JP4600246B2 - Optical transceiver module and optical communication device - Google Patents

Description

  The present invention relates to an optical transmission / reception module having a photoelectric conversion function and transmitting / receiving an optical signal, and an optical communication apparatus including the optical transmission / reception module. Specifically, the heat radiation efficiency is improved by providing a heat radiation space forming recess that forms a heat radiation space between the mounting portion and the mounting portion.

  For example, as represented by MSA (Multi Source Agreement) such as XFP (10 Gigabit Small Form Factor Pluggable) and XENPAK (10 Gigabit Ethernet (registered trademark) Transceiver Package), an optical transceiver module with a data transmission speed of 10 Gbps In general, an external component is formed of a metal-based material (see, for example, Patent Document 1).

  FIG. 11 is an exploded perspective view showing an example of the XFP module. The XFP module 101 is mounted on a host board 102 that constitutes a network card. The host board 102 includes a gauge 103 into which the XFP module 101 is inserted and a connector 104 to which the XFP module 101 inserted into the gauge 103 is connected. A heat sink 105 attached to the upper surface of the gauge 103 and a clip 105 a for fixing the heat sink 105 to the gauge 103 are provided.

  Conventionally, the casing, the gauge 103, the heat sink 105, and the clip 105a constituting the exterior of the XFP module 101 are made of a metal material.

  That is, in the case of an optical transmission / reception module that supports high frequencies such as 10 Gbps, for example, in the case of the XFP module 101, the power consumption is as large as about 1.5 W. Heat dissipation efficiency is improved by enabling heat dissipation.

  In addition, in order to increase the heat radiation area, the entire surface of the housing of the optical transceiver module is brought into contact with a substrate such as a host board on which the optical transceiver module is mounted.

  Further, since the signal is transmitted at a high frequency, the casing that covers the module is made of a metal material in order to perform electromagnetic shielding such as EMI and EMC.

JP 2005-196213 A

  In an optical transceiver module compatible with high frequency, an IC chip or the like mounted on a substrate on which the optical transceiver module is mounted may generate more heat than an optical transceiver module. When the amount of heat generated on the substrate side is larger than that of the optical transmission / reception module, the heat on the substrate side is sucked up by the optical transmission / reception module, and the heat dissipation efficiency of the optical transmission / reception module is reduced.

  In addition, since the external component parts of the optical transceiver module are made of a metal material, there is a problem that care is required. In particular, when used as a consumer product, it must be easy to handle.

  The present invention has been made to solve such problems, and an object thereof is to provide an optical transceiver module and an optical communication apparatus that are easy to handle and have improved heat dissipation efficiency.

This onset Ming optical transceiver module includes an optical transmission module for transmitting an optical signal, an optical receiver module for receiving the optical signal, and a circuit board for processing electrical signals, constituted by a metal covering at least the circuit board An external housing made of resin that covers the internal housing, and the external housing forms a heat dissipation space between the mounting portion on which the external housing is mounted. A space forming recess was provided, and the outer casing was provided with a window portion exposing the inner casing at least on the upper surface and the heat radiation space forming recess .

Optical communication device of the present onset Ming, an optical transceiver module for transmitting and receiving optical signals, in the optical communication apparatus having a main substrate on which the optical transceiver module is mounted, the optical transceiver module, the light transmitting the optical signal A transmission module; an optical reception module that receives an optical signal; a circuit board that processes electrical signals ; an internal housing that is made of metal that covers at least the circuit board; and a resin that covers the internal housing. An external housing, and the external housing includes a heat radiation space forming recess that forms a heat radiation space with a mounting portion on which the external housing is mounted, and the external housing includes the internal housing. A window portion for exposing the body was provided at least on the upper surface and the heat radiation space forming recess.

  According to the optical transceiver module of the present invention, the heat radiation space is also formed between the mounting part where the housing is mounted, so that the area in contact with the outside air is increased and the heat radiation efficiency can be improved.

  According to the optical communication apparatus of the present invention, it is possible to improve the heat dissipation efficiency of the optical transmission / reception module by including the above-described optical transmission / reception module. In addition, heat from the substrate side is not easily transmitted to the optical transceiver module, and it is difficult to be affected by heat.

