JP4692067B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device used for a personal computer, a mobile phone, and the like, and an electronic apparatus using the electro-optical device.

  Conventionally, electro-optical devices such as liquid crystal devices have been used as display devices for electronic devices such as personal computers and mobile phones. However, in recent years, personal computers, mobile phones, and the like have been reduced in size, increased in functionality, and reduced in cost, and electro-optical devices such as liquid crystal devices used have been required to be further reduced in size, thickness, and cost.

Therefore, for example, an edge of one surface is provided in an edge region of a panel substrate on which an on-panel IC chip that drives either a scanning line or a data line is mounted in a TFD (Thin Film Diode) active matrix type liquid crystal device. It is proposed to include a base material to which the vicinity of the part is bonded, and an IC chip on the base material that is mounted on the one surface of the base material and drives either the scanning line or the data line. (For example, refer to Patent Document 1).
Japanese Patent Laid-Open No. 2002-244577 (paragraphs [0005] to [0007], FIG. 5).

  However, the above-mentioned proposal makes the shape of the frame region of the electro-optical device symmetrical, improves the ease of incorporation into the casing of an electronic device such as a cellular phone, reduces the manufacturing cost, and reduces the frame area to reduce the electrical cost. Although it was possible to reduce the size of the optical device, the thickness of the entire electro-optical device increased by mounting electronic components on the base material, which is a circuit board. There was no problem.

  SUMMARY An advantage of some aspects of the invention is that it provides an electro-optical device capable of reducing the thickness without increasing the planar size, and an electronic apparatus using the electro-optical device. To do.

In order to achieve the above object, an electro-optical device according to a main aspect of the present invention includes a pair of substrates that hold an electro-optical material, and a protruding portion in which one of the pair of substrates extends from the other substrate. An electronic component other than a circuit board electrically connected to the surface of the electro-optical material, an LED mounted on one surface of the circuit board, and a connector mounted on the one surface of the circuit board An electro-optical device comprising: a light guide plate having an emission surface that emits light toward the pair of substrates; a light receiving surface that receives light from the LED; and a resin frame that houses the light guide plate. The circuit board is bent to a side where the light guide plate and the resin frame of the pair of boards are arranged, and the LED and the connector are disposed in an area overlapping with the protruding portion of the bent circuit board. All the electronic components other than the LED are disposed, and the LED is disposed in a region on the incident surface side of the light guide plate in a region overlapping the projecting portion of the bent circuit board, and the connector The other electronic components are arranged in an outer region opposite to the incident surface side of the region where the LEDs are arranged, and the resin frame has an opening for accommodating all the electronic components other than the connectors. And a notch portion in which the incident surface side of the light guide plate is cut out corresponding to the shape of the LED in the holding portion of the resin frame disposed between the light guide plate and the electronic component other than the connector. And is provided .
In the electro-optical device, the circuit board is bonded to the substrate at least on the side opposite to the region where electronic components other than the connector are arranged.
In the electro-optical device, the one surface on which electronic components other than the LED and the connector are mounted is a surface on the side that does not face the substrate of the bent circuit board. And
In the electro-optical device, the LED is arranged in a bent area of the circuit board.
The electro-optical device further includes a metal frame that holds at least the resin frame from the outside, and the resin frame includes an opening that accommodates an electronic component other than the connector and an opening that accommodates the light guide plate. Each of the openings is penetrated to the opposite side, and the metal frame covers at least each of the penetrated openings.

  Here, the “circuit board” refers to a flexible board such as a flexible board or a hard board, and may be directly connected to the board or electrically connected to the board via another board. May be. The “optical member” refers to, for example, a prism sheet or a light guide plate, and the “electronic component” refers to, for example, a resistor or a capacitor.

In the present invention, since the electronic component is arranged in the region between the bent region and the edge of the optical member , for example, the electronic component provided in the overlapping region is planar with the optical member. Without overlapping, it is possible to prevent the electro-optical device from becoming thicker by the amount of the electronic component.

According to an aspect of the present invention, the electronic component includes a connector, and the electronic component other than the connector is provided in the region between the electronic components. Accordingly, for example, electrical connection with an external circuit via a connector is facilitated, and an increase in thickness of the electro-optical device due to electrical connection with the external circuit can be prevented.

According to an aspect of the present invention, the electronic components other than the connector are provided only in the region between them. As a result, all electronic components other than the connector are collected in the overlapping region, and an increase in the thickness of the electro-optical device due to the electronic components other than the connector can be reliably prevented.

  According to an aspect of the present invention, a plurality of electronic components other than the connector are arranged in a line on the circuit board. As a result, the area for mounting the electronic component can be further reduced, and the planar size of the electro-optical device can be reduced.

  According to an aspect of the present invention, a plurality of electronic components other than the connector are arranged on the circuit board so as to be along the edge in the vicinity of the edge on the side. This makes it possible to securely mount electronic components even when the gap between the side edge of the substrate and the optical member such as the light guide plate on the side is narrow while reducing the thickness of the electro-optical device. It is possible to reduce the planar size of.

According to an aspect of the present invention, the circuit board is characterized in that at least a side opposite to a region where electronic components other than the connector are provided is in contact with the one board. As a result, when mounting electronic components excluding connectors on the circuit board, more space from the circuit board can be secured, and the thickness of the electro-optical device can be reduced even when tall electronic components are mounted. Is possible.
According to an aspect of the present invention, the circuit board is characterized in that at least an opposite side of a region where electronic components other than the connector are provided is bonded to the one board.

According to an aspect of the present invention, the light source is provided on one surface side of the circuit board, and the electronic component is provided on the same surface side as the one surface side on which the light source is provided. It is characterized by being. This facilitates the formation of wiring that is electrically connected to the electronic component, thereby improving the reliability of the electrical connection and reducing the manufacturing cost.
According to one aspect of the present invention, the circuit board is arranged in the order of electronic components other than the connector and the light source from the side close to the bent region, and the circuit board is an electronic other than the connector. Extends from the region where the component is arranged to the optical member side, is bent at a region where it does not overlap with the edge of the optical member, extends to the electronic component side other than the connector, and the electronic component other than the connector is arranged The light source is folded in a region that does not overlap the region, and the light source is arranged in the folded region.

  According to an aspect of the present invention, the electronic device further includes a resin frame that holds at least a part of the optical member, and at least a part of the electronic component other than the connector is formed in an opening formed in the resin frame. It is housed. Here, “the part” means that, for example, when there are a plurality of electronic parts other than the connector, some of the electronic parts are included in the opening part. It shall also be said if it is. In addition, the “opening” includes not only those that are completely penetrated but also those that are not penetrated and in which a depression is formed. As a result, the conventional electronic component is not embedded in the resin frame, and the thickness of the resin frame is directly added to the thickness of the electro-optical device, so that an opening is provided and at least a part of the electronic component is accommodated therein. Thus, the thickness of the electro-optical device can be reduced by the amount stored.

