JP4520251B2 - Curable composition - Google Patents
Curable composition Download PDFInfo
- Publication number
- JP4520251B2 JP4520251B2 JP2004252689A JP2004252689A JP4520251B2 JP 4520251 B2 JP4520251 B2 JP 4520251B2 JP 2004252689 A JP2004252689 A JP 2004252689A JP 2004252689 A JP2004252689 A JP 2004252689A JP 4520251 B2 JP4520251 B2 JP 4520251B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- component
- curable composition
- carbon
- addition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title claims description 64
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 33
- 150000001875 compounds Chemical class 0.000 claims description 33
- 239000007795 chemical reaction product Substances 0.000 claims description 28
- 239000000047 product Substances 0.000 claims description 27
- -1 glycidoxy Chemical group 0.000 claims description 25
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 23
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 238000007259 addition reaction Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000004215 Carbon black (E152) Substances 0.000 claims description 11
- 229930195733 hydrocarbon Natural products 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 8
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 5
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 4
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 14
- 125000003342 alkenyl group Chemical group 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- BQYPERTZJDZBIR-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical group C[SiH]1O[SiH](C)O[SiH](C)O[SiH](C)O1 BQYPERTZJDZBIR-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 125000003367 polycyclic group Chemical group 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 125000005024 alkenyl aryl group Chemical group 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- UHXCHUWSQRLZJS-UHFFFAOYSA-N (4-dimethylsilylidenecyclohexa-2,5-dien-1-ylidene)-dimethylsilane Chemical compound C[Si](C)C1=CC=C([Si](C)C)C=C1 UHXCHUWSQRLZJS-UHFFFAOYSA-N 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- OQJPAHYVGNJBJK-UHFFFAOYSA-N (3-dimethylsilylphenyl)-dimethylsilane Chemical compound C[SiH](C)C1=CC=CC([SiH](C)C)=C1 OQJPAHYVGNJBJK-UHFFFAOYSA-N 0.000 description 1
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- CZNRFEXEPBITDS-UHFFFAOYSA-N 2,5-bis(2-methylbutan-2-yl)benzene-1,4-diol Chemical compound CCC(C)(C)C1=CC(O)=C(C(C)(C)CC)C=C1O CZNRFEXEPBITDS-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- QYXVDGZUXHFXTO-UHFFFAOYSA-L 3-oxobutanoate;platinum(2+) Chemical compound [Pt+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O QYXVDGZUXHFXTO-UHFFFAOYSA-L 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 0 C*C(C1)C2C=CC1C2 Chemical compound C*C(C1)C2C=CC1C2 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- ZPNJBTBYIHBSIG-UHFFFAOYSA-N phenyl-(2,2,6,6-tetramethylpiperidin-4-yl)methanone Chemical compound C1C(C)(C)NC(C)(C)CC1C(=O)C1=CC=CC=C1 ZPNJBTBYIHBSIG-UHFFFAOYSA-N 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical group Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Description
本発明は、光学デバイスもしくは光学部品用材料、電子デバイスもしくは電子部品用絶縁材料またはコーティング材料として有用な、多環式炭化水素骨格含有成分を含む硬化性組成物に関する。 The present invention relates to a curable composition containing a polycyclic hydrocarbon skeleton-containing component useful as an optical device or optical component material, an electronic device or electronic component insulating material, or a coating material.
従来、光学デバイスまたは光学部品用材料、特に発光ダイオード(LED)素子の封止材料としては、一般的にエポキシ樹脂が用いられている。また、シリコーン樹脂に関しても、LED素子のモールド部材等として用いること(特許文献1、特許文献2参照)、またカラーフィルター材料として用いること(特許文献3参照)が試みられているが、実際上の使用例は少ない。 Conventionally, an epoxy resin is generally used as a sealing material for an optical device or an optical component material, particularly a light emitting diode (LED) element. In addition, regarding silicone resin, attempts have been made to use it as a mold member for LED elements (see Patent Document 1 and Patent Document 2) and as a color filter material (see Patent Document 3). There are few examples of use.
近年、白色LEDが注目される中で、これまで問題とされなかったエポキシ封止材の紫外線等による黄変や、小型化に伴う発熱量の増加によるクラック等の問題が発生しており対応が急務となっている。これらの対応策としては、分子中に多量のフェニル基を持つシリコーンレジン硬化物を用いることが検討されている。しかし、今後のLEDの光源としては、より短い波長の光線を生じるものが使用されるようになる傾向にあり、エポキシ封止材およびフェニル基含有シリコーンレジン封止材は短波長領域での光透過性が悪いため、短波長領域の光線を生じるLEDへの適用は問題があった。 In recent years, while white LEDs have been attracting attention, problems such as yellowing due to ultraviolet rays etc. of epoxy sealing materials, which has not been a problem so far, and cracks due to an increase in the amount of heat generated due to miniaturization have occurred and can be handled It is an urgent need. As a countermeasure for these, the use of a cured silicone resin having a large amount of phenyl groups in the molecule has been studied. However, as light sources for future LEDs, those that generate light with shorter wavelengths tend to be used, and epoxy encapsulants and phenyl group-containing silicone resin encapsulants are light transmissive in the short wavelength region. Due to the poor nature, there has been a problem in application to LEDs that generate light in the short wavelength region.
また、炭素−炭素二重結合を1分子中に少なくとも2個有する有機化合物と、ケイ素原子に結合した水素原子を1分子中に少なくとも2個有するケイ素化合物とを必須成分として含む光学材料用組成物も提案されている(特許文献4〜特許文献8参照)。しかし、これらの組成物を加熱硬化させて硬化物を得る際に発泡または硬化収縮を生じたり、硬化物が着色する等の問題点があった。 An optical material composition comprising, as essential components, an organic compound having at least two carbon-carbon double bonds in one molecule and a silicon compound having at least two hydrogen atoms bonded to a silicon atom in one molecule. Have also been proposed (see Patent Documents 4 to 8). However, when these compositions are heat-cured to obtain a cured product, there are problems such as foaming or curing shrinkage, and coloring of the cured product.
上記従来技術の問題点に鑑み、本発明は、光学デバイスもしくは光学部品用材料、電子デバイスもしくは電子部品用絶縁材料またはコーティング材料として有用な、硬度および強度が高く、さらに短波長領域での光透過性に優れた硬化物を与える硬化性組成物を提供することを目的とする。 In view of the above-described problems of the prior art, the present invention is useful as an optical device or optical component material, an electronic device or electronic component insulating material or a coating material, has high hardness and strength, and further transmits light in a short wavelength region. It aims at providing the curable composition which gives the hardened | cured material excellent in property.
本発明者らは、上記目的を達成するために鋭意検討を行った結果、本発明を完成させるに至った。
即ち、本発明は、
(A)(a)下記一般式(1):
As a result of intensive studies to achieve the above object, the present inventors have completed the present invention.
That is, the present invention
(A) (a) The following general formula (1):
[式中、Aは、下記一般式(2):
[Wherein A represents the following general formula (2):
(式中、R'は独立に非置換もしくは置換の炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6のアルコキシ基であり、nは0〜100の整数である)
で表される基、および下記構造式(3):
(In the formula, R ′ is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, and n is an integer of 0 to 100)
And the following structural formula (3):
で表される基から成る群から選ばれる2価の基であり、
Rは独立に非置換もしくは置換の炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6アルコキシ基である]
で表されるケイ素原子に結合した水素原子を1分子中に2個有する化合物と、
(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物であって、かつ、付加反応性炭素−炭素二重結合を1分子中に少なくとも2個有する付加反応生成物、
(B)ケイ素原子に結合した水素原子を1分子中に3個以上有する化合物、および
(C)ヒドロシリル化反応触媒
を含む硬化性組成物を提供するものである。
A divalent group selected from the group consisting of groups represented by:
R is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms.
A compound having two hydrogen atoms bonded to a silicon atom represented by
(b) an addition reaction product with a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, and the addition-reactive carbon-carbon double bond in one molecule An addition reaction product having at least two
(B) a compound having three or more hydrogen atoms bonded to a silicon atom in one molecule, and
(C) A curable composition containing a hydrosilylation reaction catalyst is provided.
本発明の硬化性組成物は、硬度および強度が高く、硬化収縮が無く、短波長領域の光線についても光透過率が高く、透明性に優れた硬化物を与えることができる。従って、発光ダイオード素子の保護、封止もしくは接着、波長変更もしくは調整またはレンズ等の用途に好適に使用できる。また、レンズ材料、光学デバイスもしくは光学部品用封止材、ディスプレイ材料等の各種の光学用材料、電子デバイスもしくは電子部品用絶縁材料、更にはコーティング材料としても有用である。 The curable composition of the present invention has high hardness and strength, no curing shrinkage, high light transmittance even for light in the short wavelength region, and can provide a cured product having excellent transparency. Therefore, it can be suitably used for applications such as protection, sealing or adhesion, wavelength change or adjustment of light emitting diode elements, or lenses. Further, it is also useful as a lens material, various optical materials such as an optical device or an optical component sealing material, a display material, an electronic device or an insulating material for an electronic component, and a coating material.
以下、本発明について詳しく説明する。
[(A)成分]
本発明組成物の(A)成分は、
(a)下記一般式(1):
The present invention will be described in detail below.
[Component (A)]
The component (A) of the composition of the present invention is
(a) The following general formula (1):
[式中、Aは、下記一般式(2):
[Wherein A represents the following general formula (2):
(式中、R'は独立に非置換もしくは置換の炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6のアルコキシ基であり、nは0〜100の整数である)
で表される基、および下記構造式(3):
(In the formula, R ′ is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, and n is an integer of 0 to 100)
And the following structural formula (3):
で表される基から成る群から選ばれる2価の基であり、
Rは独立に非置換もしくは置換の炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6アルコキシ基である]
で表されるケイ素原子に結合した水素原子を1分子中に2個有する化合物と、
(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物であって、かつ、付加反応性炭素−炭素二重結合を1分子中に少なくとも2個有する付加反応生成物である。
A divalent group selected from the group consisting of groups represented by:
R is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms.
