JP4762922B2 - Electronic equipment parts - Google Patents

Description

  The present invention relates to an electronic device component.

  In general, many key sheets used for portable electronic devices such as cellular phones and portable information terminal devices are mainly composed of silicone rubber. In order to improve the wear resistance of the surface of the silicone rubber and to suppress contamination, for example, a technique for coating a silicone rubber with a resin having a urethane bond has been proposed (see, for example, Patent Document 1).

  In addition, a technique for fixing a key top made of resin and a key sheet made of a rubber-like elastic body with an ultraviolet curable adhesive (see, for example, Patent Document 2), and a technique for improving the adhesiveness of the adhesive (See, for example, Patent Document 3).

JP-A-7-296676 JP-A-11-86667 Japanese Patent Laid-Open No. 2000-34352

  However, since the primer used when bonding the silicone-based material such as silicone rubber and the key top is colorless and transparent, there is an adhesive underlayer consisting of the primer after the silicone-based material and the key top are attached. It is difficult to confirm. On the other hand, there is a problem that it is difficult to carry out a follow-up survey when a defect occurs in an electronic device part in the distribution process or in the market, to elucidate the cause, or to collect a product.

  Accordingly, an object of the present invention is to easily confirm whether or not primer processing has been performed between a plurality of constituent parts constituting a part of the electronic device in the manufacturing process, and after the product distribution, It is to facilitate follow-up.

In order to solve the above problems, an electronic device component constituting a part of the electronic device of the present invention is:
Adhesive base layer (characters and symbols are displayed) which is formed using a primer in which a light emitter is dispersed between a plurality of components constituting the electronic device component, and the entire layer emits light when irradiated with ultraviolet rays. And an ultraviolet ray absorbing layer for absorbing ultraviolet rays incident from the outside of the component part on one side of the adhesive base layer .

According to the present invention, it is possible to easily confirm whether or not the adhesive base layer made of the primer is interposed between the plurality of constituent parts in the manufacturing process of the electronic device made of the plurality of constituent parts. Therefore, the defective product rate can be reduced. In addition, based on the color or form of light emitted from the adhesive underlayer, it is possible to follow up the electronic device parts placed in the distribution process or on the market. Therefore, even when a failure occurs in a part for an electronic device, the cause can be easily clarified or the product can be easily recovered. In addition to this, it is possible to block the ultraviolet rays from the outside of the constituent parts and cause the light emitter to emit light only when necessary. Moreover, it can suppress that the other component contained in a primer deteriorates by ultraviolet irradiation except when it is required.

In another invention, in addition to the above-described invention, an adhesive is provided on one surface of the adhesive base layer.
In another invention, in addition to the above-described invention, an ultraviolet modifying layer is provided on the other surface of the adhesive base layer.
In another invention, in addition to the above-described invention, a plasma treatment layer is provided on one surface of the adhesive base layer, and a translucent coat layer is provided on the other surface of the adhesive base layer.

Another invention has the form of a member for a push button switch in addition to the above-described invention, wherein a plurality of components are a key sheet for arranging the key top and the key top, and the adhesive base layer is at least the key top. It exists in the whole area between the key sheets.

  For this reason, in the manufacturing process of the member for pushbutton switches, it can be easily confirmed whether or not an adhesive base layer made of a primer is interposed between the key top and the key sheet. Therefore, the defective product rate can be reduced. In addition, the push button switch member placed in the distribution process or on the market can be traced based on the color or form of light emitted from the adhesive base layer. Therefore, even when a problem occurs in the push button switch member, the cause can be easily clarified or the product can be easily recovered.

In addition to the above-described invention, another invention has a form of a member for a push button switch, and a plurality of components are used as a coat layer covering the outer surface of the key top and the key top, and as a pretreatment for forming the coat layer The adhesive base layer is present in the entire area between the key top and the coat layer.

For this reason, in the manufacturing process of the member for pushbutton switches, it can be easily confirmed whether or not an adhesive base layer made of a primer is interposed between the key top and the coat layer covering the outer surface thereof. Therefore, the defective product rate can be reduced. In addition, the push button switch member placed in the distribution process or on the market can be traced based on the color or form of light emitted from the adhesive base layer. Therefore, even when a problem occurs in the push button switch member, the cause can be easily clarified or the product can be easily recovered.
In another invention, in addition to the above-described invention, the adhesive base layer emits light so as to recognize a color or a form for specifying an electronic device component.

  According to the present invention, in the manufacturing process, it is easily confirmed whether or not primer processing has been performed between a plurality of constituent parts constituting a part of the electronic device, and after the product distribution, the follow-up survey of the electronic device component is performed. Can be made easier.

  Embodiments of an electronic device component according to the present invention will be described below with reference to the drawings.

1. Manufacturing conditions (Example 1)
FIG. 1 is a diagram for explaining a manufacturing process according to the first embodiment.

