JP4650375B2 - Resin composition for forming fine pattern and method for forming fine pattern - Google Patents

Description

  The present invention relates to a fine processing technique using a photoresist, and relates to a resin composition for forming a fine pattern and a method for forming a fine pattern, which are used when a pattern is shrunk by heat treatment after patterning. More specifically, the present invention relates to a resin composition for forming a fine pattern and a method for forming a fine pattern, which can further improve the pattern shrinkage rate.

In recent years, with the progress of miniaturization of semiconductor elements, further miniaturization has been required in the lithography process in the manufacturing method. That is, in the lithography process, microfabrication of 100 nm or less is now required, and a fine pattern is formed using a photoresist material corresponding to short-wavelength irradiation light such as ArF excimer laser light and F ₂ excimer laser light. Various methods for forming the film have been studied.

  In such a lithography technique, there is a limit to miniaturization due to the limitation of the exposure wavelength. Therefore, research has been conducted so far to enable the formation of fine patterns exceeding the wavelength limit. For example, an electron beam resist such as polymethyl methacrylate is patterned, and after applying a positive resist on the resist pattern, a heat treatment is performed to provide a reaction layer at the boundary between the resist pattern and the positive resist layer. A method of refining a resist pattern by removing non-reacted portions of the resist (Patent Document 1), and forming a reaction layer between the lower layer resist pattern and the upper layer resist using thermal crosslinking with an acid generator or acid (Patent Document 2), a semiconductor device using, as an upper layer resist coating solution, a fine pattern forming material in which a photosensitive component is not contained and a water-soluble resin, a water-soluble crosslinking agent, or a mixture thereof is dissolved in a water-soluble solvent (Patent Document 3), a photosensitive layer made of a chemically amplified resist is provided on a substrate, and after exposure to form an image, the resist is developed. On the resist pattern, a water-soluble resin such as polyvinyl acetal, a water-soluble cross-linking agent such as tetra (hydroxymethyl) glycoluril, a water-soluble nitrogen-containing organic compound such as amine, and optionally fluorine And a film-forming agent containing a silicon-containing surfactant, heat treatment to form a water-insoluble reaction layer at the interface between the resist pattern and the resist pattern refinement coating, and then with pure water, A method (Patent Document 4) and the like for removing a non-reactive portion of a resist pattern refinement coating film have been proposed.

  These methods are preferable in that the pattern can be easily refined with a fine pattern forming material (upper layer resist) beyond the wavelength limit of the photosensitive resist (lower layer resist). However, cross-linking of the fine pattern forming material to the unnecessary portion of the bottom portion of the resist pattern, a skirted shape, the perpendicularity of the cross-sectional shape of the fine pattern forming material becomes poor, or the upper layer resist pattern There is a problem that the pattern shape is affected by mixing baking, which is heating for causing cross-linking, and it cannot be said that it is sufficiently satisfactory. In addition, these processes are highly dependent on heat of several tens of nm / ° C., and it is difficult to maintain a uniform temperature in the wafer surface when the substrate is enlarged and the pattern is miniaturized. There is a problem that the dimensional controllability of the lowering. Furthermore, the fine pattern forming material using the water-soluble resin has a problem that the resistance to dry etching is low due to the limitation of solubility in water. When creating a semiconductor device, the pattern is transferred onto the substrate by dry etching using the resist pattern as a mask. However, if the dry etching resistance is low, there is a problem that the resist pattern cannot be accurately transferred onto the substrate.

  In addition, a so-called thermal flow process has been proposed in which a photoresist pattern is formed on a substrate and then subjected to heat or radiation to fluidize the photoresist pattern to make the pattern dimension smaller than the resolution limit ( Patent Document 5 and Patent Document 6). However, this method has a problem that it is difficult to control the flow of resist by heat or radiation, and a product having a constant quality cannot be obtained.

  Furthermore, as a method developed from this thermal flow process, a method (Patent Document 7) is proposed in which a photoresist pattern is formed on a substrate, and then a water-soluble resin film is provided thereon to control the flow of the photoresist. ing. However, the water-soluble resin such as polyvinyl alcohol used in this method has a drawback that it has insufficient solubility and stability over time required for removal with water, resulting in a residue.

  Furthermore, when forming a fine resist pattern by thermally shrinking a resist pattern formed using a photoresist, a resist pattern coating formation agent is provided, the resist pattern is thermally shrunk by heat treatment, and removed by washing with water. A resist pattern refinement coating forming agent that can be used, and a method for efficiently forming a fine resist pattern using the same (Patent Document 8) have been proposed. However, in this method, the coating forming agent for refining the resist pattern is water-based, the covering property to a fine pattern such as a contact hole having a diameter of 100 nm or less is insufficient, and since it is water-based, a dedicated cup at the time of application This increases the cost because it is necessary, and there is a problem that freezing and precipitation occur when the temperature is low during transportation and the like.

  Therefore, the present inventors have proposed a resin composition for forming a fine pattern comprising a hydroxyl group-containing resin, a crosslinking component, and an alcohol solvent containing 10% by weight or less of water based on the total solvent. (Patent Document 9).

Japanese Patent No. 2723260 JP-A-6-250379 Japanese Patent Laid-Open No. 10-73927 Japanese Patent Laid-Open No. 2001-19860 JP-A-1-307228 Japanese Patent Laid-Open No. 4-364221 JP 7-45510 A JP 2003-195527 A International Publication No. 05/1167776 Pamphlet

  The resin composition for forming a fine pattern described in Patent Document 9 is a resin composition used when a pattern is shrunk by heat treatment after patterning, and the solvent is not an aqueous solvent but an alcohol solvent. Excellent coating properties for patterns, and excellent dimensional controllability of cured film. Therefore, regardless of the surface state of the substrate, the pattern gap of the resist pattern can be effectively and accurately miniaturized, and a pattern exceeding the wavelength limit can be satisfactorily and economically reduced with few pattern defects. There is an advantage that it can be formed in a state. However, in recent years, in the formation of a resist pattern, further improvement in the pattern shrinkage rate has been demanded, and a measure that can improve the pattern shrinkage rate more stably is desired.

  The present invention has been made in order to cope with such problems. Regardless of the surface state of the substrate, the pattern gap of the resist pattern can be effectively and accurately miniaturized, and the wavelength limit can be reduced. It is possible to improve the pattern shrinkage rate while maintaining the advantage of the resin composition described in Patent Document 9 that it is possible to form a pattern that exceeds that in good and economically at low cost and with few pattern defects. A resin composition and a fine pattern forming method capable of efficiently forming a fine resist pattern using the resin composition are provided.

