JP4689055B2 - Semiconductor device for preventing tampering of pachinko machines - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device for preventing unauthorized modification of a pachinko machine , for example, a semiconductor device capable of preventing unauthorized modification such as illegally replacing a read-only memory (ROM) used in a pachinko game machine. is there.
[0002]
[Prior art]
Conventionally, semiconductor elements such as transistors, ICs, and LSIs are usually sealed with a ceramic package, a plastic package, or the like from the viewpoint of protection from the external environment and easy handling of the semiconductor elements, thereby forming a semiconductor device. Yes. The ceramic package itself is heat-resistant and has excellent moisture resistance, so it is durable against temperature and humidity, has excellent mechanical strength, and is reliable because it is a hollow package. High sealing is possible. However, in recent years, resin sealing using a plastic package has become the mainstream due to reasons such as relatively high constituent materials and inferior mass productivity.
[0003]
As a sealing resin used in such a resin composition for semiconductor sealing for plastic packages, an epoxy resin, a novolac-type phenol resin, and an inorganic filler are the main components, and a curing accelerator, a colorant, a release agent are included therein. What contains a mold agent etc. is used widely.
[0004]
Resin-encapsulated semiconductor devices formed by encapsulating semiconductor elements as described above are mainly black in appearance, but are also referred to as colored materials, containing pigments and dyes, white, Some of them are colored in red, green, yellow, etc. to improve discrimination.
[0005]
On the other hand, due to remarkable progress in computerization technology in recent years, the wave of computerization has rushed to every part of daily life, and the semiconductor devices as described above are incorporated in all electronic devices.
[0006]
Among them, semiconductor devices are incorporated in game machines even in pachinko games, which are popular entertainment. That is, recently, a pachinko machine installed in a pachinko amusement hall has, for example, a read-only memory (hereinafter referred to as “ROM”) on which a game content is stored mounted on a game board. By replacing this ROM, the pachinko machine can increase the number of consecutive jackpots by making it easier to make jackpots or changing the probability.
[0007]
By exchanging the ROM in this way, the jackpot of the pachinko game machine can be increased, so that illegal modification such as illegally replacing the ROM during the business hours or outside the business hours of the pachinko playground may be performed. is there. As a result, a large amount of prize balls may be illegally obtained and exchanged for prizes, thereby causing a great deal of damage to the amusement hall.
[0008]
[Problems to be solved by the invention]
The solutions to the above problems have been studied in the past, and there are methods such as devising that the front frame of the pachinko game machine can not be easily opened and closed, or performing constant monitoring with a surveillance video. . However, these methods are costly and cannot reliably confirm whether or not the ROM has been illegally exchanged.
[0009]
[Means for Solving the Problems]
Therefore, as a result of studying a method capable of very easily discriminating that the semiconductor is not a regular semiconductor device but an unauthorized semiconductor as described above, the present inventors have found that a semiconductor sealing resin used in manufacturing a semiconductor device. It has been found that by including a fluorescent pigment in the composition, it is possible to easily determine whether a regular semiconductor device is an illegally replaced semiconductor device by simply irradiating ultraviolet rays, and the present invention has been completed.
[0010]
That is, the present invention is a thermosetting resin, a phenol resin, a curing accelerator and a resin composition containing an inorganic filler, using a semi-conductor sealing resin composition containing a fluorescent pigment, a read-only A semiconductor device for preventing tampering of a pachinko machine in which a semiconductor element as a memory is sealed is provided.
[0011]
Preferably, an epoxy resin is used as the thermosetting resin, and the inorganic fluorescent pigment is contained in the resin composition in an amount of 0.05 to 7% by weight .
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0013]
A semiconductor device for preventing tampering of a pachinko machine according to the present invention includes a thermosetting resin, a curing agent, a curing accelerator, and an inorganic filler, and a resin composition for semiconductor encapsulation containing a fluorescent pigment Is used to seal a semiconductor element which is a read-only memory .
[0014]
As the thermosetting resin, epoxy resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, polyphenylene sulfide, and the like can be used. Among these, it is preferable to use an epoxy resin from the viewpoints of moldability, cured product characteristics, moisture resistance reliability, and solder resistance characteristics.
