JP4665599B2 - Droplet discharge head and printing apparatus - Google Patents

Description

  One aspect of the invention relates to a chip element in which circuit elements for discharging droplets are integrated in a semiconductor layer. One embodiment of the present invention relates to a droplet discharge head in which a chip element is mounted on a substrate. One embodiment of the present invention relates to a printing apparatus equipped with a droplet discharge head.

Here, an ink jet printer which is an example of a printing apparatus will be described.
In recent years, ink jet printers have become popular and have become familiar. Currently, a serial scan method is widely used as a printing method for inkjet printers. The serial scan method is a method of printing while reciprocating a print head having a size smaller than the recording width.
The serial scan method has fewer print head components and is advantageous in reducing manufacturing costs. However, since a reciprocating operation is required, there is a problem that the printing time becomes long.

In addition, there is a line method as a printing method of the ink jet printer. The line method refers to a method of printing using a print head having a size equal to or larger than the recording width. This print head is also called a line head. Unlike the serial scan method, the line head does not require reciprocal movement. Therefore, it is possible to print at a higher speed than the serial scan method.
However, the line head has more components than the serial scan method, and the manufacturing cost tends to be high.
Therefore, the applicant adopts a method in which a line head is configured by bonding a plurality of chip elements manufactured by applying semiconductor manufacturing technology.

FIG. 1 shows a conventional example of a line head. FIG. 1 is a cross-sectional view of a line head. The line head has a structure in which the chip element 3 is bonded to the upper surface of the substrate 1. The chip element 3 includes a heating element 3b formed on the semiconductor substrate 3a and a coating layer 3c that covers the surface of the heating element 3b. A nozzle (droplet discharge port) 5 is processed in the coating layer 3c at a position facing the heating element 3a. In addition, an individual flow path 7 is formed in the coating layer 3c to guide ink to a liquid chamber (a space below the nozzles, where the heating element 3b is disposed). The semiconductor substrate 3 a is formed with a through hole 11 that couples the common flow path 9 and the individual flow path 7.
Japanese Patent No. 3343875

By the way, for the formation of the through hole 11, anisotropic etching or dry etching is usually used.
However, both have problems that the etching rate is slow and the processing time is long. In addition, an etching mask that protects the region other than the through hole 11 is required, and there is a problem that the manufacturing process is complicated.

  The inventors pay attention to the above technical problems and propose a chip structure that realizes further reduction in manufacturing cost. That is, a chip structure in which a through hole is not formed in a semiconductor substrate is proposed. At this time, the inventors adopt a structure in which a drive element region, a heating element region, and a control circuit region are sequentially arranged from the side surface end portion of the semiconductor chip that is in contact with the liquid common flow path in the liquid chamber arrangement direction.

  In the case of the chip element according to the invention, there is no need to provide a through hole for coupling to the common flow path in the semiconductor substrate. Therefore, the manufacturing time of the chip element can be greatly shortened by the time required for the processing. In the case of this chip element, since the drive element region is located on the side end side in contact with the common flow path, the upper surface portion can be used as a bonding area for a sealing member that seals the opening of the common flow path. Therefore, it is possible to eliminate the bonding region (margin portion) of the sealing member, and the chip element area can be reduced. Thereby, reduction of manufacturing cost is realizable.

Hereinafter, embodiments of a droplet discharge head on which the chip element according to the invention is mounted will be described.
In addition, the well-known or well-known technique of the said technical field is applied to the part which is not illustrated or described in particular in this specification.
In addition, the element structure and the manufacturing method described below are one form of the invention and are not limited thereto.

(A) Manufacturing Process of Droplet Discharge Head Here, a droplet discharge head (hereinafter referred to as a “printing head”) that ejects ink droplets with the pressure of bubbles generated by heating by a heating element (thermal method). The case of manufacturing will be described.
FIG. 2 to FIG. 6 show examples of manufacturing processes of the print head 9020. The print head means a chip device (assembly part) in which a nozzle is processed on a coating layer that covers the surface of a chip element in which circuit elements for discharging liquid droplets are integrated.

