JP4671309B1 - Addition type silicone resin composition - Google Patents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/54—Silicon-containing compounds
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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Abstract
【課題】ポリフタルアミド樹脂などの難接着性基材に対して優れた密着性を有するとともに、硫黄ガスバリアー性にも優れ、接着剤、シーリング剤、封止剤などとして有用な硬化性シリコーン樹脂組成物を提供する。
【解決手段】ＳｉＨ基と反応性を有する炭素−炭素二重結合を１分子中に少なくとも２個含有するオルガノポリシロキサン（ａ）、１分子中に少なくとも２個のＳｉＨ基を含有するオルガノ水素ポリシロキサン（ｂ）、付加反応触媒（ｃ）、（メタ）アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物（ｄ）を含有することを特徴とする付加型シリコーン樹脂組成物。
【選択図】なしThe present invention relates to a curable silicone resin that has excellent adhesion to difficult-to-adhere substrates such as polyphthalamide resins and also has excellent sulfur gas barrier properties, and is useful as an adhesive, sealing agent, sealant, and the like. A composition is provided.
An organopolysiloxane containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule (a), and an organohydrogenpolysiloxane containing at least two SiH groups in one molecule. An addition-type silicone resin composition comprising a reaction product (d) of siloxane (b), an addition reaction catalyst (c), a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent .
[Selection figure] None
Description
本発明はポリフタルアミド樹脂などの難接着性基材に対して優れた密着性を有するとともに、硫黄ガスバリアー性にも優れ、接着剤、シーリング剤、封止剤などとして有用な付加型シリコーン樹脂組成物に関する。 The present invention is an addition-type silicone resin that has excellent adhesion to difficult-to-adhere substrates such as polyphthalamide resins, and also has excellent sulfur gas barrier properties, and is useful as an adhesive, sealing agent, sealant, etc. Relates to the composition.
シリコーン樹脂は耐熱性に優れ、弾性を有することから接着剤、シーリング剤、封止剤などの各種用途に使用されており、最近ではＬＥＤの接着剤や封止剤としての需要が増加しつつある。ＬＥＤ部材には各種エンジニアリングプラスチックが使用されているため、シリコーン樹脂にはこれらのエンジニアリングプラスチックへの密着性が求められている。しかしながら、ポリフタルアミド樹脂などのエンジニアリングプラスチックへの密着性が十分ではなく、改良が求められている。また、ＬＥＤの導通や反射用金属として用いられる銀の腐蝕を抑制するため、硫黄ガスバリア性が求められている。 Silicone resins are excellent in heat resistance and have elasticity, so they are used in various applications such as adhesives, sealing agents, and sealants. Recently, demand for LED adhesives and sealants is increasing. . Since various engineering plastics are used for the LED member, the silicone resin is required to have adhesion to these engineering plastics. However, adhesion to engineering plastics such as polyphthalamide resin is not sufficient, and improvement is required. Moreover, in order to suppress the corrosion of silver used as a conductive metal or a reflective metal, a sulfur gas barrier property is required.
特許文献１〜４には、種々の付加硬化型シリコーン樹脂組成物が開示されているが、いずれもポリフタルアミド樹脂などのエンジニアリングプラスチックへの密着性が十分ではなく、更なる改良が必要であった。また、硫黄ガスバリア性についても十分ではなかった。
本発明はポリフタルアミド樹脂などの難接着性基材に対して優れた密着性を有するとともに、硫黄ガスバリアー性にも優れ、接着剤、シーリング剤、封止剤などとして有用な付加型シリコーン樹脂組成物を提供することである。 The present invention is an addition-type silicone resin that has excellent adhesion to difficult-to-adhere substrates such as polyphthalamide resins, and also has excellent sulfur gas barrier properties, and is useful as an adhesive, sealing agent, sealant, etc. It is to provide a composition.
本発明は、ＳｉＨ基と反応性を有する炭素−炭素二重結合を１分子中に少なくとも２個含有するオルガノポリシロキサン（ａ）、１分子中に少なくとも２個のＳｉＨ基を含有するオルガノ水素ポリシロキサン（ｂ）、付加反応触媒（ｃ）、（メタ）アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物（ｄ）を含有することを特徴とする付加型シリコーン樹脂組成物である。 The present invention relates to an organopolysiloxane (a) containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and an organohydrogenpolysiloxane containing at least two SiH groups in one molecule. An addition-type silicone resin composition comprising a reaction product (d) of siloxane (b), an addition reaction catalyst (c), a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent It is.
