JP4505674B2 - Pattern inspection method - Google Patents

Description

The present invention relates to an inspection method for obtaining, for example, a circuit pattern image of a semiconductor wafer, and more particularly to a pattern inspection method capable of inspecting the entire sample and a local portion.

  With the recent high integration of LSIs, the defect detection sensitivity required for samples such as wafers and masks has become even higher. For example, when detecting a defective portion with respect to a wafer pattern having a pattern size of 0.25 μm of DRAM, a detection sensitivity of 0.1 μm is required. In addition, there is an increasing demand for an inspection apparatus that satisfies both high detection sensitivity and high detection speed. In order to meet these requirements, surface inspection apparatuses using electron beams have been developed.

  For example, as described in Japanese Patent Application Laid-Open No. 7-249393, a pattern inspection apparatus that forms a beam cross-sectional shape into a rectangular shape or an elliptical shape using a rectangular cathode and a quadrupole lens is known. This pattern inspection apparatus does not scan the sample surface by focusing the electron beam in a spot shape as in a conventional scanning electron microscope, but scans with a rectangular beam having a certain rectangular beam irradiation region. The sample surface can be scanned in a short time, and the detection speed can be increased.

  However, the rectangular beam has a problem in that the beam amount (current density) irradiated per unit area is reduced and the contrast of the detected image is reduced because the beam irradiation area is wider than the spot beam.

  Therefore, the present applicant has proposed a pattern inspection apparatus that solves this problem in Japanese Patent Application No. 9-1178.

FIG. 12 is a diagram for explaining this pattern inspection apparatus.

In FIG. 12 , the pattern inspection apparatus has a primary column 51, a stage 52, and a secondary column 53. A stage 52 is disposed directly below the primary column 51, and a material 54 is placed on the stage 52. A secondary column 53 is disposed obliquely at a position where secondary electrons generated from the sample 54 are detected.

  An electron gun 55 is disposed inside the primary column 51, and a primary optical system 56 is disposed on the optical axis of the electron beam emitted from the electron gun 55.

  Inside the secondary column 53, a cathode lens 57 and a secondary optical system 58 are disposed on the optical axis of the secondary beam from the sample. Further, a detector 59 is disposed at a position where the secondary beam is focused via the secondary optical system 58. The detector 59 has a TDI (Time Delay Integration) array CCD sensor, and a photoelectric signal is input to the CPU 61 via the CCD camera drive controller 60.

  The CPU 61 outputs control signals to the primary column control unit 62, the secondary column control unit 63, and the stage drive mechanism 64. The primary column control unit 62 performs lens voltage control for the primary optical system 56, and the secondary column control unit 63 performs lens voltage control for the cathode lens 57 and the secondary optical system 58. The stage drive mechanism 64 drives the stage 52 in the XY directions.

  Further, the position information of the stage 52 is input to the CCD camera drive controller 60 via the laser interferometer unit 65.

  Next, the operation of this pattern inspection apparatus will be described.

  An electron beam (primary beam) is irradiated from the electron gun 55 in the primary column 51. The primary beam is irradiated onto the sample surface after the beam cross section is formed into a rectangular or elliptical shape by the primary optical system 56. At that time, the beam irradiation region has a rectangular or elliptical shape having a certain area.

  When the sample 54 is irradiated with a beam, secondary electrons (secondary beam) are generated from the beam irradiation region. The secondary beam is focused by the cathode lens 57 and the secondary optical system 58, and magnified and projected on the detection surface of the detector 59 at a predetermined magnification.

  The detector 59 converts the secondary beam into an optical signal, which is further photoelectrically converted by the TDI array CCD sensor to generate an image signal. The imaging operation of this TDI array CCD sensor will be described later.

  The CCD camera drive control unit 60 takes out an image signal from the detector 59 and outputs it to the CPU 61. Thereafter, the stage 52 is driven in the XY directions, an electron beam is irradiated to a predetermined portion of the sample, and image detection is repeated.

Here will be described with reference to FIG. 13 for the imaging operation of the TDI array CCD sensor is a characteristic point of the pattern inspection apparatus.