First, as shown in FIG. 2, circuit elements are formed on the semiconductor substrate 21. For the substrate constituting the semiconductor substrate 21, for example, silicon, glass, ceramics or other materials are used. A heating element 23 is formed on the semiconductor layer on the surface of the semiconductor substrate 21 by a semiconductor manufacturing technique (first step).
Here, the heating elements 23 are formed in the longitudinal direction of the semiconductor substrate 21 at the same interval as the nozzle pitch. In the case of FIG. 2, the direction perpendicular to the paper surface corresponds to the longitudinal direction of the semiconductor substrate 21. For example, when it is desired to manufacture a 600 DPI print head, the heating elements 23 are formed at intervals of 42.3 (μm). In the case of the semiconductor substrate shown in FIG. 2, six chip elements can be cut out at a time.
In this step, driving elements and control circuits are also formed in the semiconductor layer on the surface of the semiconductor substrate 21. The arrangement pattern of circuit elements will be described later.

Next, the sacrificial layer 25 corresponding to the individual flow paths for guiding the ink to the individual liquid chambers is formed by the patterning process (second step). For the sacrificial layer 25, for example, a soluble resin material is used.
Next, the surface of the semiconductor substrate 21 (including the sacrificial layer 25) is covered with a covering layer 27 (third step). For the covering layer 27, for example, a photo-curable epoxy resin is used. The coating layer 27 is applied by, for example, a spin coating method.
Next, the nozzle 27a is formed on the coating layer 27 (fourth step). The nozzle 27 a is formed so as to be positioned directly above the heat generating element 23. Here, the lower end (bottom) of the nozzle 27 a is formed so as to reach the sacrificial layer 25. That is, the nozzle 27 a is formed so as to penetrate the coating layer 27.

Next, as shown in FIG. 3, the semiconductor substrate 21 is cut into a plurality of chip elements at the position of the cut line L (fifth step). For example, a dicer is used for cutting the semiconductor substrate 21. The cut line L is an intermediate position between the heat generating element 23 and the heat generating element 23. In the case of FIG. 3, six chip elements are cut out from one semiconductor substrate 21. In the case of FIG. 3, the cross-sectional structures of two adjacent chip elements are symmetric. By this cutting, a chip element in which the sacrificial layer 25 is exposed on one side surface is generated.
As described above, the cutting of the semiconductor substrate 21 is performed before the sacrifice layer 25 is removed. Incidentally, it is not preferable to remove the sacrificial layer 25 before cutting the semiconductor substrate 21 because the void after the removal becomes an escape portion and affects the processing accuracy.

Next, the sacrificial layer 25 is removed from the chip element (sixth step). FIG. 4 shows an example of removal. FIG. 4 shows a method of immersing the chip element in the liquid tank 33 filled with the dissolving liquid 31. The solution 31 to be used is selected according to the material of the sacrificial layer 25.
When the chip element is immersed in the solution 31, only the sacrificial layer 25 is dissolved and flows out (elutes) outside the chip element. At this time, since the coating layer 27 is not dissolved in the solution 31, there is no change in the shape of the coating layer 27. As a result, a void is formed only in the portion where the sacrificial layer 25 was present. This gap becomes the individual flow path 35 including the liquid chamber. The formed individual flow path 35 communicates with the nozzle 27a.
The sacrificial layer 25 may be removed by spraying the solution 31 from the side surface of the chip element.

Through the above steps, the chip element in which the individual flow path 35 is formed inside the coating layer 27 is completed.
Next, as shown in FIG. 5, the chip element is bonded to the base 37 of the print head (seventh step). As the material of the base 37, for example, aluminum, stainless steel, ceramics, resin, or the like is used.
In the case of this embodiment, a through hole corresponding to the common flow path 39 is formed in the base 37, and the chip element is mounted on a step portion formed on a part of the inner wall constituting the through hole. For example, an adhesive is used for mounting. The side surface of the chip element where the opening of the individual flow path 35 exists constitutes the inner wall surface of the common flow path 39 together with the base 37.
The step portion is formed to be one step lower than the facing side so that when the chip element is attached, the surface of the chip element and the substrate 37 have the same height.

Thus, when the mounting of the chip element to the base 37 is completed, the opening of the common flow path 39 exposed on the upper surface of the base 37 is integrally sealed with the upper surface of the chip element as shown in FIG. Eighth step). A top plate 41 (sealing member) is used for sealing the opening.
The top plate 41 is a sheet-like member. As the material of the top plate 41, for example, polyimide, PET or other resin film, nickel, aluminum, stainless steel or other metal foil is used. The top plate 41 and the base 37 (including the chip element) are bonded with the adhesive layer 43 interposed therebetween. By the bonding of the top plate 41, the opening on the upper surface side of the common flow path is completely closed. Note that a water-resistant silicone adhesive is used as the adhesive.

