JP4515814B2 - Mounting accuracy measurement method - Google Patents

Description

The present invention relates to a mounting accuracy measuring method, a mounting accuracy measuring apparatus, and a component mounting machine used for measuring the mounting accuracy of a component on a substrate in a component mounter for mounting the component on the substrate.

  Conventionally, in an electronic component mounting operation such as an IC in a component mounter, an electronic component is sucked and held by a suction nozzle provided in a mounting head portion from a component supply unit, and a suction posture is recognized by a component recognition camera. Thus, positioning in the X direction and Y direction is performed, correction in the θ direction, which is the rotational direction, is performed by the mounting head unit, and the electronic component is mounted on the circuit board positioned at a predetermined position.

  In such a component mounting machine, an error in mounting accuracy is measured before electronic component mounting. The error of the mounting position is a difference between the target position when the electronic component is mounted and the position of the actually mounted electronic component.

  Conventionally, in a component mounting machine such as a flip chip bonder, various mounting accuracy measuring methods have been proposed to improve the mounting accuracy. For example, when a component mounting machine is offline, This is done by mounting on a substrate using a jig and measuring the error.

  By the way, an offset measuring method capable of automatically measuring and registering a mounting position offset that causes a mounting position error by using a function possessed by an existing component mounting machine without requiring a dedicated measuring device, and a measuring jig used therefor Is disclosed (for example, see Patent Document 1).

In this mounting accuracy measuring method and the measurement jig used therefor, the substrate jig is carried into the component mounting machine, the split jig is mounted on the board jig by the component mounting machine, and the substrate jig is mounted by the recognition camera mounted on the component mounting machine. The individual mark indicating the position of the split jig attached to is recognized and acquired as a target position, and a recognition camera recognizes the mounting position mounting accuracy measurement mark attached to the split jig mounted on the board jig. The difference between the actually mounted positions is obtained as the mounting position offset.
JP 2003-51700 A

  However, in the conventional mounting accuracy measurement method, since the substrate camera side or the substrate side moves together with the XY robot to perform the measurement, the positioning accuracy of the XY robot has a considerable influence on the mounting error measurement accuracy. There is a problem.

  The mounting accuracy of the XY robot will be described with reference to FIG. FIG. 12 is a reference diagram illustrating an example of an actual measurement value of the amount of deviation caused by self-heating when the XY robot is mounted in the component mounter.

  In FIG. 12, for example, measurement is performed using a glass substrate 1201 for mapping measurement. The substrate 1201 has 20 mm pitch × 15 points in the X direction and 20 mm pitch × 11 points in the Y direction. Then, component mounting processing is performed according to these pitches. In FIG. 12, since only the displacement amount is plotted at 1000 times, the displacement amount is 20 μm when it is shifted by 1 square.

  A square point indicates a mounting target position, and a circular point indicates an actual mounting position. That is, the mounting is performed accurately at the mounting position where the two points of the circular shape and the quadrangular shape overlap, while the mounting target position is at the position where the two points of the circular shape and the rectangular shape are mounted apart from each other. Indicates that it is implemented away.

  In FIG. 12, although the straightness of the XY robot is 10 μm or less, the amount of deviation in the X direction, which is the traveling direction, is about 15 μm at the maximum, and the amount of deviation at both ends in the X direction is changed. Since the amount is small, it can be seen that there is a large displacement in the X-axis direction at the central portion.

  As described above, even if an XY robot in a large component mounting machine such as a flip chip bonder has an accurate squareness and straightness at the time of assembly, the XY robot causes thermal expansion due to self-heating of the mounting operation. It can be seen that distortion occurs in the perpendicularity and straightness.

  Therefore, positional deviation occurs in straightness, squareness, etc. due to temperature expansion, etc., which not only affects the mounting accuracy of components on the board, but also in mounting accuracy measurement using this XY robot. The above-described temperature distortion is a problem and has a considerable influence on the measurement of mounting accuracy.

  Conventionally, in component mounting machines such as SMT (Surface Mount Technology), the mounting accuracy is required to be on the order of several tens to several hundreds of micrometers. Therefore, mounting accuracy on the order of several μm, which is more accurate, is required. Therefore, realization of a more precise mounting accuracy measuring method is also required.

  The present invention has been made in view of the above situation, and provides a mounting accuracy measuring method capable of performing mounting accuracy measurement more accurately without being affected by mounting accuracy of an XY robot in a component mounter. With the goal.

