JP4619710B2 - Silicone pressure sensitive adhesive and adhesive tape - Google Patents
Silicone pressure sensitive adhesive and adhesive tape Download PDFInfo
- Publication number
- JP4619710B2 JP4619710B2 JP2004197477A JP2004197477A JP4619710B2 JP 4619710 B2 JP4619710 B2 JP 4619710B2 JP 2004197477 A JP2004197477 A JP 2004197477A JP 2004197477 A JP2004197477 A JP 2004197477A JP 4619710 B2 JP4619710 B2 JP 4619710B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- sensitive adhesive
- silicone
- component
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims description 72
- 229920001296 polysiloxane Polymers 0.000 title claims description 62
- 239000002390 adhesive tape Substances 0.000 title description 20
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000003963 antioxidant agent Substances 0.000 claims description 23
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 20
- 230000003078 antioxidant effect Effects 0.000 claims description 17
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 16
- 125000003342 alkenyl group Chemical group 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 125000005375 organosiloxane group Chemical group 0.000 claims description 9
- 125000002947 alkylene group Chemical group 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 8
- 238000006482 condensation reaction Methods 0.000 claims description 8
- 239000002530 phenolic antioxidant Substances 0.000 claims description 8
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 6
- 150000004982 aromatic amines Chemical class 0.000 claims description 5
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 125000006363 carbonyl oxy alkylene group Chemical group 0.000 claims 1
- -1 3-chloropropyl groups Chemical group 0.000 description 51
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 125000003944 tolyl group Chemical group 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 4
- 125000005023 xylyl group Chemical group 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- HNURKXXMYARGAY-UHFFFAOYSA-N 2,6-Di-tert-butyl-4-hydroxymethylphenol Chemical compound CC(C)(C)C1=CC(CO)=CC(C(C)(C)C)=C1O HNURKXXMYARGAY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229910015395 B-O-Si Inorganic materials 0.000 description 2
- 229910015403 B—O—Si Inorganic materials 0.000 description 2
- 0 C[N+](N*1=C)(N*1=C)[O-] Chemical compound C[N+](N*1=C)(N*1=C)[O-] 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 2
- OUBMGJOQLXMSNT-UHFFFAOYSA-N N-isopropyl-N'-phenyl-p-phenylenediamine Chemical compound C1=CC(NC(C)C)=CC=C1NC1=CC=CC=C1 OUBMGJOQLXMSNT-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 125000005816 fluoropropyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])* 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- 125000006353 oxyethylene group Chemical group 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- HMVBQEAJQVQOTI-SOFGYWHQSA-N (e)-3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)\C=C(/C)C#C HMVBQEAJQVQOTI-SOFGYWHQSA-N 0.000 description 1
- IRFSXVIRXMYULF-UHFFFAOYSA-N 1,2-dihydroquinoline Chemical compound C1=CC=C2C=CCNC2=C1 IRFSXVIRXMYULF-UHFFFAOYSA-N 0.000 description 1
- ZJNLYGOUHDJHMG-UHFFFAOYSA-N 1-n,4-n-bis(5-methylhexan-2-yl)benzene-1,4-diamine Chemical compound CC(C)CCC(C)NC1=CC=C(NC(C)CCC(C)C)C=C1 ZJNLYGOUHDJHMG-UHFFFAOYSA-N 0.000 description 1
- APTGHASZJUAUCP-UHFFFAOYSA-N 1-n,4-n-di(octan-2-yl)benzene-1,4-diamine Chemical compound CCCCCCC(C)NC1=CC=C(NC(C)CCCCCC)C=C1 APTGHASZJUAUCP-UHFFFAOYSA-N 0.000 description 1
- VETPHHXZEJAYOB-UHFFFAOYSA-N 1-n,4-n-dinaphthalen-2-ylbenzene-1,4-diamine Chemical compound C1=CC=CC2=CC(NC=3C=CC(NC=4C=C5C=CC=CC5=CC=4)=CC=3)=CC=C21 VETPHHXZEJAYOB-UHFFFAOYSA-N 0.000 description 1
- ZRMMVODKVLXCBB-UHFFFAOYSA-N 1-n-cyclohexyl-4-n-phenylbenzene-1,4-diamine Chemical compound C1CCCCC1NC(C=C1)=CC=C1NC1=CC=CC=C1 ZRMMVODKVLXCBB-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- FXNDIJDIPNCZQJ-UHFFFAOYSA-N 2,4,4-trimethylpent-1-ene Chemical group CC(=C)CC(C)(C)C FXNDIJDIPNCZQJ-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- BYLSIPUARIZAHZ-UHFFFAOYSA-N 2,4,6-tris(1-phenylethyl)phenol Chemical compound C=1C(C(C)C=2C=CC=CC=2)=C(O)C(C(C)C=2C=CC=CC=2)=CC=1C(C)C1=CC=CC=C1 BYLSIPUARIZAHZ-UHFFFAOYSA-N 0.000 description 1
- PFEFOYRSMXVNEL-UHFFFAOYSA-N 2,4,6-tritert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 PFEFOYRSMXVNEL-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- SJSWOOZQQKFYQJ-UHFFFAOYSA-N 2,6-ditert-butyl-4-(3-trimethoxysilylpropoxy)phenol Chemical compound CO[Si](OC)(OC)CCCOC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SJSWOOZQQKFYQJ-UHFFFAOYSA-N 0.000 description 1
- LHJCGKWZIYVDRY-UHFFFAOYSA-N 2,6-ditert-butyl-4-(3-trimethoxysilylpropyl)phenol Chemical compound CO[Si](OC)(OC)CCCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 LHJCGKWZIYVDRY-UHFFFAOYSA-N 0.000 description 1
- WUEUNFUSRIONIR-UHFFFAOYSA-N 2,6-ditert-butyl-4-trimethoxysilylphenol Chemical compound CO[Si](OC)(OC)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 WUEUNFUSRIONIR-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- QUVMSYUGOKEMPX-UHFFFAOYSA-N 2-methylpropan-1-olate;titanium(4+) Chemical compound [Ti+4].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-] QUVMSYUGOKEMPX-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- HFYAEUXHCMTPOL-UHFFFAOYSA-N 3-Methyl-1-penten-3-ol Chemical compound CCC(C)(O)C=C HFYAEUXHCMTPOL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- MDWVSAYEQPLWMX-UHFFFAOYSA-N 4,4'-Methylenebis(2,6-di-tert-butylphenol) Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 MDWVSAYEQPLWMX-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- ZZMVLMVFYMGSMY-UHFFFAOYSA-N 4-n-(4-methylpentan-2-yl)-1-n-phenylbenzene-1,4-diamine Chemical compound C1=CC(NC(C)CC(C)C)=CC=C1NC1=CC=CC=C1 ZZMVLMVFYMGSMY-UHFFFAOYSA-N 0.000 description 1
- ZXPYQXDDKNDCMN-UHFFFAOYSA-N 4-n-octyl-4-n-phenylbenzene-1,4-diamine Chemical compound C=1C=C(N)C=CC=1N(CCCCCCCC)C1=CC=CC=C1 ZXPYQXDDKNDCMN-UHFFFAOYSA-N 0.000 description 1
- QFIGXPMFVPAVTK-UHFFFAOYSA-N 6-methylhept-2-yn-4-ol Chemical compound CC#CC(O)CC(C)C QFIGXPMFVPAVTK-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- BJMGFWRNINJMGH-UHFFFAOYSA-L CC([O-])=O.CC([O-])=O.CCCCCCCC[Sn+2] Chemical compound CC([O-])=O.CC([O-])=O.CCCCCCCC[Sn+2] BJMGFWRNINJMGH-UHFFFAOYSA-L 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- JRWGTCJYVMMXET-UHFFFAOYSA-N OC1=C(C=C(C=C1C(C)(C)C)C[SiH](OC)OC)C(C)(C)C Chemical compound OC1=C(C=C(C=C1C(C)(C)C)C[SiH](OC)OC)C(C)(C)C JRWGTCJYVMMXET-UHFFFAOYSA-N 0.000 description 1
- QAPVYZRWKDXNDK-UHFFFAOYSA-N P,P-Dioctyldiphenylamine Chemical compound C1=CC(CCCCCCCC)=CC=C1NC1=CC=C(CCCCCCCC)C=C1 QAPVYZRWKDXNDK-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- JYSSGQITKNFRQE-UHFFFAOYSA-N [3-(4-anilinoanilino)-2-hydroxypropyl] 2-methylprop-2-enoate Chemical compound C1=CC(NCC(O)COC(=O)C(=C)C)=CC=C1NC1=CC=CC=C1 JYSSGQITKNFRQE-UHFFFAOYSA-N 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Description
本発明は、シリコーン系感圧接着剤および粘着テープに関し、詳しくは、高温に曝された後の再はく離性が良好である感圧接着層を形成するシリコーン系感圧接着剤、および高温に曝された後の再はく離性が良好である粘着テープに関する。 The present invention relates to a silicone-based pressure-sensitive adhesive and a pressure-sensitive adhesive tape, and more specifically, a silicone-based pressure-sensitive adhesive that forms a pressure-sensitive adhesive layer having good releasability after being exposed to high temperature, and exposure to high temperature. The present invention relates to a pressure-sensitive adhesive tape having good removability after being applied.
