JP4602695B2 - Electronic seal - Google Patents

Description

  The present invention relates to an electronic seal seal, and more particularly, to an electronic seal seal that prevents fraud such as concealing the fact that it has been opened by detecting the fact that it has been reliably opened.

  Conventionally, this type of electronic seal seal does not exist. Machines such as important documents and computers are sealed. The seal is formed in such a manner that when the seal opening is opened by attaching a seal seal to the opening / closing port, the sealing seal is broken or the like. Therefore, it is determined whether or not the opening / closing port of the object is opened based on whether or not the seal seal is broken. That is, if the seal seal is broken, it is determined that the opening / closing port of the object has been opened. If the sealing seal is not broken, it is determined that the sealed state of the object is maintained.

  As described in the background art above, conventionally, it is determined whether or not the opening / closing opening has been opened by sticking a sealing seal to the opening / closing opening of an object to be sealed and whether or not the sealing seal is damaged. It was. However, by carefully peeling the sealed seal from the object without damaging it, stealing the information of the stored documents, or falsifying the property, and then sticking the sealed seal to the opening / closing port again There is a defect that fraud such as leakage of information and falsification of property cannot be found.

  Furthermore, since the seal seal may be counterfeited, after the seal seal is peeled off and the document or property is fraudulent, the fraud is detected by sealing the opening and closing with a new counterfeit seal seal. There is also the problem of being unable to do so.

  For example, in a pachinko game machine or the like, a ROM for controlling the game machine is attached, and a seal seal is attached to the ROM. However, after the seal sticker is peeled off, the ROM is changed and the game device is tampered with, and if the fraud to stick the seal sticker is made again, there is a problem that the fraud cannot be found. ing.

  Therefore, it is possible to prevent forgery of the seal and to detect the opening of the opening of the sealed object that is sealing the document or property, and to prevent the leakage of the information on the document or the alteration of the property. The technical problem which should arise arises, and this invention aims at solving this subject.

The present invention has been proposed to achieve the above object, and the invention according to claim 1 is characterized in that a coil is formed on the back surface of a film-like or sheet-like insulating substrate, and the insulating substrate is provided. by forming to face the capacitor patterns on both surfaces, the capacitor is formed through the insulating substrate, a seal sealing the resonant circuit is provided between said coil and said capacitor, said seal seal is arranged in the form of a wiring pattern for connecting between the side electrode pattern and said coil of said capacitor formed on the same side or the opposite side of said coil circulates around the該片side electrode pattern, and, the wiring pattern has a zigzag regularly bent shape, further, the insulating is disposed on the back surface of the base material coil and one capacitor pattern and a coil and a capacitor A wiring pattern for connecting the turn is adhered to the insulating base material with an adhesive, and the back surface of the insulating base material, the coil, the capacitor pattern, and the coil and the capacitor pattern are connected. in the state where strong adhesive or pressure-sensitive adhesive than the adhesive force of the adhesive to the back surface of the wiring pattern has is applied, the seal object of the encapsulating indicia seal after bonded to seal the object of encapsulating indicia seal by remaining in the sealed object more exfoliated portion of the wiring pattern or in whole adheres during the cutting or the coil young properly of the wiring pattern is cut at the boundary between the該片side electrode pattern of the capacitor And the coil and the capacitor are electrically separated, and the resonance circuit is destroyed. An electronic seal seal is provided.

And invention of Claim 2 forms a coil in the back surface of a film-like or sheet-like insulating base material, and forms a capacitor pattern opposite to both sides of the insulating base material, capacitor is configured through the insulating substrate, a seal sealing the resonant circuit is provided between said coil and said capacitor, encapsulating indicia seal formed on the same side or the opposite side of said coil A wiring pattern that connects between the one-side electrode pattern of the capacitor and the coil is arranged around the one-side electrode pattern and the coil , and the wiring pattern has a zigzag regularly bent shape. has further, and a wiring pattern for connecting the coil and the one disposed on the back surface of the insulating substrate capacitor patterns and the coil and the capacitor pattern Attached to the insulating base material with an adhesive, and on the back surface of the insulating base material, the coil, the capacitor pattern, and the back surface of the wiring pattern connecting the coil and the capacitor pattern After applying the sealing seal to the object to be sealed in a state where an adhesive or pressure-sensitive adhesive stronger than the adhesive strength of the adhesive is applied, the wiring pattern of the wiring pattern is peeled off when the sealing seal is peeled off from the object to be sealed . by partially or entirely adhered remain in the sealed object, cutting or the coil young properly of the wiring pattern occurs cleavage at the interface between the該片side electrode pattern of the capacitor, the electrical coil and capacitor The electronic seal seal is provided so that the resonance circuit is broken.