A compound having two hydrogen atoms bonded to a silicon atom represented by
(b) an addition reaction product with a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, and the addition-reactive carbon-carbon double bond in one molecule Is an addition reaction product having at least two.
<(a)成分>
この(A)成分の反応原料である、(a)上記一般式(1)で表されるケイ素原子に結合した水素原子(以下、「SiH」ということがある)を1分子中に2個有する化合物において、上記一般式(1)中のAが上記一般式(2)で表される2価の基である場合、該化合物としては、下記一般式(4):
<(A) component>
This reaction raw material of component (A) has (a) two hydrogen atoms bonded to the silicon atom represented by the general formula (1) (hereinafter sometimes referred to as “SiH”) in one molecule. In the compound, when A in the general formula (1) is a divalent group represented by the general formula (2), the compound includes the following general formula (4):
(式中、RおよびR'はそれぞれ独立に非置換もしくは置換の炭素原子数1〜12、好ましくは1〜6の1価炭化水素基または炭素原子数1〜6、好ましくは1〜4のアルコキシ基であり、nは0〜100、好ましくは0〜10の整数である)
で表される化合物が挙げられる。
Wherein R and R ′ are each independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12, preferably 1 to 6 carbon atoms, or alkoxy having 1 to 6 carbon atoms, preferably 1 to 4 carbon atoms. And n is an integer of 0 to 100, preferably 0 to 10)
The compound represented by these is mentioned.
上記式中、R,R'が上記1価炭化水素基である場合としては、例えば、メチル基、エチル、プロピル基、イソプロピル基、ブチル基、tert-ブチル基、ペンチル基、イソペンチル基、ヘキシル基、sec-ヘキシル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;フェニル基、o-,m-,p-トリル等のアリール基;ベンジル基、2-フェニルエチル基等のアラルキル基;ビニル基、アリル基、1−ブテニル基、1-ヘキセニル基等のアルケニル基;p-ビニルフェニル基等のアルケニルアリール基;およびこれらの基中の炭素原子に結合した1個以上の水素原子が、ハロゲン原子、シアノ基、エポキシ環含有基等で置換された、例えば、クロロメチル基、3-クロロプロピル基、3,3,3-トリフルオロプロピル基等のハロゲン化アルキル基;2-シアノエチル基;3-グリシドキシプロピル基等が挙げられる。 In the above formula, when R and R ′ are the above monovalent hydrocarbon group, for example, methyl group, ethyl, propyl group, isopropyl group, butyl group, tert-butyl group, pentyl group, isopentyl group, hexyl group Alkyl groups such as sec-hexyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group; aryl groups such as phenyl group, o-, m-, and p-tolyl; aralkyl groups such as benzyl group and 2-phenylethyl group An alkenyl group such as a vinyl group, an allyl group, a 1-butenyl group, or a 1-hexenyl group; an alkenyl aryl group such as a p-vinylphenyl group; and one or more hydrogen atoms bonded to carbon atoms in these groups; Substituted with a halogen atom, a cyano group, an epoxy ring-containing group, etc., for example, a halogenated amine such as a chloromethyl group, 3-chloropropyl group, 3,3,3-trifluoropropyl group, etc. Kill group; 2-cyanoethyl group; such as 3-glycidoxypropyl group.
また、R,R'が上記アルコキシ基である場合としては、例えば、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基、sec-ブトキシ基、tert-ブトキシ基等が挙げられる。 Examples of the case where R and R ′ are the above alkoxy groups include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a sec-butoxy group, and a tert-butoxy group.
上記の中でも、上記RおよびR'としては、アルケニル基およびアルケニルアリール基以外のものが好ましく、特に、その全てがメチル基であるものが、工業的に製造することが容易であり、入手しやすいことから好ましい。 Among the above, as R and R ′, those other than alkenyl and alkenylaryl groups are preferable, and those in which all of them are methyl groups are easy to produce industrially and easily available. This is preferable.
この上記一般式(4)で表される化合物の好適な具体例の構造式を下記に示すが、前記化合物が下記構造式のものに限定されるものではない。なお、以下、「Me」はメチル基を意味する。 Structural formulas of preferred specific examples of the compound represented by the above general formula (4) are shown below, but the compounds are not limited to those of the following structural formula. Hereinafter, “Me” means a methyl group.
HMe2SiOSiMe2H
HMe2SiO(Me2SiO)SiMe2H
HMe2SiO(Me2SiO)4SiMe2H
HMe2SiO(Me2SiO)8SiMe2H
HMe2SiO(Me2SiO)12SiMe2H
なお、この上記一般式(4)で表される化合物は、1種単独でも2種以上を組み合わせても使用することができる。
HMe 2 SiOSiMe 2 H
HMe 2 SiO (Me 2 SiO) SiMe 2 H
HMe 2 SiO (Me 2 SiO) 4 SiMe 2 H
HMe 2 SiO (Me 2 SiO) 8 SiMe 2 H
HMe 2 SiO (Me 2 SiO) 12 SiMe 2 H
In addition, the compound represented by the general formula (4) can be used alone or in combination of two or more.
該(A)成分の反応原料である、(a)上記一般式(1)で表されるSiHを1分子中に2個有する化合物において、上記一般式(1)中のAが上記構造式(3)で表される2価の基である場合、該化合物としては、下記一般式(5): In the compound having (a) two SiHs represented by the above general formula (1) in one molecule, which is a reaction raw material of the component (A), A in the general formula (1) is the structural formula ( In the case of the divalent group represented by 3), the compound includes the following general formula (5):
(式中、Rは上記一般式(4)に関して定義のとおりである)
で表される化合物が挙げられる。
(Wherein R is as defined above for general formula (4))
The compound represented by these is mentioned.
上記一般式(5)中のRとしては、上記一般式(4)中のRについて記載したものと同じ基が挙げられ、アルケニル基およびアルケニルアリール基以外のものであるものが好ましく、特に、その全てがメチル基であるものが好ましい。 Examples of R in the general formula (5) include the same groups as those described for R in the general formula (4), and those other than alkenyl groups and alkenyl aryl groups are preferable. Those in which all are methyl groups are preferred.
この上記一般式(5)で表される化合物としては、例えば、
構造式:HMe2Si-p-C6H4-SiMe2H
で表される 1,4-ビス(ジメチルシリル)ベンゼン、
構造式:HMe2Si-m-C6H4-SiMe2H
で表される 1,3-ビス(ジメチルシリル)ベンゼン等のシルフェニレン化合物が挙げられる。
なお、この上記一般式(5)で表される化合物は、1種単独でも2種以上を組み合わせても使用することができる。
更に、この(A)成分の反応原料である上記(a)成分は、1種単独でも2種以上を組み合わせても使用することができる。
As the compound represented by the general formula (5), for example,
Structural formula: HMe 2 Si-p-C 6 H 4 -SiMe 2 H
1,4-bis (dimethylsilyl) benzene represented by
Structural formula: HMe 2 Si-m-C 6 H 4 -SiMe 2 H
And a silphenylene compound such as 1,3-bis (dimethylsilyl) benzene.
The compound represented by the general formula (5) can be used alone or in combination of two or more.
Furthermore, the component (a), which is a reaction raw material for the component (A), can be used alone or in combination of two or more.
<(b)成分>
この(A)成分の反応原料である(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素において、前記「付加反応性」とは、ケイ素原子に結合した水素原子の付加(ヒドロシリル化反応として周知)を受け得る性質を意味する。
<(B) component>
In (b) a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, which is a reaction raw material of component (A), the “addition reactivity” is bonded to a silicon atom. Means the property of being able to undergo the addition of hydrogen atoms (known as hydrosilylation reactions).
また、該(b)成分は、(i)多環式炭化水素の多環骨格を形成している炭素原子のうち、隣接する2つの炭素原子間に付加反応性炭素−炭素二重結合が形成されているもの、(ii)多環式炭化水素の多環骨格を形成している炭素原子に結合した水素原子が、付加反応性炭素−炭素二重結合含有基によって置換されているもの、または、(iii)多環式炭化水素の多環骨格を形成している炭素原子のうち、隣接する2つの炭素原子間に付加反応性炭素−炭素二重結合が形成されており、かつ、多環式炭化水素の多環骨格を形成している炭素原子に結合した水素原子が付加反応性炭素−炭素二重結合含有基によって置換されているもの、の何れであっても差し支えない。
この(b)成分としては、例えば、下記構造式(x):
In addition, the component (b) includes (i) an addition reactive carbon-carbon double bond formed between two adjacent carbon atoms among the carbon atoms forming the polycyclic skeleton of the polycyclic hydrocarbon. (Ii) a hydrogen atom bonded to a carbon atom forming the polycyclic skeleton of a polycyclic hydrocarbon is replaced by an addition-reactive carbon-carbon double bond-containing group, or (Iii) an addition reactive carbon-carbon double bond is formed between two adjacent carbon atoms among the carbon atoms forming the polycyclic skeleton of the polycyclic hydrocarbon, and the polycyclic The hydrogen atom bonded to the carbon atom forming the polycyclic skeleton of the formula hydrocarbon may be any substituted with an addition-reactive carbon-carbon double bond-containing group.
Examples of the component (b) include the following structural formula (x):
(x)
で表される 5-ビニルビシクロ[2.2.1]ヘプト-2-エン、
下記構造式(y):
(x)
5-vinylbicyclo [2.2.1] hept-2-ene represented by
The following structural formula (y):
(y)
で表される 6-ビニルビシクロ[2.2.1]ヘプト-2-エン、これら両者の組み合わせ(以下、これら3者を区別する必要がない場合は、「ビニルノルボルネン」と総称することがある);下記構造式(z):
(y)
6-vinylbicyclo [2.2.1] hept-2-ene, a combination of the two (hereinafter, when there is no need to distinguish these three, they may be collectively referred to as “vinyl norbornene”); The following structural formula (z):
(z)
で表されるジシクロペンタジエン等が挙げられる。
(z)
The dicyclopentadiene etc. which are represented by these are mentioned.
