JP4632193B2 - Patterning substrate manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a patterning substrate capable of forming a pattern using a difference in wettability.

  In general, there are two methods for manufacturing a patterning substrate: a method of making a partition surface lyophobic after forming a lyophilic partition, and a method of making a pattern formation portion lyophilic after forming a lyophobic partition. It can be divided roughly. As the former method, as described in Patent Document 1, plasma irradiation is performed by introducing a gas containing fluorine atoms, and as the latter method, as described in Patent Document 2, repelling is performed. A method in which a protective film is provided on the liquid partition wall and lyophilic treatment such as UV irradiation or oxygen plasma treatment is performed, or as described in Patent Document 3, UV irradiation is performed on the entire surface, and the protrusions are made liquid repellent. There is a method of making the recess and lyophilic.

  However, in the method disclosed in Patent Document 1 described above, since the liquid repellency treatment with fluorine gas adheres to all organic substances, there is a problem that the range of selection of the material for forming the insulating layer is narrowed. In the invention described in 1), since a step of forming a protective film is added, there is a problem that productivity is poor. Moreover, in patent document 3, when making a recessed part lyophilic, a convex part also became lyophilic and there existed a possibility that the liquid repellency of a convex part might fall.

JP 2000-353594 A JP2002-22933 JP-A-9-230129

  The present invention has been made in view of the above problems, and when forming a fluid coating solution in a pattern on the substrate surface, the coating solution does not spread out of a predetermined region with high accuracy. It is a main object of the present invention to provide a patterning substrate manufacturing method and a patterning substrate capable of forming the patterning substrate.

  In order to achieve the above object, the present invention provides a patterning substrate manufacturing method comprising a substrate and a liquid repellent layer formed in a pattern on the substrate and having a higher contact angle with the liquid than the substrate. A liquid-repellent layer is formed by applying a liquid-repellent layer-forming coating liquid that forms a liquid-repellent layer having a contact angle with a liquid higher than that of the substrate on the substrate. The above-described removal is performed by the removal process for forming the contact layer, the removal process for removing the entire surface of the substrate having the liquid-repellent layer formed in the pattern, and the contact angle recovery process for increasing the contact angle with the liquid. A contact angle recovery treatment step in which the contact angle with the liquid of the liquid repellent layer is higher than that after the removal step by applying to the substrate having the liquid repellent layer formed in the pattern after the step. A method for manufacturing a patterning substrate, comprising: That.

  When the removal process is performed, residues such as foreign matters can be removed. Therefore, in the area where the removal process is performed, the contact angle with the liquid is changed in a decreasing direction, and the liquid is made lyophilic. Therefore, after the removing step, the region where the liquid repellent layer is not formed becomes more lyophilic, and the liquid repellency of the liquid repellent layer is lowered. However, by performing the contact angle recovery treatment step after the removal step, the liquid repellency once lowered by the removal treatment in the liquid repellent layer can be increased again to a desired level. Therefore, it is possible to easily manufacture a patterning substrate in which a pattern with a clear difference in wettability is accurately formed on the substrate according to the pattern of the liquid repellent layer formed in advance by a simple process.

  Furthermore, in the present invention, the contact angle recovery process is preferably a heat process. This is because the liquid repellency can be sufficiently recovered by a simple method without requiring any complicated work.

  In the present invention, it is preferable that the removal treatment in the removal step is a plasma irradiation treatment or a UV-ozone cleaning treatment. This is because the foreign matters existing on the substrate can be easily removed, and the treatment can be performed to make the liquid lyophilic.

  Furthermore, in the present invention, there is provided a patterning substrate manufacturing method comprising a substrate and a liquid repellent layer formed in a pattern on the substrate and having a higher contact angle with the liquid than the substrate, A liquid repellent layer forming step of forming a liquid repellent layer in a pattern by applying a liquid repellent layer forming coating liquid that forms a liquid repellent layer having a higher contact angle with the liquid than the substrate; There is provided a method for producing a patterning substrate, comprising: a plasma irradiation treatment step for subjecting a substrate having a liquid repellent layer formed in the above pattern to a plasma irradiation treatment on the entire surface thereof.

