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JP4783583B2 - Method for internal electrical insulation of a substrate for a power semiconductor module - Google Patents

Method for internal electrical insulation of a substrate for a power semiconductor module Download PDF

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Publication number
JP4783583B2
JP4783583B2 JP2005126525A JP2005126525A JP4783583B2 JP 4783583 B2 JP4783583 B2 JP 4783583B2 JP 2005126525 A JP2005126525 A JP 2005126525A JP 2005126525 A JP2005126525 A JP 2005126525A JP 4783583 B2 JP4783583 B2 JP 4783583B2
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substrate
power semiconductor
insulating
semiconductor module
insulating mass
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JP2005322902A (en
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アウグスティン カールハインツ
ゲープル クリスティアン
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Semikron Elektronik GmbH and Co KG
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  • Engineering & Computer Science (AREA)
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Abstract

Applied up to the edge of a substrate (20), an insulating substance (IS) (70) is not fully cross-linked before fitting the substrate in a casing (60) so designed that, during its interlocked fitting, a recess (62) remains over one part of the casing's width. When placed in this recess and after complete curing/hardening-off, the IS acts an adhesive bond between the casing and the substrate.

Description

本発明は、パワー半導体モジュール用の基板を内部電気絶縁するための方法に関する。この種のパワー半導体モジュールは、カバーを備えたフレーム状の絶縁プラスチックハウジングと、絶縁基板とを有する。基板上には、少なくとも１つの導体パスと、この導体パス上の少なくとも１つのパワー半導体素子とが配設されている。このパワー半導体素子は、コネクタ要素、他の導体パス、及び／又は、他のパワー半導体素子と、回路に適して接続されている。従来技術としてモジュール内部のこの種の接続部はボンディング接続部により成される。   The present invention relates to a method for internal electrical insulation of a substrate for a power semiconductor module. This type of power semiconductor module has a frame-shaped insulating plastic housing provided with a cover, and an insulating substrate. On the substrate, at least one conductor path and at least one power semiconductor element on the conductor path are disposed. This power semiconductor element is suitably connected to a connector element, another conductor path, and / or another power semiconductor element in a circuit. Conventionally, this type of connection inside the module is made by a bonding connection.

この種のパワー半導体モジュールの内部絶縁の従来技術として誘電絶縁マス（dielectric isolation mass）があり、この誘電絶縁マスは、所謂硬質注形材又は所謂軟質注形材又はそれらの組み合わせとして形成されている。硬質注形材は、その化学的な構成と、それと関連する健康上の危険性とに基づき、益々とその利用が少なくなっている。軟質注形材としては、従来技術として、様々に形成されているシリコーンゴムバリエーションがその価値を認められている。   There is a dielectric isolation mass as a prior art of internal insulation of this type of power semiconductor module, and this dielectric insulation mass is formed as a so-called hard casting material, a so-called soft casting material, or a combination thereof. . Hard castings are becoming less and less used due to their chemical composition and the associated health hazards. As a soft casting material, as a conventional technique, variously formed silicone rubber variations have been recognized for their value.

頻繁に二成分シリコーンゴムバリエーションが使用され、これらのシリコーンゴムバリエーションは、パワー半導体モジュールへの充填直前に初めて適切な装置内で混合される。パワー半導体モジュールへの充填、従ってその内部絶縁は、絶縁すべき重要な全ての構成部品を確実に覆うことを保証する充填高さに至るまで実施される。   Frequently, two-component silicone rubber variations are used, and these silicone rubber variations are mixed in a suitable apparatus for the first time just before filling the power semiconductor module. The filling of the power semiconductor module, and therefore its internal insulation, is carried out to a filling height that ensures that all the important components to be insulated are covered securely.