なお、前記ビニルノルボルネンのビニル基の置換位置は、シス配置(エキソ形)またはトランス配置(エンド形)のいずれであってもよく、また、前記配置の相違によって、該成分の反応性等に特段の差異がないことから、これら両配置の異性体の組み合わせであっても差し支えない。 Incidentally, the substitution position of the vinyl group of the vinyl norbornene may be either a cis configuration (exo type) or a trans configuration (end type). Since there is no difference in the above, it is possible to use a combination of both isomers.
<(A)成分の調製>
本発明組成物の(A)成分は、SiHを1分子中に2個有する上記(a)成分の1モルに対して、付加反応性炭素−炭素二重結合を1分子中に2個有する上記(b)成分の1モルを越え 10モル以下、好ましくは1モルを越え5モル以下の過剰量を、ヒドロシリル化反応触媒の存在下で付加反応させることにより、SiHを有しない付加反応生成物として得ることができる。
こうして得られる(A)成分は、(b)成分由来の付加反応性炭素−炭素二重結合のほかに、(a)成分に由来する(具体的には、一般式(1)中のRおよび/または一般式(2)中のR’に由来する)付加反応性炭素−炭素二重結合を含み得るので、付加反応性炭素−炭素二重結合を1分子中に少なくとも2個含むが、この数は好ましくは2〜6個、より好ましくは2個である。この付加反応性炭素−炭素二重結合が多すぎると、本発明の組成物を硬化させて得られる硬化物に割れが生じやすくなる。
<Preparation of component (A)>
The component (A) of the composition of the present invention has two addition-reactive carbon-carbon double bonds in one molecule per mole of the component (a) having two SiH in one molecule. (b) An addition reaction product having no SiH is obtained by subjecting an excess of more than 1 mole to 10 moles or less, preferably more than 1 mole to 5 moles or less in the presence of a hydrosilylation reaction catalyst. Obtainable.
The component (A) thus obtained is derived from the component (a) in addition to the addition-reactive carbon-carbon double bond derived from the component (b) (specifically, R in the general formula (1) and And / or an addition-reactive carbon-carbon double bond (derived from R ′ in the general formula (2)), so that at least two addition-reactive carbon-carbon double bonds are contained in one molecule. The number is preferably 2 to 6, more preferably 2. When there are too many this addition reactive carbon-carbon double bonds, it will become easy to produce a crack in the hardened | cured material obtained by hardening the composition of this invention.
前記ヒドロシリル化反応触媒としては、従来から公知のものが全て使用することができる。例えば、白金金属を担持したカーボン粉末、白金黒、塩化第2白金、塩化白金酸、塩化白金酸と一価アルコールとの反応生成物、塩化白金酸とオレフィン類との錯体、白金ビスアセトアセテート等の白金系触媒;パラジウム系触媒、ロジウム系触媒等の白金族金属系触媒が挙げられる。また、付加反応条件、溶媒の使用等については、特に限定されず通常のとおりとすればよい。 Any conventionally known hydrosilylation reaction catalyst can be used. For example, carbon powder carrying platinum metal, platinum black, secondary platinum chloride, chloroplatinic acid, reaction product of chloroplatinic acid and monohydric alcohol, complex of chloroplatinic acid and olefins, platinum bisacetoacetate, etc. Platinum group catalysts such as platinum group catalysts such as palladium catalysts and rhodium catalysts. Moreover, about addition reaction conditions, use of a solvent, etc., it may just be as usual without being specifically limited.
前記のとおり、(A)成分の調製に際し、上記(a)成分に対して過剰モル量の上記(b)成分を用いることから、該(A)成分は、上記(b)成分の構造に由来する付加反応性炭素−炭素二重結合を1分子中に2個有するものである。更に、(A)成分は、上記(a)成分に由来する残基を有し、その残基が、上記(b)成分の構造に由来するが付加反応性炭素−炭素二重結合を有しない多環式炭化水素の二価の残基によって結合されている構造を含むものであってもよい。 As mentioned above, when preparing the component (A), the component (b) is used in an excess molar amount with respect to the component (a). Therefore, the component (A) is derived from the structure of the component (b). It has two addition-reactive carbon-carbon double bonds in one molecule. Furthermore, the component (A) has a residue derived from the component (a), and the residue is derived from the structure of the component (b) but does not have an addition-reactive carbon-carbon double bond. It may contain a structure linked by a divalent residue of a polycyclic hydrocarbon.
即ち、(A)成分としては、例えば、下記一般式(6):
Y-X-(Y'-X)p-Y (6)
(式中、Xは上記(a)成分の化合物の二価の残基であり、Yは上記(b)成分の多環式炭化水素の一価の残基であり、Y'は上記(b)成分の二価の残基であり、pは0〜10、好ましくは0〜5の整数である)
で表される化合物が挙げられる。
That is, as the component (A), for example, the following general formula (6):
Y-X- (Y'-X) p-Y (6)
Wherein X is a divalent residue of the compound of the component (a), Y is a monovalent residue of the polycyclic hydrocarbon of the component (b), and Y ′ is the above (b ) Component divalent residue, p is an integer of 0 to 10, preferably 0 to 5)
The compound represented by these is mentioned.
なお、上記 (Y'-X) で表される繰り返し単位の数であるpの値については、上記(a)成分1モルに対して反応させる上記(b)成分の過剰モル量を調整することにより設定することが可能である。
上記一般式(6)中のYとしては、具体的には、例えば、下記構造式:
In addition, about the value of p which is the number of repeating units represented by said (Y'-X), adjusting the excess molar amount of said (b) component made to react with respect to 1 mol of said (a) component. It is possible to set by.
As Y in the general formula (6), specifically, for example, the following structural formula:
で表される一価の残基(以下、これら6者を区別する必要がない場合は、これらを「NB基」と総称し、また、前記6者の構造を区別せずに「NB」と略記することがある。);
(Hereinafter, when it is not necessary to distinguish these six members, they are collectively referred to as “NB group”, and “NB” without distinguishing the structure of the six members) May be abbreviated.);
で表される一価の残基(以下、これら7者を区別する必要がない場合は、これらの構造を「DCP」と略記することがある。)が挙げられる。
上記一般式(6)中のY'としては、具体的には、例えば、下記構造式:
(Hereinafter, these structures may be abbreviated as “DCP” when it is not necessary to distinguish these seven members.)
As Y ′ in the general formula (6), specifically, for example, the following structural formula:
で表される二価の残基が挙げられる。
The bivalent residue represented by these is mentioned.
但し、上記構造式で表される非対称な二価の残基は、その左右方向が上記記載のとおりに限定されるものではなく、上記構造式は、実質上、個々の上記構造を紙面上で 180度回転させた構造をも含めて示している。 However, the asymmetrical divalent residue represented by the above structural formula is not limited in the left-right direction as described above. It also shows the structure rotated 180 degrees.
上記一般式(6)で表される(A)成分の好適な具体例を、以下に示すが、これに限定されるものではない。(なお、「NB」および「DCP」の意味するところは、上記のとおりである。)
NB-Me2SiOSiMe2-NB
NB-Me2SiO(Me2SiO)SiMe2-NB
NB-Me2SiO(Me2SiO)4SiMe2-NB
NB-Me2SiO(Me2SiO)8SiMe2-NB
NB-Me2SiO(Me2SiO)12SiMe2-NB
NB-Me2Si-p-C6H4-SiMe2-NB
NB-Me2Si-m-C6H4-SiMe2-NB
Preferred specific examples of the component (A) represented by the general formula (6) are shown below, but are not limited thereto. (The meanings of “NB” and “DCP” are as described above.)
NB-Me 2 SiOSiMe 2 -NB
NB-Me 2 SiO (Me 2 SiO) SiMe 2 -NB
NB-Me 2 SiO (Me 2 SiO) 4 SiMe 2 -NB
NB-Me 2 SiO (Me 2 SiO) 8 SiMe 2 -NB
NB-Me 2 SiO (Me 2 SiO) 12 SiMe 2 -NB
NB-Me 2 Si-p-C 6 H 4 -SiMe 2 -NB
NB-Me 2 Si-m- C 6 H 4 -SiMe 2 -NB
(式中、pは1〜10の整数である。)
(In the formula, p is an integer of 1 to 10.)
(式中、pは1〜10の整数である。)
(In the formula, p is an integer of 1 to 10.)
DCP-Me2SiOSiMe2-DCP
DCP-Me2SiO(Me2SiO)SiMe2-DCP
DCP-Me2SiO(Me2SiO)4SiMe2-DCP
DCP-Me2SiO(Me2SiO)8SiMe2-DCP
DCP-Me2SiO(Me2SiO)12SiMe2-DCP
DCP-Me2Si-p-C6H4-SiMe2-DCP
DCP-Me2Si-m-C6H4-SiMe2-DCP
DCP-Me 2 SiOSiMe 2 -DCP
DCP-Me 2 SiO (Me 2 SiO) SiMe 2 -DCP
DCP-Me 2 SiO (Me 2 SiO) 4 SiMe 2 -DCP
DCP-Me 2 SiO (Me 2 SiO) 8 SiMe 2 -DCP
DCP-Me 2 SiO (Me 2 SiO) 12 SiMe 2 -DCP
DCP-Me 2 Si-p-C 6 H 4 -SiMe 2 -DCP
DCP-Me 2 Si-m- C 6 H 4 -SiMe 2 -DCP
(式中、pは1〜10の整数である。)
(In the formula, p is an integer of 1 to 10.)
(式中、pは1〜10の整数である。)
更に、本発明の(A)成分は、1種単独でも2種以上を組み合わせても使用することができる。
(In the formula, p is an integer of 1 to 10.)
Furthermore, the component (A) of the present invention can be used singly or in combination of two or more.
[(B)成分]
本発明の(B)成分は、SiHを1分子中に3個以上有する化合物である。該(B)成分中のSiHが、上記(A)成分が1分子中に少なくとも2個有する付加反応性炭素−炭素二重結合とヒドロシリル化反応により付加して、3次元網状構造の硬化物を与える。
該(B)成分としては、例えば、下記一般式(7):
[Component (B)]
The component (B) of the present invention is a compound having 3 or more SiH molecules in one molecule. SiH in the component (B) is added by an addition reactive carbon-carbon double bond and at least two of the component (A) in one molecule and a hydrosilylation reaction to form a cured product having a three-dimensional network structure. give.