  According to one aspect of the present invention, it further comprises a metal frame that holds at least the resin frame from the outside, and the opening of the resin frame penetrates from the one substrate side to the opposite side, The metal frame covers at least the through-opening portion. Accordingly, it is possible to increase the strength of the electro-optical device itself, and to protect the electronic component from foreign matters and to have a structure that is strong against external impact, compared to a case where the electronic component can be viewed from the opening.

  An electro-optical device according to another aspect of the present invention includes a substrate on which an electro-optical material is disposed, and is electrically connected to the substrate and disposed at least on the opposite side of the surface on which the electro-optical material is disposed. And an electronic component provided on the circuit board, and a resin frame having an opening for accommodating at least a part of the electronic component.

  In the present invention, since at least a part of the electronic component mounted on the circuit board is accommodated in the opening of the resin frame, the electronic component is not conventionally contained in the resin frame, and the thickness of the resin frame is In addition to the thickness of the electro-optical device as it is, an opening can be provided so that at least a part of the electronic component can be accommodated therein, and the thickness of the electro-optical device can be reduced correspondingly.

  According to an aspect of the present invention, the electronic component includes a connector, and an electronic component other than the connector is accommodated in the opening. Accordingly, for example, electrical connection with an external circuit via a connector is facilitated, and an increase in thickness of the electro-optical device due to electrical connection with the external circuit can be prevented.

  According to an aspect of the present invention, the electronic component other than the connector is provided only in a region overlapping the opening in a plane. As a result, all electronic components other than the connector are collected in the overlapping region, and an increase in the thickness of the electro-optical device due to the electronic components other than the connector can be reliably prevented.

  According to an aspect of the present invention, a plurality of electronic components other than the connector are arranged in a line on the circuit board. As a result, the area for mounting the electronic component can be further reduced, and the planar size of the electro-optical device can be reduced.

  According to an aspect of the present invention, the apparatus further includes a metal frame that holds at least the resin frame from the outside, and the opening of the resin frame penetrates from the substrate side to the opposite side, and the metal frame The frame is characterized in that it covers at least the penetrated opening. Accordingly, it is possible to increase the strength of the electro-optical device itself, and to protect the electronic component from foreign matters and to have a structure that is strong against external impact as compared with the case where the electronic component can be seen through the opening.

  An electronic apparatus according to another aspect of the invention includes the above-described electro-optical device.

  Since the present invention includes the electro-optical device that can be made thinner without increasing the planar size, it is possible to provide a more compact and highly functional electronic apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a TFT (Thin Film Transistor) active matrix type liquid crystal device and an electronic apparatus using the liquid crystal device will be described as an example of an electro-optical device, but the present invention is not limited to this. is not. Further, in the following drawings, in order to make each configuration easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

  1 is a schematic exploded perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a partial cross-sectional view taken along line AA of FIG. 1 (the X driver IC and electronic components are not cut), and FIG. FIG. 4 is a sectional view taken along line BB in FIG. 2 (electronic parts are not cut) and FIG. 4 is a bottom view of the liquid crystal device.

  (Configuration of liquid crystal device)

  For example, as shown in FIG. 1, the liquid crystal device 1 includes a liquid crystal panel 2, an optical member unit 3 that makes light incident on the liquid crystal panel 2, a flexible substrate 4 as a circuit board electrically connected to the liquid crystal panel 2, and at least optical. A resin frame 5 that holds a part of the member unit 3 is provided. Here, in addition to the resin frame 5, other incidental mechanisms are attached to the liquid crystal device 1 as necessary (not shown).

  The liquid crystal panel 2 is enclosed in a gap between the first substrate 7 and the second substrate 8 as a pair of substrates bonded together via a sealing material 6 as shown in FIGS. 1 and 2, for example. For example, a TN (Twist Nematic) type liquid crystal 9 as an electro-optical material is included.

  The first and second substrates 7 and 8 are plate-like members made of a light-transmitting material such as glass or synthetic resin, for example, as shown in FIG. 2, outside the first and second substrates 7 and 8 ( Polarizers 10 and 11 for polarizing incident light are attached to the opposite side of the liquid crystal).

  The first substrate 7 has a gate electrode 12 formed in the Y-axis direction and a source electrode 13 as a signal line formed in the X-axis direction as shown in FIGS. 1 and 2, for example, on the inner side (liquid crystal side). Further, an alignment film 14 is formed on the liquid crystal side of the gate electrode 12 and the source electrode 13. The gate electrode 12 and the source electrode 13 are made of nickel or the like, for example, and are electrically connected to a TFT (not shown). The TFT is electrically connected to the pixel electrode 15 made of ITO (indium tin oxide) or the like.

  As a result, when a voltage is applied to the gate electrode 12, the gate electrode 12 and the source electrode 13 cause a current to flow from the source electrode 13 to the pixel electrode 15 or vice versa. Here, the source electrode 13 applies a data signal to the pixel electrode 15, and the pixel electrode 15 applies a voltage to the liquid crystal 9 sandwiched between the common electrode described later.

  Furthermore, the first substrate 7 has an overhanging portion 16 that protrudes from the outer peripheral edge of the second substrate 8, and the overhanging portion 16 includes, for example, an area from which the gate electrode 12 and the source electrode 13 are surrounded by the sealing material 6. A gate electrode wiring 17 and a source electrode wiring 18 extending to the overhanging portion 16 are formed, and an X driver IC 19 and a Y driver IC 20 for driving a liquid crystal electrically connected to the respective electrode wirings are mounted. Yes.

  For example, as illustrated in FIG. 2, the overhang portion 16 includes electrode terminals 21 electrically connected to the gate electrode wiring 17 and the source electrode wiring 18 in regions corresponding to the mounting surfaces of the X driver IC 19 and the Y driver IC 20. Further, an input terminal 22 for inputting a current from the flexible substrate 4 and the like to the X driver IC 19 and the Y driver IC 20 is provided.

  Further, the overhang portion 16 includes an external terminal 23 that receives a current from the flexible substrate 4, an input wiring 24 that supplies an external current to the input terminal 22, and the like.

  For example, as shown in FIGS. 2 and 3, the X driver IC 19 and the Y driver IC 20 have a plurality of bumps 25 electrically connected to the electrode terminal 21 and the input terminal 22 on the mounting surface to be mounted on the projecting portion 16. . This electrical connection is made through an anisotropic conductive film 26 (not shown) that is also an adhesive between the electrode terminal 21 and the input terminal 22 and the bump 25.

