JP4507817B2 - Display substrate manufacturing method by droplet discharge, display substrate, display device manufacturing method, display device, and electronic apparatus - Google Patents

Description

  The present invention relates to a method for manufacturing a display substrate by droplet ejection, a display substrate, a method for manufacturing a display device, a display device, and an electronic apparatus.

  Generally, in various display devices (electro-optical devices), a color filter is provided to enable color display. This color filter has, for example, a dot-shaped filter element of each color of R (red), G (green), and B (blue) on a substrate made of glass or plastic, so-called stripe arrangement, delta arrangement, They are arranged in a predetermined arrangement pattern such as a mosaic arrangement.

  In addition, as an example of a display device, an electro-optical device such as a liquid crystal device or an EL (electroluminescence) device is used, and a display dot whose optical state can be controlled independently is formed on a substrate made of glass or plastic. There is something arranged. In this case, each display dot is provided with a liquid crystal or an EL light emitting unit. As an arrangement mode of display dots, for example, a display dot arranged in a vertical and horizontal lattice (dot matrix) is generally used.

  In a display device capable of color display, for example, display dots (liquid crystal or EL light emitting unit) corresponding to the respective colors R, G, B, for example, are formed, and one display is formed by, for example, three display dots corresponding to all colors. Two picture elements (pixels) are formed. Then, it is possible to perform color display by controlling the gradations of a plurality of display dots included in one pixel.

  For example, as disclosed in Patent Document 1, in the manufacturing process of these display devices, a photosensitive resin is applied on a substrate, and an exposure process and a development process are performed on the photosensitive resin, thereby forming a lattice-like structure. After forming a partition (bank), droplets discharged by a head or the like are landed on an area defined by the partition and dried, thereby causing a display element (that is, a filter element or EL of the above color filter). In some cases, a display dot or the like of the light emitting portion is formed. This method has an advantage that it can be easily manufactured because it is not necessary to pattern display elements for each color by a photolithography method or the like. And the hydrophilicity process was performed to the board | substrate surface, and the wettability of the ink was improved (for example, refer patent document 1).

JP 2000-221319 A

  However, in the above conventional color filter or display device (electro-optical device) manufacturing method, partition walls called banks are mostly formed of a lyophobic material around the pixel region, and adjacent pixels are formed. The device is designed to prevent ink from flowing into the area. For example, at the initial stage when ink is filled in the pixel area, it has been necessary to devise measures such as landing the ink around the pixel area in order to reduce insufficient wetting and spreading of the ink around the pixel area. . However, if ink is repelled in the vicinity of the bank, the ink may not be sufficiently spread around the periphery of the pixel area, and color loss may occur. On the other hand, if the amount of ink dropped so that the ink spreads in the peripheral area is increased, the ink is mixed into adjacent banks, and there is a possibility that color mixing occurs.

  Accordingly, a manufacturing method capable of manufacturing a display device that can suppress the occurrence of color mixture and reduce deficiency in the pixel region to reduce the occurrence of color loss, and display contrast. There has been a demand for a high-definition display substrate with little reduction.

  An object of the present invention is to perform droplet ejection that can reduce the insufficient spread of droplets and the mixing of droplets between adjacent regions when the functional liquid is disposed as droplets on a region on a substrate. A display substrate manufacturing method, a display substrate, a display device manufacturing method, a display device, and an electronic apparatus are provided.

  The method for manufacturing a substrate of the present invention is a method for manufacturing a substrate having a partition wall that partitions a predetermined region on a base body, and includes a step of forming a partition wall for partitioning the predetermined region on the base body, The method includes a step of forming a liquid repellent film having a convex shape in a part of a predetermined region, and a step of applying a functional liquid to the predetermined region.

  According to the present invention, the method includes a step of forming a partition and a step of forming a film, and when a droplet is landed on a region partitioned by the partition, a liquid repellent film is formed on the island region of the region. Therefore, the wettability of the substantially central part of the region is poor and the wettability of the peripheral part is good, so that the functional liquid is repelled in the liquid repellent film, and the functional liquid is located in the peripheral part rather than the substantially central part of the area. Will flow. Then, since the functional liquid spreads in the center of the region, it is less likely that voids (color missing portions) that are not filled with droplets are formed. In addition, since the functional liquid tends to flow to the peripheral portion of the region, it is possible to suppress color mixing that occurs due to variations in the landing position when discharging is aimed at the peripheral portion of the region. Also, for example, when a lyophobic film is formed on a lyophilic film, when a lyophobic film is formed on a non-lyophilic non-lyophobic film, or on a lyophobic film having high lyophobic properties Even if a liquid-repellent film having a relatively low liquid repellency is formed, a void portion (color missing portion) that is not filled with droplets is less formed. Further, since the liquid repellent film has a convex shape, the functional liquid tends to flow to the peripheral portion rather than the substantially central portion of the region.

  The substrate manufacturing method of the present invention includes a step of forming a film of a negative radiation-sensitive material having liquid repellency in the predetermined region in the step of forming the liquid repellent film, and the partition side of the substrate. A negative radiation sensitive material is formed by disposing a mask having a pinhole at a position corresponding to the substantially central portion of the predetermined region on the surface opposite to the surface and irradiating light so as to pass through the pinhole. It is desirable to have a step of exposing the film and a step of developing the film of the negative radiation sensitive material after the exposure.

  According to this invention, the film forming step of the negative type radiation sensitive material and the step of exposing from the back side of the substrate are provided, and the thickness of the substrate is separated when performing pinhole exposure from the back side of the substrate. Since light is irradiated from the place, a light quantity distribution is formed by light diffraction. Since the film thickness distribution of the liquid repellent film is substantially proportional to the light amount distribution, the liquid repellent film can be formed thick at the approximate center of the region and thin at the peripheral part.

  The substrate manufacturing method of the present invention includes the step of forming the liquid repellent film, the step of forming a film of a positive radiation sensitive material having liquid repellency in the predetermined region, and the partition side of the substrate. A mask is disposed at a position corresponding to the substantially central portion of the predetermined region on the surface, and the film of the positive radiation sensitive material is exposed by irradiating light, and the positive radiation after the exposure And developing a film of a sensitive material.

  According to this invention, since the film forming step of the positive type radiation sensitive material and the step of exposing from the front surface side of the substrate are provided, the wiring and the like are present on the substrate and the exposure cannot be performed from the back surface side. Even in the case of organic EL, a liquid repellent film can be formed.

  In the method for producing a substrate of the present invention, in the step of forming the liquid repellent film, it is desirable to form the liquid repellent film by performing exposure multiple times.

  According to this invention, by exposing the positive radiation sensitive material a plurality of times, a substantially mountain-shaped liquid repellent film can be formed, so that the functional liquid does not accumulate in the approximate center of the region. It will be repelled and it will be easier to flow around it.

  The substrate of the present invention includes a base, a partition formed so as to partition a predetermined region on the base, a convex liquid repellent film formed in a part of the predetermined region, and the predetermined region And a display layer formed by solidifying the functional liquid.

  According to this invention, when the functional liquid lands on the area, the liquid repellent film is formed on a part of the area. Therefore, the liquid repellent film repels the functional liquid and the functional liquid flows around the area. Therefore, the generation of voids (color missing portions) that are not filled with droplets can be suppressed to a small extent. If the generation of voids in the region can be suppressed, the concentration of ink may be increased from the conventional level, so that less ink can be landed on the region. Since the amount of ink to be ejected is small, it is possible to land at the target position when the droplets are landed, so that it is possible to suppress the occurrence of color mixing failure during ejection. Therefore, color mixing defects can be suppressed, and the height of the partition walls can be reduced, so that flattening is facilitated. Therefore, it becomes higher density and higher definition. In addition, since the liquid repellent film is formed in a convex shape, the liquid droplets that have landed on the region are more likely to flow to the peripheral portion of the region than to the substantially central portion.

  As for the board | substrate of this invention, it is desirable for the height of the said liquid repellent film to be the range of 100 nm-300 nm.

  According to the present invention, since the liquid repellent film is formed at a height of 100 nm to 300 nm, when the liquid droplets land on the area, the functional liquid is repelled on the liquid repellent film, and the partition wall and the peripheral part of the area It is easy to guide the functional liquid in between. Then, when the functional liquid flows to the peripheral portion of the region and accumulates there, the functional liquid can spread from the peripheral portion of the region toward the central portion.

  An electro-optical device according to the present invention includes the above-described substrate.

  According to the present invention, as described above, it is possible to suppress the generation of voids (color missing portions) and color mixture that are not filled with liquid droplets, and to reduce the height of the partition walls. Since a display substrate can be formed, quality problems such as disconnection and short circuit can be reduced. Accordingly, since a device with higher density, higher definition, and stable quality can be obtained, an electro-optical device capable of improving display quality can be provided.

  An electronic apparatus according to the present invention includes the above-described electro-optical device.

  According to the present invention, since the electro-optical device that can further improve the display quality is provided, it is possible to provide an electronic apparatus that can be miniaturized with high accuracy.

Hereinafter, embodiments of a method for manufacturing a display device by droplet ejection, a display device, and an electronic apparatus according to the present invention will be described in detail with reference to the accompanying drawings. Here, before describing the characteristic configuration and method of the present invention, first, the substrate used in the droplet discharge method, the droplet discharge method, the structure and manufacturing method of the color filter substrate, the structure and manufacturing of the EL light emitting panel The method will be described sequentially.
<About the substrate>

Various substrates such as glass, quartz glass, and plastic can be used as the substrate used in the manufacturing method of the display device by droplet discharge.
<Droplet ejection method>

Examples of the discharge technique of the droplet discharge method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. Here, in the charge control method, a charge is applied to a material with a charging electrode, and the flight direction of the material is controlled with a deflection electrode to be discharged from a discharge nozzle. In addition, the pressure vibration method is a method in which an ultra-high pressure of about 30 kg / cm ² is applied to the material and the material is discharged to the nozzle tip side. When discharged and a control voltage is applied, electrostatic repulsion occurs between the materials, and the materials are scattered and are not discharged from the discharge nozzle. In addition, the electromechanical conversion method utilizes the property that a piezoelectric element (piezoelectric element) deforms in response to a pulsed electric signal, and the piezoelectric element is deformed through a flexible substance in the space where the material is stored. Pressure is applied, and the material is extruded from this space and discharged from the discharge nozzle.

  In the electrothermal conversion method, a material is rapidly vaporized by a heater provided in a space in which the material is stored to generate bubbles, and the material in the space is discharged by the pressure of the bubbles. In the electrostatic attraction method, a minute pressure is applied to a space in which a material is stored, a meniscus of material is formed on the discharge nozzle, and an electrostatic attractive force is applied in this state before the material is drawn out. In addition to this, techniques such as a system that uses a change in the viscosity of a fluid due to an electric field and a system that uses a discharge spark are also applicable. The droplet discharge method has an advantage that the use of the material is less wasteful and a desired amount of the material can be accurately disposed at a desired position. In addition, the amount of one drop of the liquid material discharged by the droplet discharge method is 1 to 300 nanograms, for example.

<Color filter substrate structure and manufacturing method thereof>
6A to 6F are process cross-sectional views illustrating the manufacturing process of the color filter substrate, and FIG. 7 is a schematic flowchart illustrating the procedure of the manufacturing process of the color filter substrate.