  When plasma irradiation treatment is performed, residues such as foreign matters can be removed. Therefore, after the plasma irradiation treatment step, the lyophilicity of the region where the liquid repellent layer is not formed can be improved. Therefore, the pattern can be formed with high accuracy by a simple process.

  According to the present invention, there is also provided a patterning substrate having a substrate and a liquid repellent layer formed in a pattern on the substrate and having a higher contact angle with the liquid than the substrate. Provided is a patterning substrate having a surface roughness of 2 nm or more.

  In the present invention, in the liquid repellent layer having higher liquid repellency than the substrate, the surface roughness on the surface thereof is in the above range, so that the liquid repellency can be improved not only on the material surface but also on the shape surface. Therefore, a clear difference in wettability can be obtained. Therefore, by using such a patterning substrate, a desired member can be accurately formed at a predetermined position without unevenness.

  When the removal process is performed, residues such as foreign matters can be removed. Therefore, in the area where the removal process is performed, the contact angle with the liquid is changed in a decreasing direction, and the liquid is made lyophilic. Therefore, after the removing step, the region where the liquid repellent layer is not formed becomes more lyophilic, and the liquid repellency of the liquid repellent layer is lowered. However, by performing the contact angle recovery treatment step after the removal step, the liquid repellency once lowered by the removal treatment in the liquid repellent layer can be increased again to a desired level. Therefore, it is possible to easily manufacture a patterning substrate in which a pattern with a clear difference in wettability is accurately formed on the substrate according to the pattern of the liquid repellent layer formed in advance by a simple process.

  The patterning substrate manufacturing method and patterning substrate of the present invention will be described below.

A. Patterning Substrate Manufacturing Method First, the patterning substrate manufacturing method of the present invention will be described. The method for producing a patterning substrate of the present invention can be divided into two modes depending on the difference in the process after the liquid repellent layer is formed in a pattern. Hereinafter, the patterning substrate manufacturing method of the present invention will be described separately for the first embodiment and the second embodiment.

1. First Embodiment A patterning substrate manufacturing method according to a first embodiment includes a substrate and a liquid repellent layer that is formed in a pattern on the substrate and has a higher liquid contact angle than the substrate. A method for manufacturing a substrate, comprising:
A liquid-repellent layer is formed on a substrate by applying a liquid-repellent layer-forming coating solution that forms a liquid-repellent layer having a higher contact angle with the liquid than the substrate. Process,
A removal step of performing a removal treatment on the entire surface of the substrate having the liquid repellent layer formed in the pattern,
The contact of the liquid repellent layer with the liquid is performed by performing a contact angle recovery process for increasing the contact angle with the liquid on the substrate having the liquid repellent layer formed in the pattern after the removing step. And a contact angle recovery treatment step of making the angle higher than that after the removing step.

  A method for manufacturing the patterning substrate of this embodiment will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing an example of a method for manufacturing a patterning substrate of this embodiment. First, as shown in FIG. 1A, a liquid-repellent liquid-repellent layer having a contact angle higher than the contact angle with the liquid of the electrode layer 2 on the substrate 1 on which the electrode layer 2 is formed. A forming coating solution is applied to form the liquid repellent film 3. The liquid repellent film 3 contains the liquid repellent substance α. Thereafter, as shown in FIG. 1B, the liquid-repellent film 3 is irradiated with ultraviolet rays 5 through a mask 4, and development, washing, etc. are performed, as shown in FIG. A liquid repellent layer 3 'formed in a pattern is obtained.

  Further, after forming the liquid repellent layer 3 ′ in a pattern, a removal process 6 is performed on the entire surface of the substrate 1 as shown in FIG. Thereby, for example, when the liquid repellent layer 3 ′ is patterned, the residue (liquid repellent substance α) of the liquid repellent film 3 remaining in the region a where the liquid repellent film 3 is removed is removed. be able to. Therefore, after the removal process 6, the lyophilicity of the region a from which the liquid repellent film 3 has been removed can be enhanced. However, in this embodiment, since the removal treatment 6 is performed also on the liquid repellent layer 3 ′, the liquid repellent layer 3 ′ is also made lyophilic, and the liquid repellency is lowered.