Furthermore, the invention described in claim 3 is such that a coil is formed on the back surface of a film-like or sheet-like insulating base material, and a capacitor pattern is formed opposite to both sides of the insulating base material. A sealing seal in which a capacitor is configured through the insulating base material, and a resonance circuit is provided by the coil and the capacitor, the sealing seal being divided on both sides of the coil by the capacitor. disposed Te, are arranged in the form of circling around each該片side electrode wiring pattern is divided for connecting the side electrodes and the coil on the same side or the opposite side of said capacitor and said coil, and, wherein wiring pattern has a zigzag-shaped regularly bent shape, further, the coil and one of the capacitor patterns and the coil and the capacitor path disposed on the back surface of the insulating substrate And a wiring pattern for connecting the wire to the insulating base material with an adhesive, and connecting the back surface of the insulating base material, the coil, the capacitor pattern, and the coil to the capacitor pattern. in state where strong adhesive or pressure-sensitive adhesive than the adhesive force of the adhesive to the back surface of the wiring patterns is coated, the sealing target encapsulating indicia seal after bonded to seal the object of encapsulating indicia seal by part of the wiring pattern when peeled from the object or in all adheres remain in the sealed object, occurs cleavage at the interface between the該片side electrode pattern of cutting or the coil or the capacitor of the wiring pattern The electronic seal seal is characterized in that the coil and the capacitor are electrically separated to destroy the resonance circuit.

  According to the first aspect of the present invention, a resonant circuit composed of a coil and a capacitor is formed on a film-like or sheet-like insulating base material, and the one-side electrode of the capacitor formed on the same side or the opposite side of the coil pattern An electronic seal seal is configured by forming a wiring pattern connecting the pattern and the coil pattern so as to have a complicated bent shape. Then, when the adhesive or adhesive is applied to the wiring pattern side, and the sealing seal is attached to the sealed object, and then the sealing seal is peeled off from the object, the wiring pattern portion is intricately bent By virtue of the adhesive force of the electronic seal seal or the hooking force to the electronic seal seal, the wiring pattern portion easily peels off from the insulating substrate and adheres to the object, and the resonance circuit Destroyed. For this reason, since the resonance circuit of the electronic seal seal does not resonate with a predetermined radio wave transmitted by the scanner, the resonance circuit is not recognized.

  Therefore, when the resonance circuit is recognized by the scanner, it is determined that the electronic seal seal is not peeled off from the sealed object. On the other hand, when the resonance circuit is not recognized by the scanner, the sealed object is determined. Further, since it can be determined that the electronic seal seal has been peeled off and opened, there is an advantage that it is possible to reliably detect whether the sealed object has been opened, and to prevent leakage of information and tampering of the property due to unauthorized opening. Furthermore, forgery of the electronic seal seal can be prevented by changing the resonance frequency of the resonance circuit of the electronic seal seal.

First aspect of the present invention, to form a resonant circuit consisting of coil and capacitor insulating substrate, and one side electrode pattern and said coil of said capacitor formed on the same side or the opposite side of said coil A wiring pattern that connects the electrodes is arranged so as to circulate around the one-side electrode, and the wiring pattern is formed so as to have a complicatedly bent shape (a zigzag regularly bent shape). It constitutes a seal. When the encapsulating indicia seal was peeled from the sealed object after bonding the encapsulating indicia seal sealing the object by complicatedly bent shape of the wiring pattern (zigzag regularly bent shape), the electronic seal Combined with the adhesive force of the seal or the hooking force with respect to the electronic seal seal, the wiring pattern is easily peeled off from the insulating substrate, and the resonance circuit is destroyed.