Examples of the component (B) include the following general formula (7):
(式中、R1は独立に水素原子またはアルケニル基以外の非置換もしくは置換の炭素原子数1〜12、好ましくは1〜6の一価炭化水素基であり、qは3〜10、好ましくは3〜8の整数、rは0〜7、好ましくは0〜2の整数であり、かつq+rの和は3〜10、好ましくは3〜6の整数である)
で表される環状シロキサン系化合物が挙げられる。
(In the formula, R 1 is independently a monovalent hydrocarbon group having 1 to 12, preferably 1 to 6 carbon atoms that are unsubstituted or substituted other than a hydrogen atom or an alkenyl group, and q is 3 to 10, preferably An integer of 3-8, r is an integer of 0-7, preferably 0-2, and the sum of q + r is an integer of 3-10, preferably 3-6)
The cyclic siloxane type compound represented by these is mentioned.
上記一般式(7)中のR1がアルケニル基以外の非置換もしくは置換の一価炭化水素基である場合としては、例えば、メチル基、エチル、プロピル基、イソプロピル基、ブチル基、tert-ブチル基、ペンチル基、イソペンチル基、ヘキシル基、sec-ヘキシル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;フェニル基、o-,m-,p-トリル等のアリール基;ベンジル基、2-フェニルエチル基等のアラルキル基;p-ビニルフェニル基等のアルケニルアリール基;およびこれらの基中の炭素原子に結合した1個以上の水素原子が、ハロゲン原子、シアノ基、エポキシ環含有基等で置換された、例えば、クロロメチル基、3-クロロプロピル基、3,3,3-トリフルオロプロピル基等のハロゲン化アルキル基;2-シアノエチル基;3-グリシドキシプロピル基等が挙げられる。 Examples of the case where R 1 in the general formula (7) is an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group include, for example, methyl group, ethyl, propyl group, isopropyl group, butyl group, tert-butyl Group, alkyl group such as pentyl group, isopentyl group, hexyl group, sec-hexyl group; cycloalkyl group such as cyclopentyl group, cyclohexyl group; aryl group such as phenyl group, o-, m-, p-tolyl; benzyl group An aralkyl group such as 2-phenylethyl group; an alkenylaryl group such as p-vinylphenyl group; and one or more hydrogen atoms bonded to carbon atoms in these groups contain a halogen atom, a cyano group or an epoxy ring Substituted with, for example, a halogenated alkyl group such as chloromethyl group, 3-chloropropyl group, 3,3,3-trifluoropropyl group; 2-cyanoethyl group; Sid hydroxypropyl group and the like.
上記の中でも、前記R1としては、特に、その全てがメチル基であるものが、工業的に製造することが容易であり、入手しやすいことから好ましい。 Among these, as R 1 , those in which all of them are methyl groups are particularly preferable because they are easy to produce industrially and are easily available.
また、該(B)成分としては、例えば、上記ビニルノルボルネンの一種または二種と 1,3,5,7-テトラメチルシクロテトラシロキサンとをヒドロシリル化反応させて得られるSiHを1分子中に3個以上有する付加反応生成物、例えば、下記一般式(8): In addition, as the component (B), for example, SiH obtained by hydrosilylation reaction of one or two kinds of vinyl norbornene and 1,3,5,7-tetramethylcyclotetrasiloxane may be added in 3 molecules in one molecule. Addition reaction product having at least one, for example, the following general formula (8):
(式中、sは1〜100、好ましくは1〜10の整数である)
で表される化合物が挙げられる。
(Wherein s is an integer of 1 to 100, preferably 1 to 10)
The compound represented by these is mentioned.
上記(B)成分の好適な具体例を、以下に示すが、これに限定されるものではない。
(HMeSiO)3
(HMeSiO)4
(HMeSiO)3(Me2SiO)
(HMeSiO)4(Me2SiO)
Although the preferable example of the said (B) component is shown below, it is not limited to this.
(HMeSiO) 3
(HMeSiO) 4
(HMeSiO) 3 (Me 2 SiO)
(HMeSiO) 4 (Me 2 SiO)
本発明の(B)成分は、1種単独でも2種以上を組み合わせても使用することができる。
The component (B) of the present invention can be used singly or in combination of two or more.
(B)成分の配合量は、次のように設定されることが好ましい。後述するように、本発明の組成物は、(B)成分以外のケイ素原子に結合した水素原子を有する成分、および/または(A)成分以外のケイ素原子に結合した付加反応性炭素−炭素二重結合を有する成分を含有することができる。そこで、本組成物中のケイ素原子に結合した付加反応性炭素−炭素二重結合1モルに対して本組成物中のケイ素原子に結合した水素原子の量は、通常0.5〜2.0モル、好ましくは0.8〜1.5モルである。そして、本組成物中のケイ素原子に結合した水素原子に占める前記(B)成分中のケイ素原子に結合した水素原子の割合は、通常、20〜100モル%、好ましくは40〜100モル%である。また、本組成物中のケイ素原子に結合した付加反応性炭素−炭素二重結合に占める前記(A)成分中の付加反応性炭素−炭素二重結合の割合は、通常、20〜100モル%、好ましくは40〜100モル%である。(B)成分の配合量がこのような条件を満たすようになされると、コーティング材料等の用途に適用する場合に十分な硬度を有する硬化物を得ることができる。
上述の任意的成分を含まない場合には、本発明組成物への(B)成分の配合量は、上記(A)成分中の付加反応性炭素−炭素二重結合1モルに対して、該(B)成分中のSiHが、通常、0.5〜2.0モル、好ましくは 0.8〜1.5モルとなる量とするのがよい。
The blending amount of component (B) is preferably set as follows. As will be described later, the composition of the present invention comprises a component having a hydrogen atom bonded to a silicon atom other than the component (B) and / or an addition-reactive carbon-carbon bond bonded to a silicon atom other than the component (A). A component having a heavy bond can be contained. Therefore, the amount of hydrogen atoms bonded to silicon atoms in the composition relative to 1 mol of addition reactive carbon-carbon double bonds bonded to silicon atoms in the composition is usually 0.5 to 2.0 mol, preferably 0.8 to 1.5 moles. And the ratio of the hydrogen atom couple | bonded with the silicon atom in the said (B) component which occupies for the hydrogen atom couple | bonded with the silicon atom in this composition is 20-100 mol% normally, Preferably it is 40-100 mol%. is there. Moreover, the ratio of the addition-reactive carbon-carbon double bond in the component (A) in the addition-reactive carbon-carbon double bond bonded to the silicon atom in the composition is usually 20 to 100 mol%. , Preferably it is 40-100 mol%. When the blending amount of the component (B) satisfies such conditions, a cured product having sufficient hardness can be obtained when applied to applications such as coating materials.
When the above-mentioned optional components are not included, the blending amount of the component (B) in the composition of the present invention is the amount of the addition reactive carbon-carbon double bond in 1 mol of the component (A). The amount of SiH in the component (B) is usually 0.5 to 2.0 mol, preferably 0.8 to 1.5 mol.
[(C)成分]
本発明の(C)成分であるヒドロシリル化反応触媒は、上記「(A)成分の調製」で記載したものと同じである。
本発明組成物への(C)成分の配合量は、触媒としての有効量であればよく、特に制限されないが、上記(A)成分と(B)成分との合計質量に対して、白金族金属原子として、通常、1〜500 ppm、特に2〜100 ppm程度となる量を配合することが好ましい。前記範囲内の配合量とすることで、硬化反応に要する時間が適度のものとなり、硬化物が着色する等の問題を生じることがない。
[Component (C)]
The hydrosilylation reaction catalyst which is the component (C) of the present invention is the same as that described in the above “Preparation of the component (A)”.
The compounding amount of the component (C) in the composition of the present invention is not particularly limited as long as it is an effective amount as a catalyst, but the platinum group is based on the total mass of the component (A) and the component (B). As a metal atom, it is preferable to mix | blend normally the quantity used as 1-500 ppm, especially about 2-100 ppm. By setting the blending amount within the above range, the time required for the curing reaction becomes appropriate, and problems such as coloring of the cured product do not occur.
[他の配合成分]
本発明組成物には、上記(A)〜(C)成分に加えて、本発明の目的・効果を損なわない範囲で他の成分を配合することは任意である。
[Other ingredients]
In addition to the above components (A) to (C), it is optional to add other components to the composition of the present invention within a range that does not impair the objects and effects of the present invention.
<酸化防止剤>
本発明の硬化性樹脂組成物の硬化物中には、上記(A)成分中の付加反応性炭素−炭素二重結合が未反応のまま残存している場合があり、或いは、
下記構造式(i):
<Antioxidant>
In the cured product of the curable resin composition of the present invention, the addition-reactive carbon-carbon double bond in the component (A) may remain unreacted, or
The following structural formula (i):
で表される 2-(ビシクロ[2.2.1]ヘプト-2-エン-5-イル)エチル基および/または
下記構造式(ii):
2- (bicyclo [2.2.1] hept-2-en-5-yl) ethyl group and / or the following structural formula (ii):
(ii)
で表される 2-(ビシクロ[2.2.1]ヘプト-2-エン-6-イル)エチル基の開環メタセシス反応により生じる炭素−炭素二重結合が含まれている場合がある。そして、前記炭素−炭素二重結合が含まれていると、大気中の酸素により酸化され前記硬化物が着色する原因となる。
そこで、本発明組成物に、必要に応じ、酸化防止剤を配合することにより前記着色を未然に防止することができる。
(ii)
It may contain a carbon-carbon double bond generated by a ring-opening metathesis reaction of 2- (bicyclo [2.2.1] hept-2-en-6-yl) ethyl group represented by And when the said carbon-carbon double bond is contained, it will be oxidized by oxygen in air | atmosphere and will cause the said hardened | cured material to color.
Then, the said coloring can be prevented beforehand by mix | blending antioxidant with this invention composition as needed.