  Next, as shown in FIG. 1E, heat treatment 7 is performed. In the present embodiment, by performing the heat treatment, the liquid repellency of the liquid repellent layer 3 ′ once lowered by the removal treatment 6 can be increased again to a predetermined level (see FIG. 1 (f)). . That is, compared with the liquid repellent layer 3 ′ after the removal treatment 6, the liquid repellent layer 3 ′ after the heat treatment 7 can have a higher contact angle with the liquid. Accordingly, a patterning substrate having a sufficient difference in wettability can be easily manufactured by a simple method according to the pattern of the liquid repellent layer formed with high accuracy.

  Such a method for manufacturing a patterning substrate according to this embodiment will be described in detail below in each process.

(1) Liquid-repellent layer forming step First, the liquid-repellent layer forming step in this embodiment will be described. In the liquid repellent layer forming step in this embodiment, a liquid repellent layer forming coating liquid for forming a liquid repellent layer having a contact angle with the liquid higher than that of the substrate is applied on the substrate to form a pattern. This is a step of forming a liquid repellent layer.

  In this step, the liquid repellent layer is patterned. In this process, the method for patterning the liquid repellent layer is not particularly limited as long as it can form the liquid repellent layer in a desired shape with high accuracy. Specific examples include a photolithography method using a photosensitive resin, a gravure printing method, a flexographic printing method, an offset printing method, a screen printing method, a thermal transfer method, and a laser transfer method.

  In this step, as the liquid repellent layer forming coating liquid to be applied on the substrate, a liquid repellent layer having a contact angle with the liquid higher than the contact angle with the liquid of the substrate described later is formed. The coating liquid is not particularly limited as long as it can be applied. Specifically, a material in which a liquid repellent material is dissolved in an appropriate solvent can be used. For example, as a material having liquid repellency, there are a case where the resin material itself has liquid repellency and a case where an additive is added to the resin material to impart liquid repellency.

  First, when the resin material itself has liquid repellency, the material for forming the liquid repellent layer includes polytetrafluoroethylene, an acrylate or methacrylate containing a fluoroaliphatic group, and an acrylate or methacrylate containing no fluorine. Fluorine-containing polymer compounds such as polymers can be mentioned. Examples of the methacrylate monomer containing a fluoroaliphatic group include 2,2,2-trifluoroethyl methacrylate, 2,2,3,3,3-pentafluoromethacrylate, 2- (perfluorobutyl) ethyl methacrylate, 2- ( Perfluorooctyl) ethyl methacrylate, 2- (perfluorohexyl) ethyl methacrylate, 2- (perfluorodecyl) ethyl methacrylate, 2- (perfluoro-3-methylbutyl) ethyl methacrylate, 3- (perfluoro-3-methylbutyl) 2-hydroxypropyl methacrylate, 2- (perfluoro-5-methylhexyl) ethyl methacrylate, 3- (perfluoro-5-methylbutyl) -2-hydroxypropyl methacrylate, 2- (perfluoro-7-methyloctyl) ) Ethyl methacrylate, 3- (perfluoro-7-methyloctyl) -2-hydroxypropyl methacrylate, 2- (perfluoro-9-methyldecyl) ethyl methacrylate, 3- (perfluoro-8-methyldecyl) -2-hydroxy Propyl methacrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 1H, 1H, 5H-octafluoropentyl methacrylate, 1H, 1H, 7H-dodecafluoroheptyl methacrylate, 1H, 1H, 9H-hexadecafluorobetyl methacrylate 1H, 1H, 11H-icosafluorononyl methacrylate, 2,2,2-trifluoro-1-trifluorohethylethyl methacrylate, 2,2,3,4,4,4-hexafluorobutyl methacrylate, etc. It is possible. Furthermore, examples of the acrylate monomer containing a fluoroaliphatic group include 3- (perfluoro-3-methylbutyl) -2-hydroxypropyl acrylate, 2- (perfluoro-5-methylhexyl) ethyl acrylate, 2- (perfluoro- 9-methyloctyl) ethyl acrylate, 2- (perfluoro-9-methyldecyl) ethyl acrylate, 2,2,3,3,3-tetrafluoroacrylate, 1H, 1H, 5H-octafluorobenzyl acrylate, 1H, 1H , 7H-dodecafluoroheptyl acrylate, 1H, 1H, 9H-hexadecafluorononyl acrylate, 1H, 1H, 11H-icosafluorodecyl acrylate, 2,2,2-trifluoro-1-trifluoromethyl ethyl acrylate, 2 , 2,3,4 , It may be mentioned 4-hexafluorobutyl acrylate. As described above, by selecting one or two or more of the above-mentioned methacrylate monomers or acrylate monomers containing a fluoroaliphatic group and copolymerizing them with an acrylate monomer or methacrylate monomer not containing fluorine. A fluorine-containing polymer compound can be obtained. In addition, the case where one or more types are selected from the above-mentioned methacrylate monomer or acrylate monomer containing a fluoroaliphatic group, and a copolymer composed only of these may be used.