As shown in FIG. 13 (1), the electron beam is irradiated to a predetermined portion of the specimen 54. At this time, in the TDI array CCD sensor, as shown in FIG. 13B, signal charges are accumulated in the horizontal scanning line A corresponding to the portion irradiated with the electron beam. Next, the CPU 61 moves the stage 52 and the sample 54 in the Y direction by one horizontal scanning line at a predetermined timing as shown in FIG. At the same time, the CCD camera drive control unit 60 transfers the signal charge accumulated in the line A to the line B. Therefore, as shown in FIG. 13 (4), the signal charge accumulated at the previous time and the signal charge obtained at the current imaging are added to the line B and accumulated.

As shown in FIG. 13 (5), the CPU 61 further moves the stage 52 and the sample 54 by one horizontal scanning line. At the same time, CCD camera drive control unit 60, as shown in FIG. 13 (6), the signal charges of the line A to line B, and transfers the signal charges of the line B to the line C. Therefore, the signal charges obtained at the time of imaging at the previous time, the previous time, and the current time are added to the line C and accumulated.

  If the above operations are repeated, the signal charges at the same location of the sample can be added and accumulated by the number of horizontal scanning lines. That is, the TDI array CCD sensor can increase the signal charge of the same portion of the sample by cumulative addition by repeatedly performing imaging while delaying the signal charge. Thereby, the current density of the sample can be increased, and the S / N of the detected image can be improved.

  However, although the above-described pattern inspection apparatus is suitable for detecting a wide range of images such as the entire sample, the following adverse effects can be considered when detecting a local region of the sample.

  For example, as the sample detection area becomes smaller, the stage operating range becomes relatively smaller. This means that high-precision and stable control is required for all operations such as stage alignment operation, movement operation, and stop operation. In order to detect a smaller local area, further stage control is required. Accuracy is required.

  Further, since the stage repeats the movement stop operation, vibration (hunting) occurs in the stage. At this time, since the local region of the sample is enlarged and projected, even a slight hunting appears as noise in the detection image, and there is a problem that the S / N is lowered.

Therefore, in order to solve the above-described problems, the present invention automatically observes a defective portion of a pattern by observing a sample from a wide area to a local area with high accuracy regardless of the accuracy of stage control. An object of the present invention is to provide a pattern inspection method that can be detected .

FIG. 1 is a principle block diagram showing an example of an apparatus for carrying out the present invention.

As an apparatus for carrying out the present invention, a stage 1 on which a specimen is mounted and driven, an irradiation means 2 for irradiating an electron beam onto the specimen placed on the stage 1, and an electron beam irradiation are generated from the specimen. At least one of secondary electrons, reflected electrons, and backscattered electrons is projected as a secondary beam to generate image information of the sample, stage driving means 4 for driving the stage 1, and secondary The electron detector 3 includes a fluorescent unit 6 that converts the secondary beam into light, a TDI array CCD sensor 7 that photoelectrically converts the light and accumulates the converted charges. , And a control unit 8 for shifting charges accumulated in the TDI array CCD sensor 7 . In this apparatus, the projection position of the secondary beam projected on the electron detection means 3 is changed by the movement of the sample by the stage driving means, and the control unit 8 is accumulated in the TDI array CCD sensor 7 according to the change. The stage 8 scan mode for shifting the electric charge and the projection position of the secondary beam projected onto the electron detection means 3 by the deflection means 5 fluctuate, and the control unit 8 accumulates in the TDI array CCD sensor 7 according to the fluctuation. and it possesses a deflector scan mode for shifting the charges.

FIG. 2 is a block diagram of the principle when the function shown in FIG. 1 is added to the apparatus shown in FIG. 1 for detecting a defect location from image information of the sample generated by the electron detection means.

In this case, in the stage scanning mode or deflectors scan mode, it is configured to include a defect detection means 9 for detecting a defective portion from the image information of the sample generated by the electron detecting means 3.

(Function)
The present invention has a stage scanning mode and a deflector scanning mode.

  In the stage scanning mode, the stage 1 and the sample placed thereon are imaged while being continuously moved, and charges are accumulated in the TDI array CCD sensor 7. At this time, the charge accumulated in the TDI array CCD sensor 7 is shifted (transferred) in accordance with the movement of the sample.