  As shown in FIG. 6A, radiation is applied to the surface of a substrate 12 made of light-transmitting glass, plastic, or the like by various methods such as spin coating (rotary coating), cast coating, and roll coating. A sensitive material 6A is applied (step S31 shown in FIG. 7). The radiation sensitive material 6A is preferably a resin composition. The thickness of the radiation-sensitive material 6A after coating is usually 0.1 to 10 μm, preferably 0.5 to 3.0 μm.

  This resin composition includes, for example, (i) a radiation-sensitive resin composition that contains a binder resin, a polyfunctional monomer, a photopolymerization initiator, and the like and is cured by irradiation with radiation, and (ii) a binder resin, A radiation-sensitive resin composition that contains a compound that generates an acid upon irradiation with radiation, a crosslinkable compound that can be cross-linked by the action of an acid generated upon irradiation with radiation, and the like that is cured by irradiation with radiation can be used. These resin compositions are usually prepared as a liquid composition by mixing a solvent when used, and this solvent may be a high-boiling solvent or a low-boiling solvent. Examples of the radiation sensitive material 6A include (a) hexafluoropropylene, unsaturated carboxylic acid (anhydride), and other copolymerizable ethylenically unsaturated monomers as described in JP-A-10-86456. A copolymer with a monomer, (b) a compound capable of generating an acid upon irradiation with radiation, (c) a crosslinkable compound capable of crosslinking by the action of an acid generated upon irradiation with radiation, (d) other than the component (a) The fluorine-containing organic compound and (e) a solvent capable of dissolving the components (a) to (d) are preferable.

  Next, the radiation sensitive material 6A is irradiated (exposed) with radiation through a predetermined pattern mask (step S32 in FIG. 7). The radiation includes visible light, ultraviolet rays, X-rays, electron beams, etc., but radiation (light) having a wavelength in the range of 190 to 450 nm is preferable. This radiation irradiation (exposure) process is a method in which the front surface side exposure and the back surface side exposure of the substrate 12 are performed simultaneously, and details will be described later.

  Next, the radiation sensitive material 6A is developed (step S33 in FIG. 7), thereby forming the partition (bank) 6B and the liquid repellent film 6Z shown in FIG. 6B. The partition 6B and the liquid repellent film 6Z are configured in a shape (negative pattern) corresponding to the pattern mask. The shape of the partition wall 6B is preferably, for example, a lattice shape that is defined so that the rectangular filter element forming regions 7 can be arranged vertically and horizontally on a plane. An alkaline developer is used as the developer used to develop the radiation sensitive material 6A. Examples of the alkali developer include sodium carbonate, sodium hydroxide, potassium hydroxide, sodium silicon, sodium metasilicon, aqueous ammonia, ethylamine, n-propylamine, diethylamine, di-n-propylamine, triethylamine, and methyldiethylamine. , Dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, choline, pyrrole, piperidine, 1,8-diazabicyclo [5,4,0] -7-undecene, 1,5-diazabicyclo [4,3,0] An aqueous solution such as -5-nonene is preferred. An appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant, or the like can be added to the alkaline developer. In addition, washing with water is usually performed after development with an alkali developer.

  Next, as shown in FIG. 6C, the partition 6B is baked (baked) at, for example, about 200 ° C. to form the partition 6C (step S34 in FIG. 7). This firing temperature is appropriately adjusted according to the radiation sensitive material 6A. Further, there may be a case where baking is not required. In this embodiment, since the partition wall 6C is made of a light-shielding material, it functions as a literal partition wall that defines (partitions) each region 7, and a light-shielding portion that blocks light other than the region 7. It has a function as a layer. But you may comprise so that it may have only a function as a partition. In this case, a light shielding layer made of metal or the like may be formed separately from the partition wall.

  Next, a filter element material 13 in which a colorant (pigment, dye, etc.) is mixed in a base material such as an acrylic resin in each region 7 defined by the partition wall 6C formed as described above (example in FIG. 6). Then, 13R (red colorant), 13G (green colorant), and 13B (blue colorant)) are introduced. As a method for introducing the filter element material 13 into each region 7, the filter element material 13 is formed as a liquid material (functional liquid) by mixing a solvent or the like, and this functional liquid is introduced into the region 7. More specifically, in this embodiment, the material is introduced by landing the functional liquid in the region 7 in the form of droplets 8 by droplet ejection using a droplet ejection head described later.

  Said filter element material 13 is introduce | transduced in the area | region 7 as a functional liquid, and is preliminarily solidified or temporarily hardened by performing prebaking (preliminary baking) by drying or baking at low temperature (for example, 60 degreeC) after that. . For example, the filter element material 13R is introduced (step S35 in FIG. 6C and FIG. 7), and then the filter element material 13R is pre-baked to form the filter element 3R (step S36 in FIG. 7). Next, the filter element material 13G is introduced (step S37 in FIG. 6 (d) and FIG. 7), the filter element material 13G is pre-baked to form the filter element 3G (step S38 in FIG. 7), and The filter element material 13B is introduced (step S39 in FIG. 6 (e) and FIG. 7), and then the filter element material 13B is pre-baked to form the filter element 3B (FIG. 6 (f) and FIG. 7). Step S40). In this way, the filter element material 13 of all colors is introduced into each region 7 to form the filter element 3 (3R, 3G, 3B) which is a temporarily solidified or temporarily cured display element. A material (color filter substrate CF) is formed.

  Next, the color filter substrate CF, which is a display material configured as described above, is inspected (step S41 in FIG. 7). In this inspection, for example, the partition wall 6C and the filter element 3 as a display element are observed with the naked eye or a microscope. In this case, the color filter substrate CF may be photographed and automatically inspected based on the photographed image. If a defect is found in the filter element 3 which is a display element by this inspection, the color filter substrate CF is removed, and the process proceeds to the substrate regeneration process.

  Here, the defect of the filter element 3 means that when the filter element 3 is absent (so-called dot dropout), the filter element 3 is formed, but the amount (volume) of the material arranged in the region 7 is The filter element 3 is formed when it is inappropriate because it is too much or too little, but it may be a case where foreign matters such as dust are mixed or adhered.

  If no defect is found in the display material in the above inspection, the filter element 3 (3R, 3G, 3B) of the color filter substrate CF is completely solidified by, for example, baking (baking) at a temperature of about 200 ° C. Alternatively, it is cured (step S42 in FIG. 7). If a defect is found, it will be removed. The baking temperature can be appropriately determined depending on the composition of the filter element material 13 and the like. Further, it may be simply dried or aged in a different atmosphere (in nitrogen gas or in dry air) without heating to a particularly high temperature. Finally, as shown in FIG. 6 (f), a transparent protective layer 14 is formed on the filter element 3.

<Structure of EL light emitting panel and manufacturing method thereof>
Next, with reference to FIG. 8 and FIG. 9, the EL light emitting panel 252 and the manufacturing method thereof will be described. 8A to 8H are process cross-sectional views illustrating the manufacturing process of the EL light emitting panel 252, and FIG. 9 is a schematic flowchart illustrating the procedure of the manufacturing process of the EL light emitting panel 252.

  When the EL light emitting panel 252 is manufactured, the first electrode 201 is formed on the substrate 12 made of translucent glass or plastic as shown in FIG. In the case where the EL light emitting panel 252 is a passive matrix type, the first electrode 201 is formed in a band shape, and is an active matrix type in which an active element such as a TFD element or a TFT element (not shown) is formed on the substrate 12. The first electrode 201 is formed independently for each display dot. As a method for forming these structures, for example, a photolithography method, a vacuum deposition method, a sputtering method, a pyrosol method, or the like can be used. As a material of the first electrode 201, ITO (Indium-Tin · Oxide), tin oxide, a composite oxide of indium oxide and zinc oxide, or the like can be used.

  Next, the radiation sensitive material 6A (positive type) is applied on the first electrode 201 in the same manner as in the case of the color filter substrate (step S61 in FIG. 8B and FIG. 9). Then, radiation irradiation (exposure) processing (step S62 in FIG. 9) and development processing (step S63 in FIG. 9) are performed by the same method as described above, and as shown in FIG. Then, the liquid repellent film 6Z is formed. This radiation irradiation (exposure) process is a method in which the front surface side exposure and the back surface side exposure of the substrate 12 are performed simultaneously, and details will be described later.

  The banks 6B are formed in a lattice shape so as to separate the first electrodes 201 formed in each display dot, that is, so as to configure the EL light emitting portion formation region 7 corresponding to the display dots. Is done. Further, as in the case of the color filter substrate, it preferably has a light shielding function. In this case, it is possible to improve contrast, prevent color mixing of the light emitting material, and prevent light leakage from between the pixels. As the material of the partition wall 6B, various materials basically used for the partition wall of the color filter substrate can be used. However, in this case, in particular, it is desirable to have durability against the solvent of the EL light-emitting material described later, and further, it can be tetrafluoroethylated by fluorocarbon gas plasma treatment, for example, acrylic resin, epoxy resin, Organic materials such as photosensitive polyimide are preferred.

  Next, immediately before applying the hole injection layer material 202A as a functional liquid, the substrate 12 is subjected to continuous plasma treatment of oxygen gas and fluorocarbon gas plasma. Thereby, the polyimide surface is water-repellent, the ITO surface is hydrophilized, and the wettability on the substrate side for finely patterning droplets can be controlled. As an apparatus for generating plasma, an apparatus for generating plasma in a vacuum or an apparatus for generating plasma in the atmosphere can be used similarly. In addition to or instead of this process, the partition wall 6B is baked (baked) at about 200 ° C. (step S64 in FIG. 9). Thereby, the partition 6C is formed.

  Next, as shown in FIG. 8D, the hole injection layer material 202A is ejected in the form of droplets 8 and landed on the region 7 (step S65 in FIG. 9). This hole injection layer material 202A is obtained by liquefying a material as a hole injection layer with a solvent or the like. Thereafter, as a pre-bake treatment, the solvent is removed in a vacuum (1 torr) at room temperature for 20 minutes, and then, as shown in FIG. 8 (e), in the atmosphere, 200 ° C. (on a hot plate), 10 minutes. A hole injection layer 202 that is incompatible with the light emitting layer material is formed by heat treatment (step S66 in FIG. 9). Under the above conditions, the thickness of the hole injection layer 202 was 40 nm.

  Next, as shown in FIG. 8 (f), an R light emitting layer material and a G light emitting layer material as an EL light emitting material, which is a functional liquid, are formed on the hole injection layer 202 in each region 7. It introduce | transduces as a droplet similarly to the above (step S67 of FIG. 9). And after application | coating of these light emitting layer materials, the solvent was removed on conditions, such as room temperature and 20 minutes, in a vacuum (1 torr) as a prebaking process (step S68 of FIG. 9). Thereafter, conjugation was performed by heat treatment at 150 ° C. for 4 hours in a nitrogen atmosphere to form an R color light emitting layer 203R and a G color light emitting layer 203G (step S69 in FIG. 9). The light-emitting layer conjugated by heat treatment is insoluble in the solvent. Note that the thickness of the R light emitting layer 203R and the G light emitting layer 203G formed under the above conditions was 50 nm.