  It is also possible to form the liquid repellent layer using a copolymer obtained by copolymerizing the above-described fluorine-containing polymer compound and a general polymer material not containing fluorine.

  On the other hand, as a material for forming a liquid repellent layer in the case of imparting liquid repellency by adding an additive to a resin material, photosensitive polyimide resin, acrylic resin, other, photo-curing resin, thermosetting resin In addition, there may be mentioned those obtained by adding an additive having liquid repellency to a resin such as a fluorine compound-containing resin or a silicon-containing resin.

  For example, the additive having liquid repellency is not particularly limited as long as it does not adversely affect the member formed on the substrate when the patterning substrate is used in various applications. Specific examples include surfactants, fluorine-based resins, silicon-based resins, copolymer oligomers based on perfluoroalkyl group-containing acrylates or methacrylates, and silicon-containing compounds having fluorine compounds. .

  There are various types of surfactants, and examples thereof include those obtained by substituting hydrogen in the lipophilic group of general surfactants with fluorine to form perfluoroalkyl groups. Specifically, anions such as perfluoroalkyl carboxylate, perfluoroethylene oxide, perfluoroalkyl oligomer, ammonium salt of perfluoroalkyl sulfonic acid, potassium salt of perfluoroalkyl sulfonic acid, potassium salt of perfluoroalkyl carboxylic acid, etc. Examples thereof include cationic types such as perfluoroalkyl quaternary ammonium iodide, and nonionic types such as perfluoroalkyl polyoxyethylene ethanol and fluorinated alkyl esters.

  As the copolymer oligomer, it is preferable to use one having a perfluoroalkyl group-containing acrylate or methacrylate as a main component. Examples of commercially available products include Surflon (random type oligomer; manufactured by Seimi Chemical Co.), Aron G (graft type oligomer; manufactured by Toa Gosei Chemical Co., Ltd.), Modiper F (block type oligomer; manufactured by NOF Corporation), and the like. it can.

  Further, the silicon-containing compound having a fluorine compound is preferably a polysiloxane containing a fluoroalkyl group. Specific examples include one or more hydrolyzed condensates and cohydrolyzed condensates of fluoroalkylsilane. Moreover, you may use what is generally known as a fluorine-type silane coupling agent.

  In this embodiment, even when the resin material itself is formed of a material having liquid repellency, the additive for imparting liquid repellency described above may be further added if necessary.

  In the liquid repellent layer formed using such a liquid repellent layer-forming coating liquid, the degree of liquid repellency is particularly as long as the contact angle with the liquid is higher than the substrate described later. There is no limitation. Specifically, the contact angle with respect to the liquid repellent layer of pure water is preferably in the range of 30 ° to 150 °, and more preferably in the range of 50 ° to 120 °.

  Here, the contact angle is measured by using pure water and measuring the contact angle with a contact angle measuring device (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) (dropping a droplet from a microsyringe). Seconds later) and based on the result.

(substrate)
Next, the substrate will be described. In the present embodiment, the substrate is a substrate on which the above-described liquid repellent layer is formed, and functions as a support that holds the patterning substrate in a certain shape. In addition to the member functioning as a support, such a substrate includes a case where another member is formed according to the use of the patterning substrate of this embodiment. For example, it may be a substrate on which an electrode layer or a gas barrier layer that blocks gas such as moisture and oxygen is formed. In such a case, the liquid repellent layer described above has a higher contact angle with the liquid than other members formed on the substrate surface. Specifically, as shown in FIG. 1, when the electrode layer 2 is formed on the substrate 1, the liquid repellent layer 3 has a higher contact angle with the liquid than the electrode layer 2. Shall.