On the other hand, in the deflector scanning mode, the image of the secondary beam projected on the electron detector 3 is moved by using the deflector 5 while the sample is irradiated with the electron beam, and the TDI array CCD is picked up. Charge is accumulated in the sensor 7. Thereby, the same state as the state which imaged, moving a sample is implement | achieved. At this time, the charge accumulated in the TDI array CCD sensor 7 is shifted in accordance with the change in the projection position of the secondary beam.

Further, when the defect detection unit 9 is provided , the defect detection unit 9 detects a defect location from the sample image information by, for example, template pattern matching.

At this time, first, a defect portion of the entire sample may be searched in the stage scanning mode, and then each defective portion may be observed in detail in the deflector scanning mode.

In the present invention, by driving the stage, having a stage scanning mode the electron beam scans the sample, by moving the projection position of the secondary beams by using a deflecting means and a deflector scan mode for capturing Yes. Therefore, when the inspection target area is large, an image is detected at high speed using the stage scanning mode. When the inspection target area is small, the deflector scanning mode is used to achieve high sensitivity and high image quality. Image detection can be performed. In particular, the image detection of the local area needed to control the stage with high accuracy and stability, but by using the deflector scanning mode, complicated and advanced control of such a stage becomes unnecessary. It is possible to cope with detection of an extremely narrow area.

The stage scanning mode is suitable for detecting defects in the entire sample. On the other hand , the deflector scanning mode is suitable for detecting defects in a local region of a sample. Therefore, by using the two modes in combination, it is possible to detect a defective portion of the image at high speed and with high accuracy.

In this way, according to the present invention, it is not necessary to control the stage drive with high accuracy, and since it is possible to avoid a decrease in S / N due to stage vibration, the reliability of inspection can be improved. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is an overall configuration diagram of the present embodiment. FIG. 4 is a diagram showing the configuration of the detector 36. Further, FIG. 5 is a diagram showing the trajectory of the primary beam, and FIG. 6 is a diagram showing the trajectory of the secondary beam .

  In FIG. 3, the pattern inspection apparatus has a primary column 21, a secondary column 22, and a chamber 23.

  A primary column 21 is obliquely connected to the side surface of the secondary column 22, and a chamber 23 is disposed below the secondary column 22.

  An electron gun 24 is provided inside the primary column 21, and a primary optical system 25 is disposed on the optical axis of the electron beam (primary beam) emitted from the electron gun 24. A Wien filter 29 inside the secondary column 22 is arranged obliquely with respect to the optical axis.

  On the other hand, a stage 26 is installed inside the chamber 23, and a sample 27 is placed on the stage 26.

  Further, inside the secondary column 22, a cathode lens 28, a Wien filter 29, a numerical aperture 30, a first lens 31, a field aperture 32, and a second lens are arranged on the optical axis of the secondary beam generated from the sample 27. 33, a third lens 34, a deflector 35 and a detector 36 are arranged.

  In FIG. 4, a detector 36 includes a first MCP (microchannel plate) 45a, a second MCP 45b, a FOP (fiber optic plate) 47 coated with a phosphor screen 46, and a CCD equipped with a TDI array CCD sensor. And a camera 48.

  The input / output terminal of the detector 36 is connected to the input / output terminal of the CCD camera drive control unit 37, and the output of the CCD camera drive control unit 37 is input to the CRT 39 via the CPU 38.

  Further, the CPU 38 outputs control signals to the primary column control unit 40, the secondary column control unit 41, the deflection drive control unit 42, and the stage drive mechanism 43.

  The primary column control unit 40 controls the lens voltage of the primary optical system 25, and the secondary column control unit 41 controls the lens voltages of the cathode lens 28, the first lens 31, the second lens 33, and the third lens 34. The deflection drive control unit 42 controls the voltage applied to the deflector 35, and the stage drive mechanism 43 controls the drive of the stage 26 in the XY directions.

  The CCD camera drive control unit 37 receives a control signal from the laser interferometer unit 44 and a control signal from the deflection drive control unit 42.