  As a result of intensive research on the resin composition as described in Patent Document 9, the present inventors have incorporated a compound having two or more epoxy groups in the molecule as a crosslinking component, thereby reducing pattern shrinkage. The present inventors have found that the rate can be further improved and have completed the present invention. That is, according to the present invention, the following resin composition for forming a fine pattern and method for forming a fine pattern are provided.

[1] A resin composition for forming a fine pattern comprising a hydroxyl group-containing resin, a crosslinking component, and an alcohol solvent containing 10% by weight or less of water with respect to the alcohol and all solvents, A resin composition for forming a fine pattern comprising, as a component, a compound having two or more epoxy groups in its molecule.

[2] The resin composition for forming a fine pattern according to [1], wherein the alcohol is a monohydric alcohol having 1 to 8 carbon atoms.

（式（１）において、Ｒ^１及びＲ^２は、水素原子又は下記式（２）で表され、Ｒ^１及びＲ^２の少なくとも１つは下記式（２）で表され；

式（２）において、Ｒ^３及びＲ^４は、水素原子、炭素数１〜６のアルキル基、炭素数１〜６にアルコキシアルキル基、又はＲ^３及びＲ^４が互いに連結した炭素数２〜１０の環を表し、Ｒ^５は、水素原子、炭素数１〜６のアルキル基を表す。） [3] The resin composition for forming a fine pattern according to [1] or [2], further containing a compound containing a group represented by the following formula (1) as the crosslinking component.

(In the formula (1), R ¹ and R ² are each represented by a hydrogen atom or the following formula (2), and at least one of R ¹ and R ² is represented by the following formula (2);

In Formula (2), R ³ and R ⁴ are a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 6 carbon atoms, or 2 to 10 carbon atoms in which R ³ and R ⁴ are connected to each other. R ⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. )

（式（１）において、Ｒ^１及びＲ^２は、水素原子又は下記式（２）で表され、Ｒ^１及びＲ^２の少なくとも１つは下記式（２）で表され；

式（２）において、Ｒ^３及びＲ^４は、水素原子、炭素数１〜６のアルキル基、炭素数１〜６にアルコキシアルキル基、又はＲ^３及びＲ^４が互いに連結した炭素数２〜１０の環を表し、Ｒ^５は、水素原子、炭素数１〜６のアルキル基を表す。） [4] A resin composition for forming a fine pattern comprising a hydroxyl group-containing resin, a crosslinking component, and an alcohol solvent containing 10% by weight or less of water with respect to the alcohol and all solvents, A resin composition for forming a fine pattern comprising, as components, a compound having two or more oxetanyl groups in the molecule and a compound containing a group represented by the following formula (1).

(In the formula (1), R ¹ and R ² are each represented by a hydrogen atom or the following formula (2), and at least one of R ¹ and R ² is represented by the following formula (2);

In Formula (2), R ³ and R ⁴ are a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 6 carbon atoms, or 2 to 10 carbon atoms in which R ³ and R ⁴ are connected to each other. R ⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. )

[5] A pattern forming step for forming a resist pattern on the substrate, a film forming step for forming a coating of the resin composition for forming a fine pattern on the resist pattern, and a heat treatment step for heat-treating the substrate on which the coating is formed. And the film removal step of removing the film with an aqueous alkali solution and washing with water, the fine pattern forming resin composition according to any one of [1] to [4]. The fine pattern formation method using the resin composition for fine pattern formation of this.

  The resin composition for forming a fine pattern of the present invention can effectively and accurately miniaturize the pattern gap of the resist pattern regardless of the surface state of the substrate, and a pattern that exceeds the wavelength limit is good and economical. In addition, the pattern shrinkage rate can be further improved in addition to the fact that the pattern can be formed at a low cost and with few pattern defects.

（式（１）において、Ｒ^１及びＲ^２は、水素原子又は下記式（２）で表され、Ｒ^１及びＲ^２の少なくとも１つは下記式（２）で表され；

式（２）において、Ｒ^３及びＲ^４は、水素原子、炭素数１〜６のアルキル基、炭素数１〜６にアルコキシアルキル基、又はＲ^３及びＲ^４が互いに連結した炭素数２〜１０の環を表し、Ｒ^５は、水素原子、炭素数１〜６のアルキル基を表す。） [1] Resin composition for forming a fine pattern:
The resin composition for forming a fine pattern of the present invention is an alcohol solution composed of a hydroxyl group-containing resin, a crosslinking component, and an alcoholic solvent. The crosslinking component includes (1) a compound having two or more epoxy groups in the molecule, or (2) a compound having two or more oxetanyl groups in the molecule and the following formula (1): And a compound containing the represented group.

(In the formula (1), R ¹ and R ² are each represented by a hydrogen atom or the following formula (2), and at least one of R ¹ and R ² is represented by the following formula (2);

In Formula (2), R ³ and R ⁴ are a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 6 carbon atoms, or 2 to 10 carbon atoms in which R ³ and R ⁴ are connected to each other. R ⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. )

[1-1] Resin containing a hydroxyl group:
The resin containing a hydroxyl group may be a resin containing a structural unit having at least one hydroxyl group (—OH) among hydroxyl groups derived from alcohols, phenols, and carboxylic acids. As the resin, a (meth) acrylic resin, a vinyl resin (hereinafter referred to as a (meth) acrylic resin and a vinyl resin “copolymer I”), a novolac resin, or a mixed resin thereof is used. Can do. By using the above resin containing an alcohol-soluble hydroxyl group, a fine pattern forming resin composition having excellent etching resistance can be obtained.

  The copolymer I is obtained by copolymerizing a monomer having at least one hydroxyl group among alcoholic hydroxyl groups, hydroxyl groups derived from carboxylic acids, and phenolic hydroxyl groups.

  Monomers containing alcoholic hydroxyl groups include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, glycerol mono Hydroxyalkyl (meth) acrylates such as methacrylate can be exemplified, and 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate are preferable. These monomers can be used alone or in combination of two or more.

式（３）において、Ｒ^６は水素原子又はメチル基を表す。また、Ｒ^７は直鎖状又は環状の２価の炭化水素基を表す。 Moreover, the monomer which has the hydroxyl group shown to following formula (3) which has the fluoroalkyl group of (alpha) position can be used.

In the formula (3), R ⁶ represents a hydrogen atom or a methyl group. R ⁷ represents a linear or cyclic divalent hydrocarbon group.