  Note that, before forming the light emitting layer, the hole injection layer 220 may be subjected to continuous plasma treatment with oxygen gas and fluorocarbon gas plasma. As a result, a fluoride layer is formed on the hole injection layer 220 and the ionization potential is increased, whereby the hole injection efficiency is increased, and an organic EL device with high light emission efficiency can be provided.

  Next, as shown in FIG. 8G, the R light emitting layer 203R and the G light emitting layer 203G are formed in the state of droplets 8 in the B color light emitting layer 203B as an EL light emitting material which is a functional liquid. 9 is introduced into the region 7 where the light emitting layer is not formed and is also superimposed on the R light emitting layer 203R and the G light emitting layer 203G (step S70 in FIG. 9). Thereafter, as a pre-bake process, the solvent is removed under conditions of vacuum (1 torr), room temperature, 20 minutes, and the like (step S71 in FIG. 9), whereby the B light emitting layer 203B is formed as shown in FIG. 8 (g). Formed. Thus, by arranging the B light emitting layer 203B so as to overlap, not only the three primary colors of R, G, and B are formed, but also the step between the R light emitting layer 203R and the G light emitting layer 203G and the bank 6C is filled. It can be flattened. Thereby, a short circuit between the upper and lower electrodes can be reliably prevented. On the other hand, by adjusting the film thickness of the B-color light-emitting layer 203B, the B-color light-emitting layer 203B functions as an electron injecting and transporting layer in the stacked structure of the R-color light-emitting layer 203R and the G-color light-emitting layer 203G. Does not emit light. As a method for forming the B color light emitting layer 203B as described above, for example, a general spin coating method can be adopted as a wet method, or a method for forming the R color light emitting layer 203R and the G color light emitting layer 203G can be adopted. A similar method can be employed.

  As an arrangement mode of the R color light emitting layer 203R, the G color light emitting layer 203G, and the B color light emitting layer 203B, a known pattern such as a stripe arrangement, a delta arrangement, or a mosaic arrangement may be appropriately used according to the required display performance. Can be used.

Next, regarding the EL light-emitting panel 252 in which the hole injection layer 202 and the R-color light-emitting layer 203R, the G-color light-emitting layer 203G, or the B-color light-emitting layer 203B are formed on each display dot as described above, a visual inspection or a microscope is used. Inspection by image or inspection by image processing or the like is performed (step S72 in FIG. 9). And this test | inspection WHEREIN: It is defective in the EL light emission part (It is comprised by the laminated body of the hole injection layer 202 and the R color light emitting layer 203R, the G color light emitting layer 203G, or the B color light emitting layer 203B) in each display dot. When a missing dot, a defective laminated structure, an excessive amount of light emitting material, a foreign substance such as dust is detected, it is excluded from the process. If no defect is found by this inspection, the counter electrode 213 is formed as shown in FIG. 8H (step S73 in FIG. 9). When the counter electrode 213 is a surface electrode, the counter electrode 213 can be formed by using a film forming method such as a vapor deposition method or a sputtering method using, for example, Mg, Ag, Al, Li, or the like as a material. In the case where the counter electrode 213 is a striped electrode, the formed electrode layer can be formed using a patterning method such as a photolithography method. Finally, as shown in FIG. 8 (h), the protective layer 214 is formed on the counter electrode 213 with an appropriate material (resin mold material, inorganic insulating film, etc.) (step S74 in FIG. 9). The target EL light emitting panel 252 is manufactured.
(First embodiment)

  Next, the main part of the first embodiment of the present invention that can be applied in the manufacturing process of the color filter substrate and EL light emitting panel described above will be described in detail. FIG. 1A is a plan view showing a structure on a substrate 12 as a base body of the first embodiment, and FIG. 1B is a cross-sectional structure taken along line BB in FIG. It is a schematic sectional drawing which shows.

  In the first embodiment, the substantially rectangular region 7 (see FIG. 1) is formed by the partition wall 6 </ b> C formed on the substrate 12.

  As shown in FIG. 1A, the partition walls 6C are arranged in a lattice pattern in the extending direction of the region 7 (X direction in the drawing) and in the adjacent direction (Y direction in the drawing). Each region 7 has a substantially rectangular shape and is surrounded by inner surfaces 6X and 6Y of the partition wall 6C. And the space | interval of a pair of partition 6C which opposes on both sides of the area | region 7 is comprised so that it may become fixed width along the longitudinal direction (illustration X direction) of the area | region 7. FIG. Area 7 is a pixel formation area. In this region 7, a liquid repellent film 6Z is disposed for each region.

  As shown in FIG. 1B, the liquid repellent film 6Z disposed in each region 7 is formed in an island region with a thickness of about 100 nm near the central portion 7a of the region 7. Moreover, the liquid repellent film 6Z is arranged so that the central portion 7a is on the center line CL (X direction and Y direction in FIG. 1A) of the region 7. Further, the liquid repellent film 6Z is not formed on the peripheral portion 7b. That is, the central portion 7a is a portion that actively retains liquid repellency, and the wettability of the central portion 7a is reduced. On the other hand, since the peripheral portion 7b is not liquid repellent, the wettability is not lowered. Moreover, the liquid repellent film 6Z is gradually thinner from the central portion 7a of the region 7 toward the peripheral portion 7b. The liquid repellent film 6Z has a hemispherical gentle curved surface. Accordingly, since the wettability is better in the peripheral portion 7b than in the central portion 7a, the droplet 8 dropped on the region 7 can flow toward the peripheral portion 7b.

  Further, when the liquid repellent film 6Z is formed in the region 7, the film thickness is set to 100 nm. However, the present invention is not limited to this. The film thickness of the liquid repellent film 6Z is more preferably in the range of 100 nm to 300 nm. For example, if the thickness of the liquid repellent film 6Z is 100 nm, the droplet 8 can smoothly flow to the periphery in the region 7. In addition, when the film thickness of the liquid repellent film 6Z is 300 nm or more, there is a risk that the droplet 8 dropped on the region 7 gets over the partition wall 6C.

  Here, in order to save the functional liquid, if the liquid repellent film 6Z is formed wide and high in the region 7, the volume of the liquid repellent film 6Z increases and the volume in the region 7 surrounded by the partition wall 6C is increased. Since the effective volume is relatively small, only a small amount of droplets 8 are required. Therefore, it is economical because functional fluid can be saved. If the size of the region 7 is changed, the size of the liquid repellent film 6Z can also be changed.

  The liquid repellent film 6Z may have a length of 60% to 70%, for example, with respect to the longitudinal direction of the region 7. If it is preferably 90%, the droplet 8 landed on the region 7 may flow to the peripheral portion 7b and further spread to the central portion 7a. Further, the liquid repellent film 6Z may be formed so as to cover, for example, a range of 20% from both ends of the region 7 in the longitudinal direction. Even if the droplet 8 that has landed on the region 7 is within this range, the functional liquid can flow to the peripheral portion 7b and then spread to the central portion 7a.

  Note that the partition wall 6C and the liquid repellent film 6Z formed so as to surround the region 7 are formed using a technique of a fine processing technique by photolithography.

  The structure on the substrate 12 is as described above, and an exposure method of the radiation sensitive material 6A when forming the partition walls 6C and the liquid repellent film 6Z will be described.

  FIG. 2A is a schematic cross-sectional view showing a method for exposing a color filter by photolithography, FIG. 2B is a schematic cross-sectional view showing an organic EL exposure method, and FIG. FIG. 2 is a schematic cross-sectional view of an EL liquid repellent film.

  A case where the radiation sensitive material 6A is a negative type will be described (in the case of a color filter).

  As shown in FIG. 2A, the mask 10 and the mask 4 are arranged facing each other with the substrate 12 coated with the radiation sensitive material 6A interposed therebetween. And the mask 10 which has the hole 10a is arrange | positioned on the surface side (radiation sensitive material 6A application surface side) of the board | substrate 12. As shown in FIG. The size of the hole 10 a of the mask 10 is the same as that of the region 7 and is the same rectangular shape as that of the region 7. And the mask 10 is arrange | positioned so that the center of the hole 10a may come on CL of the area | region 7 (X direction of Fig.1 (a), Y direction). Next, the mask 4 having the holes 4 a is disposed on the back side of the substrate 12. At this time, the mask 4 is disposed away from the thickness of the substrate 12. And the mask 4 is arrange | positioned so that the hole 4a may come on CL of the area | region 7 (X direction of FIG. 1A, Y direction). In addition, the thickness of the board | substrate 12 is 0.5 mm-0.7 mm.

  The diameter of the hole 4a formed in the mask 4 is about 5 μm. Note that the diameter of the hole 4a is not limited to about 5 μm because it is sufficient if the diameter of the hole 4a is about 5 μm or more, and conversely about 5 μm or less, as long as exposure is possible.

  The exposure method of the radiation sensitive material 6A includes a surface side exposure in which the radiation sensitive material 6A formed on the front surface side of the substrate 12 is exposed by irradiating light from the front surface side of the substrate 12, and a light from the back surface side of the substrate 12. Is exposed to the radiation sensitive material 6A and exposed, and these are performed simultaneously. This backside exposure is called backside pinhole exposure.

In the surface-side exposure of the radiation sensitive material 6A, exposure is performed by irradiating light having an energy of 20 to 30 mw / cm ² for about 5 to 6 seconds so that the light is transmitted through the hole 10a provided in the mask 10. Next, in the backside pinhole exposure of the radiation sensitive material 6A, light having an energy of 20 to 30 mw / cm ² is irradiated for about 100 seconds so that the light passes through the hole 4a provided in the mask 4; Exposure. Since the radiation sensitive material 6A is a negative type, the exposed portion is cured. Here, in back surface pinhole exposure, light is irradiated from the back surface side of the substrate 12, so light is irradiated from a distance from the substrate 12 by the thickness of the substrate 12. At this time, a light amount distribution is formed in the light irradiation area by light diffraction caused by light passing through the pinhole. Due to this light quantity distribution, the central portion 7a of the region 7 is easily exposed and the peripheral portion 7b is difficult to be exposed. Then, after these exposures, the radiation sensitive material 6A is developed (step S33 in FIG. 7), and a liquid repellent film 6Z is formed in the central portion 7a of the region 7. Then, the liquid repellent film 6Z is positively left in the region 7 by this backside pinhole exposure.

  In the present embodiment, the front side exposure and the back side pinhole exposure are performed simultaneously (step S32 in FIG. 7), but the present invention is not limited to this. For example, when the exposure cannot be performed simultaneously for some reason, the front surface side exposure and the back surface pinhole exposure may be performed separately.

  Next, the case where the radiation sensitive material 6A is a positive type will be described. In the case of an organic EL element in which a wiring pattern is formed on the back side of the substrate 12, if an attempt is made to form the lyophobic film 6 </ b> Z by exposure from the back side of the substrate 12, the optical path through which light passes is wired. Since the pattern is blocked, the radiation sensitive material 6A cannot be sufficiently exposed from the back side of the substrate 12. In such a case, a method of exposing the radiation sensitive material 6A by irradiating light from the surface side of the substrate 12 is adopted. Therefore, the radiation sensitive material 6A described above is better because the positive type is easier to expose than the negative type.