  First, in the space between the lid 1a and the container 1b constituting the injection mold shown in FIG. 1 (A), a polycarbonate-based resin (trade name: “Caliver 301-22”) manufactured by Sumitomo Dow Co., Ltd. Was molded by injection to obtain a resin molded body 2 ′ in which a plurality of key tops were connected (FIG. 1B).

  Here, the surface (lower side surface) formed by contact with the bottom surface of the container 1b is a surface to be touched during key operation, and the surface (upper side surface) formed by contact with the lid 1a of the mold is the key sheet. It was fixed to the surface.

Next, the resin molded body 2 ′ was taken out from the container 1b of the mold, and numbers or letters were printed on the surface fixed to the key sheet to form a printed layer 3 having a thickness of about 10 μm (FIG. 1C). . As an ink for forming the printing layer 3, an ultraviolet curable ink (trade name: “Reicure PF4200”) manufactured by Jujo Chemical Co., Ltd. was used. Further, after the printing process, the printing layer 3 was dried with an integrated light amount of 500 mJ / cm ² using an ultraviolet curing metal halide lamp (trade name: “[D] bulb”) manufactured by Fusion UV Systems Japan Co., Ltd. . Next, surplus portions such as runners and gates of the resin molded body 2 ′ were removed and separated into individual key tops 2 having the printed layer 3. Next, the key top 2 was held on the fixing jig 4 with the printing layer 3 exposed to the upper side (FIG. 1D).

On the other hand, 100 parts by weight of a silicone rubber compound (trade name: “DY32-6014U”) manufactured by Toray Dow Corning Co., Ltd. is provided between the lid 1c and the container 1d constituting the mold shown in FIG. A raw material consisting of 0.5 parts by weight of the company's cross-linking agent (trade name: “RC-8”) was added and compression molded. The compression molding conditions were a molding temperature of 180 ° C., a molding time of 5 minutes, and a molding pressure of 180 kg / cm ² . As a result of this compression molding, a key sheet molded body in which a plurality of key sheets were connected was obtained. After the key sheet molded bodies in a plurality of connected states are dried at a drying temperature of 200 ° C. for 60 minutes, excess portions such as burrs are removed and each key sheet 5 is separated from the key sheet molded body (FIG. 1 (F)). .

Subsequently, the surface of the key top 2 in the key sheet 5 is irradiated with ultraviolet rays using a batch type ultraviolet cleaning furnace (trade name: “VUM-3073-B”) manufactured by Oak Manufacturing Co., Ltd. 6 was formed (FIG. 1G). Ultraviolet rays having wavelengths of 184.9 nm and 253.7 nm were used, and the ultraviolet rays were irradiated under the condition of 1200 mJ / cm ² . The ultraviolet modified layer 6 obtained by the treatment using ultraviolet rays is a layer for improving the wettability between the surface of a resin such as silicone rubber and the primer.

Next, on the surface of the UV modified layer 6, as a primer, 100 parts by weight of toluene and 1 part by weight of an amino silane coupling agent (trade name: “KBM-603”) manufactured by Shin-Etsu Chemical Co., Ltd. and Sinloihi Co., Ltd. An inorganic fine particle light emitter (trade name: “EXL-A004LL”) 1 part by weight was added by spray coating. For spray coating, a spray nozzle (trade name: “Luminer ST6”) manufactured by Fuso Seiki Co., Ltd. was used. Spray coating was performed using a nozzle system of 0.5 mm under an atomization pressure of 1.4 kg / cm ² . As a result, an adhesive base layer 7 containing a luminescent material was obtained (FIG. 1H). Next, using a desktop black light lamp (trade name: “Bright Luminer F-02”) manufactured by Marktech Co., Ltd., the adhesive base layer 7 was irradiated with black light (ultraviolet light centered at 365 nm), The light emission of the adhesive underlayer 7 was confirmed. Next, the irradiation of the black light was stopped, and it was confirmed that the adhesive base layer 7 was colorless and transparent. Next, the key sheet 5 was sucked and fixed by the key sheet fixing jig 8 so that the adhesive base layer 7 was exposed to the upper side (FIG. 1 (I)).

  Next, an ultraviolet curable adhesive 9 was transferred to the adhesive base layer 7 using a transfer jig (FIG. 1 (I)). For this adhesive 9, an ultraviolet curable adhesive (trade name: “CHEMISEAL 5X845C”) manufactured by Chemitech Co., Ltd. was used. Thereafter, the key sheet 5 and the printing layer 3 on the upper side of the key top 2 exposed from the fixing jig 4 were fixed with high accuracy while the key sheet 5 was fixed to the fixing jig 8 ( FIG. 1 (J)).