  Embodiments of an optical transceiver module and an optical communication apparatus according to the present invention will be described below with reference to the drawings.

<Example of Configuration of Optical Transmission / Reception Module of First Embodiment>
FIG. 1 is a configuration diagram illustrating an example of an optical transceiver module according to the first embodiment. FIG. 1A is a plan sectional view of the optical transceiver module 1A, and FIG. 1B is an optical diagram illustrated in FIG. It is AA sectional drawing of 1 A of transmission / reception modules.

  The optical transceiver module 1A of the first embodiment includes an optical transmitter module 2 that transmits an optical signal, an optical receiver module 3 that receives an optical signal, a circuit board 4 that processes an electrical signal, and a housing 5. Prepare.

  The optical transmission module 2 is referred to as TOSA (Transmitter Optical SubAssembly). For example, a surface emitting semiconductor laser element and the like, a monitoring photodiode and the like are mounted on the stem portion 2a. The stem portion 2a includes a plurality of leads 2b connected to a semiconductor laser element or the like, and each lead 2b protrudes from the rear surface of the stem portion 2a. In the optical transmission module 2, a fiber support housing 2c having a sleeve for supporting an optical fiber (not shown) and a condenser lens is attached to the stem portion 2a.

  The optical receiving module 3 is referred to as ROSA (Receiver Optical SubAssembly). For example, a photodiode or the like is mounted on the stem portion 3a. The stem portion 3a includes a plurality of leads 3b connected to the photodiode, and each lead 3b protrudes from the rear surface of the stem portion 3a. In the optical receiver module 3, a sleeve for supporting an optical fiber (not shown) and a fiber support housing 3c having a condenser lens and the like are attached to the stem portion 3a.

  The circuit board 4 includes a rigid board 6 and flexible boards 7a to 7c. For example, the circuit board 4 is a flex rigid board in which the rigid board 6 and the flexible boards 7a to 7c are integrally formed. The circuit board 4 may have a configuration in which the flexible boards 7a to 7c are connected to the rigid board 6 by soldering.

  The circuit board 4 includes two flexible boards 7 a and 7 b which are first flexible boards corresponding to the optical transmission module 2 and the optical reception module 3 on one end side of the rigid board 6. In addition, a flexible substrate 7c, which is a second flexible substrate connected to a host board or the like to be described later, is provided on the other end side of the rigid substrate 6.

  The rigid substrate 6 is, for example, a laser driver IC (Integrated Circuit) that is a driving circuit, a bias circuit, an APC circuit, or the like as a transmission-side circuit unit for operating the optical transmission module 2. 6a etc. are mounted. In addition, the rigid substrate 6 is a receiving side circuit unit for operating the optical receiving module 3, and an LA (Limiting Amplifier) -IC which is an amplifier circuit, a single or a plurality of IC chips constituting a received optical power detection circuit, etc. 6b etc. are mounted. Note that the LA-IC is an example of the amplifier circuit, and the LA-IC may not be mounted. These IC chips 6a, 6b, etc. become heat generating components in the optical transceiver module 1A.

  For example, the flexible boards 7a to 7c perform impedance control by forming a microstrip line with a signal wiring layer on one surface and forming a predetermined GND pattern with a ground conductor layer on the other surface. The leads 2b of the optical transmission module 2 are connected to the flexible substrate 7a by soldering, and the leads 3b of the optical receiving module 3 are connected to the flexible substrate 7b by soldering. The impedance control line can also be formed without using a GND pattern or the like.

  The housing 5 accommodates the optical transmission module 2, the optical reception module 3, and the circuit board 4. The housing 5 includes an internal housing 5a made of a metal-based material that covers the circuit board 4, and an external housing 5b made of a resin-based material such as plastic and covering the internal housing 5a.

