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JP4635670B2 - Cooling structure of electronic equipment unit - Google Patents

Cooling structure of electronic equipment unit Download PDF

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JP4635670B2
JP4635670B2 JP2005082935A JP2005082935A JP4635670B2 JP 4635670 B2 JP4635670 B2 JP 4635670B2 JP 2005082935 A JP2005082935 A JP 2005082935A JP 2005082935 A JP2005082935 A JP 2005082935A JP 4635670 B2 JP4635670 B2 JP 4635670B2
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heat
housing
cooling
intake
opening
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JP2006269575A (en
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孝幸 長嶋
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Meidensha Corp
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Description

この発明は、自然空冷の電子機器ユニットであって、基本ユニット部と拡張冷却ユニット部とから構成され、設置環境温度又は実装スペースの優先度の選択によりユニット構成を変更可能とした電子機器ユニットの冷却構造、あるいはメインプリント板とオプションプリント板の多段積み構成とされた電子機器ユニットの冷却構造に関するものである。   The present invention is a natural air-cooled electronic device unit, which is composed of a basic unit portion and an extended cooling unit portion, and an electronic device unit whose unit configuration can be changed by selecting the installation environment temperature or the priority of the mounting space. The present invention relates to a cooling structure or a cooling structure of an electronic device unit having a multi-stacked structure of a main printed board and an optional printed board.

電子機器ユニットの中には様々な用途に使用されるものがあり、そのために電子機器は小型でかつ高い温度で使用可能な仕様を求められるようになったが、電子機器ユニットで使用される部品の発熱量が次第に大きくなり、その要求に応えることが困難になった。特に、小型であることと冷却特性が高いこととは矛盾した関係にあり、これらを両立させることは非常に困難であった。そこで、従来、温度対策として、次のようなことが行われていた。即ち、(1)高い温度仕様とするため、自然空冷から強制空冷に変更した。この場合、冷却ファンを実装するため、ユニットの信頼性は低下し、コストアップ、電力量アップ等が生じる。又、冷却ファンを実装する容積が必要となり、筐体が大きくなった。(2)ユニットの設置環境温度を低くする。電子機器ユニットの設置環境温度を低くするには、外側に強制空気装置を設けたり、他の発熱部品の影響を抑えるため、設置場所を広くとったり、場所の入れ替えをしたりする必要がある。(3)電子機器ユニットの筐体の寸法を大きくして、冷却特性を向上する。自然空冷の場合には、筐体の容積により冷却特性が決定されてしまう。そこで、電子機器ユニットの筐体の寸法を大きくして、冷却効率を高めることが行なわれた。   Some electronic device units are used for various purposes. For this reason, electronic devices are required to have specifications that are small and can be used at high temperatures. The calorific value of the ash gradually increased, making it difficult to meet the demand. In particular, there is a contradictory relationship between the small size and the high cooling characteristics, and it has been very difficult to achieve both. Therefore, conventionally, the following has been performed as a countermeasure against temperature. That is, (1) natural air cooling was changed to forced air cooling to achieve a high temperature specification. In this case, since the cooling fan is mounted, the reliability of the unit is lowered, resulting in an increase in cost, an increase in electric power, and the like. In addition, a volume for mounting the cooling fan is required, and the housing becomes large. (2) Lower the installation environment temperature of the unit. In order to reduce the installation environment temperature of the electronic device unit, it is necessary to provide a forced air device on the outside, or to widen the installation place or replace the place in order to suppress the influence of other heat generating components. (3) The size of the housing of the electronic device unit is increased to improve the cooling characteristics. In the case of natural air cooling, the cooling characteristics are determined by the volume of the housing. Therefore, the size of the housing of the electronic device unit has been increased to improve the cooling efficiency.

(3)の場合について、図5により説明する。図5(a)は標準ユニットの場合、図5(b)は高環境温度対策ユニットの場合であり、何れの場合も筐体1の内部に発熱部品であるプリント板2が設けられ、矢印3により筐体1の内部から外部への熱流が示されている。図5(b)の場合には筐体1の容積を大きくし、冷却効率を高めている。   The case (3) will be described with reference to FIG. 5A shows the case of a standard unit, and FIG. 5B shows the case of a high environmental temperature countermeasure unit. In either case, a printed board 2 which is a heat generating component is provided inside the housing 1, and an arrow 3 Shows the heat flow from the inside of the housing 1 to the outside. In the case of FIG. 5B, the volume of the housing 1 is increased to enhance the cooling efficiency.

又、自然空冷の電子機器ユニットにおいては、冷却効率を向上するために、(4)筐体の吸排気口の開口率を大きくして内部に多くの空気を入れて冷却する対策、あるいは(5)熱伝導で筐体へ熱を移動させて放熱させる対策が行われている。(4)の対策、即ち筐体の吸排気口の開口率を大きくした場合を図6により説明する。4は電子機器ユニットの筐体、5は床等の設置面であり、筐体4と設置面5との間にはゴム脚等の間隔材6が設けられ、筐体4の内底面上には支柱7が立設され、支柱7には水平実装のメインプリント板8及びオプションプリント板9が上下二段に取り付けられる。メインプリント板8の下面には発熱デバイス10が実装される。筐体4の底面4aには吸気口4bが設けられ、筐体4の天面4cには排気口4dが設けられ、筐体4の側面4eには吸排気口4fが設けられる。二点鎖線11は吸排気分離ラインであり、ライン11より上方の吸排気口4fは実質的には排気口となり、ライン11より下方の吸排気口4fは実質的には吸気口となる。オプションプリント板9の中央にも排気口9aが設けられる。   Further, in a natural air-cooled electronic device unit, in order to improve cooling efficiency, (4) a countermeasure for increasing the opening ratio of the intake / exhaust port of the housing and introducing a large amount of air inside, or (5 ) Measures are taken to dissipate heat by transferring heat to the housing by heat conduction. The countermeasure of (4), that is, the case where the opening ratio of the intake / exhaust port of the housing is increased will be described with reference to FIG. Reference numeral 4 denotes a housing of the electronic device unit, 5 denotes an installation surface such as a floor, and a spacing member 6 such as a rubber leg is provided between the housing 4 and the installation surface 5. The column 7 is erected, and a horizontal printed main printed board 8 and an optional printed board 9 are attached to the column 7 in two upper and lower stages. A heat generating device 10 is mounted on the lower surface of the main printed board 8. An intake port 4 b is provided on the bottom surface 4 a of the housing 4, an exhaust port 4 d is provided on the top surface 4 c of the housing 4, and an intake / exhaust port 4 f is provided on the side surface 4 e of the housing 4. A two-dot chain line 11 is an intake / exhaust separation line. The intake / exhaust port 4f above the line 11 is substantially an exhaust port, and the intake / exhaust port 4f below the line 11 is substantially an intake port. An exhaust port 9 a is also provided at the center of the option printed board 9.