R ⁷ includes methylene group, ethylene group, propylene group (1,3-propylene group, 1,2-propylene group), tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene. Group, decamethylene group, undecamethylene group, dodecamethylene group, tridecamethylene group, tetradecamethylene group, pentadecamethylene group, hexadecamethylene group, heptacamethylene group, octadecamethylene group, nonacamethylene group, insalen Group, 1-methyl-1,3-propylene group, 2-methyl-1,3-propylene group, 2-methyl-1,2-propylene group, 1-methyl-1,4-butylene group, 2-methyl- Saturated chain hydrocarbon group such as 1,4-butylene group, ethylidene group, propylidene group, 2-propylidene group, 1,3 -Cyclobutylene groups such as cyclobutylene groups, cyclopentylene groups such as 1,3-cyclopentylene groups, cyclohexylene groups such as 1,4-cyclohexylene groups, and cyclooctylene groups such as 1,5-cyclooctylene groups A monocyclic hydrocarbon ring group such as a cycloalkylene group having 3 to 10 carbon atoms, a norbornylene group such as a 1,4-norbornylene group or a 2,5-norbornylene group, a 1,5-adamantylene group or 2 And a bridged cyclic hydrocarbon ring group such as a bicyclic to tetracyclic hydrocarbon ring group having 4 to 30 carbon atoms such as an adamantylene group such as 1,6-adamantylene group.

In particular, when R ⁷ is an aliphatic cyclic hydrocarbon group, an alkylene group having 1 to 4 carbon atoms is preferably inserted as a spacer between the bistrifluoromethyl-hydroxymethyl group and R ⁷ . Among these, as Formula (3), R ⁷ is preferably a 2,5-norbornylene group or a 1,2-propylene group. Suitable formula (3) includes 4,4,4-trifluoro-3-hydroxy-1-methyl-3-trifluoromethyl-1-butyl methacrylate. These monomers are normally 5-90 mol% with respect to all the monomers which comprise a copolymer, Preferably, it is 10-60 mol%.

  Examples of the monomer containing a hydroxyl group derived from an organic acid such as carboxylic acid include acrylic acid, methacrylic acid, crotonic acid, 2-succinoloylethyl (meth) acrylate, 2-malenoylethyl (meth) acrylate, 2 -Hexahydrophthaloylethyl (meth) acrylate, ω-carboxy-polycaprolactone monoacrylate, monohydroxyethyl acrylate phthalate, acrylic acid dimer, 2-hydroxy-3-phenoxypropyl acrylate, t-butoxy methacrylate, t-butyl acrylate Monocarboxylic acids such as: (meth) acrylic acid derivatives having a carboxyl group such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, and other dicarboxylic acids, and the like. Or two or more groups Together it can be used. As a commercially available product of ω-carboxy-polycaprolactone monoacrylate, for example, Aronix M-5300 manufactured by Toagosei Co., Ltd., and as a commercially available product of acrylic acid dimer, for example, Aronix M-5600 manufactured by the same company, 2-hydroxy-3 -As a commercial item of phenoxypropyl acrylate, the company Aronix M-5700 can be illustrated, for example.

  Among these, acrylic acid, methacrylic acid, and 2-hexahydrophthaloylethyl methacrylate are preferable. These monomers are normally 5-90 mol% with respect to all the monomers which comprise a copolymer, Preferably, it is 10-60 mol%.

  Examples of the monomer having a phenolic hydroxyl group include p-hydroxystyrene, m-hydroxystyrene, o-hydroxystyrene, α-methyl-p-hydroxystyrene, α-methyl-m-hydroxystyrene, α-methyl-o-. Hydroxystyrene, 2-allylphenol, 4-allylphenol, 2-allyl-6-methylphenol, 2-allyl-6-methoxyphenol, 4-allyl-2-methoxyphenol, 4-allyl-2,6-dimethoxyphenol , 4-allyloxy-2-hydroxybenzophenone and the like, among which p-hydroxystyrene or α-methyl-p-hydroxystyrene is preferable.

Ｒ^８及びＲ^１０は水素原子又はメチル基を表し、Ｒ^９は式（３）におけるＲ^７と同一である。式（４）で表される単量体としては、ｐ−ヒドロキシメタクリルアニリドが好ましい。式（４）で表されるフェノール性水酸基を有する単量体は、共重合体を構成する全単量体に対して、通常３０〜９５モル％、好ましくは４０〜９０モル％である。 Examples of the monomer having a phenolic hydroxyl group include a monomer represented by the following formula (4) having an amide group in the molecule.

R ⁸ and R ¹⁰ represent a hydrogen atom or a methyl group, and R ⁹ is the same as R ⁷ in formula (3). As a monomer represented by Formula (4), p-hydroxymethacrylanilide is preferable. The monomer having a phenolic hydroxyl group represented by the formula (4) is usually 30 to 95 mol%, preferably 40 to 90 mol%, based on all monomers constituting the copolymer.

  Furthermore, a monomer having a functional group that can be converted into a phenolic hydroxyl group after copolymerization can be copolymerized, for example, p-acetoxystyrene, α-methyl-p-acetoxystyrene, p-benzyloxystyrene, p -Tert-butoxystyrene, p-tert-butoxycarbonyloxystyrene, p-tert-butyldimethylsiloxystyrene and the like. When these functional group-containing compounds are used, the obtained copolymer is easily converted into a phenolic hydroxyl group by performing an appropriate treatment, for example, hydrolysis using hydrochloric acid or the like. be able to. The monomer before and after conversion to these phenolic hydroxyl groups is usually 5 to 90 mol%, preferably 10 to 80 mol%, based on all monomers constituting the copolymer.

These monomers having an alcoholic hydroxyl group, a hydroxyl group derived from a carboxylic acid, or a phenolic hydroxyl group are within the above ranges with respect to all the monomers constituting the copolymer I. If the number of structural units having a hydroxyl group is too small, the number of reaction sites with the crosslinking component described later is too small to cause pattern shrinkage. On the other hand, if too large, there is a risk of swelling during development and filling the pattern. .
Further, for example, in the case of a monomer having a phenolic hydroxyl group and a monomer having an alcoholic hydroxyl group, only the structural unit having a hydroxyl group can be used.

  The copolymer I can be copolymerized with other monomers for the purpose of controlling the hydrophilicity and solubility of the resin. Other monomers include monomers other than monomers having at least one hydroxyl group among the above-mentioned alcoholic hydroxyl groups, hydroxyl groups derived from organic acids such as carboxylic acids, and phenolic hydroxyl groups. As monomers, (meth) acrylic acid aryl esters, dicarboxylic acid diesters, nitrile group-containing polymerizable compounds, amide bond-containing polymerizable compounds, vinyls, allyls, chlorine-containing polymerizable compounds, conjugated diolefins Etc.

  Specifically, dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate and diethyl itaconate; (meth) acrylic acid aryl esters such as phenyl (meth) acrylate and benzyl (meth) acrylate; styrene, α-methylstyrene, Aromatic vinyls such as m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, pt-butoxystyrene; t-butyl (meth) acrylate, 4,4,4-trifluoro-3- (Meth) acrylic acid esters such as hydroxy-1-methyl-3-trifluoromethyl-1-butyl (meth) acrylate; nitrile group-containing polymerizable compounds such as acrylonitrile and methacrylonitrile; amide bonds such as acrylamide and methacrylamide Containing polymerizable compound; fat such as vinyl acetate Acid vinyls, vinyl chloride, chlorine-containing polymerizable compounds such as vinylidene chloride; 1,3-butadiene, isoprene, may be used conjugated diolefins such as 1,4-dimethyl butadiene. These compounds can be used alone or in combination of two or more.

