JP4791439B2 - Plasma display panel and manufacturing method thereof - Google Patents

Description

  The present invention relates to a plasma display panel, and more particularly to a dielectric of a plasma display panel and a method for forming the same.

  With the advent of the multimedia era, there has been a demand for the appearance of display devices capable of expressing finer, larger and more natural colors. However, there is a limit to the current CRT (Cathode Ray Tube) in order to construct a large screen of 40 inches or more. It is developing rapidly to expand its applications.

  The biggest feature of the display device such as the above-mentioned PDP is that it is manufactured with a thinner thickness than a CRT which is a self-luminous type, and it is not only easy to produce a large flat screen (60 to 80 inches), but also the style and The design is clearly distinguished from the conventional CRT.

  The PDP has a discharge cell defined by a lower plate having an address electrode, an upper plate having a sustain electrode pair, and a barrier rib, and a phosphor is applied to the discharge cell to display a screen. . Specifically, when a discharge occurs in the discharge space between the upper plate and the lower plate, ultraviolet rays generated at this time are incident on the phosphor to generate visible light, and the visible light causes the screen to appear. Is displayed.

  However, the plasma display panel and the manufacturing method thereof according to the above-described process have the following problems.

  In order to improve the luminous efficiency of the plasma display panel, it is necessary to reduce the discharge current. However, the discharge current is greatly affected by the thickness of the dielectric layer. Usually, when the dielectric layer is thin, the discharge start voltage decreases, the discharge current increases, and when the dielectric layer is thick, the discharge starts. The voltage increases and the discharge current decreases. Therefore, when the thickness of the dielectric film is simply increased, the discharge current decreases, but the discharge start voltage increases.

  Further, the conventional plasma display panel described above has the following problems.

  The contrast ratio of the plasma display panel means the ratio between the maximum brightness and the minimum brightness. Since the plasma display panel has a high light reflectance in a bright room, there is a problem that the bright room contrast is lower than that of other display devices such as an LCD (Liquid Crystal Display). There is also a problem that the color temperature of the plasma display panel decreases as the reflectance of the external light increases.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method of forming a differential dielectric on a substrate of a plasma display panel and an apparatus used therefor. is there.

  Another object of the present invention is to improve the color temperature by increasing the bright room contrast of the plasma display panel.

  In order to solve the above-described problems, the present invention provides a plasma including a first panel including a first substrate on which address electrodes are formed, and a second panel including a second substrate on which sustain electrode pairs are formed. A method of manufacturing a display panel, comprising: applying a first dielectric on the second substrate; and a second dispensing device including a nozzle having an inverted trapezoidal jet on the first dielectric. Applying a dielectric material to the differential structure; drying and firing the first dielectric material and the second dielectric material; drying and firing the first dielectric material and the second dielectric material. Forming a protective film on the second dielectric formed in this manner; and joining the first panel and the second panel.

  According to another embodiment, the present invention includes a first panel including a first substrate on which an address electrode is formed, and a second panel including a second substrate on which a sustain electrode pair is formed. In the plasma display panel in which the second panel and the second panel are arranged to face each other, a first dielectric formed on the second substrate; formed on the first dielectric and chromatic, gray or black A second dielectric material having a step structure; and a protective film formed on the first dielectric material and the second dielectric material.

  According to another embodiment, the present invention provides a plasma display panel including a first panel including a first substrate on which address electrodes are formed, and a second panel including a second substrate on which sustain electrode pairs are formed. A method of manufacturing, comprising: applying a first dielectric on the second substrate; and including a chromatic, gray, or black material on a region corresponding to a non-discharge space of the first dielectric Applying a second dielectric material with a dispensing device; drying and firing the first dielectric material and the second dielectric material; drying the first dielectric material and the second dielectric material; Forming a protective film on the second dielectric formed by firing; and bonding the first panel and the second panel.

  According to the present invention, it is possible to provide a method of forming a differential dielectric material on a substrate of a plasma display panel and an apparatus used therefor.

  Other objects, features and advantages of the present invention will become apparent through the detailed description of the embodiments with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention capable of specifically realizing the above object will be described with reference to the accompanying drawings.