  Further, the primary column 21, the secondary column 22, and the chamber 23 are connected to an evacuation system (not shown), and are evacuated by a turbo pump of the evacuation system, and the inside is maintained in a vacuum state.

  As shown in FIG. 5, the primary beam from the electron gun 24 receives a lens action by the primary optical system 25 and enters the Wien filter 29.

Here, LaB ₆ which can take out a large current with a rectangular cathode is used as the tip of the electron gun. The primary optical system 25 uses a quadrupole or octupole electrostatic lens that is asymmetric about the rotation axis. This lens can cause focusing and divergence in the X-axis and Y-axis in the same manner as a so-called cylindrical lens. By constructing this lens in two stages and optimizing each lens condition, the beam irradiation area on the sample surface can be formed into an arbitrary rectangular shape or elliptical shape without losing irradiation electrons. .

  When the primary beam enters the Wien filter 29, the trajectory is bent by the deflection action of the Wien filter 29. The Wien filter 29 orthogonally crosses the magnetic field and the electric field, and when the electric field is E, the magnetic field is B, and the speed of the charged particles is v, only the charged particles satisfying the Wien condition of E = vB travel straight. Bend the trajectory. As shown in FIG. 7, for the primary beam, a force FB caused by a magnetic field and a force FE caused by an electric field are generated, and the beam trajectory is bent. On the other hand, since the force FB and the force FE work in opposite directions with respect to the secondary beam, they cancel each other and the secondary beam goes straight as it is.

  The primary beam that has passed through the cathode lens 28 irradiates the sample 27 perpendicularly. Here, the irradiation region of the primary beam irradiated on the sample 27 is rectangular. From the entire beam irradiation region of the sample 27, secondary electrons, reflected electrons, or backscattered electrons are generated as secondary beams. That is, this secondary beam has rectangular two-dimensional image information. Furthermore, since the primary beam irradiates the sample 27 perpendicularly, the secondary beam has a clear electron image without a shadow.

  The secondary beam passes through the lens and is incident on the Wien filter 29 while receiving the lens action of the cathode lens 28.

  Incidentally, the cathode lens 28 is composed of three electrodes. The lowermost electrode forms a positive electric field with respect to the secondary beam between the potential on the sample 27 side, draws electrons (particularly, secondary electrons with small directivity), and efficiently enters the lens. Designed to guide. The lens action is performed by applying a voltage to the first and second electrodes from the bottom of the cathode lens 28 to bring the third electrode to zero potential.

  The secondary beam that has passed through the cathode lens 28 goes straight without passing through the deflection action of the Wien filter 29 and passes through the numerical aperture 30. Note that by changing the electromagnetic field applied to the Wien filter 29, only electrons having a specific energy (for example, secondary electrons, reflected electrons, or backscattered electrons) can be guided to the detector 36 from the secondary beam. it can.

  The numerical aperture 30 corresponds to an aperture stop and plays a role of suppressing lens aberrations of the first lens 31, the second lens 33, and the third lens 34 with respect to the secondary beam.

  By the way, if the secondary beam is imaged only by the cathode lens 28, the lens action becomes strong and aberration is likely to occur. Therefore, as shown in FIG. 6, one image formation is performed together with the first lens 31. The secondary beam obtains an intermediate image on the field aperture 32 by the cathode lens 28 and the first lens 31.

  In this case, since the magnification magnification necessary for the secondary optical system is usually insufficient, the second lens 33 and the third lens 34 are added as lenses for enlarging the intermediate image. The secondary beam is enlarged and imaged by the second lens 33 and the third lens 34, and is imaged twice in total.

  The first lens 31, the second lens 33, and the third lens 34 are all rotational axis symmetric lenses called unipotential lenses or Einzel lenses. Each lens has a configuration of three electrodes. Usually, the outer two electrodes are set to zero potential, and the lens action is performed with a voltage applied to the center electrode.

  In addition, a field aperture 32 is arranged at an intermediate image formation point, and this field aperture 32 limits the field of view to a necessary range as in the field stop of an optical microscope. At the same time, in the case of an electron beam, unnecessary electrons scattered in the apparatus are blocked together with the second lens 33 and the third lens 34 in the subsequent stage to prevent the detector 36 from being charged up or contaminated. The magnification is set by changing the lens condition (focal length) of the second lens 33 and the third lens 34.