[0015]
In the semiconductor device for tamper prevention of the pachinko machine of the present invention, in the case of using an epoxy resin as a thermosetting resin in a semi-conductor sealing resin composition, the type of epoxy resin used is not limited in particular, Various epoxy resins known per se can be used. Specifically, a cresol novolac epoxy resin, a phenol novolac epoxy resin, a biphenyl epoxy resin, a bisphenol A epoxy resin, a naphthalene epoxy resin, or the like can be used. These epoxy resins can be used alone or in combination of two or more. Among these, it is preferable to use a cresol novolac type epoxy resin or a phenol novolac type epoxy resin from the viewpoint of easy viscosity adjustment.
[0016]
When such an epoxy resin is used as a resin composition for encapsulating a semiconductor, it is preferable to use a resin having a softening point in the range of 50 to 80 ° C, preferably 60 to 75 ° C. The epoxy equivalent is 190 to 220, preferably 198 to 210.
[0017]
Furthermore, the epoxy resin used in the present invention preferably has a viscosity at 150 ° C. of 4 to 20 poise, preferably 7 to 10 poise, in order to achieve the object of the present invention. By using an epoxy resin in the above viscosity range, the load on the kneader in the kneading step for obtaining the composition is reduced, and kneading stability is improved.
[0018]
Further, in the semiconductor device for preventing tampering of the pachinko machine of the present invention, the curing agent blended in the semiconductor sealing resin composition is not particularly limited as long as it cures the thermosetting resin. When an epoxy resin is used as the thermosetting resin, a novolac resin such as a phenol novolak resin or a cresol novolak resin, an acid anhydride such as tetrahydrophthalic anhydride, trimellitic anhydride, or benzophenonetetracarboxylic anhydride Products, amines such as diaminodiphenylmethane, metaphenylenediamine, and diaminodiphenyl ether can be used as the curing agent. In addition, although the compounding quantity of a hardening | curing agent is set in the range which does not degrade the sclerosis | hardenability of a thermosetting resin, and the characteristic of the hardened | cured material obtained, it is 6 to 10 weight% normally in the resin composition for semiconductor sealing, Preferably Is contained in the range of 7 to 9% by weight.
[0019]
Of these curing agents for epoxy resins, phenolic resins can be preferably used from the viewpoint of cured product characteristics and moisture resistance reliability. Such a phenol resin is not particularly limited as long as it has a phenolic hydroxyl group, and various phenol resins known per se can be used. Specifically, novolak-type phenol resins such as phenol novolac resins, phenol aralkyl resins such as xylylene-modified phenol resins, terpene-modified phenol resins, dicyclopentadiene-modified phenol resins, and the like can be used. These phenol resins can be used alone or in combination of two or more. Among these, when a cresol novolac type epoxy resin is used as the epoxy resin, it is preferable from the viewpoint of moldability to use a novolac type phenol resin as the phenol resin.
[0020]
The phenol resin preferably has a softening point in the range of 70 to 110 ° C., preferably 80 to 100 ° C. from the viewpoint of kneading workability, and has a hydroxyl equivalent of 100 to 120, preferably 100 to 110. It is preferable.
[0021]
In addition, in the semiconductor device for preventing tampering of the pachinko machine of the present invention, as a resin composition for semiconductor encapsulation , when a epoxy resin and a phenol resin as a curing agent are blended, as a curing accelerator blended together with these, Further, organic phosphorus compounds such as amines, imidazoles, phosphine compounds, and quaternary phosphonium compounds can be used. As the curing accelerator, a latent curing accelerator encapsulated in microcapsules having a core / shell structure can also be used. The blending amount of the curing accelerator can be appropriately set according to the type of the thermosetting resin and the type of the curing agent, but is usually set in the range of 0.2 to 0.6% by weight in the composition. To do.
[0022]
Further, the inorganic filler to be contained in the resin composition for semiconductor encapsulation together with the above-mentioned components is not particularly limited, and from the viewpoint of kneading workability and molding workability, the resin composition of the present invention. It is blended in the range of 50 to 90% by weight, preferably 70 to 80% by weight. Those known per se can be used. Specifically, silica powder such as fused silica powder, crystalline silica powder and amorphous silica powder, alumina powder, glass fiber, mica, talc, clay and the like are used. Among these inorganic fillers, when silica powder is used, any of crushed, spherical, or ground materials can be used, and these can be used alone or in combination of two or more. Can do.
