JP4500158B2 - thread - Google Patents

Description

  The present invention relates to a thread that is configured by mounting an IC chip on a base substrate and is used by being sandwiched between two sheet substrates.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching a member called a thread to securities or banknotes or sandwiching them between paper base materials is considered. Yes. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted between paper bases of banknotes, and authenticity of securities and banknotes is determined by the presence or absence of this thread.

  Furthermore, in recent years, a technique for determining the authenticity of securities and bills using a thread on which an IC chip capable of reading information in a non-contact state is mounted has been considered. In this technique, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is embedded in a recess formed in a paper base of securities or banknotes, When the bill is used, information written on the IC chip is read to determine the authenticity of the securities or the bill (for example, see Patent Document 1).

  7A and 7B are diagrams showing an example of a conventional thread on which an IC chip is mounted. FIG. 7A is a view seen from the surface, and FIG. 7B is a cross-sectional view taken along line A-A ′ shown in FIG. Moreover, FIG. 8 is a figure which shows an example of the forgery prevention sheet | seat in which the thread | sled 201 shown in FIG. 7 was integrated, (a) is the figure seen from the surface, (b) is A- shown in (a). It is A 'sectional drawing.

  In this example, as shown in FIG. 7, the IC chip 210 enters the through hole 231 formed in the paper layer 230 with respect to the belt-shaped resin layer 220 and the paper layer 230 bonded to each other via the adhesive 240. The IC chip 210 is mounted on the resin layer 220 and is adhered to the resin layer 220 and the paper layer 230 while being covered with the adhesive 240. In addition, as a material of the resin layer 220, PET, PET-G, PVC, etc. can be considered. Further, the IC chip 210 can read information in a non-contact state, and the information written in the IC chip 210 can be read by bringing it close to an information writing / reading device provided outside. Read out.

  As shown in FIG. 8, the thread 201 configured in this manner is sandwiched between a label base material 206 formed by applying an adhesive 205 on one surface of a paper base material 204 and a paper base material 203, and the label base The anti-counterfeit sheet 202 in which the thread 201 is incorporated is configured to be fixed between the label base material 206 and the paper base material 203 by the adhesive 205 of the material 206.

In the anti-counterfeit sheet 202 configured as described above, when the information written in the IC chip 210 is brought close to a readable reader / writer, the information written in the IC chip 210 is read out and read out. Based on the information, the authenticity determination of the forgery prevention sheet 202 is performed.
JP 2002-319006 A

  However, like the one described in Patent Document 1, when the thread is embedded in the recess formed in the sheet base material or the like, the flexible material is embedded in the flexible material, and distortion or warpage occurs. There is a problem that the pasting work becomes very difficult.

  Further, when the anti-counterfeit sheet is configured by sandwiching the thread 201 as shown in FIG. 7 between the label base material 206 and the paper base material 203 as shown in FIG. Although the thread 201 is fixed to the label base material 206 and the label base material 206 and the paper base material 203 are bonded, the thread 201 and the paper base material 203 are not bonded. When the sheet is bent or the like, there is a problem that a region of the paper base material 203 where the thread 201 is sandwiched is lifted.

  Moreover, when it is set as the form which only affixes on a sheet | seat base material, the thickness of the whole sheet | seat base material will not become uniform, but it will become difficult to protect an IC chip from the pressure from a vertical direction There is.

  The present invention has been made in view of the problems of the conventional techniques as described above, and can be bonded without forming a recess or the like on the label base material and the sheet base material sandwiching the thread. And it aims at providing the thread | thread which can maintain the intensity | strength of a base material while aiming at uniform thickness, protecting an IC chip from the pressure from a vertical direction.

In order to achieve the above object, the present invention provides:
An IC chip capable of reading information in a non-contact state is formed on the second base substrate by bonding the band-shaped first base substrate and the second base substrate via an adhesive. A thread that is mounted on the first base substrate so as to enter the first through hole and is adhered to the first base substrate by the adhesive,
The first base substrate has at least one second through hole in a region that does not face the first through hole.

Also, an IC chip-containing sheet incorporating the thread,
An adhesive is applied to one surface, and a label substrate on which the thread is mounted with the second base substrate side as a mounted surface on the surface to which the adhesive is applied,
It is also conceivable to have a sheet base material that is laminated by sandwiching the thread on the label base material on which the thread is mounted, and that is adhered to the label base material with the adhesive.