  Copolymer I uses, for example, a mixture of monomers using radical polymerization initiators such as hydroperoxides, dialkyl peroxides, diacyl peroxides, azo compounds, and chain transfer agents as necessary. Can be produced by polymerization in a suitable solvent.

  Examples of the solvent used for the polymerization include alkanes such as n-pentane, n-hexane, n-heptane, n-octane, n-nonane, and n-decane; cyclohexane, cycloheptane, cyclooctane, decalin, Cycloalkanes such as norbornane; aromatic hydrocarbons such as benzene, toluene, xylene, ethylbenzene, cumene; halogenated hydrocarbons such as chlorobutanes, bromohexanes, dichloroethanes, hexamethylene dibromide, chlorobenzene; ethyl acetate Saturated carboxylic acid esters such as n-butyl acetate, i-butyl acetate, methyl propionate, propylene glycol monomethyl ether acetate; alkyl lactones such as γ-butyrolactone; tetrahydrofuran, dimethoxyethanes, diethoxyethanes, etc. Ethers; alkyl ketones such as 2-butanone, 2-heptanone and methyl isobutyl ketone; cycloalkyl ketones such as cyclohexanone; 2-propanol, 1-butanol, 4-methyl-2-pentanol, propylene glycol monomethyl ether, etc. Alcohols and the like. These solvents can be used alone or in combination of two or more.

  Moreover, the reaction temperature in the said superposition | polymerization is 40-120 degreeC normally, Preferably it is 50-100 degreeC, and reaction time is 1-48 hours normally, Preferably it is 1-24 hours.

  The copolymer I preferably has a high purity, and not only has a low content of impurities such as halogen and metal, but the residual monomer and oligomer components are below a predetermined value, for example, 0.1 mass by HPLC analysis. % Or less is preferable. As a result, the process stability and pattern shape of the resin composition for forming a fine pattern of the present invention containing the copolymer I can be further improved, and there is no change over time in liquid foreign matter and sensitivity. A resin composition for forming a fine pattern can be provided.

The following method is mentioned as a purification method of the copolymer I obtained by the above methods.
As a method for removing impurities such as metals, a method in which a metal in a polymerization solution is adsorbed using a zeta potential filter, a metal is chelated and removed by washing the polymerization solution with an acidic aqueous solution such as oxalic acid or sulfonic acid. And the like. In addition, as a method of removing residual monomers and oligomer components below the specified value, liquid-liquid extraction method that removes residual monomers and oligomer components by combining water washing and an appropriate solvent, a specific molecular weight or less Refining method to remove residual monomers by coagulating resin in poor solvent by dripping polymerization solution into poor solvent And a purification method in a solid state such as washing with a poor solvent for the resin slurry separated by filtration. Moreover, you may combine these methods.

  The weight average molecular weight Mw of the copolymer I thus obtained is usually 1,000 to 500,000, preferably 1,000 to 50,000, particularly preferably 1,000 to 500,000 in terms of gel permeation chromatography. 20,000. If the molecular weight is too large, there is a possibility that it cannot be removed with a developer after heat curing. If it is too low, a uniform coating film may not be formed after coating.

  The novolac resin used in the present invention is preferably alkali-soluble. Such a novolac resin can be obtained, for example, by addition condensation of an aromatic compound having a phenolic hydroxyl group (hereinafter simply referred to as “phenols”) and an aldehyde under an acid catalyst. Examples of phenols used at this time include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p- Butylphenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, 3,4 , 5-trimethylphenol, p-phenylphenol, resorcinol, hydroquinone, hydroquinone monomethyl ether, pyrogallol, phloroglicinol, hydroxydiphenyl, bisphenol A, gallic acid, gallic acid ester, α-naphthol, β-naphthol and the like. . Examples of aldehydes include formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde. The catalyst for the addition condensation reaction is not particularly limited. For example, hydrochloric acid, nitric acid, sulfuric acid, formic acid, oxalic acid, acetic acid, and the like are used as the acid catalyst. The weight average molecular weight of the novolak resin is not particularly limited, but is preferably 1,000 to 30,000.

[1-2] Crosslinking component:
The composition of the present invention contains a compound having two or more epoxy groups in the molecule (hereinafter referred to as “crosslinking component Ia”) as a crosslinking component. By using such a compound as a crosslinking component, a preferable effect that the pattern shrinkage rate can be further improved is exhibited.

  Although there is no upper limit in particular about the number of epoxy groups in a molecule | numerator, it is preferable that it is 2-6 pieces, and it is still more preferable that it is 2-4 pieces. By setting the number of epoxy groups in the molecule to 2 to 6, the pattern shrinkage rate can be further increased while maintaining the storage stability as a solution. On the other hand, when the number of epoxy groups in the molecule exceeds 6, the storage stability of the composition may be lowered depending on conditions.

  Examples of the “crosslinking component Ia” include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy. ) Cyclohexane-meta-dioxane, bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3 ′, 4 '-Epoxy-6'-methylcyclohexanecarboxylate, methylene bis (3,4-epoxycyclohexane), di (3,4-epoxycyclohexylmethyl) ether of ethylene glycol, ethylene bis (3,4-epoxycyclohexanecarboxylate), ε-caprolactone 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, trimethylcaprolactone modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, β-methyl-δ-valerolactone Epoxycyclohexyl group-containing compounds such as modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate;

Bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, Polyglycidyl ethers of aromatic polyhydric alcohols such as hydrogenated bisphenol F diglycidyl ether and hydrogenated bisphenol S diglycidyl ether; 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin tri Glycidyl ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycol Polyglycidyl ethers of aliphatic polyhydric alcohols such as Gilles ether;

Polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as ethylene glycol, propylene glycol, and glycerin; diglycidyl esters of aliphatic long-chain dibasic acids And the like.

  Among these, polyglycidyl ethers are preferable, polyglycidyl ethers of polyhydric alcohols are more preferable, and polyglycidyl ethers of aliphatic polyhydric alcohols are particularly preferable because the pattern shrinkage rate can be effectively improved.