  As shown in FIG. 2B, a radiation sensitive material 6 </ b> A is formed on the substrate 12, and a mask 10 </ b> X, a mask 10 </ b> Y, and a mask 10 </ b> Z that are light shielding masks are disposed on the substrate 12. In practice, the mask 10X, the mask 10Y, and the mask 10Z are sequentially used for each exposure process (for convenience, the mask 10X, the mask 10Y, and the mask 10Z are described at the same place). The mask 10X, the mask 10Y, and the mask 10Z are formed with light shielding portions 10b having different sizes for shielding light.

  The structure on the substrate 12 is as described above, and an exposure method of the radiation sensitive material 6A (positive type) when forming the partition wall 6C and the liquid repellent film 6Z will be described. First, the partition 6C portion of the radiation sensitive material 6A is exposed. Next, three masks 10X, 10Y, and 10Z having different shapes and shapes similar to the shape of the remaining portion obtained by cutting the island-shaped liquid repellent film 6Z from the region 7 surrounded by the partition wall 6C are prepared in advance. (In this case, the shape is gradually reduced with respect to the similar shape). First, the mask 10X is disposed on the substrate 12, and the radiation sensitive material 6A is exposed by irradiating light. Next, the radiation sensitive material 6A is similarly exposed using a mask 10Y that is relatively smaller than the mask 10X. Next, the radiation sensitive material 6A is similarly exposed using a mask 10Z that is relatively smaller than the mask 10Y. In this way, the radiation-sensitive material 6A is sequentially exposed a plurality of times while gradually reducing the size of the mask 10 from the larger one (multiple exposure).

  When the predetermined number of exposures is completed, the radiation sensitive material 6A is developed. Since the radiation sensitive material 6A is a positive type, the unexposed part is cured after development, and the liquid repellent film 6Z is formed on the substrate 12. Similarly, the partition wall 6C is also formed. Further, when the liquid repellent film 6Z is formed, the three masks 10X, 10Y, and 10Z are used, but the present invention is not limited to this. For example, as long as the liquid repellent film 6Z having a shape that allows the functional liquid to easily collect at the periphery of the region 7 is obtained, the exposure may be performed by increasing the number of masks.

  As shown in FIG. 2C, the liquid repellent film 6Z formed by this multiple exposure method has a mountain shape in which the thickness of the liquid repellent film 6Z gradually decreases from the center to the periphery. It becomes.

  3A to 3C are process cross-sectional views illustrating the landing state of the droplet in more detail.

  As shown in FIG. 3A, a partition wall 6C for partitioning the region 7 and a liquid repellent film 6Z are formed on the substrate 12. When the droplet 8 is landed on the region 7, the droplet 8 flows along the hemispherical gentle curved surface of the liquid repellent film 6Z to the periphery, and accumulates between the partition wall 6C and the liquid repellent film 6Z. The droplet 8 wets and spreads in the region 7 (FIG. 3B). When the droplet 8 is further landed, the droplet 8 wets and spreads over the entire region 7 as shown in FIG.

  4A is a plan view showing a state of insufficient wetting, and FIG. 4B is a schematic cross-sectional view showing a cross-sectional structure along the line BB in FIG. In addition, since (a) and (b) in the figure are for explaining insufficient wetting, they are not directly related to the first embodiment.

  As shown in FIGS. 4A and 4B, the region 7 formed on the substrate 12 is formed so as to be surrounded by a partition wall 6C. Since the region 7 is a pixel region, it is formed in a rectangular shape. Here, the lack of wetting means that when the droplet 8 lands on the region 7, the droplet 8 tends to rise due to surface tension, and the droplet 8 tends to have a substantially spherical shape. This is a phenomenon in which the droplet 8 does not wet and spread, and an insufficiently wetted portion 7 n is generated in the peripheral portion 7 b as compared with the central portion 7 a of the region 7. It is known that the cause of the insufficient wetting is due to the shape of the region 7. That is, if the region 7 has a rectangular shape, a phenomenon of insufficient wetting is likely to occur. Moreover, when the ratio of the length of the region 7 in the longitudinal direction (X direction in FIG. 1 (a)) and the length in the short direction (Y direction in FIG. 1 (a)) is significantly different, this insufficient wetting occurs. It's easy to do. Since the size of the region 7 varies depending on the application, the ratio of the landing diameter of the droplet 8 to be dropped varies depending on the difference in size, that is, the length between the inner surface 6X and the inner surface 6Y of the region 7. When the length of the inner surface 6Y is short and the length of the inner surface 6X is long, it is necessary to further reduce the landing diameter of the droplet 8, so that the amount of injected droplets per hour is reduced. So it will lead to a decrease in productivity. In addition, when the droplet 8 lands on the region 7, the droplet 8 is difficult to spread in the region 7, so that an insufficiently wetted portion 7 n is generated and color loss can occur. Moreover, it has been difficult to eliminate this lack of wetting.

  In the region 7, display elements, that is, the filter element 3 of the color filter substrate and the hole injection layer 202 and the EL light emitting layer 203 of the EL light emitting panel 252 are formed. For this purpose, various materials are introduced into each region 7 in the form of droplets 8. In the present embodiment, inside the region 7, as shown in FIG. 1A, the dropped droplet 8 wets and spreads in the region 7 surrounded by the partition wall 6C. At this time, the dropped droplet 8 repels the liquid repellent film 6Z formed in the region 7 and preferentially flows to the lower periphery along the hemispherical gentle curved surface, and the peripheral portion 7b of the region 7 Then, the droplet 8 flows into the region 7 and the droplet 8 fills the region 7 surrounded by the partition wall 6C (FIG. 3C).

  In the first embodiment as described above, the following effects are obtained.

(1) When the droplets 8 land on the region 7, the liquid repellent film 6Z is formed in the region 7, the liquid repellent film 6Z is high in the central portion 7a, and the liquid repellent film 6Z is not formed in the peripheral portion 7b. Therefore, since the liquid repellency is low and the height of the liquid repellent film 6Z is about 100 nm and has a hemispherical curved surface, the droplet 8 is guided to the periphery along this gentle curved surface. And since the droplet 8 dripped at the area | region 7 flows toward the peripheral part 7b, generation | occurrence | production of the space | gap part (color missing part) where the droplet 8 is not satisfy | filled can be suppressed. Further, it is not necessary to apply the droplets 8 excessively, and the droplets 8 can be spread all over the area 7. Moreover, since the landing position of the droplet 8 can be aimed at the central portion 7a of the region 7 when the droplet 8 is landed on the region 7, even if the landing is caused by deviation from the target due to the flight bending, And landing at a position beyond the partition wall 6C can be suppressed. Therefore, it is possible to suppress the occurrence of color mixing that occurs when the droplet 8 crosses the partition wall 6C in the adjacent region 7. In the case of the organic EL element, since the liquid repellent film 6Z is formed in a mountain shape so that the thickness gradually decreases from the center to the peripheral edge of the region 7, the function repelled by the liquid repellent film 6Z. Since the liquid flows along the step-like slope to the periphery of the region 7, the functional liquid is repelled and hardly stays there. Further, the functional liquid tends to flow to the periphery of the region 7 along the mountain-shaped slope.
(2) If the droplet 8 can be landed on the region 7 even if the flying bend occurs, the region 8 can be obtained by using the high-density ink, which has not been able to be adopted as the droplet 8 because it causes the flight bend until now. The amount of droplets 8 used per 7 can be made small. If the amount of the droplets 8 can be reduced, the height of the partition wall 6C can be kept low, so that the substrate surface after forming the liquid repellent film 6Z (and after forming a protective film made of a transparent resin thereon) It becomes easy to flatten. Therefore, if flattening can be performed, a device with less short-circuiting or disconnection can be provided, and thus a display device with improved display quality can be obtained. Therefore, a smaller and more accurate electronic device can be provided.
(Second Embodiment)

  Next, a second embodiment of the present invention will be described. In the second embodiment, the shape of the region 7 in the first embodiment is different, and the length of the region 7 in the Y direction is shortened. That is, unlike the first embodiment, the position of the liquid repellent film 6Z is not limited to the substantially central portion. The same parts as those in the first embodiment described above and parts having the same functions are denoted by the same reference numerals and description thereof is omitted. Further, since the method for forming the liquid repellent film 6Z is the same, the description thereof is omitted.

  FIG. 5A is a plan view showing a structure on the substrate 12 as the second embodiment, and FIG. 5B shows a cross-sectional structure along the line BB in FIG. It is a schematic sectional drawing.

  As shown in FIG. 5A, the partition walls 6C are arranged in a lattice shape in the longitudinal direction (X direction in the drawing) of the region 7 and in the short direction (Y direction in the drawing). Each region 7 has a substantially rectangular shape and is surrounded by inner surfaces 6X and 6Y of the partition wall 6C. In the present embodiment, the length of the region 7 in the Y direction is relatively shorter than the length in the X direction, and the region 7 is formed to be elongated in the longitudinal direction. In each region 7, a liquid repellent film 6Z is disposed.

  As shown in FIG. 5B, the region 7 formed on the substrate 12 is surrounded by a partition wall 6C. The partition 6C is formed with a height of 1 to 3 μm. The liquid repellent film 6Z disposed in each region 7 is formed with a thickness of about 100 nm near the central portion 7a of the region 7. Moreover, the liquid repellent film 6Z is arranged so that the central portion 7a is on the center line CL (X direction and Y direction in FIG. 5A) of the region 7. Similarly to the first embodiment, the liquid repellent film 6Z is not formed on the peripheral portion 7b. That is, the central portion 7a is a portion that actively maintains liquid repellency, and the peripheral portion 7b does not impart liquid repellency. Moreover, the liquid repellent film 6Z is formed so as to gradually become thinner from the central portion 7a of the region 7 toward the peripheral portion 7b. The liquid repellent film 6Z is formed in a hemispherical shape, and its surface has a gentle convex curved surface.

  When the droplet 8 lands in the region 7, the droplet 8 flows along the semispherical gentle curved surface of the liquid repellent film 6 </ b> Z to the peripheral portion 7 b having a low height in the region 7. Moreover, since the central portion 7a is liquid repellent, the dropped droplet 8 is repelled. Then, the repelled droplet 8 flows to the peripheral portion 7b having no liquid repellency with respect to the liquid repellent film 6Z. Therefore, even if the region 7 is partitioned and formed in an elongated rectangular shape, the droplets 8 dropped on the region 7 can spread while being directed from the central portion 7a to the peripheral portion 7b. Occurrence of color mixing can be suppressed.

  In the second embodiment as described above, the following effects are obtained in addition to the same effects as those of the first embodiment described above.

  (3) Since the length of the inner surface 6Y in the Y direction of the region 7 is relatively shorter than the length in the X direction, the density becomes higher and the definition becomes higher. Therefore, since a display device with improved display quality can be obtained, a smaller and more accurate electronic device can be provided.

<Configuration of droplet discharge device>
Next, the configuration of a droplet discharge device that can be used in each of the above embodiments and modifications will be described. FIG. 10 is a schematic perspective view showing the overall configuration of the droplet discharge device IJ. FIG. 11 is a partial perspective view partially showing a main part of the droplet discharge device.