本発明の付加型シリコーン樹脂組成物はポリフタルアミド樹脂などのエンジニアリングプラスチックへの密着性に優れる。また、硫黄ガスバリアー性にも優れるため、ＬＥＤなどの各種電子部材の接着剤、シーリング剤、封止剤などとして特に適する。 The addition-type silicone resin composition of the present invention is excellent in adhesion to engineering plastics such as polyphthalamide resin. Moreover, since it is excellent also in sulfur gas barrier property, it is especially suitable as an adhesive agent, sealing agent, sealing agent, etc. of various electronic members, such as LED.
本発明の付加型シリコーン樹脂組成物の各成分について説明する。ＳｉＨ基と反応性を有する炭素−炭素二重結合を１分子中に少なくとも２個含有するオルガノポリシロキサン（ａ）は、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、イソブテニル基、ヘキセニル基などの炭素−炭素二重結合を１分子中に少なくとも２個含有するオルガノポリシロキサンである。オルガノポリシロキサンは例えば主鎖がジオルガノシロキサンの繰返し単位であり、末端がトリオルガノシロキサン構造であるものが例示され、分岐や環状構造を有するものであってもよい。末端や繰返し単位中のケイ素に結合したオルガノ構造としてはメチル基、エチル基、フェニル基などが例示される。具体例としては、両末端にビニル基を有するジメチルポリシロキサンが挙げられる。 Each component of the addition-type silicone resin composition of this invention is demonstrated. Organopolysiloxane (a) containing at least two carbon-carbon double bonds having reactivity with SiH group in one molecule is vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, An organopolysiloxane containing at least two carbon-carbon double bonds such as a hexenyl group in one molecule. Examples of the organopolysiloxane include those in which the main chain is a repeating unit of diorganosiloxane and the terminal has a triorganosiloxane structure, and may have a branched or cyclic structure. Examples of the organo structure bonded to silicon in the terminal or repeating unit include a methyl group, an ethyl group, and a phenyl group. Specific examples include dimethylpolysiloxane having vinyl groups at both ends.
１分子中に少なくとも２個のＳｉＨ基を含有するオルガノ水素ポリシロキサン（ｂ）は、末端および／または繰返し構造中において、２個以上のＳｉＨ基を含有するオルガノポリシロキサンである。オルガノポリシロキサンは例えば主鎖がジオルガノシロキサンの繰返し単位であり、末端がトリオルガノシロキサン構造であるものが例示され、分岐や環状構造を有するものであってもよい。末端や繰返し単位中のケイ素に結合したオルガノ構造としてはメチル基、エチル基、フェニル、オクチル基などが例示され、これらの２個以上が水素基に置換されたものである。 The organohydrogenpolysiloxane (b) containing at least two SiH groups in one molecule is an organopolysiloxane containing two or more SiH groups in the terminal and / or repeating structure. Examples of the organopolysiloxane include those in which the main chain is a repeating unit of diorganosiloxane and the terminal has a triorganosiloxane structure, and may have a branched or cyclic structure. Examples of the organo structure bonded to the terminal or silicon in the repeating unit include a methyl group, an ethyl group, a phenyl, and an octyl group, and two or more of these are substituted with a hydrogen group.
付加反応触媒（ｃ）は、前記（ａ）成分と前記（ｂ）成分のヒドロシリル化反応を促進させるために添加され、ヒドロシリル化反応の触媒活性を有する公知の金属、金属化合物、金属錯体などを用いることができる。特に白金、白金化合物、それらの錯体を用いることが好ましい。これらの触媒は単独で使用してもよく、２種以上を併用してもよい。また、助触媒を併用してもよい。付加反応触媒（ｃ）の配合量は組成物全体に対して１ｐｐｍ〜５０ｐｐｍとすることが好ましく、より好ましくは５〜２０ｐｐｍである。 The addition reaction catalyst (c) is added to promote the hydrosilylation reaction of the component (a) and the component (b), and a known metal, metal compound, metal complex or the like having catalytic activity for the hydrosilylation reaction is added. Can be used. In particular, it is preferable to use platinum, a platinum compound, or a complex thereof. These catalysts may be used alone or in combination of two or more. A cocatalyst may be used in combination. The addition amount of the addition reaction catalyst (c) is preferably 1 ppm to 50 ppm, more preferably 5 to 20 ppm, based on the entire composition.