シリコーン系感圧接着剤は、電気絶縁性、耐熱性、粘着性等が優れることから、信頼性が要求される用途で広く使用されている。特に、シリコーン系感圧接着剤の耐熱性を向上させるため、例えば、セリウム含有化合物を含有するもの（特許文献１参照）、Ｂ−Ｏ−Ｓｉ結合を有する有機ケイ素化合物を含有するもの（特許文献２参照）、およびフェノール系酸化防止剤を含有するもの（特許文献３参照）が提案されている。 Silicone-based pressure-sensitive adhesives are widely used in applications that require reliability because they are excellent in electrical insulation, heat resistance, adhesiveness, and the like. In particular, in order to improve the heat resistance of the silicone-based pressure-sensitive adhesive, for example, one containing a cerium-containing compound (see Patent Document 1), one containing an organosilicon compound having a B—O—Si bond (Patent Document) 2) and those containing phenolic antioxidants (see Patent Document 3) have been proposed.
しかし、セリウム含有化合物やＢ−Ｏ−Ｓｉ結合を有する有機ケイ素化合物を含有するシリコーン系感圧接着剤は、被着体に粘着した状態で高温に曝された後、被着体に貼り付けた粘着テープをはがすと、感圧接着層の一部が被着体上に残るという問題があった。これに対して、フェノール系酸化防止剤を含有するシリコーン系感圧接着剤は、このような問題が少ないものの、被着体に粘着した状態で長時間高温に曝されると、感圧接着層の一部が被着体上に残る場合があるという問題があった。このため、このようなシリコーン系感圧接着剤は、特に、電気回路基板のはんだリフロー工程において、熱処理用マスキングテープとして使用した場合に、熱処理後に該テープをはがす際に前記基板上に感圧接着層が残ると、後の工程で支障が生じるという問題があった。
本発明は、高温に曝された後の再はく離性が良好である感圧接着層を形成するシリコーン系感圧接着剤、および高温に曝された後の再はく離性が良好である粘着テープを提供することを目的とする。 The present invention relates to a silicone-based pressure-sensitive adhesive that forms a pressure-sensitive adhesive layer that has good re-peelability after exposure to high temperatures, and an adhesive tape that has good re-peelability after exposure to high temperatures. The purpose is to provide.
本発明のシリコーン系感圧接着剤は、
（Ａ）（ａ）一分子中に平均１個以上のアルケニル基を有する生ゴム状のオルガノポリシロキサンと（ｂ）Ｒ1 3ＳiＯ1/2単位（式中、Ｒ1は置換もしくは非置換の一価炭化水素基である。）とＳiＯ4/2単位から本質的に成り、ＳiＯ4/2単位に対するＲ1 3ＳiＯ1/2単位のモル比が０.５〜１.５であるオルガノポリシロキサンレジンとの混合物、またはこれらの部分縮合反応物、
（Ｂ）一分子中に平均２個以上のケイ素原子結合水素原子を有するオルガノポリシロキサン｛（Ａ）成分中のアルケニル基１モルに対して、本成分中のケイ素原子結合水素原子が０.５〜１５０.０モルとなる量｝、
（Ｃ）フェノール系酸化防止剤および／またはフェノール変性オルガノシロキサン｛（Ａ）成分と（Ｂ）成分の合計１００重量部に対して０.００１〜１０重量部｝、
（Ｄ）芳香族アミン系酸化防止剤および／または平均式：Ｒ 6 b ＳiＯ (4-b)/2
｛式中、Ｒ 6 は置換もしくは非置換の一価炭化水素基、一般式：
（式中、Ｙは単結合、オキシ基、アルキレン基、またはオキシアルキレン基であり、ｃは１または２である。）で示される芳香族アミノ含有基、または一般式：
（式中、Ｙは前記と同じである。）で示される芳香族アミノ含有基であり、但し、一分子中の少なくとも１個のＲ 6 は前記いずれかの芳香族アミノ含有基であり、ｂは１.５〜３.０の範囲内の数である。｝で示される芳香族アミノ変性オルガノシロキサン｛（Ａ）成分と（Ｂ）成分の合計１００重量部に対して０.００１〜１０重量部｝、および
（Ｅ）白金系触媒（本接着剤を硬化させるに十分な量）
から少なくともなることを特徴とする。
また、本発明の粘着テープは、支持フィルムと、その上に形成された、請求項１記載のシリコーン系感圧接着剤の硬化によるシリコーン系感圧接着層とを有することを特徴とする。
The silicone pressure sensitive adhesive of the present invention is
(A) (a) a raw rubber-like organopolysiloxane having an average of one or more alkenyl groups in one molecule and (b) R 1 3 SiO 1/2 unit (wherein R 1 is a substituted or unsubstituted one) Organopolysiloxane consisting essentially of SiO 4/2 units and having a molar ratio of R 1 3 SiO 1/2 units to SiO 4/2 units of 0.5 to 1.5. A mixture with a resin, or a partial condensation reaction product thereof,
(B) Organopolysiloxane having an average of 2 or more silicon-bonded hydrogen atoms in one molecule {the amount of silicon-bonded hydrogen atoms in this component is 0.5 with respect to 1 mol of the alkenyl group in component (A). To an amount of ˜150.0 mol},
(C) a phenolic antioxidant and / or a phenol-modified organosiloxane {0.001 to 10 parts by weight with respect to 100 parts by weight of the total of the components (A) and (B)},
(D) Aromatic amine antioxidant and / or average formula: R 6 b SiO (4-b) / 2
{Wherein R 6 is a substituted or unsubstituted monovalent hydrocarbon group, general formula:
(Wherein Y is a single bond, an oxy group, an alkylene group, or an oxyalkylene group, and c is 1 or 2), or a general formula:
(Wherein Y is the same as defined above), provided that at least one R 6 in one molecule is any of the above aromatic amino-containing groups, b Is a number in the range of 1.5 to 3.0. } {0.001 to 10 parts by weight with respect to 100 parts by weight of the total of the components (A) and (B)}, and (E) a platinum-based catalyst (curing the adhesive) Enough)
It consists of at least.
The pressure-sensitive adhesive tape of the present invention is characterized by having a support film and a silicone-based pressure-sensitive adhesive layer formed thereon by curing the silicone-based pressure-sensitive adhesive according to claim 1.
本発明のシリコーン系感圧接着剤は、高温に曝された後の再はく離性が良好である感圧接着層を形成することができるという特徴があり、また、本発明の粘着テープは、高温に曝された後の再はく離性が良好であるという特徴がある。 The silicone-based pressure-sensitive adhesive of the present invention is characterized in that it can form a pressure-sensitive adhesive layer that has good releasability after being exposed to a high temperature. It is characterized by good removability after being exposed to.
はじめに、本発明のシリコーン系感圧接着剤について詳細に説明する。
（Ａ）成分は本組成物の主成分であり、（ａ）一分子中に平均１個以上のアルケニル基を有する生ゴム状のオルガノポリシロキサンと（ｂ）Ｒ1 3ＳiＯ1/2単位（式中、Ｒ1は置換もしくは非置換の一価炭化水素基である。）とＳiＯ4/2単位から本質的に成り、ＳiＯ4/2単位に対するＲ1 3ＳiＯ1/2単位のモル比が０.５〜１.５であるオルガノポリシロキサンレジンとの混合物、またはこれらの部分縮合反応物である。
First, the silicone pressure sensitive adhesive of the present invention will be described in detail.
Component (A) is the main component of the present composition, and (a) a raw rubber-like organopolysiloxane having an average of one or more alkenyl groups in one molecule and (b) R 1 3 SiO 1/2 unit (formula R 1 is a substituted or unsubstituted monovalent hydrocarbon group) and an SiO 4/2 unit, and the molar ratio of the R 1 3 SiO 1/2 unit to the SiO 4/2 unit is 0. It is a mixture with an organopolysiloxane resin that is 0.5 to 1.5, or a partial condensation reaction product thereof.
（ａ）成分の生ゴム状のオルガノポリシロキサンは、一分子中に平均１個以上のアルケニル基を有するが、これは、アルケニル基が一分子中に平均１個未満であると、得られる感圧接着剤の凝集力（保持力）が低下するためである。（ａ）成分は生ゴム状であるが、その可塑度（ＪＩＳ Ｋ ６２４９に規定される方法に準じて測定された可塑度：２５℃、４.２ｇの球状試料に１ｋｇｆの荷重を３分間かけたときの値）が５０〜２００の範囲内であることが好ましく、特には８０〜１８０の範囲内であることが好ましい。また、（ａ）成分の分子構造は限定されないが、実質的には直鎖状であることが好ましく、一部分枝を有していてもよい。（ａ）成分中のアルケニル基としては、例えば、ビニル基、アリル基、ブテニル基、ペンテニル基が挙げられ、特に、ビニル基であることが好ましい。（ａ）成分中のアルケニル基以外のケイ素原子に結合する基としては、例えば、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基等のアルキル基；フェニル基、トリル基、キシリル基等のアリール基；ベンジル基、フェネチル基等のアラルキル基；クロロメチル基、３−クロロプロピル基、３,３,３−トリフロロプロピル基等のハロゲン化アルキル基等の置換もしくは非置換の一価炭化水素基；水酸基；メトキシ基、エトキシ基、プロポキシ基等のアルコキシ基；アセトキシ基；イソプロペノキシ基；アミノキシ基等の加水分解性基が挙げられ、特に、メチル基、フェニル基であることが好ましい。また、（ａ）成分を下記（ｂ）成分と部分縮合反応させる場合には、（ａ）成分は少なくとも０.０１重量％のケイ素原子結合水酸基もしくはケイ素原子結合加水分解性基を有することが好ましい。 The raw rubber-like organopolysiloxane of component (a) has an average of one or more alkenyl groups in one molecule, and this is the pressure sensitivity obtained when the average number of alkenyl groups is less than one in one molecule. This is because the cohesive force (holding force) of the adhesive is reduced. The component (a) is in the form of raw rubber, but its plasticity (plasticity measured according to the method defined in JIS K 6249: 25 ° C., 4.2 g of spherical sample was subjected to a load of 1 kgf for 3 minutes. Is preferably in the range of 50 to 200, and more preferably in the range of 80 to 180. Further, the molecular structure of the component (a) is not limited, but it is preferably substantially linear, and may partially have branches. Examples of the alkenyl group in component (a) include a vinyl group, an allyl group, a butenyl group, and a pentenyl group, and a vinyl group is particularly preferable. Examples of the group bonded to the silicon atom other than the alkenyl group in the component (a) include alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, and heptyl group; phenyl group, tolyl group, and xylyl group. Aryl groups such as aralkyl groups; aralkyl groups such as benzyl groups and phenethyl groups; substituted or unsubstituted alkyl groups such as chloromethyl groups, 3-chloropropyl groups, 3,3,3-trifluoropropyl groups, etc. Valent hydrocarbon group; hydroxyl group; alkoxy group such as methoxy group, ethoxy group, propoxy group; acetoxy group; isopropenoxy group; hydrolyzable group such as aminoxy group, and particularly preferably methyl group and phenyl group. . When the component (a) is subjected to a partial condensation reaction with the component (b) below, the component (a) preferably has at least 0.01% by weight of a silicon atom-bonded hydroxyl group or a silicon atom-bonded hydrolyzable group. .