  Specific examples of “polyglycidyl ether of aliphatic polyhydric alcohol” include ethylene glycol diglycidyl ether (two epoxy groups, for example, trade name: Epolite 40E, manufactured by Kyoeisha Chemical Co., Ltd.), trimethylolethane triglycidyl ether (epoxy) Three groups, for example, trade name: Epolite 100MF, manufactured by Kyoeisha Chemical Co., Ltd., dimethylolpropane diglycidyl ether (two epoxy groups, for example, trade name: Epolite 1500NP, manufactured by Kyoeisha Chemical Co., Ltd.), pentaerythritol tetraglycidyl ether ( 4 epoxy groups, for example, trade name: Denacol EX-411, manufactured by Nagase ChemteX Corporation) and the like can be mentioned. Among these, trimethylolethane triglycidyl ether is preferable because the effect of improving the pattern shrinkage rate is particularly large.

  The compounding quantity of the crosslinking component Ia in this invention is 5-200 weight part with respect to 100 weight part of resin which has a hydroxyl group, Preferably it is 5-100 weight part. If the blending amount is less than 5 parts by weight, the pattern shrinkage rate tends to be insufficiently improved. On the other hand, when it exceeds 200 parts by weight, the storage stability as the composition may be deteriorated.

式（１）において、Ｒ^１及びＲ^２は、水素原子又は下記式（２）で表され、Ｒ^１及びＲ^２の少なくとも１つは下記式（２）で表され；

式（２）において、Ｒ^３及びＲ^４は、水素原子、炭素数１〜６のアルキル基、炭素数１〜６のアルコキシアルキル基、又はＲ^３及びＲ^４が互いに連結した炭素数２〜１０の環を表し、Ｒ^５は、水素原子、炭素数１〜６のアルキル基を表す。 The composition of the present invention preferably contains a compound containing a group represented by the following formula (1) (hereinafter referred to as “crosslinking component II”) in addition to the crosslinking component I as a crosslinking component. This compound is an aminal having a structure of -NCO- in the molecule. Like the crosslinking component I, the above-mentioned hydroxyl group-containing resin and / or crosslinking component react with each other by the action of an acid (curing). Component). As the crosslinking component, it is preferable to use the crosslinking component II in addition to the crosslinking component I because the pattern shrinkage ratio is improved and the effect of improving the limit resolution that cannot be obtained by the crosslinking component I alone is exhibited.

In formula (1), R ¹ and R ² are represented by a hydrogen atom or the following formula (2), and at least one of R ¹ and R ² is represented by the following formula (2);

In Formula (2), R ³ and R ⁴ are each a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 6 carbon atoms, or a carbon number 2 to 10 in which R ³ and R ⁴ are connected to each other. R ⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

  The compound represented by the formula (1) (crosslinking component II) is a compound having an imino group, a methylol group or a methoxymethyl group as a functional group in the molecule, and is a (poly) methylolated melamine, (poly) methylol. And nitrogen-containing compounds obtained by alkyl etherifying all or part of active methylol groups such as glycol urilyl, (poly) methylolated benzoguanamine, and (poly) methylolated urea. Here, examples of the alkyl group include a methyl group, an ethyl group, a butyl group, or a mixture thereof, and may contain an oligomer component that is partially self-condensed. Specific examples include hexamethoxymethylated melamine, hexabutoxymethylated melamine, tetramethoxymethylated glycoluril, and tetrabutoxymethylated glycoluril.

  The commercially available compounds include Cymel 300, 301, 303, 350, 232, 235, 236, 238, 266, 267, 285, 1123, 1123-10, 1170, 370, 771, 272, 1172, 325, 327, 703, 712, 254, 253, 212, 1128, 701, 202, 207 (Japan) Made by Cytec Co., Ltd.), Nikarac MW-30M, 30, 22, 22X, Nikalac MS-21, 11, 001, Nikalac MX-002, 730, 750, 708, 706, 706, 042, 035, 45, 410, 302, 202, Nicarak SM-651, 652, 653, 551, 451, Nicarak SB-40 , The 355, the 303, the 301, the 255, the 203, the 201, NIKALAC BX-4000, the 37, the 55H, NIKALAC BL-60 (or more, manufactured by Sanwa Chemical Co., Ltd.) and the like. Cymel 300, 325, 327, 703, 712, 712, 254, 253, 212, 1128, 701, 202, and 207 are preferable.

  When the crosslinking component Ia is used alone as the crosslinking component, the blending amount of the crosslinking component Ia in the present invention is preferably 1 to 100 parts by weight with respect to 100 parts by weight of the resin having a hydroxyl group, and is preferably 5 to 70 parts. More preferred are parts by weight. If the blending amount is less than 1 part by weight, curing may be insufficient and pattern shrinkage may not occur, and if it exceeds 100 parts by weight, curing may proceed excessively and the pattern may be buried.

  When the crosslinking component Ia and the crosslinking component II are used in combination as the crosslinking component, the total amount of the crosslinking component Ia and the crosslinking component II is preferably 1 to 100 parts by weight with respect to 100 parts by weight of the resin having a hydroxyl group. 5 to 70 parts by weight is more preferable. The blend ratio of the crosslinking component Ia and the crosslinking component II is preferably 80:20 to 20:80, and more preferably 70:30 to 30:70. If the ratio of the cross-linking component Ia is smaller than 20:80, there is a possibility that a problem of insufficient pattern shrinkage may occur. On the other hand, when the ratio of the cross-linking component II is smaller than 80:20, there is a tendency to cause a problem of insufficient resolution.

  The composition of the present invention contains a compound having two or more oxetanyl groups in the molecule (hereinafter referred to as “crosslinking component Ib”) and the crosslinking component II already described as a crosslinking component. Also good. The crosslinking component Ib is a compound containing a cyclic ether, like the crosslinking component I, and acts as a crosslinking component (curing component) in which the hydroxyl group-containing resin and / or the crosslinking component react with each other by the action of an acid. It is. When the crosslinking component Ib and the crosslinking component II are used in combination as the crosslinking component, the pattern shrinkage ratio is improved, and the pattern shrinkage ratio and the limit resolution, which cannot be obtained only by the crosslinking component Ib or the crosslinking component II, are well balanced. Since the effect of making it exhibit is acquired, it is preferable.