上記構成において、冷却空気は矢印12に示すように筐体4の底面4aの吸気口4b及び側面4eのライン11より下方の吸排気口4fから流入し、天面4cの排気口4d及び側面4eのライン11より上方の吸排気口4fから流出する。13はプリント板8,9間の中央部分に形成される発熱中心部分、14は同じくプリント板8,9間に形成される高温部分であり、発熱中心部分13は吸排気分離ライン11とほぼ同一高さとなる。   In the above configuration, the cooling air flows from the intake port 4f on the bottom surface 4a and the side surface 4e of the casing 4 through the intake / exhaust port 4f as shown by the arrow 12, and the exhaust port 4d and the side surface 4e on the top surface 4c. Flows out from the intake / exhaust port 4 f above the line 11. 13 is a heat generating center portion formed in the central portion between the printed boards 8 and 9, 14 is a high temperature portion similarly formed between the printed boards 8 and 9, and the heat generating center portion 13 is substantially the same as the intake / exhaust separation line 11. It becomes height.

図7は(5)の対策、即ち筐体15へ熱伝導させて放熱させる場合であり、筐体15の底面15aには吸気口を設けず、天面15bには排気口15cを設け、側面15dには吸排気口15eを設けている。発熱デバイス10の下面と筐体15の内底面との間には熱伝導ゴム16を設け、発熱量が大きいメインプリント板8の発熱デバイス10からの熱を熱伝導ゴム16を介して筐体15の底面15aへ熱伝導させて放熱し、また筐体15の天面15bに設けた排気口15cから残りの熱を放出する。この場合、筐体15に熱伝導させて放熱するため、筐体15が大きいとメインプリント板8の冷却効果は大きく、オプションプリント板9との間の熱の移動は小さく、各部の温度上昇は抑制される。   FIG. 7 shows the countermeasure of (5), that is, the case where heat is conducted to the housing 15 to dissipate heat. The bottom surface 15a of the housing 15 is not provided with an intake port, and the top surface 15b is provided with an exhaust port 15c. An intake / exhaust port 15e is provided at 15d. A heat conductive rubber 16 is provided between the lower surface of the heat generating device 10 and the inner bottom surface of the housing 15, and heat from the heat generating device 10 of the main printed board 8 that generates a large amount of heat is transmitted through the heat conductive rubber 16 through the housing 15. The bottom surface 15a of the housing 15 is thermally conducted to dissipate heat, and the remaining heat is released from the exhaust port 15c provided on the top surface 15b of the housing 15. In this case, since heat is conducted to the housing 15 to dissipate heat, if the housing 15 is large, the cooling effect of the main printed board 8 is large, the heat transfer between the optional printed board 9 is small, and the temperature rise of each part is It is suppressed.

その他、この出願の発明に関連する先行技術文献情報としては次のようなものがある。
特開2003−298269号公報 特開2004−363525号公報 特開2000−36678号公報 特開2000−252656号公報
Other prior art document information related to the invention of this application is as follows.
JP 2003-298269 A JP 2004-363525 A JP 2000-36678 A JP 2000-252656 A

上記した(1),(3)の対策、即ち冷却ファンを設置したり、筐体の大きさを大きくする対策は設置環境温度が高い場合には実施することとなるが、設置環境温度が問題となるケースは少なく、むしろ小型化が要求されるケースの方が多く、小型化の要求には応えることができなかった。又、(2)の対策、即ち電子機器ユニットの設置環境温度を低くするのは、設置環境温度が問題となるケースが少ないばかりでなく、システム全体を構築する場合に大きな障害(制約)となり、好ましくなかった。   The above measures (1) and (3), that is, the measures to install a cooling fan or increase the size of the housing, are implemented when the installation environment temperature is high, but the installation environment temperature is a problem. However, there were more cases where downsizing was required, and the request for downsizing could not be met. In addition, the measure (2), that is, lowering the installation environment temperature of the electronic device unit is not only a small number of cases where the installation environment temperature becomes a problem, but also becomes a major obstacle (constraint) when constructing the entire system. It was not preferable.