Next, using an ultraviolet irradiation conveyor (trade name: “M015L312”) manufactured by Eye Graphics Co., Ltd., ultraviolet light (metal halide, 120 W / cm) having a wavelength of 300 nm to 450 nm was applied under the condition of 4000 mJ / cm ^2. Irradiated. After the adhesive 9 is sufficiently fixed, the fixing jig 4 and the fixing jig 8 are removed to obtain an electronic device component (a combined body of the key top 2 and the key sheet 5) (FIG. 1). (K)).

(Example 2)
The configuration of the electronic device component obtained in Example 2 is substantially the same as that of the electronic device component obtained in Example 1. Therefore, in Example 2, the same members and the like as those described in Example 1 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  First, as in the first embodiment, as described with reference to FIGS. 1A, 1B, 1C, and 1D, the manufacturing process of the key top 2 is performed. . However, the ink for forming the printing layer 3 includes 100 parts by weight of screen printing ink (trade name: “SG429B”) manufactured by Seiko Advance Co., Ltd., and the same curing agent (trade name: “SG429B curing agent”) 15 A solvent-drying ink containing 10 parts by weight of a thinner (trade name: “T-980”) manufactured by the same company was used. The thickness of the printing layer 3 was 5 μm. Furthermore, the ink after printing was cured under the conditions of a drying temperature of 80 ° C. and a drying time of 30 minutes. These matters are different from those of the first embodiment.

  Next, similarly to Example 1, the steps shown in FIGS. 1E and 1F were performed. Next, a primer was spray applied to the arrangement surface of the key top 2 in the key sheet 5. As a result, an adhesive base layer 7 containing a light emitter was formed (similar to FIG. 1H). As a primer, 100 parts by weight of toluene, 1 part by weight of an amino-based silane coupling agent (trade name: “KBM-603”) manufactured by Shin-Etsu Chemical Co., Ltd. Name: “EXL-A003S”) 1 part by weight was used. In addition, the process which forms the ultraviolet modified layer 6 demonstrated based on FIG. 1 (G) was not implemented. Next, as the adhesive 9, a cyanoacrylate adhesive (trade name: “401”) manufactured by Henkel Japan Co., Ltd. was used, and the adhesive was applied onto the adhesive base layer 7 by a dispenser method (FIG. 1 ( Similar to I).

Next, as shown in FIG. 1 (J), the key top 2 and the key sheet 5 were bonded together. Thus, a combined body of the key top 2 and the key sheet 5 was obtained by the adhesive force of the adhesive 9 (similar to FIG. 1K). Here, as a method of curing the adhesive 9, the key top 2 and the key sheet 5 are bonded together, and a load of 0.1 kg / cm ² is applied to the bonded surfaces and held at room temperature for 30 seconds. The method was adopted. As a result, a structure in which the layer of the light-transmitting layered adhesive 9 and the adhesive base layer 7 were in contact between the key top 2 and the key sheet 5 was obtained. These matters are different from those of the first embodiment. The electronic device component obtained in Example 2 is shown in FIG.

(Example 3)
FIG. 2 is a diagram for explaining a manufacturing process according to the third embodiment.

First, the conductive contact portion 10 shown in FIG. Specifically, 100 parts by weight of silicone rubber (trade name: “KE951-U”) manufactured by Shin-Etsu Chemical Co., Ltd., 50 parts by weight of carbon black, and 2,5-dimethyl-2,5- A mixture of 2 parts by weight of di (t-butylperoxy) hexane was inserted into a mold and heated and pressurized under conditions of 180 ° C. and 200 kg / cm ² to form a conductive contact part 10 having a diameter of 4 mm. .

Next, at the same time that the switch base 11 shown in FIG. 2A was manufactured, the conductive contact portion 10 was fixed to the switch base 11. Specifically, the previously produced conductive contact portion 10 is inserted into the recessed portion of the bottom surface in the mold, and 100 parts by weight of silicone rubber (trade name: “KE951-U”) and manufactured by Shin-Etsu Chemical Co., Ltd. 5 parts by weight of a colorant (trade name: “SR Color Green”) and 0.5 parts by weight of 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane as a vulcanizing agent were mixed. The silicone rubber compound was filled so as to contact the conductive contact portion 10 in the mold. Next, it heated and pressurized on 180 degreeC and 150 kg / cm < ² > conditions.

  As a result, as shown in FIG. 2A, the switch base including the thin portion 13 connected to the periphery of the key top 12, the base portion 14 disposed further around the thin portion 13, and the conductive contact portion 10. Material 11 was obtained. When the base portion 14 is fixed to a substrate surface having a contact corresponding to the conductive contact portion 10 and the key top 12 is pressed, the thin portion 13 is bent by the pressing force, and the position of the conductive contact portion 10 is lowered. When the conductive contact portion 10 comes into contact with the contact corresponding to the conductive contact portion 10, the switch is turned “ON”. Subsequently, when the force of pressing the key top 12 is weakened, the thin portion 13 is deflected by the elasticity of the silicone rubber, and the contact between the conductive contact portion 10 and the corresponding contact is released.