本発明の付加型シリコーン樹脂組成物は前記（ａ）〜（ｃ）の各成分に加えて、（メタ）アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤の反応物（ｄ）を含有することを特徴とする。ここで、（ｄ）に代えて、単に（メタ）アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤を前記（ａ）〜（ｃ）の各成分と混合しても本願発明の効果は得られない。すなわち、（メタ）アクリロイル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤を予め反応させ、前記（ａ）〜（ｃ）の各成分と混合することが必要である。 In addition to the components (a) to (c), the addition type silicone resin composition of the present invention comprises a reaction product (d) of a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent. It is characterized by containing. Here, instead of (d), the effect of the present invention can be obtained by simply mixing a (meth) acryloyl group-containing silane coupling agent and an epoxy group-containing silane coupling agent with the components (a) to (c). Cannot be obtained. That is, it is necessary that the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent are reacted in advance and mixed with the components (a) to (c).
（メタ）アクリロイル基含有シランカップリング剤は、分子内に（メタ）アクリロイル基およびアルコキシシリル基などの反応性シリル基を有する化合物である。具体的には、γ−メタクリロキシプロピルメチルジメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルメチルジエトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、γ−アクリロキシプロピルトリメトキシシランなどが挙げられる。 A (meth) acryloyl group-containing silane coupling agent is a compound having a reactive silyl group such as a (meth) acryloyl group and an alkoxysilyl group in the molecule. Specifically, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane Etc.
エポキシ基含有シランカップリング剤は、分子内にエポキシ基およびアルコキシシリル基などの反応性シリル基を有する化合物である。エポキシ基含有シランカップリング剤の具体例として、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、γ−グリシドキシプロピルトリエトキシシランなどが挙げられる。 The epoxy group-containing silane coupling agent is a compound having a reactive silyl group such as an epoxy group and an alkoxysilyl group in the molecule. Specific examples of the epoxy group-containing silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ- Examples thereof include glycidoxypropyltriethoxysilane.
（メタ）アクリロイル基含有シランカップリング剤とエポキシ基含有シランカップリング剤を反応させる条件として、２３℃で雰囲気下であれば２４時間程度攪拌混合することにより十分に反応が進行する。同様に、６０℃で雰囲気下であれば８時間程度、８０℃雰囲気下であれば４時間、１００℃雰囲気下であれば２時間程度攪拌混合することにより十分に反応が進行する。 As a condition for reacting the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent, the reaction proceeds sufficiently by stirring and mixing for about 24 hours under an atmosphere at 23 ° C. Similarly, the reaction proceeds sufficiently by stirring and mixing for about 8 hours in an atmosphere at 60 ° C., for 4 hours in an atmosphere at 80 ° C., and for about 2 hours in an atmosphere at 100 ° C.
（メタ）アクリロイル基含有シランカップリング剤とエポキシ基含有シランカップリング剤を反応させる際に、さらにビニルトリメトキシシランやビニルトリエトキシシランなどのビニル基含有シランカップリング剤を反応させることもでき、この反応物を（ｄ）成分として用いることによって、密着性や硫黄ガスバリアー性をさらに向上させることができる。ただし、（メタ）アクリロイル基含有シランカップリング剤に代えてビニル基含有シランカップリング剤を用いた場合、すなわちビニル基含有シランカップリング剤およびエポキシ基含有シランカップリング剤のみを反応させた生成物を（ｄ）成分として用いた場合、本願発明の効果は発現しない。また、前記オルガノポリシロキサン（ａ）１００重量部に対して、（ｄ）成分を０．１〜２０重量部配合することが好ましく、０．５〜１０重量部配合することがより好ましい。 When the (meth) acryloyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent are reacted, a vinyl group-containing silane coupling agent such as vinyltrimethoxysilane or vinyltriethoxysilane can be further reacted. By using this reactant as the component (d), adhesion and sulfur gas barrier properties can be further improved. However, when a vinyl group-containing silane coupling agent is used instead of the (meth) acryloyl group-containing silane coupling agent, that is, a product obtained by reacting only the vinyl group-containing silane coupling agent and the epoxy group-containing silane coupling agent. When is used as the component (d), the effect of the present invention is not exhibited. Moreover, it is preferable to mix | blend 0.1-20 weight part of (d) component with respect to 100 weight part of said organopolysiloxane (a), and it is more preferable to mix | blend 0.5-10 weight part.