又、(4)の対策において、図6に示すように、自然空冷でプリント板8,9が水平実装で多段積みの場合、吸気口4b及び排気口4dを設けてその開口率を高くしても、プリント板8,9間に熱がこもって発熱中心部分13及び高温部分14が生じてしまう。又、側面4eに吸排気口4fを設けても、発熱中心13がプリント板8、9間にあり、吸気と排気が混在するため、対流が滞り、オプションプリント板9に排気口9aを設けても低温の空気がプリント板8,9間に入らず、熱がこもることになる。さらに、メインプリント板8の発熱量が大きく、オプションプリント板9の最大許容温度が低い場合、電子機器ユニットの周囲温度の仕様を下げる必要が出てくる。又、天面4c側に排気口4dが必要なため、筐体4の上に小さな落下物があると、筐体4内に入る可能性があり、短絡の原因になる。また、底面4aにも吸気口4bがあるため、設置面5に細かい金属物があると、やはり短絡の危険が生じる。さらに、筐体4の上方、下方は通風抵抗を下げるため、多くのスペースが必要となり、例えば底面4aと設置面5との間にゴム脚等の間隔材6が必要になる。   In the measure of (4), as shown in FIG. 6, when the printed boards 8 and 9 are horizontally mounted and are stacked in multiple stages with natural air cooling, an intake port 4b and an exhaust port 4d are provided to increase the opening ratio. However, heat is trapped between the printed boards 8 and 9, and the heat generating center portion 13 and the high temperature portion 14 are generated. Further, even if the intake / exhaust port 4f is provided on the side surface 4e, the heat generating center 13 is located between the printed boards 8 and 9, and intake and exhaust are mixed. However, low-temperature air does not enter between the printed boards 8 and 9, and heat is trapped. Furthermore, when the heat generation amount of the main printed board 8 is large and the maximum allowable temperature of the optional printed board 9 is low, it is necessary to lower the specification of the ambient temperature of the electronic device unit. Further, since the exhaust port 4d is required on the top surface 4c side, if there is a small fallen object on the casing 4, there is a possibility of entering the casing 4, which causes a short circuit. Further, since the bottom surface 4a also has the intake port 4b, if there is a fine metal object on the installation surface 5, there is a risk of short circuit. Furthermore, a large space is required above and below the housing 4 in order to reduce the ventilation resistance. For example, a spacing member 6 such as a rubber leg is required between the bottom surface 4 a and the installation surface 5.

また、(5)の対策である図7の場合、筐体15が大きい場合は冷却効果は大きいが、小型ユニットの場合は冷却効果が落ちる。又、メインプリント板8の発熱量が大きく、オプションプリント板9の最大許容温度が低い場合は、電子機器ユニットの周囲の温度仕様を下げる必要がある。さらに、天面15bに排気口15cがあるため、筐体15の上に小さな落下物があると、筐体15内に入り、短絡の原因になる。また、底面15aには吸気口は設けないが、底面15aから放射により放熱させるため、高い放射率となるように表面処理を施す必要があり、また筐体15の上下には通風抵抗を下げるために多くのスペースを設ける必要がある。   In the case of FIG. 7, which is a countermeasure of (5), the cooling effect is large when the casing 15 is large, but the cooling effect is reduced in the case of a small unit. Further, when the heat generation amount of the main printed board 8 is large and the maximum allowable temperature of the optional printed board 9 is low, it is necessary to lower the temperature specification around the electronic device unit. Furthermore, since there is an exhaust port 15c on the top surface 15b, if there is a small fallen object on the case 15, it will enter the case 15 and cause a short circuit. In addition, the bottom surface 15a is not provided with an intake port, but since heat is radiated from the bottom surface 15a, it is necessary to perform a surface treatment so as to obtain a high emissivity. It is necessary to provide a lot of space.

この発明は上記のような課題を解決するために成されたものであり、小型で冷却特性が高い電子機器ユニットの冷却構造を得ることを目的とする。   The present invention has been made to solve the above-described problems, and an object thereof is to obtain a cooling structure for an electronic device unit that is small in size and has high cooling characteristics.

この発明の請求項1に係る電子機器ユニットの冷却構造は、筐体内に発熱デバイスを実装されたプリント板を収容し、前記筐体の一側に放熱面を有し、該放熱面と対向する側面に開口部を有し、底面に吸気口を有し、天面に排気口を有し、前記発熱デバイスと前記放熱面の間に熱伝導ゴムを介在させるとともに、前記開口部を着脱自在の平板状のカバー部で閉塞可能な基本ユニット部と、
空状に形成されていて、一側に前記基本ユニット部の開口部と連通する開口部を有するとともに、該開口部に対向する他側に放熱面を有し、底面に吸気口を有し、天面に排気口を有し、前記基本ユニット部の開口部に前記カバー部に代えて着脱自在に取り付けられる拡張冷却ユニット部と、を備えたものである。
Cooling structure for an electronic device unit according to claim 1 of the present invention accommodates a printed circuit board mounted a heating device in a housing having a heat radiating surface on one side of the housing, opposite to the heat radiating surface has an opening on the side surface, it has an air inlet on the bottom, an exhaust opening in the top, with the interposition of thermally conductive rubber between the radiating surface and the heat-generating device, removable the opening a basic unit portion that can close a flat plate-like cover portion,
It is formed in a middle empty shape, and having an opening in communication with the opening of the basic unit portion on one side, having a heat radiating surface on the other side facing the opening, has an air inlet on the bottom And an extended cooling unit portion having an exhaust port on the top surface and detachably attached to the opening of the basic unit portion in place of the cover portion.

以上のようにこの発明の請求項1によれば、設置環境温度が普通の場合には冷却構造を基本ユニット部のみとして小型化を図り、設置環境温度が高い場合には基本ユニット部の筐体の開口部に拡張冷却ユニット部の開口部を取り付け、熱伝導と熱放射により冷却特性を向上させており、小型化と高冷却特性の両方を実現することができる。   As described above, according to the first aspect of the present invention, when the installation environment temperature is normal, the cooling structure is used only as the basic unit portion to reduce the size, and when the installation environment temperature is high, the housing of the basic unit portion is provided. The opening portion of the extended cooling unit portion is attached to the opening portion, and the cooling characteristics are improved by heat conduction and radiation, so that both miniaturization and high cooling characteristics can be realized.