In order to solve the above-described problems, a mounting accuracy measuring method according to the present invention measures a mounting error between the jig work and the jig substrate after mounting the jig work on the jig substrate in a component mounter. A mounting accuracy measuring method, wherein the component mounter includes a mounting head that sucks the jig workpiece and mounts the jig workpiece at a predetermined position on the jig substrate, and an XY robot that positions the mounting head in the X direction and the Y direction. And a substrate camera that images the jig substrate and the jig workpiece from a specific viewpoint position, the jig work is made of a transparent member , and two substrate side marks are formed on the jig substrate. On the jig workpiece, two workpiece side marks are respectively formed corresponding to the two substrate side marks with the two substrate side marks as a reference position. , The mounting accuracy measurement method, when imaged by the substrate camera, for each of the workpiece-side mark and the substrate-side mark corresponding, the work-side mark and the substrate-side mark the corresponding falls within the same visual field The viewpoint acquisition step for acquiring the viewpoint position , and the corresponding workpiece-side mark and the substrate-side mark for each corresponding workpiece-side mark based on the image captured by the substrate camera from the viewpoint position acquired in the viewpoint acquisition step. Acquires the positional relationship between the substrate side mark and the workpiece side mark, and acquires the positional relationship between the theoretical mounting position of the jig workpiece on the jig substrate with no theoretical mounting error and the substrate side mark. a position obtaining step of, acquired in the position acquisition step, said corresponding substrate-side mark and the workpiece-side Ma The two substrate-side marks using the positional relationship between the two workpieces and the positional relationship between the theoretical mounting position of the jig work on the jig substrate and the substrate-side mark. ΔX and ΔY which are the differences in the X and Y directions between the midpoint of the line segment connecting the two and the midpoint of the line segment connecting the two workpiece side marks, and the robot coordinate system which is the coordinate system in the XY robot And an error measurement step for measuring an error of the mounting position by calculating Δθ, which is a difference in angle with the substrate coordinate system in which two orthogonal sides of the mounted jig work are set in the X direction and the Y direction. It is characterized by including.
For this reason, in the present invention, using a transparent jig workpiece and jig substrate, the workpiece side mark and the substrate side mark can be placed in the same field of view, and the mounting accuracy can be measured from the relative positional relationship. Therefore, it is possible to perform mounting accuracy measurement without being affected by the movement accuracy of the XY robot. In addition, it is possible to accurately calculate the mounting displacement in the X direction, the Y direction, and the rotation direction using the positional relationship acquired in the position acquisition step.

In order to achieve the above object, the present invention is a mounting accuracy measuring device using the characteristic configuration steps of the mounting accuracy measuring method as a means, or a jig work, a jig substrate , and the mounting used in this mounting accuracy measuring method. It is possible to provide a program capable of causing a computer to execute the steps included in the component mounting machine including the accuracy measuring device or the mounting accuracy measuring method.

  In the mounting accuracy measuring method according to the present invention, a transparent glass jig substrate and a glass jig work are used, and an XY robot is positioned with reference to a board side mark using a substrate camera to measure a mounting error in three directions. In addition, it is possible to provide a mounting accuracy measurement method that is not affected by the accuracy of the XY robot.

Hereinafter, the mounting accuracy measuring method according to the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is an external view of a component mounter 100 using the offset measuring method according to the present invention.

  The component mounter 100 not only performs the process of mounting the jig work 101 on the glass jig substrate 102 but also measures the accuracy of the mounting position after the jig work 101 is mounted.

  The component mounter 100 includes a jig work 101, a glass jig substrate 102, a mounting head 103, a substrate camera 104, a component recognition camera 105, a transport rail 106, an XY robot 107, and a waffle tray 108 at the time of component mounting.

  The jig workpiece 101 is a glass chip component made of a transparent material such as glass. For example, a pattern of a dummy IC is formed, and the jig work 101 is in a state where it is sucked and held by the mounting head 103 at a predetermined position of the glass jig substrate 102. Implemented. The mounting in the present invention is performed using a highly transparent double-sided tape or the like.

  The glass jig substrate 102 is a substrate for mounting accuracy measurement on which the jig workpiece 101 is mounted using a highly transparent double-sided tape, and is made of transparent glass. Note that the jig substrate 102 is not limited to glass, but may be any transparent material that can perform an edging process.