  A plurality of bumps 25 are arranged on the mounting surface of the X driver IC 19 and the Y driver IC 20, and are formed in, for example, a substantially rectangular parallelepiped, but are not limited to this, and may have a cylindrical shape or the like. It is made of nickel (Ni), copper (Cu), gold (Au) or the like.

  Further, the alignment film 14 is an organic thin film such as polyimide, and is subjected to a rubbing process for defining the alignment state of the liquid crystal 9 when no voltage is applied.

  On the other hand, a common electrode 27 is formed on the inner surface (liquid crystal side) of the second substrate 8, and an alignment film 28 is formed on the liquid crystal side of the common electrode 27.

  Here, the common electrode 27 is a surface electrode formed over the entire display region, and is a transparent conductive film such as ITO. The alignment film 28 is an organic thin film such as polyimide, and is subjected to a rubbing process for defining the light distribution state of the liquid crystal 9 when no voltage is applied.

  Although not shown, an underlayer, a reflective layer, a colored layer, a light shielding layer, and the like are formed inside one of the first and second substrates 7 and 8 as necessary.

  Next, for example, as shown in FIG. 2, the optical member unit 3 includes a light guide plate 29 as an optical member, two prism sheets 30 and 31, a diffusion sheet 32, a reflection sheet 33, a light shielding sheet 34, and the like.

  Here, the light guide plate 29 is formed in, for example, a substantially rectangular shape as shown in FIG. 2, and emits light incident from the light source described later to the entire diffusion sheet 32, and the light source side end surface is from the light source. It is a light receiving surface for receiving the light.

  The diffusion sheet 32 emits light of various angles by diffusion, and the prism sheets 31 and 30 improve the luminance of light incident from the diffusion sheet 32. It is arranged on the liquid crystal side surface.

  Further, the reflection sheet 33 is formed by evaporating Ag on a plastic film, for example, and is disposed on the opposite side of the light guide plate 29 from the liquid crystal panel so as to cover the bottom of the light source as shown in FIG.

  Further, for example, as shown in FIG. 2, the light shielding sheet 34 has a frame shape in which an opening is formed so that the central portion coincides with at least a display area C (C in FIG. 2) that is an area related to display on the liquid crystal panel 2. The liquid crystal panel side reflects black light and the prism sheet side reflects white light.

  Next, for example, as shown in FIGS. 1 to 4, the flexible substrate 4 is formed by mounting and mounting a wiring pattern 36 and a light source 37 and electronic components electrically connected to the wiring pattern 36 on a base substrate 35. Yes. Here, the base substrate 35 is a flexible film-like member, and the wiring pattern 36 is made of, for example, copper.

  In addition, the flexible substrate 4 includes, for example, as shown in FIGS. 1 and 4, a branch portion 40 including a main body portion 39 connected to the projecting portion 16 of the liquid crystal panel 2 and a connector 49 for electrically connecting to an external circuit. And an electronic component 38 other than the light source 37 and the connector is mounted on the main body 39.

  Examples of the electronic component 38 other than the connector include a resistor and a capacitor. For example, to control the light source 37, or an IC on a glass substrate or a circuit board (driving IC on the first or second substrate, circuit board) There are capacitors, diodes, resistors, and the like for noise countermeasures for the ROM (Read Only Memory), power supply IC, and control IC), and capacitors, diodes, and resistors are properly used as necessary.

  Further, the main body 39 has a plurality of main body connecting terminals (not shown) formed at the end on the liquid crystal panel side, and is electrically connected to the external terminals 23 of the overhanging portion 16 of the liquid crystal panel 2 through the anisotropic conductive film 41. Connected. The main body connection terminal is electrically connected to a wiring pattern 36 formed on the side surface opposite to the overhanging portion side of the base substrate 35 through a through hole (not shown).

  Further, the main body 39 is a side edge that is electrically connected to the flexible substrate 4 of the first substrate 7 from the inside of the liquid crystal panel side end portion on which the main body connection terminals are formed, for example, as shown in FIG. 42 is bent in a substantially semicircular cross section.

  Furthermore, the main body 39 is arranged so as to be in contact with the side opposite to the mounting surface of the X and Y driver ICs of the overhanging portion 16 after being bent into a substantially semicircular cross section as shown in FIG. Yes.

  Further, the main body 39 that is turned around to the side opposite to the mounting surface of the overhanging portion 16 with the X and Y driver ICs is folded into a substantially S shape in front of a light shielding sheet or the like as shown in FIG. Finally, the wiring pattern 36 of the main body 39 is opposite to the first substrate side. Thereby, the wiring pattern 36 of the main body 39 can be directly electrically connected to the light source 37, and the alignment of the light source 37 can be accurately performed while simplifying the structure and reducing the manufacturing cost.

  Further, the main body 39 is formed such that a light source 37 disposed near the end of the main body 39 opposite to the liquid crystal panel side on the wiring pattern side can allow light to enter the light receiving surface of the light guide plate 29.

  Here, the light source 37 mounted on the flexible substrate 4 and the electronic component 38 other than the connector are, for example, the side of the first substrate 7 electrically connected to the flexible substrate 4 as shown in FIGS. A region D (a range represented by D in FIGS. 2 and 4) that overlaps the edge 42 of the light source and the edge 60 of the light guide plate 29, the diffusion sheet 32, or the like which is an optical member on the side (hereinafter referred to as D). Are all collected in the “overlapping region D”) and provided so as not to overlap the optical member such as the light guide plate 29 in a planar manner. As a result, it is possible to prevent the thickness of the liquid crystal device 1 from increasing as much as the electronic component 38 overlaps with the optical member in a conventional manner.

  Specifically, for example, an LED (Light Emitting Diode) is used as the light source 37, and the light emission surface is guided more than the light guide plate 29 in the overlapping region D of the flexible substrate 4 as shown in FIGS. 2 and 4. Four are arranged in parallel so as to correspond to the light receiving surface of the light plate 29, respectively. Of course, the number of LEDs is not limited to four, and may be more or less.

  Further, the electronic components 38 other than the connectors are arranged in a row in the vicinity of the side edge 42 of the first substrate 7 in the overlapping region D as shown in FIGS. 2 and 4, for example, along the side edge 42. Is arranged. In addition, although it demonstrated as what the electronic components 38 except a connector were arranged in multiple rows, of course, it is not restricted to this, For example, it arranges in two or more rows, Furthermore, electronic components other than a connector are one. There may be only one. This also makes it possible to reduce the thickness of the liquid crystal device.