また、（ｂ）成分は、Ｒ1 3ＳiＯ1/2単位とＳiＯ4/2単位から本質的に成るオルガノポリシロキサンレジンである。上式中、Ｒ1は置換もしくは非置換の一価炭化水素基であり、例えば、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基等のアルキル基；ビニル基、アリル基、ブテニル基、ペンテニル基等のアルケニル基；フェニル基、トリル基、キシリル基等のアリール基；ベンジル基、フェネチル基等のアラルキル基；クロロメチル基、３−クロロプロピル基、３,３,３−トリフロロプロピル基等のハロゲン化アルキル基等の置換もしくは非置換の一価炭化水素基が挙げられ、特に、メチル基、ビニル基、フェニル基であることが好ましい。さらに、（ｂ）成分を前記（ａ）成分と部分縮合反応させる場合には、（ｂ）成分は少なくとも０.０１重量％のケイ素原子結合水酸基もしくはケイ素原子結合加水分解性基を有することが好ましい。この加水分解性基としては、例えば、メトキシ基、エトキシ基、プロポキシ基等のアルコキシ基；アセトキシ基；イソプロペノキシ基；アミノキシ基が挙げられる。また、（ｂ）成分は、Ｒ1 3ＳiＯ1/2単位とＳiＯ4/2単位から本質的に成るが、他にＲ1 2ＳiＯ2/2単位やＲ1ＳiＯ3/2単位を有していてもよく、（ｂ）成分中のＲ1 3ＳiＯ1/2単位とＳiＯ4/2単位の合計含有量が５０重量％以上であることが好ましく、さらに８０重量％以上であることが好ましく、特に、１００重量％、すなわちこれらの２つの単位のみからなることが好ましい。（ｂ）成分は、ＳiＯ4/2単位に対するＲ1 3ＳiＯ1/2単位のモル比が０.５〜１.５の範囲内であり、好ましくは、０.５〜１.０の範囲内であり、特に好ましくは、０.６〜０.９の範囲内である。これは、このモル比が上記範囲の下限未満であると、得られる感圧接着剤のタックが低下する傾向があるからであり、一方、上記範囲の上限をこえると、得られる感圧接着剤の粘着力が低下する傾向があるからである。 The component (b) is an organopolysiloxane resin consisting essentially of R 1 3 SiO 1/2 units and SiO 4/2 units. In the above formula, R 1 is a substituted or unsubstituted monovalent hydrocarbon group, for example, an alkyl group such as methyl group, ethyl group, propyl group, butyl group, pentyl group, heptyl group; vinyl group, allyl group, Alkenyl groups such as butenyl and pentenyl; aryl groups such as phenyl, tolyl and xylyl; aralkyl groups such as benzyl and phenethyl; chloromethyl, 3-chloropropyl, 3,3,3-tri Examples thereof include substituted or unsubstituted monovalent hydrocarbon groups such as a halogenated alkyl group such as a fluoropropyl group, and a methyl group, a vinyl group, and a phenyl group are particularly preferable. Further, when the component (b) is partially condensed with the component (a), the component (b) preferably has at least 0.01% by weight of a silicon atom-bonded hydroxyl group or a silicon atom-bonded hydrolyzable group. . Examples of the hydrolyzable group include an alkoxy group such as a methoxy group, an ethoxy group, and a propoxy group; an acetoxy group; an isopropenoxy group; and an aminoxy group. The component (b) consists essentially of R 1 3 SiO 1/2 units and SiO 4/2 units, but also has R 1 2 SiO 2/2 units and R 1 SiO 3/2 units. The total content of R 1 3 SiO 1/2 units and SiO 4/2 units in component (b) is preferably 50% by weight or more, more preferably 80% by weight or more. In particular, it is preferred that it consists of 100% by weight, ie only these two units. Component (b) has a molar ratio of R 1 3 SiO 1/2 units to SiO 4/2 units in the range of 0.5 to 1.5, preferably in the range of 0.5 to 1.0. And particularly preferably within the range of 0.6 to 0.9. This is because if the molar ratio is less than the lower limit of the above range, the tack of the resulting pressure sensitive adhesive tends to decrease, while if exceeding the upper limit of the above range, the resulting pressure sensitive adhesive is obtained. This is because the adhesive strength of the glass tends to decrease.
（Ａ）成分は、（ａ）成分と（ｂ）成分の混合物でもよく、またこれらの部分縮合反応物でもよいが、（Ａ）成分中、（ａ）成分と（ｂ）成分の重量比は１：９〜９：１の範囲内であることが好ましく、さらには、２：８〜８：２の範囲内であることが好ましく、特には、３：７〜７：３の範囲内であることが好ましい。なお、これらを部分縮合反応する方法としては、例えば、これらを加熱して部分縮合反応する方法、これらを水酸化カリウム、水酸化バリウム等の塩基；アンモニア水；メチルアミン、エチルアミン、プロピルアミン等のアミン類；テトラブチルチタネート、テトライソブチルチタネート等のチタン化合物；オクチル錫ジアセテート等の錫化合物；ヘキサメチルジシラザン等の触媒の存在下で部分縮合反応する方法が挙げられる。 The component (A) may be a mixture of the component (a) and the component (b), or may be a partial condensation reaction product thereof. In the component (A), the weight ratio of the component (a) to the component (b) is It is preferably within the range of 1: 9 to 9: 1, more preferably within the range of 2: 8 to 8: 2, and particularly within the range of 3: 7 to 7: 3. It is preferable. In addition, as a method of partial condensation reaction of these, for example, a method of performing partial condensation reaction by heating them, a base such as potassium hydroxide or barium hydroxide; ammonia water; methylamine, ethylamine, propylamine, etc. Examples include amines; titanium compounds such as tetrabutyl titanate and tetraisobutyl titanate; tin compounds such as octyl tin diacetate; and a partial condensation reaction in the presence of a catalyst such as hexamethyldisilazane.
（Ｂ）成分は本組成物の架橋剤であり、一分子中に平均２個以上のケイ素原子結合水素原子を有するオルガノポリシロキサンである。（Ｂ）成分中のケイ素原子の結合位置としては、例えば、分子鎖末端および／または分子鎖側鎖が挙げられる。（Ｂ）成分中の水素原子以外のケイ素原子に結合する基としては、例えば、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基等のアルキル基；フェニル基、トリル基、キシリル基、ナフチル基等とアリール基；ベンジル基、フェネチル基等のアラルキル基；クロロメチル基、３−クロロプロピル基、３,３,３−トリフロロプロピル基等のハロゲン化アルキル基等のアルケニル基を除く置換もしくは非置換の一価炭化水素基が挙げられ、特に、メチル基、フェニル基であることが好ましい。このような（Ｂ）成分の分子構造としては、例えば、直鎖状、分枝鎖状、環状、網状、一部分枝を有する直鎖状が挙げられ、特に、直鎖状であることが好ましい。また、（Ｂ）成分の２５℃における粘度は特に限定されないが、０.１〜５００,０００ｍＰa・ｓの範囲内であることが好ましく、特に、１〜１００,０００ｍＰa・ｓの範囲内であることが好ましい。 Component (B) is a cross-linking agent of the present composition and is an organopolysiloxane having an average of two or more silicon-bonded hydrogen atoms in one molecule. Examples of the bonding position of the silicon atom in the component (B) include a molecular chain terminal and / or a molecular chain side chain. Examples of the group bonded to the silicon atom other than the hydrogen atom in the component (B) include alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group; phenyl group, tolyl Groups, xylyl groups, naphthyl groups, etc. and aryl groups; aralkyl groups such as benzyl groups, phenethyl groups; halogenated alkyl groups such as chloromethyl groups, 3-chloropropyl groups, 3,3,3-trifluoropropyl groups, etc. Examples thereof include a substituted or unsubstituted monovalent hydrocarbon group excluding an alkenyl group, and a methyl group and a phenyl group are particularly preferable. Examples of such a molecular structure of the component (B) include a straight chain, a branched chain, a ring, a network, and a straight chain having a partial branch, and a straight chain is particularly preferable. The viscosity of component (B) at 25 ° C. is not particularly limited, but is preferably within the range of 0.1 to 500,000 mPa · s, and particularly within the range of 1 to 100,000 mPa · s. Is preferred.