  The mounting head 103 is moved onto the waffle tray 108 which is a component supply unit by the XY robot 107 and sucks and holds the jig work 101 by using the suction nozzle provided in the mounting head 103, and also by the component recognition camera 105. The posture of the jig workpiece 101 held by suction is recognized, and the jig workpiece 101 is mounted on the jig substrate 102 after correcting the X direction, the Y direction, and the θ direction which is the rotation direction based on the recognition result.

  The substrate camera 104 is used for recognizing a mark formed at a corner of the substrate for recognizing the substrate and a target mark of a substrate side mark for recognizing the mounting position. The visual field of the substrate camera 104 is, for example, 4 mm square.

  The component recognition camera 105 recognizes the shift amount of the jig work 101 held by the mounting head 103, and based on the shift amount, the XY robot 107 is in the X direction and the Y direction, and the mounting head 103 is in the rotation direction. Correction in the θ direction is performed.

The transport rail 106 serves as a guide means when the glass jig substrate 102 is transported to a position for performing a mounting process by using, for example, a transport belt or a transport arm.
The XY robot 107 is a planar mobile robot, and is driven based on a mounting program recorded in a memory unit, for example. Further, the XY robot 107 performs an operation of moving the mounting head to the waffle tray 108.

The waffle tray 108 is installed in the component supply unit, and the jig work 101 is arranged.
FIG. 2 is an explanatory diagram of the jig work 101 used in the mounting accuracy measuring method according to the present invention.

As shown in FIG. 2A, the jig glass 201 is cut into the same pattern to create a plurality of jig workpieces 101. Therefore, the accuracy of the jig workpiece 101 is created very accurately. Further, the jig work 101 is accurately cut to 8 mm square, for example, and a pattern of a dummy IC is formed at the center.

In FIG. 2 (b), shows a top view of the jig workpiece 101, the jig workpiece 101 of 8mm square, IC chip of the dummy portion 101b of 3mm square, and the jig workpiece-side mark 101a having a diameter of 1mm are arranged diagonally Is formed.

FIG. 3 is a plan view of another glass jig substrate 301 used in the mounting accuracy measuring method according to the present invention. Note that the jig workpiece 101 is mounted on the glass jig substrate 301 at some mounting positions.

The glass jig substrate 301 is provided at four corners in order to measure the target mark 304 at the center position of the cross shape that becomes a target when the jig work 101 is mounted, and the amount of mounting displacement when the glass jig substrate 301 is transported. And a substrate side mark 303 serving as a reference position in mounting accuracy measurement. The glass jig substrate 301 is made of a transparent member such as glass.

FIG. 4 is a schematic diagram for explaining the mounting accuracy measuring method according to the first embodiment.
The jig work 101 is formed in an 8 mm square, and a 3 mm square dummy IC portion 101b is formed on the surface, and a jig work side mark 101a having a diameter of 1 mm is formed in two places.

In FIG. 4, the glass jig substrate 102 is, for example, a 10 cm square transparent substrate, and a target position 102a on which the jig workpiece 101 is mounted and two substrate side marks having a diameter of 0.5 mm at intervals of 5 mm are diagonally located. Is formed.

Then, after the mounting process, the board camera 104 sets the first and second camera field positions at positions where the board side mark and the jig work side mark fall within the same field of view. For setting the visual field position, the visual field position is determined using, for example, a substrate-side mark accurately formed on the glass jig substrate 102. Therefore, the mounting errors in the X direction, the Y direction, and the θ direction can be measured without being affected by the distance that the XY robot 107 moves.

FIG. 5 is a plan view showing ΔX, ΔY, and Δθ that are the amounts of mounting misalignment in the X direction, the Y direction, and the θ direction in the mounting accuracy measurement according to the first embodiment.
The midpoint of the line connecting between the substrate side marks 302 is set as the reference position 501 and the midpoint of the line connecting between the jig work side marks 101a is set as the mounting position 502, and the difference between the X direction and the Y direction of the position is set. Based on this, ΔX and ΔY as shown in FIG. 5 are determined.

Further, the rotation direction difference Δθ is calculated based on an angle formed by the robot coordinate system and the substrate coordinate system.
In the present invention, since the jig workpiece and the jig substrate are both configured to be transparent, it is possible to visually recognize the accuracy after mounting, and the mounting accuracy of the mounting position can be measured using the substrate camera. Can be done.