本発明の硬化性シリコーン樹脂組成物には前記必須成分の他、各種樹脂、添加剤を配合できる。希釈剤の配合により、粘度、柔軟性等を調整できる。その具体例として、フタル酸ジメチル、フタル酸ジエチル、フタル酸ジブチル、フタル酸ジ２−エチルヘキシルなどフタル酸エステル系の希釈剤、ジメチルシリコーンオイル、アルキル変性シリコーンオイル、ポリエーテル変性シリコーンオイル等のシリコーンオイル、アジピン酸ジオクチル、アジピン酸ジイソノニル、アゼライン酸ジアルキル、セバシン酸ジブチル、エポキシ化大豆油、ポリプロピレングリコール、アクリルポリマー、α−オレフィンやその誘導体、植物油由来脂肪酸の２−エチルヘキシルエステル化合物等が挙げられる。 In addition to the essential components, various resins and additives can be blended in the curable silicone resin composition of the present invention. Viscosity, flexibility, etc. can be adjusted by blending the diluent. Specific examples include phthalate-based diluents such as dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-2-ethylhexyl phthalate, silicone oils such as dimethyl silicone oil, alkyl-modified silicone oil, and polyether-modified silicone oil. , Dioctyl adipate, diisononyl adipate, dialkyl azelate, dibutyl sebacate, epoxidized soybean oil, polypropylene glycol, acrylic polymer, α-olefin and derivatives thereof, vegetable oil-derived fatty acid 2-ethylhexyl ester compounds, and the like.
粘度調整、粘性調整、増量などを目的として、炭酸カルシウム、硅砂、タルク、カーボンブラック、酸化チタン、カオリン、二酸化ケイ素、メラミン等の充填材、硬化樹脂の補強のためにガラス繊維等の補強材、軽量化及び粘度調整などのためにシラスバルーン、ガラスバルーン等の中空体を添加できる。その他、酸化防止剤、顔料、防腐剤などを適宜使用することができる。 For the purpose of adjusting viscosity, adjusting viscosity, increasing weight, etc., fillers such as calcium carbonate, cinnabar, talc, carbon black, titanium oxide, kaolin, silicon dioxide, melamine, reinforcing materials such as glass fiber for reinforcing cured resin, Hollow bodies such as shirasu balloons and glass balloons can be added for weight reduction and viscosity adjustment. In addition, antioxidants, pigments, preservatives, and the like can be used as appropriate.
以下、本発明について実施例、比較例を挙げてより詳細に説明するが、具体例を示すものであって、特にこれらに限定するものではない。 EXAMPLES Hereinafter, although an Example and a comparative example are given and demonstrated in detail about this invention, a specific example is shown and it does not specifically limit to these.
反応物の調製
γ−メタクリロキシプロピルトリメトキシシラン（信越化学工業社製、商品名ＫＢＭ−５０３）１重量部、γ−グリシドキシプロピルトリメトキシシラン（信越化学工業社製、商品名ＫＢＭ−４０３）１重量部を２３℃雰囲気下で２４時間攪拌混合し、反応物１を得た。また、前記化合物の他にビニルトリメトキシシラン（信越化学工業社製、商品名ＫＢＭ−１００３）を用い、表１の配合、反応条件にて同様に反応物２〜１２を得た。
Preparation of reaction product 1 part by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-503), γ-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-403) ) 1 part by weight was stirred and mixed in an atmosphere of 23 ° C. for 24 hours to obtain a reaction product 1. In addition to the above compounds, vinyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-1003) was used, and reactants 2 to 12 were obtained in the same manner under the composition and reaction conditions shown in Table 1.