この酸化防止剤としては、従来から公知のものが全て使用することができ、例えば、2,6-ジ-t-ブチル-4-メチルフェノール、2,5-ジ-t-アミルヒドロキノン、2,5-ジ-t-ブチルヒドロキノン、4,4'-ブチリデンビス(3-メチル-6-t-ブチルフェノール)、2,2'-メチレンビス(4-メチル-6-t-ブチルフェノール)、2,2'-メチレンビス(4-エチル-6-t-ブチルフェノール)等が挙げられる。これらは、1種単独でも2種以上を組み合わせても使用することができる。 As the antioxidant, all conventionally known antioxidants can be used. For example, 2,6-di-t-butyl-4-methylphenol, 2,5-di-t-amylhydroquinone, 2, 5-di-t-butylhydroquinone, 4,4'-butylidenebis (3-methyl-6-t-butylphenol), 2,2'-methylenebis (4-methyl-6-t-butylphenol), 2,2'- And methylenebis (4-ethyl-6-t-butylphenol). These can be used singly or in combination of two or more.
なお、この酸化防止剤を使用する場合、その配合量は、酸化防止剤としての有効量であればよく、特に制限されないが、上記(A)成分と(B)成分との合計質量に対して、通常、10〜10,000 ppm、特に 100〜1,000 ppm 程度配合することが好ましい。前記範囲内の配合量とすることによって、酸化防止能力が十分発揮され、着色、白濁、酸化劣化等の発生がなく光学的特性に優れた硬化物が得られる。 In addition, when using this antioxidant, the blending amount thereof is not particularly limited as long as it is an effective amount as an antioxidant, but with respect to the total mass of the component (A) and the component (B). Usually, it is preferable to add about 10 to 10,000 ppm, particularly about 100 to 1,000 ppm. By setting the blending amount within the above range, the antioxidant ability is sufficiently exhibited, and a cured product having excellent optical characteristics without coloration, white turbidity, oxidative deterioration and the like is obtained.
<粘度・硬度調整剤>
本発明組成物の粘度もしくは本発明組成物から得られる硬化物の硬度等を調整するために、ケイ素原子に結合したアルケニル基またはSiHを有する直鎖状ジオルガノポリシロキサンもしくは網状オルガノポリシロキサン;非反応性の(即ち、ケイ素原子に結合したアルケニル基およびSiHを有しない)直鎖状もしくは環状ジオルガノポリシロキサン、シルフェニレン系化合物等を配合してもよい。
<Viscosity / Hardness modifier>
In order to adjust the viscosity of the composition of the present invention or the hardness of the cured product obtained from the composition of the present invention, a linear diorganopolysiloxane or network organopolysiloxane having an alkenyl group or SiH bonded to a silicon atom; A reactive (that is, having no alkenyl group bonded to a silicon atom and SiH), a linear or cyclic diorganopolysiloxane, a silphenylene compound, and the like may be blended.
本発明組成物に、(D1)ケイ素原子に結合したアルケニル基を有する種々の構造のオルガノポリシロキサンを配合する場合、その配合量は、前記アルケニル基と上記(A)成分が有する付加反応性炭素−炭素二重結合との合計量1モルに対する、上記(B)成分中のSiHが、通常、0.5〜2.0モル、好ましくは 0.8〜1.5モルとなる量とするのがよい。また、(D2)SiHを有する種々の構造のオルガノポリシロキサンを配合する場合、その配合量は、前記SiHと上記(B)成分が有するSiHとの合計量が、上記(A)成分が有する付加反応性炭素−炭素二重結合1モルに対して、通常、0.5〜2.0モル、好ましくは 0.8〜1.5モルとなる量とするのがよい。 When the organopolysiloxane having various structures having an alkenyl group bonded to a silicon atom is blended with the composition of the present invention (D1), the blending amount is the addition reactive carbon of the alkenyl group and the component (A). -It is good to set it as the quantity from which SiH in the said (B) component is 0.5-2.0 mol normally with respect to 1 mol of total amounts with a carbon double bond, Preferably it is 0.8-1.5 mol. In addition, when (D2) SiH-containing organopolysiloxanes with various structures are blended, the blending amount is the total amount of the SiH and the SiH that the (B) component has, and the addition that the (A) component has The amount is usually 0.5 to 2.0 moles, preferably 0.8 to 1.5 moles per mole of reactive carbon-carbon double bond.
<その他>
また、ポットライフを確保するために、1-エチニルシクロヘキサノール、3,5-ジメチル-1-ヘキシン-3-オール等の付加反応制御剤を配合することができる。更に、透明性に影響を与えない範囲で、強度を向上させるためにヒュームドシリカ等の無機質充填剤を配合してもよいし、必要に応じて、染料、顔料、難燃剤等を配合してもよい。
<Others>
Moreover, in order to ensure pot life, an addition reaction control agent such as 1-ethynylcyclohexanol and 3,5-dimethyl-1-hexyn-3-ol can be blended. Furthermore, an inorganic filler such as fumed silica may be blended in order to improve the strength within a range that does not affect transparency, and if necessary, a dye, pigment, flame retardant, etc. may be blended. Also good.
更に、太陽光線、蛍光灯等の光エネルギーによる光劣化に抵抗性を付与するため光安定剤を用いることも可能である。この光安定剤としては、光酸化劣化で生成するラジカルを補足するヒンダードアミン系安定剤が適しており、酸化防止剤と併用することで、酸化防止効果はより向上する。光安定剤の具体例としては、ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート、4-ベンゾイル-2,2,6,6-テトラメチルピペリジン等が挙げられる。
また、本発明組成物を封止材料として用いる場合には、基材との接着性を向上させるためにシランカップリング剤を配合してもよいし、クラック防止のため可塑剤を添加してもよい。
なお、本発明組成物の硬化条件については、その量により異なり、特に制限されないが、通常、60〜180℃、5〜180分の条件とすることが好ましい。
Furthermore, it is also possible to use a light stabilizer in order to impart resistance to light degradation caused by light energy such as sunlight and fluorescent lamps. As this light stabilizer, a hindered amine stabilizer that captures radicals generated by photooxidation degradation is suitable, and the antioxidant effect is further improved by using it together with the antioxidant. Specific examples of the light stabilizer include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, 4-benzoyl-2,2,6,6-tetramethylpiperidine and the like.
Moreover, when using this invention composition as a sealing material, in order to improve adhesiveness with a base material, you may mix | blend a silane coupling agent and may add a plasticizer for crack prevention. Good.
In addition, about the hardening conditions of this invention composition, it changes with the quantity, Although it does not restrict | limit in particular, Usually, it is preferable to set it as 60-180 degreeC and the conditions for 5 to 180 minutes.
以下、実施例および比較例を示し、本発明を具体的に説明するが、本発明は下記の実施例に制限されるものではない。 EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.
[合成例1](A)成分の調製
攪拌装置、冷却管、滴下ロートおよび温度計を備えた 500mLの4つ口フラスコに、ビニルノルボルネン(商品名:V0062、東京化成社製;5-ビニルビシクロ[2.2.1]ヘプト-2-エンと 6-ビニルビシクロ[2.2.1]ヘプト-2-エンとの略等モル量の異性体混合物)156g(1.3モル)を加え、オイルバスを用いて 85℃に加熱した。これに、5質量%の白金金属を担持したカーボン粉末 0.05g添加し、攪拌しながら 1,1,3,3-テトラメチルジシロキサン 67g(0.5モル)を 60分間かけて滴下した。滴下終了後、更に 90℃で加熱攪拌を 24時間行った後、室温まで冷却した。その後、白金金属担持カーボンをろ過して除去し、過剰のビニルノルボルネンを減圧留去して、無色透明なオイル状の反応生成物(25℃における粘度:110 mm2/s)170gを得た。
[Synthesis Example 1] Preparation of Component (A) Into a 500 mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd .; 5-vinylbicyclo) 156 g (1.3 mol) of [2.2.1] hept-2-ene and 6-vinylbicyclo [2.2.1] hept-2-ene in an approximately equimolar amount of an isomer mixture), and using an oil bath. Heated to ° C. To this, 0.05 g of carbon powder supporting 5 mass% platinum metal was added, and 67 g (0.5 mol) of 1,1,3,3-tetramethyldisiloxane was added dropwise over 60 minutes with stirring. After completion of dropping, the mixture was further stirred at 90 ° C. for 24 hours, and then cooled to room temperature. Thereafter, platinum metal-supported carbon was removed by filtration, and excess vinylnorbornene was distilled off under reduced pressure to obtain 170 g of a colorless and transparent oily reaction product (viscosity at 25 ° C .: 110 mm 2 / s).
反応生成物を、FT-IR、NMR、GPC等により分析した結果、このものは、
(1) -Si-O-Si-結合を1個有する化合物:NBMe2SiOSiMe2NB 約 70モル%、
(2) -Si-O-Si-結合を2個有する化合物:約 25モル%(下記に代表的な構造式の一例を示す)、
As a result of analyzing the reaction product by FT-IR, NMR, GPC, etc.,
(1) Compound having one -Si-O-Si- bond: NBMe 2 SiOSiMe 2 NB about 70 mol%,
(2) Compound having two -Si-O-Si- bonds: about 25 mol% (an example of a typical structural formula is shown below),
および、(3) -Si-O-Si-結合を3個有する化合物:約5モル%(下記に代表的な構造式の一例を示す)
And (3) a compound having three -Si-O-Si- bonds: about 5 mol% (an example of a typical structural formula is shown below)
の混合物であることが判明した。また、前記混合物全体としての付加反応性炭素−炭素二重結合の含有割合は、0.46モル/100gであった。
It was found to be a mixture of Moreover, the content rate of the addition reactive carbon-carbon double bond as the whole mixture was 0.46 mol / 100 g.