  Furthermore, an area E (range represented by E in FIGS. 2 and 4) (hereinafter referred to as “provided area E”) in which a plurality of electronic components 38 other than the connector are arranged and provided is the area of the flexible substrate 4. For example, as shown in FIG. 2, the opposite side of the provided region E is bonded to the opposite side of the X and Y driver IC mounting side of the first substrate 7 as a substrate by a double-sided adhesive tape or the like (not shown). Thus, the thickness of the liquid crystal device 1 as a whole is reduced while ensuring a higher height space from the wiring pattern 36 that is the mounting surface of the electronic component by the optical member.

  Next, for example, as shown in FIG. 1, the resin frame 5 is placed in a region D where the substantially rectangular frame 43 having the same size as the first substrate 7 and the main body 39 of the flexible substrate 4 overlap. A holding portion 44 and an opening 45 provided to connect the two.

  Here, for example, as shown in FIGS. 1 and 2, the frame 43 is formed so as to be able to accommodate the substantially optical member unit 3 therein. Left side wall 43a, right side wall 43b which is also the right side wall, front overhang side wall 43c, and opposite side wall 43d on the opposite side.

  The holding portion 44 has, for example, four light source cutout portions 46 such that the four light sources 37 can be accommodated in the light guide plate side end portion as shown in FIGS. 1 to 4. As shown in FIG. 2, the wiring pattern side surface of the main body portion 39 bent in an S shape is attached to the remaining side surface of the flexible substrate 4 cut out by the portion 46 with a double-sided adhesive tape (not shown).

  Thus, the light source 37 is firmly fixed by the flexible substrate 4 fixed to the resin frame 5 by the holding portion 44 and the holding portion 44 itself, and the display quality can be prevented from being deteriorated due to the displacement of the light source 37 or the like.

  The opening 45 is formed, for example, as a substantially rectangular and completely penetrating opening along the side edge 42 on the protruding portion side of the first substrate 7 as shown in FIGS. 1 to 4. The holding portion 44 and the overhang are formed so as to substantially coincide with a region E (E in FIGS. 2 and 4) in which a plurality of electronic components 38 other than the connectors arranged in a row is provided in the vicinity of the side edge 42 of the portion 39. It is formed between the side wall 43c. As a result, all of the plurality of electronic components 38 other than the connector are accommodated in the opening 45 at least a part of the respective electronic components.

  Moreover, the thickness of the opening 45 is formed by the resin frame 5 so that all the electronic components 38 other than the connector do not jump out of the reflection sheet surface as shown in FIG.

  The entire resin frame 5 is, for example, white, and the light leaked from the reflection sheet 33 and the like can be returned to the light guide plate 29 to improve the luminance of the display surface of the liquid crystal panel 2.

  2 and 4, the reflection sheet 33 covers the entire surface of the light guide plate 29 opposite to the liquid crystal panel side, and the light source 37 and the surface of the holding portion 44 of the resin frame 5 opposite to the flexible substrate 4 side. Is attached to the light guide plate or the like with a double-sided adhesive tape or the like (not shown). Further, the reflection sheet 33 is disposed in the frame 43 such that the outer surface thereof is a surface having the same height as the bottom surface of the frame 43 of the resin frame 5 as shown in FIG.

  (Manufacturing method of liquid crystal device)

  Next, a method for manufacturing the liquid crystal device 1 configured as described above will be described focusing on the assembly of the flexible substrate 4 and the resin frame 5.

  First, the liquid crystal panel 2 is manufactured.

  For example, a TFT, a gate electrode 12, a source electrode 13, a pixel electrode 15 and the like are formed on the liquid crystal side of the first substrate 7, an alignment film 14 is formed on the liquid crystal side, and a rubbing process is performed so that the first substrate side is formed. To manufacture. When forming the gate electrode 12, the source electrode 13, and the like, the gate electrode wiring 17, the source electrode wiring 18, the electrode terminal 21, and the input terminal 22 may be formed at the same time.

  Further, if necessary, a base layer, a reflective film, and a colored layer are formed on the liquid crystal side of the second substrate 8, a common electrode 27 is formed on the liquid crystal side, an alignment film 28 is further formed, and a rubbing process is performed. To produce the second substrate side.

  Then, the gap material 47 is sprayed on the second substrate by dry spraying or the like, and the first substrate side and the second substrate side are bonded together via the seal material 6. Thereafter, liquid crystal is injected from an inlet (not shown) of the sealing material 6, and the inlet of the sealing material 6 is sealed with a sealing material such as an ultraviolet curable resin.

  Further, polarizing plates 10 and 11 are attached to the outer surfaces of the first and second substrates 7 and 8.

  Further, the anisotropic conductive film 26 is aligned and arranged in the mounting region of the X driver IC 19 and Y driver IC 20 of the overhanging portion 16 so as to cover the electrode terminal 21 and the input terminal 22 and the like. The X driver IC 19 and the Y driver IC 20 are heated and pressure-bonded so that the bumps 25 are positioned corresponding to the electrode terminals and the like on the electrode 26, and the bumps 25 and the electrode terminals and the like are electrically connected to the anisotropic conductive film 26. Electrical connection through particles.

  Next, a flexible substrate is manufactured and assembled to the liquid crystal panel 2.

  A base substrate 35 of the main body portion 39 and the branching portion 40 of the flexible substrate 4 is formed by a predetermined mold, and a predetermined wiring pattern 36, a connection terminal, and the like are formed on the base substrate 35, for example.

  Further, as shown in FIG. 2 and FIG. 4, between the liquid crystal panel side end of the main body 39 and the light guide plate side end opposite to the wiring pattern 36 so as to be electrically connected. A predetermined number of electronic components 38 other than the connector are mounted on the side edge 42 of the first substrate 7 when the flexible substrate 4 is just assembled to the liquid crystal panel 2 so as to be substantially parallel and straight. Of course, the number of electronic components shown in FIGS. 3 and 4 is an example, and is not limited thereto.

  Further, for example, as shown in FIG. 2 and FIG. 4, there are four on the same surface side as the one surface side of the main body portion 39 on which the electronic component 38 other than the connector is mounted, on the opposite end portion on the liquid crystal panel side. The light source 37 is separated and electrically connected to the wiring pattern 36 for mounting.

  For example, as shown in FIGS. 1, 2, and 4, the connector 49 is mounted by being electrically connected to the wiring pattern 36 at the end of the branch portion 40 opposite to the end of the liquid crystal panel.