  As shown in FIG. 10, the droplet discharge device IJ includes a head unit 26 including a head 22 as an example of a droplet discharge head, a head position control device 17 that controls a head position that controls the position of the head 22, A substrate position control device 18 for controlling the position of the substrate 12, a scanning drive device 19 as a scanning drive means for scanning and moving the head 22 with respect to the substrate 12 in the scanning direction X, and the head 22 with respect to the substrate 12 in the scanning direction The feed drive device 21 that feeds in the Y direction intersecting (orthogonal) with the substrate, the substrate supply device 23 that supplies the substrate 12 to a predetermined working position in the droplet discharge device IJ, and the overall control of the droplet discharge device IJ. And a control device 24 for controlling.

  The head position control device 17, the substrate position control device 18, the scanning drive device 19, and the feed drive device 21 are installed on the base 9. Each of these devices is covered with a cover 15 as necessary.

  12A and 12B are diagrams showing a head, in which FIG. 12A is a schematic perspective view, and FIG. 12B is a diagram showing an arrangement of nozzles. For example, the head 22 has a nozzle row 28 in which a plurality of nozzles 27 are arranged as shown in FIG. The number of nozzles 27 is, for example, 180, the hole diameter of the nozzles 27 is, for example, 28 μm, and the pitch of the nozzles 27 is, for example, 141 μm (see FIG. 12B). A reference direction S shown in FIG. 12A indicates a standard scanning direction of the head 22, and an arrangement direction T indicates an arrangement direction of the nozzles 27 in the nozzle row 28.

  13A and 13B show the configuration of the main part of the head. FIG. 13A is a schematic perspective view, and FIG. 13B is a cross-sectional view. The head 22 includes a nozzle plate 29 made of stainless steel, a diaphragm 31 facing the nozzle plate 29, and a plurality of partition members 32 that join them together. A plurality of liquid material chambers 33 and liquid reservoirs 34 are formed by the partition member 32 between the nozzle plate 29 and the vibration plate 31. The liquid material chamber 33 and the liquid reservoir 34 communicate with each other through a passage 38.

  A liquid material supply hole 36 is formed in the diaphragm 31. A liquid material supply device 37 is connected to the liquid material supply hole 36. The liquid material supply device 37 supplies the liquid material M composed of one of R, G, and B, for example, R filter element material, to the liquid material supply hole 36. The liquid material M supplied in this way fills the liquid reservoir 34 and further fills the liquid material chamber 33 through the passage 38.

  The nozzle plate 29 is provided with a nozzle 27 for ejecting the liquid material M from the liquid material chamber 33 in the form of a jet. Further, a liquid material pressurizing body 39 is attached to the rear surface of the surface of the diaphragm 31 facing the liquid material chamber 33 so as to correspond to the liquid material chamber 33. As shown in FIG. 13B, the liquid material pressurizing body 39 includes a piezoelectric element 41 and a pair of electrodes 42a and 42b that sandwich the piezoelectric element 41. The piezoelectric element 41 is bent and deformed so as to protrude outward as indicated by an arrow C by energization of the electrodes 42a and 42b, thereby increasing the volume of the liquid material chamber 33. Then, the liquid material M corresponding to the increased volume flows from the liquid reservoir 34 through the passage 38 into the liquid material chamber 33.

  Thereafter, when the energization to the piezoelectric element 41 is released, both the piezoelectric element 41 and the diaphragm 31 return to the original shape, and thereby the liquid material chamber 33 also returns to the original volume. The pressure of the liquid material M is increased, and the liquid material M is ejected as droplets 8 from the nozzle 27. In addition, a liquid repellent material layer 43 made of, for example, a Ni-tetrafluoroethylene eutectoid plating layer is provided on the periphery of the nozzle 27 in order to prevent the flying of the droplet 8 and the clogging of the nozzle 27. .

  Next, the head position control device 17, the substrate position control device 18, the scanning drive device 19, the feed drive device 21, and other means arranged around the head 22 will be described with reference to FIG. To do. As shown in FIG. 11, the head position control device 17 includes an α motor 44 that rotates the head 22 attached to the head unit 26 in a plane (horizontal plane) and an axis parallel to the feed direction Y. A β motor 46 that swings and rotates, a γ motor 47 that swings and rotates the head 22 around an axis parallel to the scanning direction X, and a Z motor 48 that translates the head 22 in the vertical direction.

  The substrate position control device 18 includes a table 49 on which the substrate 12 is placed, and a θ motor 51 that rotates the table 49 in a plane (horizontal plane). Further, the scanning drive device 19 includes an X guide rail 52 extending in the scanning direction X, and an X slider 53 incorporating a pulse-driven linear motor, for example. The X slider 53 translates in the scanning direction X along the X guide rail 52 by, for example, operation of a built-in linear motor.

  Furthermore, the feed drive device 21 has a Y guide rail 54 extending in the feed direction Y, and a Y slider 56 incorporating a linear motor that is pulse-driven, for example. The Y slider 56 translates in the feed direction Y along the Y guide rail 54 by, for example, operation of a built-in linear motor.

  The linear motor that is pulse-driven in the X slider 53 and the Y slider 56 can precisely control the rotation angle of the output shaft by a pulse signal supplied to the motor. Therefore, the position of the head 22 supported by the X slider 53 in the scanning direction X and the position of the table 49 in the feed direction Y can be controlled with high accuracy. The position control of the head 22 and the table 49 is not limited to position control using a pulse motor, and can be realized by feedback control using a servo motor or any other method.

  The table 49 is provided with positioning pins 50 a and 50 b that regulate the planar position of the substrate 12. The substrate 12 is positioned and held by a substrate supply device 23, which will be described later, with the end faces on the scanning direction X side and the feeding direction Y side in contact with the positioning pins 50a and 50b. The table 49 is preferably provided with a known fixing means such as air suction (vacuum suction) for fixing the substrate 12 held in such a positioning state.

  As shown in FIG. 11, in the droplet discharge device IJ, a plurality of sets (two sets in the illustrated example) of imaging devices 91R, 91L and 92R, 92L are arranged above the table 49. Here, the imaging devices 91R, 91L and 92R, 92L show only the lens barrel in FIG. 11, and other portions and their support structures are omitted. A CCD camera or the like can be used as an imaging device as these observation means. In FIG. 10, these imaging devices are not shown.

  As shown in FIG. 10, the substrate supply device 23 includes a substrate accommodating portion 57 that accommodates the substrate 12 and a substrate transfer mechanism 58 such as a robot that conveys the substrate 12. The substrate transfer mechanism 58 includes a base 59, a lifting shaft 61 that moves up and down relative to the base 59, a first arm 62 that rotates about the lifting shaft 61, and a first arm that rotates relative to the first arm 62. It has two arms 63 and a suction pad 64 provided on the lower surface of the distal end of the second arm 63. The suction pad 64 is configured to suck and hold the substrate 12 by air suction (vacuum suction) or the like.

  Further, a capping device 76 and a cleaning device 77 are disposed under the scanning locus of the head 22 and at one side position of the feed driving device 21. Further, an electronic balance 78 is installed at the other side position of the feed driving device 21. Here, the capping device 76 is a device for preventing the nozzle 27 (see FIG. 12) from drying when the head 22 is in a standby state. The cleaning device 77 is a device for cleaning the head 22. The electronic balance 78 is a device that measures the weight of the droplets 8 of material discharged from the individual nozzles 27 in the head 22 for each nozzle. Further, a head camera 81 that moves integrally with the head 22 is attached in the vicinity of the head 22.

  The control device 24 includes a computer main body 66 that accommodates a processor, an input device 67 such as a keyboard, and a display device 68 such as a CRT. The computer main body 66 includes a CPU (Central Processing Unit) 69 shown in FIG. 14 and an information recording medium 71 that is a memory for storing various types of information.

  FIG. 14 is a block diagram of a control system of the droplet discharge device IJ. The head position control device 17, the substrate position control device 18, the scanning drive device 19, the feed drive device 21, and the head drive circuit 72 that drives the piezoelectric element 41 (see FIG. 13B) in the head 22 are as follows. As shown in FIG. 14, it is connected to the CPU 69 via the input / output interface 73 and the bus 74. Further, the substrate supply device 23, the input device 67, the display device 68, the capping device 76, the cleaning device 77, and the electronic balance 78 are also connected to the CPU 69 via the input / output interface 73 and the bus 74 as described above.

  Further, the memory 71 includes a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), a hard disk, a CD-ROM (Compact Disk Read Only Memory), a DVD (Digital Versatile Disc), an MD (Digital Versatile Disc), and an MD (Digital Versatile Disc). This is a concept including a disk-type recording medium such as an external storage device that reads data using these, and functionally, a storage that stores program software describing a control procedure of the operation of the droplet discharge device IJ An area, a storage area for storing the discharge position of the material in the substrate 12 by the head 22 as coordinate data, a storage area for storing the feed movement amount of the substrate 12 in the feed direction Y shown in FIG. CP And region functioning as a work area and a temporary file for the 69 and other various storage area is set.

  The CPU 69 performs control for discharging the material to a predetermined position on the surface of the substrate 12 in accordance with program software stored in a memory that is the information storage medium 71. As shown in FIG. 14, as a specific function realization unit, a weight using a cleaning calculation unit 151 that performs a calculation for realizing a cleaning process, a capping calculation unit 152 for realizing a capping process, and an electronic balance 78 It has a weight measurement calculation unit 153 that performs calculation for realizing measurement, and a drawing calculation unit 154 that causes a material to land on the surface of the substrate 12 by droplet discharge and draws in a predetermined pattern.

  The drawing calculation unit 154 includes a drawing start position calculation unit 155 for setting the head 22 at an initial position for drawing, and a scan for calculating control for moving the head 22 in the scanning direction X at a predetermined speed. The control calculation unit 156, the feed control calculation unit 157 that calculates control for shifting the substrate 12 in the feed direction Y by a predetermined feed movement amount, and any of the plurality of nozzles 27 in the head 22 are operated to discharge the material. Various function calculation units such as a nozzle discharge control calculation unit 158 that performs calculation for controlling whether or not to perform are provided.

  Each function described above is realized by program software using the CPU 69. However, when each function described above can be realized by an electronic circuit not using the CPU, such an electronic circuit may be used. .

  Next, the operation of the droplet discharge device IJ will be described based on the flowchart shown in FIG. When the droplet discharge device IJ is activated by turning on the power by the operator, initial setting is first realized (step S1). Specifically, the head unit 26, the substrate supply device 23, the control device 24, and the like are set in a predetermined initial state.

  Next, when the weight measurement timing arrives (step S2), the head unit 26 shown in FIG. 11 is moved to the electronic balance 78 shown in FIG. 10 by the scanning drive device 19 (step S3). And the quantity of the liquid material discharged from the nozzle 27 is measured using the electronic balance 78 (step S4). Further, the voltage applied to the piezoelectric element 41 of each nozzle 27 is adjusted in accordance with the liquid material discharge characteristic of the nozzle 27 measured in this way (step S5).

  Thereafter, when the cleaning timing comes (step S6), the head unit 26 is moved to the cleaning device 77 by the scanning drive device 19 (step S7), and the head 22 is cleaned by the cleaning device 77 (step S8). .

