JP4746017B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method, and more particularly, to a sheet sticking apparatus and a sticking method suitable for integrating (mounting) a ring frame and a semiconductor wafer via an adhesive sheet.

  Conventionally, when a semiconductor wafer (hereinafter simply referred to as a “wafer”) and a ring frame are integrated, an adhesive sheet such as a dicing sheet or a mounting sheet is attached to the ring frame with the wafer disposed inside the ring frame. It is common to stick over the area (see, for example, Patent Document 1).

JP 2006-102822 A

  In the sheet sticking apparatus described in Patent Document 1, an adhesive sheet attached to a ring frame and a wafer is cut in contact with the surface of the ring frame, and the rotary blade used for the cutting is a ring. It is configured to move along a circumferential locus on the frame. Therefore, the cutting of the adhesive sheet according to Patent Document 1 has the disadvantage that the surface of the ring frame is damaged or the blade edge of the rotary blade is damaged.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to make the cutting blade and the adherend non-contact when the adhesive sheet affixed to the adherend is cut. An object of the present invention is to provide a sheet sticking device and a sticking method that can wipe out damage factors of an adherend and a cutting blade by maintaining the state.

In order to achieve the above object, a supporting means for supporting the adherend, a feeding means for feeding a belt-like adhesive sheet to a relative position of the adherend, a pressing means for pressing the adhesive sheet against the adherend, A cutting means for cutting the adhesive sheet inside the outer periphery of the adherend, and a clearance forming means for forming a space between the adhesive sheet and the adherend when cutting the adhesive sheet ,
The clearance forming means is provided so as to be able to be separated and approached relative to the support means, and a sheet pressing means for pressing the adhesive sheet between the adherend and the pressing means along the separating and approaching direction. And holding the adhesive sheet between the sheet pressing means and the sheet holding means in an inclined posture while maintaining the state in which the adhesive sheet is pressed by the sheet pressing means. In this way, the space can be formed .

The sheet sticking device according to the present invention includes a frame member and a support means for supporting the plate member in a state where the plate member is disposed inside the frame member, and a relative position between the frame member and the plate member. A feeding means for feeding out the belt-like adhesive sheet, a pressing means for pressing the adhesive sheet against the frame member and the plate-like member, a cutting means for cutting the adhesive sheet inside the outer periphery of the frame member, and the adhesive sheet. A clearance forming means for forming a space between the adhesive sheet and the frame member when cutting ,
The clearance forming means is provided so as to be able to be separated and approached relative to the support means, a sheet pressing means for pressing the adhesive sheet between the frame member, and a relative to the pressing means along the approaching and separating direction. And holding the adhesive sheet between the sheet pressing means and the sheet holding means in an inclined posture while maintaining the state in which the adhesive sheet is pressed by the sheet pressing means. In this case, the space can be formed .

  Moreover, the said press means is good to comprise by the 1st press means which presses the said adhesive sheet to a plate-shaped member, and the 2nd press means which presses an adhesive sheet to a frame member.

  Furthermore, the second pressing means is provided so as to be movable integrally with the cutting means, and is configured to press while rotating on the frame member.

Furthermore, the sheet sticking method according to the present invention includes a step of feeding a belt-like adhesive sheet to a relative position of an adherend located in a plane, a step of pressing the adhesive sheet and sticking the adherend to the adherend, and the bonding In the sheet sticking method including the step of cutting the sheet inside the outer periphery of the adherend,
While maintaining a state in which a part of the adhesive sheet is pressed against the adherend, the adhesive sheet is maintained in an inclined posture by relatively displacing the adhesive sheet and the adherend outside the pressed area. a space is formed between the sheet and the adherend, keeping and the adherend disconnect means by cutting the adhesive sheet to form the space in a non-contact, it adopts a method called.