  Next, in order to display characters or symbols on the key tops 12, as shown in FIG. Specifically, an ink obtained by adding 20 parts by weight of a commercially available white pigment to 100 parts by weight of “Silmark” (trade name) manufactured by Shin-Etsu Chemical Co., Ltd. by screen printing is used to make the thickness 30 μm. It was applied to 12 surfaces. Next, the ink was fixed to the surface of the key top 12 by heating at 200 ° C. for 60 minutes.

  Next, a plasma treatment layer 16 shown in FIG. 2C was formed on the surface of the switch base 11. Specifically, oxygen as a process gas was flowed at 40 cc / min, the switch base material 11 was placed in a container whose pressure was reduced to 0.3 hPa, and plasma treatment was performed at a high frequency output of 300 W for 60 seconds.

  Next, an adhesive base layer 17 containing a light emitter as shown in FIG. 2D was formed on the plasma treatment layer 16. Specifically, 100 parts by weight of a 30% diluted solution obtained by adding toluene to an amino silane coupling agent (trade name: “KBP-40”) manufactured by Shin-Etsu Chemical Co., Ltd., and irradiated with black light Then, a mixed solution of 1 part by weight of organic luminous body magic lumino powder (trade name: “EXL-A003S”) that emits light was applied thinly on the plasma treatment layer 16.

  Next, a light-transmitting coat layer 18 shown in FIG. 2E was formed. Specifically, 40 parts by weight of a main component of urethane resin paint (trade name: “Rabasan”) manufactured by Musashi Paint Co., Ltd., 10 parts by weight of an auxiliary agent, 10 parts by weight of thinner, and organication manufactured by Nippon Oil & Fats Co., Ltd. An organic paint blended with 4 parts by weight of an oxide (trade name: “Perhexa V”) was applied by air spray to a film thickness of 40 μm, dried at 150 ° C. for 40 minutes, and cured. The coat layer 18 is a non-silicone material. Through these steps, the electronic device part of Example 3 was completed.

Example 4
FIG. 3 is a diagram for explaining a manufacturing process according to the fourth embodiment. First, a silicone rubber sheet (key sheet) 21 having pressing portions 21a and 21a shown in FIG.

Specifically, 100 parts by weight of silicone rubber (trade name: “KE951-U”) and 0.5 parts by weight of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane as a vulcanizing agent The mixture was inserted into a mold and heated and pressurized under the conditions of 180 ° C. and 200 kg / cm ² to form a silicone rubber sheet 21 having the shape shown in FIG.

  Next, the plasma treatment layer 24 shown in FIG. 3B was formed on the surface of the silicone rubber sheet 21 opposite to the pressing portions 21a and 21a. Specifically, oxygen as a process gas was flowed at 40 cc / min, the silicone rubber sheet 21 was placed in a container whose pressure was reduced to 0.3 hPa, and plasma treatment was performed at a high frequency output of 300 W for 60 seconds.

  Next, an adhesive base layer 25 containing a light emitter as shown in FIG. 3C was formed on the plasma treatment layer 24.

  Specifically, 100 parts by weight of a 30% diluted solution obtained by adding toluene to an amino silane coupling agent (trade name: “KBP-40”) manufactured by Shin-Etsu Chemical Co., Ltd., and irradiated with black light Then, a mixed solution of 1 part by weight of an organic luminous body magic lumino powder (trade name: “EXL-A003S”) that emits light was thinly applied on the plasma treatment layer 24.

  Next, a light-transmitting coat layer 26 shown in FIG. 3D was formed. Specifically, 40 parts by weight of the main component of urethane resin paint (trade name: “Rabasan”), 10 parts by weight of auxiliary agent, 10 parts by weight of thinner, and organic oxide (trade name: “Perhexa V”) 4 An organic paint blended with parts by weight and 1 part by weight of an inorganic fine particle light emitter (trade name: “EXL-A004LL”) is applied by air spray to a film thickness of 40 μm and dried at 150 ° C. for 40 minutes. And cured.

  Next, a double-sided tape (trade name: “HI-BON YT134-1”) 27 using an acrylic adhesive manufactured by Hitachi Chemical Polymer Co., Ltd. is cut into a shape slightly smaller than the bottom surface of the key top, and the coating layer 26 was pasted at a predetermined position.

  Next, the key top 28 having the printed layer 29 produced in the same process as that of FIG. 1C is bonded to the acrylic of the silicone rubber sheet 21 by crimping using the fixing jig 4.8 shown in FIG. It stuck on the double-sided tape 27 using a system adhesive.

(Example 5)
As a primer, 100 parts by weight of toluene, 1 part by weight of a silane coupling agent containing triethylamine as an active ingredient, and 1 part by weight of an organic luminophoric magic lumino powder (trade name: “EXL-A003S”) manufactured by Sinloihi Manufacture was performed under the same conditions as in Example 2 except that the above was used.