付加型シリコーン樹脂組成物の調製
ポリメチルビニルシロキサン（粘度８．１Ｐａ・ｓ）１００重量部に前記反応物１を１重量部添加した。次いで付加反応触媒として白金−ビニルシロキサン錯体を組成物全体に対して１０ｐｐｍとなるよう添加し、さらにメチル水素ポリシロキサン（粘度４．９Ｐａ・ｓ）１０重量部を添加混合することにより、実施例１の付加型シリコーン樹脂組成物を調製した。
Preparation of Addition Type Silicone Resin Composition 1 part by weight of the reaction product 1 was added to 100 parts by weight of polymethylvinylsiloxane (viscosity 8.1 Pa · s). Next, a platinum-vinylsiloxane complex was added as an addition reaction catalyst so as to be 10 ppm relative to the entire composition, and 10 parts by weight of methylhydrogenpolysiloxane (viscosity 4.9 Pa · s) was added and mixed. The addition type silicone resin composition was prepared.
実施例１において、反応物１に代えて表２、３記載の配合にて各反応物、各シランカップリング剤を添加した他は実施例１と同様に行い、実施例２〜１４、比較例１〜７の各付加型シリコーン樹脂組成物を得た。 In Example 1, it replaced with the reactant 1 and carried out similarly to Example 1 except having added each reactant and each silane coupling agent by the mixing | blending of Table 2, 3, Example 2-14, a comparative example Each addition type silicone resin composition of 1-7 was obtained.
硬度
各付加型シリコーン樹脂組成物を１５０℃で１時間加熱することにより硬化させ、厚み２ｍｍの試験体を作成した。ＪＩＳ Ｋ６３０１に準拠し、硬度計Ａを用いて硬度を測定した。
Hardness Each addition type silicone resin composition was cured by heating at 150 ° C. for 1 hour to prepare a specimen having a thickness of 2 mm. The hardness was measured using a hardness meter A in accordance with JIS K6301.
密着性
各付加型シリコーン樹脂組成物をポリフタルアミド樹脂板（幅２５ｍｍ、２ｍｍ厚）に塗布量５０ｇ／ｍｍ2で塗布し、別のポリフタルアミド樹脂板（幅２５ｍｍ、２ｍｍ厚）を長さ方向に２５ｍｍ重なり合うように貼り合わせてクリップで固定し、１５０℃雰囲気下で１時間硬化させた。２３℃雰囲気下で２４時間養生後、引張り速度５０ｍｍ／分でせん断試験を行い、強度の測定および破壊状態の確認を行った。また、被着材として半光沢銀メッキＳＵＳ板（幅２５ｍｍ、１００μｍ厚、メッキ厚３〜７μｍ）を用いて、同様にせん断強度の測定および破壊状態の確認を行った。
Adhesiveness Each addition type silicone resin composition was applied to a polyphthalamide resin plate (width 25 mm, 2 mm thickness) at an application amount of 50 g / mm 2 , and another polyphthalamide resin plate (width 25 mm, 2 mm thickness) was lengthened. They were pasted so as to overlap each other by 25 mm, fixed with clips, and cured at 150 ° C. for 1 hour. After curing for 24 hours in an atmosphere of 23 ° C., a shear test was performed at a pulling rate of 50 mm / min, and the strength was measured and the fracture state was confirmed. Further, using a semi-glossy silver plated SUS plate (width 25 mm, 100 μm thickness, plating thickness 3 to 7 μm) as an adherend, the shear strength was measured and the fracture state was confirmed in the same manner.