By sealing with the top plate 41, an ink flow path from the common flow path 39 to the nozzle 27a via the individual flow path 35 is formed.
Ink is ejected by heating the heating element 23 in a state where the ink is filled in the lower region of the nozzle 27a (the space where the heating element 23 is formed). That is, a part of the ink is formed into droplets by the pressure change (expansion and contraction of the bubbles) of the bubbles growing from the surface of the heated heating element 23, and is discharged to the outside from the nozzle 27a. In FIG. 6, the flow of ink is indicated by arrows.

(B) Arrangement Example of Circuit Elements FIG. 7 shows an example circuit pattern of chip elements proposed in this specification. FIG. 7 is a diagram showing the entire chip element from the upper surface side.
In the case of this chip element, the drive transistor part (drive element area) 51 and the heater part (heat generation) are arranged in the direction in which the liquid chamber is arranged from the end on the side in contact with the common flow path when mounted on the substrate constituting the print head. The element region 53, the logic circuit portion (control circuit region) 55, and the electrode portion 57 are arranged in this order.

The drive transistor unit 51 is a region in which drive elements that drive the heating elements are arranged in the longitudinal direction. A transistor is used as the drive element. When the transistor is on, the driving current is supplied to the heat generating element, and when the transistor is off, the supply of the driving current is stopped.
The heater unit 53 is a region where the heating elements are arranged in the longitudinal direction. The heating elements are arranged at a nozzle pitch. A resistor is used for the heating element. When the drive current is supplied, the heating element generates heat. When the liquid chamber is filled with ink, ink droplets are ejected from the nozzle to the outside due to the pressure of bubbles that grow due to the heat generated by the heating element.

The logic circuit section 55 is an area where circuit elements (control circuit elements) for controlling the operation of the drive elements are arranged.
The electrode part 57 is a terminal for supplying power necessary for driving the circuit element formed in the chip element. Two types of electrodes are provided, one for supplying power supply potential (VDD) and the other for supplying ground potential (GND).
FIG. 8 shows a partial cross-sectional structure of the print head. As shown in FIG. 8, the top plate 41 that seals the upper surface opening of the common channel 39 is bonded to the coating layer 27 at the upper surface position of the drive transistor portion 51 of the chip element. In addition, the edge part of the top plate 41 is sealed with the adhesive agent 43a. That is, the region where the driving transistor unit 51 is arranged is used as a marginal region.

FIG. 8 also shows a connection structure between the electrode exposed on the surface of the chip element and the printed wiring board 61 (adhered to the base 37). The electrode of the electrode part 57 is connected to the printed wiring board 61 via the bump 63, the conductor layer 65, and the bump 63. Incidentally, the upper surface is covered with a protective layer 67.
FIG. 9 is a plan view of the structure of the print head as seen transparently from above. The top plate 41 and the coating layer 67 cover the vicinity of both sides of the heater unit 53.

FIG. 10 shows another circuit pattern example of the chip element. 10, parts corresponding to those in FIG. 7 are denoted by the same reference numerals.
The difference between FIG. 10 and FIG. 7 is two points, that is, the arrangement of the drive transistor portion 51 and the heater portion 53 is opposite and the margin portion 71 exists. The marginal part 71 is an area required by replacing the arrangement of the drive transistor part 51 and the heater part 53. This is because the top plate 41 cannot be bonded to the upper surface of the heater portion 53.
Since the margin part 71 exists, the heater part 53, the drive transistor part 51, and the logic circuit part 55 can be arranged.

However, the width L2 of the chip element having the structure shown in FIG. 10 is longer than the width L1 of the chip element having the structure shown in FIG. This is because the drive transistor unit 51, the heater unit 53, the logic circuit unit 55, and the electrode unit 57 are all the same size.
For this reason, from the viewpoint of manufacturing cost, the chip element having the narrow chip width shown in FIG. 7 is superior to the chip element having the structure shown in FIG.
By adopting the circuit arrangement shown in FIG. 7 as the structure of the chip element, the number of chip elements that can be cut out from one substrate can be increased. Accordingly, the manufacturing cost of the chip element can be reduced. Therefore, the inventors recommend the circuit arrangement shown in FIG.