従来技術によるパワー半導体モジュールの前記内部絶縁における欠点は、絶縁のために必要ではなく均等な充填のためにのみ必要である注形マスが、高い割合でパワー半導体モジュールの内部に配設されているということである。   The disadvantage of the internal insulation of the power semiconductor module according to the prior art is that a casting mass, which is not necessary for insulation but only for even filling, is arranged at a high rate inside the power semiconductor module. That's what it means.

本発明の基礎を成す課題は、電気特性を同様に留め、使用される絶縁マスの量を少なくとも半減させる、パワー半導体モジュール用の基板を内部電気絶縁するための方法を紹介することである。   The problem underlying the present invention is to introduce a method for internal electrical insulation of a substrate for a power semiconductor module, which also retains the electrical properties and at least halves the amount of insulation mass used.

前記の課題は、請求項１に記載した方法により解決され、特別な構成は下位請求項に記載されている。本発明の基本思想は、冷却体（即ちヒートシンク）上に直接的に取り付けるためのパワー半導体モジュールから出発し、この際、このパワー半導体モジュールはフレーム状の絶縁プラスチックハウジングを有する。更にこのプラスチックハウジングは、好ましくはハウジングと一体式に結合されているカバーを有する。第２のカバー面は基板により形成され、この基板は、絶縁層と、この絶縁層上に配設されている少なくとも１つの金属層とから構成され、この金属層はパワー半導体モジュール内部側に設けられている。またこの金属層はそれ自体が構造化（即ちパターン化）され得て、パワー半導体モジュールの少なくとも１つの導体パス（即ち導電路）を形成する。この導体パス上には少なくとも１つのパワー半導体素子が配設されていて、このパワー半導体素子は、外部へと通じるコネクタ要素、他の導体パス、及び／又は、他のパワー半導体素子と、回路に適して接続されている。   The problem is solved by the method described in claim 1, and a special configuration is described in the subclaims. The basic idea of the invention starts from a power semiconductor module for direct mounting on a cooling body (ie a heat sink), where the power semiconductor module has a frame-like insulating plastic housing. In addition, the plastic housing preferably has a cover that is integrally joined to the housing. The second cover surface is formed by a substrate, and the substrate is composed of an insulating layer and at least one metal layer disposed on the insulating layer, and the metal layer is provided inside the power semiconductor module. It has been. The metal layer can also be structured (ie, patterned) itself to form at least one conductor path (ie, conductive path) of the power semiconductor module. At least one power semiconductor element is disposed on the conductor path. The power semiconductor element is connected to a connector element, another conductor path, and / or another power semiconductor element that leads to the outside. Connected properly.