  After mounting all the electronic components 38 and the connector 49 other than the light source 37 and the connector on the flexible substrate 4, the main body connection terminal of the main body 39 is connected to the external terminal 23 of the liquid crystal panel 2 through the anisotropic conductive film 41. Are electrically connected to each other, and the body portion 39 of the flexible substrate 4 is bent at the edge 42 on the side of the overhanging portion 16 to be opposite to the side of the overhanging portion 16 of the first substrate 7 where the X and Y driver ICs 19 and 20 are mounted. Turn around to the side.

  At this time, the main body 39 is mounted with a plurality of electronic components 38 other than the connector in a straight line, and the opposite side of the provided region E is bonded to the first substrate 7 with a double-sided adhesive tape. Further, for example, as shown in FIGS. 1, 2, and 4, the branch portion 40 is branched from the main body portion 39 at the edge 42 on the side of the first substrate 7.

  Next, the light source 37 that is just mounted when the main body 39 is bent into an S-shape in the middle as shown in FIG. It fits in the notch 46.

  Next, the optical member unit 3 is incorporated in a resin frame 5 manufactured in advance.

  For example, as shown in FIGS. 2 and 4, the reflection sheet 33 is disposed on the outer side (bottom surface side) of the resin frame 5, and the outer surface thereof is a surface having the same height as the bottom surface of the frame 43 of the resin frame 5 as shown in FIG. In this way, it is arranged in the frame 43 and bonded with a double-sided adhesive tape or the like so as to cover the surface of the holding portion 44 of the resin frame 5 opposite to the flexible substrate 4 side.

  Thereafter, for example, the light guide plate 29, the diffusion sheet 32, and the two prism sheets 31 and 30 are arranged in that order from the inside of the frame 43 to the inner surface side (liquid crystal panel side) of the reflection sheet 33, and finally the light shielding sheet 34 is shielded. Alignment is performed so that the opening of the sheet 34 and the display area C of the liquid crystal panel 2 coincide with each other, and the sheet 34 is attached onto the prism sheet 30 with a double-sided adhesive tape or the like.

  Next, the liquid crystal panel 2 to which the flexible substrate 4 is connected is incorporated into a resin frame.

  2 and 3, a plurality of electronic components 38 other than the connector mounted on the main body 39 of the flexible substrate 4 connected to the liquid crystal panel 2 are accommodated in the opening 45 of the resin frame 5, and the resin frame The liquid crystal panel 2 is placed on the resin frame 5 and set so that the light source 37 is housed in the light source notch 46 of the holding unit 44 of the fifth. At this time, the light source 37 is positioned and fixed so that light can be emitted to the light receiving surface of the light guide plate 29 by the double-sided adhesive tape provided on the flexible substrate side of the holding portion 44 and the holding portion 44 itself.

  In addition, necessary parts are attached to complete the liquid crystal device 1.

  Above, description of the manufacturing method of the liquid crystal device 1 is complete | finished.

  As described above, according to the present embodiment, all of the electronic components 38 other than the connector mounted on the flexible substrate 4 and the side edge 42 of the first substrate 7 electrically connected to the flexible substrate 4 and the light guide plate are used. Since the electronic components are collected in a region D (D in FIGS. 2 and 4) that overlaps with the edge 60 of the optical member, the electronic component does not overlap the optical member in a plane. It is possible to prevent the liquid crystal device 1 from becoming thicker for the electronic components.

  In addition, since the electronic components 38 other than the connectors are arranged in a line on the flexible substrate 4, the area for mounting the electronic components can be further reduced, and the planar size of the liquid crystal device 1 can also be reduced. It becomes.

  Further, the plurality of electronic components 38 other than the connector of the liquid crystal device 1 are arranged on the flexible substrate 4 so as to be along the edge in the vicinity of the edge 42 on the side of the first substrate 7. Even when the gap between the side edge 42 of the substrate 7 and the optical member such as the light guide plate is narrow, the electronic component can be reliably mounted, the planar size is reduced, and the thickness of the liquid crystal device 1 is also reduced. It becomes possible.

  The flexible substrate 4 of the liquid crystal device 1 is in contact with the first substrate 7 at the opposite side of the region E (E in FIGS. 2 and 4) where at least a plurality of electronic components 38 other than the connectors are provided. Therefore, when mounting the electronic component 38 other than the connector on the flexible substrate 4, the height space from the flexible substrate 4 can be secured, and the thickness of the liquid crystal device 1 can be reduced even if a tall electronic component is mounted. It becomes possible to do.

  Further, the light source 37 of the liquid crystal device 1 is provided on one surface side of the flexible substrate 4, and the electronic component 38 other than the connector is provided on the same surface side as the one surface side on which the light source 37 is provided. Therefore, it is easy to form the wiring pattern 36 that is electrically connected to the electronic component, thereby improving the reliability of the electrical connection and reducing the manufacturing cost.

  The liquid crystal device 1 further includes a resin frame 5 that holds a part of an optical member such as a light guide plate. The plurality of electronic components 38 other than the connectors are at least part of the electronic components 38 other than the connectors. Since the electronic component is not embedded in the resin frame 5 in the related art, the thickness of the resin frame 5 is added to the thickness of the liquid crystal device 1 as it is because it is accommodated in the opening 45 formed in the frame 5. However, by providing the opening 45 and at least a part of the electronic component therein, the thickness of the liquid crystal device 1 can be reduced accordingly.

  (Second Embodiment)

  Next, a second embodiment of the liquid crystal device according to the present invention will be described. This embodiment is different from the first embodiment in that a metal frame is further provided on the outer side of the resin frame, and this point will be mainly described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 5 is a schematic exploded perspective view of a liquid crystal device according to a second embodiment of the present invention, and FIG. 6 is a partial cross-sectional view taken along line FF in FIG. 5 (the X driver IC and electronic components are not cut).

  (Configuration of liquid crystal device)

  The liquid crystal device 101 includes, for example, a liquid crystal panel 2, an optical member unit 3 that makes light incident on the liquid crystal panel 2, a flexible substrate 4 as a circuit board electrically connected to the liquid crystal panel 2, as shown in FIGS. A resin frame 5 that holds at least a part of the optical member unit 3 and a metal frame 150 that holds the liquid crystal panel 2 and the resin frame 5 are provided. Here, in addition to the metal frame 150, other incidental mechanisms are attached to the liquid crystal device 1 as necessary (not shown).

  For example, as shown in FIGS. 5 and 6, the metal frame 150 has a substantially box-like shape opened upward (resin frame side), and is surrounded by four substantially side-walled side walls 151 and the side walls. And a metal frame bottom 152.

  Here, the inner diameter of the side wall 151 is just large enough to accommodate the resin frame 5 and the liquid crystal panel 2, and the liquid crystal panel 2 and the optical member unit held by the resin frame 5 are more firmly fixed and held. Become.

