of a personal computer having various hardware resources such as a CPU 18, a ROM 19, a RAM 20, and a signal output means 21, and a program for executing the processing operations shown in the flowchart of FIG. Built-in.

  The signal output means 21 has a first signal S1 for extending the first sheet 13 to a predetermined position P1 (see FIG. 6) at a first speed V1 with respect to the pulse motor 8 of the expanding apparatus 1, and a first signal S1. After the completion of the stretching at the speed V1, the second signal S2 for stretching the first sheet 13 at the second speed V2 that is slower than the first speed V1 is output. In the present embodiment, pulse signals are used as the first and second signals S1 and S2.

  The CPU 18 performs, for example, a process of outputting the signals S1 and S2 via the signal output means 21.

  Next, the control operation of the control device 17 will be described based on the flowchart of FIG.

  The control device 17 first outputs a first signal S1 to the pulse motor 8 of the expanding device 1 in step St1. As a result, the ring frame holding means 4 and the first ring frame 12 descend at the first speed V1 via the ball screw mechanism 5, and the first seat 13 reaches the predetermined position P1 in FIG. 6 at the first speed V1. Stretched.

  When the stretching at the first speed V1 as described above is completed (St2), the control device 17 then outputs the second signal S2 to the pulse motor 8 of the expanding device 1. As a result, the ring frame holding means 4 and the first ring frame 12 are moved down together at the second speed V2, and the first sheet 13 is stretched at the second speed V2 (St3).

  When the stretching operation at the second speed V2 is started as described above, the image processing means 16 captures an image from the camera 15 while performing this stretching operation (St4), and the chip interval G is set from the captured image. Measurement is performed (St5), and the measurement data is output from the image processing means 16 to the control device 17, and the control device 17 determines whether or not the chip interval G has reached a predetermined amount (St6). In the present embodiment, the fact that the average value of the measurement data is within the allowable range of the set value is expressed as reaching a predetermined amount, and the allowable range can be changed as appropriate.

  Here, when it is determined that the chip interval G has reached the predetermined amount, the purpose of setting the chip interval G to the predetermined amount has been achieved, so the stretching operation at the second speed V2 is terminated (St7). On the other hand, when it is determined that the chip interval G has not reached the predetermined amount, the process returns to step St4 while performing the enlargement operation at the second speed V2, and captures an image (St4) and measures the chip interval ( A series of processing operations of St5) and chip interval determination (St6) are performed. This series of processing operations is repeatedly performed until the chip interval G reaches a predetermined amount by the stretching operation at the second speed V2, and when the predetermined interval is reached, the series of processing operations is completed. The stretching operation at the speed V2 of 2 is also finished (St7) (see FIG. 7).

  After the stretching operation at the second speed V2 as described above is completed, the second sheet 22 having the ultraviolet curable adhesive layer is placed from above the first ring frame 12 as shown in FIG. The attached second ring frame 23 is lowered, the second sheet 22 is bonded to the chip C of the semiconductor wafer 11 whose chip interval is expanded by a predetermined amount, and then the first sheet 13 is peeled to transfer the chip C. Is done. The transferred chip C is picked up by a pickup device in the next process.

  FIG. 8 is a graph showing the enlargement of the present embodiment. As shown in the figure, the stretching operation at the first speed V1 is performed from the stretching start position of X0 to the predetermined pulse X1, at which point the camera 15 is started and the tip interval G reaches a predetermined amount. Until the determination is made, the stretching operation is continuously performed at the second speed V2 that is slower than the first speed V1.

  As can be understood from the above description, in the control device 17 of the present embodiment, the first sheet 13 is stretched to the predetermined position P1 at the first speed V1, and then the first image 13 taken in by the image processing means 16 is used. The first sheet 13 is stretched at a second speed V2 slower than the first speed V1 while measuring the chip interval G from the image of the semiconductor wafer 11 on the first sheet 13, and the chip interval G is expanded by a predetermined amount. The control method is adopted. Therefore, when the chip is picked up, the space between the chips is expanded by a predetermined amount of chip interval set in advance. Therefore, when the chip is picked up, a recognition device of the pickup device, for example, when checking the position of the chip with a camera The time for the position recognition process and the correction process for aligning the position of the pickup collet with the recognized position can be shortened, and the pickup processing capability can be improved.

  In the control device 17 of the above-described embodiment, the stretching operation is uniformly performed at the same second speed V2 during the period from image capture to chip interval determination processing (during the processing time from St4 to St6 in FIG. 4). Although the configuration is employed, the stretching operation may be performed at a third speed that is slower than the second speed V2 only during the chip interval measurement process (St5 in FIG. 4). According to such a configuration, even when it takes time to measure the chip interval, the stretching operation is performed at the third speed slower than the second speed during the measurement process. It is possible to effectively prevent the chip interval G from exceeding a predetermined amount of allowable range while waiting for the determination result.