According to the present invention, when the adhesive sheet is cut inside the outer periphery of the adherend, the space is formed between the adhesive sheet and the adherend via the clearance forming means. Can be kept at a position separated from the surface of the adherend. Therefore, by cutting the tip of the cutting blade that constitutes the cutting means in this space, it is possible to avoid contact between the cutting blade and the adherend. The inconvenience of damaging the tip can be solved.
Further, in the case where the clearance forming means is constituted by the sheet pressing means and the sheet holding means, a space can be obtained by simply displacing the plane position of the sheet holding means relative to the plane position where the sheet pressing means presses the adhesive sheet. Can be formed.
Further, when the pressing means is constituted by the first pressing means that presses the adhesive sheet against the plate-like member and the second pressing means that presses the adhesive sheet against the frame member, the frame is cut after cutting. The adhesive sheet can be reliably pressed against the member.
Further, by adopting a configuration in which the second pressing means is supported so as to be movable integrally with the cutting means, a mechanism for moving the second pressing means and the cutting means can be shared, and the configuration can be simplified. Can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment. In this figure, a sheet sticking device 10 includes a supply roll 11 that supports a belt-like adhesive sheet S that can be supplied in a rolled state, a ring frame RF as a frame member, and an inner side of the ring frame RF. Support means 12 for supporting a wafer W as a plate-shaped member arranged as an adherend, feeding means 13 for feeding a belt-like adhesive sheet S to an upper position relative to the ring frame RF and the wafer W, and the adhesive sheet In a state where the pressing means 14 for pressing S against the ring frame RF and the wafer W, the cutting means 15 for cutting the adhesive sheet S inside the outer periphery of the ring frame RF, and the adhesive sheet S pressed against the ring frame RF, Clearance formation for forming a space C (see FIG. 2) between the outer adhesive sheet S and the ring frame RF A stage 16, is constituted by a winding means 17 for winding the unnecessary adhesive sheet S1.

  The support means 12 includes an outer table 20 that supports the ring frame RF and an inner table 21 that supports the wafer W. The outer table 20 is provided with a circular hole 20A in the center, while the outer peripheral side is provided in a shape that forms a square in plan view. On the other hand, the inner table 21 is provided in a substantially circular shape having a smaller diameter than the inner diameter of the hole 20A and is disposed in the hole 20A. The outer table 20 and the inner table 21 have suction holes (not shown) formed on the upper surface side so that the ring frame RF and the wafer W can be sucked and held. Further, the inner table 21 is connected to the output shaft 23 of the linear motion motor 22 located on the lower surface side, whereby the upper surface height position can be adjusted corresponding to the wafers W having various thicknesses. .

  The feeding means 13 is supported by a frame F movable in the left-right direction in FIG. 1 by a driving means (not shown), and peels off an unnecessary adhesive sheet S1 (described later) from the ring frame RF, and removes the adhesive sheet S from the ring frame RF and The feeding roller 29 is fed to an upper position of the wafer W, and the pinch roller 28 sandwiches the unnecessary adhesive sheet S1 by the feeding roller 29. A guide roller 27 is disposed between the feeding means 13 and the supply roll 11 so as to be disposed relative to the feeding roller 29 and guide the adhesive sheet S substantially parallel to the upper surfaces of the wafer W and the ring frame R. ing. The feeding roller 29 can be rotated by a motor M.

  The pressing means 14 is provided so as to be movable up and down by a cylinder 25 attached in a sheet pressing means 45 described later, a first pressing means 30 for pressing the adhesive sheet S against the wafer W, and the adhesive sheet S on the ring frame RF. It is comprised with the 2nd press means 31 which presses to. The 1st press means 30 is comprised by elastic members, such as rubber | gum, and the lower surface side is provided in the curve or inclined surface shape in which a center part is located below rather than an outer peripheral part. Accordingly, when the adhesive sheet S is attached to the wafer W, the air existing between the adhesive sheet S and the wafer W can be attached while being expelled to the outside.

  The second pressing means 31 is constituted by a press roller 33 supported by a connecting arm 43 that supports a cutting means 15 described later. The press roller 33 is connected to the piston rod 37 of the pressing cylinder 36 via a bracket 35, and can move while rotating along the ring frame RF while pressing the adhesive sheet S against the upper surface of the ring frame RF. Is provided.