  A compound containing two or more oxetanyl groups as a reactive group (crosslinking component Ib) is, for example, 3,7-bis (3-oxetanyl) -5-oxa-nonane, 3,3 ′-(1,3- ( 2-methylenyl) propanediylbis (oxymethylene)) bis- (3-ethyloxetane), 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2-bis [(3- Ethyl-3-oxetanylmethoxy) methyl] ethane, 1,3-bis [(3-ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenylbis (3-Ethyl-3-oxetanylmethyl) ether, triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether Tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tricyclodecanediyldimethylene (3-ethyl-3-oxetanylmethyl) ether, trimethylolpropane tris (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis (3-ethyl-3-oxetanylmethoxy) butane, 1,6-bis (3-ethyl-3-oxetanylmethoxy) hexane, pentaerythritol tris (3-ethyl-3-oxetanylmethyl) ether, penta Erythritol tetrakis (3-ethyl-3-oxetanylmethyl) ether, polyethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexakis (3-ethyl-3-oxetanylmethyl) ether, dipe Taerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis (3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexakis (3-ethyl-3-oxetanylmethyl) ether Caprolactone-modified dipentaerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropanetetrakis (3-ethyl-3-oxetanylmethyl) ether, ethylene oxide (EO) -modified bisphenol A bis (3-ethyl-3) -Oxetanylmethyl) ether, propylene oxide (PO) modified bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO modified hydrogenated bisphenol A bis (3-e Oxetane ring in the molecule such as til-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F (3-ethyl-3-oxetanylmethyl) ether And the like. Among these, dipentaerythritol hexakis (3-ethyl-3-oxetanylmethyl) ether is preferable because it can provide an effect of improving the limit resolution when used in combination with the crosslinking component II.

  The crosslinking component Ib exhibits its effect when used in combination with the crosslinking component II. The definition, specific compounds, and preferred compounds of the crosslinking component II are as described above.

  When the crosslinking component Ib and the crosslinking component II are used in combination as the crosslinking component, the total amount of the crosslinking component Ib and the crosslinking component II is preferably 1 to 100 parts by weight with respect to 100 parts by weight of the resin having a hydroxyl group. 5 to 70 parts by weight is more preferable. If the blending amount is less than 1 part by weight, curing may be insufficient and pattern shrinkage may not occur, and if it exceeds 100 parts by weight, curing may proceed excessively and the pattern may be buried.

  The blend ratio of the crosslinking component Ib and the crosslinking component II is preferably 80:20 to 20:80, and more preferably 70:30 to 30:70. If the ratio of the cross-linking component Ia is smaller than 20:80, there is a possibility that a problem of insufficient pattern shrinkage may occur. On the other hand, when the ratio of the cross-linking component II is smaller than 80:20, there is a tendency to cause a problem of insufficient resolution.

  Further, the total amount of the hydroxyl group-containing resin and the crosslinking component is 0.1 to 30% by weight, preferably 1 to 20% by weight, based on the entire resin composition including the alcohol solvent described later. If the total amount of the hydroxyl group-containing resin and the cross-linking component is less than 0.1% by weight, the coating film may become too thin, causing film breakage in the pattern-etched part. There is a possibility that it cannot be embedded in the pattern.

[1-3] Alcohol solvent:
The alcohol solvent that can be used in the present invention is a solvent containing 10% by weight or less of water based on the alcohol and the total solvent. Any solvent that does not cause intermixing with the photoresist film when the resin having a hydroxyl group and the crosslinking component are sufficiently dissolved and applied onto the photoresist film can be used.

  The “alcohol” is preferably a monohydric alcohol having 1 to 8 carbon atoms. For example, 1-propanol, isopropanol, 1-butanol, 2-butanol, tert-butanol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, 3-methyl-1- Butanol, 3-methyl-2-butanol, 1-hexanol, 2-hexanol, 3-hexanol, 2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3 -Methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, 1-heptanol, 2- And heptanol, 2-methyl-2-heptanol, 2-methyl-3-heptanol, etc., and 1-butanol, 2-butanol , 4-methyl-2-pentanol are preferred. These alcohols can be used alone or in combination of two or more.

  The alcohol solvent can contain 10% by weight or less, preferably 1% by weight or less of water based on the total solvent. If it exceeds 10% by weight, the solubility of the resin having a hydroxyl group is lowered. In addition, although it says "it contains 10 mass% or less water", the alcohol which does not contain water at all is also included in the scope of the present invention. That is, in the present invention, it is also preferable to use an anhydrous alcohol containing no water as an “alcohol solvent”. Further, the “total solvent” referred to here includes “other solvents” described later in addition to alcohol and water.

  The resin composition for forming a fine pattern of the present invention can be mixed with another solvent for the purpose of adjusting applicability when applied on a photoresist film. Other solvents have the effect of uniformly applying the resin composition for forming a fine pattern without eroding the photoresist film.

  Other solvents include cyclic ethers such as tetrahydrofuran and dioxane; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether Alkyl ethers of polyhydric alcohols such as diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether; ethylene glycol ethyl ether acetate, diethylene glycol ethyl ether acetate, propylene glycol ethyl ether acetate Alkyl ether acetates of polyhydric alcohols such as propylene glycol monomethyl ether acetate; aromatic hydrocarbons such as toluene and xylene; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, di Ketones such as acetone alcohol; ethyl acetate, butyl acetate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, Methyl 2-hydroxy-3-methylbutanoate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, ethyl acetate, vinegar Esters such as butyl. Among these, cyclic ethers, polyhydric alcohol alkyl ethers, polyhydric alcohol alkyl ether acetates, ketones, and esters are preferable.

  The blending ratio of the other solvent is 30% by weight or less, preferably 20% by weight or less in the total solvent. If it exceeds 30% by weight, the photoresist film may be eroded, causing problems such as intermixing with the resin composition for forming a fine pattern, and the resist pattern may be buried.

[1-4] Other additives:
A surfactant may be added to the resin composition for forming a fine pattern of the present invention for the purpose of improving coating properties, antifoaming properties, leveling properties and the like.

  Examples of such surfactants include BM-1000, BM-1100 (above, manufactured by BM Chemie), MegaFuck F142D, F172, F173, and F183 (above, manufactured by Dainippon Ink & Chemicals, Inc.), Fluorard FC-135, FC-170C, FC-430, FC-431 (above, manufactured by Sumitomo 3M), Surflon S-112, S-113, S-131, S-141, S -145 (above, manufactured by Asahi Glass Co., Ltd.), SH-28PA, -190, -193, SZ-6032, SF-8428 (above, manufactured by Toray Dow Corning Silicone), etc. Surfactants can be used. The blending amount of these surfactants is preferably 5% by weight or less with respect to 100 parts by weight of the hydroxyl group-containing resin.

[2] Fine pattern forming method:
A fine pattern is formed by the following method using the resin composition for forming a fine pattern.

[2-1] Resist pattern forming step:
First, a resist pattern is formed on the substrate. For example, an antireflection film (organic film or inorganic film) is formed on an 8-inch or 12-inch silicon wafer substrate by a conventionally known method such as spin coating. Next, a photoresist is applied by a conventionally known method such as spin coating, and prebaking (PB) is performed under conditions of, for example, about 80 ° C. to 140 ° C. and about 60 to 120 seconds. Thereafter, exposure is performed with ultraviolet rays such as g-line and i-line, KrF excimer laser beam, ArF excimer laser beam, X-ray, electron beam, etc., for example, post-exposure baking (PEB) under conditions of about 80 ° C. to 140 ° C. Then, development is performed to form a resist pattern.