このような（Ｂ）成分のオルガノポリシロキサンとしては、例えば、分子鎖両末端トリメチルシロキシ基封鎖メチルハイドロジェンポリシロキサン、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン共重合体、分子鎖両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルハイドロジェンシロキサン・メチルフェニルシロキサン共重合体、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルポリシロキサン、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖ジメチルシロキサン・メチルフェニルシロキサン共重合体、分子鎖両末端ジメチルハイドロジェンシロキシ基封鎖メチルフェニルポリシロキサン、式：Ｒ2 3ＳiＯ1/2で示されるシロキサン単位と式；Ｒ2 2ＨＳiＯ1/2で示されるシロキサン単位と式：ＳiＯ4/2で示されるシロキサン単位からなるオルガノポリシロキサンレジン、式：Ｒ2 2ＨＳiＯ1/2で示されるシロキサン単位と式：ＳiＯ4/2で示されるシロキサン単位からなるオルガノポリシロキサンレジン、式：Ｒ2ＨＳiＯ2/2で示されるシロキサン単位と式：Ｒ2ＳiＯ3/2で示されるシロキサン単位または式：ＨＳiＯ3/2で示されるシロキサン単位からなるオルガノポリシロキサンレジン、およびこれらのオルガノポリシロキサンの二種以上の混合物が挙げられる。上式中、Ｒ2はアルケニル基を除く置換もしくは非置換の一価炭化水素基であり、前記と同様の基が例示される。 Examples of such an organopolysiloxane of the component (B) include, for example, molecular chain both-end trimethylsiloxy group-blocked methylhydrogenpolysiloxane, molecular chain both-end trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer, molecule Trimethylsiloxy group-capped dimethylsiloxane / methylhydrogensiloxane / methylphenylsiloxane copolymer, both chain ends dimethylhydrogensiloxy group-capped dimethylpolysiloxane, molecular chain both ends dimethylhydrogensiloxy group-capped dimethylsiloxane / methyl phenyl siloxane copolymers, both molecular terminals with dimethylhydrogensiloxy groups at methylphenyl polysiloxane, wherein: the siloxane units represented by the formula R 2 3 SiO 1/2; R 2 2 HSiO 1/2 Siloxane units of the formula: organopolysiloxane resin comprising siloxane units represented by SiO 4/2, wherein: the siloxane units represented by the formula R 2 2 HSiO 1/2: from siloxane units represented by SiO 4/2 An organopolysiloxane resin comprising a siloxane unit represented by the formula: R 2 HSiO 2/2 and a siloxane unit represented by the formula: R 2 SiO 3/2 or a siloxane unit represented by the formula: HSiO 3/2 Resins, and mixtures of two or more of these organopolysiloxanes. In the above formula, R 2 is a substituted or unsubstituted monovalent hydrocarbon group excluding an alkenyl group, and examples thereof are the same groups as described above.
（Ｂ）成分の含有量は、（Ａ）成分中のアルケニル基の合計１モルに対して、本成分中のケイ素原子結合水素原子が０.５〜１５０.０モルの範囲内となる量であり、好ましくは、０.６〜１５０.０モルの範囲内となる量であり、さらに好ましくは、０.７〜１４０.０モルの範囲内となる量であり、特に好ましくは、０.８〜１３０.０モルの範囲内となる量である。これは、（Ｂ）成分の含有量が上記範囲の下限未満であると、得られる感圧接着剤が十分に硬化しなくなったり、また凝集力（保持力）が低下するためであり、一方、上記範囲の上限をこえると、得られる感圧接着剤の剥離紙もしくは剥離フィルムに対する剥離抵抗が大きくなり、さらにこの剥離抵抗が経時的に大きくなるためである。 The content of component (B) is such that the silicon-bonded hydrogen atoms in this component are in the range of 0.5 to 150.0 mol with respect to a total of 1 mol of alkenyl groups in component (A). Yes, preferably in an amount in the range of 0.6 to 150.0 moles, more preferably in an amount in the range of 0.7 to 140.0 moles, particularly preferably 0.8. The amount is within the range of ˜13.0 mol. This is because if the content of the component (B) is less than the lower limit of the above range, the resulting pressure-sensitive adhesive will not be sufficiently cured, and the cohesive force (holding force) will decrease, If the upper limit of the above range is exceeded, the peel resistance of the resulting pressure-sensitive adhesive to the release paper or release film increases, and this peel resistance increases with time.
（Ｃ）成分は、高温に曝された後の再はく離性を向上するための成分であり、フェノール系酸化防止剤および／またはフェノール変性オルガノシロキサンである。（Ｃ）成分のフェノール系酸化防止剤としては、モノフェノール系酸化防止剤、ビスフェノール系酸化防止剤、ポリフェノール系酸化防止剤、ヒンダードフェノール系酸化防止剤が例示され、好ましくは、ヒンダードフェノール系酸化防止剤である。このような（Ｃ）成分のフェノール系酸化防止剤としては、２,６−ジ−ｔｅｒｔ−ブチル−ｐ−クレゾール、２,４,６−トリ−ｔｅｒｔ−ブチルフェノール、ｎ−オクチル−３−(４'−ヒドロキシ−３',５'−ジ−ｔｅｒｔ−ブチルフェニル)プロピオネート、ｎ−オクタデシル−３−（４'−ヒドロオキシ−３',５'−ジ−ｔｅｒｔ−ブチルフェノール）プロピオネート、スチレン化フェノール、４−ヒドロオキシメチル−２,６−ジ−ｔｅｒｔ−ブチルフェノール、２,５−ジ−ｔｅｒｔ−ブチル−ハイドロキノン、シクロヘキシルフェノール、ブチルヒドロキシアニゾール、２,２'−メチレン−ビス（４−メチル−６−ｔｅｒｔ−ブチルフェノール）、２,２'−メチレン−ビス（４−エチル−６−ｔｅｒｔ−ブチルフェノール）、４,４'−ｉ−プロピリデンビスフェノール、１,１−ビス−（４−ヒドロオキシフェニル）シクロヘキサン、４,４'−メチレン−ビス（２,６−ジ−ｔｅｒｔ−ブチルフェノール）、２,６−ビス（２'−ヒドロオキシ−３'−ｔｅｒｔ−ブチル−５'−メチルベンジル）−４−メチルフェノール、１,１,３−トリス（２−メチル−４−ヒドロオキシ−５−ｔｅｒｔ−ブチルフェニル）ブタン、１,３,５−トリス−メチル−２,４,６−トリス（３,５−ジ−ｔｅｒｔ−ブチル−４−ヒドロオキシ−ベンジル）ベンゼン、テトラキス［メチレン−３−（３,５−ジ−ｔｅｒｔ−ブチル−４−ヒドロオキシフェニル）プロピオネート］メタン、４−ヒドロオキシ−３,５−ジ−ｔｅｒｔ−ブチルフェニルトリメトキシシラン、４−ヒドロオキシ−３,５−ジ−ｔｅｒｔ−ブチルフェニルトリエトキシシラン、４−ヒドロオキシ−３,５−ジ−ｔｅｒｔ−ブチルフェニルメチルジメトキシシラン、３−（４−ヒドロオキシ−３,５−ジ−ｔｅｒｔ−ブチルフェニル）プロピルトリメトキシシラン、３−（４−ヒドロオキシ−３,５−ジ−ｔｅｒｔ−ブチルフェニル）プロピルメチルジメトキシシラン、３−（４−ヒドロオキシ−３,５−ジ−ｔｅｒｔ−ブチルフェニルオキシ）プロピルトリメトキシシランが例示される。 Component (C) is a component for improving the releasability after exposure to high temperature, and is a phenolic antioxidant and / or a phenol-modified organosiloxane. Examples of the phenolic antioxidant of component (C) include monophenolic antioxidants, bisphenolic antioxidants, polyphenolic antioxidants, and hindered phenolic antioxidants, preferably hindered phenolic agents. It is an antioxidant. Examples of such a phenolic antioxidant as the component (C) include 2,6-di-tert-butyl-p-cresol, 2,4,6-tri-tert-butylphenol, n-octyl-3- (4 '-Hydroxy-3', 5'-di-tert-butylphenyl) propionate, n-octadecyl-3- (4'-hydroxy-3 ', 5'-di-tert-butylphenol) propionate, styrenated phenol, 4 -Hydroxymethyl-2,6-di-tert-butylphenol, 2,5-di-tert-butyl-hydroquinone, cyclohexylphenol, butylhydroxyanisole, 2,2'-methylene-bis (4-methyl-6- tert-butylphenol), 2,2'-methylene-bis (4-ethyl-6-tert-butylphenol), 4,4'-i-pro Ridenbisphenol, 1,1-bis- (4-hydroxyphenyl) cyclohexane, 4,4'-methylene-bis (2,6-di-tert-butylphenol), 2,6-bis (2'-hydroxy-3) '-Tert-butyl-5'-methylbenzyl) -4-methylphenol, 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-tris -Methyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxy-benzyl) benzene, tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxy) Phenyl) propionate] methane, 4-hydroxy-3,5-di-tert-butylphenyltrimethoxysilane, 4-hydroxy-3,5-di-tert-butylphen Rutriethoxysilane, 4-hydroxy-3,5-di-tert-butylphenylmethyldimethoxysilane, 3- (4-hydroxy-3,5-di-tert-butylphenyl) propyltrimethoxysilane, 3- (4- Examples include hydroxy-3,5-di-tert-butylphenyl) propylmethyldimethoxysilane and 3- (4-hydroxy-3,5-di-tert-butylphenyloxy) propyltrimethoxysilane.