  2A and 2B are configuration diagrams showing an example of the housing 5. FIG. 2A is a perspective view of the housing 5 viewed from the upper surface side, and FIG. 2B is a perspective view of the housing 5 viewed from the lower surface side. 3 is a block diagram showing an example of the internal housing 5a, FIG. 3 (a) is a perspective view of the internal housing 5a viewed from the upper surface side, and FIG. 3 (b) is a view of the internal housing 5a viewed from the lower surface side. It is a perspective view. 4 is a block diagram showing an example of the external housing 5b. FIG. 4 (a) is a perspective view of the external housing 5b viewed from the upper surface side, and FIG. 4 (b) is a view of the external housing 5b viewed from the lower surface side. It is a perspective view.

  The internal housing 5a includes an upper case 8a and a lower case 8b, and has a size that covers at least the entire rigid substrate 6 of the circuit board 4 and the stem portions of the optical transmission module 2 and the optical reception module 3.

  The internal housing 5a includes a fiber support housing 2c of the light transmission module 2 and an opening 8c that exposes the fiber support housing 3c of the light reception module 3. Moreover, the opening part which exposes the flexible substrate 7c of the circuit board 4 to the exterior is provided. Furthermore, an attachment portion 8d to the external housing 5b is provided.

  The inner casing 5a is made of a metal material as described above, and functions as an electromagnetic shield by covering the entire rigid substrate 6 of the circuit board 4 and the stem portions of the optical transmission module 2 and the optical reception module 3. To do.

  The outer casing 5b includes an upper case 9a and a lower case 9b, and covers the entire inner casing 5a. The external housing 5b is formed with a connector portion 10a corresponding to the fiber support housing 2c of the light transmission module 2 exposed from the internal housing 5a, and corresponds to the fiber support housing 3c of the light reception module 3. Thus, the connector portion 10b is formed.

  Further, the outer casing 5b is formed with windows 11a to 11d that open part of the upper and lower surfaces and expose part of the inner casing 5a. Here, in the external housing 5b, the positions where the windows 11a to 11d are formed are, for example, positions corresponding to the optical transmission module 2 and the optical reception module 3 and positions corresponding to the rigid substrate 6 of the circuit board 4.

  As described above, the outer casing 5b is made of a resin-based material, and covers the inner casing 5a, so that the inner casing 5a is difficult to come into direct contact from the outside. The internal housing 5a only needs to have a size that covers the entire rigid substrate 6 of the circuit board 4 and the stem portions of the optical transmission module 2 and the optical reception module 3, and is smaller than the external housing 5b. Furthermore, since the connector portion and the like are formed on the side of the external housing 5b that can be easily molded, and the connector portion and the like are not formed on the internal housing 5a, the shape is simple. Therefore, it is possible to reduce the cost of the internal housing 5a that functions as an electromagnetic shield.

  The housing 5 includes a heat radiation space forming recess 12 on the lower surface. The heat radiation space forming recess 12 is formed by recessing a part of the lower case 9b of the outer casing 5b in a concave shape, and is connected to both side ends of the outer casing 5b.

  In the housing 5, a mounting attachment portion 13 for a mounting portion such as a host board described later is formed in a lower case 9 b of the external housing 5 b, and a heat radiation space forming recess 12 is formed avoiding the mounting attachment portion 13.

  In this example, the heat radiation space forming recess 12 is formed below the rigid board 6 of the circuit board 4. Further, the above-described window portion 11 c is formed in the heat radiation space forming recess 12, and a part of the inner housing 5 a is exposed in the heat radiation space forming recess 12.

  In the case 5, the rigid substrate 6 of the circuit board 4, the optical transmission module 2, and the optical reception module 3 are attached to the internal case 5a, and the internal case 5a is covered with the external case 5b. Then, the flexible substrate 7c is exposed from the other end side of the housing 5 for external connection. Here, since the optical transmission module 2 and the rigid substrate 6 are connected by the flexible substrate 7a, and the optical reception module 3 and the rigid substrate 6 are connected by the flexible substrate 7b, the optical transmission module 2 fixed to the housing 5 and Errors in the positions of the optical receiving module 3 and the rigid substrate 6 are absorbed by deformation of the flexible substrates 7a and 7b.