  When the weight measurement timing and the cleaning timing do not arrive, or when the weight measurement and the cleaning are finished, the substrate supply device 23 shown in FIG. 10 is operated to supply the substrate 12 to the table 49 in step S9. Specifically, the substrate 12 in the substrate housing portion 57 is sucked and held by the suction pad 64, the lifting shaft 61, the first arm 62, and the second arm 63 are moved to transport the substrate 12 to the table 49, and the table. It presses on the positioning pins 50a and 50b (refer FIG. 11) previously provided in 49 proper positions.

  Next, as shown in FIG. 11, the table 49 is rotated in a plane (horizontal plane) by rotating the output shaft of the θ motor 51 in units of minute angles while observing the substrate 12 with the imaging devices 91R and 91L. Then, the substrate 12 is positioned (step S10). More specifically, the alignment marks formed on the left and right ends of the substrate 12 are respectively photographed by the pair of imaging devices 91R, 91L or 92R, 92L shown in FIG. 11, and the substrate is determined according to the imaging positions of these alignment marks. 12 plane postures are obtained by calculation, and the angle θ is adjusted by rotating the table 49 in accordance with the plane postures.

  Thereafter, while observing the substrate 12 with the head camera 81 shown in FIG. 10, the position for starting drawing with the head 22 is determined by calculation (step S11). Then, the scanning drive device 19 and the feed drive device 21 are appropriately operated to move the head 22 to the drawing start position (step S12).

  At this time, the head 22 may be configured such that the reference direction S shown in FIG. 12 matches the scanning direction X, or the reference direction S is inclined with respect to the scanning direction at a predetermined angle. You may comprise. This predetermined angle is often different from the pitch of the nozzles 27 and the pitch of the position where the material should land on the surface of the substrate 12, and is arranged in the arrangement direction T when the head 22 is moved in the scanning direction X. This is a measure for making the dimensional component in the feed direction Y of the pitch of the nozzle 27 geometrically equal to the pitch of the landing position of the substrate 12 in the feed direction Y.

  When the head 22 is placed at the drawing start position in step S12 shown in FIG. 15, the head 22 is linearly scanned and moved in the scanning direction X at a constant speed (step S13). During this scanning, ink droplets are continuously ejected from the nozzles 27 of the head 22 onto the surface of the substrate 12.

  The discharge amount of the ink droplets may be set so that the entire amount is discharged within the discharge range that can be covered by the head 22 by one scan. For example, the ink droplet is originally discharged by one scan. A material that is a fraction (for example, one-fourth) of the material to be discharged is ejected, and when the head 22 is scanned a plurality of times, the scanning range partially overlaps the feed direction Y. The material may be discharged several times (for example, four times) in all regions.

  When the scanning of one line with respect to the substrate 12 is completed (step S14), the head 22 is reversed and returned to the initial position (step S15), and a predetermined amount in the feed direction Y (only the set feed movement amount). Move (step S16). Each time, scanning is performed again in step S13, and the material is discharged. Thereafter, the above operation is repeated, and scanning is performed over a plurality of lines. Here, when the scanning for one line is completed, the scanning direction may be reversed so that the scanning direction is moved in the feed direction Y as it is, reversed, and scanned in the reverse direction. .

  Here, as will be described later, the case where a plurality of color filters are formed in the substrate 12 will be described. When the discharge of the material is completed for one row of the color filter regions in the substrate 12 (step S17), the head 22 is completed. Moves in the predetermined feed direction Y and repeats the operations from step S13 to step S16 again as described above. Finally, when the discharge of the material is completed for all the color filter regions on the substrate 12 (Step S18), the processed substrate 12 is processed by the substrate supply device 23 or another unloading mechanism in Step S20. It is discharged outside. Thereafter, as long as there is no instruction from the operator to end the operation, the supply of the substrate 12 and the material discharge operation are repeated as described above. If all the CF rows have not been completed in step S18, the operation moves to the next row CF area (step S19), and the operations from step S13 to step S18 are repeated again.

  When the operator gives an instruction to end the operation (step S21), the CPU 69 conveys the head 22 to the capping device 76 in FIG. 10, and performs capping processing on the head 22 by the capping device 76 (step S22).

  The liquid droplet ejection apparatus described above can be used in the arrangement method and the manufacturing method according to the present invention. However, the present invention is not limited to this, and a liquid droplet is ejected and a predetermined landing position is expected. Any device can be used as long as it can be landed.

  In the present invention, the droplet discharge head such as the head of the droplet discharge device is moved in the longitudinal direction of the region (for example, the direction in which the longer side extends in the case of a substantially rectangular region or opening, It is preferable that a plurality of liquid droplets are sequentially ejected by scanning in a substantially strip-shaped region or an opening in the extending direction thereof.

<Display device (electro-optical device) and manufacturing method thereof>
Next, a display device (electro-optical device) and a manufacturing method thereof according to each of the above embodiments and modifications will be described. FIG. 16 is a flowchart of the display device (electro-optical device) according to the embodiment. FIG. 17 is a view showing a liquid crystal device as an example of a display device (electro-optical device) manufactured by the manufacturing method, and FIG. 18 is a cross-sectional view of the liquid crystal device along the line IX-IX in FIG. . First, the structure of the liquid crystal device will be described with reference to FIGS. This liquid crystal device is a transflective liquid crystal device that performs full-color display using a simple matrix method.

  As shown in FIG. 17, in the liquid crystal device 101, a liquid crystal driving IC 103a and a liquid crystal driving IC 103b configured as a semiconductor chip or the like are mounted on a liquid crystal panel 102, and an FPC (flexible printed circuit) 104 as a wiring connecting element is liquid crystal. It is connected to the panel 102. The liquid crystal device 101 is configured by providing an illumination device 106 as a backlight on the back side of the liquid crystal panel 102.

  The liquid crystal panel 102 is formed by bonding the first substrate 107 a and the second substrate 107 b with the sealant 108. The sealing material 108 is formed by adhering an epoxy resin to the inner surface of the first substrate 107a or the second substrate 107b in a ring shape (circular shape) by screen printing or the like, for example. In addition, as shown in FIG. 18, a conductive material 109 formed in a spherical shape or a cylindrical shape with a conductive material is included in the seal material 108 in a dispersed state.

  As shown in FIG. 18, the first substrate 107a has a plate-like substrate 111a formed of transparent glass, transparent plastic, or the like. A reflective film 112 is formed on the inner surface (upper surface in FIG. 18) of the substrate 111a. In addition, an insulating film 113 is stacked thereon, and a first electrode 114a is formed in a stripe shape (see FIG. 17) when viewed from the direction of arrow D. Further thereon, an alignment film 116a is formed. Further, a polarizing plate 117a is attached to the outer surface (the lower surface in FIG. 18) of the substrate 111a by sticking or the like.

  In FIG. 17, in order to make the arrangement of the first electrodes 114 a easy to understand, the interval between them is drawn much wider than actual. Therefore, in reality, a larger number of first electrodes 114a are formed on the substrate 111a than the number of the first electrodes 114a depicted in the drawing.

  As shown in FIG. 18, the second substrate 107b has a plate-like base material 111b formed of transparent glass, transparent plastic, or the like. A color filter 118 is formed on the inner surface (the lower surface in FIG. 18) of the base material 111b, and the second electrode 114b is formed in a stripe shape in a direction perpendicular to the first electrode 114a as viewed from the arrow D (see FIG. 18). 17). Further thereon, an alignment film 116b is formed. A polarizing plate 117b is attached to the outer surface (upper surface in FIG. 18) of the substrate 111b by sticking or the like.

  In FIG. 17, in order to make the arrangement of the second electrodes 114 b easier to understand, as in the case of the first electrodes, their intervals are drawn much wider than actual. Therefore, in reality, a larger number of first electrodes 114a are formed on the substrate 111a than the number of the first electrodes 114a depicted in the drawing.

  As shown in FIG. 18, liquid crystal L, for example, STN (super twisted nematic) liquid crystal, is sealed in a gap surrounded by the first substrate 107a, the second substrate 107b, and the sealing material 108, that is, a so-called cell gap. A large number of minute spherical spacers 119 are dispersed on the inner surface of the first substrate 107a or the second substrate 107b, and the presence of these spacers 119 in the cell gap allows the cell gap to be maintained uniformly. It has become.

  The first electrode 114a and the second electrode 114b are disposed so as to extend in directions orthogonal to each other. The portions where they intersect in a plane are arranged in a dot matrix as seen from the direction of arrow D in FIG. Each intersection in the dot matrix form one display dot. The color filter 118 is a predetermined pattern, for example, a pattern such as a stripe arrangement, a delta arrangement, or a mosaic arrangement, when each color element (filter element) of R (red), G (green), and B (blue) is viewed from the arrow D direction. It is comprised by arranging with. One display dot corresponds to each one of R, G, and B. One pixel (pixel) is configured by display dots of three colors of R, G, and B.

  By selectively turning on the display dots arranged in a matrix, images such as letters and numbers are displayed outside the second substrate 107b of the liquid crystal panel 102. The area in which the image is displayed in this way is the effective display area, and is indicated by an arrow V in FIGS.

  As shown in FIG. 18, the reflective film 112 is formed of a light reflective material such as an APC alloy or aluminum. In addition, an opening 121 is formed in the reflective film 112 at a position corresponding to each display dot that is an intersection of the first electrode 114a and the second electrode 114b. Accordingly, the openings 121 are arranged in a matrix like the display dots as viewed from the arrow D in FIG.

  The first electrode 114a and the second electrode 114b are made of, for example, ITO (indium tin oxide) which is a transparent conductive material. The alignment films 116a and 116b are formed by depositing a polyimide resin in the form of a film having a uniform thickness. When these alignment films 116a and 116b are subjected to a rubbing process, the initial alignment of liquid crystal molecules on the surfaces of the first substrate 107a and the second substrate 107b is determined.

  As shown in FIG. 17, the first substrate 107a is formed to have a larger area than the second substrate 107b, and when these substrates are bonded together by the sealant 108, the first substrate 107a is outside the second substrate 107b. It has the board | substrate overhang | projection part 107c overhanging. The substrate overhanging portion 107c is connected to the second electrode on the second substrate 107b via a lead wire 114c extending from the first electrode 114a and a conductive material 109 (see FIG. 18) existing inside the sealing material 108. Various wirings such as a lead wiring 114d that conducts to 114b, an input bump of the liquid crystal driving IC 103a, that is, a metal wiring 114e connected to the input terminal, and a metal wiring 114f connected to the input bump of the liquid crystal driving IC 103b. The wiring is formed in a predetermined pattern.

  At this time, the lead-out wiring 114c extending from the first electrode 114a and the lead-out wiring 114d energizing the second electrode 114b are formed of ITO which is the same material as those electrodes. Further, the metal wirings 114e and 114f which are wirings on the input side of the liquid crystal driving ICs 103a and 103b are formed of a metal material having a low electric resistance value, for example, an APC alloy. This APC alloy is an alloy mainly containing Ag and added with Pd and Cu, for example, an alloy having a composition of Ag: 98 wt%, Pd: 1 wt%, Cu: 1 wt%.

