JP4750821B2 - 発光表示パネル - Google Patents
発光表示パネル Download PDFInfo
- Publication number
- JP4750821B2 JP4750821B2 JP2008111697A JP2008111697A JP4750821B2 JP 4750821 B2 JP4750821 B2 JP 4750821B2 JP 2008111697 A JP2008111697 A JP 2008111697A JP 2008111697 A JP2008111697 A JP 2008111697A JP 4750821 B2 JP4750821 B2 JP 4750821B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- display panel
- front plate
- heat
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000005286 illumination Methods 0.000 description 3
- 239000003570 air Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
12前プレート
14熱伝導/放散装置
16発光装置
17固定素子
19導線
20頸部分
22平坦部分
24テール部分
122貫通孔
142熱伝導素子
144熱放散フィン
Claims (7)
- 発光表示パネルであって、
前面および背面をその上に画成する前プレートであって、かつその上にN個の貫通孔を設け、Nが自然数である、前プレートと、
各々が前記N個の貫通孔のうちの1つに対応するN個の熱伝導/放散装置であって、前記N個の熱伝導/放散装置の各々が、
前記対応する孔に適合する頸部分、およびテール部分に分けられ、平坦な端面と側壁を有する円筒形のヒートパイプであって、前記頸部分は前記平坦な端面と前記側壁の一部を備え、前記平坦な端面は前記頸部分の遠位端において前記側壁の伸長方向に対し垂直であり、前記円筒形のヒートパイプの前記テール部分が前記前プレートの前記背面に配置されるように、その前記頸部分を通して前記対応する孔に挿入され、前記頸部分の一部は前記前プレートの厚さ内に配置される、銅から成る、円筒形のヒートパイプと、
前記ヒートパイプの前記テール部分の周縁に取り付けられる少なくとも1つの熱放散フィンと、を備え、前記円筒形のヒートパイプの長さは、前記平坦な端面の全幅の二倍を超える、装置と、
前記対応する前記孔に挿入される前記円筒形のヒートパイプの前記平坦な端面に取り付けられる、各々が前記N個の孔のうちの1つに対応するN個の発光装置と、を備え、
それによって、前記N個の発光装置の各々の動作中に生成される熱が、前記前プレートの前記背面まで前記1つの発光装置に対応する前記円筒形のヒートパイプによって伝導され、そして次に、前記1つの発光装置に対応する前記少なくとも1つの熱放散フィンによって放散される、パネル。 - 前記N個の発光装置が、前記前プレートの前記前面上にアレイの形態で配置される、ことを特徴とする請求項1に記載の発光表示パネル。
- さらに、動力供給/制御ユニット、を備え、前記N個の発光装置の各々が、前記動力供給/制御ユニットに電気的に接続される少なくとも2本の導線を有する、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記前プレートが、セメント材、ガラス材料、金属材料、木製材料、重合物質、セメント/高分子複合材料およびセラミック/高分子複合材料からなる群から選択されるものから作られる、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記N個の発光装置の各々が、各々が発光ダイオードダイまたはレーザダイオードダイである少なくとも1つの半導体発光ダイを備える、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記前プレート内の前記孔の各々の内径が、前記対応する発光装置の外径よりわずかに大きい、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記N個の熱伝導/放散装置の各々が、前記熱伝導/放散装置を前記前プレートの前記背面に固定するために、前記対応する熱伝導/放散装置の前記円筒形のヒートパイプの前記テール部分を取り付ける固定素子を更に備える、ことを特徴とする請求項1に記載の発光表示パネル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201131143U CN2821749Y (zh) | 2005-07-21 | 2005-07-21 | 发光显示面板 |
CN200520113114.3 | 2005-07-21 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008600015 Continuation | 2005-07-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008233924A JP2008233924A (ja) | 2008-10-02 |
JP4750821B2 true JP4750821B2 (ja) | 2011-08-17 |
Family
ID=37018303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008111697A Expired - Fee Related JP4750821B2 (ja) | 2005-07-21 | 2008-04-22 | 発光表示パネル |
Country Status (5)
Country | Link |
---|---|
US (1) | US7997766B2 (ja) |
EP (1) | EP1916648A4 (ja) |
JP (1) | JP4750821B2 (ja) |
CN (1) | CN2821749Y (ja) |
WO (1) | WO2007009296A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1916467A1 (en) * | 2005-08-19 | 2008-04-30 | NeoBulb Technologies, Inc. | Led illumination device with high power and high heat dissipation rate |
US7922360B2 (en) * | 2007-02-14 | 2011-04-12 | Cree, Inc. | Thermal transfer in solid state light emitting apparatus and methods of manufacturing |
TWM348981U (en) * | 2008-06-12 | 2009-01-11 | Acpa Energy Conversion Devices Co Ltd | Heat dissipation module |