  In such a substrate, the member functioning as a support is not particularly limited as long as it is generally used as a member having such a function. For example, it may be made of a transparent material or an opaque material, and examples thereof include an inorganic material such as glass and an organic material such as a resin. The resin that can be specifically used is not particularly limited as long as it can be formed into a film. Among these, a polymer material having a relatively high solvent resistance and heat resistance is preferable. For example, fluorine resin, polyethylene, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, ABS resin, polyamide, polyacetal, polyester, polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyethersulfone, polyamide Imide, polyimide, polyphenylene sulfide, liquid crystalline polyester, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polymicroxylene dimethylene terephthalate, polyoxymethylene, polyethersulfone, polyetheretherketone, polyacrylate, acrylonitrile-styrene resin , Phenolic resin, urea resin, melamine resin, unsaturated polyester resin, epoxy Examples of the resin include polyurethane resin, polyurethane, silicone resin, and amorphous polyolefin. In this embodiment, any polymer material that satisfies other conditions can be used, and these two or more types of copolymers may be used.

(2) Removal Step Next, the removal step in this embodiment will be described. The removing step in the present embodiment is a step of removing the entire surface of the substrate having the liquid repellent layer formed in the pattern.

  In this step, when a removal treatment is performed, residues such as foreign matters remaining in the portion where the liquid repellent layer has been removed during the liquid repellent layer forming step can be removed. Along with this, the wettability of the portion subjected to the removal process can be improved. Moreover, depending on the method of removal treatment, wettability may be improved by modifying the surface.

  Here, the improvement of wettability means that the wettability changes in the direction in which the contact angle with the liquid decreases.

  In the present embodiment, since such removal treatment is performed on the entire surface of the substrate, the liquid repellent remaining in such a portion is removed with respect to the portion from which the liquid repellent layer has been removed in the liquid repellent layer forming step. Residues such as the repellent layer can be removed, so that the lyophilic property can be further improved. At the same time, the lyophobic property of the liquid repellent layer is lowered. However, by performing the liquid repellency recovery processing step described later, a finally obtained patterning substrate can be manufactured with a pattern having a sufficient difference in wettability.

  The removal process in this step is not particularly limited as long as it is a method that can remove foreign matters remaining in unnecessary portions, and examples thereof include a dry etching process. Specifically, examples of the dry etching process include a plasma irradiation process and a UV-ozone cleaning process.

  The plasma irradiation treatment is not particularly limited as long as residues such as foreign matters can be removed and lyophilicity can be achieved.

  Moreover, as a reactive gas used when performing plasma irradiation processing, it is possible to use the reactive gas generally used. Especially, it is preferable that it is a reactive gas which can remove a foreign material efficiently. Examples of the composition of such a reactive gas include a combination of a gas containing fluorine or a fluorine compound, a gas containing chlorine or a chlorine compound, oxygen, or argon.

  Next, the UV-ozone cleaning is not particularly limited as long as foreign substances and the like can be similarly removed and lyophilicity can be achieved.

  Specifically, as ozone used in the present embodiment, oxygen or air containing ozone is suitable.

  Further, in this step, for example, the surface roughness of the surface of the liquid repellent layer after the dry etching treatment as the removal treatment is preferably 2 nm or more. Among these, it is preferably 5 nm or more, more preferably 10 nm or more, and most preferably 20 nm or more.

  In this embodiment, for example, by performing the treatment by adjusting the degree of surface roughness of the surface of the liquid repellent layer after the dry etching treatment as the removal treatment to be within the above range, This is because sufficient liquid repellency can be achieved not only on the surface but also on the shape surface in the liquid repellent layer after the contact angle recovery treatment step described later.

  In addition, the said surface roughness is prescribed | regulated based on the result measured using AFM (atomic force scanning microscope).

  In this step, the removal treatment is performed on the entire surface of the substrate having the liquid repellent layer formed in the liquid repellent layer forming step. Therefore, the liquid repellent layer is also subjected to the removal treatment, and the degree of the liquid repellency is reduced as described above. In this embodiment, the contact angle recovery treatment described later is performed. Since the liquid repellency once lowered can be increased again to a desired level, the patterning substrate finally obtained can be formed with a pattern having a sufficient difference in wettability. .