  The liquid crystal driving ICs 103a and 103b are mounted by being bonded to the surface of the substrate extension 107c by an ACF (anisotropic conductive film) 122. That is, in the present embodiment, a structure in which a semiconductor chip is directly mounted on a substrate, that is, a so-called COG (chip on glass) type liquid crystal panel is formed. In this COG mounting structure, the input side bumps of the liquid crystal driving ICs 103a and 103b and the metal wirings 114e and 114f are conductively connected by the conductive particles contained in the ACF 122, and the output side of the liquid crystal driving ICs 103a and 103b. The bumps and the lead wires 114c and 114d are conductively connected.

  The FPC 104 includes a flexible resin film 123, a circuit 126 including a chip component 124, and a metal wiring terminal 127 (see FIG. 17). The circuit 126 is soldered to the surface of the resin film 123 and directly mounted by other conductive connection methods. The metal wiring terminal 127 is formed of an APC alloy, Cr, Cu or other conductive material. The portion of the FPC 104 where the metal wiring terminal 127 is formed is connected to the portion of the first substrate 107a where the metal wiring 114e, 114f is formed by the ACF 122. The conductive particles contained in the ACF 122 make the metal wirings 114e and 114f on the substrate side and the metal wiring terminal 127 on the FPC side conductive.

  An external connection terminal 131 is formed at the opposite end of the FPC 104, and the external connection terminal 131 is connected to an external circuit (not shown). Then, the liquid crystal driving ICs 103a and 103b are driven based on the signal transmitted from the external circuit, the scanning signal is supplied to one of the first electrode 114a and the second electrode 114b, and the data signal is supplied to the other. Thereby, the voltage of the display dots arranged in the effective display region V is individually controlled, and as a result, the alignment of the liquid crystal L is individually controlled.

  As illustrated in FIG. 18, the lighting device 106 illustrated in FIG. 17 includes a light guide 132 made of acrylic resin, a diffusion sheet 133 provided on the light emission surface 132 b of the light guide 132, and a light guide. It has a reflective sheet 134 provided on the opposite side of the light emitting surface 132b of the body 132 and an LED (light emitting diode) 136 as a light emitting source.

  The LED 136 is supported by an LED substrate 137, and the LED substrate 137 is attached to a support portion (not shown) formed integrally with the light guide 132, for example. When the LED substrate 137 is mounted at a predetermined position of the support portion, the LED 136 is placed at a position facing the light capturing surface 132 a that is the side end surface of the light guide 132. The buffer member 138 is for buffering an impact applied to the liquid crystal panel 102, and is inserted between the liquid crystal panel 102 and the lighting device 106.

  When the LED 136 emits light, the light is taken in from the light taking-in surface 132a, guided to the inside of the light guide 132, and diffused from the light emitting surface 132b while propagating while reflecting on the reflection sheet 134 or the wall surface of the light guide 132. The light is emitted to the outside through the sheet 133 as planar light.

  In the liquid crystal device 101 described above, when external light such as sunlight and indoor light is sufficiently bright, external light is taken into the liquid crystal panel 102 from the second substrate 107b side in FIG. After being passed, the light is reflected by the reflective film 112 and supplied to the liquid crystal L again. The orientation of the liquid crystal L is controlled for each of the R, G, and B display dots by the electrodes 114a and 114b that sandwich the liquid crystal L. Accordingly, the light supplied to the liquid crystal L is modulated for each display dot, and an image such as letters and numbers is displayed outside the liquid crystal panel 102 by the light that passes through the polarizing plate 117b and the light that cannot pass through the modulation. The type is displayed.

  On the other hand, when a sufficient amount of external light cannot be obtained, the LED 136 emits light, and planar light is emitted from the light emitting surface 132 b of the light guide 132, and the light passes through the opening 121 formed in the reflective film 112. Supplied to the liquid crystal L. At this time, similarly to the reflective display, the supplied light is modulated for each display dot by the liquid crystal L whose orientation is controlled. As a result, an image is displayed to the outside, and transmissive display is performed.

  The liquid crystal device 101 having the above configuration is manufactured by, for example, a manufacturing method shown in FIG. In this manufacturing method, a series of steps P1 to P6 is a step for forming the first substrate 107a, and a series of steps P11 to P14 is a step for forming the second substrate 107b. The first substrate forming step and the second substrate forming step are usually performed independently.

  First, in the first substrate formation step, a plurality of reflective films 112 of the liquid crystal panel 102 are formed on the surface of a large-area mother original substrate formed of translucent glass, translucent plastic, or the like using a photolithography method or the like. Form. Further, an insulating film 113 is formed thereon using a well-known film forming method (process P1). Next, the first electrode 114a, the lead wirings 114c and 114d, and the metal wirings 114e and 114f are formed by using a photolithography method or the like (process P2).

  Thereafter, an alignment film 116a is formed on the first electrode 114a by coating, printing, or the like (step P3), and the alignment film 116a is rubbed to determine the initial alignment of the liquid crystal (step P4). ). Next, the sealing material 108 is formed in an annular shape by, for example, screen printing (process P5), and spherical spacers 119 are further dispersed thereon (process P6). As a result, a large-area mother first substrate having a plurality of panel patterns on the first substrate 107a of the liquid crystal panel 102 is formed.

  Next, a second substrate forming process (process P11 to process P14 in FIG. 16) is performed. First, a large mother base material formed of translucent glass or translucent plastic is prepared, and a plurality of color filters 118 of the liquid crystal panel 102 are formed on the surface (process P11). The formation process of the color filter 118 is performed using the manufacturing method shown in FIGS. 6 and 7, and the formation of the R, G, B color filter elements in the manufacturing method of the partition wall or the light shielding layer is shown in FIG. This is performed by discharging a droplet as a filter element material from the nozzle 27 of the head 22 using the droplet discharge device IJ shown.

  When the color filter 118 is formed on the mother substrate 12, that is, the mother material base material, the second electrode 114b is then formed by photolithography (process P12). Further, the alignment film 116b is formed by coating, printing, or the like (process P13). Next, a rubbing process is performed on the alignment film 116b to determine the initial alignment of the liquid crystal (process P14). As described above, a large mother second substrate having a plurality of panel patterns on the second substrate 107b of the liquid crystal panel 102 is formed.

  As described above, after the mother first substrate and the mother second substrate having a large area are formed, the mother substrates are aligned with each other with the sealant 108 interposed therebetween, that is, aligned, and then bonded to each other (process P21). As a result, an empty panel structure including a plurality of liquid crystal panel portions and not yet filled with liquid crystal is formed.

  Next, a scribe groove, that is, a dividing groove is formed at a predetermined position of the completed empty panel structure, and further, stress or heat is applied to the panel structure based on the scribe groove, or light is irradiated, etc. The substrate is divided by breaking (breaking) the method (step P22). As a result, a so-called strip-shaped empty panel structure in which the liquid crystal injection opening 110 (see FIG. 17) of the sealing material 108 of each liquid crystal panel portion is exposed to the outside is formed.

  Thereafter, liquid crystal L is injected into each liquid crystal panel portion through the exposed liquid crystal injection opening 110, and each liquid crystal injection opening 110 is sealed with a resin or the like (step P23). A normal liquid crystal injection process is performed by decompressing the inside of the liquid crystal panel portion and injecting liquid crystal by a difference between the internal and external pressures. For example, liquid crystal is stored in a storage container, the storage container storing the liquid crystal and a strip-shaped empty panel are placed in a chamber or the like, and the chamber or the like is evacuated and then the liquid crystal is stored inside the chamber. Immerse the strip-shaped empty panel in Thereafter, when the chamber is opened to atmospheric pressure, the interior of the empty panel is in a vacuum state, so that liquid crystal pressurized by atmospheric pressure is introduced into the panel through the liquid crystal injection opening. Thereafter, since the liquid crystal adheres around the liquid crystal panel structure after the liquid crystal injection, the strip-shaped panel after the liquid crystal injection process is subjected to a cleaning process in step P24.

  Thereafter, a scribe groove is formed again at a predetermined position on the strip-shaped panel after liquid crystal injection and cleaning are completed. Further, the strip-like panel is divided based on the scribe groove. As a result, the plurality of liquid crystal panels 102 are individually cut out (process P25). As shown in FIG. 17, the liquid crystal driving ICs 103a and 103b are mounted on the individual liquid crystal panels 102 thus manufactured, the lighting device 106 is mounted as a backlight, and the FPC 104 is connected to the target. The liquid crystal device 101 to be completed is completed (process P26).

  The individual filter elements 3 are not formed by one scan of the head 22, but N times (for example, three times in the illustrated examples in the first and second embodiments described above) by a plurality of scans. Alternatively, it may be formed in a predetermined film thickness by overlapping and receiving material discharge four times. In this case, even if there is a variation in the material discharge amount between the plurality of nozzles 27, it is possible to prevent a variation in film thickness between the plurality of filter elements 3, and the above-mentioned island-like color unevenness is further reduced. Therefore, the light transmission characteristics of the color filter can be made uniform in a plane.

  Further, in the liquid crystal device and the manufacturing method thereof according to the present embodiment, the filter element 3 is formed by material discharge using the head 22 by using the droplet discharge device IJ shown in FIG. There is no need to go through complicated steps such as the method using, and the material is not wasted.

  In this embodiment, a liquid crystal device and an EL device including a liquid crystal panel are described as the display device. However, as a display device including a color filter similar to the above, an electro-optical device other than the liquid crystal device, for example, It can also be applied to plasma display panels.

<Electronic equipment>
Specific examples of the electronic device of the present invention will be described.
FIG. 19 is a perspective view of the personal computer 490. FIG. 20 is a perspective view of the mobile phone 491. FIG. For example, a personal computer 490 as shown in FIG. 19 includes the display unit 300 of the above embodiment. Further, a cellular phone 491 as shown in FIG. 20 can be similarly applied. In addition, the liquid crystal device 101 is a portable telephone such as PHS (Personal / Handy / Phone / System), an electronic notebook, a pager, a POS (Point / Of / Sales) terminal, an IC card, a mini-disc player, a liquid crystal projector, an engineering work Various electronic devices such as stations (Engineering / Work / Station: EWS), word processors, televisions, viewfinder type or direct-view type video tape recorders, electronic desk calculators, car navigation devices, devices with touch panels, watches, game machines, etc. Applicable to equipment.

  The present invention has been described above with reference to preferred embodiments. However, the present invention is not limited to the above-described embodiments, and includes the following modifications and the scope in which the object of the present invention can be achieved. Thus, it can be set to any other specific structure and shape.

  (Modification 1) In the color filter manufacturing apparatus (droplet discharge apparatus) shown in FIGS. 10 and 11, the mother substrate 12 is scanned by moving the head 22 in the scanning direction X, and the mother substrate 12 is fed and driven. By moving the head 21, the feeding operation of the head 22 to the mother substrate 12 is realized, but the present invention is not limited to this. For example, on the contrary, the scanning can be executed by moving the mother substrate 12 and the feeding operation can be executed by moving the head 22. Furthermore, at least one of them is moved relatively, such as moving the mother substrate 12 without moving the head 22, or moving both of them in the opposite directions, so that the head 22 Any configuration that moves relatively along the surface can be employed.