  In the present invention configured as described above, when the second base base material is laminated on the first base base material and bonded to each other, the first base base material and the second base base material are combined. The pressure-sensitive adhesive for adhesion is exposed through the second through hole formed in the first base substrate. Therefore, when the thread is sandwiched between the label base material having the adhesive applied to one surface and the sheet base material so that the second base base material is on the label base material side, the second base The substrate side is fixed by the adhesive of the label substrate, and the first base substrate side is fixed by the adhesive exposed through the second through hole.

  As described above, in this embodiment, a region that does not oppose the first through hole of the first base substrate to which the second base substrate having the first through hole into which the IC chip enters is bonded. At least one second through-hole is formed in the first base substrate and the second base when the second base substrate is laminated on the first base substrate and bonded to each other. The pressure-sensitive adhesive for adhering to the base material is exposed through the second through hole formed in the first base base material, so that the second base base material is on the label base material side. Is sandwiched between the label base material and the sheet base material, the second base base material side is adhered to the label base material by the adhesive of the label base material, and the first base base material side is the second penetration Adhesive exposed through the holes is adhered to the sheet substrate and Thereby enabling bonding in each of the substrate. At that time, it is possible to make the thickness uniform while protecting the IC chip from the pressure from the vertical direction and to maintain the strength of the substrate.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a thread according to the present invention, in which FIG. 1A is a view seen from the surface, FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. ) Is a view from the back side.

  In this embodiment, as shown in FIG. 1, the paper layer 30 is a paper base 30 that is a belt-like first base substrate and a second base substrate that are bonded to each other via an adhesive 40. The IC chip 10 enters the first through hole 31 formed in the layer 30 and is mounted on the resin layer 20. The IC chip 10 is bonded to the resin layer 20 and the paper layer 30 in a state where the IC chip 10 is covered with the adhesive 40. Has been configured. The resin layer 20 is provided with second through holes 21a to 21d having a long hole shape in a region not facing the through hole 31, and the adhesive 40 is exposed through the through holes 21a to 21d. Yes. In addition, as a material of the resin layer 20, PET, PET-G, PVC, etc. can be considered. Further, the IC chip 10 can read information in a non-contact state, and the information written in the IC chip 10 can be read close to an information writing / reading device provided outside. Read out.

  Below, the manufacturing method of the thread | sled 1 comprised as mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread 1 shown in FIG.

  First, the paper layer 30 is laminated | stacked on the resin layer 20 with which the adhesive 40 was apply | coated to one side, and these are mutually adhere | attached with the adhesive 40 (FIG. 2 (a)). Here, as the adhesive 40, a thermoplastic adhesive such as hot-melt glue is conceivable. In that case, the adhesive 40 is heated by applying pressure when the resin layer 20 and the paper layer 30 are laminated. The resin layer 20 and the paper layer 30 are bonded by melting.

  Next, the region where the IC chip 10 is mounted from the paper layer 30 side is irradiated with laser light, the through hole 31 is formed in the paper layer 30 and the adhesive 40 under the through hole 31 is removed. The resin layer 20 is exposed, and a recess 33 is formed so that the IC chip 10 can enter. Further, the region where the through holes 21a to 21d are formed is irradiated with laser light from the resin layer 20 side, the through holes 21a to 21d are formed in the resin layer 20, and the adhesive 40 under the through holes 21a to 21d is removed. Thereby, the concave portions 22a to 22d where the paper layer 30 is exposed are formed. (FIGS. 2B and 2C).

  Next, the IC chip 10 is inserted into the recess 33 formed by forming the through hole 31 in the paper layer 20 and removing the adhesive 40 at the lower part of the region, and the IC chip is placed on the resin layer 20. 10 is mounted (FIG. 2D).

  Next, the adhesive 40 is melted to bond the IC chip 10 and the resin layer 20 together. When a thermoplastic adhesive is used as the pressure-sensitive adhesive 40, the pressure-sensitive adhesive 40 is melted by heating the resin layer 20 and the paper layer 30 while applying pressure by, for example, a heat roller. Then, a part of the melted adhesive 40 flows into the concave portion 33 from between the resin layer 20 and the paper layer 30, and the adhesive 40 that has flowed into the concave portion 33 is subsequently cured, whereby the IC chip 10 becomes the resin layer 20. And the paper layer 30 are bonded. At this time, the adhesive 40 that has flowed into the recess 33 wraps around the IC chip 10 and covers the IC chip 10. A part of the melted adhesive 40 also flows into the recesses 22a to 22d from between the resin layer 20 and the paper layer 30, and the adhesive 40 is exposed through the through holes 21a to 21d formed in the resin layer 20. (FIG. 2 (e)).