参考形態1
以下、この発明の実施形態を説明する前に参考形態1を図面とともに説明する。図1(a),(b)はこの発明の参考形態1による電子機器ユニットの冷却構造の基本ユニット部の縦断側面図及び拡張冷却ユニット部の側面図を示し、内部実装部品が少ない場合の参考形態である。基本ユニット部17の筐体18はアルミニウム等の熱伝導率が高い材料により形成する。筐体18の底面18aには吸気口18bを設けるとともに、天面18cには排気口18dを設ける。筐体18の一方の側面18eの内側には支柱7が立設され、支柱7にはプリント板19がねじ20により取り付けられ、プリント板19の内面側には発熱デバイス21が実装され、発熱デバイス21は突出した発熱部(ダイ部)21aを有する。発熱部21aには金属製のヒートスプレッダー22が接着部23を介して接着され、ヒートスプレッダー22と筐体18の一方の側面18eとの間には熱伝導ゴム24が設けられ、側面18eは放熱面となる。
Reference form 1
Before describing an embodiment of the present invention , Reference Embodiment 1 will be described with reference to the drawings. Figure 1 (a), (b) shows a side view of a vertical side view and expansion cooling unit of the basic unit of the cooling structure of the electronic device unit according to Reference Embodiment 1 of the present invention, when the internal mounting part is small Reference It is a form. The casing 18 of the basic unit portion 17 is formed of a material having high thermal conductivity such as aluminum. An intake port 18b is provided on the bottom surface 18a of the housing 18, and an exhaust port 18d is provided on the top surface 18c. A support column 7 is erected on the inner side of one side surface 18 e of the housing 18, a printed board 19 is attached to the support column 7 with screws 20, and a heat generating device 21 is mounted on the inner surface side of the printed board 19. 21 has a protruding heat generating part (die part) 21a. A metal heat spreader 22 is bonded to the heat generating portion 21a through an adhesive portion 23, and a heat conductive rubber 24 is provided between the heat spreader 22 and one side surface 18e of the housing 18, and the side surface 18e dissipates heat. It becomes a surface.

25は高熱伝導で高熱放射の部材からなる拡張冷却ユニット部、ここではヒートシンクであり、その取付部25aは基本ユニット部17の放熱面18eに着脱自在に取り付けられる。   Reference numeral 25 denotes an extended cooling unit portion made of a member having high heat conduction and high heat radiation, here, a heat sink, and its attachment portion 25a is detachably attached to the heat radiation surface 18e of the basic unit portion 17.

上記構成において、黒い矢印3は熱流、白い矢印12は空気流を示し、発熱デバイス21の発熱部21aからの熱は伝導によりヒートスプレッダー22に拡散された後、熱伝導ゴム24を介して筐体18の放熱面18eに熱伝導され、放熱面18eから熱伝導及び熱放射により放熱される。又、放熱面18eを塗装等により表面処理することにより熱放射率を高め、冷却特性を向上することができる。このような構造により、発熱デバイス21からの発熱の多くは筐体18より放出されるが、その放熱量は筐体18の表面積と状態に依存するため、冷却特性には限度がある。設置環境温度が普通の場合は、基本ユニット部17に拡張冷却ユニット部25を取り付けず、基本ユニット部17のみとし、冷却構造を小型化する。設置環境温度が高い場合には、基本ユニット部17の筐体18の放熱面18eに拡張冷却ユニット部25の取付部25aを取り付け、熱伝導及び熱放射をさらに向上させて冷却特性を向上させる。   In the above configuration, the black arrow 3 indicates a heat flow, the white arrow 12 indicates an air flow, and the heat from the heat generating portion 21a of the heat generating device 21 is diffused to the heat spreader 22 by conduction, and then the case is interposed via the heat conductive rubber 24. The heat radiating surface 18e is thermally conducted and is radiated from the heat radiating surface 18e by heat conduction and heat radiation. Moreover, the heat emissivity can be increased and the cooling characteristics can be improved by surface-treating the heat radiating surface 18e by coating or the like. With such a structure, most of the heat generated from the heat generating device 21 is released from the housing 18, but since the amount of heat radiation depends on the surface area and state of the housing 18, the cooling characteristics are limited. When the installation environment temperature is normal, the extended cooling unit portion 25 is not attached to the basic unit portion 17 and only the basic unit portion 17 is provided, and the cooling structure is downsized. When the installation environment temperature is high, the attachment portion 25a of the extended cooling unit portion 25 is attached to the heat radiating surface 18e of the casing 18 of the basic unit portion 17 to further improve heat conduction and heat radiation to improve the cooling characteristics.

参考形態1においては、設置環境温度が普通の場合には冷却構造を基本ユニット部17のみとしており、小型化とコストダウンが可能であり、設置環境温度が高い場合には基本ユニット部17の筐体18の放熱面18eに拡張冷却ユニット部25の取付部25aを取り付け、冷却特性を向上させており、小型化と高冷却特性の両方を実現することができる。 In the reference form 1, when the installation environment temperature is normal, the cooling structure is only the basic unit portion 17, which can reduce the size and cost, and when the installation environment temperature is high, the housing of the basic unit portion 17 can be reduced. The attachment portion 25a of the extended cooling unit portion 25 is attached to the heat radiating surface 18e of the body 18 to improve the cooling characteristics, and both miniaturization and high cooling characteristics can be realized.