腐食性
銀メッキを施した銅板上に各付加型シリコーン樹脂組成物を塗布し、１５０℃で１時間加熱することにより硬化して厚み２ｍｍの皮膜を形成した。該銅板を硫黄粉０．２ｇと共に１００ｃｃガラスビンに封入し、６０℃または８０℃雰囲気下で２４時間放置した。放置後に銅板を取り出してシリコーン皮膜を剥がし、銀メッキの腐食の程度を確認して以下のように評価した。
○ ：腐食なし
△ ：部分的に腐食（薄い黒色）
× ：全面腐食（黒色化）
Each addition type silicone resin composition was apply | coated on the copper plate which gave corrosive silver plating, and it hardened | cured by heating at 150 degreeC for 1 hour, and formed the film | membrane with a thickness of 2 mm. The copper plate was sealed in a 100 cc glass bottle with 0.2 g of sulfur powder, and left in a 60 ° C. or 80 ° C. atmosphere for 24 hours. After leaving, the copper plate was taken out, the silicone film was peeled off, and the degree of corrosion of the silver plating was confirmed and evaluated as follows.
○: No corrosion △: Partially corroded (light black)
×: Overall corrosion (blackening)
実施例の各付加型シリコーン樹脂組成物はポリフタルアミド樹脂に対して優れた密着性を有しおり、６０℃における硫黄ガスバリアー性にも優れていた。さらに、実施例３〜１４においては、半光沢銀メッキＳＵＳに対しても優れた密着性を有しており、８０℃における硫黄ガスバリアー性にも優れていた。一方、比較例の各付加型シリコーン樹脂組成物はポリフタルアミド樹脂や半光沢銀メッキＳＵＳに対する密着が低く、硫黄ガスバリアー性が低いため銀が腐食されていた。 Each addition-type silicone resin composition of the example had excellent adhesion to the polyphthalamide resin, and was excellent in sulfur gas barrier properties at 60 ° C. Furthermore, in Examples 3 to 14, it had excellent adhesion to semi-glossy silver plating SUS and was excellent in sulfur gas barrier properties at 80 ° C. On the other hand, each addition type silicone resin composition of the comparative example had low adhesion to the polyphthalamide resin and semi-glossy silver plating SUS, and silver was corroded because of low sulfur gas barrier property.
Claims (3)
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| JP2010146333A JP4671309B1 (en) | 2010-06-28 | 2010-06-28 | Addition type silicone resin composition |
| TW100120656A TWI428374B (en) | 2010-06-28 | 2011-06-14 | Adductive silicone resin composition |
| KR1020110062804A KR101269278B1 (en) | 2010-06-28 | 2011-06-28 | Additiontype silicone resin composition |
| CN2011101794546A CN102295836B (en) | 2010-06-28 | 2011-06-28 | Addition type silicone resin composition |
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| JP2010146333A JP4671309B1 (en) | 2010-06-28 | 2010-06-28 | Addition type silicone resin composition |
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| KR (1) | KR101269278B1 (en) |
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| JP6084377B2 (en) * | 2012-06-21 | 2017-02-22 | アイカ工業株式会社 | Addition type silicone resin composition and sealant for optical semiconductor device |
| JP6211251B2 (en) * | 2012-06-21 | 2017-10-11 | アイカ工業株式会社 | Addition type silicone resin composition and sealant for optical semiconductor device |
| JP6168754B2 (en) * | 2012-11-16 | 2017-07-26 | アイカ工業株式会社 | Addition type silicone resin composition and sealant for optical semiconductor device |
| MY155102A (en) * | 2013-01-09 | 2015-09-07 | Daicel Corp | Curable resin composition, and cured product of same |
| CN103113846B (en) * | 2013-03-12 | 2014-12-31 | 深圳市博恩实业有限公司 | Heat-conducting silica gel sheet and manufacturing method thereof |
| CN106810698A (en) * | 2016-12-30 | 2017-06-09 | 佛山市功能高分子材料与精细化学品专业中心 | A kind of epoxy silicones tackifier and its organosilicon thermal conductive insulation glue of preparation |
| CN109796928B (en) * | 2019-01-11 | 2020-10-16 | 北京天山新材料技术有限公司 | Organosilicon sealant, device sealed by using organosilicon sealant and application of organosilicon sealant |
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Also Published As
| Publication number | Publication date |
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| TWI428374B (en) | 2014-03-01 |
| TW201204769A (en) | 2012-02-01 |
| JP2012007126A (en) | 2012-01-12 |
| KR20120001655A (en) | 2012-01-04 |
| KR101269278B1 (en) | 2013-05-29 |
| CN102295836A (en) | 2011-12-28 |
| CN102295836B (en) | 2013-10-30 |
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