  The cutting means 15 includes a cutting blade 40 whose blade edge is directed to the lower end side, and a linear motion motor 41 that supports the cutting blade 40 so as to be movable in the vertical direction. The linear motion motor 41 is supported through the connecting arm 43 so as to be movable integrally with the pressing cylinder 36. A motor M2 for rotating the connecting arm 43 in a plane is disposed on the upper side of the connecting arm 43, and a linear motion fixed on the upper part of the motor M2 so as to be lifted and lowered by a frame (not shown). A motor M3 is arranged, and the entire unit below the motor M2 is provided so as to be movable up and down by the linear motion motor M3.

  The clearance forming means 16 is provided so as to be able to approach and separate from the support means 12 by the linear motion motor M3. The clearance forming means 16 includes a sheet pressing means 45 for pressing the adhesive sheet S between the ring frame RF and a sheet holding means 46 provided so as to be relatively displaceable with the sheet pressing means 45 along the approaching and separating direction. It is comprised including. The sheet pressing means 45 includes a plane part 50 having a substantially circular shape in plan view supported on the lower surface side of the central part of the connection arm 43 via a rotary bearing 48 and a peripheral wall part 51 depending from the outer periphery of the plane part 50. It is provided in the shape of a cylindrical container with an open bottom. The adhesive sheet S can be pressed by pressing the adhesive sheet S against the upper surface of the ring frame RF at the lower end surface of the peripheral wall portion 51.

  The sheet holding means 46 is constituted by a pair of upper and lower chucks 52 disposed on the left and right sides of the support means 12, respectively. Each chuck 52 is supported by a frame or the like (not shown). With the chuck 52 sandwiching the upper and lower surfaces of the adhesive sheet S, the sheet pressing member 45 is relatively lowered, so that the sheet pressing member 45 The adhesive sheet S from the outer edge to the chuck 52 is maintained in an inclined posture, and a space C is formed between the adhesive sheet S and the ring frame RF. In FIG. 2, the inclination angle of the adhesive sheet S is shown in a state of being largely inclined with respect to the plane, but this is for the purpose of expressing the space C in an easy-to-understand manner. The tip of 40 is kept at a slight inclination so that the adhesive sheet S can be pierced without contacting the surface of the ring frame RF. Therefore, the position of the support means 12 is actually higher than the position shown in FIG. 1, and the space C can be formed even if the lowering amount of the sheet pressing means 45 is small. Here, “slight inclination” means that the tension of the adhesive sheet S positioned between the left and right chucks 52 is not excessive, and warps the wafer W after the adhesive sheet S is attached to the ring frame RF and the wafer W. This is a level that does not occur.

  The winding means 17 is constituted by a winding roller 55 that is rotationally driven by a motor M4. The winding roller 55 can wind the outer side of the adhesive sheet S cut into a substantially circular shape by the cutting means 15 as an unnecessary adhesive sheet S1.

  Next, the sheet sticking method in this embodiment is demonstrated, also referring FIG. 2 thru | or FIG.

  First, the lead end of the adhesive sheet S supported by the supply roll 11 is pulled out and fixed to the take-up roller 55 between the guide roller 27, the left and right chucks 52, and the feeding means 13. In this state, the sheet pressing means 45 is maintained at an initial position located above the adhesive sheet S maintained substantially horizontal between the guide roller 27 and the feeding roller 29. Further, the support means 12 is in a position where the inner table 21 is lowered, and is prepared for the transfer of the wafer W.

  When the ring frame RF and the wafer W are transferred onto the outer table 20 and the inner table 21 through a transfer means (not shown), the left and right chucks 52 are closed as shown in FIG. Insert S. After the pinching is completed, the unit below the motor M2 is lowered by driving the linear motion motor M3, and the lower end surface of the peripheral wall portion 51 of the sheet pressing means 45 presses the adhesive sheet S against the ring frame RF. As a result, the adhesive sheet S between the peripheral wall portion 52 and the left and right chucks 52 is inclined, and a space C is formed. At this time, the left and right chucks 52 may be moved up and down or left and right to control the tension of the inclined portion of the adhesive sheet S.