実施最良形態
図2(a),(b)は実施最良形態による電子機器ユニットの冷却構造の拡張冷却ユニット部の縦断側面図及び基本ユニット部の縦断側面図を示し、内部実装部品が多い場合の実施最良形態である。基本ユニット部26の筐体27はアルミニウム等の熱伝導率が高い材料により形成する。筐体27の底面27aには吸気口27bが設けられるとともに、天面27cには排気口27dが設けられる。筐体27の一方の側面27eの内面には支柱7が立設され、支柱7にはプリント板19がねじ20により取り付けられ、プリント板19の内面側には発熱デバイス21が実装される。発熱デバイス21の発熱部21aにはヒートスプレッダー22が接着部23を介して接着され、ヒートスプレッダー22と筐体27の側面27eとの間には熱伝導ゴム24が設けられ、側面27eが放熱面となる。筐体27内にはその他のプリント板28も設けられ、筐体27の放熱面27eと反対側には開口部27fが設けられ、開口部27fには筐体27と同じ材質のカバー部27gが着脱自在に取り付けられる。
Best Embodiment 1
FIGS. 2A and 2B are a vertical side view of the extended cooling unit portion and a vertical side view of the basic unit portion of the cooling structure of the electronic device unit according to the first embodiment, and the best implementation when there are many internal mounting parts. It is a form. The casing 27 of the basic unit portion 26 is formed of a material having high thermal conductivity such as aluminum. An intake port 27b is provided on the bottom surface 27a of the casing 27, and an exhaust port 27d is provided on the top surface 27c. A support column 7 is erected on the inner surface of one side surface 27 e of the housing 27, a printed board 19 is attached to the support column 7 with screws 20, and a heat generating device 21 is mounted on the inner surface side of the printed board 19. The heat spreader 22 is bonded to the heat generating portion 21a of the heat generating device 21 via the bonding portion 23, the heat conductive rubber 24 is provided between the heat spreader 22 and the side surface 27e of the housing 27, and the side surface 27e is the heat radiating surface. It becomes. Other printed boards 28 are also provided in the housing 27, an opening 27f is provided on the opposite side of the heat dissipation surface 27e of the housing 27, and a cover 27g made of the same material as the housing 27 is provided in the opening 27f. Removably attached.

29は高熱伝導で表裏が高熱放射の部材により一方が開口した筐状に形成された拡張冷却ユニット部であり、開口部29aは基本ユニット部26の開口部27fにカバー部27gの代わりに着脱自在に取り付けられる。又、拡張冷却ユニット部29の底面29bには吸気口29cが設けられ、天面29dには排気口29eが設けられる。   Reference numeral 29 denotes an extended cooling unit portion formed in a housing shape having one side opened by a member having high heat conduction and front and back sides having high heat radiation, and the opening portion 29a is detachably attached to the opening portion 27f of the basic unit portion 26 instead of the cover portion 27g. Attached to. Further, the bottom surface 29b of the extended cooling unit 29 is provided with an intake port 29c, and the top surface 29d is provided with an exhaust port 29e.

上記構成において、発熱デバイス21の発熱部21aからの熱は熱伝導によりヒートスプレッダー22に拡散された後、熱伝導ゴム24を介して筐体27の放熱面27eに熱伝導され、放熱面27eから熱伝導及び熱放射により放熱される。又、放熱面27eを塗装等により表面処理することにより熱放射率を高め、冷却特性を向上することができる。設置環境温度が普通の場合は、基本ユニット部26に拡張冷却ユニット部29を取り付けず、筐体27の開口部27fにはカバー部27gを取り付ける。又、設置環境温度が高い場合には、基本ユニット部26の筐体27の開口部27fからカバー部27gを取り外し、拡張冷却ユニット部29の開口部29aを開口部27fに取り付ける。この構造により、筐体が全体的に大きくなり、吸排気口も増加し、内部対流による熱伝達が大きくなり、また拡張冷却ユニット部29の裏側に基本ユニット部26から熱放射を受け、この熱を拡張冷却ユニット部29の表側から熱放射するので、冷却効果が向上する。実施最良形態の冷却構造は、発熱物が基本ユニット部26の全体に実装されているような場合に特に有効であり、内部の熱伝達と熱放射により冷却効果は増加する。 In the above configuration, the heat from the heat generating portion 21a of the heat generating device 21 is diffused to the heat spreader 22 by heat conduction, and then is thermally conducted to the heat radiating surface 27e of the housing 27 via the heat conductive rubber 24, and from the heat radiating surface 27e. It is dissipated by heat conduction and heat radiation. Moreover, the heat emissivity can be increased by surface-treating the heat radiating surface 27e by coating or the like, and the cooling characteristics can be improved. When the installation environment temperature is normal, the extended cooling unit 29 is not attached to the basic unit 26, and the cover 27 g is attached to the opening 27 f of the housing 27. When the installation environment temperature is high, the cover 27g is removed from the opening 27f of the casing 27 of the basic unit 26, and the opening 29a of the extended cooling unit 29 is attached to the opening 27f. With this structure, the overall housing becomes larger, the number of intake / exhaust ports also increases, heat transfer due to internal convection increases, and heat radiation is received from the basic unit portion 26 on the back side of the extended cooling unit portion 29. Since the heat is radiated from the front side of the extended cooling unit 29, the cooling effect is improved. The cooling structure of the first embodiment is particularly effective when the heat generating material is mounted on the entire basic unit portion 26, and the cooling effect is increased by internal heat transfer and heat radiation.

実施最良形態においては、設置環境温度が普通の場合には冷却構造を基本ユニット部26のみとしており、小型化とコストダウンが可能であり、設置環境温度が高い場合には基本ユニット部26の筐体27の開口部27fに拡張冷却ユニット部29の開口部29aを取り付け、熱伝達と熱放射により冷却特性を向上させており、小型化と高冷却特性の両方を実現することができる。又、内部部品が高発熱になっても、拡張冷却ユニット部29を大きくすることにより容易に対応することができる。 In the first embodiment, when the installation environment temperature is normal, the cooling structure is only the basic unit portion 26, and it is possible to reduce the size and cost, and when the installation environment temperature is high, the basic unit portion 26 The opening 29a of the extended cooling unit 29 is attached to the opening 27f of the housing 27, and the cooling characteristics are improved by heat transfer and heat radiation, so that both miniaturization and high cooling characteristics can be realized. Further, even if the internal components generate high heat, it can be easily handled by increasing the size of the extended cooling unit 29.