  In the accompanying drawings, in order to clearly represent a large number of layers and regions, the thicknesses thereof are shown enlarged, but the thickness ratios between the layers shown in the drawings indicate actual thickness ratios. It is not a thing.

  FIG. 1 is a view showing a discharge cell structure of an embodiment of a plasma display panel according to the present invention. Hereinafter, a discharge cell structure of an embodiment of a plasma display panel according to the present invention will be described with reference to FIG.

  As shown in FIG. 1, in the plasma display panel of the present invention, a pair of sustain electrodes 180a and 180b provided in one direction on a front substrate 170 and bus electrodes 180a ′ and 180b ′ made of a normal metal material are formed. Is done. A dielectric and a protective film 195 are sequentially formed on the front substrate 170 while covering the sustain electrode pairs 180a and 180b and the bus electrodes 180a ′ and 180b ′.

The front substrate 170 is formed through processing such as milling and cleaning of display substrate glass. Here, the sustain electrode pairs 180a and 180b are formed by applying a photo-etching method by sputtering or a lift-off method by CVD to ITO (Indium-Tin-Oxide) or SnO ₂ or the like. The bus electrodes 180a ′ and 180b ′ are configured to contain silver (Ag) or the like. Further, a black matrix is formed on the scan electrode and the sustain electrode, and the black matrix includes a low-melting glass and a black pigment.

  A dielectric is formed on the front substrate 170 on which the sustain electrode pairs 180a and 180b and the bus electrodes 180a 'and 180b' are formed. As illustrated, the dielectric includes a first dielectric 190a and a second dielectric 190b. Here, the first dielectric 190a includes a transparent low-melting glass and has a thickness of about 5 to 30.5 μm.

  The second dielectric 190b further includes a metal oxide in addition to the transparent low melting point glass. Here, the metal oxide includes at least one of cobalt, copper, manganese, and chromium oxides. Accordingly, the second dielectric 190b is chromatic, gray or black.

  The second dielectric 190b is formed only in a region corresponding to the non-discharge space of the first dielectric 190a. That is, the second dielectric 190b is not formed on the region corresponding to the space between the sustain electrode pair 180a and 180b. In other words, the thickness of the dielectric is not constant but varies from part to part, and has a structure such as a difference. At this time, as illustrated, the second dielectric 190b is formed in a trapezoidal shape, but may be formed in a rectangular shape. The shape of the second dielectric 190b varies depending on the formation process, which will be described later.

  The second dielectric 190b has a thickness of about 7.5 to 33 [mu] m and is separated by about 200 to 400 [mu] m. Further, one width of the second dielectric 190b is 276 to 476 μm.

  A protective film 195 is formed on the first dielectric 190a and the second dielectric 190b. The protective film 195 includes magnesium oxide or the like, and may protect the dielectric from ion bombardment during discharge (+) and increase secondary electron emission. Here, the protective film 195 may be formed with a two-layer structure. In this case, the first layer in contact with the dielectric is formed as a thin film, and the second layer in contact with the discharge space is formed with a magnesium oxide single crystal in the form of nanopowder. It has an uneven shape that is not flat. At this time, since the surface area where ultraviolet ions collide with the protective film during gas discharge increases, the amount of secondary electrons emitted increases and the discharge start voltage decreases. As a result, the discharge efficiency is increased and the jitter is increased. (Jitter) can be reduced.

  On the other hand, an address electrode 120 is formed on one surface of the back substrate 110 along the crossing direction of the sustain electrode pair 180 a and 180 b, and a white dielectric 130 is formed on the entire surface of the back substrate 110 while covering the address electrode 120. It is formed. The white dielectric 130 is applied through a printing method or a film laminating method and then completed through a baking process. A partition 140 is disposed between the address electrodes 120 on the white dielectric 130. Here, the barrier rib 140 is a stripe-type, a well-type, or a delta-type.

  Although not shown, a black top 145 a is formed on the partition 140. And between each partition 140, the phosphor layer 150a, 150b, 150c of red (R), green (G), and blue (B) is formed. A crossing point between the address electrode 120 on the back substrate 110 and the sustain electrode pair 180a and 180b on the front substrate 170 is a portion constituting each discharge cell.