(Example 6)
As a primer, 1 part by weight of a silane coupling agent containing 1,8-diazabicyclo [5.4.0] undec-7-ene (abbreviation: DBU) as an active ingredient in 100 parts by weight of toluene and an organic made by Sinloihi Manufacture was performed under the same conditions as in Example 2, except that a mixture of 1 part by weight of a light-emitting phosphor magic lumino powder (trade name: “EXL-A003S”) was used.

  Next, a comparative example will be described.

(Comparative Example 1)
As a primer, 100 parts by weight of toluene, 1 part by weight of a vinyl-based silane coupling agent (trade name: “KBE-1003”) manufactured by Shin-Etsu Chemical Co., Ltd., and an organic light-emitting material Magic Lumino Powder (trade name) manufactured by Sinroihi : "EXL-A003S") Manufactured under the same conditions as in Example 2, except that 1 part by weight was used.

(Comparative Example 2)
As a primer, 100 parts by weight of toluene, 1 part by weight of an acryloxy-based silane coupling agent (trade name: “KBM-5103”) manufactured by Shin-Etsu Chemical Co., Ltd., and organic luminophore magic lumino powder (trade name) manufactured by Sinloihi : "EXL-A003S") Manufactured under the same conditions as in Example 2, except that 1 part by weight was used.

(Comparative Example 3)
As a primer, 100 parts by weight of toluene, 1 part by weight of a vinyl-based silane coupling agent (trade name: “KBE-1003”) manufactured by Shin-Etsu Chemical Co., Ltd., and an organic light-emitting material Magic Lumino Powder (trade name) manufactured by Sinroihi : "EXL-A003S") Manufactured under the same conditions as in Example 1 except that 1 part by weight was used.

(Comparative Example 4)
As a primer, 100 parts by weight of toluene, 1 part by weight of an acryloxy-based silane coupling agent (trade name: “KBM-5103”) manufactured by Shin-Etsu Chemical Co., Ltd., and organic luminophore magic lumino powder (trade name) manufactured by Sinloihi : "EXL-A003S") Manufactured under the same conditions as in Example 1 except that 1 part by weight was used.

(Comparative Example 5)
100 parts by weight of a styryl-based silane coupling agent (trade name: “KBM-1403”) manufactured by Shin-Etsu Chemical Co., Ltd. to which toluene is added to form a 30% diluent, and emits light when irradiated with black light. Manufactured under the same conditions as in Example 4 except that a mixed solution of 1 part by weight of organic luminous body magic lumino powder (trade name: “EXL-A003S”) was thinly applied on the plasma treatment layer 24. .

(Comparative Example 6)
100 parts by weight of a 30% diluted solution obtained by adding toluene to an acryloxy silane coupling agent (trade name: “KBM-5103”) manufactured by Shin-Etsu Chemical Co., Ltd., and emitting light by irradiating with black light. Manufactured under the same conditions as in Example 4 except that a mixed solution of 1 part by weight of organic luminous body magic lumino powder (trade name: “EXL-A003S”) was thinly applied on the plasma treatment layer 24. .

2. Performance Evaluation (1) Luminous Characteristics Since the key tops 2 and the like of electronic device parts obtained under the conditions of Example 1, Example 2, Example 5 and Example 6 have translucency, When a plurality of constituent parts constituting a part were bonded together or after the process, black light was irradiated. As a result, the adhesive underlayer 7 emitted light, and its presence could be confirmed.

  The switch base material 11 obtained under the conditions of Example 3 (having the adhesive base layer 17 shown in FIG. 2D) is colorless and transparent in a normal state. By irradiating the black light using a desktop black light lamp (trade name: “Pleit Miner F-02”), the light emission of the illuminant contained in the adhesive underlayer 17 was confirmed. Similarly, the silicone rubber sheet 21 obtained under the conditions of Example 4 (having the adhesive base layer 25 and the coat layer 26 shown in FIG. 3E), a desktop black light lamp (trade name: “Pleit Miner”) F-02 ") was used to irradiate black light, and light emission of the light emitters contained in the adhesive underlayer 25 and the coat layer 26 was confirmed.

  As a result of performing the same evaluation as in Examples 1 to 6 for electronic device parts obtained under the conditions of Comparative Examples 1 to 6, light emission by black light could be confirmed.