(3) Contact Angle Recovery Processing Step Next, the contact angle recovery processing step will be described. The contact angle recovery process in this embodiment is performed by applying a contact angle recovery process for increasing the contact angle with the liquid to the substrate having the liquid repellent layer formed in a pattern after the removal process. In this step, the contact angle of the liquid layer with the liquid is made higher than that after the removal step.

  In this embodiment, by performing such a main step, the lyophobic property can be restored to a desired level again even when the lyophilic property is reduced by the removing step and the lyophobic property is once lowered. Therefore, it is possible to easily and accurately form a pattern due to the difference in wettability according to the liquid repellent pattern formed by the liquid repellent layer forming step.

  As the contact angle recovery treatment, the contact angle with the liquid of the liquid repellent layer after the contact angle recovery treatment is compared with the contact angle with the liquid of the liquid repellent layer after the removal treatment. However, there is no particular limitation as long as the processing method is high. Specific examples include heat treatment and light irradiation. Among these, heat treatment is preferable. This is because it is a simple method without requiring a particularly troublesome work and the contact angle with the liquid can be sufficiently increased.

  Specifically, the heat treatment is not particularly limited as long as the temperature of the entire substrate having liquid repellency can be easily raised and heated without unevenness. For example, a commonly used heating device or the like can be used. Specifically, an oven, a far infrared heater, a hot plate, light irradiation, and the like can be given. Among these, a heating method using a hot plate is preferable. This is because the hot plate conducts heat directly from the lower side of the substrate and heats it, so that it is excellent in thermal efficiency and has little heating unevenness.

  In addition, the temperature in the heat treatment is not particularly limited as long as it does not cause thermal degradation of the base material or the like.

  In this step, by performing the contact angle recovery treatment, the liquid repellency of the liquid repellent layer once lowered can be increased to a desired level again. The contact angle with respect to the liquid repellent layer is preferably in the range of 30 ° to 150 °, and more preferably in the range of 50 ° to 120 °. This is because if the liquid repellency is in the above range, it is possible to easily prevent the coating liquid from proceeding at the boundary of the liquid repellent layer.

  In addition, the said contact angle was prescribed | regulated based on the result measured by the method similar to the method mentioned above.

(4) Others As an application of the patterning substrate manufactured by the method for manufacturing a patterning substrate as described above, a desired member is formed using a pattern due to a difference in wettability formed on the surface of the patterning substrate. There is no particular limitation as long as it can be formed. Specifically, it can be used when forming an EL element, a color filter, a color conversion filter, or the like. By using the patterning substrate manufactured by the patterning substrate manufacturing method of this embodiment for these applications, a desired member such as an EL element can be accurately formed using the difference in wettability. For example, an organic EL layer such as a light emitting layer can be formed. Hereinafter, a method for manufacturing an EL element will be specifically described.

(Manufacturing method of EL element)
In the method for producing an EL element in the present invention, a liquid repellent layer forming coating solution for forming a liquid repellent layer having a contact angle with a liquid higher than that of the electrode layer is applied on a substrate having at least an electrode layer. A liquid repellent layer forming step for forming a liquid repellent layer in a pattern, a removal step for removing the entire surface of the substrate having the liquid repellent layer formed in the pattern, and a liquid. The contact angle recovery treatment for increasing the contact angle is performed on the substrate having the liquid-repellent layer formed in the pattern after the removing step, so that the contact angle with the liquid of the liquid-repellent layer is An organic EL layer is formed in a pattern by discharging and applying a coating liquid for forming an organic EL layer on the electrode layer by a nozzle discharge method on the electrode layer, which is higher than after the removing step. And the step of performing.