本発明に従う方法の第１構成は次の本質的なステップを有する：
・ 基板の形成。そのためには少なくとも１つのパワー半導体素子が導体パス上に好ましくはロウ付け技術により配設される。引き続き、パワー半導体素子、コネクタ要素、他の導体パス、及び／又は、他のパワー半導体素子の間で、回路に適した接続部が製造される。この種の接続部は、好ましくはワイヤボンディング接続部又はバンドボンディング接続部を用いて製造される。
・ 粘性の誘電絶縁マスを用いた基板の表面被覆。そのためには注形法（即ち注入成形法；キャスティング）が好ましいと示されていて、その理由は、その際、絶縁マスが、例えばボンディングワイヤにより覆われている領域にも確実に充填されるためである。注形法はその加速のために圧力支援され得る。
・ 絶縁マスの架橋（即ち加硫）の開始。本発明に従う方法では、好ましくは、架橋が紫外光又は温度の作用を用いて開始される絶縁マスが使用される。本方法のこの時点では絶縁マスの完全な架橋が回避されなくてはならない。
・ 基板の縦軸線（ｘ軸線）を中心にした基板の回転。それにより、過剰の絶縁マスが滴下し得て、設けられているボンディング接続部が絶縁マスで確実に被覆され得る。この滴下・被覆過程の経過時に絶縁マスは更に架橋する。完全な架橋がこの方法ステップ中に可能であるが、この方法ステップ中にも架橋がまだ完全ではないことが好ましい。
・ パワー半導体モジュールのハウジング内における基板の配設。まだ完全に架橋していない絶縁マスにおいて、この絶縁マスは有利にもまだ粘着材料として作用し、この粘着材料はハウジングと基板との間の接着接続部を製造する。 The first configuration of the method according to the invention has the following essential steps:
• Substrate formation. For this purpose, at least one power semiconductor element is arranged on the conductor path, preferably by a brazing technique. Subsequently, connections suitable for the circuit are manufactured between the power semiconductor elements, connector elements, other conductor paths, and / or other power semiconductor elements. This type of connection is preferably manufactured using a wire bonding connection or a band bonding connection.
• Surface coating of the substrate using a viscous dielectric insulating mass. For this purpose, the casting method (i.e. the injection molding method; casting) has been shown to be preferred because the insulating mass is also reliably filled in the area covered by, for example, bonding wires. It is. The casting method can be pressure assisted for its acceleration.
• Initiation of insulation mass cross-linking (ie vulcanization). In the process according to the invention, preferably an insulating mass is used in which crosslinking is initiated using the action of ultraviolet light or temperature. At this point in the process, complete cross-linking of the insulating mass must be avoided.
・ Rotation of the substrate around the vertical axis (x-axis) of the substrate. Thereby, an excessive insulating mass can be dripped, and the provided bonding connection part can be reliably covered with the insulating mass. The insulating mass further crosslinks during the dripping / coating process. Although complete crosslinking is possible during this method step, it is preferred that crosslinking is not yet complete during this method step.
・ Arrangement of the board in the housing of the power semiconductor module. In an insulating mass that has not yet been completely crosslinked, this insulating mass advantageously still acts as an adhesive material, which produces an adhesive connection between the housing and the substrate.

注形法が圧力支援されている、及び／又は、従来技術による回転式噴射注形法(Drallstrahlgiessverfahren)が適用されると、特に有利であり、その理由は、この際、絶縁マスが迅速に且つ均一に基板上に分配されるためである。 It is particularly advantageous if the casting method is pressure assisted and / or the rotary injection casting method (Drallstrahlgiessverfahren) according to the prior art is applied, since the insulating mass is quickly and This is because it is uniformly distributed on the substrate.

本発明に従う方法の第２構成は次の本質的なステップを有する：
・ 第１構成に従う、基板の形成。
・ 少なくとも１つのパワー半導体素子を装備した側を用いた、誘電絶縁マス内への基板の浸漬。この際、絶縁マスは、例えばボンディング接続部の下側にあるような全ての中間空間内に浸入する。引き出し及びオプションとしての追加的な待ち時間中、過剰の絶縁マスが滴下し、この際、特に、設けられているボンディング接続部も、絶縁マスで被覆され得る。
・ 第１構成に従う、絶縁マスの架橋（即ち加硫）の開始。以前の方法ステップに対し、基板の位置は、装備された側が下方に向かって維持される。従って、ボンディング接続部の充分な被覆が達成されることが保証される。第１構成に対応してこの方法ステップでは、架橋がまだ完全でないことが好ましい。
・ 第１構成に対応する、過剰の絶縁マスの滴下と、絶縁マスを用いた、設けられているボンディング接続部の確実な被覆。
・ 第１構成に従う、パワー半導体モジュールのハウジング内における基板の配設。 The second configuration of the method according to the invention has the following essential steps:
-Substrate formation according to the first configuration.
• Submerging the substrate in a dielectric insulating mass using the side equipped with at least one power semiconductor element. At this time, the insulating mass penetrates into all intermediate spaces such as those below the bonding connection. During the withdrawal and optional additional waiting time, an excess of insulating mass is dripped, and in particular, the provided bonding connections can also be covered with the insulating mass.
• Initiation of cross-linking (ie vulcanization) of the insulating mass according to the first configuration With respect to the previous method steps, the position of the substrate is maintained facing down on the equipped side. Thus, it is ensured that sufficient coverage of the bonding connection is achieved. In this method step corresponding to the first configuration, it is preferred that the crosslinking is not yet complete.
Corresponding to the first configuration, dripping excess insulating mass and reliably covering the provided bonding connection with the insulating mass.
-Arrangement of the substrate in the housing of the power semiconductor module according to the first configuration.