参考形態
図3は参考形態による電子機器ユニットの冷却構造の縦断側面図を示し、筐体30はアルミニウム等の高熱伝導率材により形成する。筐体30は設置面5に間隔材6を介して設置され、底面30aに吸気口30bが設けられるとともに、両側面30cに吸排気口30dが設けられる。又、筐体30の天面30eの内面には支柱7が立設され、支柱7にはメインプリント板31及びオプションプリント板32が上下二段に水平にねじ33により取り付けられ、メインプリント板31の上面には発熱デバイス34が実装され、発熱デバイス34の上面と筐体30の天面30eの下面との間には熱伝導ゴム35が設けられる。11は吸排気口30dの吸排気分離ラインである。又、オプションプリント板32の中央にも排気口32aを設ける。筐体30と間隔材6の合計高さはhである。
Reference form 2
FIG. 3 shows a longitudinal side view of the cooling structure of the electronic device unit according to Reference Embodiment 2 , and the housing 30 is formed of a high thermal conductivity material such as aluminum. The housing 30 is installed on the installation surface 5 via the spacing member 6, and an intake port 30b is provided on the bottom surface 30a, and an intake / exhaust port 30d is provided on both side surfaces 30c. Further, a support column 7 is erected on the inner surface of the top surface 30 e of the housing 30, and a main printed board 31 and an optional printed board 32 are attached to the support column 7 vertically in two stages by screws 33. A heat generating device 34 is mounted on the upper surface of the heat generating device 34, and a heat conductive rubber 35 is provided between the upper surface of the heat generating device 34 and the lower surface of the top surface 30 e of the housing 30. Reference numeral 11 denotes an intake / exhaust separation line of the intake / exhaust port 30d. An exhaust port 32 a is also provided at the center of the option printed board 32. The total height of the housing 30 and the spacing member 6 is h.

上記構成において、発熱デバイス34の熱は熱伝導ゴム35を介して筐体30の天面30eに熱伝導され、天面30eから熱放射、熱伝導により放熱される。天面30eは最も冷却効率が良い部分であるので、効率の良い放熱が行なわれる。又、天面30eから放熱仕切れない熱は側面30cに熱伝導され、側面30cから放熱される。また、オプションプリント板32は筐体30の底面30aの吸気口30bから流入した冷えた空気により冷却され、吸気口30bは多数設けられるので、吸気抵抗は小さく、オプションプリント板32の排気口32aへ熱い空気が流出する。発熱部が上方に位置するため、発熱中心13も上方に位置し、吸排気分離ライン11も発熱中心13とほぼ同じレベルになるため、側面30cに設けられた吸排気口30dは吸気口として機能するものが多くなり、プリント板31,32間に冷たい空気が流入し、効果的に冷却される。特に、オプションプリント板32の冷却効率が良い。   In the above configuration, the heat of the heat generating device 34 is thermally conducted to the top surface 30e of the housing 30 through the heat conducting rubber 35, and is radiated from the top surface 30e by heat radiation and heat conduction. Since the top surface 30e is the portion with the highest cooling efficiency, efficient heat radiation is performed. Further, the heat that is not separated from the top surface 30e is thermally conducted to the side surface 30c and is radiated from the side surface 30c. Further, the option printed board 32 is cooled by the cooled air flowing in from the air inlet 30b of the bottom surface 30a of the housing 30, and a large number of air inlets 30b are provided. Hot air flows out. Since the heat generating portion is located above, the heat generating center 13 is also located above, and the intake / exhaust separation line 11 is at substantially the same level as the heat generating center 13, so the intake / exhaust port 30d provided on the side surface 30c functions as an intake port. As a result, cold air flows between the printed boards 31 and 32 to effectively cool them. In particular, the cooling efficiency of the option printed board 32 is good.

参考形態においては、発熱デバイス34を筐体30内の上方に位置させ、その熱を冷却効率が良い天面30eに熱伝導して放熱しており、冷却効率が向上する。又、発熱部が上方に位置するために吸排気分離ライン11も上方に位置し、側面30cの吸排気口30dも吸気口として機能するものが多くなり、プリント板31,32間に熱がこもることはなくなり、やはり冷却効率は上昇する。また、特にオプションプリント板32の温度が低下するので、多種類のプリント板の実装が可能となる。さらに、天面30eに排気口を設けないので、天面30e側の冷却スペースが少なくて良く、小型化が可能となり、落下物の侵入による短絡も生じず、安全性が増す。 In the reference mode 2 , the heat generating device 34 is positioned above the housing 30, and the heat is conducted to the top surface 30e with good cooling efficiency to dissipate heat, thereby improving the cooling efficiency. Further, since the heat generating part is located above, the intake / exhaust separation line 11 is also located above, and the intake / exhaust port 30d on the side surface 30c also functions as an intake port, and heat is trapped between the printed boards 31 and 32. The cooling efficiency will increase. In particular, since the temperature of the option printed board 32 is lowered, various types of printed boards can be mounted. Further, since no exhaust port is provided in the top surface 30e, the cooling space on the top surface 30e side may be small, miniaturization is possible, no short circuit occurs due to intrusion of falling objects, and safety is increased.

参考形態
図4は参考形態による電子機器ユニットの冷却構造の縦断側面図を示し、筐体36はアルミニウム等の高熱伝導率材により形成する。筐体36は底面36aが設置面5に接触して設置され、両側面36bには吸排気口36cが設けられる。又、筐体36の天面36dの内面には支柱7が立設され、支柱7にはメインプリント板31及びオプションプリント板32が上下二段に水平にねじ33により取り付けられ、メインプリント板31の上面には発熱デバイス34が実装され、発熱デバイス34の上面と筐体36の天面36dの下面との間には熱伝導ゴム35が設けられる。11は吸排気口36cの吸排気分離ラインである。又、オプションプリント板32の中央にも排気口32aを設ける。筐体36の高さはhである。
Reference form 3
FIG. 4 shows a longitudinal side view of the cooling structure of the electronic device unit according to the reference embodiment 3 , and the casing 36 is made of a high thermal conductivity material such as aluminum. The housing 36 is installed such that the bottom surface 36a is in contact with the installation surface 5, and intake and exhaust ports 36c are provided on both side surfaces 36b. Further, a support column 7 is erected on the inner surface of the top surface 36d of the housing 36, and a main printed board 31 and an optional printed board 32 are attached to the support column 7 in two vertical levels by screws 33. A heat generating device 34 is mounted on the upper surface of the heat generating device 34, and a heat conductive rubber 35 is provided between the upper surface of the heat generating device 34 and the lower surface of the top surface 36 d of the housing 36. Reference numeral 11 denotes an intake / exhaust separation line of the intake / exhaust port 36c. An exhaust port 32 a is also provided at the center of the option printed board 32. The height of the housing 36 is h.