[2-2] Film formation step:
Next, a film of the resin composition for forming a fine pattern is formed on the resist pattern. For example, the fine pattern forming resin composition of the present invention is applied to the substrate on which the resist pattern is formed by a conventionally known method such as spin coating. The solvent may be volatilized only by spin coating to form a coating film. Moreover, if necessary, for example, prebaking (PB) is performed at about 80 ° C. to 110 ° C. for about 60 to 120 seconds to form a coating film of the resin composition for forming a fine pattern.

[2-3] Heat treatment step:
Further, the substrate on which the coating film is formed is heat treated. By the heat treatment, the acid derived from the photoresist diffuses from the interface with the photoresist into the resin composition layer for forming a fine pattern, and the resin composition for forming a fine pattern causes a crosslinking reaction. The cross-linking reaction state from the photoresist interface is determined by the material of the resin composition for forming a fine pattern, the photoresist used, the baking temperature and the baking time. The heat treatment temperature and heat treatment time are usually about 90 ° C. to 160 ° C. and about 60 to 120 seconds.

[2-4] Film removal step:
Finally, the film is removed with an alkaline aqueous solution and washed with water. Specifically, the coating film of the resin composition for forming a fine pattern is developed with an alkaline aqueous solution such as tetramethylammonium hydroxide (TMAH) (for example, about 60 to 120 seconds) to form uncrosslinked fine particles. The coating film of the resin composition for pattern formation is dissolved and removed. Finally, a hole pattern, an elliptical pattern, a trench pattern, and the like can be miniaturized by washing with water.

  The present invention will be described below with reference to examples, but the embodiments of the present invention are not limited to these examples. Hereinafter, synthesis examples of the resin containing a hydroxyl group used in Examples will be described.

Synthesis Example 1 [Synthesis of Resin (P-1) Having a Hydroxyl Group]:

  100 g of pt-butoxystyrene (P-1-1), 10 g of styrene (P-1-2) and 9.0 g of azobisisobutyronitrile are dissolved in propylene glycol monomethyl ether and polymerized at 80 ° C. for 9 hours. Reaction was performed. The polymerization solution was purified by reprecipitation with methanol to obtain 100 g of a pt-butoxystyrene / styrene copolymer having Mw of 7,300 and Mw / Mn of 1.80. This copolymer and 50 g of 10% by weight sulfuric acid solution were dissolved in 300 g of propylene glycol monomethyl ether, and an acid hydrolysis reaction was performed at 90 ° C. for 6 hours. The reaction solution was purified by reprecipitation with a large amount of water until neutral, and 65 g of a copolymer of p-hydroxystyrene / styrene = 85/15 mol%, Mw 5,500, Mw / Mn 1.55 was obtained. This copolymer is referred to as “resin (P-1)”.

Measurement of Resin (P-1) and the following Mw and Mn of the polymer obtained in each synthesis example, Tosoh Corporation GPC column (G2000H _XL 2 present, one G3000H _XL, G4000H _XL one) was used, Measurement was performed by gel permeation chromatography (GPC) using monodisperse polystyrene as a standard under the analysis conditions of a flow rate of 1.0 ml / min, an elution solvent tetrahydrofuran, and a column temperature of 40 ° C.

Synthesis Example 2 [Synthesis of Resin having Hydroxyl (P-2)]:

  90 g of p-hydroxymethacrylanilide (P-2-1), 30 g of t-butyl methacrylate (P-2-2), 9 g of azobisisobutyronitrile, 5 g of 2,4-diphenyl-4-methyl-1-pentene And polymerized for 8 hours under reflux conditions (63 ° C.). The polymerization solution was purified by reprecipitation of methanol / water and isopropyl alcohol / heptane, and was composed of p-hydroxymethacrylanilide / t-butylmethacrylate = 70/30 (molar ratio) of Mw8,500 and Mw / Mn2.08. 120 g of polymer was obtained. This copolymer is referred to as “resin (P-2)”.

Synthesis Example 3 [Synthesis of Resin Having Hydroxyl (P-3)]:

  P-hydroxy of Mw 5,200, Mw / Mn 1.62 in the same manner as in Synthesis Example 5 except that p-hydroxymethacrylanilide (P-3-1) and styrene (P-3-2) are used as starting materials. A copolymer consisting of methacrylanilide / styrene = 70/30 (molar ratio) was obtained. This copolymer is referred to as “resin (P-3)”.

Synthesis Example 4 [Synthesis of Resin Having Hydroxyl (P-4)]:

  Mw 7,000, Mw / Mn 1 .M, as in Synthesis Example 5 except that p-hydroxymethacrylanilide (P-4-1) and pt-butoxystyrene (P-4-2) were used as starting materials. A copolymer consisting of 77 p-hydroxymethacrylanilide / pt-butoxystyrene = 70/30 (molar ratio) was obtained. This copolymer is referred to as “resin (P-4)”.

Synthesis Example 5 [Synthesis of Resin Having Hydroxyl (P-5)]:

  P-Hydroxymethacrylanilide (P-5-1) and 4,4,4-trifluoro-3-hydroxy-1-methyl-3-trifluoromethyl-1-butyl methacrylate (P-5-2) as starting materials P-hydroxymethacrylanilide with Mw 9,700 and Mw / Mn 1.99 / 4,4,4-trifluoro-3-hydroxy-1-methyl-3-trifluoro in the same manner as in Synthesis Example 5 A copolymer consisting of methyl-1-butyl methacrylate = 85/15 (molar ratio) was obtained. This copolymer is referred to as “resin (P-5)”.

Synthesis Example 6 [Synthesis of Resin Having Hydroxyl (P-6)]:

The same as Synthesis Example 5 except that p-hydroxymethacrylanilide (P-6-1) and 3-tricyclo [4.3.0.1 ^2,5 ] decane methacrylate (P-6-2) are used as starting materials. A copolymer consisting of p-hydroxymethacrylanilide / 3-tricyclo [4.3.0.1 ^2,5 ] decane methacrylate = 70/30 (molar ratio) having Mw of 8,000 and Mw / Mn of 1.80. Obtained. This copolymer is referred to as “resin (P-6)”.

(Example 1 to Example 13, Comparative Example 1 to Comparative Example 3)
After adding a hydroxyl group-containing resin, a crosslinking component, an alcohol solvent and other additives at the ratio shown in Table 1, and stirring for 3 hours using a stirring blade (100 rpm), the mixture was filtered using a filter having a pore diameter of 100 nm. Thus, a fine pattern forming resin composition was obtained.

  The crosslinking component and alcohol solvent used in each example and comparative example are shown below.