  Thereafter, the thread 1 manufactured as described above is incorporated into the sheet.

  3A and 3B are diagrams showing an example of a forgery prevention sheet in which the thread 1 shown in FIG. 1 is incorporated, in which FIG. 3A is a view seen from the surface, and FIG. 3B is AA ′ shown in FIG. It is sectional drawing.

  As shown in FIG. 3, the thread 1 shown in FIG. 1 is formed between a label base material 6 in which an adhesive 5 is applied to one surface of a paper base material 4 and a paper base material 3 that is a sheet base material. The label layer 6 is sandwiched between the label base 6 and the paper base 3 by the adhesive 5 so that the thread 1 is incorporated. The anti-counterfeit sheet 2 is configured. At this time, the label base 6 and the paper base 3 are bonded to each other by the adhesive 5 of the label base 6. The label base 6 and the thread 1 are bonded to each other by the adhesive 5 of the label base 6 and the adhesive 40 exposed through the through holes 31 formed in the paper layer 30, and the paper base 3 And the thread 1 are bonded to each other by the adhesive 40 exposed through the through holes 21a to 21d formed in the resin layer 20. Thereby, the thread | sled 1 is adhere | attached on each of the label base material 6 and the paper base material 3. FIG.

  In the anti-counterfeit sheet 2 configured as described above, when the information written in the IC chip 10 is brought close to a readable reader / writer, the information written in the IC chip 10 is read out and read out. Based on the information, the authenticity determination of the forgery prevention sheet 2 is performed.

(Second Embodiment)
4A and 4B are diagrams showing a second embodiment of the thread of the present invention, where FIG. 4A is a view seen from the surface, FIG. 4B is a cross-sectional view taken along line AA ′ shown in FIG. ) Is a view from the back side.

  In the present embodiment, as shown in FIG. 4, the paper layer 120 is a paper base 130 that is a belt-like first base substrate and a paper layer 130 that is a second base substrate that are bonded to each other via an adhesive 140. The IC chip 110 enters the first through hole 131 formed in the layer 130 and is mounted on the resin layer 120. The IC chip 110 is bonded to the resin layer 120 and the paper layer 130 in a state where the IC chip 110 is covered with the adhesive 140. Has been configured. The resin layer 120 is formed with second through holes 121a to 121d having a long hole shape in a region not facing the through hole 131, and the adhesive 40 is exposed through the through holes 121a to 121d. Yes. In addition, as a material of the resin layer 120, PET, PET-G, PVC, etc. can be considered. Further, the IC chip 110 can read information in a non-contact state, and the information written in the IC chip 110 can be read by bringing it close to an information writing / reading device provided outside. Read out.

  Below, the manufacturing method of the thread | sled 101 comprised as mentioned above is demonstrated.

  FIG. 5 is a diagram for explaining a method of manufacturing the thread 101 shown in FIG.

  First, the paper layer 130 is laminated | stacked on the resin layer 120 with which the adhesive 140 was apply | coated to one side, and these are mutually adhere | attached with the adhesive 140 (FIG. 5 (a)). Here, as the adhesive 140, a thermoplastic adhesive such as hot melt paste is conceivable. In that case, the adhesive 140 is heated by applying pressure when the resin layer 120 and the paper layer 130 are laminated. The resin layer 120 and the paper layer 130 are bonded by melting.

  Next, a laser beam is irradiated from the paper layer 130 side to the area where the IC chip 110 is mounted, whereby the adhesive 140 is exposed and a recess 133 into which the IC chip 110 enters is formed. In addition, the region where the through holes 121a to 121d are formed from the resin layer 120 side is irradiated with laser light, and the through holes 121a to 121d are formed in the resin layer 120. Form. (FIGS. 5B and 5C). At this time, a part of the adhesive 140 may be removed.

  Next, the IC chip 110 is inserted into the recess 133 formed by the through hole 131 in the paper layer 120, and the IC chip 110 and the resin layer 120 are bonded to each other by the adhesive 140 exposed in the recess 133 (FIG. 5 (d)). In the case where a thermoplastic adhesive is used as the adhesive 140, the adhesive 140 is heated by pressing the IC chip 110 against the resin layer 120 when the IC chip 110 enters the recess 133. The IC chip 110 and the resin layer 120 are bonded by melting. As a method of heating the IC chip 110, for example, it is conceivable to use a chip mounting machine having heat, and it is also conceivable to heat the peripheral portion of the recess 133 into which the IC chip 110 enters as necessary. At this time, the adhesive 140 applied in the recess 133 is melted and goes around the IC chip 110 in the recess 133 to cover the surface of the IC chip 110.