[合成例2](A)成分の調製
攪拌装置、冷却管、滴下ロートおよび温度計を備えた 500mLの4つ口フラスコに、ビニルノルボルネン(商品名:V0062、東京化成社製;5-ビニルビシクロ[2.2.1]ヘプト-2-エンと 6-ビニルビシクロ[2.2.1]ヘプト-2-エンとの略等モル量の異性体混合物)60g(0.5モル)を加え、オイルバスを用いて 85℃に加熱した。これに、5質量%の白金金属を担持したカーボン粉末 0.02g添加し、攪拌しながら 1,4-ビス(ジメチルシリル)ベンゼン 38.8g(0.2モル)を 25分間かけて滴下した。滴下終了後、更に 90℃で加熱攪拌を 24時間行った後、室温まで冷却した。その後、白金金属担持カーボンをろ過して除去し、過剰のビニルノルボルネンを減圧留去して、無色透明なオイル状の反応生成物(25℃における粘度:1220 mm2/s)79gを得た。
[Synthesis Example 2] Preparation of component (A) Into a 500 mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd .; 5-vinylbicyclo) 60 g (0.5 mol) of [2.2.1] hept-2-ene and 6-vinylbicyclo [2.2.1] hept-2-ene in approximately equimolar amount) Heated to ° C. To this, 0.02 g of carbon powder supporting 5% by mass of platinum metal was added, and 38.8 g (0.2 mol) of 1,4-bis (dimethylsilyl) benzene was added dropwise over 25 minutes while stirring. After completion of dropping, the mixture was further stirred at 90 ° C. for 24 hours, and then cooled to room temperature. Thereafter, platinum metal-supported carbon was removed by filtration, and excess vinylnorbornene was distilled off under reduced pressure to obtain 79 g of a colorless and transparent oily reaction product (viscosity at 25 ° C .: 1220 mm 2 / s).
反応生成物を、FT-IR、NMR、GPC等により分析した結果、このものは、
(1) p-フェニレン基を1個有する化合物:NBMe2Si-p-C6H4-SiMe2NB 約 72モル%、
(2) p-フェニレン基を2個有する化合物:約 24モル%(下記に代表的な構造式の一例を示す)、
As a result of analyzing the reaction product by FT-IR, NMR, GPC, etc.,
(1) Compound having one p-phenylene group: NBMe 2 Si—p—C 6 H 4 —SiMe 2 NB about 72 mol%,
(2) Compound having two p-phenylene groups: about 24 mol% (an example of a typical structural formula is shown below),
および、(3) p-フェニレン基を3個有する化合物:約4モル%(下記に代表的な構造式の一例を示す)
And (3) a compound having three p-phenylene groups: about 4 mol% (an example of a typical structural formula is shown below)
の混合物であることが判明した。また、前記混合物全体としての付加反応性炭素−炭素二重結合の含有割合は、0.40モル/100gであった。
It was found to be a mixture of Moreover, the content rate of the addition reactive carbon-carbon double bond as the whole mixture was 0.40 mol / 100 g.
[合成例3](B)成分の調製
攪拌装置、冷却管、滴下ロートおよび温度計を備えた 500mLの4つ口フラスコに、トルエン 80gおよび 1,3,5,7-テトラメチルシクロテトラシロキサン 115.2g(0.48モル)を加え、オイルバスを用いて 117℃に加熱した。これに、5質量%の白金金属を担持したカーボン粉末 0.05g添加し、攪拌しながらビニルノルボルネン(商品名:V0062、東京化成社製;5-ビニルビシクロ[2.2.1]ヘプト-2-エンと 6-ビニルビシクロ[2.2.1]ヘプト-2-エンとの略等モル量の異性体混合物)48g(0.4モル)を 16分間かけて滴下した。滴下終了後、更に 125℃で加熱攪拌を 16時間行った後、室温まで冷却した。その後、白金金属担持カーボンをろ過して除去し、トルエンを減圧留去して、無色透明なオイル状の反応生成物(25℃における粘度:2,500 mm2/s))152gを得た。
Synthesis Example 3 Preparation of Component (B) To a 500 mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, 80 g of toluene and 1,3,5,7-tetramethylcyclotetrasiloxane 115.2 g (0.48 mol) was added and heated to 117 ° C. using an oil bath. To this, 0.05 g of carbon powder supporting 5% by mass of platinum metal was added, and while stirring, vinyl norbornene (trade name: V0062, manufactured by Tokyo Chemical Industry Co., Ltd .; 5-vinylbicyclo [2.2.1] hept-2-ene and 48 g (0.4 mol) of an approximately equimolar amount of isomer mixture with 6-vinylbicyclo [2.2.1] hept-2-ene was added dropwise over 16 minutes. After completion of dropping, the mixture was further stirred with heating at 125 ° C. for 16 hours, and then cooled to room temperature. Thereafter, platinum metal-supported carbon was removed by filtration, and toluene was distilled off under reduced pressure to obtain 152 g of a colorless and transparent oily reaction product (viscosity at 25 ° C .: 2,500 mm 2 / s).
反応生成物を、FT-IR、NMR、GPC等により分析した結果、このものは、
(1) テトラメチルシクロテトラシロキサン環を1個有する化合物:約6モル%(下記に代表的な構造式の一例を示す)、
As a result of analyzing the reaction product by FT-IR, NMR, GPC, etc.,
(1) Compound having one tetramethylcyclotetrasiloxane ring: about 6 mol% (an example of a typical structural formula is shown below),
(2) テトラメチルシクロテトラシロキサン環を2個有する化合物:約 25モル%(下記に代表的な構造式の一例を示す)、
(2) Compound having two tetramethylcyclotetrasiloxane rings: about 25 mol% (an example of a typical structural formula is shown below),
(3) テトラメチルシクロテトラシロキサン環を3個有する化合物:約 16モル%(下記に代表的な構造式の一例を示す)
(3) Compound having three tetramethylcyclotetrasiloxane rings: about 16 mol% (an example of a typical structural formula is shown below)
(4) テトラメチルシクロテトラシロキサン環を4個有する:約 11モル%(下記に代表的な構造式の一例を示す)、
(4) having four tetramethylcyclotetrasiloxane rings: about 11 mol% (an example of a typical structural formula is shown below),
および、(5) テトラメチルシクロテトラシロキサン環を5〜12個有する化合物:残余(下記に代表的な構造式の一例を示す)
And (5) a compound having 5 to 12 tetramethylcyclotetrasiloxane rings: the remainder (an example of a typical structural formula is shown below)
(式中、nは4〜11の整数である。)
の混合物であることが判明した。なお、前記混合物全体としてのSiHの含有割合は、0.63モル/100gであった。
(In the formula, n is an integer of 4 to 11.)
It was found to be a mixture of In addition, the content rate of SiH as the said mixture whole was 0.63 mol / 100g.
[実施例1]
(A1) 合成例1で得られた反応生成物:5質量部、(A2) 合成例2で得られた反応生成物:60質量部、
(B1) (MeHSiO)4:5質量部、(B2) 合成例3で得られた反応生成物:30質量部(なお、前記(B1)と(B2)成分中の合計のSiH/前記(A1)と(A2)成分中の合計の炭素−炭素二重結合(モル比)=1.03。以下、前記と同様にして、SiH/炭素−炭素二重結合のモル比を「SiH/C=C(モル比)」と記載する。)
(C) 白金-ビニルシロキサン錯体:白金金属原子として(A1)、(A2)、(B1)および(B2)の合計質量に対して 20 ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。この組成物を、ガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で2時間加熱して硬化物を得た。
[Example 1]
(A1) Reaction product obtained in Synthesis Example 1: 5 parts by mass, (A2) Reaction product obtained in Synthesis Example 2: 60 parts by mass,
(B1) (MeHSIO) 4 : 5 parts by mass, (B2) Reaction product obtained in Synthesis Example 3: 30 parts by mass (Note that the total SiH in the components (B1) and (B2) / (A1 ) And the total carbon-carbon double bond (molar ratio) in the component (A2) = 1.03 Hereinafter, in the same manner as described above, the molar ratio of SiH / carbon-carbon double bond is “SiH / C = C ( Molar ratio) ”.)
(C) platinum-vinylsiloxane complex: an amount of 20 ppm relative to the total mass of (A1), (A2), (B1) and (B2) as a platinum metal atom, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition. This composition was poured into a mold made of glass plates to a thickness of 4 mm and heated at 150 ° C. for 2 hours to obtain a cured product.
[実施例2]
(A2) 合成例2で得られた反応生成物:81質量部、
(B1) (MeHSiO)4:19質量部(SiH/C=C(モル比)=0.98)、
(C) 白金-ビニルシロキサン錯体:白金金属原子として(A2)および(B1)の合計質量に対して20 ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。この組成物を、ガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で2時間加熱して硬化物を得た。
[Example 2]
(A2) Reaction product obtained in Synthesis Example 2: 81 parts by mass
(B1) (MeHSIO) 4 : 19 parts by mass (SiH / C = C (molar ratio) = 0.98)
(C) platinum-vinylsiloxane complex: an amount of 20 ppm relative to the total mass of (A2) and (B1) as platinum metal atoms, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition. This composition was poured into a mold made of glass plates to a thickness of 4 mm and heated at 150 ° C. for 2 hours to obtain a cured product.
[参考例1]
(A1) 合成例1で得られた反応生成物:58質量部、
(B2) 合成例3で得られた反応生成物:42質量部(SiH/C=C(モル比)=0.99)
(C) 白金-ビニルシロキサン錯体:白金金属原子として(A1)および(B2)の合計質量に対して20 ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。この組成物を、ガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で2時間加熱して硬化物を得た。
[ Reference Example 1 ]
(A1) Reaction product obtained in Synthesis Example 1: 58 parts by mass
(B2) Reaction product obtained in Synthesis Example 3: 42 parts by mass (SiH / C = C (molar ratio) = 0.99)
(C) platinum-vinylsiloxane complex: an amount of 20 ppm relative to the total mass of (A1) and (B2) as platinum metal atoms, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition. This composition was poured into a mold made of glass plates to a thickness of 4 mm and heated at 150 ° C. for 2 hours to obtain a cured product.
[実施例3]
(A2) 合成例2で得られた反応生成物:61質量部、
(B2) 合成例3で得られた反応生成物:39質量部(SiH/C=C(モル比)=1.00)
(C) 白金-ビニルシロキサン錯体:白金金属原子として(A2)および(B2)の合計質量に対して20 ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。この組成物を、ガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で2時間加熱して硬化物を得た。
[Example 3 ]
(A2) Reaction product obtained in Synthesis Example 2: 61 parts by mass
(B2) Reaction product obtained in Synthesis Example 3: 39 parts by mass (SiH / C = C (molar ratio) = 1.00)
(C) platinum-vinylsiloxane complex: an amount of 20 ppm relative to the total mass of (A2) and (B2) as platinum metal atoms, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition. This composition was poured into a mold made of glass plates to a thickness of 4 mm and heated at 150 ° C. for 2 hours to obtain a cured product.