  Further, a substantially rectangular metal frame notch 153 is formed on the side wall 151 of the side wall 151 as shown in FIG. 5, for example, from the metal frame notch 153 to the flexible substrate 4. The branch portion 40 extends to the outside, and a part of the main body portion 39 that is bent and protruded along the side edge 42 of the first substrate 7 is accommodated.

  Further, for example, as shown in FIGS. 5 and 6, the metal frame bottom 152 is formed so as to cover all four side walls 151 from the bottom, and an electronic component other than the plurality of connectors visible from the opening 45 of the resin frame 5. 38, the reflection sheet 33, etc. are covered with the metal frame bottom 152 from the outside.

  (Manufacturing method of liquid crystal device)

  Next, in the liquid crystal device 101 configured as described above, after assembling the liquid crystal panel 2 to which the flexible substrate 4 is connected to the resin frame 5, the metal frame 150 is bent to the metal frame notch portion 153 to be arranged on the side side. The other points are substantially the same as in the first embodiment except that the flexible substrate 4 and the like protruding in the vicinity of the edge 42 are aligned and the metal frame 150 is assembled to the resin frame 5 and the like. Is omitted.

  As described above, according to the present embodiment, the metal frame 150 that holds at least the resin frame 5 from the outside is further provided, and the opening 45 of the resin frame 5 penetrates from the first substrate side to the opposite side. In addition, since the metal frame 150 covers the opening 45 that is penetrated, the strength of the liquid crystal device itself can be increased, and the electronic component 38 other than the connector can be seen through the opening 45 compared to the case where the electronic frame 38 is viewed through the opening 45. It is possible to protect parts from foreign matters and to have a structure that is strong against external impacts.

  (Third embodiment)

  Next, a third embodiment of the liquid crystal device according to the present invention will be described. This embodiment is different from the first embodiment in that a light source and an optical member unit are not provided, and thus will be mainly described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 7 is a schematic exploded perspective view of a liquid crystal device according to a third embodiment of the present invention, and FIG. 8 is a partial sectional view taken along line GG of FIG. 7 (the X driver IC and electronic components are not cut).

  (Configuration of liquid crystal device)

  For example, as shown in FIG. 7, the liquid crystal device 201 includes a liquid crystal panel 2, a flexible substrate 204 as a circuit board electrically connected to the liquid crystal panel 2, a resin frame 205 that holds at least a part of the flexible substrate 204, and a liquid crystal A metal frame 250 that holds the panel 2 and the resin frame 205 is provided. Here, in addition to the metal frame 250, other incidental mechanisms are attached to the liquid crystal device 201 as needed (not shown).

  The liquid crystal panel 2 is sealed in a gap between the first substrate 7 and the second substrate 8 as a pair of substrates bonded together via a sealing material 6 as shown in FIGS. 7 and 8, for example. For example, a TN (Twist Nematic) type liquid crystal 9 as an electro-optical material is included.

  The first and second substrates 7 and 8 are plate-like members made of a light-transmitting material such as glass or synthetic resin, for example, as shown in FIG. 8, outside the second substrate 8 on the display side (liquid crystal A polarizing plate 11 for polarizing incident light is attached to the opposite side.

  Further, the alignment film 14 is an organic thin film such as polyimide, and is subjected to a rubbing process for defining the alignment state of the liquid crystal 9 when no voltage is applied.

  On the other hand, a common electrode 27 is formed on the inner surface (liquid crystal side) of the second substrate 8, and an alignment film 28 is formed on the liquid crystal side of the common electrode 27.

  Next, for example, as shown in FIGS. 7 and 8, the flexible substrate 204 is formed by mounting a wiring pattern 36 on the base substrate 35 and an electronic component 238 other than a connector electrically connected to the wiring pattern 36. Has been. Here, the base substrate 35 is a flexible film-like member, and the wiring pattern 36 is made of, for example, copper.

  Further, as the electronic components 238 other than the connector, there are a resistor, a capacitor, and the like. For example, an IC on a glass substrate and a circuit board (a driving IC on the first or second substrate, a ROM (Read Only Memory) on the circuit board). There are capacitors, diodes, resistors, etc. for noise countermeasures for power supply ICs, control ICs), and capacitors, diodes, resistors are used as needed.

  7 and 8, the flexible substrate 204 includes a main body 39 connected to the overhanging portion 16 of the liquid crystal panel 2 and a branch portion 40 provided with a connector 49 for electrical connection with an external circuit. And an electronic component 238 other than the connector is mounted on the main body 39.

  Further, the main body 39 has a plurality of main body connecting terminals (not shown) formed at the end on the liquid crystal panel side, and is electrically connected to the external terminals 23 of the overhanging portion 16 of the liquid crystal panel 2 through the anisotropic conductive film 41. Connected. The main body connection terminal is electrically connected to a wiring pattern 36 formed on the side surface opposite to the overhanging portion side of the base substrate 35 through a through hole (not shown).

  Further, the main body 39 is a side edge that is electrically connected to the flexible substrate 204 of the first substrate 7 from the inside of the liquid crystal panel side end portion on which the main body connection terminals are formed, for example, as shown in FIG. 42 is bent in a substantially semicircular cross section.

  Further, the main body portion 39 is arranged so as to be in contact with the side surface opposite to the mounting surface of the X and Y driver ICs of the overhang portion 16 after being bent into a substantially semicircular cross section.

  Further, the main body 39 that is turned around to the side opposite to the mounting surface of the X and Y driver ICs of the overhanging portion 16 has the wiring pattern 36 on the side opposite to the first substrate side. Thereby, the wiring pattern 36 of the main body 39 can be directly electrically connected to the electronic component 238 other than the connector, and the structure can be simplified and the manufacturing cost can be reduced.

  Further, all the electronic components 238 other than the connector are provided on the flexible substrate so as to be collected in a region overlapping in a plane with an opening of a resin frame 205 described later.

  For example, as shown in FIG. 8, a plurality of arrays are arranged in a row in the vicinity of the side edge 42 of the first substrate 7, along the side edge 42, and in a region overlapping the opening of the resin frame 205. Has been.

  Further, in an area E (range indicated by E in FIG. 8) in which a plurality of electronic components 238 other than the connector are arranged and provided, the opposite side of the provided area E of the flexible substrate 204 is shown in FIG. In this way, the first substrate 7 which is the substrate is bonded to the opposite side of the X and Y driver IC mounting side by a double-sided adhesive tape or the like (not shown). Thus, the thickness of the entire liquid crystal device 201 is reduced while securing a height space from the wiring pattern 36 that is the mounting surface of the electronic component 238.