(C) Arrangement Example of Wiring Pattern Next, an arrangement example of the wiring pattern for the power supply potential (VH) and the wiring pattern for the ground potential (GND) is shown. There are two types of wiring pattern arrangement, one-layer type and two-layer type.

(A) One-layer type FIG. 11 shows an arrangement example of one-layer wiring patterns. The arrangement example shown in FIG. 11 uses one electrode for each of the power supply potential (VH) and the ground potential (GND).
In the case of FIG. 11, the ground potential (GND) wiring pattern 81 is arranged in an L shape from the electrode 83 so that one side thereof is along the outer edge of the driving transistor unit 51. On the other hand, the wiring pattern 85 for the power supply potential (VH) and the ground potential (GND) is arranged from the electrode 87 in an L shape so that one side thereof extends between the heater portion 53 and the logic circuit portion 55.

FIG. 11 also shows a supply path of current supplied to two arbitrarily selected heating elements. In either case, the supply path length is the same. Of course, the other heating elements have the same supply path length.
FIG. 12 shows another arrangement example of the wiring pattern. The arrangement example shown in FIG. 12 uses two electrodes for the power supply potential (VH) and the ground potential (GND). Also in this case, the supply path length of the current flowing through an arbitrary heating element is the same.
In the case of FIG. 12, the supply path for the current flowing into the heating element and the outflow path for the current flowing out from the heating element can be branched into two.

As a result, the effective resistance value between the heating element and each potential electrode can be reduced. That is, the effective wiring length can be shortened. Accordingly, the energy consumed in the wiring portion can be reduced. As a result, the energy that can be applied to the heating element can be made larger than in the case of FIG.
When the applied energy is increased, the ink droplet ejection speed can be increased. Accordingly, it is possible to shorten the time until ink droplets land on the recording medium.
FIG. 13 shows an equivalent circuit corresponding to the wiring patterns of FIGS.

(B) Two-layer type FIG. 14 shows an arrangement example of a two-layer wiring pattern. In the arrangement example shown in FIG. 14, the ground potential (GND) is arranged in the first layer (lower hierarchy), and the power supply potential (VH) is arranged in the second layer (upper hierarchy). In FIG. 14, the wiring pattern for the power supply potential is indicated by a thick line, and the wiring pattern for the ground potential is indicated by a thin line.
Since the wiring patterns can be arranged in two layers, the wiring patterns for the ground potential (GND) and the power supply potential (VH) can be arranged along the longitudinal outer edge of the heater portion 53. As a result, it is possible to supply each potential at the shortest distance from each wiring pattern arranged along the outer edge in the longitudinal direction of the heater unit 53 to the corresponding element.

FIG. 14 shows a case where a plurality of electrodes for each potential are used. That is, FIG. 14 is the same as the case where there are two electrodes for each potential in the one-layer wiring pattern (FIG. 12). Therefore, even in the case of this two-layer wiring pattern, it is possible to have one electrode for each potential.
Incidentally, in FIG. 14, it is assumed that there are two electrodes for power supply potential (VH) and three electrodes for ground potential (GND). Therefore, the effective resistance value between the heating element and each potential electrode can be reduced. In other words, FIG. 14 shows an example of a case where the effective wiring length is shortened to increase the energy that can be applied to the heating element.
FIG. 15 shows an equivalent circuit corresponding to the wiring pattern of FIG.

The actual wiring pattern employs the structure shown in FIGS. Among these, FIG. 16 to FIG. 18 show examples of wiring patterns of each layer corresponding to FIG. FIG. 19 is a diagram in which the wiring patterns of the respective layers shown in FIGS. 16 to 18 are viewed from the surface side of the chip element.
FIG. 16 shows a wiring pattern example of the second layer (upper layer). FIG. 16 shows the vicinity of the heater unit 53. The wiring pattern 85 is for supplying a power supply potential (VH), and is connected to one terminal of the heating element 89. The other end of the heating element 89 is connected to a wiring pattern 91 that is connected to the first level wiring (transistor drain terminal).