  Next, as shown in FIG. 3, the cutting blade 40 of the cutting means 15 is lowered by driving the linear motion motor 41, penetrates the inclined portion of the adhesive sheet S, and the tip thereof is positioned in the space C. At this time, the position of the cutting blade 40 is controlled so as not to contact the ring frame RF. Then, when the motor M2 is driven and the connecting arm 43 rotates in a plane, the cutting blade 40 cuts the adhesive sheet S into a substantially circular shape, and then the cutting blade 40 moves backward (see FIG. 4).

  When the adhesive sheet S is cut in this way, the press roller 33 is lowered by the pressing cylinder 36 to a position where it presses the adhesive sheet S against the upper surface of the ring frame RF, and the inner table 21 is raised to raise the wafer W. The upper surface of the adhesive sheet S is raised slightly below the lower surface of the adhesive sheet S, and the first pressing means 30 is lowered by the cylinder 25 to attach the adhesive sheet S to the wafer W. Thereby, the wafer W and the ring frame RF can be integrated.

  Then, when the press roller 33 rotates once along the ring frame RF, the adhesive sheet S positioned outside the peripheral wall portion 51 of the sheet pressing means 45 is pressed and stuck to the ring frame RF. In FIG. 4, the adhesive sheet S is illustrated as being completely separated for easy understanding, but actually, the outer portion of the adhesive sheet S cut out in a circle is continuously used as the unnecessary adhesive sheet S <b> 1. Connected to.

  When sticking and cutting of the adhesive sheet S is completed in this way, the linear motor M3 moves upward, the entire unit below the linear motor M3 returns to the initial position, and the chuck 52 is opened. To do. Then, the feeding roller 29 of the feeding means 13 moves to the right in the figure together with the pinch roller 28 while being rotated by the motor M (see the position of the two-dot chain line in FIG. 1), and the unnecessary adhesive sheet S1 attached to the ring frame RF Peel off. After completion of the peeling, the motor M is locked and returns to the initial position shown in FIG. In synchronization with this return, the motor M4 is driven to wind up the unnecessary adhesive sheet S1 by the winding roller 55, and the new adhesive sheet S is fed out above the support means 12. During the peeling operation and the feeding operation by the feeding means 13, the entire unit below the linear motor M3 and the chuck 52 located on the left side are retracted to a position where the driving means (not shown) does not interfere with the operation of the feeding means 13. It is like that. Further, the wafer W integrated with the ring frame RF via the adhesive sheet S is transferred to the next process via a transfer means (not shown). Then, a new ring frame RF and wafer W are transferred to the support means 12, and thereafter the same operation is repeated to sequentially perform integration processing.

  Therefore, according to such an embodiment, the space C is formed between the adhesive sheet S and the ring frame RF, and the cutting is performed in a state where the cutting edge of the cutting blade 40 is positioned in the space C. Therefore, since the adhesive sheet S can be cut without bringing the cutting blade 40 into contact with the ring frame RF, the ring frame RF is not damaged, and the service life of the cutting blade 40 can be kept long. Get the effect.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the sheet pressing unit 45 is lowered (approached) to the support unit 12 side to keep the adhesive sheet S in an inclined posture. However, the present invention is not limited to this. The chuck 52 may be moved in a direction (upward) to be separated from the support unit 12, and the support unit 12 may be moved closer to the sheet pressing unit 45. In short, the sheet pressing means 45 and the sheet holding means 46 can move relatively apart from each other with respect to the support means 12, and the sheet pressing means 45 and the sheet holding means 46 are relatively displaced along the separation approaching direction. It is enough if possible.

  Further, the frame member is a ring frame RF having a closed loop shape as the adherend, but a frame member that is not a closed loop may be used.

  Furthermore, in the above-described embodiment, the case where the wafer W is integrated with the ring frame RF has been illustrated and described. However, the present invention includes a case where the adhesive sheet S is pasted by using either one as an adherend. Therefore, for example, when a surface protection sheet is attached to the wafer W, a sheet pressing unit having a diameter smaller than the diameter of the wafer W is adopted, and the second surface is positioned at a position where the surface of the wafer W can be pressed. This can be dealt with by arranging pressing means.