  The secondary beam passes through the deflector 35 and forms an image on the detection surface of the detector 36. At this time, the secondary beam is not deflected by the deflector 35.

  As shown in FIG. 4, the secondary beam is incident on the first MCP 45a. The secondary beam collides with the phosphor screen 46 via the second MCP 45b while amplifying the amount of current in the first MCP 45a. At that time, the potential at the entrance of the first MCP 45a is adjusted to set the acceleration voltage of the secondary beam to the best value of the MCP detection efficiency.

  For example, when the acceleration voltage of the secondary beam is +5 kV, the electric potential at the entrance of the first MCP 45 a is set to −4.5 kV to decelerate the electron energy to about 0.5 keV.

The current amplification factor of the secondary beam is defined by a voltage applied between the first MCP 45a and the second MCP 45b. For example, when 1 kV is applied, an amplification factor of 1 × 10 ⁴ is obtained. In addition, a voltage of about 4 kV is applied between the second MCP 45b and the phosphor screen 46 in order to suppress the expansion of the secondary beam output from the second MCP 45b as much as possible.

  The fluorescent screen 46 converts electrons into an optical image, and the optical image passes through the FOP 47 and is picked up by the CCD camera 48. Here, in order to match the image size on the fluorescent screen 46 and the image pickup size of the CCD camera 48, the image is projected by being reduced to about ３ by the FOP 47.

  The optical image is photoelectrically converted by the TDI array CCD sensor of the CCD camera 48, and signal charges are accumulated in the TDI array CCD sensor. The CCD camera drive control unit 37 reads image information serially from the TDI array CCD sensor and outputs it to the CPU 38. The CPU 38 displays the detected image on the CRT 39.

Next, will be described with reference to the drawings the stage scanning mode and deflector scan mode is a feature point on the operation of this embodiment. FIG. 8 is a flowchart for explaining the operation of detecting a defective portion.

(Stage scan mode)
As shown in FIG. 9, when a semiconductor wafer is used as a sample, raster scanning is performed to detect an image of the entire chip surface. At this time, the primary beam irradiates a fixed position, and the stage 26 is driven to scan the beam on the sample surface.

  The sample placed on the stage 26 is moved in the Y direction at a constant speed by the CPU 38 and the stage drive mechanism 43.

  Here, the area from (X1, Y1) to (X512, Y256) is set as the inspection target area. The TDI array CCD sensor has, for example, 512 × 256 pixels, and the inspection target area is projected so as to be compatible with the TDI array CCD sensor.

  Now, images from (X1, Y1) to (X512, Y1) of the inspection target area are picked up by the TDI array CCD sensor. The signal charge is accumulated in ROW1 of the TDI array CCD sensor shown in FIG. When the stage 26 moves in the Y direction in accordance with an instruction from the CPU 38, the beam irradiation area moves in the scanning direction by one horizontal scanning line corresponding to the TDI array CCD sensor. At the same time, the laser interferometer unit 44 sends a vertical clock signal to the CCD camera drive control unit 37.

  When the vertical clock signal is input, the CCD camera drive control unit 37 sends a transfer pulse to transfer the signal charge accumulated in ROW1 to ROW2. In ROW2, images from (X1, Y1) to (X512, Y1) are captured and signal charges are accumulated. At this time, the signal charges transferred from ROW1 are added and accumulated. In ROW1, images from (X1, Y2) to (X512, Y2) are taken and signal charges are accumulated.

  As described above, the primary beam scans the inspection target area by sequentially driving the stage 26 in the Y direction. Then, the stored charges are sequentially transferred to adjacent ROWs according to the stage drive.

  When images from (X1, Y256) to (X512, Y256) of the inspection target area are captured and accumulated in ROW1 of the TDI array CCD sensor, images from (X1, Y1) to (X512, Y1) The accumulated number of horizontal scanning lines is added and accumulated in the ROW 256 of the TDI array CCD sensor.