[実施例4]
(A1) 合成例1で得られた反応生成物:10質量部、(A2) 合成例2で得られた反応生成物:55質量部、
(B1) (MeHSiO)4:5質量部、(B2) 合成例3で得られた反応生成物:30質量部(SiH/C=C(モル比)=1.02)
(C) 白金-ビニルシロキサン錯体:白金金属原子として(A1)、(A2)、(B1)および(B2)の合計質量に対して20 ppmとなる量、並びに
1-エチニルシクロヘキサノール:0.03質量部
を均一に混合して組成物を得た。この組成物を、ガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で2時間加熱して硬化物を得た。
[Example 4 ]
(A1) Reaction product obtained in Synthesis Example 1: 10 parts by mass, (A2) Reaction product obtained in Synthesis Example 2: 55 parts by mass,
(B1) (MeHSIO) 4 : 5 parts by mass, (B2) Reaction product obtained in Synthesis Example 3: 30 parts by mass (SiH / C = C (molar ratio) = 1.02)
(C) platinum-vinylsiloxane complex: an amount of 20 ppm relative to the total mass of (A1), (A2), (B1) and (B2) as a platinum metal atom, and
1-Ethynylcyclohexanol: 0.03 part by mass was uniformly mixed to obtain a composition. This composition was poured into a mold made of glass plates to a thickness of 4 mm and heated at 150 ° C. for 2 hours to obtain a cured product.
[比較例1]
上記実施例1に記載の(A1)成分および(A2)成分に代えて、(A')(ViMeSiO)4(前記Viはビニル基である)を 59質量部用いること、並びに、(B1)成分の(MeHSiO)4の使用量5質量部を 41質量部に変更すること、および(B2)成分を使用しないこと(なお、SiH/Vi(モル比)=1.0)以外は、実施例1と同じにして組成物および硬化物を得た。
[Comparative Example 1]
In place of the components (A1) and (A2) described in Example 1, 59 parts by mass of (A ′) (ViMeSiO) 4 (wherein Vi is a vinyl group), and component (B1) The same amount as in Example 1 except that 5 parts by mass of (MeHSIO) 4 is changed to 41 parts by mass and the component (B2) is not used (SiH / Vi (molar ratio) = 1.0). Thus, a composition and a cured product were obtained.
[比較例2]
フェニルシリコーンレジン系硬化性組成物(商品名:X-34-1195、信越化学工業社製、フェニル基含有量:約50モル%)を、実施例1と同様にガラス板で組んだ型の中に4mm厚になるように流し込み、150℃で8時間加熱して硬化物を得た。
[Comparative Example 2]
In a mold in which a phenyl silicone resin curable composition (trade name: X-34-1195, manufactured by Shin-Etsu Chemical Co., Ltd., phenyl group content: about 50 mol%) is assembled with a glass plate in the same manner as in Example 1. The resulting product was poured to a thickness of 4 mm and heated at 150 ° C. for 8 hours to obtain a cured product.
<性能評価手法>
(1)上記各実施例、参考例および比較例で得られた硬化物について、下記手法に従い、性能を評価した。
−外観−
各硬化物の外観を目視により観察した。観察結果を表1に示す。
−硬度−
ASTM D 2240 に準じて、各硬化物の硬度(Shore D)を測定した。測定結果を表1に示す。
−弾性率−
4mm厚の各硬化物から、10mm(幅)×100mm(長さ)の試験片を作製し、JIS K-6911 に準じて、3点曲げ試験により、弾性率(MPa)を測定した。測定結果を表1に示す。
<Performance evaluation method>
(1) The performance of the cured products obtained in the above Examples , Reference Examples and Comparative Examples was evaluated according to the following method.
-Appearance-
The appearance of each cured product was visually observed. The observation results are shown in Table 1.
-Hardness-
The hardness (Shore D) of each cured product was measured according to ASTM D 2240. The measurement results are shown in Table 1.
-Elastic modulus-
A test piece of 10 mm (width) × 100 mm (length) was produced from each cured product of 4 mm thickness, and the elastic modulus (MPa) was measured by a three-point bending test according to JIS K-6911. The measurement results are shown in Table 1.
(2)収縮率の測定
上記各実施例、参考例および比較例1で得られた樹脂組成物(比較例2については、上記フェニルシリコーンレジン系硬化性組成物)を、4mm×10mm×100mmの金型に流し込み、150℃で2時間加熱して硬化させ、冷却した後に硬化物を取り出した。
硬化に際する収縮率を下式によって求めた。測定結果を表1に示す。
収縮率(%)=(硬化物の長さ/金型部の長さ)×100
(2) Measurement of shrinkage rate The resin composition obtained in each of the above Examples , Reference Examples and Comparative Example 1 (for Comparative Example 2, the phenyl silicone resin-based curable composition) was 4 mm × 10 mm × 100 mm. It was poured into a mold and heated at 150 ° C. for 2 hours to be cured. After cooling, the cured product was taken out.
The shrinkage rate upon curing was determined by the following formula. The measurement results are shown in Table 1.
Shrinkage rate (%) = (length of cured product / length of mold part) x 100
(3)光透過率
各硬化物の光透過率を分光光度計を用いて、測定波長:800、600、400nm、および 300nm(紫外線領域)の4点について測定した。測定結果を表2に示す。
(3) Light transmittance The light transmittance of each cured product was measured using a spectrophotometer at four measurement wavelengths: 800, 600, 400 nm, and 300 nm (ultraviolet region). The measurement results are shown in Table 2.
[評価]
比較例のものと対比するに、実施例の硬化物は、いずれも、硬度および弾性率に優れ、かつ、硬化収縮が非常に小さい。また、特に 300nm(紫外線領域)の短波長における光透過率においても優れていることが分かる。
[Evaluation]
In contrast to the comparative example, all of the cured products of the examples are excellent in hardness and elastic modulus and have very small curing shrinkage. It can also be seen that the light transmittance is particularly excellent at a short wavelength of 300 nm (ultraviolet region).
Claims (8)
[式中、Aは下記構造式(3):
で表される2価の基であり、
Rは独立に非置換のもしくはハロゲン原子、シアノ基もしくはグリシドキシ基で置換された炭素原子数1〜12の1価炭化水素基または炭素原子数1〜6アルコキシ基である]
で表されるケイ素原子に結合した水素原子を1分子中に2個有する化合物と、
(b)付加反応性炭素−炭素二重結合を1分子中に2個有する多環式炭化水素との付加反応生成物であって、かつ、付加反応性炭素−炭素二重結合を1分子中に2〜6個有する付加反応生成物、
(B)ケイ素原子に結合した水素原子を1分子中に3個以上有する化合物、および
(C)ヒドロシリル化反応触媒
を含む硬化性組成物。 (A) (a) The following general formula (1):
[In the formula, A is under Symbol structural formula (3):
In a divalent group which Ru represented,
R are independently unsubstituted or halogen atom, a monovalent hydrocarbon group or a C 1 -C 6 alkoxy group which has been C1-12 cyano group or a glycidoxy group]
A compound having two hydrogen atoms bonded to a silicon atom represented by
(b) An addition reaction product with a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, and the addition-reactive carbon-carbon double bond in one molecule 2 to 6 addition reaction products
(B) a compound having three or more hydrogen atoms bonded to a silicon atom in one molecule, and
(C) A curable composition containing a hydrosilylation reaction catalyst.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004252689A JP4520251B2 (en) | 2003-10-10 | 2004-08-31 | Curable composition |
KR1020050029233A KR101135801B1 (en) | 2004-08-31 | 2005-04-08 | Curable Compositions |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003352714 | 2003-10-10 | ||
JP2004252689A JP4520251B2 (en) | 2003-10-10 | 2004-08-31 | Curable composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005133073A JP2005133073A (en) | 2005-05-26 |
JP4520251B2 true JP4520251B2 (en) | 2010-08-04 |
Family
ID=34656131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004252689A Expired - Lifetime JP4520251B2 (en) | 2003-10-10 | 2004-08-31 | Curable composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4520251B2 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4520248B2 (en) * | 2004-08-27 | 2010-08-04 | 信越化学工業株式会社 | Curable silicone resin composition |
JP2007077252A (en) * | 2005-09-13 | 2007-03-29 | Shin Etsu Chem Co Ltd | Curable silicone composition |
JP4509080B2 (en) * | 2006-09-28 | 2010-07-21 | 信越化学工業株式会社 | Silsesquioxane compound mixture, hydrolyzable silane compound, production method thereof, resist composition using the same, pattern formation method, and substrate processing method |
KR101186779B1 (en) * | 2007-04-17 | 2012-09-27 | 아사히 가세이 케미칼즈 가부시키가이샤 | Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof |
JP5248034B2 (en) * | 2007-04-23 | 2013-07-31 | 株式会社Adeka | Silicon-containing compound, curable composition, and cured product |
JP5248032B2 (en) * | 2007-04-23 | 2013-07-31 | 株式会社Adeka | Silicon-containing compound, curable composition, and cured product |
JP5248033B2 (en) | 2007-04-23 | 2013-07-31 | 株式会社Adeka | Silicon-containing compound, curable composition, and cured product |
JP2008274184A (en) * | 2007-05-07 | 2008-11-13 | Shin Etsu Chem Co Ltd | Organosilicon compound containing polycyclic hydrocarbon group having hydrogen atom combined with silicon atom, and method for manufacturing the same |
JP5279197B2 (en) * | 2007-05-07 | 2013-09-04 | 信越化学工業株式会社 | Curable organosilicon composition and cured product thereof |
JP2009024116A (en) * | 2007-07-23 | 2009-02-05 | Sony Corp | Curable resin material-fine particle composite material, producing method thereof, optical material and light emitting device |
JP5540466B2 (en) * | 2008-01-19 | 2014-07-02 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
JP5552243B2 (en) * | 2009-02-26 | 2014-07-16 | 日東電工株式会社 | Metal oxide fine particles |
JP5404103B2 (en) * | 2009-03-05 | 2014-01-29 | 信越化学工業株式会社 | Curable silicone composition, cured silicone resin and light reflecting material |
JP2011225654A (en) * | 2010-04-16 | 2011-11-10 | Nippon Kayaku Co Ltd | Diolefin resin, epoxy resin, and composition for the same |
JP2012046604A (en) * | 2010-08-26 | 2012-03-08 | Shin-Etsu Chemical Co Ltd | Curable silicone-based composition containing polycyclic hydrocarbon skeleton component |
JP5931503B2 (en) * | 2012-02-27 | 2016-06-08 | 信越化学工業株式会社 | White thermosetting silicone composition and light reflecting material for white light-emitting diode comprising cured product of the composition |
TWI629307B (en) | 2013-09-20 | 2018-07-11 | 日商信越化學工業股份有限公司 | Polyoxymethylene modified epoxy resin and its composition and hardened material |