Next, an operation procedure when the jig work is mounted on the glass jig substrate before the mounting accuracy measurement will be described.
FIG. 6 is a flowchart showing an operation procedure until the board mounting of the component mounter 100 according to the first embodiment. The component mounter 100 uses a mounting head 103 that freely moves on an XY plane by an XY robot 107 having an X-axis table and a Y-axis table to hold a jig work 101 held from a waffle tray 108 that is a component supply unit. The circuit board is configured to be mounted at a predetermined position.

  First, the mounting head 103 is moved to the waffle tray 108, the suction nozzle is lowered to suck and hold the jig work 101 (S601), and the mounting head 103 is moved onto the component recognition camera 105 to determine a predetermined holding position. A displacement amount from the position is detected (S602).

  When the jig workpiece 101 is mounted on the substrate 102, the positional deviation in the XY direction detected by the component recognition camera 105 is corrected by the movement operation of the mounting head 103 in the XY direction by the XY robot 107, and the θ direction which is the rotation direction. The positional deviation at is corrected by the rotation operation of the suction nozzle (S603).

  Further, the glass jig substrate 102 is carried into the component mounting machine 100 via the conveyance rail 106 and positioned and fixed at a predetermined position. The positional deviation from the predetermined position at that time is the four corners provided on the glass jig substrate 102. Is detected by the substrate camera 104 mounted on the mounting head 103, and the amount of displacement is detected and reflected in the mounting position correction when the jig work 101 is mounted.

FIG. 7 is a flowchart showing an operation procedure of the component mounter 100 using the mounting accuracy measuring method according to the present invention.
First, according to the operation procedure described in FIG. 6 described above, one jig work 101 to be subjected to mounting accuracy measurement is selected from the jig works 101 mounted on the jig board 102, and the board camera 104 A field-of-view position is acquired such that the side mark and the workpiece-side mark fall within the same field of view (S702).

  Next, the substrate side mark formed on the glass jig substrate 102 side is acquired as the reference position of the field of view (S703), and an image that can recognize the relative position of the jig work side mark and the substrate side mark is taken (S704). ). In the first camera field of view and the second camera field of view, the processing from S702 to S704 as a loop is repeated.

  As described above, after mounting the jig work 101, the error from the normal mounting position of the jig work 101 and the glass jig substrate 102 is measured using the mounting accuracy measuring method according to the present invention. Rather than moving the position of the XY robot based on the position information stored in the unit, the mounting head 103 having the substrate camera 104 is mounted on the jig substrate 102 closest to the substrate stopper by the XY robot 107. Since the workpiece side mark and the jig side mark of the jig workpiece 101 are moved to the viewpoint position where the jig side mark can be recognized at the same time, it is possible to measure the accuracy of the mounting position without being affected by the accuracy of the XY robot 107 as in the prior art. Become.

  FIG. 8 is a reference diagram for explaining the mounting accuracy measuring method according to the present invention. The mounting accuracy measuring method of the present invention is a method for determining mounting errors ΔX, ΔY, and Δθ in the X direction, the Y direction, and the θ direction. In FIG. 8, the robot coordinate system is a coordinate system in the XY robot 107 of the component mounting machine 100, and the board coordinate system is the two directions orthogonal to the mounted jig workpiece 101 in the X direction and the Y direction. Coordinate system.

  In the description of FIG. 8, θ represents the inclination of the board coordinate system measured in the robot coordinate system, and p1 and p2 are component marks 802a mounted in a state where there is no theoretical deviation from the board side marks 801a and 801b. The vector in the substrate coordinate system to 802b is shown, m is the vector in the substrate coordinate system from the substrate side mark 801a to the substrate side mark 801b, and r1 and r2 are actually mounted from the board side marks 801a and 801b. R1 and R2 indicate vectors in the robot coordinate system from the board side marks 801a and 801b to the actually mounted component marks 803a and 803b. ing.

  Note that p1, p2, and m can be obtained from CAD data, and θ, R1, and R2 can be measured by the substrate camera 104. Then, r1 and r2, which will be described below, are calculated from the measurement results, and finally ΔX, ΔY, and Δθ that are mounting misalignments are obtained.