  In addition, in the switch base material 11 obtained under the conditions of Example 4, when the light emitters included in the adhesive base layer 25 and the coat layer 26 are light emitters that emit light of different colors, mixed colors are confirmed. Thus, the presence of both the adhesive base layer 25 and the coat layer 26 can be confirmed. For example, when the light emitter included in the adhesive base layer 25 is a light emitter that emits green light and the light emitter included in the coat layer 26 is a light emitter that emits blue light, if the light emission of light blue can be confirmed, the adhesive base layer 25 can be confirmed. It can be confirmed that both layers of the coating layer 26 and the coating layer 26 exist. When only green or blue light emission can be confirmed, it can be confirmed that only one of the adhesive base layer 25 and the coat layer 26 exists. Furthermore, when no light emission is observed, it can be confirmed that neither the adhesive base layer 25 nor the coat layer 26 exists.

  In addition, among the plurality of key tops 28, the emission color immediately below a specific key top 28 is changed to the emission color immediately below another key top 28, whereby the date of manufacture of the electronic device component can be specified. Can be. For example, two layers of the adhesive base layer 25 are formed, and a phosphor that emits red light when the entire area of one of the layers (for example, the first adhesive base layer 25) is irradiated with black light. It is assumed that the layer contains. By determining that an electronic device component that emits red light entirely from the first adhesive base layer 25 is manufactured in 2006, the manufacturing year of the electronic device component can be specified. Further, the upper half region of the key top 28 displaying “1” emits blue light so that the other adhesive base layer 25 (hereinafter referred to as a second adhesive base layer) is directly below the key top 28. The part includes a light emitting body that emits blue light when irradiated with black light. When the upper half of the key top 28 emits blue light, the month of manufacture of the electronic device component can be specified by determining that the number of the key top 28 indicates the month of manufacture. When the production months are October, November and December, the key top 28 displaying “0”, the key top 28 displaying “0”, the key top 28 displaying “1”, and “ It is preferable to include a light emitting body that emits blue light in a portion immediately below the upper half of the key top 28 displaying “0” and the key top 28 displaying “2”. Further, a light emitting body that emits blue light when irradiated with black light is included in a portion immediately below the light so that the lower half region of the key top 28 displaying “1” emits blue light. When the lower half of the key top 28 emits blue light, the date of manufacture of the electronic device component can be specified by determining that the number of the key top 28 indicates the date of manufacture. If only the numeric keys are not enough, the days from 1 to 31 can be specified by using the key top 28 on which an asterisk (*), a sharp (#), a telephone mark, etc. are displayed. For example, when the lower half of the key top 28 displaying “1” and the lower half of the key top 28 displaying “#” emit blue light, it can be determined that the manufacturing date is 21 days. .

  In this way, by making use of the numbers, symbols, or designs of each key top 28 and the area within each key top 28, it becomes possible to specify the date of manufacture of the electronic device component. When a failure occurs, the cause at the time of manufacture can be searched by specifying the date of manufacture of the electronic device part. In addition, even when a product for several months or years before and after the specified date of manufacture must be collected, the collection target can be limited, so that the collection becomes easy. It should be noted that the factory of the manufacturer may be specified by the light emission of the other key tops 28, whether it is morning or afternoon. Furthermore, information such as a barcode may be printed on the adhesive base layer 25 so that the date of manufacture and the manufacturer can be specified. Furthermore, by using the adhesive base layer 25 as one layer and using the coat layer 26, the adhesive base layer 25 can be used as a layer for specifying the manufacturing year, and the coat layer 26 can be used as a layer for specifying the manufacturing date. Such a technique can be similarly applied not only to the electronic device component of the fourth embodiment but also to electronic device components of other embodiments. The emission color is not limited to the above example, and the combination of the colors of the light emitters in the plurality of layers can be arbitrarily determined. In addition, by using the same type of color without using a combination of colors and changing the amount of light emitters, etc., the date of manufacture, manufacturer, etc. may be identified by the intensity of light emission. Furthermore, instead of the upper and lower areas in the key top 28, the left and right areas may be used as areas for specifying the manufacturing date.

  Table 1 shows the types and emission colors of inorganic fine particle light emitters in which an activator (emission center) is added to metal particles (matrix).

  Originally, the appearance of transparent or translucent silicone rubber appears to be a slightly yellowish color. The light emitter used in Example 1 is a light emitter that emits blue light in Table 1. For this reason, when the primer which added this light-emitting body is used as an adhesion | attachment base layer, the said light-emitting body reacts to the ultraviolet light contained in a fluorescent lamp or sunlight slightly. As a result, the silicone rubber constituting the electronic device part obtained under the conditions of Example 1 looked whitish. The so-called fluorescent bleaching effect that the silicone rubber looks whitish when the key top 2 has a letter shape and no decoration layer, or has a decoration layer and is light in color, is preferable in appearance.

  The organic luminescent material is obtained by solidifying a luminescent dye in an acrylic resin, an amino resin, a polyester resin, or the like. Even if it is an organic type light-emitting body, the same effect as the said inorganic type fine particle light-emitting body will be acquired if it is light-emitted in blue color.