  In the plasma display panel according to the above-described embodiment, a step is formed in the dielectric provided on the front substrate, whereby the discharge start voltage is lowered and the power consumption is improved. Since a part of the dielectric provided on the front substrate represents hue, reflection of external light is reduced, bright room contrast is increased, and color temperature is improved.

  2A to 2P are diagrams illustrating an embodiment of a method for manufacturing a plasma display panel according to the present invention, and FIGS. 3A to 3C are diagrams illustrating embodiments of a dispensing apparatus. Hereinafter, a method for manufacturing a plasma display panel according to the present invention will be described with reference to FIGS. 2A to 2P and FIGS. 3A to 3C.

  First, as shown in FIG. 2A, on the front substrate 170, a pair of sustain electrodes 180a and 180b and bus electrodes 180a ′ and 180b ′ are formed. Here, the front substrate 170 is manufactured through milling and cleaning of glass for display substrates or soda-lime glass.

The sustain electrode pairs 180a and 180b are formed by subjecting ITO or SnO ₂ to a photo-etching method by sputtering or a lift-off method by CVD. The bus electrodes 180a ′ and 180b ′ are formed by subjecting a material such as silver (Ag) to a screen printing method or a photosensitive paste method. A black matrix is formed on the sustain electrode pair 180a and 180b. The black matrix is formed by applying a screen printing method or a photosensitive paste method to a low melting point glass and a black pigment.

  Next, as shown in FIG. 2B, a first dielectric 190a is formed on the front substrate 170 on which the sustain electrode pairs 180a and 180b and the bus electrodes 180a 'and 180b' are formed. Here, the first dielectric 190a is formed by applying a screen printing method, a coating method, or a method of laminating a green sheet (in the case of the XGA class) to a material including a low-melting glass or the like to a thickness of about 5 to 30.5 μm. Laminate by thickness.

  Next, a second dielectric 190b is formed on the first dielectric 190a. First, as shown in FIG. 2C, a second dielectric material 190b 'is applied and patterned on the first dielectric 190a. The second dielectric material 190b 'includes a metal oxide in addition to the low-melting glass. The second dielectric material 190b 'described above is applied and patterned to form a second dielectric 190b having a step as shown in FIG. 2D.

  Here, a method of forming the second dielectric 190b includes a screen printing method and a sanding method.

  The screen printing method is a method of printing a plurality of times at a position where the second dielectric 190b is to be formed. If the second dielectric 190b is formed by screen printing, the paste material is printed in a certain pattern. The screen printing method has a simple process and can use low-cost equipment. However, since the uniformity of the thickness and width is poor, there is a concern that the precision is lowered in the case of a high definition pattern. And even after the baking step, the mesh mark of the screen mask remains as it is, so that the surface illuminance decreases. In particular, in the case of a large panel, pattern mismatch may occur due to deformation of the screen mask.

  Then, after forming a dielectric material by the green sheet method or the like and patterning a mask thereon, cutting particles such as ceramic particles and calcium carbonate fine particles are blown at a high pressure, which is unnecessary using the kinetic energy. The part is cut, and the second dielectric 190b having a differential structure is formed by a sanding method. The sanding method can be manufactured up to a line width of 50 μm or less, but there is a problem that environmental damage is caused by dust, and in the case of high definition, it cannot withstand collision energy and cracks in the pattern occur. .

  When the second dielectric 190b is formed by a coating method or a green sheet method, first, a dielectric material is applied and then patterned. As shown in FIG. 2C, a second dielectric material 190b 'is applied on the first dielectric 190a. Next, the second dielectric material 190b 'is patterned. FIG. 2C shows an example in which the second dielectric material 190b' is selectively exposed with the mask 250 covered.

  As shown, the light is selectively projected only on the portion where the mask 250 is not selected. After completing the above-described exposure process, after undergoing development and baking processes, the second dielectric 190b is completed as shown in FIG. 2D. At this time, the width of the second dielectric 190b can be adjusted by adjusting the width of the mask in the firing step.

