JP4521227B2 - 窒素を含有する蛍光体の製造方法 - Google Patents
窒素を含有する蛍光体の製造方法 Download PDFInfo
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- JP4521227B2 JP4521227B2 JP2004207723A JP2004207723A JP4521227B2 JP 4521227 B2 JP4521227 B2 JP 4521227B2 JP 2004207723 A JP2004207723 A JP 2004207723A JP 2004207723 A JP2004207723 A JP 2004207723A JP 4521227 B2 JP4521227 B2 JP 4521227B2
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- containing nitrogen
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 134
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title claims description 63
- 229910052757 nitrogen Inorganic materials 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000010304 firing Methods 0.000 claims description 23
- 239000007789 gas Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- 239000012190 activator Substances 0.000 claims description 12
- 229910052788 barium Inorganic materials 0.000 claims description 12
- 229910052712 strontium Inorganic materials 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 8
- 229910052684 Cerium Inorganic materials 0.000 claims description 7
- 229910052693 Europium Inorganic materials 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- 238000000295 emission spectrum Methods 0.000 description 32
- 239000000843 powder Substances 0.000 description 19
- 239000002994 raw material Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 150000004767 nitrides Chemical class 0.000 description 10
- 230000005284 excitation Effects 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 8
- 239000011575 calcium Substances 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000005121 nitriding Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- COHYTHOBJLSHDF-UHFFFAOYSA-N Indigo Chemical compound N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000695 excitation spectrum Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004132 Calcium polyphosphate Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 235000019827 calcium polyphosphate Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0602—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with two or more other elements chosen from metals, silicon or boron
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/70—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus
- C09K11/71—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus also containing alkaline earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/77217—Silicon Nitrides or Silicon Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
- C01P2002/54—Solid solutions containing elements as dopants one element only
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/84—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by UV- or VIS- data
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
M2Si5N8:Z (2)
(上記一般式中、MはSr、BaおよびCaからなる群から選択される少なくとも1種であり、ZはEuおよびCeからなる群から選択される少なくとも1種の付活剤である。)
M2Si5N8:Z (2)
(上記一般式中、MはSr、BaおよびCaからなる群から選択される少なくとも1種であり、ZはEuおよびCeからなる群から選択される少なくとも1種の付活剤である。)
(上記一般式(2)中、MはSr、BaおよびCaからなる群から選択される少なくとも1種であり、ZはEuおよびCeからなる群から選択される少なくとも1種の付活剤である。)
上述したような酸化物蛍光体を還元/窒化することによって窒化物蛍光体が得られ、製造後の蛍光体は、その全ての部分が発光する。原料である酸化物蛍光体の窒化を制御した場合には、窒化物蛍光体と原料酸化物蛍光体との混合蛍光体を得ることもでき、近紫外、または青色発光ダイオードに塗布する際に必要な割合に製造することも可能である。混合蛍光体における組成比(窒化物蛍光体の重量/酸化物蛍光体の重量)は、例えば、焼成雰囲気(水素濃度等)、焼成条件(温度、時間等)を変化させることにより変化させることができる。例えば、雰囲気中の水素濃度が高い場合には、組成比は大きくなり、焼成温度が高い場合や焼成時間が長い場合も、組成比は大きくなる。
15…第1の凹部; 16…発光チップ; 17…第2の凹部