<Configuration example of optical communication apparatus according to first embodiment>
Next, a network card as a first embodiment of an optical communication apparatus provided with the above-described optical transceiver module 1A will be described.

  5 and 6 are configuration diagrams showing an example of the network card according to the first embodiment. FIG. 5 is a perspective view of the network card 21A, and FIG. 6 is a side sectional view of the network card 21A.

  The network card 21A includes the optical transmission / reception module 1A described with reference to FIG.

  The host board 22 is an example of a main board, and the optical transceiver module 1A is mounted on one end side. As described with reference to FIG. 1 and the like, the optical transmission / reception module 1A includes the heat radiation space forming concave portion 12 on the lower surface of the housing 5, and the mounting attachment portion 13 is mounted on the host board 22 to mount the optical transmission / reception module 1A. Thus, a heat radiation space 14 is formed between the lower surface of the housing 5 of the optical transceiver module 1 </ b> A and the host board 22.

  The host board 22 is mounted such that a bezel 22a is attached to one end, and the connector portions 10a and 10b of the optical transceiver module 1A are exposed to the bezel 22a.

  The host board 22 is mounted with a PHY (Physical layer) chip 23, a MAC (Media Access Control) chip 24, and the like on the other end side. For example, the PHY chip may be mounted on the optical transceiver module 1A without being mounted on the host board, and the optical transceiver module 1A may be directly connected to the MAC chip 24. Further, the host board 22 includes a card edge connector 25 such as PCI Express at one side end.

  In the network card 21A, the electrical connection between the host board 22 and the optical transceiver module 1A is performed by the flexible substrate 7c provided in the optical transceiver module 1A. The flexible substrate 7c is connected to predetermined electrode pads formed on the host board 22 by soldering, for example. The host board 22 may be provided with a connector, and the flexible board 7c may be connected to the connector.

  The network card 21A is mounted in an expansion slot such as a personal computer, and the card edge connector 25 is connected to a connector on the personal computer side.

  As described above, the optical transmission / reception module 1A exposes the connector portions 10a and 10b to the bezel 22a. However, if the end portions of the connector portions 10a and 10b are mounted at predetermined positions, the appearance is improved. . However, an error occurs in the position of the optical transmission / reception module 1A on the host board 22 due to an error in dimensions of each part.

  Therefore, in the network card 21A of the present embodiment, the host board 22 and the optical transmission / reception module 1A are electrically connected by the flexible board 7c provided in the optical transmission / reception module 1A. The position error is absorbed by deformation of the flexible substrate 7c.

  Thereby, in the network card 1A, the optical transmission / reception module 1A can be mounted so that the end faces of the connector portions 10a and 10b are aligned at predetermined positions, and the appearance is improved.

  In the optical transmission / reception module 1A, as shown in FIG. 1A, the optical transmission module 2 is connected to the rigid substrate 6 by a flexible substrate 7a, and the optical reception module 3 is connected to the rigid substrate 6 by a flexible substrate 7b. . Thereby, it is possible to absorb the impact when the connector of the optical fiber is inserted / extracted by the flexible substrates 7 a and 7 b and not to be transmitted to the rigid substrate 6.

<Operation Example of Optical Communication Device of First Embodiment>
FIG. 7 is an explanatory diagram illustrating an operation example of the network card 21A according to the first embodiment. Next, the operation of the network card 21A as the optical communication apparatus according to the first embodiment will be described.

  In the network card 21A, optical fibers (not shown) are connected to the connector portions 10a and 10b of the optical transmission / reception module 1A, and data is transmitted / received to / from an external information communication device by an optical signal.

  First, the operation of transmitting data will be described. Data to be transmitted is input to the network card 21A via a card edge connector 25 connected to an expansion slot such as a personal computer.

  The transmitted data is processed by the MAC chip 24 and the like, and is input to the circuit board 4 of the optical transceiver module 1A via the flexible board 7c.

  The optical transmission / reception module 1A processes data to be transmitted by an IC chip 6a such as a laser driver IC mounted on the rigid board 6 of the circuit board 4, and the optical transmission module 2 is not shown via the flexible board 7a. Output to a surface emitting semiconductor laser element.