  Hereinafter, the patterning process described above will be described in detail. After covering the mask 250, only the position where the second dielectric 190b is to be formed is irradiated with light. Here, it is preferable that the light is irradiated only on the second dielectric material 190b 'on the non-discharge space. That is, light is irradiated only to a width of about 276 to 476 μm in the XGA class. When the above-described steps are completed, the second dielectric 190b is patterned with a step and has a thickness of 7.5 to 33 μm. In FIG. 2D, the second dielectric 190b is patterned into a trapezoid, but it may be patterned into a quadrangle, which will be described later.

  The completed second dielectric 190b represents a chromatic color, gray or black. The metal oxide included in the second dielectric material 190b ′ includes a material selected from the group consisting of oxides of cobalt (Co), copper (Cu), manganese (Mn), and chromium (Cr). When configured, the second dielectric 190b is tinged with blue.

  Hereinafter, an embodiment of a method of forming the second dielectric using a dispensing apparatus will be described.

  FIG. 3A shows a part of the dispensing apparatus. The dielectric material stored in the dispenser 300 is applied to the substrate 320 through the nozzle 310. At this time, the dielectric material is applied onto the substrate depending on the moving speed of the dispenser 300 and the amount of the dielectric material ejected from the nozzle 310. The shape and thickness of the dielectric material changes.

  FIG. 3B is a view showing a nozzle of the dispensing apparatus shown in FIG. 3A. As shown in FIG. 3B, the injection part 310 ′ provided in the nozzle 310 has an inverted trapezoidal shape. Accordingly, the dielectric material 190b 'sprayed through the spraying section 310' is applied in an inverted trapezoidal shape with a constant interval as shown in FIG. 2E. Specifically, the inverted trapezoid of the injection unit 310 ′ preferably has a length ratio between the upper side and the lower side of 1.5: 1 to 2: 1, and is thereby applied onto the first dielectric 190 a. The second dielectric material 190b ′ is also applied in an inverted trapezoid. Here, the inverted trapezoid means the cross-sectional shape of the second dielectric material 190b ′, and the second dielectric material 190b ′ has a three-dimensional hexahedron, and the area of the upper surface is larger than the area of the lower surface. Structure.

  As described above, after the first dielectric 190a and the second dielectric material 190b 'are applied to form a differential dielectric structure, the dielectric is dried and fired. The drying step is a step of evaporating a solvent or the like of the dielectric material, and is preferably performed at about 100 to 150 ° C. Next, the dielectric material firing step is performed at a temperature of about 500-600 ° C.

  In the drying and firing steps, a part of the dielectric material having fluidity is deformed. That is, a part of the upper side end portion of the inverted trapezoidal second dielectric material 190b 'flows down, and as shown in FIG. 2F, a differential dielectric structure close to a right-angle shape is formed. That is, when the second dielectric material 190b 'is applied in a right-angle shape, a part of the upper surface collapses during the drying and firing processes, and the upper surface has a curved surface shape or a trapezoidal shape as a whole. Therefore, in this embodiment, a dielectric material having a differential structure is applied to an inverted trapezoid, and after the drying and firing steps, a differential dielectric having a shape close to a right angle, that is, a structure close to a rectangular parallelepiped is formed.

  FIG. 3C shows the nozzle of the second embodiment of the dispensing apparatus. In the dispensing apparatus according to the present embodiment, the dielectric material is applied to the substrate through the jetting part of the nozzle. The shape and thickness of the dielectric material applied onto the substrate vary depending on the moving speed of the dispenser and the amount of the dielectric material to be ejected. As shown in the drawing, in the dispensing apparatus, the injection units 331, 332, and 333 provided in the nozzle 310 are grouped. That is, the injection units are not separated with the same interval, and a large number of injection units gather to form the injection unit group 330. Here, two or more injection units are grouped in the injection unit group, and three injection units are grouped in the injection unit group illustrated in FIG. 3C. One injection unit group has a horizontal length of 200 to 400 μm and a vertical length of 100 to 300 μm. Here, the horizontal direction and the vertical direction are the same as those shown in FIG. 3C attached, and the direction toward the adjacent injection unit is the horizontal direction.