  Accordingly, it is possible to recognize whether or not the resonance circuit is operated by the scanner, and to prevent information leakage and property alteration due to unauthorized opening of the sealed object. Furthermore, since the wiring pattern is arranged around the capacitor electrode, the wiring pattern is cut even when the sealing seal is peeled off from any direction, so that it is possible to more reliably recognize the opening of the sealed object. .

According to a second aspect of the invention, to form a resonant circuit consisting of coil and capacitor insulating substrate, and one side electrode pattern and said coil of said capacitor formed on the same side or the opposite side of said coil wiring pattern for connecting between are arranged in the form of revolving around the該片side electrode and said coil, and, as the wiring pattern having a complicated bent shape (zigzag regularly bent shape) An electronic seal seal is formed. When the encapsulating indicia seal was peeled from the sealed object after bonding the encapsulating indicia seal sealing the object by complicatedly bent shape of the wiring pattern (zigzag regularly bent shape), the electronic seal Combined with the adhesive force of the seal or the hooking force with respect to the electronic seal seal, the wiring pattern is easily peeled off from the insulating substrate, and the resonance circuit is destroyed.

  Accordingly, it is possible to recognize whether or not the resonance circuit is operated by the scanner, and to prevent information leakage and property alteration due to unauthorized opening of the sealed object. Furthermore, since the wiring pattern is arranged around the capacitor electrode and the coil pattern, the wiring pattern is cut regardless of the direction around the sealing seal from which the sealing seal is peeled off. Can be recognized.

According to a third aspect of the invention, to form a resonant circuit consisting of coil and capacitor insulating substrate, and, the capacitor is arranged on both sides of the coil, formed on the same side or the opposite side of said coil are arranged in the form has been both sides of one side electrode pattern and a wiring pattern for connecting between the coil of each said capacitor to move around on both sides of該片side electrode and said coil, and, is complicated wiring pattern An electronic seal seal is formed by forming a bent shape (a zigzag regularly bent shape). When the encapsulating indicia seal was peeled from the sealed object after bonding the encapsulating indicia seal sealing the object, the electronic seal sealed by complicatedly bent shape of the wiring pattern (zigzag regularly bent shape) In combination with the adhesive force or the pulling force on the electronic seal seal, the wiring pattern is easily peeled off from the insulating substrate, and the resonance circuit is destroyed.

  Accordingly, it is possible to recognize whether or not the resonance circuit is operated by the scanner, and to prevent information leakage and property alteration due to unauthorized opening of the sealed object. Furthermore, since the wiring pattern is arranged around each capacitor electrode and the coil pattern, the wiring pattern is cut regardless of the direction around the sealing seal from which the sealing seal is peeled off. Recognition of opening is possible.

  The present invention is an electronic seal seal that prevents unauthorized opening, and connects a film-like or sheet-like insulating base material, a coil and a capacitor formed of a metal thin film on the insulating base material, and both The resonant circuit is composed of a wiring pattern for the purpose of preventing unauthorized opening.The purpose is to destroy the resonant circuit when the electronic seal seal is peeled off. Achieved by enabling confirmation of unauthorized opening.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 is a plan view seen from the back side of the electronic seal seal 1 of the present invention, and FIG. 2 is a cross-sectional view of the electronic seal seal 1. The electronic seal seal 1 includes a coil 3 formed of a metal thin film on the back surface of a film-like or sheet-like insulating base 2, one capacitor pattern 4, and a wiring pattern 5 connecting the coil 3 and the capacitor pattern 4. Is attached with an adhesive 6. Further, the wiring pattern 5 is arranged so that the wiring length is increased by taking a zigzag bent shape. In this embodiment, the capacitor pattern 4 is disposed on the right side of the insulating substrate 2 and the coil 3 is mounted on the left side of the capacitor pattern 4. However, the present invention is limited to this. There is no.