  (Modification 2) In the present embodiment, the head having a structure for discharging the material by utilizing the bending deformation of the piezoelectric element is used, but the present invention is not limited to this, and a head having any other structure is used. Also good. For example, it is possible to use a head that discharges a material by bubbles generated by heating.

  (Modification 3) The use of the droplet discharge device IJ is not limited to the above-described color filter, liquid crystal device, and EL device. For example, FED (Field Emission Display: Field Emission Display) ) And the like, a PDP (Plasma Display Panel), an electrophoresis apparatus, that is, a material that is a functional liquid containing charged particles is discharged into the recesses between the partition walls of each pixel. A device for applying a voltage between electrodes arranged so as to sandwich the upper and lower electrodes to bring charged particles to one electrode side for display in each pixel, a thin cathode ray tube, CRT (Cathode-Ray Tube: Cathode ray tube) A device that has a substrate (base material) such as a display and forms a predetermined layer in the area above it. It can be used for various display devices having the (electro-optical device).

  (Modification 4) The apparatus or method of the present invention is a device having a substrate (base material) constituting a color filter or a display device (electro-optical device), and ejects droplets 8 onto the substrate (base material). It can use for the manufacturing process of the various devices which can use the process to do. For example, a configuration in which an optical member is formed by discharging fine microlenses formed on a base material, a configuration in which a resist to be applied on a substrate is applied only to a necessary portion, and a light-transmitting property such as plastic A structure in which a light scattering plate is formed by ejecting and forming convex portions that scatter light on a substrate or the like, a fine white pattern, and RNA (ribonucleic acid) in spike spots arranged in a matrix on a DNA (Deoxyribonucleic acid) chip : Ribonucleic acid) is ejected to prepare a fluorescently labeled probe and hybridize on the DNA chip. Samples, antibodies, DNA (Deoxyribonucleic acid: deoxyribonucleic acid) To form a biochip Also configured such as available.

  (Modification 5) The liquid crystal device 101 is also formed by forming a partition wall 6 surrounding a pixel electrode, such as an active matrix liquid crystal panel including a transistor such as a TFT or an active element of TFD in a pixel. For example, the color filter can be formed by discharging the material into the concave portion. For example, a configuration in which a color filter formed on a pixel electrode is formed as a conductive color filter by discharging a mixture of a color material and a conductive material as materials on the pixel electrode, and a spacer for maintaining a gap between substrates The present invention can be applied to any part that constitutes the electro-optical system of the liquid crystal device 101, such as a structure that discharges and forms particles.

  (Modification 6) The shape of the partition wall 6C is not limited to the rectangle shown in the first embodiment or the second embodiment. For example, it may be square. In this way, when the droplet 8 fills the entire surface of the region 7, the length in the longitudinal direction of the region 7 is equal to the length in the width direction, so that the surface tension of the droplet 8 is evenly applied to the region 7. It will be. And since the droplet 8 spreads evenly in the region 7, the same effect as the effect obtained in the first embodiment or the second embodiment can be obtained.

  (Modification 7) The method of forming the liquid repellent film 6Z in the first embodiment or the second embodiment described above is a method of forming on a glass substrate, but is not limited thereto. For example, a reflective film may be formed on a glass substrate, and the liquid repellent film 6Z may be formed on this film. Even in this case, since the liquid repellent film 6Z is present in the region 7, the same effect as that obtained in the first embodiment or the second embodiment can be obtained.

  (Modification 8) The method of forming the liquid repellent film 6Z in the first embodiment or the second embodiment described above is a method of forming on the glass substrate, but is not limited thereto. For example, a transparent resin film may be formed on a glass substrate, and the liquid repellent film 6Z may be formed on this film. Even in this case, since the liquid repellent film 6Z is present in the region 7, the same effect as that obtained in the first embodiment or the second embodiment can be obtained.

  (Modification 9) In the above embodiment, the functional liquid after landing on the substrate is solidified by drying and baking (baking), but the solidification method is not limited to this. For example, a solidification method in which a functional liquid mixed with a radiation curable resin is used as the functional liquid of the display element, and the functional liquid after landing is irradiated with radiation to be cured may be employed. Although radiation includes X-rays, ultraviolet rays, electron beams, etc., it is preferable to use ultraviolet rays from the viewpoint of cost and convenience.

  (Modification 10) In the above-described embodiment, the island-shaped liquid repellent film 6Z is formed to be scattered in one area in one area, but the present invention is not limited to this. For example, a plurality of liquid repellent films 6Z can be formed. Even in this case, since the liquid repellent film 6Z is present in the region 7, the same effect as that obtained in the first embodiment or the second embodiment can be obtained.

  (Modification 11) In the embodiment, the hemispherical liquid repellent film 6Z having a convex shape is formed, but the invention is not limited to this. For example, the liquid repellent film 6Z may be flat. Even in this case, since the liquid repellent film 6Z is present in the region 7, the same effect as that obtained in the first embodiment or the second embodiment can be obtained.

  (Modification 12) In the embodiment, the mountain-shaped liquid repellent film 6Z having a convex shape is formed, but the invention is not limited to this. For example, the liquid repellent film 6Z may be flat. Even in this case, since the liquid repellent film 6Z is present in the region 7, the same effect as that obtained in the first embodiment or the second embodiment can be obtained.

  (Modification 13) Although the liquid repellent film 6Z is formed in the island-shaped region of the region 7 in the above embodiment, the present invention is not limited to this. For example, the lyophobic film 6Z is formed on a film having lyophilicity, the lyophobic film 6Z is formed on a film having no lyophilicity, or relatively low repellency with respect to a film having high lyophobicity. A liquid repellent film 6Z having liquid properties may be formed. Even in this case, since the liquid repellent film 6Z is present in the region 7, the same effect as that obtained in the first embodiment or the second embodiment can be obtained.

  (Technical idea) A step of manufacturing a color filter as a substrate by the method of manufacturing a substrate according to any one of claims 1 to 3, and a liquid crystal sandwiched between the color filter and the TFT array substrate A method for manufacturing an electro-optical device (liquid crystal display device), comprising: a step of bonding to a state; and a step of mounting a driver component on the TFT array substrate.

  With such a configuration, an electro-optical device having a color filter with improved display quality can be provided.

It is the figure which showed the structure of the board | substrate of 1st Embodiment, (a) is a top view, (b) is a schematic sectional drawing which shows the cross-section along the BB line in (a). (A) is schematic sectional drawing which shows the exposure method of a color filter, (b) is a schematic sectional drawing which shows the exposure method of organic EL, (c) is the liquid repellent film of organic EL after exposure. FIG. (A)-(c) is process sectional drawing which shows the landing state of a droplet in detail. It is the figure which showed the state of insufficient wetting, (a) is a top view, (b) is a schematic sectional drawing which shows the cross-section along the BB line in (a). It is a figure which shows the structure of the board | substrate of 2nd Embodiment, (a) is a top view, (b) is a schematic sectional drawing which shows the cross-sectional structure along the BB line in (a). (A)-(f) is process sectional drawing which shows the manufacturing process of a color filter substrate. The schematic flowchart which shows the procedure of the manufacturing process of a color filter board | substrate. (A)-(h) is process sectional drawing which shows the manufacturing process of EL light emission panel. The schematic flowchart which shows the procedure of the manufacturing process of EL light emission panel. FIG. 2 is a schematic perspective view showing an overall configuration of a droplet discharge device. The fragmentary perspective view which shows the principal part of a droplet discharge apparatus partially. It is a figure which shows a head, (a) is a schematic perspective view, (b) is a figure which shows the arrangement | sequence of a nozzle. It is a figure which shows the principal part of a head partially, (a) is a schematic perspective view, (b) is a schematic sectional drawing. The block diagram of the control system of a droplet discharge apparatus. 3 is a schematic flowchart showing an operation procedure of the droplet discharge device. 6 is a flowchart of a display device (electro-optical device) according to the embodiment. FIG. 6 is a diagram showing a liquid crystal device as an example of a display device (electro-optical device) manufactured by the manufacturing method. FIG. 18 is a cross-sectional view of the liquid crystal device along the line IX-IX in FIG. 17. The perspective view of a personal computer. The perspective view of a mobile telephone.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Color filter as a board | substrate, 3 (3R, 3G, 3B) ... Filter element as a display element and a display layer, 4 ... Back side exposure mask, 4a ... Hole (pinhole) for exposure of a back side exposure mask 6A ... radiation sensitive material, 6 (6B, 6C) ... partition wall, 6 (6X, 6Y) ... inner surface, 6Z ... liquid repellent film, 7 ... region, 7a ... central portion of the region, 7b ... peripheral portion of the region, 7n: insufficiently wetted portion, 8 ... droplet, 10 ... surface side exposure mask, 10a ... hole for exposure of the surface side exposure mask, 10b ... light shielding portion, 10 (10X, 10Y, 10Z) ... light shielding mask, 12 ... Substrate as substrate, 22 ... head, 27 ... nozzle, 101 ... liquid crystal device as display device, 102 ... liquid crystal panel, 202 ... hole injection layer constituting display element, 203 ... EL light emitting layer, 252 ... as display device EL table Apparatus, 300 ... display unit having a display device, 490 ... personal computer as an electronic device, 491 ... mobile phone as an electronic device, the center line showing the center of the CL ... area, IJ ... droplet discharge device.

Claims (8)

A method of manufacturing a substrate having a partition wall that partitions a predetermined region on a substrate,
Forming a partition for partitioning the predetermined region on the substrate;
Forming a liquid repellent film having a convex shape in a part of the predetermined region;
Applying a functional liquid to the predetermined region;
A method for manufacturing a substrate, comprising: In the manufacturing method of the board | substrate of Claim 1,
In the step of forming the liquid repellent film,
Forming a negative-type radiation-sensitive material film having liquid repellency in the predetermined region;
A mask provided with a pinhole is disposed on the surface of the base opposite to the partition wall, at a position corresponding to the substantially central portion of the predetermined region, and light is applied so as to pass through the pinhole. A process of exposing a film of negative radiation sensitive material;
Developing the negative radiation sensitive material film after the exposure;
A method for manufacturing a substrate, comprising: In the manufacturing method of the board | substrate of Claim 1,
In the step of forming the liquid repellent film,
Forming a positive radiation-sensitive material film having liquid repellency in the predetermined region;
A step of exposing a film of a positive-type radiation-sensitive material by irradiating light on the surface on the partition side of the substrate at a position corresponding to a substantially central portion of the predetermined region; and
Developing the film of the positive-type radiation-sensitive material after the exposure;
A method for manufacturing a substrate, comprising: In the manufacturing method of the board | substrate of Claim 3,
In the step of forming the liquid repellent film, the liquid repellent film is formed by exposing a plurality of times to form the substrate. A substrate;
A partition formed so as to partition a predetermined region on the substrate;
A convex liquid repellent film formed in a part of the predetermined region;
A display layer disposed in the predetermined region and formed by solidifying the functional liquid;
A substrate characterized by comprising: The substrate according to claim 5, wherein
A substrate characterized in that the liquid repellent film has a height in the range of 100 nm to 300 nm.   An electro-optical device comprising the substrate according to claim 5.   An electronic apparatus comprising the electro-optical device according to claim 7.

Images