本発明に従う方法の両方の構成において、パワー半導体モジュールの絶縁すべき全ての部分が、特にボンディング接続部も、誘電絶縁マスを用いて十分に架橋され被覆されていることは有利である。   In both configurations of the method according to the invention, it is advantageous that all parts to be insulated of the power semiconductor module, in particular also the bonding connections, are sufficiently cross-linked and covered with a dielectric insulating mass.

更に、本発明に従う方法の両方の構成において、基板が滴下中に一時的にその垂直軸（ｚ方向）を中心に回転され、それにより滴下が加速されると有利である。   Furthermore, in both configurations of the method according to the invention, it is advantageous if the substrate is temporarily rotated around its vertical axis (z direction) during dripping, thereby accelerating the dripping.

同様に、滴下方法ステップ中に基板が真空で付勢されると有利であり、その理由は、それにより場合により設けられている絶縁マス内のガス封入物が有効に除去されるためである。   Similarly, it is advantageous if the substrate is energized in a vacuum during the drip method step, because this effectively removes gas inclusions in the optionally provided insulating mass.

次に本発明を図１及び図２と関連して詳細に説明する。   The invention will now be described in detail in conjunction with FIGS.

図１は、従来技術によるパワー半導体モジュールの断面を示す図である。冷却体（１０）と、この冷却体（１０）上に配設されているパワー半導体モジュールの基板（２０）と、この基板（２０）を囲んで覆っているハウジング（６０）とが描かれている。   FIG. 1 is a diagram showing a cross section of a power semiconductor module according to the prior art. A cooling body (10), a power semiconductor module substrate (20) disposed on the cooling body (10), and a housing (60) surrounding and covering the substrate (20) are depicted. Yes.

基板（２０）は、絶縁材料ボディ（２４）、好ましくは酸化アルミニウム又は窒化アルミニウムなどのような産業セラミック、並びに、この絶縁材料ボディ（２４）の両側に設けられた金属層（２２、２６）から構成されている。この際、これらの金属層（２２、２６）は、周知のＤＣＢ法を用いて絶縁材料ボディ（２４）上に施されている。ハウジング（６０）の内部側の金属層（２６）はそれ自体が構造化（即ちパターン化）されていて、従って互いに絶縁されている導体パス（即ち導電路）を形成している。これらの導体パスは、ダイオード、サイリスタ、ＩＧＢＴ、及び／又は、ＭＯＳ・ＦＥＴのようなパワー半導体素子（３０）と、センサ構成要素（５０）とを支持し、これらは導体パス上にロウ付け接続部を用いて配設されている。他の導体パス（２６）とのパワー半導体素子（３０）の回路に適した他の接続部はワイヤボンディング接続部（３２）を用いて行われる。   The substrate (20) consists of an insulating material body (24), preferably an industrial ceramic such as aluminum oxide or aluminum nitride, as well as metal layers (22, 26) provided on both sides of the insulating material body (24). It is configured. At this time, these metal layers (22, 26) are applied on the insulating material body (24) by using a well-known DCB method. The metal layer (26) on the inner side of the housing (60) is itself structured (i.e. patterned) and thus forms conductor paths (i.e. conductive paths) that are insulated from one another. These conductor paths support power semiconductor elements (30) such as diodes, thyristors, IGBTs and / or MOS-FETs and sensor components (50), which are brazed onto the conductor paths. It is arranged using the part. Another connection suitable for the circuit of the power semiconductor element (30) with the other conductor path (26) is made using the wire bonding connection (32).