  Furthermore, the other capacitor pattern 7 is adhered to the surface of the insulating substrate 2 with an adhesive 8 using a metal thin film similar to the capacitor pattern 4. The capacitor pattern 4 is disposed so as to face the insulating substrate 2 through the insulating substrate 2.

  The other capacitor pattern 7 is connected to an extending portion 9 extending leftward from the capacitor pattern 7. Furthermore, the end of the extended portion 9 is connected to the other end of the coil 3 by a connector 10. Therefore, the one capacitor pattern 4 and the other capacitor pattern 7 are electrically connected via the coil 3, so that the capacitor pattern 4 and the capacitor pattern 7 constitute a capacitor 11 and a resonance circuit is formed on the insulating substrate 2. 12 is provided. The extended portion 9 is adhered to the insulating substrate 2 with an adhesive 8 in the same manner as the capacitor pattern 7.

  On the other hand, an adhesive 13 is applied to the back surface of the insulating base 2 and the back surface of the capacitor pattern 4 and the wiring pattern 5 connecting the coil pattern 3 and the capacitor pattern 4, and the electronic seal seal It is formed so that it can be affixed to the opening / closing port of the object to be sealed. Further, the pressure-sensitive adhesive 13 has a stronger adhesive force than the adhesive 6 that adheres the coil 3, the capacitor pattern 4, the wiring pattern 5, and the insulating substrate 2 on the back surface. The upper surface of the electronic seal seal 1 is covered with a surface protective paper 14.

  As shown in FIG. 3, the electronic seal seal 1 configured in this way is attached to a sealed object 15. Then, by transmitting a radio wave having the same frequency as the resonance frequency of the resonance circuit 12 of the electronic seal seal 1 from the transmission unit 17 of the scanner 16, the resonance circuit 12 resonates to induce the radio wave. 12 transmits radio waves of the same frequency. Further, the radio wave transmitted from the resonance circuit 12 is received by the receiving unit 18 of the scanner 16, and the control unit 19 recognizes the transmitted radio wave. At this time, since it is recognized that the electronic seal seal 1 has not been peeled off, it can be confirmed that the opening / closing port of the sealed object 15 is held in a sealed state.

  On the other hand, when the electronic seal seal 1 is removed from the object 15, the adhesion that bonds the object 15 to the coil pattern 3, the capacitor pattern 4, and the wiring pattern 5 formed on the back surface of the insulating substrate 2. Since the agent 13 has a stronger adhesive force than the adhesive 6 that adheres the coil pattern 3, the capacitor pattern 4, and the wiring pattern 5 to the insulating substrate 2, the coil pattern 3 and the capacitor pattern 4 and the wiring pattern 5 are peeled off from the insulating substrate 2 and remain on the object 15. Therefore, the resonance circuit 12 is cut and destroyed at at least one of the zigzag bent portions of the coil pattern 3, the capacitor pattern 4, or the wiring pattern 5. In particular, the area of the portion bonded to the object 15 with the adhesive 13 is increased by making the shape of the wiring pattern 5 complicated, and these are peeled off more reliably, and the resonance circuit is destroyed.

  Thus, even when a resonance wave is transmitted from the scanner 16, no resonance wave is transmitted from the resonance circuit 12, and it can be confirmed that the electronic seal seal 1 has been opened. Therefore, it is possible to confirm the opening of the object 15 with certainty. On the other hand, since the resonance circuit 12 can change the resonance frequency by changing the number of turns of the coil 3 or the area of the capacitor, forgery of the electronic seal seal 1 can be prevented.