FIG. 2G is a cross-sectional view of an embodiment in which a second dielectric material is applied using the dispensing apparatus shown in FIG. 3C. In FIG. 2G, a second dielectric material 190b ′ is formed on the first dielectric 190a. Here, the ink applied onto the first dielectric 190a from the ejection units belonging to one ejection unit group gathers to form the second dielectric material 190b ′. That is, two injection units may be grouped to form an injection unit group. However, in the present embodiment, since three injection units are grouped to form an injection unit group, one second dielectric layer is , Formed in a bend and has three vertices . Here, in this embodiment, the ejection unit located in the middle of one ejection unit group ejects the largest amount of ink, and in FIG. 2G, the middle of the three vertices of the second dielectric material 190b ′. The part is the highest.

  As described above, after the first dielectric material and the second dielectric material are applied and the differential dielectric structure is formed, the dielectric layer is dried and baked. This is the same as the first embodiment described above.

  In the drying and firing steps, a part of the dielectric material having fluidity is deformed. That is, a part of the high portion of the ink ejected from the ejecting units forming one ejecting unit group flows down and is integrated with the adjacent portion. As a result, as shown in FIG. 2F, a differential dielectric structure close to a right-angled shape is formed. That is, when the second dielectric layer is applied in a right-angled shape, a part of the upper surface collapses during the drying and firing processes, and the upper surface has a curved surface shape or an overall trapezoidal shape.

  Therefore, in this embodiment, when a large number of differential dielectrics are applied so as to be adjacent to each other, a part of the ink flows down and is integrated in the drying and baking processes to form a second dielectric having a shape close to a square. The different ejection unit groups are designed to have a long distance so that the second dielectric material composed of the ink ejected from the different ejection unit groups is not integrated into one, and the overall structure is different. Maintained.

  Next, as shown in FIG. 2H, a protective film 195 is deposited on the dielectric. Here, the second dielectric 190b has a trapezoidal difference structure, but may have a structure as shown in FIG. 2D. The protective film 195 can include a dopant such as silicon (Si). Here, the protective film 195 is formed by a chemical vapor deposition (CVD) method, an electron beam (E-beam) method, an ion plating (Ion-plating) method, a sol-gel method, a sputtering method, or the like. At this time, when silicon is doped in the protective film, the jitter value in the address period is decreased, and another material can be used as a dopant instead of silicon in order to reduce the jitter value. The protective film includes a first protective film in the form of a thin film and a second protective film in the form of a single crystal nanopowder.

  Thereafter, as shown in FIG. 2I, address electrodes 120 are formed on the back substrate 110. Here, the back substrate 110 is formed through processing such as milling or cleaning of display substrate glass or soda-lime glass. Next, address electrodes 120 are formed on the back substrate 110. The address electrode 120 is formed by subjecting silver (Ag) or the like to a screen printing method, a photosensitive paste method, a photoetching method after sputtering, or the like.

Then, as shown in FIG. 2J, a dielectric 130 is formed on the back substrate 110 on which the address electrodes 120 are formed. The dielectric 130 is formed by applying a screen printing method or green sheet laminating to a material containing a low melting point glass and a filler such as TiO ₂ . Here, the lower plate dielectric 130 preferably represents white in order to increase the luminance of the plasma display panel.

Next, as shown in FIGS. 2K to 2N, barrier ribs for dividing each discharge cell are formed. At this time, the partition wall material 140a includes a matrix glass and a filler. The matrix glass is configured to include PbO, SiO ₂ , B ₂ O ₃ and Al ₂ O ₃ , and the filler is configured to include TiO ₂ and Al ₂ O ₃ .

  Next, the barrier rib material 140a is patterned to form barrier ribs. At this time, the patterning process is performed by developing after exposing the mask. That is, when a mask is positioned at a portion corresponding to the address electrode and exposure is performed, after the development and baking steps, only the light irradiated portion remains and a partition is formed. Here, when a photoresist component is included in the partition wall material, the partition wall material can be easily patterned.

  Next, as shown in FIG. 2O, phosphors 150a, 150b, and 150c are coated on the surface of the lower dielectric layer 130 that contacts the discharge space and the side surfaces of the barrier ribs. R, G, and B phosphors are sequentially applied by each discharge cell, and the phosphors are applied by a screen printing method or a photosensitive paste method.