  In this state, when a transfer pulse is input to the TDI array CCD sensor, the signal charge accumulated in the ROW 256 is transferred to the CCD shift register via a transfer gate (not shown), and the CCD camera drive control unit 37 is controlled. To the CPU 38.

  Thus, by sequentially driving the stage 26, the primary beam scans the sample, and the sample image is taken out from the TDI array CCD sensor one horizontal scanning line at a time.

  The above operation is performed on the entire surface of the chip, and an image of the entire surface of the chip is acquired (step S1 in FIG. 8).

  When the image of the entire surface of the chip is acquired, the CPU 38 specifies a defective portion by template matching with a template image created in advance based on the design data. Specifically, the CPU 38 performs noise reduction by a smoothing process using an edge-preserving smoothing filter, and then obtains a cross-correlation coefficient between the template image and the detected image, so that a non-matching portion, that is, a defective portion. Is specified (step S2 in FIG. 8). The CPU 38 stores the address of the defective part in the internal memory.

(Deflector scanning mode)
Next, a deflector scanning mode for enlarging and displaying a defective portion when there is a defective portion (step S3 in FIG. 8) will be described.

  The CPU 38 drives the stage 26 via the stage driving mechanism 43, aligns the position with the defective portion (step S4 in FIG. 8), changes the focal length of the second lens 33 and the third lens 34, and enlarges the defective portion. indicate.

  As shown in FIG. 11 (1), the images from (X1, Y1) to (X512, Y1) in the inspection target area of the defective part are imaged and stored in ROW1 of the TDI array CCD sensor in FIG.

  The CPU 38 calculates a voltage value to be applied to the deflector 35 based on the set enlargement magnification, and outputs a control signal to the deflection drive control unit 42. The deflection drive control unit 42 controls the voltage applied to the deflector 35 according to the control signal from the CPU 38, and projects the secondary beam projected on the detection surface of the detector 36 as shown in FIG. The position is moved while being deflected by one horizontal scanning line.

  At the same time, the deflection drive controller 42 sends a vertical clock signal to the CCD camera drive controller 37. The CCD camera drive control unit 37 sends a transfer pulse and transfers the signal charge accumulated in ROW1 to ROW2.

  In ROW2, images from (X1, Y1) to (X512, Y1) are captured and signal charges are accumulated. At this time, the signal charges transferred from ROW1 are added and accumulated. In ROW1, images from (X1, Y2) to (X512, Y2) are taken and signal charges are accumulated.

  As described above, the inspection target area is scanned by sequentially moving the projection position of the secondary beam by the deflector 35. At this time, the accumulated signal charges are sequentially transferred to adjacent ROWs according to the projection position of the secondary beam.

  When an image from (X1, Y256) to (X512, Y256) of the inspection target area is captured and accumulated in ROW1 of the TDI array CCD sensor, images from (X1, Y1) to (X512, Y1) The number of horizontal scanning lines is added and stored in the ROW 256 of the TDI array CCD sensor.

  In this state, when a transfer pulse is input, the signal charge accumulated in the ROW 256 is transferred to the CCD shift register via a transfer gate (not shown), and to the CPU 38 via the CCD camera drive control unit 37. Is output.

  In this way, by sequentially moving the projection position of the secondary beam by the deflector 35, the sample image is taken out from the TDI array CCD sensor one horizontal scanning line at a time, and the CPU 38 can acquire an image of the defective portion. Yes (step S5 in FIG. 8).

  The above operation is performed on all defective portions, images of the defective portions are sequentially acquired, and repeated until the image file is stored in the recording medium (step S6 in FIG. 8).

  As described above, in the pattern inspection apparatus of this embodiment, the stage 26 is driven to perform beam scanning on the entire surface of the chip, and an image is picked up by the TDI array CCD sensor to detect a defective portion. On the other hand, the sample is scanned for the defective portion by moving the projection position of the secondary beam by the deflector 35.

Therefore, the stage scanning mode is used for image detection on the entire surface of the sample, and the deflector scanning mode is used for the local region of the sample, so that the defect pattern detection of the sample can be performed at high speed and with high accuracy. .