外部の導線と、基板（２０）の導体パス（２６）を電気接続させるための接続要素は、コンタクトバネ（８０）により形成されている。   A connection element for electrically connecting the external conductor and the conductor path (26) of the substrate (20) is formed by a contact spring (80).

このパワー半導体モジュールの内部絶縁部はシリコーンゴム（７０）により形成されていて、このシリコーンゴム（７０）は、パワー半導体モジュールの内部をほぼ半分の高さに至るまで満たしている。それにより、シリコーンゴム（７０）において基板（２０）とは反対側の表面（７２）は平坦な面を形成している。   The internal insulating portion of the power semiconductor module is formed of silicone rubber (70), and the silicone rubber (70) fills the power semiconductor module to almost half the height. Thereby, the surface (72) opposite to the substrate (20) in the silicone rubber (70) forms a flat surface.

図２は、本発明に従って形成された内部絶縁部を有するパワー半導体モジュールを示している。冷却体（１０）と、パワー半導体素子（３０）を備えた基板（２０）と、それらのパワー半導体素子（３０）の回路に適した接続部とは、図１と同様に形成されている。   FIG. 2 shows a power semiconductor module having an internal insulation formed in accordance with the present invention. The cooling body (10), the substrate (20) provided with the power semiconductor elements (30), and the connection portions suitable for the circuits of these power semiconductor elements (30) are formed in the same manner as in FIG.

ここで絶縁マス（７０）は、本発明に従う方法の両方の構成に従って基板（２０）上に施されたものである。この絶縁マス（７０）は、基板（２０）の縁に至るまで施され、基板（２０）をハウジング（６０）に配設する前にはまだ完全には架橋されていないものである。ここでハウジング（６０）は、その配設時に互いにハウジング幅の一部に渡って凹部（６２）が残るように構成されている。ここで、この凹部（６２）内に配設されている絶縁マス（７０）は、その完全な硬化の後、ハウジング（６０）と基板（２０）との間の接着接続部として作用する。   Here, the insulating mass (70) is applied on the substrate (20) according to both configurations of the method according to the invention. This insulating mass (70) is applied to the edge of the substrate (20) and has not yet been completely cross-linked before the substrate (20) is placed in the housing (60). Here, the housing (60) is configured such that a recess (62) remains over a part of the housing width when disposed. Here, the insulating mass (70) disposed in the recess (62) acts as an adhesive connection between the housing (60) and the substrate (20) after complete curing.

本発明に従う方法により施された絶縁マス（７０）は表面（７４）を有し、この表面（７４）は、基板（２０）であってこの基板（２０）上に配設されているパワー半導体素子（３０）とボンディング接続部（３２）とを備えた基板（２０）の輪郭線に従っている。本発明に従う方法及びそれにより４００ｍＰａ・ｓと１４００ｍＰａ・ｓとの間に調整されている絶縁マス（７０）の粘性に基づき、基板（２０）の全ての表面と、全てのパワー半導体モジュール（３０）と、中でも全てのボンディング接続部（３２）とが、それらの電気絶縁のための十分に覆われる。   The insulating mass (70) applied by the method according to the invention has a surface (74), which is a substrate (20) and is disposed on the substrate (20). It follows the outline of the substrate (20) with the element (30) and the bonding connection (32). Based on the method according to the invention and the viscosity of the insulating mass (70) adjusted thereby between 400 mPa · s and 1400 mPa · s, all surfaces of the substrate (20) and all power semiconductor modules (30) And above all of the bonding connections (32) are sufficiently covered for their electrical insulation.

更に絶縁マス（７０）は次のパラメータを有する：体積固有抵抗は１０１５ Ｏｈｍ・ｃｍよりも大きく、誘電率は２.５と３との間である。 Furthermore, the insulating mass (70) has the following parameters: the volume resistivity is greater than 10 15 Ohm · cm and the dielectric constant is between 2.5 and 3.