  Then, the calculation procedure for obtaining ΔX, ΔY, and Δθ in the mounting accuracy measurement method will be described. First, the measurement result after mounting is converted from the robot coordinate system to the substrate coordinate system using the following equation (1). Convert to

Here, [-θ] indicates a rotation matrix.
Further, the mounting displacement in the X direction and the Y direction is calculated using the following formula 2 in order to obtain an average value of the difference between p1, p2 and r1, r2.

    Next, the calculation method of the amount of deviation Δθ in the rotation direction will be described. In order to obtain the theoretical inclination θcad of the component mark with respect to the substrate coordinates, the x component of the vector (−p1 + m + p2) from the component mark 803a to the component mark 803b, Arctan is calculated from the y component using Equation (3).

  Similarly, in order to obtain the inclination θreal of the actually mounted component mark with respect to the board coordinates, arctan is calculated using Equation 4 from the x component and y component of the vector (−r1 + m + r2) from the component mark 803a to the component mark 803b. calculate.

  Then, as shown in Equation 5, a value obtained by subtracting θcad from θreal can be obtained as the angle deviation Δθ.

FIG. 9 is a flowchart showing an operation procedure in the mounting accuracy side-hand method according to the present invention.
First, R1, R2, and θ are measured using the substrate camera 104 by the transparent glass jig substrate 102 and the jig workpiece 101 after the mounting process (S901).

  Next, ΔX, ΔY, Δθ, which are misalignments in the three-axis directions, are calculated by the arithmetic unit provided in the component mounting machine 100 using the above-described mathematical expressions (S902), and error correction processing is performed using these. (S903) The component mounter 100 can correct the operation position on the program of the XY robot 107 and perform component mounting with higher accuracy.

FIG. 10 is a plan view of another glass jig substrate 1001 used in the mounting accuracy measuring method of the present invention.
Unlike the glass jig substrate 301 shown in FIG. 3 described above, an IC mark 1002 serving as a dummy IC is formed on the glass jig substrate 1001 at the mounting position. It is to be noted that the substrate side mark 1003 which is a target in component recognition is formed in the same manner as the glass jig substrate 301 in FIG.

As described above, the mounting accuracy measuring method according to the present invention performs the mounting process using the transparent glass jig substrate 102 and the jig work 101, and the board side mark and the jig work side mark are displayed using the board camera 104. The viewpoint position is specified so as to fall within the same field of view, and this is imaged at two locations for one jig work.

  Then, the substrate camera 104 is moved by the XY robot 107 in order to take an image of two places. At this time, the jig is used as a relative position with respect to the substrate side mark formed accurately on the glass jig substrate 102. Since the workpiece side mark is measured to measure the mounting accuracy error, it is not affected by the accuracy of the XY robot 107, which is affected by temperature expansion, etc. during the accuracy measurement, so that a higher mounting accuracy measurement can be performed. It becomes possible.

In addition, since the mounting accuracy measuring method according to the present invention can be performed by using the jig work 101 and the glass jig substrate 102, the mounting accuracy can be easily measured at the customer or delivery destination of the component mounting machine 100. Can be done.

Further, since both the glass jig substrate 102 and the jig workpiece 101 are made of transparent members, it is possible to measure the workpiece side mark position as seen from the jig substrate 102 mark side which is the back surface as well as from the front surface. It becomes.

  Then, measurement and calculation processing of errors in the X direction, Y direction, and θ direction are performed using the board camera 104 provided in the component mounting machine 100, and the correction result is reflected on the mounting data program. It is possible to mount components with higher accuracy by easily correcting the mounting position using the result of the mounting accuracy measurement method.

In addition, by performing error correction by the mounting accuracy measuring method according to the present invention, it is possible to provide a component mounter in which the mounting error is in the range of several μm.
The mounting accuracy measuring method according to the present invention is a component that is mounted from the upper surface of a substrate to be mounted using a mounting head and an XY robot when mounting an electronic component such as a flip chip bonder as described above on a substrate. It can be used not only in a mounting machine but also in a rotary type component mounting machine in which a mounting head is fixed and a mounting board side is moved to perform a mounting process.

(Embodiment 2)
Next, the second embodiment of the present invention will be described. In the second embodiment, there is provided a mounting accuracy measuring method in which the same pattern is formed on the glass jig workpiece and the glass jig substrate, and the mounting accuracy can be easily evaluated at the delivery destination.

