JP4778114B2 - 多層配線基板の製造方法及びそれにより得られる多層配線基板 - Google Patents
多層配線基板の製造方法及びそれにより得られる多層配線基板 Download PDFInfo
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- JP4778114B2 JP4778114B2 JP2010525547A JP2010525547A JP4778114B2 JP 4778114 B2 JP4778114 B2 JP 4778114B2 JP 2010525547 A JP2010525547 A JP 2010525547A JP 2010525547 A JP2010525547 A JP 2010525547A JP 4778114 B2 JP4778114 B2 JP 4778114B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
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- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
表1に示した厚さ約100μmのプリプレグ(パナソニック電工(株)製R−1551又は三菱ガス化学(株)製GHPL−830)をそれぞれ用い、実施例1〜3,比較例3では下記の通り予備加熱し、比較例1,2では予備加熱を行わなかった。これらのプリプレグにCO2レーザーを用いて、φ100μm、φ150μmの孔を設け、印刷法により表1に示した導電性ペーストを充填した後、真空プレス機を用いて次の条件でプレスを行った。
温度:30℃→130℃(昇温17分、保持10分)→180℃(昇温24分、保持46分)→30℃(冷却23分)
合金型:タツタ システム・エレクトロニクス(株)製、メタライズペースト(MPシリーズ)
粉体接触型:タツタ システム・エレクトロニクス(株)製、AE1840
上記により得られた多層基板につき、以下の評価を行った。
完成基板の断面を光学顕微鏡で観察し、図6に示す膨れ量(s)を測定し、5μm未満を○、5μm以上を×とした。
φ0.15mmの初期導電性については、200孔、400孔、600孔、800孔連結パターンを作製し、抵抗値を測定した。それらを各孔数で除算し、1孔当たりの抵抗値を求め、その平均値を算出した。200孔、400孔、600孔連結パターン作製はN=6で行い、800孔連結パターン作製はN=2で行った。
作製した任意の連結パターンにおいて試験前に測定した抵抗値をa、試験後に測定した抵抗値をbとして、導電性変化率を次式により求め、導電性変化率が±20%以内であった場合を○、−20%未満又は20%を越えた場合を×とした。
(b−a)×100/a
半田ディップ試験:260℃の半田に10秒間浸漬した後常温大気で冷却するサイクルを3サイクル繰り返した。
プレッシャークッカーテスト(PCT):121℃、湿度100%、2気圧の雰囲気に24時間暴露した。
ヒートサイクル試験:−65℃で30分間保持した後、125℃で30分間保持するサイクルを1000サイクル繰り返す雰囲気に暴露した。
耐熱性試験:100℃の雰囲気で1000時間暴露した。
耐湿性試験:温度85℃、湿度85%の雰囲気で1000時間暴露した。
φ150μmの孔に導電性ペーストを充填し、孔ピッチが0.6mm、0.8mm、1.0mmの3種のピッチとなるように櫛形パターンを作製した。そのパターンに直流電流50Vを印加し、温度85℃、湿度85%で1000時間暴露後、試験雰囲気のまま抵抗値を測定し、その抵抗値が106Ω以上の場合を○、106Ω未満の場合を×とした。
10……コア基板、11……銅箔層、12……スルーホールメッキ
13……導電性ペースト、14……蓋メッキ、15……樹脂層、16……銅箔
Claims (4)
- プリプレグにレーザー加工にてビアホールを設ける穿孔工程と、そのビアホールに樹脂構成成分と金属粉とを含有する導電性ペーストを充填する工程と、その充填された導電性ペーストの上下に銅箔又はパターニングされた基材の銅箔部分を配してプレスする工程とを含む多層基板の製造方法であって、
前記導電性ペーストとして、(A)アクリレート樹脂モノマー及びエポキシ樹脂プレポリマーを含む樹脂構成成分100重量部に対し、(B)インジウム単独、又は錫、鉛、ビスマス及びインジウムからなる群から選択された2種以上の合金である融点180℃以下の低融点金属少なくとも1種と、金、銀、銅、及びニッケルからなる群から選択された少なくとも1種の金属及び/又はこの群から選択された2種以上の金属の合金である融点800℃以上の高融点金属とを含む金属粉200〜2200重量部、(C)フェノール系硬化剤0.3〜35重量部を含む硬化剤0.5〜40重量部、及び(D)フラックス0.3〜80重量部を含有し、前記金属粉の少なくとも一部が溶融して隣接する金属粉同士が合金化する合金型ペーストを用い、
前記プリプレグとして、60℃から200℃へ昇温する温度プロファイルにおいて貯蔵弾性率が増加から減少に変化する変曲点における貯蔵弾性率をA、減少から増加に変わる変曲点における貯蔵弾性率をBとした場合の比率A/Bが予備加熱前に10以上であるものを用い、
該プリプレグを前記穿孔工程前に予備加熱することにより前記比率A/Bを10未満にする