上記構成において、発熱デバイス34の熱は熱伝導ゴム35を介して筐体36の天面36dに熱伝導され、天面36dから熱放射、熱伝導により放熱される。天面36dは最も冷却効率が良い部分であるので、効率が良い放熱が行なわれる。また、天面36dから放熱仕切れない熱は側面36bに熱伝導され、側面36bから放熱される。さらに、設置面5が金属等の熱伝導が高い材質の場合、熱は筐体36の底面36aから設置面5に熱伝導され、冷却効果が大幅に向上する。一方、発熱部が上方に位置するため、発熱中心13も上方に位置し、吸排気分離ライン11も上方に位置する。このため、側面36bに設けられた吸排気口36cの多くは吸気口として働き、プリント板31,32間に外部の冷たい空気が流入する。又、間隔材を設けないので、側面36bの長さが長くなり、吸気面積が増大して吸気量が増大し、この吸気はオプションボード32の排気口32aを通ってプリント板31,32間に流入する。これらによってプリント板31,32、特にオプションプリント板32は効果的に冷却される。   In the above configuration, the heat of the heat generating device 34 is thermally conducted to the top surface 36d of the housing 36 through the heat conducting rubber 35, and is radiated from the top surface 36d by heat radiation and heat conduction. Since the top surface 36d is the portion with the highest cooling efficiency, efficient heat dissipation is performed. In addition, heat that is not radiated from the top surface 36d is thermally conducted to the side surface 36b and is radiated from the side surface 36b. Further, when the installation surface 5 is made of a material having high heat conductivity such as metal, heat is conducted from the bottom surface 36a of the housing 36 to the installation surface 5, and the cooling effect is greatly improved. On the other hand, since the heat generating part is located above, the heat generating center 13 is also located above, and the intake / exhaust separation line 11 is also located above. For this reason, most of the intake / exhaust ports 36 c provided on the side surface 36 b function as intake ports, and external cold air flows between the printed boards 31 and 32. Further, since the spacing member is not provided, the length of the side surface 36b is increased, the intake area is increased, and the intake amount is increased. The intake air passes through the exhaust port 32a of the option board 32 and is located between the printed boards 31 and 32. Inflow. As a result, the printed boards 31, 32, particularly the optional printed board 32, are effectively cooled.

参考形態においては、発熱デバイス34を筐体36内の上方に位置させ、その熱を冷却効率が良い天面36dに熱伝導して放熱しており、冷却効率が向上する。又、天面から放熱仕切れない熱は側面36b、さらには設置面5と接触した底面36aから放熱され、冷却効果が大幅に向上する。一方、吸排気分離ライン11が上方に位置するため、側面36bの吸排気口36cが吸気口として働き、プリント板31,32間に外部の冷たい空気が流入し、また間隔材を設けないので、側面36bの吸気面積が増大して吸気量が増大し、プリント板31,32、特にオプションプリント板32が効果的に冷却され、多種類のプリント板の実装が可能となる。又、天面36d側及び底面36a側に吸気口及び排気口が設けられないので、金属物による短絡が生じず、安全性が増大するとともに、天面36d側及び底面36a側の冷却スペース(間隔材を含めて)が少なくてよいので、小型化が可能となる。 In the reference mode 3 , the heat generating device 34 is positioned above the housing 36, and the heat is conducted to the top surface 36d having good cooling efficiency to dissipate heat, thereby improving the cooling efficiency. Further, the heat that cannot be radiated from the top surface is radiated from the side surface 36b and the bottom surface 36a that is in contact with the installation surface 5, and the cooling effect is greatly improved. On the other hand, since the intake / exhaust separation line 11 is located above, the intake / exhaust port 36c of the side surface 36b functions as an intake port, and external cold air flows between the printed boards 31 and 32, and no spacing material is provided. The intake area of the side surface 36b is increased to increase the intake air amount, and the printed boards 31, 32, particularly the optional printed board 32, are effectively cooled, and various types of printed boards can be mounted. In addition, since the intake port and the exhaust port are not provided on the top surface 36d side and the bottom surface 36a side, a short circuit due to a metal object does not occur, safety is increased, and cooling spaces (intervals) on the top surface 36d side and the bottom surface 36a side are increased. It is possible to reduce the size.

この発明の参考形態1による電子機器ユニットの冷却構造の基本ユニット部の縦断側面図及び拡張冷却ユニット部の側面図である。It is the vertical side view of the basic unit part of the cooling structure of the electronic device unit by the reference form 1 of this invention, and the side view of an extended cooling unit part. 実施最良形態による電子機器ユニットの冷却構造の拡張冷却ユニット部の縦断側面図及び基本ユニット部の縦断側面図である。It is the vertical side view of the extended cooling unit part of the cooling structure of the electronic device unit by Embodiment 1, and the vertical side view of a basic unit part. 参考形態による電子機器ユニットの冷却構造の縦断側面図である。It is a vertical side view of the cooling structure of the electronic device unit by the reference form 2 . 参考形態による電子機器ユニットの冷却構造の縦断側面図である。It is a vertical side view of the cooling structure of the electronic device unit by the reference form 3 . 従来の標準及び高環境温度対策の電子機器ユニットの冷却構造の縦断側面図である。It is a vertical side view of the cooling structure of the electronic device unit of the conventional standard and high environmental temperature countermeasure. 従来の開口率を大きくし手冷却する従来の電子機器ユニットの冷却構造の縦断側面図である。It is a vertical side view of the cooling structure of the conventional electronic device unit which increases the conventional aperture ratio and performs manual cooling. 従来の筐体への熱伝導により冷却する電子機器ユニットの冷却構造の縦断側面図である。It is a vertical side view of the cooling structure of the electronic device unit cooled by the heat conduction to the conventional housing | casing.