  FIG. 11 is a top view showing only the marks formed on the jig substrate and the jig workpiece in order to explain the mounting accuracy measuring method according to the second embodiment. The component mounter used for mounting accuracy measurement is the same as that shown in FIG.

In FIG. 11, the mark of the same pattern is formed on the glass jig workpiece and the glass jig substrate.
FIG. 11A shows the original pattern formed on the glass jig substrate. FIG. 11 (b) shows a case where the jig work is mounted with a displacement of +0.5 mm accurately in the X direction and the Y direction, and FIG. 11 (c) shows a case where the jig work is mounted shifted in the θ direction. FIG. 11 (d) shows the case where the jig work is mounted shifted in the X direction, Y direction, and θ direction.

Next, the mounting operation of the jig work in the mounting error measuring method will be described.
First, the jig workpiece is set on the tray with the pattern surface of the jig workpiece facing down.
Next, the suction position of the jig work is recognized in advance with the substrate camera, and suction processing is performed in the mounting head. The recognition at this time is performed by separately recognizing the two 4.8 mm square marks 1104 formed on the glass jig work in the flip chip bonder. Further, in the die bonder, the recognition process is performed by dividing two corner edges to be a 3 mm square dummy IC.

  Then, individual mark correction is performed, and mounting processing is performed with a shift of +0.5 mm in the X and Y directions. In this case, the jig work is mounted on the substrate by sticking a highly transparent double-sided tape on the glass jig substrate.

  In the mounting accuracy measurement according to the second embodiment, two round marks at two corners are simultaneously imaged as the visual field position, for example, at a position where the glass substrate side mark is at the center. The substrate side camera is moved by the XY robot when imaging two corners, but the workpiece side mark is measured as a relative position based on the jig glass substrate side mark accurately formed on the fixed side. Therefore, similarly to the first embodiment described above, it is possible to provide a mounting accuracy measurement method that is not affected by the movement distance accuracy of the XY robot.

  The mounting accuracy measuring method according to the present invention can be used for a mounting accuracy measuring method of a component mounting machine such as a flip chip bonder and a die bonder, and in particular, a component for performing semiconductor mounting or the like that requires high precision mounting of several μm order. Used for mounting machines.

It is an external view of the component mounting machine using the offset measuring method according to the present invention. It is explanatory drawing of the glass jig workpiece | work used for the mounting accuracy measuring method which concerns on this invention. It is a top view of the other glass jig substrate used for the mounting accuracy measuring method concerning the present invention. It is the schematic for demonstrating the mounting accuracy measuring method which concerns on Embodiment 1. FIG. FIG. 7 is a plan view showing ΔX, ΔY, and Δθ, which are amounts of mounting misalignment in the X direction, the Y direction, and the θ direction in the mounting accuracy measurement according to the first embodiment. 4 is a flowchart showing an operation procedure up to board mounting of the component mounter according to the first embodiment. It is a flowchart which shows the operation | movement procedure of the component mounting machine using the mounting accuracy measuring method which concerns on this invention. It is a reference figure for demonstrating the mounting accuracy measuring method which concerns on this invention. It is a flowchart which shows the operation | movement procedure in the mounting precision side hand method which concerns on this invention. It is a top view of the other glass jig board | substrate used for the mounting accuracy measuring method of this invention. It is a top view which shows only the mark formed in a jig | tool board | substrate and a jig workpiece | work for demonstrating the mounting accuracy measuring method which concerns on this Embodiment 2. FIG. It is a reference figure which shows an example of the measured value of the deviation | shift amount at the time of mounting | wearing of XY robot in a component mounting machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting machine 101 Jig work 101a Jig work side mark 101b Dummy IC
102 Glass jig substrate 103 Mounting head 104 Substrate camera 105 Component recognition camera 106 Transfer rail 107 XY robot 108 Waffle tray
201 Jig Glass 301 Glass Jig Substrate 303 Glass Substrate Side Mark 304 Target Position 1001 Glass Jig Substrate

Claims (6)