また、（Ｃ）成分のフェノール変性オルガノシロキサンは、一分子中のケイ素原子に少なくとも１個のヒドロキシフェニル含有基が結合しているものであれば特に限定されない。このヒドロキシフェニル含有基の結合位置は限定されず、例えば、分子鎖末端および／または分子鎖側鎖が挙げられる。このようなオルガノシロキサンの分子構造は特に限定されず、例えば、直鎖状、環状、分岐状、一部分岐を有する直鎖状が挙げられ、好ましくは直鎖状である。このようなフェノール変性オルガノシロキサンは、例えば、平均式：
Ｒ3 aＳiＯ(4-ａ)/2
で示される。式中のＲ3は、置換もしくは非置換の一価炭化水素基、一般式：
R 3 a SiO (4-a) / 2
Indicated by R 3 in the formula is a substituted or unsubstituted monovalent hydrocarbon group,
このようなフェノール変性オルガノシロキサンは、例えば、特開昭６１−４３６９２号公報、特開平２−２６１８２３号公報に開示されているが、具体的には、次のような化合物が例示される。なお、式中のｍ、ｎはそれぞれ正数である。
（Ｃ）成分の含有量は、（Ａ）成分と（Ｂ）成分の合計１００重量部に対して、０.００１〜１０重量部の範囲内であり、好ましくは、０.００５〜８重量部の範囲内であり、特に好ましくは、０.０１〜５重量部の範囲内である。これは、（Ｃ）成分の含有量が、上記範囲の下限未満であると、高温に曝された後の再はく離性が低下する恐れがあるからであり、一方、上記範囲の上限を超えると、得られる感圧接着剤が十分に硬化しなくなったり、また粘着力やタックが低下したりするためである。 The content of the component (C) is in the range of 0.001 to 10 parts by weight, preferably 0.005 to 8 parts by weight, based on 100 parts by weight of the total of the components (A) and (B). And particularly preferably within the range of 0.01 to 5 parts by weight. This is because if the content of the component (C) is less than the lower limit of the above range, the releasability after exposure to high temperatures may decrease, whereas if it exceeds the upper limit of the above range. This is because the resulting pressure-sensitive adhesive is not sufficiently cured, and adhesive strength and tack are reduced.
（Ｄ）成分は、（Ｃ）成分と共に高温に曝された後の再はく離性を向上するための成分であり、芳香族アミン系酸化防止剤および／または芳香族アミノ変性オルガノシロキサンである。（Ｄ）成分の芳香族アミン系酸化防止剤としては、フェニル−α−ナフチルアミン、フェニル−β−ナフチルアミン等のナフチルアミン系酸化防止剤；４,４'−（α,α−ジメチルベンジル）ジフェニルアミン、４,４'−ジオクチル・ジフェニルアミン、ジフェニルアミンとアセトンの高温反応生成品、ジフェニルアミンとアセトンの低温反応生成品、ジフェニルアミンとアニリンとアセトンの低温反応品、ジフェニルアミンとジイソブチレンの反応生成品、オクチル化ジフェニルアミン、置換ジフェニルアミン、アルキル化ジフェニルアミン、ジフェニルアミン誘導体等のジフェニルアミン系酸化防止剤；Ｎ,Ｎ'−ジフェニル−ｐ−フェニレンジアミン、Ｎ,Ｎ'−ジ−β−ナフチル−ｐ−フェニレンジアミン、Ｎ−シクロヘキシル−Ｎ'−フェニル−ｐ−フェニレンジアミン、Ｎ−フェニル−Ｎ'−イソプロピル−ｐ−フェニレンジアミン、Ｎ−フェニル−Ｎ'−（３−メタクリロイルオキシ−２−ヒドロキシプロピル）−ｐ−フェニレンジアミン、Ｎ,Ｎ'−ビス（１−メチルヘプチル）−ｐ−フェニレンジアミン、Ｎ,Ｎ'−ビス（１,４−ジメチルペンチル）−ｐ−フェニレンジアミン、Ｎ−（１,３−ジメチルブチル）−Ｎ'−フェニル−ｐ−フェニレンジアミン、ジアリル−ｐ−フェニレンジアミンの混合品、フェニル・オクチル−ｐ−フェニレンジアミン等のｐ−フェニレンジアミン系酸化防止剤；フェニル−α−ナフチルアミンとジフェニル−ｐ−フェニレンジアミンの混合品、Ｎ−イソプロピル−Ｎ'−フェニル−ｐ−フェニレンジアミンと６−エトキシ−２,２,４−トリメチル−１,２−ジヒドロキノリンの混合品等のアミン混合品が例示される。 The component (D) is a component for improving the releasability after being exposed to a high temperature together with the component (C), and is an aromatic amine antioxidant and / or an aromatic amino-modified organosiloxane. Examples of the aromatic amine-based antioxidant as component (D) include naphthylamine-based antioxidants such as phenyl-α-naphthylamine and phenyl-β-naphthylamine; 4,4 ′-(α, α-dimethylbenzyl) diphenylamine, 4 , 4'-dioctyl diphenylamine, high temperature reaction product of diphenylamine and acetone, low temperature reaction product of diphenylamine and acetone, low temperature reaction product of diphenylamine, aniline and acetone, reaction product of diphenylamine and diisobutylene, octylated diphenylamine, substituted Diphenylamine antioxidants such as diphenylamine, alkylated diphenylamine and diphenylamine derivatives; N, N′-diphenyl-p-phenylenediamine, N, N′-di-β-naphthyl-p-phenylenediamine, N-cyclohexyl-N ′ -Phenyl p-phenylenediamine, N-phenyl-N′-isopropyl-p-phenylenediamine, N-phenyl-N ′-(3-methacryloyloxy-2-hydroxypropyl) -p-phenylenediamine, N, N′-bis ( 1-methylheptyl) -p-phenylenediamine, N, N′-bis (1,4-dimethylpentyl) -p-phenylenediamine, N- (1,3-dimethylbutyl) -N′-phenyl-p-phenylene Diamine, a mixture of diallyl-p-phenylenediamine, p-phenylenediamine-based antioxidants such as phenyl octyl-p-phenylenediamine; a mixture of phenyl-α-naphthylamine and diphenyl-p-phenylenediamine, N-isopropyl -N'-phenyl-p-phenylenediamine and 6-ethoxy-2,2,4-trimethyl-1,2- Examples include amine mixtures such as dihydroquinoline mixtures.
また（Ｄ）成分の芳香族アミノ変性オルガノシロキサンは、一分子中のケイ素原子に少なくとも１個の芳香族アミノ含有基が結合しているものであれば特に限定されない。この芳香族アミノ含有基の結合位置は限定されず、例えば、分子鎖末端および／または分子鎖側鎖が挙げられる。このようなオルガノシロキサンの分子構造は特に限定されず、例えば、直鎖状、環状、分岐状、一部分岐を有する直鎖状が挙げられ、好ましくは直鎖状である。このような芳香族アミノ変性オルガノシロキサンは、例えば、平均式：
Ｒ6 bＳiＯ(4-b)/2
で示される。式中のＲ6は置換もしくは非置換の一価炭化水素基、一般式：
R 6 b SiO (4-b) / 2
Indicated by R 6 in the formula is a substituted or unsubstituted monovalent hydrocarbon group,
このような芳香族アミノ変性オルガノシロキサンは、例えば、特開平２−２８３７６５号公報に開示されているが、次のような化合物が例示される。なお、式中のｍ、ｎはそれぞれ正数である。
（Ｄ）成分の含有量は、（Ａ）成分と（Ｂ）成分の合計１００重量部に対して、０.００１〜１０重量部の範囲内であり、好ましくは、０.００５〜８重量部の範囲内であり、特に好ましくは、０.０１〜５重量部の範囲内である。これは、（Ｄ）成分の含有量が、上記範囲の下限未満であると、高温に曝された後の再はく離性が低下する恐れがあるからであり、一方、上記範囲の上限を超えると、得られる感圧接着剤が十分に硬化しなくなったり、また粘着力やタックが低下したりするためである。 The content of the component (D) is in the range of 0.001 to 10 parts by weight, preferably 0.005 to 8 parts by weight, based on 100 parts by weight of the total of the components (A) and (B). And particularly preferably within the range of 0.01 to 5 parts by weight. This is because if the content of component (D) is less than the lower limit of the above range, the releasability after exposure to high temperatures may decrease, whereas if it exceeds the upper limit of the above range. This is because the resulting pressure-sensitive adhesive is not sufficiently cured, and adhesive strength and tack are reduced.
（Ｅ）成分は本組成物の架橋反応を促進するための白金系触媒である。（Ｅ）成分としては、塩化白金酸、塩化白金酸のアルコール溶液、白金のカルボニル錯体、白金のアルケニルシロキサン錯体、白金のオレフィン錯体が例示され、特に、（Ａ）成分との相溶性が良好であることから、白金のアルケニルシロキサン錯体であることが好ましい。この白金のアルケニルシロキサン錯体において、アルケニルシロキサンとしては、例えば、１,３−ジビニル−１,１,３,３−テトラメチルジシロキサン、１,１,３,３−テトラビニル−１,３−ジメチルジシロキサンが挙げられる。 Component (E) is a platinum-based catalyst for promoting the crosslinking reaction of the present composition. Examples of the component (E) include chloroplatinic acid, alcohol solution of chloroplatinic acid, platinum carbonyl complex, platinum alkenylsiloxane complex, and platinum olefin complex. Particularly, the compatibility with the component (A) is good. For this reason, it is preferably a platinum alkenylsiloxane complex. In this platinum alkenylsiloxane complex, examples of the alkenylsiloxane include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 1,1,3,3-tetravinyl-1,3-dimethyl. Disiloxane is mentioned.