  4 and 5 show another embodiment. The structure of the electronic seal seal 20 is substantially the same as the structure shown in FIGS. 1 and 2, and a resonance circuit is constituted by the capacitor 30 formed by the coil pattern 22 and the capacitor patterns 23 and 26. Further, the wiring pattern 24 that connects the coil pattern 22 and the capacitor pattern 23 has not only a zigzag bent shape but also an uneven structure. Accordingly, as in the embodiment of FIGS. 1 and 2, when the electronic seal seal 20 is attached to the sealing object 15 and then the electronic sealing seal 20 is removed from the sealing object 15, insulation is performed. Since the adhesive force of the adhesive 25 of the coil pattern 22 and the capacitor pattern 23 and the wiring pattern 24 that are bonded to the conductive substrate 21 is weaker than the adhesive 32 that bonds the electronic seal seal 20 to the object 15, At least one of the coil pattern 22, the capacitor pattern 23, or the wiring pattern 24 is peeled off and remains on the object 15, and the resonance circuit 31 is connected to the coil pattern 22, the capacitor pattern 23, or the wiring pattern 24. The resonance circuit 31 is destroyed by cutting at least one of the above. Therefore, the electronic seal seal 20 can be expected to have the same effect as the electronic seal seal 1.

  Further, in the electronic seal seal 20, the wiring pattern 24 connecting the coil pattern 22 and the capacitor pattern 23 has not only a zigzag bent shape, but also has irregularities, so that the wiring pattern is It has a structure that is more easily cut when peeled. For this reason, in addition to the effect of the electronic seal seal 1, the more reliable opening of the electronic seal seal 20 can be detected. Accordingly, it is possible to prevent information leakage or falsification due to unauthorized opening.

  6 and 7 show still another embodiment. In the figure, a coil 36 formed of a metal thin film and one capacitor pattern 37 are attached to the surface of an insulating base material 35 of an electronic seal seal 34 with an adhesive 38, and one end of the coil 36 is attached. The portion is connected to an extending portion 39 extending leftward from the capacitor pattern 37. Further, the other capacitor pattern 40 is adhered to the back surface of the insulating substrate 35 with an adhesive 41 in the same manner as the capacitor pattern 37 with a metal thin film. It is arranged to face the one capacitor pattern 37 with the conductive substrate 35 interposed therebetween.

The other capacitor pattern 40 is connected to a wiring pattern 42 having a zigzag bent shape, and the end of the wiring pattern 42 opposite to the side connected to the capacitor pattern 40 is connected to the wiring pattern 42 via a connector 43. The other end of the coil pattern 36 is connected. The wiring pattern 42 is arranged in a shape that circulates around the capacitor pattern 40 so as to ensure a wider bonding area.

  Accordingly, since the one capacitor pattern 37 and the other capacitor 40 are electrically connected via the coil 36 and the wiring pattern 42, the capacitor patterns 37 and 40 constitute a capacitor 44 to form the insulating substrate. A resonance circuit 45 is provided on the material 35.

  On the other hand, an adhesive 46 is applied to the back surface of the insulating substrate 35 and the back surface of the other capacitor pattern 40 and the wiring pattern 42 so that the electronic seal seal 34 can be attached to the opening / closing port of the object to be sealed. Has been. Further, the pressure-sensitive adhesive 46 has a stronger adhesive force than the adhesive 41 that adheres the other capacitor 40 and the wiring pattern 42 to the insulating substrate 35. The upper surface of the electronic seal seal 34 is covered with a surface protective paper 47.

  Accordingly, as in the embodiment of FIGS. 1 and 2, after the electronic seal seal 34 is attached to the sealed object 15, the electronic seal seal 34 is removed from the sealed object 15 when the electronic seal seal 34 is removed. Since the adhesive force of the adhesive 41 of the other capacitor pattern 40 and the wiring pattern 42 to the insulating base 35 is weak, the other capacitor 40 and the wiring pattern 42 are peeled off from the insulating base 35 and the target The resonance circuit 45 remains on the object 15 and is cut at the other capacitor pattern 40 or wiring pattern 42, and the resonance circuit is destroyed. Thus, the electronic seal seal 34 can be expected to have the same effect as the electronic seal seal.