In the component mounting machine, a mounting accuracy measurement method for measuring a mounting error between the jig workpiece and the jig substrate after mounting the jig workpiece on the jig substrate,
The component mounter is
A mounting head that sucks the jig workpiece and mounts it on a predetermined position on the jig substrate;
An XY robot for positioning the mounting head in the X and Y directions;
A substrate camera that images the jig substrate and the jig workpiece from a specific viewpoint position;
The jig work is composed of a transparent member,
Two substrate-side marks are formed on the jig substrate, and the two workpiece-side marks are respectively formed on the jig workpiece with the two substrate-side marks as a reference position. It is formed corresponding to
The mounting precision measuring how is,
Viewpoint acquisition for acquiring the viewpoint position where the corresponding work-side mark and the substrate-side mark fall within the same field of view for each of the corresponding work-side mark and the substrate-side mark when imaged by the substrate camera Steps,
Based on the image captured by the substrate camera from the viewpoint position acquired in the viewpoint acquisition step, for each of the corresponding workpiece side mark and the substrate side mark, the positional relationship between the corresponding substrate side mark and the workpiece side mark And obtaining a positional relationship between the theoretical mounting position of the jig workpiece on the jig substrate without theoretical mounting error and the substrate-side mark, and
The positional relationship for each of the corresponding substrate-side mark and workpiece-side mark acquired in the position acquisition step, and the theoretical mounting position where the jig workpiece is mounted on the jig substrate theoretically without any mounting error. Using the positional relationship with the substrate side mark, the X direction and the Y direction of the midpoint of the line connecting the two substrate side marks and the midpoint of the line connecting the two workpiece side marks ΔX and ΔY which are the differences, and the difference in angle between the robot coordinate system which is the coordinate system in the XY robot and the substrate coordinate system in which two orthogonal sides of the mounted jig work are defined as the X direction and the Y direction. An error measurement step of measuring an error of the mounting position by calculating Δθ . The mounting accuracy measurement method further includes:
The position correction step of correcting the mounting position of the jig work on the jig substrate based on the ΔX, ΔY, and Δθ calculated in the error measurement step. Mounting accuracy measurement method. In the jig workpiece, the two workpiece side marks are formed at opposite positions on the diagonal line of the jig workpiece, and the target part shape is formed on a midpoint of a line segment connecting the two workpiece side marks. ,
In the jig substrate, the two substrate side marks are formed at a position where the jig workpiece is mounted,
The mounting accuracy measuring method according to claim 1, wherein the corresponding workpiece side mark and the substrate side mark are formed at positions that fall within the same field of view in imaging by the substrate camera. The mounting accuracy measuring method according to claim 1, wherein in the error measuring step, the ΔX, ΔY, and Δθ can be measured with the jig substrate side as a surface. A mounting accuracy measuring device for measuring a mounting error between the jig workpiece and the jig substrate after mounting the jig workpiece on the jig substrate,
A mounting head that sucks the jig workpiece and mounts it on a predetermined position on the jig substrate;
An XY robot for positioning the mounting head in the X and Y directions;
A substrate camera that images the jig substrate and the jig workpiece from a specific viewpoint position;
The jig workpiece is made of a transparent member, and two substrate side marks are formed on the jig substrate. On the jig workpiece, two substrate side marks are used as reference positions. A workpiece side mark is formed corresponding to each of the two substrate side marks,
The mounting accuracy measuring device further includes:
Viewpoint acquisition for acquiring the viewpoint position where the corresponding work-side mark and the substrate-side mark fall within the same field of view for each of the corresponding work-side mark and the substrate-side mark when imaged by the substrate camera Means,
Based on the image captured by the substrate camera from the viewpoint position acquired by the viewpoint acquisition unit, for each of the corresponding workpiece side mark and the substrate side mark, the positional relationship between the corresponding substrate side mark and the workpiece side mark And a position acquisition means for acquiring a positional relationship between the theoretical mounting position of the jig workpiece on the jig substrate without theoretical mounting error and the substrate side mark;
The positional relationship for each of the corresponding substrate side mark and the workpiece side mark acquired by the position acquisition means, the theoretical mounting position of the jig work mounted on the jig substrate theoretically without any mounting error, and the Difference in X direction and Y direction between the midpoint of the line connecting the two substrate side marks and the midpoint of the line connecting the two workpiece side marks using the positional relationship with the substrate side mark ΔX and ΔY, and Δθ, which is a difference in angle between the robot coordinate system which is a coordinate system in the XY robot and the substrate coordinate system in which two orthogonal sides of the mounted jig work are defined as the X direction and the Y direction And an error measuring means for measuring the error of the mounting position by calculating the mounting accuracy measuring device. A component mounting machine comprising the mounting accuracy measuring device according to claim 5 .

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