FIG. 17 shows a wiring pattern example of the first layer (lower layer). FIG. 17 also shows the vicinity of the heater unit 53. The wiring pattern 81 is for supplying a ground potential (GND), and is connected to the source terminal of the transistor through a region between the heating element 89 and the heating element. Note that the drain terminal of the transistor is connected to the second-level wiring pattern 91.
FIG. 18 shows a control wiring pattern 93 for controlling the operation of the transistor as the driving element. The end of the wiring pattern on the drive transistor unit 51 side is connected to the gate terminal of the transistor. On the other hand, the opposite end portion of the wiring pattern is connected to the terminal of the logic circuit portion 55.

The wiring pattern 93 is also arranged so as to pass through a region between the heating element 89 and the heating element. In the case of this embodiment, the control wiring pattern 93 is arranged in a lower hierarchy than the ground potential (GND) wiring pattern 81.
Note that the above-mentioned notation of “first layer” and “second layer” is a meaning for explaining the hierarchical relationship between the wiring pattern for ground potential (GND) and the wiring pattern for power supply potential (VH). .
FIG. 19 shows a positional relationship in which wiring patterns of all layers are overlapped.

(D) Effects of Embodiments The driving transistor unit 51, the heater unit 53, and the logic circuit unit 55 are sequentially arranged in the short side direction (direction orthogonal to the direction in which the heating elements are arranged) from the common channel side end of the chip element. Thus, the chip element can be reduced in size. That is, the driving transistor portion 51 disposed at the end portion of the chip element can be used as an adhesive region between the top plate 41 and the covering layer 27, and the number of chip elements that can be cut out from one semiconductor substrate can be increased. Thereby, reduction of manufacturing cost is realizable.

Further, when the wiring pattern for the power supply potential (VH) and the wiring pattern for the ground potential (GND) are arranged on the same plane, a chip element can be realized with a simple wiring pattern. At this time, if two or more electrodes are connected to the wiring pattern for each potential, the energy that can be supplied to the heat generating element can be increased, and the printing speed and the discharge capability can be improved.
Further, when the wiring pattern for the power supply potential (VH) and the wiring pattern for the ground potential (GND) are arranged separately in two layers, the two wiring patterns are arranged along the outer edge in the longitudinal direction of the heater unit 53. can do.

In this case, the potential supply to the heating element and the drain terminal can be realized by the shortest path. For this reason, the energy that can be supplied to the heating element can be further increased as compared with the one-layer type, and it is possible to improve the printing speed and the discharge capacity.
Further, when the wiring pattern is separated into two layers, it is not necessary to arrange the wiring pattern for ground potential (GND) on the outer edge of the chip element, and further downsizing of the chip element can be realized. That is, the manufacturing cost can be reduced.

(E) Other Embodiments (a) In the embodiment described above, the driving-type chip element in which one heating element is arranged for one nozzle has been described.
However, the present invention can also be applied to a driving-type chip element in which two heating elements 97a and 97b are arranged for one nozzle 95 as shown in FIG. Here, the pair of heating elements 97a and 97b are arranged along the direction in which the heating elements are arranged (the longitudinal direction of the chip elements). In the case of a chip element having this heat generating element structure, the ejection direction of ink droplets can be deflected by making the energy (voltage) applied to the two left and right heat generating elements 97a, 97b asymmetric.

FIG. 21 shows a view of the wiring pattern when the wiring pattern for the power supply potential (VH) and the wiring pattern for the ground potential (GND) are arranged separated into two layers as viewed from the surface side of the chip element. . The two heat generating elements 97a and 97b are connected in series. However, the two heating elements 97a and 97b are arranged in parallel in the same plane.
In FIG. 21, a mechanism is adopted in which the energy applied to the heating elements 97a and 97b can be adjusted by adjusting the potential at the midpoint of connection between the heating elements 97a and 97b. In the figure, a shaded wiring pattern 99 is a wiring that provides a midpoint connection potential. One end of the wiring pattern 99 is connected to the electrode of the electrode portion 57.

FIG. 22 shows the relationship of the ink droplet ejection direction depending on how the connection midpoint potential is applied.
FIG. 22A shows an example of ejection when the midpoint connection potential is set to half the drive potential (VH). In this case, the same amount of energy is applied to the heating elements 97a and 97b. At this time, since the heat generation characteristics of the heat generating elements are the same, ink droplets are ejected to the front.
FIG. 22B shows an example of ejection when the midpoint connection potential is set larger than half of the drive potential (VH). In this case, the energy applied to the heating element 97a is larger than the energy applied to the heating element 97b. At this time, since the heating element 97a has a relatively large force for ejecting ink droplets, the ink droplets are deflected and ejected rightward (to the heating element 97b side) with respect to the front surface.