3…熱流
5…設置面
6…間隔材
11…吸排気分離ライン
12…熱流
13…発熱中心部分
17,26…基本ユニット部
18,27,30,36…筐体
18b,27b,29c,30b…吸気口
18d,27d,29e…排気口
18e,27e…放熱面
19…プリント板
21,34…発熱デバイス
21a…発熱部
22…ヒートスプレッダー
24、35…熱伝導ゴム
25,29…拡張冷却ユニット部
27f,29a…開口部
27g…カバー部
30a,36a…底面
30c,36b…側面
30d,36c…吸排気口
30e,36d…天面
31…メインプリント板、
32…オプションプリント板
DESCRIPTION OF SYMBOLS 3 ... Heat flow 5 ... Installation surface 6 ... Spacing material 11 ... Intake / exhaust separation line 12 ... Heat flow 13 ... Heat generation center part 17, 26 ... Basic unit part 18, 27, 30, 36 ... Case 18b, 27b, 29c, 30b ... Intake port 18d, 27d, 29e ... Exhaust port 18e, 27e ... Heat dissipation surface 19 ... Printed board 21, 34 ... Heat generating device 21a ... Heat generating part 22 ... Heat spreader 24, 35 ... Thermal conductive rubber 25, 29 ... Extended cooling unit part 27f , 29a ... opening 27g ... cover part 30a, 36a ... bottom face 30c, 36b ... side face 30d, 36c ... intake / exhaust port 30e, 36d ... top face 31 ... main printed board,
32 ... Option printed board

Claims (1)

体内に発熱デバイスを実装されたプリント板を収容し、前記筐体の一側に放熱面を有し、該放熱面と対向する側面に開口部を有し、底面に吸気口を有し、天面に排気口を有し、前記発熱デバイスと前記放熱面の間に熱伝導ゴムを介在させるとともに、前記開口部を着脱自在の平板状のカバー部で閉塞可能な基本ユニット部と、
空状に形成されていて、一側に前記基本ユニット部の開口部と連通する開口部を有するとともに、該開口部に対向する他側に放熱面を有し、底面に吸気口を有し、天面に排気口を有し、前記基本ユニット部の開口部に前記カバー部に代えて着脱自在に取り付けられる拡張冷却ユニット部と、を備えたことを特徴とする電子機器ユニットの冷却構造。
Houses a printed circuit board mounted a heating device in the housing, said having a heat radiating surface on one side of the housing has an opening on the side opposite to the heat radiating surface, has an inlet on the bottom, an exhaust port in the top surface, and wherein with the interposition of thermally conductive rubber between the heating device and the heat radiating surface, capable of closing the basic unit portion of the opening in the flat plate-shaped cover portion removable,
It is formed in a middle empty shape, and having an opening in communication with the opening of the basic unit portion on one side, having a heat radiating surface on the other side facing the opening, has an air inlet on the bottom An electronic device unit cooling structure comprising: an extended cooling unit portion having an exhaust port on the top surface and detachably attached to the opening of the basic unit portion in place of the cover portion.
JP2005082935A 2005-03-23 2005-03-23 Cooling structure of electronic equipment unit Active JP4635670B2 (en)

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CN107613719A (en) * 2017-08-21 2018-01-19 中国科学院长春光学精密机械与物理研究所 A kind of space camera focal plane air cooling mechanism

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JP2011039152A (en) * 2009-08-07 2011-02-24 Sanyo Electric Co Ltd Display device and cover member

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JPH11219235A (en) * 1998-02-04 1999-08-10 Hitachi Ltd Electronic device
JPH11238984A (en) * 1998-02-20 1999-08-31 Nec Niigata Ltd Portable information-processing device
JP2000252656A (en) * 1999-02-25 2000-09-14 Pfu Ltd Cooling structure for portable electronic apparatus
JP2000353887A (en) * 1999-06-10 2000-12-19 Pfu Ltd Cooling structure of portable electronic equipment
JP2002026554A (en) * 2000-06-30 2002-01-25 Toshiba Corp Electronic apparatus
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JPS61199094U (en) * 1985-05-31 1986-12-12
JPH11219235A (en) * 1998-02-04 1999-08-10 Hitachi Ltd Electronic device
JPH11238984A (en) * 1998-02-20 1999-08-31 Nec Niigata Ltd Portable information-processing device
JP2000252656A (en) * 1999-02-25 2000-09-14 Pfu Ltd Cooling structure for portable electronic apparatus
JP2000353887A (en) * 1999-06-10 2000-12-19 Pfu Ltd Cooling structure of portable electronic equipment
JP2002026554A (en) * 2000-06-30 2002-01-25 Toshiba Corp Electronic apparatus
JP2002341777A (en) * 2001-05-11 2002-11-29 Matsushita Electric Ind Co Ltd Plasma display device
JP2003124660A (en) * 2001-10-12 2003-04-25 Pfu Ltd Cooling device for electronic instrument
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Publication number Priority date Publication date Assignee Title
CN107613719A (en) * 2017-08-21 2018-01-19 中国科学院长春光学精密机械与物理研究所 A kind of space camera focal plane air cooling mechanism
CN107613719B (en) * 2017-08-21 2019-08-02 中国科学院长春光学精密机械与物理研究所 A kind of space camera focal plane air cooling mechanism

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