JP5796916B2 (en) * | 2014-06-18 | 2015-10-21 | 日本化薬株式会社 | Production method of epoxy resin |
JP6347237B2 (en) | 2015-08-21 | 2018-06-27 | 信越化学工業株式会社 | Addition-curing organopolysiloxane composition and semiconductor device |
JP6428595B2 (en) | 2015-12-22 | 2018-11-28 | 信越化学工業株式会社 | Addition-curable resin composition and semiconductor device |
US9751989B2 (en) | 2015-12-22 | 2017-09-05 | Shin-Etsu Chemical Co., Ltd. | Condensation curable resin composition and semiconductor package |
JP6941455B2 (en) * | 2016-04-21 | 2021-09-29 | 旭化成株式会社 | Curable composition |
JP6672991B2 (en) | 2016-04-25 | 2020-03-25 | 信越化学工業株式会社 | Condensation curable resin composition and semiconductor device |
JP7043165B2 (en) * | 2016-09-16 | 2022-03-29 | 旭化成株式会社 | Curable composition |
JP2018044125A (en) * | 2016-09-16 | 2018-03-22 | 旭化成株式会社 | Curable composition |
JP6867203B2 (en) * | 2017-03-17 | 2021-04-28 | 旭化成株式会社 | Curable composition |
JP6784637B2 (en) | 2017-04-13 | 2020-11-11 | 信越化学工業株式会社 | Curable resin composition |
US10385210B2 (en) * | 2017-06-20 | 2019-08-20 | Momentive Performance Materials Inc. | Curable silicone composition and applications and uses thereof |
JP6915405B2 (en) | 2017-06-29 | 2021-08-04 | 信越化学工業株式会社 | Poly (meth) acrylate and coating compositions and coating articles containing it |
JP6911741B2 (en) | 2017-12-19 | 2021-07-28 | 信越化学工業株式会社 | UV curable resin composition, adhesive and cured product |
KR102623289B1 (en) * | 2018-01-31 | 2024-01-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Infrared-transmitting curable composition, cured product thereof and optical semiconductor device |
JP6981933B2 (en) | 2018-08-15 | 2021-12-17 | 信越化学工業株式会社 | A curable composition, a cured product of the composition, and a semiconductor device using the cured product. |
JP6977698B2 (en) * | 2018-10-22 | 2021-12-08 | 信越化学工業株式会社 | (Meta) acrylate compound, coating composition containing it and coated article |
JP7088879B2 (en) * | 2019-05-24 | 2022-06-21 | 信越化学工業株式会社 | Additive-curable silicone compositions, cured products and opto-semiconductor devices |
WO2023032724A1 (en) * | 2021-08-30 | 2023-03-09 | 信越化学工業株式会社 | Low dielectric constant insulating coating composition, cured product of same and display device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07503991A (en) * | 1992-02-24 | 1995-04-27 | ユニヴァーシティ オブ サザン カリフォルニア | Crosslinkable carbosilane polymer formulations |
JP2002317048A (en) * | 2001-02-14 | 2002-10-31 | Kanegafuchi Chem Ind Co Ltd | Curing agent, curable composition, composition for optical material, optical material, method for producing the optical material and liquid crystal display and led made by using the optical material |
JP2002327114A (en) * | 2001-02-23 | 2002-11-15 | Kanegafuchi Chem Ind Co Ltd | Composition for optical material, optical material, method for producing the same, and liquid crystal display and light-emitting diode each using the optical material |
JP2002341101A (en) * | 2001-02-23 | 2002-11-27 | Kanegafuchi Chem Ind Co Ltd | Composition for optical material, optical material, method for producing the same and liquid crystal display and light emitting diode each using the same |
JP2003147079A (en) * | 2001-11-19 | 2003-05-21 | Kanegafuchi Chem Ind Co Ltd | Curable composition, curable composition for optical material, optical material, method for producing optical material and light-emitting diode by using optical material |
JP2005015666A (en) * | 2003-06-27 | 2005-01-20 | Shin Etsu Chem Co Ltd | Curable silicone resin composition |
JP2005089671A (en) * | 2003-09-19 | 2005-04-07 | Shin Etsu Chem Co Ltd | Curable silicone resin composition |
JP2005089733A (en) * | 2003-08-14 | 2005-04-07 | Shin Etsu Chem Co Ltd | Curable silicone resin composition |
JP2005232463A (en) * | 2001-02-23 | 2005-09-02 | Kaneka Corp | Composition for optical material, optical material, method for producing the same and liquid crystal display device using the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62207334A (en) * | 1986-03-08 | 1987-09-11 | Nippon Petrochem Co Ltd | Silicon carbide polymer |
JPH0655818B2 (en) * | 1986-08-27 | 1994-07-27 | ハーキュリーズ・インコーポレイテツド | Method for producing organosilicon polymer |
US5242979A (en) * | 1990-10-05 | 1993-09-07 | Hercules Incorporated | Organosilicon compositions containing hydrocarbon elastomers |
US5147945A (en) * | 1990-12-31 | 1992-09-15 | Hercules Incorporated | Organosilicon polymers and prepolymers comprising a coupling monomer |
US5196498A (en) * | 1991-09-24 | 1993-03-23 | Hercules Incorporated | Organosilicon polymers |
US5523374A (en) * | 1992-12-03 | 1996-06-04 | Hercules Incorporated | Curable and cured organosilicon compositions |
US5408026A (en) * | 1993-08-23 | 1995-04-18 | Cowan; Patrick J. | Curable and cured organosilicon compositions, and process for making same |
JP3537204B2 (en) * | 1993-12-28 | 2004-06-14 | 鐘淵化学工業株式会社 | Reactive silicon-based polymer and curable composition using the same |
-
2004
- 2004-08-31 JP JP2004252689A patent/JP4520251B2/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07503991A (en) * | 1992-02-24 | 1995-04-27 | ユニヴァーシティ オブ サザン カリフォルニア | Crosslinkable carbosilane polymer formulations |
JP2002317048A (en) * | 2001-02-14 | 2002-10-31 | Kanegafuchi Chem Ind Co Ltd | Curing agent, curable composition, composition for optical material, optical material, method for producing the optical material and liquid crystal display and led made by using the optical material |
JP2002327114A (en) * | 2001-02-23 | 2002-11-15 | Kanegafuchi Chem Ind Co Ltd | Composition for optical material, optical material, method for producing the same, and liquid crystal display and light-emitting diode each using the optical material |
JP2002341101A (en) * | 2001-02-23 | 2002-11-27 | Kanegafuchi Chem Ind Co Ltd | Composition for optical material, optical material, method for producing the same and liquid crystal display and light emitting diode each using the same |
JP2005232463A (en) * | 2001-02-23 | 2005-09-02 | Kaneka Corp | Composition for optical material, optical material, method for producing the same and liquid crystal display device using the same |
JP2003147079A (en) * | 2001-11-19 | 2003-05-21 | Kanegafuchi Chem Ind Co Ltd | Curable composition, curable composition for optical material, optical material, method for producing optical material and light-emitting diode by using optical material |
JP2005015666A (en) * | 2003-06-27 | 2005-01-20 | Shin Etsu Chem Co Ltd | Curable silicone resin composition |
JP2005089733A (en) * | 2003-08-14 | 2005-04-07 | Shin Etsu Chem Co Ltd | Curable silicone resin composition |
JP2005089671A (en) * | 2003-09-19 | 2005-04-07 | Shin Etsu Chem Co Ltd | Curable silicone resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP2005133073A (en) | 2005-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4520251B2 (en) | Curable composition | |
JP4347103B2 (en) | Curable silicone composition | |
JP2008069210A (en) | Polycyclic hydrocarbon group-containing silicone-based curable composition | |
US7323250B2 (en) | Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device | |
JP5279197B2 (en) | Curable organosilicon composition and cured product thereof | |
JP4112443B2 (en) | Curable silicone resin composition | |
JP2012046604A (en) | Curable silicone-based composition containing polycyclic hydrocarbon skeleton component | |
US7176270B2 (en) | Curable composition | |
US7019100B2 (en) | Curable silicone resin composition | |
TWI515263B (en) | A hardened silicone oxygen composition for optical lenses | |
KR102623289B1 (en) | Infrared-transmitting curable composition, cured product thereof and optical semiconductor device | |
JP5539252B2 (en) | Curable composition | |
JP4338554B2 (en) | Curable silicone resin composition | |
JP5036125B2 (en) | Curable silicone resin composition | |
US7291691B2 (en) | Curable silicone resin composition | |
JP2012219117A (en) | White thermosetting resin composition, and reflector for white light emitting diode consisting of cured product of the same | |
JP4520248B2 (en) | Curable silicone resin composition | |
JP6941455B2 (en) | Curable composition | |
KR101135801B1 (en) | Curable Compositions | |
KR101127351B1 (en) | Curable Silicone Resin Composition | |
WO2023032724A1 (en) | Low dielectric constant insulating coating composition, cured product of same and display device | |
KR20090110241A (en) | Curable silicone composition for optical lens |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061019 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090317 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090514 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100518 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100520 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130528 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4520251 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160528 Year of fee payment: 6 |