  Next, for example, as shown in FIGS. 7 and 8, the resin frame 205 has a box shape that is substantially the same size as the first substrate 7 and is open to the liquid crystal panel side.

  Further, the resin frame 205 has a substantially rectangular cutout 246 formed on the side wall on the overhanging portion side so that the branching portion 40 of the flexible substrate 204 can be extended. An opening 245 is formed so that the electronic components 238 mounted in a row on the flexible substrate 204 can be stored.

  Here, for example, as shown in FIGS. 7 and 8, the opening 245 is formed in a substantially rectangular shape and completely penetrating along the side edge 42 on the projecting portion side of the first substrate 7. In the vicinity of the edge 42 on the side of the main body 39, the bottom 248 is formed so as to substantially coincide with a region E (E in FIG. 8) provided with a plurality of electronic components 238 other than the connectors arranged in a line. Yes.

  Further, the thickness of the opening 245 in the Z-axis (Z-axis in FIG. 8) direction is thicker than the height of the plurality of electronic components 238 other than the connector, which is the highest from the wiring pattern 36, for example. A resin frame 205 is formed on the surface. As a result, all electronic components 238 other than the connector are accommodated in the opening 245.

  Next, for example, as shown in FIGS. 7 and 8, the metal frame 250 has a substantially box shape opened upward (resin frame side), and is surrounded by a substantially frame-shaped side wall 251 and the side wall. Metal frame bottom 252.

  Here, the inner diameter of the side wall 251 is just large enough to accommodate the resin frame 205 and the liquid crystal panel 2, and the liquid crystal panel 2 and the flexible substrate 204 held by the resin frame 205 are more firmly fixed and held. Become.

  Further, a substantially rectangular metal frame notch 253 is formed on the side wall 251 of the side wall 251 as shown in FIG. 7, for example, from the metal frame notch 253 to the flexible substrate 204. The branch portion 40 extends to the outside, and a part of the main body portion 39 that is bent and protruded is accommodated.

  Further, for example, as shown in FIGS. 7 and 8, the metal frame bottom 252 is formed so as to cover all four side walls 251 from the bottom, and an electronic component other than a plurality of connectors viewed from the opening 245 of the resin frame 205. 238 and the like are covered with the metal frame bottom 252 from the outside.

  (Manufacturing method of liquid crystal device)

  Next, the liquid crystal device 201 configured as described above is substantially the same as the first embodiment except that a light source, an optical member unit, and the like are not provided, and conversely, a metal frame is provided. So, I will focus on that point.

  First, the liquid crystal panel 2 is manufactured. The manufacturing process is different in that the polarizing plate is not provided on the first embodiment and the first substrate 7, but the rest is substantially the same, and the description thereof is omitted.

  Next, a flexible substrate is manufactured and assembled to the liquid crystal panel 2.

  The base substrate 35 of the main body 39 and the branching portion 40 of the flexible substrate 204 is formed by a predetermined mold, and for example, a predetermined wiring pattern 36, a connection terminal, and the like are formed on the base substrate 35.

  Further, for example, as shown in FIG. 8, when electrically connected to the wiring pattern 36 and the flexible substrate 204 is just assembled to the liquid crystal panel 2 or the like, it is substantially parallel to the edge 42 on the side of the first substrate 7 and straight. Thus, all the electronic components 238 other than the connector are mounted on the main body 39 so that all the electronic components 238 other than the connector are accommodated in a region that overlaps the opening 245 of the resin frame 205 in a plane.

  After all the electronic components 238 other than the connectors are mounted on the flexible substrate 204, the main body connecting terminals of the main body 39 are electrically connected to the external terminals 23 of the liquid crystal panel 2 through the anisotropic conductive film 41. The main body 39 of the flexible substrate 204 is bent at the side edge 42 of the overhanging portion 16, and the main body 39 is opposite to the side of the overhanging portion 16 of the first substrate 7 where the X and Y driver ICs 19 and 20 are mounted. Turn around to the side.

  At this time, the electronic component 238 other than the plurality of connectors is mounted on the main body 39 just in a straight line, and the opposite side of the provided region E is bonded to the first substrate 7 with a double-sided adhesive tape. Further, for example, as shown in FIGS. 7 and 8, the branching portion 40 is in a state where it branches off from the main body portion 39 at an edge 42 on the side of the first substrate 7.

  Next, the liquid crystal panel 2 to which the flexible substrate 204 is connected is incorporated into the resin frame 205.

  7 and 8, the electronic component 238 other than the connector mounted on the main body 39 of the flexible substrate 204 connected to the liquid crystal panel 2 is accommodated in the opening 245 of the resin frame 205, and the liquid crystal panel 2 is Place on frame 205 and set.

  Next, the resin frame 205 to which the flexible substrate or the like is assembled is aligned so that the flexible substrate 204 or the like protruding near the side edge 42 by bending the metal frame 250 into the metal frame notch 253 is accommodated. The metal frame 250 is assembled to the resin frame 205 or the like.

  In addition, necessary parts are attached to complete the liquid crystal device 201.

  This is the end of the description of the method for manufacturing the liquid crystal device 201.

  As described above, according to the present embodiment, since the electronic component 238 other than the connector mounted on the flexible substrate 204 is accommodated in the opening 245 of the resin frame 205, the electronic component is conventionally accommodated in the resin frame. In addition, the thickness of the resin frame added to the thickness of the liquid crystal device as it is can be entirely accommodated in the opening 245, and the thickness of the liquid crystal device 201 can be reduced by the amount of the accommodation.

  In addition, since the electronic components 238 other than the plurality of connectors of the liquid crystal device 201 are arranged in a line on the flexible substrate, a region where the electronic components 238 other than the connectors are mounted can be further reduced. It is also possible to reduce the planar size of.

  Further, a metal frame 250 that holds the resin frame or the like from the outside is further provided, and the opening 245 of the resin frame 205 penetrates from the first substrate side to the opposite side, and the metal frame 250 is penetrated. Since the opening 245 is covered, the strength of the liquid crystal device itself can be increased, and the electronic component 238 other than the connector can be protected from foreign matters as compared with the case where the electronic component 238 other than the connector can be seen through the opening 245. It is possible to make the structure strong against external impact.

  (Fourth Embodiment / Electronic Device)

  Next, an electronic apparatus according to the fourth embodiment of the present invention that includes the liquid crystal devices 1, 101, and 201 described above will be described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 9 is a schematic configuration diagram showing an overall configuration of a display control system of an electronic apparatus according to the fourth embodiment of the present invention.

  The electronic device 300 includes, for example, a liquid crystal panel 2 and a display control circuit 390 as a display control system as shown in FIG. 9, and the display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, A timing generator 394 and the like are included.