  In the case where a thermoplastic adhesive is used as the adhesive 140, the resin layer 120 and the paper layer 130 may be heated while being pressed by a heat roller as necessary. It will melt. Then, the adhesive 140 bonding the resin layer 120 and the paper layer 130 flows into the recesses 122a to 122d, and the adhesive 140 is raised in the recesses 122a to 122d.

  Thereafter, the thread 101 manufactured as described above is incorporated into the sheet.

  6A and 6B are diagrams showing an example of the forgery prevention sheet in which the thread 101 shown in FIG. 4 is incorporated, in which FIG. 6A is a view seen from the surface, and FIG. 6B is AA ′ shown in FIG. It is sectional drawing.

  As shown in FIG. 6, the thread 101 shown in FIG. 4 is formed between a label base material 106 formed by applying an adhesive 105 on one surface of a paper base material 104 and a paper base material 103 which is a sheet base material. The label layer 106 is sandwiched between the label base 106 and the paper base 103 by the adhesive 105 of the label base 106 so that the thread 101 is incorporated. The anti-counterfeit sheet 102 is configured. At this time, the label base material 106 and the paper base material 103 are adhered to each other by the adhesive 105 of the label base material 106. The label base 106 and the thread 101 are adhered to each other by the adhesive 105 of the label base 106 and the adhesive 140 exposed through the through hole 131 formed in the paper layer 130, and the paper base 103 The thread 101 is bonded to each other by the adhesive 140 exposed through the through holes 121a to 121d formed in the resin layer 120. As a result, the thread 101 is adhered to each of the label base material 106 and the paper base material 103.

  In the anti-counterfeit sheet 102 configured as described above, when the information written in the IC chip 110 is brought close to a readable reader / writer, the information written in the IC chip 110 is read out and read out. Based on the information, the authenticity determination of the forgery prevention sheet 102 is performed.

  In the above-described two embodiments, the resin layers 20 and 120 are formed with the four long holes 21a to 21d and 121a to 121d, respectively, but are applied to the resin layers 20 and 120. As long as the adhesives 40 and 140 are exposed, the number and shape thereof are not limited to this, and there are various types such as providing only one long hole shape or plural circular fine ones. Various forms are possible.

  In addition, through holes are provided so as to penetrate the resin layers 20 and 120 and the paper layers 30 and 130, and the adhesives 40 and 140 for bonding the resin layers 20 and 120 and the paper layers 30 and 130 are attached to the threads 1 and 101. It is also possible to expose both surfaces and bond the two sheet base materials and the threads with the adhesives 40 and 140. In that case, a region in which through holes are formed on both surfaces of the two sheet base materials May be dented.

It is a figure which shows 1st Embodiment of the thread | sled of this invention, (a) is the figure seen from the surface, (b) is AA 'sectional drawing shown to (a), (c) is from a back surface. FIG. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. It is a figure which shows an example of the forgery prevention sheet | seat in which the thread | sled shown in FIG. 1 was integrated, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows 2nd Embodiment of the thread | sled of this invention, (a) is the figure seen from the surface, (b) is AA 'sectional drawing shown to (a), (c) is from a back surface. FIG. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. It is a figure which shows an example of the forgery prevention sheet | seat in which the thread | sled shown in FIG. 4 was integrated, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows an example of the conventional thread | thread with which the IC chip was mounted, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows an example of the forgery prevention sheet | seat in which the thread | thread shown in FIG. 7 was integrated, (a) is the figure seen from the surface, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

1,101 Thread 2,102 Anti-counterfeit sheet 3,4,103,104 Paper base 5,40,105,140 Adhesive 6,106 Label base 10,110 IC chip 20,120 Resin layer 30,130 Paper layer 21a-21d, 31, 121a-121d, 131 Through hole 22a-22d, 33, 122a-122d, 133 Recess

Claims (1)

An IC chip capable of reading information in a non-contact state is formed on the second base substrate by bonding the band-shaped first base substrate and the second base substrate via an adhesive. A thread that is mounted on the first base substrate so as to enter the first through hole and is adhered to the first base substrate by the adhesive,
The first base substrate is a thread having at least one second through hole in a region not facing the first through hole.

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