  The surface emitting semiconductor laser element converts an electrical signal corresponding to transmitted data into an optical signal and emits it. Thereby, the optical signal emitted from the surface emitting semiconductor laser element is transmitted through the optical fiber, and data is transmitted to an external information communication device.

  The operation of receiving data will be described. In the network card 21A, an optical signal transmitted from an external information communication device and transmitted through an optical fiber (not shown) enters the optical reception module 3 of the optical transmission / reception module 1A.

  An optical signal incident on the optical receiving module 3 is converted into an electric signal by a light receiving element (not shown) and input to the circuit board 4 through the flexible board 7b. The optical transceiver module 1A processes the data received by the IC chip 6b such as an amplifier circuit mounted on the rigid board 6 of the circuit board 4 and outputs the processed data to the host board 22 via the flexible board 7c.

  The received data is processed by the MAC chip 24 or the like and output to a personal computer or the like via the card edge connector 25.

  Now, when the network card 21A is operated, in the optical transmission / reception module 1A, the IC chips 6a, 6b, etc. on the circuit board 4, the optical transmission module 2 and the optical reception module 3 generate heat and generate heat.

  The heat generated in the IC chip 6 a and the like is transmitted to the internal housing 5 a that constitutes the housing 5. Since the inner casing 5a is made of a metal-based material as described above, heat transfer and heat dissipation are performed efficiently.

  Although the internal housing 5a is covered with the external housing 5b constituting the housing 5, a part of the internal housing 5a is exposed from the windows 11a to 11d formed in the external housing 5b. A heat dissipation path is secured, and heat is released to the outside air OA and the host board 22.

  Then, by forming windows 11a to 11d on the upper and lower surfaces of the rigid substrate 6 on which an IC chip or the like serving as a heat generating component is mounted and the upper and lower surfaces of the optical transmission module 2 and the optical reception module 3 as heat dissipation paths, Efficiency is improved.

  Further, the inner casing 5a is covered with the outer casing 5b except for the windows 11a to 11d and is not exposed to the outside. Therefore, it is a structure that is difficult for human hands to touch, and handling becomes easy. In particular, the connector portions 10a and 10b exposed to the outside of the device are configured as a part of the external housing 5b, so that heat is hardly transmitted, and safety is improved.

  Further, the optical transmission / reception module 1 </ b> A includes a heat radiation space forming recess 12 on the lower surface of the housing 5, and a heat radiation space 14 is formed between the optical board 1 and the host board 22. Thus, on the lower surface of the housing 5, the internal housing 5 a exposed from the window portion 11 c formed in the external housing 5 a is not thermally connected to the host board 22.

  Therefore, the area in which the inner housing 5a and the outside air OA are in contact with each other increases, and heat can be radiated by natural convection not only from the upper surface but also from the lower surface of the optical transmission / reception module 1A, so that the heat radiation efficiency can be improved.

  In the configuration in which the network card 21A is mounted in the vertical direction so that the heat radiation space forming recess 12 faces in the vertical direction, the upper and lower surfaces of the optical transmission / reception module 1A are both side surfaces, and the upper side and the lower side of the optical transmission / reception module 1A are Air flows toward Thereby, an air flow is also generated in the heat radiating space forming recess 12, and the heat radiating efficiency is further improved.

  Furthermore, by providing a forced convection device such as a fan, an air flow is also generated in the heat radiating space forming recess 12 and the heat radiating efficiency is further improved.

  Further, since the area where the optical transceiver module 1A and the host board 22 are thermally connected is reduced, the amount of heat generated by the MAC chip 24 and the like on the host board 22 side is large, and the host board 22 side has a higher temperature than the optical transceiver module 1A. Even in this case, the optical transceiver module 1A can be prevented from sucking up the heat of the host board 22, and can be made less susceptible to the influence of heat.