[Crosslinking component Ia]
E-1: Ethylene glycol diglycidyl ether (2 epoxy groups, trade name: Epolite 40E, manufactured by Kyoeisha Chemical Co., Ltd.)
E-2: Trimethylolethane triglycidyl ether (3 epoxy groups, trade name: Epolite 100MF, manufactured by Kyoeisha Chemical Co., Ltd.)
E-3: Dimethylolpropane diglycidyl ether (2 epoxy groups, trade name: Epolite 1500NP, manufactured by Kyoeisha Chemical Co., Ltd.)
E-4: Pentaerythritol tetraglycidyl ether (4 epoxy groups, trade name: Denacol EX-411, manufactured by Nagase ChemteX Corporation)
[Crosslinking component Ib]
E-5: Dipentaerythritol hexakis (3-ethyl-3-oxetanylmethyl) ether (six oxetanyl groups)

[Crosslinking component II]
C-1: Methoxymethylated melamine resin (trade name: Cymel 300, manufactured by Nippon Cytex Co., Ltd.)
C-2: Methoxymethylated melamine resin (trade name: Cymel 325, manufactured by Nippon Cytex Co., Ltd.)

[Alcohol solvent]
S-1: 1-butanol S-2: water

  In order to evaluate the obtained resin composition for forming a fine pattern, an evaluation substrate with a resist pattern was prepared by the following method.

After forming a coating film with a film thickness of 77 nm (PB205 ° C., 60 seconds) on a 8-inch silicon wafer by spin coating a lower antireflection film ARC29A (made by Brewer Science) with CLEAN TRACK ACT8 (made by Tokyo Electron), JSR Patterning of ArF AR1244J (manufactured by JSR Corporation, alicyclic radiation-sensitive resin composition) is performed. AR1244J was applied by spin coating (CLEAN TRACK ACT8) and PB (130 ° C., 90 seconds) to a film thickness of 210 nm, and ArF projection exposure apparatus S306C (manufactured by Nikon Corporation), NA: 0.78, Sigma: 0.85 2/3 Ann exposure (exposure 30 mJ / cm ² ), PEB (130 ° C., 90 seconds) on CLEAN TRACK ACT8 hotplate, paddle on LD nozzle of CLEAN TRACK ACT8 Development (60 seconds), rinsing with ultrapure water, spin-drying by shaking off at 4000 rpm for 15 seconds, and an evaluation substrate A was obtained.

  The obtained evaluation substrate A corresponds to a 100 nm diameter hole pattern and a 100 nm space mask pattern (bias + 30 nm / 130 nm diameter pattern / 70 nm space on the mask) with a scanning electron microscope (S-9360 manufactured by Hitachi Keiki Co., Ltd.). The pattern was observed and the hole diameter of the resist pattern was measured.

  Using an evaluation substrate with a resist pattern (evaluation substrate A), the resin composition for forming a fine pattern shown in Table 1 was evaluated by the following method. Each evaluation result is shown in Table 1.

(1) Pattern shrinkage rate evaluation:
After applying the resin composition for forming a fine pattern shown in Table 1 on the evaluation substrate A by spin coating and baking (100 ° C., 90 seconds) with CLEAN TRACK ACT8, a resist pattern and a fine pattern are applied. In order to make the forming resin composition react, baking was performed at 155 ° C. for 90 seconds. Next, using the LD nozzle of the CLEAN TRACK ACT8, a 2.38 wt% TMAH aqueous solution was used as a developing solution for paddle development (60 seconds), rinsed with ultrapure water, then spin-dried at 4000 rpm for 15 seconds, and spin-dried. B was obtained.

Pattern shrinkage was observed with a scanning electron microscope (S-9360, manufactured by Hitachi Keiki Co., Ltd.) as a pattern corresponding to a 100 nm diameter hole pattern and a 100 nm space mask pattern (bias +30 nm / 130 nm diameter pattern / 70 nm space on the mask). Then, the hole diameter of the pattern was measured, and the pattern shrinkage rate was calculated from the following formula. At this time, a pattern shrinkage rate of 20% or more was designated as “◯”, and a pattern shrinkage rate of less than 20% was designated as “X”.
Shrinkage rate (%) = [(φ1-φ2) / φ1] × 100
φ1: Resist pattern hole diameter of evaluation substrate A (nm)
φ2: resist pattern hole diameter of evaluation substrate B (nm)

  The resin composition for forming a fine pattern of the present invention can effectively and accurately miniaturize the pattern gap of the resist pattern regardless of the surface state of the substrate, and a pattern that exceeds the wavelength limit is good and economical. In addition to being able to be formed at a low cost and with few pattern defects, it is possible to further improve the pattern shrinkage rate, which is representative of the manufacture of integrated circuit elements that are expected to become increasingly finer in the future. Can be used very suitably in the field of microfabrication.

Claims (5)

A resin composition for forming a fine pattern comprising a resin containing a hydroxyl group, a crosslinking component, and an alcohol solvent containing 10% by weight or less of water with respect to the alcohol and the total solvent,
The resin composition for fine pattern formation containing the compound which has 2 or more of epoxy groups in the molecule | numerator as said bridge | crosslinking component.   The resin composition for forming a fine pattern according to claim 1, wherein the alcohol is a monohydric alcohol having 1 to 8 carbon atoms. The resin composition for forming a fine pattern according to claim 1 or 2, further comprising a compound containing a group represented by the following formula (1) as the crosslinking component.

(In the formula (1), R ¹ and R ² are each represented by a hydrogen atom or the following formula (2), and at least one of R ¹ and R ² is represented by the following formula (2);

In Formula (2), R ³ and R ⁴ are a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 6 carbon atoms, or 2 to 10 carbon atoms in which R ³ and R ⁴ are connected to each other. R ⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ) A resin composition for forming a fine pattern comprising a resin containing a hydroxyl group, a crosslinking component, and an alcohol solvent containing 10% by weight or less of water with respect to the alcohol and the total solvent,
A resin composition for forming a fine pattern comprising, as the crosslinking component, a compound having two or more oxetanyl groups in the molecule and a compound containing a group represented by the following formula (1).

(In the formula (1), R ¹ and R ² are each represented by a hydrogen atom or the following formula (2), and at least one of R ¹ and R ² is represented by the following formula (2);

In Formula (2), R ³ and R ⁴ are a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxyalkyl group having 1 to 6 carbon atoms, or 2 to 10 carbon atoms in which R ³ and R ⁴ are connected to each other. R ⁵ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. ) A pattern forming step of forming a resist pattern on the substrate, a film forming step of forming a coating of the resin composition for forming a fine pattern on the resist pattern, a heat treatment of heat-treating the substrate on which the coating is formed, an alkali In the fine pattern forming method including the film removal step of removing the film with an aqueous solution and washing with water,
The fine pattern formation method using the resin composition for fine pattern formation as described in any one of Claims 1-4 as said resin composition for fine pattern formation.