（Ｅ）成分の含有量は、本組成物の硬化を促進するに十分な量であり、例えば、（Ａ）成分に対する本成分中の白金金属が重量単位で０.１〜１,０００ｐｐｍの範囲内となる量であることが好ましく、さらには、１〜５００ｐｐｍの範囲内となる量であることが好ましい。これは、（Ｅ）成分の含有量が、上記範囲の下限未満であると、得られる感圧接着剤の硬化が著しく遅くなるためであり、一方、上記範囲の上限を超えると、得られる感圧接着剤に着色等の問題を生じるからである。 The content of the component (E) is an amount sufficient to promote the curing of the present composition. For example, the platinum metal in the present component relative to the component (A) is in the range of 0.1 to 1,000 ppm by weight. The amount is preferably in an amount, and more preferably in the range of 1 to 500 ppm. This is because when the content of the component (E) is less than the lower limit of the above range, curing of the resulting pressure-sensitive adhesive is remarkably slowed. On the other hand, when the content exceeds the upper limit of the above range, the resulting sensitivity This is because problems such as coloration occur in the pressure-sensitive adhesive.
本接着剤は、上記の（Ａ）成分〜（Ｅ）成分からなるが、その他任意の成分として、本接着剤の硬化速度を調節するため、２−メチル−３−ブチン−２−オール、３,５−ジメチル−１−ヘキシン−３−オール、３−メチル−１−ペンテン−３−オール、２−フェニル−３−ブチン−２−オール等のアルキンアルコール；３−メチル−３−ペンテン−１−イン、３,５−ジメチル−３−ヘキセン−１−イン等とエンイン化合物；１,３,５,７−テトラメチル−１,３,５,７−テトラビニルシクロテトラシロキサン、１,３,５,７−テトラメチル−１,３,５,７−テトラヘキセニルシクロテトラシロキサン等のアルケニルシロキサン等の硬化反応調整剤を含有してもよい。 This adhesive is composed of the above components (A) to (E), but as other optional components, 2-methyl-3-butyn-2-ol, 3 to adjust the curing rate of the adhesive Alkyne alcohols such as 1,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-penten-3-ol, 2-phenyl-3-butyn-2-ol; 3-methyl-3-penten-1 -In, 3,5-dimethyl-3-hexen-1-yne and the like and enyne compounds; 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3, A curing reaction modifier such as alkenylsiloxane such as 5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane may be contained.
この硬化反応調整剤の含有量は、本接着剤の硬化速度を調節するための有効量であり、一般には、（Ａ）成分１００重量部に対して５重量部以下であることが好ましい。これは、この含有量が（Ａ）成分１００重量部に対して５重量部をこえると、得られる感圧接着剤の硬化速度が著しく遅くなるからである。 The content of this curing reaction modifier is an effective amount for adjusting the curing rate of the present adhesive, and is generally preferably 5 parts by weight or less with respect to 100 parts by weight of component (A). This is because if the content exceeds 5 parts by weight with respect to 100 parts by weight of component (A), the curing speed of the resulting pressure-sensitive adhesive is remarkably slowed.
また、本接着剤には、トルエン、キシレン、ヘキサン、ヘプタン、アセトン、メチルエチルケトン、メチルイソブチルケトン等の有機溶剤；テトラメトキシシラン、テトラエトキシシラン、ジメチルジメトキシシラン、メチルフェニルジメトキシシラン、メチルフェニルジエトキシシラン、フェニルトリメトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、ビニルトリエトキシシラン、アリルトリメトキシシラン、アリルトリエトキシシラン、３−グリシドキシプロピルトリメトキシシラン、３−メタクリロキシプロピルトリメトキシシラン等のアルコキシシラン化合物；その他、酸化防止剤、顔料、安定剤を含有してもよい。 In addition, this adhesive includes organic solvents such as toluene, xylene, hexane, heptane, acetone, methyl ethyl ketone, and methyl isobutyl ketone; tetramethoxysilane, tetraethoxysilane, dimethyldimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane , Phenyltrimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, etc. In addition, an antioxidant, a pigment, and a stabilizer may be contained.
本発明のシリコーン系感圧接着剤は、上記（Ａ）成分〜（Ｅ）成分、必要に応じてその他任意の成分を混合することにより調製することができる。このようにして調製されたシリコーン系感圧接着剤は、基材に塗工した後、室温もしくは加熱することにより硬化して、前記基材の表面に感圧接着層を形成することができる。前記塗工方法としては、グラビアコート、オフセットコート、オフセットグラビア、ロールコート、リバースロールコート、エアナイフコート、カーテンコート、コンマコートが例示される。 The silicone-based pressure-sensitive adhesive of the present invention can be prepared by mixing the components (A) to (E) and other optional components as necessary. The silicone pressure sensitive adhesive thus prepared can be applied to a substrate and then cured at room temperature or by heating to form a pressure sensitive adhesive layer on the surface of the substrate. Examples of the coating method include gravure coating, offset coating, offset gravure, roll coating, reverse roll coating, air knife coating, curtain coating, and comma coating.
次に、本発明の粘着テープについて詳細に説明する。
本発明の粘着テープは、支持フィルムと、その上に形成された、上記シリコーン系感圧接着剤を硬化してなるシリコーン系感圧接着層とを有することを特徴とする。支持フィルムとしては、例えば、ポリイミド、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ塩化ビニル、ポリカーボネート、ポリエチレンテレフタレート、ナイロン、ポリエーテルエーテルケトン、ポリフェニレンスルフィド、液晶ポリアリレート、ポリエーテルスルフォン、ポリエーテルイミド等の樹脂が成膜されたフィルムの未延伸または延伸のプラスチック基材、またはこれらの樹脂を被覆したプラスチック基材が挙げられ、特に、耐熱性が要求される場合には、ポリイミド（ＰＩ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリエチレンナフタレート（ＰＥＮ）、液晶ポリアリレート、ポリアミドイミド（ＰＡＩ）、ポリエーテルスルフォン（ＰＥＳ）等の樹脂が好ましい。
Next, the adhesive tape of the present invention will be described in detail.
The pressure-sensitive adhesive tape of the present invention has a support film and a silicone-based pressure-sensitive adhesive layer formed thereon by curing the silicone-based pressure-sensitive adhesive. Examples of the supporting film include resins such as polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, polycarbonate, polyethylene terephthalate, nylon, polyether ether ketone, polyphenylene sulfide, liquid crystal polyarylate, polyether sulfone, and polyether imide. Examples thereof include an unstretched or stretched plastic substrate of a film formed, or a plastic substrate coated with these resins. Particularly, when heat resistance is required, polyimide (PI), polyetheretherketone ( Resins such as PEEK), polyethylene naphthalate (PEN), liquid crystal polyarylate, polyamideimide (PAI), and polyethersulfone (PES) are preferable.
この粘着テープは、上記のシリコーン系感圧接着剤を、支持フィルムに塗工した後、室温もしくは加熱することにより硬化させて、前記フィルムの表面に感圧接着層を形成することにより作製することができる。この塗工方法としては、前記と同様の方法が例示される。支持フィルム上でシリコーン系感圧接着剤を硬化させる際には、加熱することが好ましく、５０℃以上で加熱することが好ましく、特に、８０〜２００℃の範囲内で加熱することが好ましい。 This pressure-sensitive adhesive tape is prepared by applying the above silicone-based pressure-sensitive adhesive to a support film and then curing it at room temperature or by heating to form a pressure-sensitive adhesive layer on the surface of the film. Can do. Examples of the coating method include the same methods as described above. When the silicone pressure-sensitive adhesive is cured on the support film, it is preferably heated, preferably heated at 50 ° C. or higher, and particularly preferably heated within the range of 80 to 200 ° C.
本発明のシリコーン系感圧接着剤および粘着テープについて実施例、比較例により詳細に説明する。なお、実施例中の粘度は２５℃において測定した値であり、ガムの可塑度は、ＪＩＳ Ｋ ６２４９に規定される方法に準じて測定された値（２５℃、４.２ｇの球状試料に１ｋｇｆの荷重を３分間かけたときの値）である。また、粘着力、高温に曝した後の再はく離性は次のようにして測定した。 The silicone-based pressure-sensitive adhesive and pressure-sensitive adhesive tape of the present invention will be described in detail with reference to examples and comparative examples. In addition, the viscosity in an Example is the value measured in 25 degreeC, and the plasticity of gum is the value measured according to the method prescribed | regulated to JISK6249 (25 degreeC, 4.2 kg of spherical samples are 1 kgf The value when the load of 3 is applied for 3 minutes). Moreover, the adhesive strength and the releasability after exposure to high temperature were measured as follows.
［粘着力］
ポリイミド樹脂からなる厚さ２５μｍの支持体上にシリコーン系感圧接着剤を硬化後の感圧接着層が４０μｍ前後の厚さになるように塗工した後、これを１２０℃で３分間加熱して粘着シートを作製した。次に、この粘着シートを幅２５ｍｍに切断して粘着テープを作製した。この粘着テープを３６０番耐水研磨紙で研磨処理したステンレススチール板（ＳＵＳ３０４）からなる被着体に２Ｋｇｆのゴムローラーを用いて圧着させた。その後、室温下、３０分間静置して、これを定速（３００ｍｍ／分）の引張試験機を用いて、１８０度引きはがし法により、この粘着力を測定した。
[Adhesive force]
A silicone pressure sensitive adhesive was coated on a 25 μm thick support made of polyimide resin so that the cured pressure sensitive adhesive layer had a thickness of about 40 μm, and then heated at 120 ° C. for 3 minutes. Thus, an adhesive sheet was prepared. Next, this adhesive sheet was cut into a width of 25 mm to produce an adhesive tape. This adhesive tape was pressure-bonded to an adherend made of a stainless steel plate (SUS304) polished with No. 360 water-resistant abrasive paper using a 2 Kgf rubber roller. Then, it left still at room temperature for 30 minutes, and this adhesive force was measured by the 180 degree peeling method using the constant-speed (300 mm / min) tensile tester.