FIG. 22C shows an example of discharge when the midpoint connection potential is set to be smaller than half the drive potential (VH). In this case, the energy applied to the heating element 97b is larger than the energy applied to the heating element 97a. At this time, since the heating element 97b has a relatively large force for ejecting ink droplets, the ink droplet is deflected and ejected leftward (to the heating element 97a side) with respect to the front surface.
Thus, the above-described technique can be applied to a chip element having a deflection discharge function.
(B) In the above-described embodiment, the case where the liquid to be ejected is ink has been described. However, the type of liquid is not limited to ink. For example, in the case of application as a display device or an electronic circuit manufacturing device, an organic material or a conductive material may be used.
(C) Various modifications can be considered for the above-described embodiments within the scope of the gist of the invention. Various modifications and application examples created based on the description of the present specification are also conceivable.

It is a figure which shows the example of a cross-section of a print head (conventional example). It is a figure which shows the manufacturing process example of a printing head (1st process-4th process). It is a figure which shows the example of a manufacturing process of a print head (5th process). It is a figure which shows the example of a manufacturing process of a print head (6th process). It is a figure which shows the manufacturing process example of a print head (7th process). It is a figure which shows the example of a manufacturing process of a print head (8th process). It is a figure which shows the circuit pattern example of a chip element. It is a figure which shows the example of a cross-section of a print head. It is a figure which shows the example of a plane structure of a print head. It is a figure which shows the other circuit pattern example of a chip element. It is a figure which shows the example of arrangement | positioning of a one-layer wiring pattern. It is a figure which shows the example of arrangement | positioning of a one-layer wiring pattern. It is an equivalent circuit diagram of a one-layer wiring pattern. It is a figure which shows the example of arrangement | positioning of a two-layer wiring pattern. It is an equivalent circuit diagram of a two-layer wiring pattern. It is a figure which shows the example of a wiring pattern of the 2nd hierarchy. It is a figure which shows the example of a wiring pattern of the 1st hierarchy. It is a figure which shows the wiring pattern example for control. It is a figure which overlaps and shows the wiring pattern shown in FIGS. It is a figure which shows the example of arrangement | positioning of the heat generating element corresponding to deflection | deviation discharge. It is a figure which shows the wiring pattern example for deflection | deviation discharge. It is a figure which shows the relationship between the energy applied and a deflection | deviation discharge direction.

Explanation of symbols

51 Drive transistor section (drive element region)
53 Heater (heating element area)
55 Logic circuit (control circuit area)
57 Electrode part 81 Wiring pattern (for ground potential)
83 electrodes (for ground potential)
85 Wiring pattern (for power supply potential)
87 electrodes (for power supply potential)

Claims (4)

In a droplet discharge head that discharges droplets by heating the liquid in the liquid chamber,
A common flow path of liquid formed on the substrate;
A chip element in which a drive element region, a heating element region, and a control circuit region are arranged in this order from the side end in contact with the common flow path to the liquid chamber arrangement direction;
The opening of the common flow path exposed to the substrate top surface, have a sealing member for integrally sealing the portion of the surface of the chip device,
The partial surface is an upper surface of the drive element region in the chip element;
The liquid droplet ejection head , wherein the sealing member is adhered to the partial surface . The droplet discharge head according to claim 1,
Droplet discharge head, wherein a wiring pattern for a wiring pattern ground potential power supply potential, placed in the same hierarchy. The droplet discharge head according to claim 1,
A droplet discharge head , wherein a power supply potential wiring pattern and a ground potential wiring pattern are arranged in different layers. In a printing apparatus equipped with a liquid droplet ejection head that discharges liquid droplets by heating a liquid in a liquid chamber, and a drive mechanism that relatively moves the recording medium and the liquid droplet ejection head,
The droplet discharge head is
A common flow path of liquid formed on the substrate;
A chip element in which a drive element region, a heating element region, and a control circuit region are arranged in this order from the side end in contact with the common flow path to the liquid chamber arrangement direction;
The opening of the common flow path exposed to the substrate top surface, have a sealing member for integrally sealing the portion of the surface of the chip device,
The partial surface is an upper surface of the drive element region in the chip element;
The printing apparatus , wherein the sealing member is adhered to the partial surface .

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