<Configuration and Operation Example of Optical Transmission / Reception Module and Optical Communication Device of Second Embodiment>
FIG. 8 is a configuration diagram illustrating an example of a network card as an optical transmission / reception module and an optical communication apparatus according to the second embodiment. In the optical transceiver module and network card of the second embodiment, parts having the same configurations as those of the first embodiment will be described with the same numbers.

  The optical transceiver module 1B of the second embodiment includes a heat conductive sheet 15 between the IC chips 6a, 6b and the like mounted on the rigid board 6 of the circuit board 4 and the internal housing 5a. The heat transfer sheet 15 is an example of a heat transfer member, and heat-generating components are thermally connected to the internal housing 5 a on both the front and back sides of the rigid substrate 6.

  In the network card 21B of the second embodiment in which the optical transceiver module 1B having such a configuration is mounted, the heat generated in the IC chips 6a, 6b and the like of the circuit board 4 is efficiently transmitted to the internal housing 5a. Can communicate.

  In particular, the optical transceiver module 1 </ b> B includes a heat radiation space forming recess 12 on the lower surface of the housing 5, and a heat radiation space 14 is formed between the optical transceiver module 1 </ b> B and the host board 22. Thereby, the area which the internal housing | casing 5a and external air OA contact increases, and the heat radiation by natural convection is possible from both the upper and lower surfaces of the optical transceiver module 1B, and the heat radiation efficiency can be further improved.

<Configuration and Operation Example of Optical Transmission / Reception Module and Optical Communication Device of Third Embodiment>
FIG. 9 is a configuration diagram illustrating an example of a network card as an optical transmission / reception module and an optical communication apparatus according to the third embodiment. In the optical transceiver module and network card according to the third embodiment, parts having the same configurations as those in the first embodiment are described with the same reference numerals.

  The optical transceiver module 1C according to the third embodiment includes a heat conductive sheet 15 between the IC chip 6a, 6b and the like mounted on the rigid board 6 of the circuit board 4 and the inner casing 5a, and an outer casing. The heat sink 16 is provided in the internal housing 5a exposed from the windows 11a and 11c formed in 5b.

  The heat sink 16 is an example of a heat radiating member, and is attached to the upper surface of the optical transceiver module 1C. In addition, the optical transceiver module 1 </ b> C includes a heat radiation space forming recess 12 on the lower surface of the housing 5, and a heat radiation space 14 is formed between the optical transmission / reception module 1 </ b> C and the host board 22. Thereby, it is possible to attach the heat sink 16 to the inner casing 5a exposed from the window portion 11c on the lower surface of the casing 5.

  In the network card 21C of the third embodiment in which the optical transceiver module 1C having such a configuration is mounted, the heat generated by the IC chips 6a, 6b and the like of the circuit board 4 is efficiently transmitted to the internal housing 5a. The heat can be transferred from the heat sink 16.

  In particular, the optical transceiver module 1 </ b> C includes the heat radiation space forming recess 12 on the lower surface of the housing 5, and the heat sink 16 can be attached to the lower surface as well as the upper surface. Thereby, the area which contacts external air OA increases and heat dissipation efficiency can be improved further.

<Configuration and Operation Example of Optical Transmission / Reception Module and Optical Communication Device of Fourth Embodiment>
FIG. 10 is a configuration diagram illustrating an example of a network card as an optical transmission / reception module and an optical communication apparatus according to the fourth embodiment. In the optical transceiver module and network card according to the fourth embodiment, parts having the same configurations as those of the first embodiment will be described with the same numbers.

  The optical transceiver module 1D of the fourth embodiment includes a heat conductive sheet 15 between the IC chip 6a, 6b and the like mounted on the rigid board 6 of the circuit board 4 and the inner casing 5a, and an outer casing. A heat conductive sheet 17 is provided between the internal housing 5 a exposed from the window portion 11 c formed in 5 b and the host board 22. The heat transfer sheet 17 is an example of a heat transfer member, and thermally connects the internal housing 5 a and the host board 22.

  In the network card 21D of the fourth embodiment in which the optical transceiver module 1D having such a configuration is mounted, the heat generated by the IC chips 6a, 6b and the like of the circuit board 4 is efficiently transmitted to the internal housing 5a. In addition to being able to transmit, the heat transmitted to the internal housing 5 a can be efficiently transmitted to the host board 22 by the heat conductive sheet 17.