  8 and 9 show still another embodiment. A coil pattern 50 is provided in the central portion of the insulating base material 49 of the electronic seal seal 48, and capacitor patterns 51 and 52 are disposed on both sides of the coil pattern 50 and adhered with an adhesive 53. The end of the capacitor pattern 51 is connected to one end of the coil pattern 50 by a wiring pattern 57. The wiring pattern 57 has a zigzag bent shape, and is arranged in a shape that circulates around the capacitor patterns 51 and 52. Further, the end portion of the capacitor pattern 51 and the end portion of the capacitor pattern 52 are connected by a connection pattern 61 via connectors 58 and 59. In addition, a capacitor pattern 54 and a capacitor pattern 55 are disposed on the surface of the insulating substrate 49 so as to face each other, and both the capacitor patterns 54 and 55 are extended portions. Connected at 62 and attached with an adhesive 56. On the other hand, a resonance circuit 65 is configured by being connected by a connector 60 at the other end of the coil 50 at the center of the extended portion 62. Further, an adhesive 66 is applied to the back surface of the insulating base 49, the back surfaces of the capacitor patterns 51 and 52, and the back surface of the wiring pattern 57 to form an electronic seal seal 48.

  The adhesive 66 has a stronger adhesive force than the adhesive 53 that adheres the capacitor patterns 51 and 52 and the wiring pattern 57 and the insulating base material 49. The upper surface of the electronic seal seal 48 is covered with a surface protective paper 67.

  Accordingly, as in the embodiment of FIGS. 1 and 2, when the electronic seal seal 48 is attached to the sealed object 15 and then removed from the sealed object 15, Since the adhesive force of the adhesive 53 that bonds the insulating substrate 49 to the capacitor patterns 51 and 52 and the wiring pattern 57 is weak, the capacitor patterns 51 and 52 and the wiring pattern 57 are peeled off and the object is removed. 15 and the resonance circuit 65 is broken because at least one of the capacitor 51 or 52 or the wiring pattern 57 is cut off. Thus, the electronic seal seal 48 can be expected to have the same effect as the electronic seal seal 1.

  Further, since the electronic seal seal 48 is arranged in such a manner that the wiring pattern 57 circulates around the capacitor patterns 51 and 52, the electronic seal seal 48 can be effectively wired regardless of whether the electronic seal seal 48 is peeled off from the left or right direction. Since the pattern 57 can be expected to be peeled off, reliable opening detection can be performed regardless of the peeling direction.

  10 and 11 show still another embodiment. A coil 70 formed of a metal thin film on the back surface of the insulating base 69 of the electronic seal seal 68 and one capacitor pattern 71 and a wiring pattern 72 connecting one end of the coil 70 and the one capacitor pattern 71. Are attached with an adhesive 73. The wiring pattern 72 is arranged around the coil pattern 70 and the one capacitor pattern 71.

  Further, on the surface of the insulating substrate 69, the other capacitor pattern 74 is attached with an adhesive 75 using a metal thin film similar to the capacitor pattern 71, and the other capacitor pattern 74 is The capacitor pattern 71 is disposed opposite to the capacitor pattern 71 with an insulating base 69 interposed therebetween. The other capacitor pattern 74 is connected to an extending portion 76 extending in the center direction from the capacitor pattern 74. Further, the end of the extended portion 76 is connected to the other end of the coil 70 by a connector 77. Accordingly, the one capacitor pattern 71 and the other capacitor pattern 74 are electrically connected via the coil pattern 70, so that a capacitor is formed by the capacitor patterns 71 and 74, and a resonance circuit 79 is formed on the insulating substrate 69. Is provided. The extended portion 76 is attached to the insulating substrate 69 with an adhesive 75 in the same manner as the capacitor pattern 74.

  On the other hand, an adhesive 80 is applied to the back surface of the insulating substrate 69 and the back surface of the one capacitor pattern 71 and the wiring pattern 72 so that the electronic seal seal 68 can be attached to the opening / closing port of the object to be sealed. Has been. Further, the pressure-sensitive adhesive 80 has a stronger adhesive force than the adhesive 73 that adheres one capacitor pattern 71 and the wiring pattern 72 to the insulating substrate. The upper surface of the electronic seal seal 68 is covered with a surface protective paper 81.