[0023]
And as the whole said inorganic filler, it is preferable from the point of making fluidity | liquidity favorable to use the thing of an average particle diameter of the range of 6-40 micrometers. Further, among the above inorganic fillers, specifically, it is particularly preferable to use a ground crystalline silica or spherical fused silica powder from the viewpoint of good fluidity. From the viewpoint of the fluidity of the composition at the time of thermoforming, the preferable particle size distribution is 0.5% by weight or less for particles having a particle size of 149 μm or more, 60 to 95% by weight or less for particles having a particle size of 46 μm or less, 10 μm or less. It is preferable to use silica powder that is adjusted so that the amount is 40 to 70% by weight and that not more than 3 μm is 15 to 40% by weight.
[0024]
In the semiconductor device for preventing tampering of the pachinko machine according to the present invention, the resin composition for semiconductor encapsulation contains a fluorescent pigment. The fluorescent pigment to be used is not limited as long as it emits fluorescence, but it is preferable to use a phosphorescent fluorescent pigment from the viewpoint of moldability and heat resistance. Specifically, ZnS: at least and sulfides typified by Cu, Eu (Yuuropiunu) etc. activator and alkaline earth metal aluminates, oxygen acid salts, halides, selected from such as tungstates One kind can be used. Among these, it is preferable to use an aluminate or an oxyacid salt from the viewpoint of moisture resistance reliability.
[0025]
In the semiconductor device for preventing tampering of the pachinko machine of the present invention, the fluorescent pigment contained in the semiconductor sealing resin composition is capable of visually confirming light emission by being irradiated with ultraviolet rays, and is a composition from the viewpoint of visibility. 0.05 to 7% by weight, preferably 0.1 to 5% by weight. If the content is too small, the visibility is inferior. If the content is too large, the molding characteristics of the resin are deteriorated, which is not preferable.
[0026]
In the semiconductor device for preventing tampering of a pachinko machine according to the present invention, various additives can be appropriately blended in the semiconductor sealing resin composition as needed in addition to the above-described components. Examples of the additive include a release agent, a flame retardant, a silane coupling agent, and a stress reducing agent. The conventional resin composition for encapsulating semiconductors contains inorganic pigments such as metal oxides and ferrocyanides and carbon black as pigments, but when these various pigments are incorporated in large quantities. , even if both contain a fluorescent pigment, there is a possibility that light emission by the fluorescent pigment Ru is concealed, it is preferable to blend only fluorescent pigment as the pigment in the present invention.
[0027]
Examples of mold release agents include long-chain carboxylic acids such as stearic acid and palmitic acid, metal salts of long-chain carboxylic acids such as zinc stearate and calcium stearate, and waxes such as polyethylene wax, carnauba wax, and montan wax. Can be used.
[0028]
Examples of flame retardants include brominated epoxy resins, magnesium hydroxide, aluminum hydroxide, composite metal hydroxides, red phosphorus, and other flame retardant aids such as antimony trioxide and antimony pentoxide. Can be used.
[0029]
Examples of the stress-reducing agent include butadiene copolymer rubbers such as methyl acrylate-butadiene-styrene copolymer and methyl methacrylate-butadiene-styrene copolymer, and silicone compounds. Further, hydrotalcites and ion trapping agents such as bismuth hydroxide may be blended for the purpose of improving the reliability in the moisture resistance reliability test.
[0030]
In the semiconductor device for preventing tampering of the pachinko machine of the present invention, the resin composition for semiconductor sealing used for sealing the semiconductor element can be manufactured, for example, by the following steps.
[0031]
First, an epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, and, if necessary, the above additives are appropriately blended, and this mixture is melt-kneaded under heating. A kneader such as a mixing roll is used for kneading.
[0032]
Next, this kneaded material is compression-molded into tablets using a compression molding machine.
[0033]
In addition to the above kneading step, it is possible to add a step of further pulverizing the kneaded product after cooling, the powder. In other words, after the kneading step, the kneaded product is cooled through a cooling roll or the like, pulverized with a pulverizer to form a powder, and this is compressed into a tablet with a tableting machine or the like. On the other hand, when this pulverization step is not included, the kneaded product is transferred to a tableting machine in a molten state without being cooled, and directly formed into a tablet shape. When the production process includes a powder process, there is an advantage of uniform quality, and when forming directly into a tablet without including the powder process, there is an effect of preventing metal foreign matter from being mixed. These steps can be performed in batches in any case, but it goes without saying that a series of steps can be performed continuously.