EP2387070A1 (en) * | 2009-01-06 | 2011-11-16 | Chen, Jenshyan | Device for energy conversion and equipment for energy conversion |
TWM362362U (en) * | 2009-03-06 | 2009-08-01 | Acpa Energy Conversion Devices Co Ltd | Heat conduction structure for heating element |
EP2405194A1 (en) * | 2010-07-05 | 2012-01-11 | NeoBulb Technologies, Inc. | Light-emitting diode illumination platform |
JP5673705B2 (ja) * | 2013-02-27 | 2015-02-18 | 三菱電機株式会社 | 照明装置 |
JP6340753B2 (ja) * | 2013-03-18 | 2018-06-13 | 三菱電機株式会社 | 発光装置 |
JP5626432B2 (ja) * | 2013-09-03 | 2014-11-19 | 三菱電機株式会社 | 照明装置 |
CN106652810A (zh) * | 2016-11-17 | 2017-05-10 | 成都朵猫文化传播有限公司 | 一种可接入互联网的广告牌 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366104U (ja) * | 1986-10-20 | 1988-05-02 | ||
JPH0419583Y2 (ja) * | 1986-12-28 | 1992-05-01 | ||
JPS63185257U (ja) * | 1987-05-22 | 1988-11-29 | ||
JPH01135480U (ja) * | 1988-03-07 | 1989-09-18 | ||
JP3713088B2 (ja) * | 1996-02-19 | 2005-11-02 | ローム株式会社 | 表示装置 |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
JP2001267773A (ja) * | 2000-03-16 | 2001-09-28 | Hitachi Ltd | 電子部品の冷却装置 |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
WO2002084750A1 (fr) * | 2001-04-12 | 2002-10-24 | Matsushita Electric Works, Ltd. | Dispositif luminescent faisant intervenir des del et procede de fabrication |
EP1467414A4 (en) * | 2001-12-29 | 2007-07-11 | Hangzhou Fuyang Xinying Dianzi | LED AND LED LAMP |
US7234844B2 (en) | 2002-12-11 | 2007-06-26 | Charles Bolta | Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement |
US6789921B1 (en) * | 2003-03-25 | 2004-09-14 | Rockwell Collins | Method and apparatus for backlighting a dual mode liquid crystal display |
US6910794B2 (en) * | 2003-04-25 | 2005-06-28 | Guide Corporation | Automotive lighting assembly cooling system |
JP4236544B2 (ja) | 2003-09-12 | 2009-03-11 | 三洋電機株式会社 | 照明装置 |
US6966674B2 (en) * | 2004-02-17 | 2005-11-22 | Au Optronics Corp. | Backlight module and heat dissipation structure thereof |
CN1680749A (zh) | 2004-04-08 | 2005-10-12 | 吴裕朝 | 发光二极管装置、发光二极管散热系统及含其的照明装置 |
CN1585244A (zh) * | 2004-06-15 | 2005-02-23 | 于波 | 永磁发电机半控整流桥的散热机构 |
TWI257465B (en) * | 2004-10-11 | 2006-07-01 | Neobulb Technologies Inc | Lighting device with high heat dissipation efficiency |
CN1605795A (zh) | 2004-10-19 | 2005-04-13 | 陈振贤 | 具高散热效率的照明装置 |
US7331691B2 (en) | 2004-10-29 | 2008-02-19 | Goldeneye, Inc. | Light emitting diode light source with heat transfer means |
-
2005
- 2005-07-21 CN CNU2005201131143U patent/CN2821749Y/zh not_active Expired - Lifetime
- 2005-07-22 US US11/989,197 patent/US7997766B2/en not_active Expired - Fee Related
- 2005-07-22 EP EP05772528A patent/EP1916648A4/en not_active Withdrawn
- 2005-07-22 WO PCT/CN2005/001103 patent/WO2007009296A1/zh not_active Application Discontinuation
-
2008
- 2008-04-22 JP JP2008111697A patent/JP4750821B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1916648A1 (en) | 2008-04-30 |
CN2821749Y (zh) | 2006-09-27 |
WO2007009296A1 (fr) | 2007-01-25 |
US20090262534A1 (en) | 2009-10-22 |
EP1916648A4 (en) | 2009-05-27 |
US7997766B2 (en) | 2011-08-16 |
JP2008233924A (ja) | 2008-10-02 |
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