  Accordingly, as in the embodiment of FIGS. 1 and 2, after the electronic seal seal 68 is attached to the sealed object 15, the electronic seal seal 68 is removed from the sealed object 15 when the electronic seal seal 68 is removed. Since the adhesive force of the adhesive 73 of the one capacitor pattern 71 and the wiring pattern 72 to the insulating substrate 69 is weak, the one capacitor pattern 71 and the wiring pattern 72 are peeled off from the insulating substrate 69, and the While remaining on the object 15, the resonance circuit 79 is cut at one capacitor pattern 71 or wiring pattern 72, and the resonance circuit 79 is destroyed. Thus, the electronic seal seal 68 can be expected to have the same effect as the electronic seal seal.

  12, 13 and 14 show still another embodiment. The electronic seal seal 82 shown in FIG. 12 has the same structure as the electronic seal seal in which the coil pattern shown in the embodiment of FIGS. 1, 4 and 6 is on one end. However, in the electronic seal seal, an adhesive was applied to the entire surface on the side to be adhered to the object 15, and the entire surface was adhered to the object 15. The electronic seal seal of this embodiment is constituted by a resonance circuit, and detects the seal seal by reacting to the radio wave from the scanner 16. Therefore, when the material of the object 15 to be sealed is metal, the radio wave is shielded, so that the resonance circuit does not operate and thus does not function as an electronic seal seal. 12 and 13, the coil pattern 83 is not adhered to the object 15 by covering both surfaces of the coil pattern portion 83 with the surface protection paper 84. That is, after the adhesive 85 is applied to the back surface of the electronic seal seal 82, the adhesive 85 is covered with the surface protective paper by covering the coil pattern portion 83 with the surface protective paper 84. The part 83 does not stick to the object.

  On the other hand, since the adhesive 85 is applied to places other than the coil portion, it can be attached to the object 15. FIG. 14 shows a case where the electronic seal seal 82 is attached to a metal sealing object 85. Since the coil pattern 83 of the electronic seal seal is located away from the object 85, the transmission radio wave from the scanner 16 and the response radio wave from the coil pattern 85 are not shielded. The response can be detected normally. As described above, the electronic seal seal 82 has an effect that can be applied to the case where the material of the sealing object 15 is not only paper, wood, plastic, but also metal, in addition to the effects similar to those of the electronic seal seal. is doing.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The top view which showed the Example of this invention and was seen from the back surface of the electronic seal seal. The longitudinal cross-sectional view of the electronic seal seal | sticker of FIG. Circuit block diagram of the scanner The top view which showed the other Example of this invention and was seen from the back surface of the electronic seal seal. The longitudinal cross-sectional view of the electronic seal seal | sticker of FIG. The top view which showed the other Example of this invention and was seen from the back surface of the electronic seal seal. The longitudinal cross-sectional view of the electronic seal seal | sticker of FIG. The top view which showed the other Example of this invention and was seen from the back surface of the electronic seal seal. The longitudinal cross-sectional view of the electronic seal seal | sticker of FIG. The top view which showed the other Example of this invention and was seen from the back surface of the electronic seal seal. The longitudinal cross-sectional view of the electronic seal seal | sticker of FIG. The top view which showed the other Example of this invention and was seen from the back surface of the electronic seal seal main-body part. Sectional drawing which shows a mode that the coil part of the electronic seal seal | sticker of FIG. 12 is coat | covered. The perspective view which shows a state when the electronic seal seal | sticker of FIG. 13 is stuck on the metallic object.