(2) Adhesive strength characteristics A
The electronic device parts obtained under the conditions of Example 2, Example 5, Example 6, Comparative Example 1 and Comparative Example 2 were bonded with an adhesive 9 by the method shown in FIG. The key top 2 and the key sheet 5 are pulled in opposite directions. This tensile test was performed using a tensile tester (trade name: “FGC10”) manufactured by Nidec-Simbo Corporation. The vertical pulling speed of the clamp 30 in the measurement was 50 mm / min. After such a tensile test, the separation surface is visually inspected. If the key sheet 5 is broken, “◯”, the key top 2 and the key sheet 5 are easily separated, and the key sheet is not broken. In some cases, it was evaluated as “x”.

  Table 2 shows the evaluation results after the tensile test.

  As a result of the tensile test, in the electronic device parts produced under the conditions of Example 2, Example 5 and Example 6, the key sheet 5 was broken, but under the conditions of Comparative Example 1 and Comparative Example 2 In the obtained electronic device component, interface peeling occurred between the adhesive and the silicone rubber, and the key sheet 5 was not broken.

(3) Adhesive strength characteristics B
The electronic device parts obtained under the conditions of Example 1, Example 4, Comparative Example 3, Comparative Example 4, Comparative Example 5 and Comparative Example 6 were subjected to a high temperature and high humidity atmosphere of 65 ° C. and 95% Rh. After exposure for 240 hours, the key top 2 and the key sheet 5 or the key top 28 and the silicone rubber sheet (key sheet) 21 were pulled in opposite directions by the method shown in FIG. The tensile tester and the vertical pulling speed of the clamp 30 were the same as the measurement of the adhesive strength property A. After such a tensile test, the separation surface is visually inspected. If the key sheets 5 and 21 are broken, “◯”, the key tops 2 and 28 and the key sheets 5 and 21 are easily separated, When the sheets 5 and 21 were not destroyed, the evaluation was “x”.

  Table 3 shows the evaluation results after the tensile test.

  As a result of the tensile test, in the electronic device parts produced under the conditions of Example 1 and Example 4, the key sheets 5 and 21 were broken, but the electrons obtained under the conditions of Comparative Examples 3 to 6 were obtained. In the device component, the interface sheet was peeled between the adhesive (or urethane coat layer) and the silicone rubber, and the key sheets 5 and 21 were not broken.

  From the evaluation results of adhesive strength characteristics A and B, a primer containing an amino silane coupling agent, a primer containing DBU, or a primer containing triethylamine is used as a primer for bonding silicone rubber and urethane or polycarbonate resin. It turns out that it is suitable.

  When an ultraviolet curable adhesive is used or a urethane coat layer is used as an adherend, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane (“KBM-603” manufactured by Shin-Etsu Chemical Co., Ltd.) ), N-2 (aminoethyl) 3-aminopropylmethyldimethoxysilane (“KBM-602” manufactured by Shin-Etsu Chemical Co., Ltd.), N-2 (aminoethyl) 3-aminopropyltriethoxysilane (Shin-Etsu Chemical) "KBE-603" manufactured by Kogyo Co., Ltd.), 3-aminopropyltrimethoxysilane ("KBM-903" manufactured by Shin-Etsu Chemical Co., Ltd.), 3-aminopropyltriethoxysilane ("Shin-Etsu Chemical Co., Ltd." KBE-903 ") was effective as a primer. For this reason, when an ultraviolet curable adhesive is used or when a urethane coat layer is used as an adherend, an aminosilane-based primer containing an amino-based silane coupling agent is considered particularly suitable.

  When a cyanoacrylate adhesive is used, in addition to a primer containing DBU, a primer containing 1,8-diazabicyclo [4.3.0] non-5-ene (abbreviation: DBN), a guanidine type Dimethylamine, trimethylamine, and aminosilane primers were also effective. Therefore, it is considered that a primer containing a basic substance typified by an organic amine compound, such as amidines, guanidine-based, dimethylamine-based, trimethylamine-based, and aminosilane-based primers, is considered suitable.

  Since the surface of the silicone rubber has a small polarity, when the silicone rubber and the polycarbonate-based or urethane-based adherend are bonded via an adhesive or the like, the adhesive effect is low only by directly interposing the adhesive or the like. For this reason, it is necessary to modify the surface of the adherend with a primer so as to facilitate adhesion with an adhesive or the like. As is apparent from a comparison between each of the above examples and each of the above comparative examples, a primer containing a basic substance typified by an aminosilane-based primer is an adherend of silicone rubber and polycarbonate or urethane that are difficult to adhere. It turns out that it is suitable as a primer at the time of adhering.

  As mentioned above, although each Example of the electronic device component which concerns on this invention was described, the electronic device component which concerns on this invention can be variously implemented unless it deviates from the summary of this invention. For example, the electronic device component may be a component other than the push button switch member. When the electronic device component is a push button switch member, it may have a slit for separating a plurality of switches, and a plurality of key tops may be formed by a single member.