ことを特徴とする多層配線基板の製造方法。 - 前記プリプレグとして、フェノキシ樹脂、エポキシ樹脂及びビスマレイドトリアジン樹脂のうちの少なくとも1種を含有してなるものを用いることを特徴とする、請求項1に記載の多層配線基板の製造方法。
- 前記予備加熱を80〜140℃で30〜120分間行うことを特徴とする、請求項1又は2に記載の多層配線基板の製造方法。
- 請求項1〜3のいずれか1項に記載の製造方法により製造された多層配線基板。
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JP5693940B2 (ja) | 2010-12-13 | 2015-04-01 | 株式会社トクヤマ | セラミックスビア基板、メタライズドセラミックスビア基板、これらの製造方法 |
JP4795488B1 (ja) * | 2011-01-18 | 2011-10-19 | パナソニック株式会社 | 配線基板、配線基板の製造方法、及びビアペースト |
KR20130066929A (ko) * | 2011-12-13 | 2013-06-21 | 한국전자통신연구원 | 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법 |
WO2013096846A1 (en) * | 2011-12-21 | 2013-06-27 | Lawrence Livermore National Security, Llc | Method of fabricating electrical feedthroughs using extruded metal vias |
JP6464341B2 (ja) * | 2014-10-30 | 2019-02-06 | 国立研究開発法人産業技術総合研究所 | レーザ照射による金属粉末を用いた金属造形物作成法、そのための形成材料、及び作成された構造体 |
US10263320B2 (en) * | 2015-07-17 | 2019-04-16 | Ohio State Innovation Foundation | Methods of making stretchable and flexible electronics |
CN110088895B (zh) * | 2016-12-28 | 2023-05-23 | 拓自达电线株式会社 | 散热基材、散热电路结构体及其制造方法 |
CN111491458A (zh) * | 2019-01-25 | 2020-08-04 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
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JP2004002789A (ja) * | 2002-04-03 | 2004-01-08 | Sekisui Chem Co Ltd | 離型フィルム、積層離型フィルム及び基板の製造方法 |
JP4191678B2 (ja) * | 2002-05-31 | 2008-12-03 | タツタ電線株式会社 | 導電性ペースト、これを用いた多層基板及びその製造方法 |
JP2007161797A (ja) * | 2005-12-12 | 2007-06-28 | Matsushita Electric Ind Co Ltd | プリプレグの特性試験方法 |
JP2007288087A (ja) * | 2006-04-20 | 2007-11-01 | Matsushita Electric Ind Co Ltd | 回路基板の製造方法 |
JP2008205111A (ja) * | 2007-02-19 | 2008-09-04 | Fujitsu Ltd | 配線基板および半導体装置、配線基板の製造方法 |
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EP2408285A1 (en) | 2012-01-18 |
JPWO2010103805A1 (ja) | 2012-09-13 |
EP2408285B1 (en) | 2018-11-14 |
EP2408285A4 (en) | 2017-11-22 |
US20140138126A1 (en) | 2014-05-22 |
KR20110112877A (ko) | 2011-10-13 |
KR101114058B1 (ko) | 2012-03-13 |
US8756805B2 (en) | 2014-06-24 |
US20120037409A1 (en) | 2012-02-16 |
TW201043109A (en) | 2010-12-01 |
WO2010103805A1 (ja) | 2010-09-16 |
US9420706B2 (en) | 2016-08-16 |
TWI419633B (zh) | 2013-12-11 |
CN102369791A (zh) | 2012-03-07 |
CN102369791B (zh) | 2013-11-13 |
HK1167776A1 (en) | 2012-12-07 |
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