Explanation of symbols

1, 20, 34, 48, 68, 82 Electronic seal seal 2, 21, 35, 49, 69 Insulating base material 3, 22, 36, 50, 70, 83 Coils 4, 7, 23, 25, 37, 40 Capacitor pattern 5, 24, 42, 57, 72 Wiring pattern 6, 25, 41, 53, 73 Adhesive 13, 32, 46, 66, 80, 85 Adhesive 12, 31, 45, 65, 79 Resonant circuit 51, 52, 54, 55, 71, 74 Capacitor pattern

Claims (3)

By forming a coil on the back surface of a film-like or sheet-like insulating base material and forming a capacitor pattern on both the front and back surfaces of the insulating base material, a capacitor can be connected via the insulating base material. is constructed, a seal sealing the resonant circuit is provided between said coil and said capacitor, encapsulating mark seals and side electrode pattern and said coil of said capacitor formed on the same side or the opposite side of said coil They are arranged in the form of a wiring pattern for connecting the orbiting around該片side electrode pattern, and has the wiring pattern has a zigzag regularly bent shape, further, the insulating substrate A coil disposed on the back surface of the capacitor and one capacitor pattern and a wiring pattern connecting the coil and the capacitor pattern are adhered to the insulating substrate with an adhesive, and Strong adhesive or pressure-sensitive adhesive than the adhesive force of the adhesive to the back surface of the wiring pattern is connected to the rear surface and the coil and the capacitor pattern and the coil of the insulating base and the capacitor pattern is applied in the state, by remaining in the sealed object part or all of adhering the wiring pattern when the encapsulating indicia seal was peeled from the sealed object after bonded to seal the object of encapsulating indicia seal, cutting or the coil young properly of the wiring pattern occurs cleavage at the interface between the該片side electrode pattern of the capacitor, a coil and a capacitor are electrically separated, said resonant circuit is configured to be destroyed Features an electronic seal. By forming a coil on the back surface of a film-like or sheet-like insulating base material and forming a capacitor pattern on both the front and back surfaces of the insulating base material, a capacitor can be connected via the insulating base material. is constructed, a seal sealing the resonant circuit is provided between said coil and said capacitor, encapsulating indicia seal the side electrode pattern and the coil of the capacitor formed on the same side or the opposite side of said coil A wiring pattern connecting between the electrodes is arranged around the one-side electrode pattern and the coil, and the wiring pattern has a zigzag regularly bent shape ; A coil disposed on the back surface of the substrate, one capacitor pattern, and a wiring pattern connecting the coil and the capacitor pattern are adhered to the insulating substrate with an adhesive. And, the back surface and the coil and the capacitor pattern and said coil a strong adhesive or adhesive than the adhesive force of the adhesive to the back surface of the wiring pattern the connects the capacitor pattern of the insulating substrate in a state in which agent is applied, after bonded to seal the object of encapsulating indicia seal, the seal object of the encapsulating mark seal adhered part or all of the wiring pattern when peeled from the sealed object by remaining in, cut or the coil young properly of the wiring pattern occurs cleavage at the interface between the該片side electrode pattern of the capacitor, a coil and a capacitor is electrically isolated, the resonant circuit is destroyed An electronic seal seal characterized by being configured as described above. By forming a coil on the back surface of a film-like or sheet-like insulating base material and forming a capacitor pattern on both the front and back surfaces of the insulating base material, a capacitor can be connected via the insulating base material. is constructed, a seal sealing the resonant circuit is provided between said coil and said capacitor, encapsulating indicia seal is disposed the capacitor is divided on both sides of the coil, the same side or with the coil The wiring pattern connecting the one-side electrode of the capacitor on the opposite side and the coil is arranged around each of the divided one-side electrodes, and the wiring pattern is regularly bent in a zigzag shape. has a shape, further, is a wiring pattern for connecting the coil and the one disposed on the back surface of the insulating substrate capacitor patterns and the coil and the capacitor pattern Chakuzai is adhered to the insulating substrate by, and said each back surface of the wiring pattern which connects the back surface of the insulating substrate and the coil and the capacitor pattern and the coil and the capacitor pattern in a state in which a strong adhesive than the adhesive strength of the adhesive or pressure-sensitive adhesive is applied, one wiring pattern encapsulating mark seal after bonded to seal the object of encapsulating indicia seal upon peeling from the sealed object part or all attached by remaining in the sealed object, occurs cleavage at the interface between the該片side electrode pattern of cutting or the coil or the capacitor of the wiring pattern, a coil and a capacitor is electrically separated An electronic seal seal, wherein the resonance circuit is destroyed.

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