  In addition, the adhesive base layers 7, 17, 25, the light emitter, the key tops 2, 12, 28, the key sheets 5, 21, and the switch base 11 used for the electronic device component according to each embodiment of the present invention include: Those other than those (material, shape, etc.) used in each embodiment of the present invention can be used.

Moreover, you may provide the ultraviolet-ray absorption layer which absorbs an ultraviolet-ray in the components for electronic devices which concern on each Example of this invention. By providing the ultraviolet absorbing layer, it is possible to suppress deterioration of the adhesive base layers 7, 17, 25 or the key tops 2, 12, 28 due to ultraviolet irradiation other than when necessary. For example, the coating layer 18 that covers the outer surface of the key top 12 of the electronic device component according to Example 3 is coated with a benzotriazole-based ultraviolet absorber (as a suitable example, “TINUVIN (Ciba Specialty Chemicals Co., Ltd.). such as by the inclusion of registered trademark) 928 "(trade name)), or combines coat layer 18 is a function of the UV-absorbing layer. In order to efficiently absorb ultraviolet rays, in addition to the ultraviolet absorber, for example, a hindered amine light stabilizer (HALS: Himdered Amine Light Stabilizer, as a suitable example, Ciba Specialty Chemical Co., Ltd.) “TINUVIN (registered trademark) 123” (trade name) manufactured by the company may be included.

  In addition, in the electronic device component according to each embodiment of the present invention, a scattering agent that scatters ultraviolet rays may be included in the adhesive base layers 7, 17, and 25. As a result, the adhesive base layers 7, 17, and 25 emit light efficiently. Electronic device parts containing a scattering agent are suitable when the adhesive base layers 7, 17, 25 or the key tops 2, 12 are not easily deteriorated by ultraviolet irradiation. As the scattering agent, titanium oxide, zinc oxide, or the like can be used.

  In addition to the phosphor that emits light only when irradiated with ultraviolet rays, the phosphor may be a phosphor (phosphorescent material) that continues to emit light for a certain period of time after irradiation with ultraviolet rays. Further, when an ultraviolet absorbing layer or a scattering agent is not used, it is possible to make it appear transparent except when irradiated with ultraviolet rays or the like by using a light emitter having a particle diameter of 50 nm or less. In general, the light scattering coefficient is proportional to the sixth power of the particle diameter. For this reason, the light scattering effect can be reduced as the particle size of the light emitter to be added is smaller. If the particle diameter is one-tenth or less of the visible light wavelength, light scattering in the visible light region is reduced to a negligible level. Therefore, it is desirable to use a light emitter having a particle diameter of 50 nm or less.

6 is a diagram for explaining a manufacturing process in Example 1. FIG. 6 is a diagram for explaining a manufacturing process in Example 3. FIG. 10 is a diagram for explaining a manufacturing process in Example 4. FIG. It is a figure which shows the tension test method for investigating the adhesive strength characteristic of the components for electronic devices produced on the conditions of each Example and each comparative example.

Explanation of symbols

2 Key Top 5 Key Sheet 7 Adhesive Underlayer 12 Key Top 17 Adhesive Underlayer 18 Coat Layer 21 Silicone Rubber Sheet (Key Sheet)
25 Adhesive foundation layer 28 Key top

Claims (7)

A component that forms part of an electronic device,
Adhesive base layer (characters and symbols are displayed) which is formed using a primer in which a light emitter is dispersed between a plurality of components constituting the electronic device component, and the entire layer emits light when irradiated with ultraviolet rays. and the excluded),
On one side of the bonding undercoat layer, electronics components, characterized in Rukoto to have a, an ultraviolet absorbing layer for absorbing ultraviolet rays incident from the outside of the component. The electronic device component according to claim 1, wherein an adhesive is provided on one surface of the adhesive base layer. The electronic device component according to claim 2 , wherein an ultraviolet modified layer is provided on the other surface of the adhesive base layer. Plasma treatment layer is provided on one surface of the adhesive underlayer, for electronic device according to claim 1, wherein said adhesive undercoat layer coating layer on the other surface of the transparent is provided parts. It has the form of a pushbutton switch member,
The plurality of components are a key top and a key sheet for arranging the key top,
It said adhesive base layer, at least the key top and the parts for electronic equipment according to any one of claims 1-4, characterized in that it has to exist in the entire region between the key sheet. It has the form of a pushbutton switch member,
The plurality of components as a coat layer covering the key top and the outer surface of the key top,
As pretreatment for forming the coating layer, for an electronic apparatus according to the adhesive base layer to claim 1 or 4, characterized in that it has to exist in the entire area between the key top and the coat layer parts. It said adhesive base layer, parts for electronic equipment according to any one of claims 1-6, wherein the make recognizable color or form for specifying the component electronics emission.

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