  An example of a method for manufacturing an EL element in the present invention is shown in FIG. 1 described above. In the EL element manufacturing method, as in the patterning substrate manufacturing method described above, as shown in FIG. 1A, a liquid repellent layer is formed on the substrate 1 on which the electrode layer 2 is formed. After applying the coating liquid for forming the property layer and forming the liquid repellent film 3, as shown in FIG. 1B, the mask 4 is used to irradiate the pattern 5 with ultraviolet rays 5 to perform development, washing, etc. By doing so, the liquid repellent layer 3 ′ is formed in a pattern (see FIG. 1C). After forming the liquid repellent layer 3 ′ in a pattern, a removal process 6 is performed on the entire surface of the substrate 1 as shown in FIG. Next, as shown in FIG. 1E, heat treatment 7 is performed. In the present invention, by performing the heat treatment 7, the liquid repellency of the liquid repellent layer 3 ′ once lowered by the removal treatment 6 can be increased again to a predetermined level (see FIG. 1 (f)). . As a result, a patterning substrate on which a pattern due to a difference in wettability between the electrode layer 2 and the liquid repellent layer 3 ′ is formed with high accuracy is obtained. In the EL element manufacturing method, the liquid-repellent film 3 is then removed, and a light-emitting layer forming coating liquid for forming a light-emitting layer is applied to the region a on the lyophilic electrode layer 2 by inkjet. It applies by discharging with an apparatus. By solidifying the light emitting layer forming coating solution, a light emitting layer is formed at a predetermined position, and further, an opposing electrode layer or the like is formed, whereby an EL element can be manufactured.

  In the present invention, since the EL element is manufactured using the patterning substrate manufactured by the above-described patterning substrate manufacturing method, when forming an organic EL layer such as a light emitting layer, a region other than a predetermined region is used. Thus, the coating liquid is prevented from spreading and the light emitting layer and the like can be formed with high accuracy and uniformity.

2. Second Embodiment Next, a method for manufacturing a patterning substrate according to a second embodiment will be described.

The method for producing a patterning substrate according to this embodiment is a method for producing a patterning substrate having a substrate and a liquid repellent layer formed in a pattern on the substrate and having a higher contact angle with the liquid than the substrate. There,
A liquid-repellent layer is formed on a substrate by applying a liquid-repellent layer-forming coating solution that forms a liquid-repellent layer having a higher contact angle with the liquid than the substrate. Process,
And a plasma irradiation treatment step of performing plasma irradiation treatment on the entire surface of the substrate having the liquid repellent layer formed in the pattern shape.

  In this embodiment, after performing the liquid-repellent layer forming step, it is possible to remove residues such as foreign matters present in unnecessary locations by performing plasma irradiation treatment. The lyophilic property of the region where the liquid repellent layer is not formed can be improved. Therefore, the pattern can be formed with high accuracy by a simple process.

  The method for producing the patterning substrate of this embodiment having such advantages will be described separately for each step of the liquid repellent layer forming step and the plasma irradiation treatment step. Of these, the liquid repellent layer forming step is the same as that in the first embodiment described above, and a description thereof will be omitted.

(Plasma irradiation treatment process)
In the present embodiment, the plasma irradiation treatment step is a step of performing plasma irradiation treatment on the entire surface of the substrate having the liquid repellent layer formed in a pattern.

  By performing the plasma irradiation treatment, it is possible to remove residues such as foreign matters present in unnecessary portions. That is, since the residue of the liquid repellent layer remaining in the region where the liquid repellent layer has been removed in the liquid repellent layer forming step can be removed, it is possible to make the region lyophilic.

  Since the plasma irradiation process in this step is the same as that described in the first embodiment, description thereof is omitted here.

B. Next, the patterning substrate of the present invention will be described. The patterning substrate of the present invention is a patterning substrate comprising a substrate and a liquid repellent layer formed in a pattern on the substrate and having a higher contact angle with the liquid than the substrate, and the liquid repellent property The surface roughness of the layer is 2 nm or more.

  In the present invention, in the liquid repellent layer having higher liquid repellency than the substrate, the surface roughness on the surface thereof is in the above range, so that the liquid repellency can be improved not only on the material surface but also on the shape surface. Therefore, a clear difference in wettability can be obtained. Therefore, by using such a patterning substrate, a desired member can be accurately formed at a predetermined position without unevenness.

  In such a patterning substrate of the present invention, the surface roughness is 2 nm or more, preferably 5 nm or more, more preferably 10 nm or more, and most preferably 20 nm or more. This is because higher liquid repellency can be obtained if the liquid repellent layer has a surface roughness within the above range. In addition, the said surface roughness was prescribed | regulated based on the result measured by the method similar to the method mentioned above.