［高温に曝した後の再はく離性］
ポリイミド樹脂からなる支持体にシリコーン系感圧接着剤を硬化後の感圧接着層が４０μｍ前後の厚さになるように塗工した後、これを１２０℃で３分間加熱して粘着シートを作製した。次に、この粘着シートを幅２５ｍｍに切断して粘着テープを作製した。この粘着テープを３６０番耐水研磨紙で研磨処理したステンレススチール板（ＳＵＳ３０４）からなる被着体に２Ｋｇｆのゴムローラーを用いて貼り合わせた。その後、２００℃〜３００℃の間を１０℃刻みに設定したオーブンで２時間エージングし、オーブンから取り出し、室温下、３０分間静置して、これを定速（３００ｍｍ／分）の引張試験機を用いて、１８０度で引きはがしてステンレス板に対する糊残りを目視で確認し、感圧接着層がステンレススチール板に全く残らない場合を再はく離性良好であるとして、○で示し、感圧接着層がステンレススチール板に残った場合を再はく離性不良として、×で示した。
[Removability after exposure to high temperatures]
After applying a silicone pressure sensitive adhesive to a polyimide resin support so that the cured pressure sensitive adhesive layer has a thickness of around 40 μm, it is heated at 120 ° C. for 3 minutes to produce an adhesive sheet. did. Next, this adhesive sheet was cut into a width of 25 mm to produce an adhesive tape. This adhesive tape was bonded to an adherend made of a stainless steel plate (SUS304) polished with No. 360 water-resistant abrasive paper using a 2 Kgf rubber roller. After that, it is aged for 2 hours in an oven set between 200 ° C. and 300 ° C. in increments of 10 ° C., taken out from the oven, and allowed to stand at room temperature for 30 minutes, which is a constant speed (300 mm / min) tensile tester. , Peel off at 180 degrees and visually check the adhesive residue on the stainless steel plate. If the pressure-sensitive adhesive layer does not remain at all on the stainless steel plate, it is shown as ◯. The case where the layer remained on the stainless steel plate was shown as x as re-peeling failure.
［実施例１］
分子鎖両末端がジメチルビニルシロキシ基で封鎖され、側鎖の一部にビニル基を有するジメチルシロキサン・メチルビニルシロキサン共重合体生ゴム（可塑度＝１３５、ビニル基の含有量＝０.０４重量％）２５.６重量部、(ＣＨ3)3ＳiＯ1/2単位とＳiＯ4/2単位から成り、ＳiＯ4/2単位に対する(ＣＨ3)3ＳiＯ1/2単位のモル比が０.８であるメチルポリシロキサンレジンの６０重量％キシレン希釈溶液５４.６重量部、粘度が２０ｍＰa・ｓであり、分子鎖両末端がトリメチルシロキシ基で封鎖されたメチルハイドロジェンポリシロキサン（ケイ素原子結合水素原子の含有量＝１.５５重量％）０.２重量部、２−メチル−３−ブチン−２−オール０.１重量部、式：
で示されるジフェニルアミン系酸化防止剤０.１５重量部、およびトルエン７０.３重量部を混合した後、白金の１,３−ジビニル−１,１,３,３−テトラメチルジシロキサン錯体（この錯体中の白金金属が上記のジメチルシロキサン・メチルビニルシロキサン共重合体生ゴムとメチルポリシロキサンレジンの合計に対して重量単位で１００ｐｐｍとなるような量）を添加して、オルガノポリシロキサン成分が４０重量％であるシリコーン系感圧接着剤を調製した。このシリコーン系感圧接着剤を用いて粘着テープを作製した。この粘着テープの粘着力および再はく離性を評価し、それらの結果を表１に示した。
[Example 1]
Both ends of the molecular chain are blocked with dimethylvinylsiloxy groups, and a dimethylsiloxane / methylvinylsiloxane copolymer raw rubber having a vinyl group in part of the side chain (plasticity = 135, vinyl group content = 0.04% by weight) ) 25.6 parts by weight, (CH 3) 3 consists SiO 1/2 units and SiO 4/2 units, in a molar ratio of (CH 3) 3 SiO 1/2 units to SiO 4/2 units is 0.8 Methyl hydrogen polysiloxane (a silicon atom-bonded hydrogen atom) having a viscosity of 20 mPa · s and a molecular chain both ends blocked with trimethylsiloxy groups. Content = 1.55 wt%) 0.2 parts by weight, 0.1 parts by weight of 2-methyl-3-butyn-2-ol, formula:
After mixing 0.15 part by weight of the diphenylamine antioxidant represented by formula (7) and 70.3 parts by weight of toluene, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (this complex) The amount of platinum metal in the dimethylsiloxane / methylvinylsiloxane copolymer raw rubber and methylpolysiloxane resin is 100 ppm by weight), and the organopolysiloxane component is 40% by weight. A silicone-based pressure sensitive adhesive was prepared. An adhesive tape was prepared using this silicone-based pressure sensitive adhesive. The adhesive strength and re-peelability of this adhesive tape were evaluated, and the results are shown in Table 1.
［比較例１］
実施例１において、ヒンダードフェノール系酸化防止剤を配合しない代わりにジフェニルアミン系酸化防止剤の配合量を０.３０重量部とした以外は実施例１と同様にしてシリコーン系感圧接着剤を調製した。このシリコーン系感圧接着剤を用いて粘着テープを作製した。この粘着テープの粘着力および再はく離性を評価し、それらの結果を表１に示した。
[Comparative Example 1]
In Example 1, a silicone pressure-sensitive adhesive was prepared in the same manner as in Example 1 except that the amount of diphenylamine antioxidant was 0.30 parts by weight instead of hindered phenol antioxidant. did. An adhesive tape was prepared using this silicone-based pressure sensitive adhesive. The adhesive strength and re-peelability of this adhesive tape were evaluated, and the results are shown in Table 1.
［比較例２］
実施例１において、ジフェニルアミン系酸化防止剤を配合しない代わりにヒンダードフェノール系酸化防止剤の配合量を０.３０重量部とした以外は実施例１と同様にしてシリコーン系感圧接着剤を調製した。このシリコーン系感圧接着剤を用いて粘着テープを作製した。この粘着テープの粘着力および再はく離性を評価し、それらの結果を表１に示した。
[Comparative Example 2]
In Example 1, a silicone-based pressure-sensitive adhesive was prepared in the same manner as in Example 1, except that the amount of hindered phenol-based antioxidant was 0.30 parts by weight instead of not containing diphenylamine-based antioxidant. did. An adhesive tape was prepared using this silicone-based pressure sensitive adhesive. The adhesive strength and re-peelability of this adhesive tape were evaluated, and the results are shown in Table 1.
［実施例２］
分子鎖両末端がジメチルビニルシロキシ基で封鎖され、側鎖の一部にビニル基を有するジメチルシロキサン・メチルビニルシロキサン共重合体生ゴム（可塑度＝１３６、ビニル基の含有量＝０.０４重量％）２５.６重量部と、(ＣＨ3)3ＳiＯ1/2単位とＳiＯ4/2単位から成り、ＳiＯ4/2単位に対する(ＣＨ3)3ＳiＯ1/2単位のモル比が０.８であるメチルポリシロキサンレジンの６０重量％キシレン希釈溶液５４.６重量部、粘度が２０ｍＰa・ｓであり、分子鎖両末端がトリメチルシロキシ基で封鎖されたメチルハイドロジェンポリシロキサン（ケイ素原子結合水素原子の含有量＝１.５５重量％）０.２重量部、２−メチル−３−ブチン−２−オール０.１重量部、式：
Dimethylsiloxane / methylvinylsiloxane copolymer raw rubber having both ends of the molecular chain blocked with dimethylvinylsiloxy groups and vinyl groups in part of the side chain (plasticity = 136, vinyl group content = 0.04% by weight) ) and 25.6 parts by weight, (CH 3) 3 consists SiO 1/2 units and SiO 4/2 units, the molar ratio of (CH 3) 3 SiO 1/2 units to SiO 4/2 units is 0.8 Methyl hydrogen polysiloxane (silicon atom-bonded hydrogen atom) having 54.6 parts by weight of a diluted solution of methylpolysiloxane resin 60% by weight in xylene, having a viscosity of 20 mPa · s, and having both molecular chain ends blocked with trimethylsiloxy groups Content = 1.55% by weight) 0.2 parts by weight, 0.1 parts by weight of 2-methyl-3-butyn-2-ol, formula:
［比較例３］
実施例２において、フェノール変性ジメチルシロキサンを配合しない代わりに芳香族アミノ変性ジメチルシロキサンの配合量を０.３０重量部とした以外は実施例２と同様にしてシリコーン系感圧接着剤を調製した。このシリコーン系感圧接着剤を用いて粘着テープを作製した。この粘着テープの粘着力および再はく離性を評価し、それらの結果を表２に示した。
[Comparative Example 3]
In Example 2, a silicone-based pressure-sensitive adhesive was prepared in the same manner as in Example 2 except that the amount of aromatic amino-modified dimethylsiloxane was 0.30 parts by weight instead of not containing phenol-modified dimethylsiloxane. An adhesive tape was prepared using this silicone-based pressure sensitive adhesive. The adhesive strength and re-peelability of this adhesive tape were evaluated, and the results are shown in Table 2.