18…反射面; 19,20…ボンディングワイヤ; 21…蛍光体含有樹脂
22…封止体。
Claims (5)
- 2種以上の金属元素を含有する酸化物蛍光体を、主として炭化ケイ素またはカーボンにより成形された収容体に収容する工程と、
窒素を含む還元混合ガス雰囲気中で前記収容体の酸化物蛍光体を焼成する工程と、
を具備することを特徴とする窒素を含有する蛍光体の製造方法。 - 2種以上の金属元素を含有する酸化物蛍光体を、炭素を含む材質の収容体に収容する工程と、
窒素ガスと水素ガスとを含む混合ガス雰囲気中で前記収容体の酸化物蛍光体を焼成する工程と、
を具備することを特徴とする窒素を含有する蛍光体の製造方法。 - 下記一般式(1)で表わされる酸化物蛍光体を、炭素を含む材質の収容体に収容し、窒素を含む還元混合ガス雰囲気中で焼成して、下記一般式(2)で表わされる蛍光体を製造する工程を具備することを特徴とする窒素を含有する蛍光体の製造方法。
M2SiO4:Z (1)
M2Si5N8:Z (2)
(上記一般式中、MはSr、BaおよびCaからなる群から選択される少なくとも1種であり、ZはEuおよびCeからなる群から選択される少なくとも1種の付活剤である。) - 下記一般式(1)で表わされる酸化物蛍光体を、炭素を含む材質の収容体に収容し、窒素を含む還元混合ガス雰囲気中で焼成して、その一部を下記一般式(2)で表わされる窒素を含有する蛍光体に変化させる工程を具備することを特徴とする窒素を含有する蛍光体の製造方法。
M2SiO4:Z (1)
M2Si5N8:Z (2)
(上記一般式中、MはSr、BaおよびCaからなる群から選択される少なくとも1種であり、ZはEuおよびCeからなる群から選択される少なくとも1種の付活剤である。) - 前記窒素を含む還元混合ガス雰囲気は、窒素ガスと水素ガスとを含む混合ガス雰囲気であることを特徴とする請求項1、3または4に記載の窒素を含有する蛍光体の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004207723A JP4521227B2 (ja) | 2004-07-14 | 2004-07-14 | 窒素を含有する蛍光体の製造方法 |
KR1020050063055A KR100695349B1 (ko) | 2004-07-14 | 2005-07-13 | 질소 함유 형광물질의 제조 방법 |
EP05254389.9A EP1616930B1 (en) | 2004-07-14 | 2005-07-13 | Fluorescent substance containing nitrogen, method for manufacturing the same, and light-emitting device |
US11/179,575 US7414272B2 (en) | 2004-07-14 | 2005-07-13 | Fluorescent substance containing nitrogen, method for manufacturing the same, and light-emitting device |
CNB200510081970XA CN100513516C (zh) | 2004-07-14 | 2005-07-14 | 含氮荧光物质、其制造方法以及发光器件 |
CN2008101456425A CN101353576B (zh) | 2004-07-14 | 2005-07-14 | 含氮荧光物质、其制造方法以及发光器件 |
US12/143,086 US20080253952A1 (en) | 2004-07-14 | 2008-06-20 | Fluorescent substance containing nitrogen, method for manufacturing the same, and light-emitting device |
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JP2004207723A JP4521227B2 (ja) | 2004-07-14 | 2004-07-14 | 窒素を含有する蛍光体の製造方法 |
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JP2006028310A JP2006028310A (ja) | 2006-02-02 |
JP4521227B2 true JP4521227B2 (ja) | 2010-08-11 |
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JP2004207723A Expired - Fee Related JP4521227B2 (ja) | 2004-07-14 | 2004-07-14 | 窒素を含有する蛍光体の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7414272B2 (ja) |
EP (1) | EP1616930B1 (ja) |
JP (1) | JP4521227B2 (ja) |
KR (1) | KR100695349B1 (ja) |
CN (2) | CN100513516C (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4521227B2 (ja) | 2004-07-14 | 2010-08-11 | 株式会社東芝 | 窒素を含有する蛍光体の製造方法 |
JP4836429B2 (ja) * | 2004-10-18 | 2011-12-14 | 株式会社東芝 | 蛍光体およびこれを用いた発光装置 |
JP4880892B2 (ja) * | 2004-10-18 | 2012-02-22 | 株式会社東芝 | 蛍光体,蛍光体の製造方法およびこれを用いた発光装置 |
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- 2005-07-13 KR KR1020050063055A patent/KR100695349B1/ko active IP Right Grant
- 2005-07-13 EP EP05254389.9A patent/EP1616930B1/en not_active Ceased
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Also Published As
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CN100513516C (zh) | 2009-07-15 |
CN101353576A (zh) | 2009-01-28 |
EP1616930B1 (en) | 2014-08-20 |
EP1616930A3 (en) | 2007-09-05 |
US7414272B2 (en) | 2008-08-19 |
US20060011936A1 (en) | 2006-01-19 |
CN1721500A (zh) | 2006-01-18 |
EP1616930A2 (en) | 2006-01-18 |
CN101353576B (zh) | 2011-12-07 |
KR20060050115A (ko) | 2006-05-19 |
KR100695349B1 (ko) | 2007-03-19 |
JP2006028310A (ja) | 2006-02-02 |
US20080253952A1 (en) | 2008-10-16 |
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