  Since the material of the substrate and the liquid repellent layer used in the patterning substrate of the present invention and the manufacturing method thereof are the same as those described in the above-mentioned items of “A. Manufacturing method of patterning substrate”, here The description in is omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has the same configuration as the technical idea described in the claims of the present invention. It is included in the technical scope of the invention.

Example 1
(Production of patterning substrate)
As a material having liquid repellency, a positive photosensitive resin TFR-H (manufactured by Tokyo Ohka Co., Ltd.) mixed with 20% by weight of Modiper F110 (manufactured by NOF Corporation) is formed on the entire surface of the substrate by spin coating, and a photomask is used. The film was exposed to light and developed with an alkali developer (NMD-3 manufactured by Tokyo Ohka Kogyo Co., Ltd.). As a result, a liquid repellent layer formed in a pattern was obtained.

  Next, the entire surface of the substrate having a liquid repellent layer is subjected to oxygen plasma treatment with a dry etching treatment time of 30 seconds, and further subjected to heat treatment at a heating temperature of 150 ° C. with a hot plate to form a patterning substrate. Produced.

(Example 2)
A patterning substrate was produced in the same manner as in Example 1 except that the dry etching treatment time was 30 minutes.

(Comparative example)
A patterning substrate was produced in the same manner as in Example 1 except that the oxygen plasma treatment and the heat treatment were not performed.

(Evaluation)
In the patterning substrates in Example 1, Example 2 and Comparative Example, the results of measuring the contact angle in the liquid repellent layer and the surface roughness of the liquid repellent layer when pure water is used as the measurement solvent are shown. Shown in Table 1 below.

  When ink was applied to the substrate in the region where the liquid repellent layer of the patterning substrate was not formed by the ink jet method, in Example 1 and Example 2, it spread well on the substrate, but in the comparative example The wet spread was bad.

(Example 3)
After performing the oxygen plasma treatment, a patterning substrate was produced in the same manner as in Example 1 except that the heat treatment was not performed using a hot plate.

Example 4
A patterning substrate was produced in the same manner as in Example 3 except that the dry etching treatment time was 30 minutes.

(Evaluation)
In the patterning substrates in Examples 3 and 4 above, the results of measuring the contact angle in the liquid repellent layer and the surface roughness of the liquid repellent layer when pure water is used as the measurement solvent are shown in Table 2 below. Shown in

  When ink was applied to the substrate in the region where the liquid repellent layer of the patterning substrate in Examples 3 and 4 was not formed by the inkjet method, the ink spread well on the substrate. The ink patterning by the liquid repellent layer was also good.

It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for patterning of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Electrode layer 3 ... Liquid repellent film 3 '... Liquid repellent layer 4 ... Mask 5 ... Ultraviolet ray 6 ... Removal process 7 ... Heat treatment a ... Area which removed the liquid repellent film

Claims (3)

A patterning substrate manufacturing method comprising a substrate and a liquid repellent layer formed in a pattern on the substrate and having a higher contact angle with pure water than the substrate,
A liquid repellent layer that forms a liquid repellent layer in a pattern by applying a liquid repellent layer forming coating liquid that forms a liquid repellent layer having a contact angle with pure water higher than that of the substrate on the substrate. Forming process;
In order to remove the liquid-repellent substance remaining outside the region where the liquid-repellent layer formed in the liquid-repellent layer forming step is removed, the substrate having the liquid-repellent layer formed in the pattern is used. On the other hand, a removal step of performing a removal process on the entire surface,
A contact angle recovery process for increasing the contact angle with the liquid is performed on the substrate having the liquid repellent layer formed in the pattern after the removal step, thereby bringing the liquid repellent layer into contact with pure water. The corner,
Possess a contact angle recovery process to be higher than after the removing step,
The method of manufacturing a patterning substrate, wherein the contact angle recovery process is a heat process . The method for manufacturing a patterning substrate according to claim 1 , wherein the removing process in the removing step is a plasma irradiation process. The method for manufacturing a patterning substrate according to claim 1 , wherein the removing process in the removing step is a UV-ozone cleaning process.

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