［比較例４］
実施例２において、芳香族アミノ変性ジメチルシロキサンを配合しない代わりにフェノール変性ジメチルシロキサンの配合量を０.３０重量部とした以外は実施例２と同様にしてシリコーン系感圧接着剤を調製した。このシリコーン系感圧接着剤を用いて粘着テープを作製した。この粘着テープの粘着力および再はく離性を評価し、それらの結果を表２に示した。
[Comparative Example 4]
In Example 2, a silicone-based pressure-sensitive adhesive was prepared in the same manner as in Example 2 except that the amount of phenol-modified dimethylsiloxane was 0.30 parts by weight instead of not containing aromatic amino-modified dimethylsiloxane. An adhesive tape was prepared using this silicone-based pressure sensitive adhesive. The adhesive strength and re-peelability of this adhesive tape were evaluated, and the results are shown in Table 2.
本発明のシリコーン系感圧接着剤は、高温に曝された後の再はく離性が良好な粘着テープの感圧接着層を形成するのに有用である。また、本発明の粘着テープは、高温に曝された後の再はく離性が良好であることから、電気回路基板のはんだリフロー工程における、熱処理用マスキングテープとして好適である。
The silicone-based pressure-sensitive adhesive of the present invention is useful for forming a pressure-sensitive adhesive layer of a pressure-sensitive adhesive tape having good releasability after being exposed to a high temperature. The pressure-sensitive adhesive tape of the present invention is suitable as a masking tape for heat treatment in a solder reflow process of an electric circuit board because it has good removability after being exposed to a high temperature.
Claims (5)
（Ｂ）一分子中に平均２個以上のケイ素原子結合水素原子を有するオルガノポリシロキサン｛（Ａ）成分中のアルケニル基１モルに対して、本成分中のケイ素原子結合水素原子が０.５〜１５０.０モルとなる量｝、
（Ｃ）フェノール系酸化防止剤および／またはフェノール変性オルガノシロキサン｛（Ａ）成分と（Ｂ）成分の合計１００重量部に対して０.００１〜１０重量部｝、
（Ｄ）芳香族アミン系酸化防止剤および／または平均式：Ｒ 6 b ＳiＯ (4-b)/2
｛式中、Ｒ 6 は置換もしくは非置換の一価炭化水素基、一般式：
（式中、Ｙは単結合、オキシ基、アルキレン基、またはオキシアルキレン基であり、ｃは１または２である。）で示される芳香族アミノ含有基、または一般式：
（式中、Ｙは前記と同じである。）で示される芳香族アミノ含有基であり、但し、一分子中の少なくとも１個のＲ 6 は前記いずれかの芳香族アミノ含有基であり、ｂは１.５〜３.０の範囲内の数である。｝で示される芳香族アミノ変性オルガノシロキサン｛（Ａ）成分と（Ｂ）成分の合計１００重量部に対して０.００１〜１０重量部｝、および
（Ｅ）白金系触媒（本接着剤を硬化させるに十分な量）
から少なくともなるシリコーン系感圧接着剤。 (A) (a) a raw rubber-like organopolysiloxane having an average of one or more alkenyl groups in one molecule and (b) R 1 3 SiO 1/2 unit (wherein R 1 is a substituted or unsubstituted one) Organopolysiloxane consisting essentially of SiO 4/2 units and having a molar ratio of R 1 3 SiO 1/2 units to SiO 4/2 units of 0.5 to 1.5. A mixture with a resin, or a partial condensation reaction product thereof,
(B) Organopolysiloxane having an average of 2 or more silicon-bonded hydrogen atoms in one molecule {the amount of silicon-bonded hydrogen atoms in this component is 0.5 with respect to 1 mol of the alkenyl group in component (A). To an amount of ˜150.0 mol},
(C) a phenolic antioxidant and / or a phenol-modified organosiloxane {0.001 to 10 parts by weight with respect to 100 parts by weight of the total of the components (A) and (B)},
(D) Aromatic amine antioxidant and / or average formula: R 6 b SiO (4-b) / 2
{Wherein R 6 is a substituted or unsubstituted monovalent hydrocarbon group, general formula:
(Wherein Y is a single bond, an oxy group, an alkylene group, or an oxyalkylene group, and c is 1 or 2), or a general formula:
(Wherein Y is the same as defined above), provided that at least one R 6 in one molecule is any of the above aromatic amino-containing groups, b Is a number in the range of 1.5 to 3.0. } {0.001 to 10 parts by weight with respect to 100 parts by weight of the total of the components (A) and (B)}, and (E) a platinum-based catalyst (curing the adhesive) Enough)
A silicone-based pressure-sensitive adhesive comprising at least
｛式中、Ｒ3は、置換もしくは非置換の一価炭化水素基、一般式：
（式中、Ｒ4、Ｒ5は同じかまたは異なる炭素数１〜１０の直鎖状または分枝状のアルキル基であり、Ｘは単結合、オキシ基、アルキレン基、オキシアルキレン基、またはアルキレンカルボニルオキシアルキレン基である。）で示されるヒドロキシフェニル含有基、または一般式：
（式中、Ｒ4、Ｒ5、およびＸは前記と同じである。）で示されるヒドロキシフェニル含有基であり、但し、一分子中の少なくとも１個のＲ3は前記いずれかのヒドロキシフェニル含有基であり、ａは１.５〜３.０の範囲内の数である。｝で示されることを特徴とする、請求項１記載のシリコーン系感圧接着剤。 The phenol-modified organosiloxane (C) has an average formula: R 3 a SiO (4-a) / 2
{Wherein R 3 represents a substituted or unsubstituted monovalent hydrocarbon group, a general formula:
(In the formula, R 4 and R 5 are the same or different linear or branched alkyl groups having 1 to 10 carbon atoms, and X is a single bond, an oxy group, an alkylene group, an oxyalkylene group, or an alkylene group. A carbonyloxyalkylene group), or a hydroxyphenyl-containing group represented by the general formula:
(Wherein R 4 , R 5 , and X are as defined above), provided that at least one R 3 in one molecule contains any of the above-mentioned hydroxyphenyl groups. A is a number in the range of 1.5 to 3.0. The silicone-based pressure-sensitive adhesive according to claim 1, wherein
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004197477A JP4619710B2 (en) | 2004-07-02 | 2004-07-02 | Silicone pressure sensitive adhesive and adhesive tape |
| US11/571,404 US7799433B2 (en) | 2004-07-02 | 2005-06-20 | Silicone-based pressure-sensitive adhesive and adhesive tape |
| PCT/JP2005/011685 WO2006003853A2 (en) | 2004-07-02 | 2005-06-20 | Silicone-based pressure-sensitive adhesive and adhesive tape |
| CN200580021769A CN100577765C (en) | 2004-07-02 | 2005-06-20 | Polysiloxanes-based pressure-sensitive adhesive and adhesive tape |
| TW94121314A TWI390002B (en) | 2004-07-02 | 2005-06-24 | Silicone-based pressure-sensitive adhesive and adhesive tape |
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| JP2004197477A JP4619710B2 (en) | 2004-07-02 | 2004-07-02 | Silicone pressure sensitive adhesive and adhesive tape |
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| JP2006016555A JP2006016555A (en) | 2006-01-19 |
| JP4619710B2 true JP4619710B2 (en) | 2011-01-26 |
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| US (1) | US7799433B2 (en) |
| JP (1) | JP4619710B2 (en) |
| CN (1) | CN100577765C (en) |
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| JP4505645B2 (en) * | 2006-02-17 | 2010-07-21 | フジコピアン株式会社 | Affixing the fixed sheet |
| JP4505646B2 (en) * | 2006-02-20 | 2010-07-21 | フジコピアン株式会社 | Fixed sheet |
| JP4505649B2 (en) * | 2006-03-23 | 2010-07-21 | フジコピアン株式会社 | Fixed sheet |
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2005
- 2005-06-20 CN CN200580021769A patent/CN100577765C/en not_active Expired - Fee Related
- 2005-06-20 WO PCT/JP2005/011685 patent/WO2006003853A2/en active Application Filing
- 2005-06-20 US US11/571,404 patent/US7799433B2/en active Active
- 2005-06-24 TW TW94121314A patent/TWI390002B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322886A (en) * | 1986-07-15 | 1988-01-30 | Toray Silicone Co Ltd | Silicone pressure-sensitive adhesive composition |
| JPH06256657A (en) * | 1992-07-09 | 1994-09-13 | Minnesota Mining & Mfg Co <3M> | Storage stable silicone composition |
| JPH09118871A (en) * | 1995-10-24 | 1997-05-06 | Toray Dow Corning Silicone Co Ltd | Organopolysiloxane for silicone pressure-sensitive adhesive and silicone pressure-sensitive adhesive |
| JP2005023300A (en) * | 2003-06-13 | 2005-01-27 | Dow Corning Toray Silicone Co Ltd | Silicone-based pressure sensitive-adhesive and adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070299216A1 (en) | 2007-12-27 |
| US7799433B2 (en) | 2010-09-21 |
| TWI390002B (en) | 2013-03-21 |
| CN100577765C (en) | 2010-01-06 |
| WO2006003853A3 (en) | 2006-03-30 |
| JP2006016555A (en) | 2006-01-19 |
| CN1977019A (en) | 2007-06-06 |
| TW200613499A (en) | 2006-05-01 |
| WO2006003853A2 (en) | 2006-01-12 |
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