  Further, the plate-like member in the present invention is not limited to the semiconductor wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer is a silicon wafer. Or a compound wafer.

  Further, the first pressing means 30 may be a hollow elastic member, and the elastic member may be expanded by compressed air or a reduced pressure atmosphere so that the adhesive sheet S is attached to the wafer W. Further, the second pressing means may be constituted by spraying compressed air or using a blade material or the like instead of the above-described configuration.

  Further, the cutting means can be configured by other cutting means such as a laser instead of the above-described configuration.

The schematic front view of the sheet sticking apparatus which concerns on this embodiment. The schematic front view of the sheet sticking apparatus which shows the state which the sheet pressing means pressed the adhesive sheet. The principal part front view which shows the state which cut | disconnects an adhesive sheet. The principal part front view which shows the state which presses an adhesive sheet to a ring frame after the cutting | disconnection of an adhesive sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Support means 13 Feeding means 14 Pressing means 15 Cutting means 16 Clearance forming means 20 Outer table 21 Inner table 30 First pressing means 31 Second pressing means 45 Sheet pressing means 46 Sheet holding means C Space W Semiconductor Wafer (Substrate, plate member)
RF ring frame (adhered body, frame member)
S Adhesive sheet

Claims (5)

A supporting means for supporting the adherend, a feeding means for feeding the belt-like adhesive sheet to a relative position of the adherend, a pressing means for pressing the adhesive sheet against the adherend, and the adhesive sheet on the adherend. Cutting means for cutting inside the outer periphery, and clearance forming means for forming a space between the adhesive sheet and the adherend when cutting the adhesive sheet ,
The clearance forming means is provided so as to be able to be separated and approached relative to the support means, and a sheet pressing means for pressing the adhesive sheet between the adherend and the pressing means along the separating and approaching direction. And holding the adhesive sheet between the sheet pressing means and the sheet holding means in an inclined posture while maintaining the state in which the adhesive sheet is pressed by the sheet pressing means. A sheet sticking device characterized in that the space can be formed . A support means for supporting the frame member and the plate-like member in a state in which the plate-like member is disposed inside the frame member, a feeding means for feeding out a belt-like adhesive sheet to a relative position between the frame member and the plate-like member, A pressing means for pressing the adhesive sheet against the frame member and the plate-like member, a cutting means for cutting the adhesive sheet inside the outer periphery of the frame member, and when the adhesive sheet is cut, the adhesive sheet and the frame member, and a clearance forming means for forming a space between,
The clearance forming means is provided so as to be able to be separated and approached relative to the support means, a sheet pressing means for pressing the adhesive sheet between the frame member, and a relative to the pressing means along the approaching and separating direction. And holding the adhesive sheet between the sheet pressing means and the sheet holding means in an inclined posture while maintaining the state in which the adhesive sheet is pressed by the sheet pressing means. The sheet sticking apparatus , wherein the space can be formed . Said pressing means, according to claim 2, wherein in that it comprises a first pressing means for pressing the adhesive sheet to the plate-like member and a second pressing means for pressing the adhesive sheet to the frame member Sheet sticking device. 4. The sheet sticking apparatus according to claim 3, wherein the second pressing means is provided so as to be movable integrally with the cutting means and presses while rotating on the frame member. A step of feeding a belt-like adhesive sheet to a relative position of an adherend positioned in a plane, a step of pressing the adhesive sheet and sticking the adherend to the adherend, and the adhesive sheet inside the outer periphery of the adherend In the sheet sticking method including the step of cutting,
While maintaining a state in which a part of the adhesive sheet is pressed against the adherend, the adhesive sheet is maintained in an inclined posture by relatively displacing the adhesive sheet and the adherend outside the pressed area. sheet sticking method to form a space between the sheet and the adherend, wherein the keep and the adherend disconnect means by cutting the adhesive sheet to form the space in a non-contact.

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