  In addition, the liquid crystal panel 2 includes a drive circuit 361 that drives the display region L.

  The display information output source 391 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

  The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The power supply circuit 393 supplies a predetermined voltage to each component described above.

  As described above, according to the present embodiment, the liquid crystal device 1 used in the electronic device 300 includes the first electronic component 38 that is electrically connected to the flexible substrate 4 except for the connectors mounted on the flexible substrate 4. The electronic components are optically collected because they are collected in a region D (D in FIGS. 2 and 4) that overlaps in plan between the edge 42 on the side of the substrate 7 and the edge 60 of the optical member such as the light guide plate. Since the liquid crystal device 1 is prevented from increasing in thickness due to its electronic components, it does not overlap in a planar manner, and it is possible to provide electronic devices that are thinner, smaller, and more functional at a lower cost. it can.

  In particular, recent electronic devices are required to be more compact and highly functional electronic devices, and the significance of the present invention to provide such a small and thin electronic device is significant. I can say that.

  Specific electronic devices include touch panels equipped with liquid crystal devices in addition to mobile phones and personal computers, projectors, liquid crystal televisions and viewfinder types, video tape recorders with direct view of monitors, car navigation systems, pagers, electronic notebooks, A calculator, a word processor, a workstation, a video phone, a POS terminal, etc. are mentioned. Needless to say, for example, the liquid crystal devices 1, 101, and 201 described above can be applied as display units of these various electronic devices.

  Note that the electro-optical device and the electronic apparatus of the present invention are not limited to the above-described examples, and it is needless to say that various modifications can be made without departing from the gist of the present invention. Further, the above embodiments can be combined without departing from the scope of the present invention.

  Although the present invention has been described above with the preferred embodiment, the present invention is not limited to any of the above-described embodiments, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention.

  For example, in the above-described embodiment, the thin film transistor element active matrix type liquid crystal device has been described. However, the present invention is not limited to this. For example, a thin film diode element active matrix type or passive matrix type liquid crystal device may be used. As a result, a wide variety of liquid crystal devices can be made thinner and more functional at lower cost.

  In the above-described embodiment, the X and Y driver IC mounting is described as COG (Chip On Glass). However, the present invention is not limited to this. For example, in the case of COF (Chip On Film) mounted on the flexible substrate 4. In this case, the driver IC may be included in the electronic component 38 other than the connector. Thereby, it is possible to measure the thinning of the liquid crystal device 1 while securing a display area of the liquid crystal panel 2.

1 is a schematic exploded perspective view of a liquid crystal device according to a first embodiment. FIG. 2 is a partial cross-sectional view taken along line AA in FIG. 1 (X driver IC and electronic components are not cut). FIG. 3 is a cross-sectional view taken along line B-B in FIG. 2 (electronic parts are not cut). 1 is a partial bottom view of a liquid crystal device according to a first embodiment. It is a general | schematic disassembled perspective view of the liquid crystal device which concerns on 2nd Embodiment. FIG. 6 is a partial cross-sectional view taken along the line FF in FIG. 5 (X driver IC and electronic components are not cut). FIG. 6 is a schematic exploded perspective view of a liquid crystal device according to a third embodiment. FIG. 8 is a partial cross-sectional view taken along line GG in FIG. 7 (X driver IC and electronic components are not cut). It is a schematic block diagram of the display control system of the electronic device which concerns on 4th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,101,201 Liquid crystal device, 2 Liquid crystal panel, 3 Optical member unit, 4,204 Flexible substrate, 5,205 Resin frame, 6 Sealing material, 7 First substrate, 8 Second substrate, 9 Liquid crystal, 10, DESCRIPTION OF SYMBOLS 11 Polarizing plate, 12 Gate electrode, 13 Source electrode, 14, 28 Alignment film, 15 Pixel electrode, 16 Overhang part, 17 Gate electrode wiring, 18 Source electrode wiring, 19 X driver IC, 20 Y driver IC, 21 electrode Terminal, 22 input terminal, 23 external terminal, 24 input wiring, 25 bump, 26, 41 anisotropic conductive film, 27 common electrode, 29 light guide plate, 30, 31 prism sheet, 32 diffusion sheet, 33 reflection Sheet, 34 shading sheet, 35 base substrate, 36 wiring pattern, 3 Light source, electronic parts other than 38,238 connector, 39 body part, 40 branching part, 42 side edge, 43 frame, 44 holding part, 45,245 opening part, 46 light source notch part, 47 gap material, 49 Connector, 60 rim, 150,250 metal frame, 151,251 side wall, 152,252 metal frame bottom, 153,253 metal frame notch, 246 notch, 248 bottom, 300 electronics, 361 drive circuit, 390 display Control circuit, C display area, D overlapping area, E provided area

Claims (6)

A pair of substrates holding an electro-optic material, a circuit board electrically connected to a surface of the overhanging portion of one of the pair of substrates overhanging from the other substrate on the electro-optic material side, and An LED mounted on one surface of the circuit board, an electronic component other than a connector mounted on the one surface of the circuit board, an emission surface for emitting light toward the pair of substrates, and the LED An electro-optical device comprising: a light guide plate having a light receiving surface on which light is incident; and a resin frame that houses the light guide plate,
The circuit board is bent to the side where the light guide plate and the resin frame are disposed on the pair of boards, and the other than the LED and the connector is placed in an area overlapping the protruding portion of the bent circuit board. All of the components are arranged, and the LED is arranged in a region on the incident surface side of the light guide plate in an area overlapping the projecting portion of the bent circuit board, and an electronic device other than the connector The component is disposed in an outer region opposite to the incident surface side of the region where the LED is disposed,
The resin frame has an opening for accommodating all electronic components other than the connector, and a shape of the LED in the holding portion of the resin frame disposed between the light guide plate and the electronic components other than the connector. The electro-optical device is provided with a notch portion in which the incident surface side of the light guide plate is cut out correspondingly. The electro-optical device according to claim 1, wherein the circuit board is bonded to the substrate at least on the side opposite to a region where electronic components other than the connector are arranged. The one surface on which electronic components other than the LED and the connector are mounted is a surface of the bent circuit board on a side not facing the substrate. 2. The electro-optical device according to 2. 4. The electro-optical device according to claim 1, wherein the LED is arranged in a bent area of the circuit board. 5. A metal frame for holding at least the resin frame from the outside;
  The resin frame has an opening for storing an electronic component other than the connector and an opening for storing the light guide plate, and each of the openings is penetrated to the opposite side.
  5. The electro-optical device according to claim 1, wherein the metal frame covers at least each of the through-openings. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 5 .

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