  In the control device 17 of the above-described embodiment, after the stretching operation at the first speed V1 is completed, the control device 17 shifts to the continuous stretching operation at the second speed V2, but instead, You may comprise so that it may transfer to intermittent extending | stretching operation | movement. In this case, an image of the plate member may be captured by the image processing means while the intermittent stretching operation is stopped, the chip interval may be measured from the image, and the chip interval may be expanded by a predetermined amount.

  FIG. 9 is a flowchart showing the processing operation of the control device when the intermittent stretching operation is performed. The processing operation of the control device 17 will be described based on this flowchart. In the first step St1, the control device 17 starts the stretching operation of the first sheet 13 at a predetermined speed. When this operation is completed (St2), the first sheet 13 is then intermittently stretched. The operation proceeds (St3). While the intermittent stretching operation is stopped (St4), the image processing means 16 captures an image from the camera 15 (St5), and measures the chip interval G from the captured image (St6). Is output from the image processing means 16 to the control device 17, and the control device 17 determines whether or not the chip interval G has reached a predetermined amount (St7). Here, when it is determined that the chip interval G has reached the predetermined amount, the intermittent stretching operation is not performed thereafter (St8). On the other hand, when it is determined that the chip interval G has not reached the predetermined amount, the process returns to Step St3, and the processes from St3 to St7 are repeated until the chip interval G reaches the predetermined amount by the intermittent stretching operation. When the predetermined amount is reached, the intermittent stretching operation is terminated (St8).

  FIG. 10 is a graph showing a case where the first sheet is intermittently stretched and the stretch amount is determined. As shown in the figure, during the period from the starting position of X0 stretching to the predetermined pulse X1, the stretching operation is performed at a predetermined speed V1, and the camera 15 is started at that time, while the stretching operation is stopped, The process of taking in and determining the chip interval is performed, and an intermittent stretching operation is performed until it is determined that the chip interval G has reached a predetermined amount.

  In the above-described embodiment, the configuration in which the chip interval is measured by the image processing unit 16 is employed. However, the chip interval measurement process may be performed by the control device 17. In the case of this configuration, the image of the camera 15 is output from the image processing means 16 to the control device 17, and the control device 17 measures the chip interval from the image.

  In the above embodiment, the case where the plate-like member is the semiconductor wafer 11 is shown, but a compound wafer represented by gallium nitride (GaN) forming a light emitting diode may be used.

Explanatory drawing of the expanding apparatus and its control apparatus to which this invention is applied. The top view of an expanding apparatus. The hardware block diagram of a control apparatus. The flowchart which showed the processing operation of the control apparatus. Explanatory drawing of the measurement position of a chip | tip space | interval. The state explanatory view of the expanding device when the stretching operation at the first speed is completed. The state explanatory view of the expanding device when the stretching operation at the second speed is completed. The graph in the case of determining the stretch amount while continuously stretching the first sheet at a second speed that is slower than the first speed. The flowchart which showed the processing operation of the control apparatus when intermittent stretching operation is performed. The graph in the case of determining the amount of stretching while stretching the first sheet intermittently.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Expand apparatus 8 Pulse motor 11 Semiconductor wafer (plate-shaped member)
12 ring frame 13 first sheet 16 image processing means 17 control device 22 second sheet

Claims (4)

A control method of an expanding device for extending each chip interval of a plate-like member that is supported on a ring frame via a first sheet and separated into chips, by extending the first sheet ,
The control method is:
After stretching the first sheet to a predetermined position at a first speed, the first sheet is stretched at a second speed slower than the first speed while measuring the chip interval by an image processing unit, A method for controlling an expanding apparatus, wherein the chip interval is expanded by a predetermined amount. The method of controlling an expanding device according to claim 1, wherein the measurement of the chip interval is performed at a plurality of locations, and an average value of the measurement data at the plurality of locations is compared with a set value. A control device for an expanding device that expands and expands each chip interval of a plate-like member that is supported on a ring frame via a first sheet and separated into chips ,
The controller is
A signal for stretching the first sheet to a predetermined position at a first speed with respect to the expanding device, and the first speed at a second speed slower than the first speed after completion of stretching at the first speed. Output means for outputting a signal for stretching the sheet;
Image processing means for capturing an image of the plate-like member on the first sheet and measuring the chip interval from the image;
Determining means for determining whether the measured chip interval has reached a predetermined amount,
After stretching the first sheet to a predetermined position at the first speed, starting the stretching operation of the first sheet at the second speed;
While performing the stretching operation at the second speed, the image processing unit captures an image of the plate-like member, measures the chip interval from the image, and determines that the chip interval has reached a predetermined amount. Is determined, the stretching operation at the second speed is terminated, and when the determination unit determines that the chip interval has not reached a predetermined amount, the image capture, the chip interval measurement, A controller for an expanding apparatus, wherein the chip interval is expanded by a predetermined amount by the stretching operation at the second speed by repeatedly performing a series of processing operations of determining the chip interval. The control of the expanding device according to claim 3, wherein the measurement of the chip interval is performed at a plurality of locations, and an average value and a set value of the measurement data at the plurality of locations are compared.

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