パワー半導体モジュールの基板の内部絶縁部を形成する本発明に従う方法により、使用される絶縁マス（７０）の量が、電気特性が変更されることなく、半部よりも多く減少されたことは明らかである。   It is clear that with the method according to the invention for forming the internal insulation of the substrate of the power semiconductor module, the amount of insulation mass (70) used is reduced by more than half without changing the electrical properties. It is.

従来技術によるパワー半導体モジュールの断面を示す図である。It is a figure which shows the cross section of the power semiconductor module by a prior art. 本発明に従って形成された内部絶縁部を有するパワー半導体モジュールを示す図である。It is a figure which shows the power semiconductor module which has the internal insulation part formed according to this invention.

符号の説明Explanation of symbols

１０ 冷却体
２０ 基板
２２ 金属層
２４ 絶縁材料ボディ
２６ 金属層
３０ パワー半導体素子
３２ ワイヤボンディング接続部
５０ センサ構成要素
６０ ハウジング
６２ 凹部
７０ 絶縁マス（シリコーンゴム）
７２ 絶縁マスの表面
７４ 絶縁マスの表面
８０ コンタクトバネ DESCRIPTION OF SYMBOLS 10 Cooling body 20 Board | substrate 22 Metal layer 24 Insulating material body 26 Metal layer 30 Power semiconductor element 32 Wire bonding connection part 50 Sensor component 60 Housing 62 Recessed part 70 Insulating mass (silicone rubber)
72 Insulating mass surface 74 Insulating mass surface 80 Contact spring

Claims (6)