  Then, as shown in FIG. 2P, the upper panel (corresponding to the second panel of the present invention) and the lower panel (corresponding to the first panel of the present invention) are joined and sealed across the partition wall, and the impurities inside the Then, a discharge gas 160 is injected.

  From the above description, those skilled in the art will understand that various changes and modifications can be made without departing from the technical idea of the present invention.

  Therefore, the technical scope of the present invention should not be limited to the contents described in the examples, but should be defined by the claims.

FIG. 3 is a view showing a unit cell of a plasma display panel according to the present invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. It is the figure which showed the manufacturing process of the manufacturing method of the plasma display panel which concerns on this invention. 1 is a view showing an example of a dispensing apparatus used for manufacturing a plasma display panel according to the present invention. 1 is a view showing an example of a dispensing apparatus used for manufacturing a plasma display panel according to the present invention. 1 is a view showing an example of a dispensing apparatus used for manufacturing a plasma display panel according to the present invention.

Explanation of symbols

110 Rear substrate 120 Address electrode 130 White dielectric 140 Bulkhead 150a, 150b, 150c Phosphor layer 170 Front substrate 180a, 180b Sustain electrode pair 180a ', 180b' Bus electrode 190a, 190b First and second dielectrics

Claims (14)

Preparing a first substrate including an address electrode, dielectric and barrier ribs,
Applying a first dielectric on a second substrate including a pair of sustain electrodes ;
And applying a second dielectric on the first dielectric,
A step of drying and firing the second dielectric and said first dielectric,
Forming a protective film on said second dielectric and said first dielectric,
Bonding the first substrate and the second substrate such that a plurality of discharge spaces and non-discharge spaces are formed ,
By forming the second dielectric only in a region corresponding to the non-discharge space of the first dielectric, a region corresponding to the discharge space of the second dielectric is exposed,
The second dielectric is formed to be bent and has three vertices;
A method for manufacturing a plasma display panel, wherein an intermediate portion is highest among the three vertices . The second dielectric is:
2. The method of manufacturing a plasma display panel according to claim 1, wherein the plasma display panel is applied in an inverted trapezoidal shape. The drying step
The method for manufacturing a plasma display panel according to claim 1, wherein the method is performed at 100 to 150 ° C. The firing step includes
The method for manufacturing a plasma display panel according to claim 1, wherein the method is performed at 500 to 600 ° C. The second dielectric is:
The method for manufacturing a plasma display panel according to claim 1, comprising a chromatic, gray or black material. Applying the second dielectric comprises:
2. The method of manufacturing a plasma display panel according to claim 1, wherein a dielectric material containing a metal oxide is applied on the first dielectric. The dielectric material is:
7. The method for manufacturing a plasma display panel according to claim 6 , comprising a substance selected from the group consisting of metal oxides of cobalt, copper, manganese or chromium. The first substrate and the second substrate are joined to each other so that a plurality of discharge spaces and non-discharge spaces are formed, and a partition wall is disposed between the first substrate and the second substrate,
A first substrate comprising an address electrode and a dielectric;
A second substrate comprising a sustain electrode pair and a first dielectric;
Is formed on the first dielectric member, chromatic, and a grayish or black, and a plurality of second dielectric having steps with respect to the first dielectric,
A protective film formed on the first dielectric and the second dielectric ,
The plurality of second dielectrics are formed only in a region corresponding to the non-discharge space of the first dielectric, thereby exposing a region corresponding to the discharge space of the second dielectric,
The second dielectric is formed to be bent and has three vertices;
The plasma display panel, wherein an intermediate portion is the highest among the three vertices . The second dielectric is:
The plasma display panel according to claim 8 , comprising a metal oxide. The second dielectric is:
10. The plasma display panel according to claim 9 , comprising a material selected from the group consisting of cobalt, copper, manganese or chromium metal oxides. The first dielectric is:
The plasma display panel according to claim 8 , wherein the thickness is 5 to 30.5 μm. The second dielectric is:
The plasma display panel according to claim 8 , wherein the thickness is 7.5 to 33 µm. 9. The plasma display panel of claim 8 , wherein the second dielectrics are spaced apart from each other by 200 to 400 [mu] m. The plasma display panel of claim 8 , wherein the second dielectric has a width of 276 to 476m.