  In particular, in the local region, the stage 26 is not driven to take an image, and therefore it is not necessary to control the stage 26 with high accuracy. Further, although a decrease in the S / N of the detected image due to the hunting of the stage 26 has been regarded as a problem, such a decrease in image quality can also be avoided.

  In this embodiment, raster scanning is performed as a sample scanning method. However, the present invention is not limited to this.

In the deflector scanning mode, the beam irradiation region may be changed according to the size of the defect portion. Further, the shape of the beam irradiation region is not limited to a rectangular shape.

  The matching method in pattern matching is not limited to the method described in the present embodiment, and other matching methods such as a residual sequential test method (SSDA method) and a sum of squared differences may be used.

It is a principle block diagram which shows one Embodiment of this invention . It is a principle block diagram at the time of adding the function which detects a defect location from the image information of the sample produced | generated by the electron detection means to embodiment shown in FIG. It is a whole block diagram of this embodiment. It is a figure which shows the structure of a detector. It is a figure which shows the track | orbit of a primary beam. It is a figure which shows the track | orbit of a secondary beam. It is a figure explaining a Wien filter. It is a flowchart explaining the operation | movement of a defect location detection. It is a figure explaining a stage scanning mode. It is a block diagram of the configuration of a TDI array CCD sensor. It is a figure explaining a deflector scanning mode. It is a block diagram of the inspection apparatus carrying a TDI array CCD sensor. It is a figure explaining operation | movement of a TDI array CCD sensor.

Explanation of symbols

1, 26, 52 ... Stage, 2 ... Irradiation means, 3 ... Electron detection means, 4 ... Stage drive means, 5 ... Deflection means, 6 ... Fluorescent part, 7 ...・ TDI array CCD sensor,
8: Control unit, 9: Defect detection means, 21, 51 ... Primary column, 22, 53 ... Secondary column, 23 ... Chamber, 24, 55 ... Electron gun, 25 56 ... Primary optical system 27, 54 ... Sample, 28, 57 ... Cathode lens, 29 ... Wien filter 30 ... Numerical aperture, 31 ... First lens, 32 ... Field aperture 33, second lens 34, third lens 35, deflector 36, 59 detector 39, 60 CCD camera drive controller 38, 61 ... CPU, 39 ... CRT, 40, 62 ... primary column control unit, 41, 63 ... secondary column control unit 42 ... deflection drive controller, 43, 64 ... stage Drive mechanism, 44, 65 ... laser interferometer unit, 58 ... secondary optical system

Claims (3)

Irradiating the surface of the substrate with a rectangular electron beam;
Converting a secondary beam generated from the irradiation region of the electron beam into a first optical image by a fiber optic plate;
Photoelectrically converting the first optical image with a time delay integration type array CCD sensor having a plurality of scanning lines, and accumulating signal charges to obtain an image of the inspection target region of the substrate;
Comparing the acquired image and design data to identify a defect location on the substrate;
A first scanning mode having:
When the defective portion of the substrate is specified by the first scanning mode, the substrate is moved to align the defective portion of the substrate, and the substrate is stopped. Magnifying and displaying the defect location by changing the focal length of the lens to be magnified;
Calculating a voltage to be applied to the polarizer based on the magnification set in the enlarged display of the defect portion;
Deflecting the projection position of the secondary beam projected onto the fiber optic plate by one scan line by applying the calculated voltage to the polarizer;
Converting the secondary beam with the projected position deflected into a second optical image by the fiber optic plate;
Photoelectrically converting the second optical image with the time delay integration type array CCD sensor and accumulating signal charges to obtain an image of the defective portion;
A second scanning mode having:
A pattern inspection method comprising:   When acquiring an image of a region to be inspected on the substrate, the time delay integration type array CCD sensor is adjacent to the scanning line in which signal charges are accumulated in accordance with driving of a stage on which the substrate is placed. 2. The pattern inspection method according to claim 1, wherein the signal charge is transferred to a scanning line.   When acquiring the enlarged image of the defect location, the time delay integration type array CCD sensor is configured to store the signal charge according to a voltage applied to a polarizer that deflects the secondary beam. The pattern inspection method according to claim 1, wherein the signal charge is transferred from a scan line to an adjacent scan line.

Images