[0034]
In the semiconductor device for preventing tampering of the pachinko machine of the present invention, the resin composition for semiconductor encapsulation is used to seal various electronic components such as semiconductor elements by a known molding method such as normal transfer molding . A semiconductor device for preventing unauthorized modification can be obtained.
[0035]
【Example】
Hereinafter, the present invention will be described in detail with reference to examples, but it goes without saying that various modifications and applications can be made without departing from the technical idea of the present invention.
[0036]
<Examples and Comparative Examples> Resin compositions for semiconductor encapsulation having the compositions described in the formulation table shown in Table 1 below were prepared.
[0037]
[Table 1]
[0038]
Each component in the composition described in Table 1 is as follows.
[0039]
Thermosetting resin A: cresol novolac type epoxy resin (epoxy equivalent 220, softening point 77 ° C.)
Thermosetting resin B: Brominated epoxy resin (epoxy equivalent 275, softening point 80 ° C., flame retardant resin)
Curing agent: phenol novolac resin (phenol equivalent 105, softening point 75 ° C.)
Curing accelerator: amine catalyst (1,8-diazabicyclo (5,4,0) -undecene-7)
・ Flame retardant: Antimony trioxide ・ Releasing agent: Natural wax ・ Silane coupling agent: (γ-glycidoxypropyltrimethoxysilane)
Fluorescent pigment A: manufactured by Nemoto Special Chemical Co., Ltd., trade name D1161 (green), composition formula BaMgAl10O17: Eu, Mn
Fluorescent pigment B: manufactured by Nemoto Special Chemical Co., Ltd., trade name D7021-1 (red), composition formula Y (P, V): Eu
Silica powder: crystalline silica, average particle size 30 μm
[0040]
The mixture obtained by blending each component shown in Table 1 above is melt-kneaded for 3 minutes with a mixing roll machine (temperature 100 ° C.), cooled and solidified, and then pulverized to obtain a powdery semiconductor sealing resin composition. It was.
[0041]
Next, using the resin composition obtained as described above, it was tableted and molded into a package (semiconductor device) of LQFP-114 (size: 20 mm × 20 mm × thickness 1.4 mm) with a TOWA automatic molding machine. .
[0042]
The semiconductor device thus obtained was irradiated with ultraviolet rays under the following conditions to examine the luminescent property (visibility) of the fluorescent color, and the results are also shown in Table 1.
[0043]
<Condition> The semiconductor device was irradiated from a distance of several centimeters using a handy UV lamp (model number EFN-260C / J).
[0044]
The evaluation criteria for visibility are as follows.
A: Uniform and clear light emission when irradiated with ultraviolet rays.
○: Irradiation with ultraviolet rays is uneven but emits light.
(Triangle | delta): Light emission is recognized slightly when irradiated with an ultraviolet-ray.
X: Light emission is not recognized even if it irradiates with an ultraviolet-ray.
[0045]
As is apparent from the results in Table 1 above, the example product containing the fluorescent pigment has extremely excellent visibility when exposed to ultraviolet rays, and is confirmed even when a regular semiconductor device is illegally replaced, for example. It is clear that this can be facilitated.
[0046]
【The invention's effect】
As described above, since the semiconductor device for preventing tampering of the pachinko machine according to the present invention contains a fluorescent pigment in a semiconductor sealing resin composition used for sealing a semiconductor element that is a read-only memory, Since the fluorescent color is developed simply by applying the light, it is possible to easily determine whether or not the regular semiconductor device is an illegally replaced semiconductor device. Therefore, it is possible to cope with illegal exchange or illegal modification of ROM in a pachinko amusement park.

Claims (4)

Thermosetting resin, a curing agent, the resin composition contains a curing accelerator and inorganic filler, using a semi-conductor sealing resin composition containing a fluorescent pigment, sealing the semiconductor element is a read-only memory A semiconductor device for preventing unauthorized modification of pachinko machines . 2. The semiconductor device for preventing tampering of a pachinko machine according to claim 1, wherein the thermosetting resin is an epoxy resin. 2. The semiconductor device for preventing unauthorized modification of a pachinko machine according to claim 1, wherein the curing agent is a phenol resin. 2. The semiconductor device for preventing tampering of a pachinko machine according to claim 1, wherein the fluorescent pigment is an inorganic pigment and is contained in an amount of 0.05 to 7% by weight in the resin composition.