  That is, when the amount of heat generated on the host board 22 side is small and the temperature on the host board 22 side is lower than that of the optical transmission / reception module 1D, the heat radiation efficiency is improved by transferring heat to the host board 22. Therefore, by providing the heat radiation space forming recess 12 with the heat conductive sheet 17, it is possible to select both a configuration for radiating heat from the lower surface of the housing 5 to the outside air and a configuration for radiating heat to the host board 22 with one type of optical transceiver module. .

  The present invention is applied to a network card or the like that performs high-speed optical communication.

It is a block diagram which shows an example of the optical transmission / reception module of 1st Embodiment. It is a block diagram which shows an example of a housing | casing. It is a block diagram which shows an example of an internal housing | casing. It is a block diagram which shows an example of an external housing | casing. It is a block diagram which shows an example of the network card of 1st Embodiment. It is a block diagram which shows an example of the network card of 1st Embodiment. It is explanatory drawing which shows the operation example of the network card of 1st Embodiment. It is a block diagram which shows an example of the optical transmission / reception module and network card | curd of 2nd Embodiment. It is a block diagram which shows an example of the optical transmission / reception module and network card | curd of 3rd Embodiment. It is a block diagram which shows an example of the optical transmission / reception module and network card | curd of 4th Embodiment. It is a disassembled perspective view which shows an example of an XFP module.

Explanation of symbols

  1A to 1D: Optical transceiver module, 2 ... Optical transmitter module, 3 ... Optical receiver module, 4 ... Circuit board, 5 ... Housing, 5a ... Internal housing, 5b ..External housing, 6 ... Rigid substrate, 7a-7c ... Flexible substrate, 11a-11d ... Window, 12 ... Heat radiation space forming recess, 14 ... Heat radiation space, 21A-21D ... Network card, 22 ... Host board

Claims (7)

An optical transmission module for transmitting an optical signal;
An optical receiver module for receiving an optical signal;
A circuit board for processing electrical signals;
An inner casing made of metal covering at least the circuit board;
An outer casing made of resin covering the inner casing;
With
The external housing includes a heat radiation space forming recess that forms a heat radiation space between the external housing and a mounting site on which the external housing is mounted.
The outer casing is an optical transmission / reception module provided with a window for exposing the inner casing at least on the upper surface and the heat radiation space forming recess . A first heat transfer member for transmitting heat generated from at least a heat generating component mounted on the circuit board to the internal housing;
Optical transceiver module according to 請 Motomeko 1. A heat radiating member was attached to the inner casing exposed at the window formed in the outer casing.
Optical transceiver module according to 請 Motomeko 1. A second heat transfer member that transfers heat transferred to the internal housing to a main board on which the optical transceiver module is mounted;
The optical transceiver module according to claim 2. An optical transceiver module for transmitting and receiving optical signals;
In an optical communication device comprising a main board on which the optical transceiver module is mounted,
The optical transceiver module is:
An optical transmission module for transmitting an optical signal;
An optical receiver module for receiving an optical signal;
A circuit board for processing electrical signals;
An inner casing made of metal covering at least the circuit board;
An outer casing made of resin covering the inner casing;
With
The external housing includes a heat radiation space forming recess that forms a heat radiation space between the external housing and a mounting site on which the external housing is mounted.
The optical communication apparatus , wherein the outer casing includes a window portion exposing the inner casing at least on an upper surface and the heat radiation space forming recess . The circuit board is
A first flexible substrate connected to the optical transmitter module and the optical receiver module;
A second flexible substrate connected to the main substrate;
A rigid board connected to the first flexible board and the second flexible board and mounted with a transmitting circuit section and a receiving circuit section;
Optical communication device according to 請 Motomeko 5. The circuit board is composed of the first flexible board, the second flexible board, and a flex rigid board in which the rigid board is integrally formed, and processing of high-frequency signals is performed.
Optical communication device according to 請 Motomeko 6.

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