パワー半導体モジュール用の基板（２０）を内部電気絶縁するための方法であって、そのパワー半導体モジュールが、カバーを備えたフレーム状の絶縁ハウジング（６０）と、絶縁基板（２０）とを有し、この基板（２０）が、少なくとも１つの導体パス（２６）と、この導体パス（２６）上に配設されている少なくとも１つのパワー半導体素子（３０）とを有し、このパワー半導体素子（３０）が、コネクタ要素（８０）、他の導体パス（２６）、及び／又は、他のパワー半導体素子（３０）と、ボンディング接続部（３２）を用い、回路に適して接続されている、前記方法において、
次の本質的なステップ、即ち、
・ 少なくとも１つのパワー半導体素子（３０）と、回路に適した接続部（３２）とを有する基板（２０）の形成；
・ 注形法により粘性の誘電絶縁マス（７０）を用いた基板（２０）の表面被覆；
・ 絶縁マス（７０）の紫外光の作用による架橋の開始；
・ 設けられているボンディング接続部（３２）を絶縁マス（７０）が確実に被覆するため、及び、過剰の絶縁マス（７０）が滴下し得るための、縦軸線（ｘ軸線）を中心にした基板（２０）の回転；
・ パワー半導体モジュールのハウジング（６０）内における基板（２０）の配設をこの記載の順番に含んでいることを特徴とする方法。 A method for electrically insulating a substrate (20) for a power semiconductor module, the power semiconductor module having a frame-shaped insulating housing (60) having a cover and an insulating substrate (20). The substrate (20) includes at least one conductor path (26) and at least one power semiconductor element (30) disposed on the conductor path (26). 30) is connected to the connector element (80), the other conductor path (26), and / or another power semiconductor element (30), using a bonding connection (32), suitably connected to the circuit, In said method,
The next essential step:
The formation of a substrate (20) having at least one power semiconductor element (30) and a connection (32) suitable for the circuit;
The surface coating of the substrate (20) with a viscous dielectric insulating mass (70) by the casting method;
The initiation of crosslinking of the insulating mass (70) by the action of ultraviolet light ;
Centered on the vertical axis (x-axis) to ensure that the insulating mass (70) covers the provided bonding connection (32) and to allow excess insulating mass (70) to drip Rotation of the substrate (20);
A method comprising the arrangement of the substrate (20) in the housing (60) of the power semiconductor module in the order described . パワー半導体モジュール用の基板（２０）を内部電気絶縁するための方法であって、そのパワー半導体モジュールが、カバーを備えたフレーム状の絶縁ハウジング（６０）と、絶縁基板（２０）とを有し、この基板（２０）が、少なくとも１つの導体パス（２６）と、この導体パス（２６）上に配設されている少なくとも１つのパワー半導体素子（３０）とを有し、このパワー半導体素子（３０）が、コネクタ要素（８０）、他の導体パス（２６）、及び／又は、他のパワー半導体素子（３０）と、ボンディング接続部（３２）を用い、回路に適して接続されている、前記方法において、
次の本質的なステップ、即ち、
・ 少なくとも１つのパワー半導体素子（３０）と、回路に適した接続部（３２）とを有する基板（２０）の形成；
・ 少なくとも１つのパワー半導体素子（３０）を装備した側を用いた、粘性の誘電絶縁マス（７０）内への基板（２０）の浸漬；
・ 絶縁マス（７０）の紫外光の作用による架橋の開始；
・ 絶縁マス（７０）を用いた、設けられているボンディング接続部（３２）の確実な被覆と、過剰の絶縁マス（７０）の滴下；
・ パワー半導体モジュールのハウジング（６０）内における基板（２０）の配設をこの記載の順番に含んでいることを特徴とする方法。 A method for electrically insulating a substrate (20) for a power semiconductor module, the power semiconductor module having a frame-shaped insulating housing (60) having a cover and an insulating substrate (20). The substrate (20) includes at least one conductor path (26) and at least one power semiconductor element (30) disposed on the conductor path (26). 30) is connected to the connector element (80), the other conductor path (26), and / or another power semiconductor element (30), using a bonding connection (32), suitably connected to the circuit, In said method,
The next essential step:
The formation of a substrate (20) having at least one power semiconductor element (30) and a connection (32) suitable for the circuit;
Immersion of the substrate (20) in a viscous dielectric insulating mass (70) using the side equipped with at least one power semiconductor element (30);
The initiation of crosslinking of the insulating mass (70) by the action of ultraviolet light ;
A reliable covering of the provided bonding connection (32) with an insulating mass (70) and the dripping of excess insulating mass (70);
A method comprising the arrangement of the substrate (20) in the housing (60) of the power semiconductor module in the order described . 基板（２０）が滴下中に一時的にその垂直軸（ｚ方向）を中心に回転され、それにより滴下が加速されることを特徴とする、請求項１又は２に記載の方法。   Method according to claim 1 or 2, characterized in that the substrate (20) is temporarily rotated about its vertical axis (z direction) during the dripping, whereby the dripping is accelerated. 各々の滴下ステップが真空付勢下で実施されることを特徴とする、請求項１又は２に記載の方法。   The method according to claim 1 or 2, characterized in that each dropping step is carried out under vacuum energization. 絶縁マス（７０）が、１０１５Ｏｈｍ・ｃｍよりも大きい体積固有抵抗と、４００ｍＰａ・ｓと１４００ｍＰａ・ｓとの間の粘性と、２.５と３との間の誘電率とを有することを特徴とする、請求項１又は２に記載の方法。 The insulating mass (70) has a volume resistivity greater than 10 15 Ohm · cm, a viscosity between 400 mPa · s and 1400 mPa · s, and a dielectric constant between 2.5 and 3; A method according to claim 1 or 2, characterized. 誘電絶縁マス（７０）を用いた基板（２０）の表面被覆が、圧力支援された回転式噴射注形法により実施されることを特徴とする、請求項１に記載の方法。   The method according to claim 1, characterized in that the surface coating of the substrate (20) with a dielectric insulating mass (70) is carried out by a pressure-assisted rotary jet casting method.
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