JP4595387B2 - Droplet ejection device, droplet ejection method, color filter substrate manufacturing method, electro-optical device manufacturing method - Google Patents

Description

The present invention relates to a droplet discharge device, a droplet discharge method, a color filter substrate manufacturing method, and an electro-optical device manufacturing method.

In recent years, a light emitting material such as an organic fluorescent material is converted into an ink, and this ink is patterned on a substrate by an ink jet method, and then dried to sandwich a light emitting layer made of the light emitting material between an anode and a cathode, for example. A technique for manufacturing a color organic electroluminescence device (organic EL device) having a structure is widely used. By the way, when manufacturing an organic EL device using such an ink jet method, the ejection characteristics are often different for each nozzle or head of the ink jet device, and each pixel of the organic EL device is associated with the variation. Film thickness unevenness may occur. Thus, for example, Patent Document 1 discloses a technique for forming a light emitting layer of one pixel by scanning with a plurality of heads.
JP 2003-249355 A

  As described in Patent Document 1, it is possible to suppress nozzle variation by scanning a head including a plurality of nozzles a plurality of times with respect to one pixel. However, even if the variation between the nozzles can be corrected by such a method, it is often difficult to correct the variation between the heads.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to prevent or suppress the occurrence of ejection unevenness between heads in a liquid droplet ejection apparatus including a liquid droplet ejection head. It is an object of the present invention to provide a droplet discharge device and a droplet discharge method capable of obtaining a film pattern with little coating unevenness. Another object of the present invention is to produce a color filter substrate that is less likely to have uneven film thickness or uneven coating on the colored layer pattern, or to manufacture an electro-optical device that is less likely to cause uneven film thickness or uneven application on the electro-optical layer pattern. An object of the present invention is to provide an electro-optical device in which uneven light emission is unlikely to occur and an electronic apparatus in which display unevenness is unlikely to occur.

  In order to solve the above problems, a droplet discharge device of the present invention is a droplet discharge device including a plurality of droplet discharge heads, each of the droplet discharge heads being scanned in the same direction, and the scanning thereof. Each droplet discharge head is arranged in a row in a direction crossing the direction, and a part of each head is arranged at a boundary portion between the adjacent first head and the second head among the heads arranged in the row. While each head is provided so as to overlap in the scanning direction, each head is provided with a plurality of nozzles in a row in a direction intersecting the scanning direction of the head, and in each region where the first head and the second head overlap, The nozzles of the head are divided into a first nozzle group in an effective ejection state and a second nozzle group in an ineffective ejection state, and the division position changes every moment in the overlapping area with scanning, and First With changes in de breaking positions, characterized in that the dividing position of the second head is changed.

  When such a droplet discharge device is used, a discharge pattern is formed in which the discharge boundary between the heads is non-linear. Therefore, the discharge between the heads is less than when the discharge boundary is formed in a straight line. It is possible to mitigate the effects that can be caused by unevenness. That is, in the film formed by the droplet discharge device, streak-like discharge unevenness is difficult to occur, and even if it occurs, the discharge unevenness in a zigzag or random state is blurred. It becomes possible to reduce the influence on the property. Therefore, it is possible to provide a highly reliable droplet discharge device that has high productivity and few defects when forming a film.

  In the liquid droplet ejection apparatus according to the present invention, the first head has a dividing position of the first nozzle group in the effective ejection state and the second nozzle group in the ineffective ejection state at both ends of the first head that changes every time scanning is performed. In order to keep the number of first nozzle groups in the effective ejection state in the first head unchanged, the division position of the other end changes as the division position of one end changes. It may be supposed to be. In this case, since the discharge amount of the droplets during the scanning period is constant, stable discharge is possible, and unevenness in film thickness and coating unevenness hardly occur even in the formed film pattern.

  Each of the droplet discharge heads may be formed in a longitudinal shape and arranged so that the longitudinal direction forms a predetermined inclination angle with respect to the scanning direction. In this case, the interval between the ejection patterns ejected from the adjacent nozzles can be narrowed, and the head-to-head pitch and the pitch of the pattern to be ejected (for example, the pitch between pixels) can be matched in a smaller space. In addition, it is possible to easily configure the interlocking change of the division position between the first head and the second head in the space.

  The droplet discharge head performs a plurality of scans in a reciprocal manner, and the division position of the first head at a predetermined position in the scanning direction may be different for each scan. In this case, uneven ejection between the heads is less likely to occur, and consequently unevenness in film thickness and unevenness in coating are less likely to occur.

  In order to solve the above problems, a droplet discharge method of the present invention is a droplet discharge method using a droplet discharge apparatus including a plurality of droplet discharge heads, and the droplet discharge heads are the same. The droplet discharge heads are arranged in a row in the direction intersecting with the scanning direction, and the droplets discharged from the adjacent first head and second head among the heads arranged in the row. For the first pattern and the second pattern formed based on the above, the droplet discharge head is driven so that the boundary line between the first pattern and the second pattern is zigzag along the scanning direction of the droplet discharge head It is characterized by doing. According to such a method, it is possible to prevent or suppress the occurrence of uneven discharge between adjacent heads, and even if uneven discharge occurs, it results in uneven discharge in a zigzag or random state. It becomes possible to mitigate the influence on the properties of the formed film.

  Next, in order to solve the above-described problem, the method for manufacturing a color filter substrate of the present invention is a method for manufacturing a color filter substrate including a plurality of colored layers of a plurality of colors in a predetermined pattern, wherein the pattern of each colored layer is It is formed using the above droplet discharge device. According to such a manufacturing method, it is possible to provide a color filter substrate with less color unevenness and excellent reliability.

  In order to solve the above-described problem, a method for manufacturing an electro-optical device according to the present invention is a method for manufacturing an electro-optical device including a plurality of types of electro-optical layers in a predetermined pattern. Is formed using the droplet discharge device. According to such a manufacturing method, a highly reliable electro-optical device having excellent electro-optical characteristics can be provided. In addition, when an organic electroluminescence layer (organic EL layer) is patterned by the above method as an electro-optical layer, and this is used as an organic EL device, it is possible to provide a highly reliable organic EL device with little emission unevenness. it can.

  Next, an electro-optical device according to the present invention is obtained by the above-described manufacturing method, and an electronic apparatus according to the present invention includes the electro-optical device as a display unit, for example. Such an electro-optical device and an electronic apparatus are highly reliable, for example, an electronic apparatus having excellent display characteristics.

Hereinafter, an organic EL device as an embodiment of the electro-optical device of the present invention and a method for manufacturing the organic EL device will be described.
FIG. 1 is an explanatory diagram showing a wiring structure of the organic EL device of this embodiment, FIG. 2 is a schematic plan view of the organic EL device of this embodiment, and FIG. 3 is a diagram of the organic EL device of this embodiment. It is a cross-sectional schematic diagram of a display area.

(Organic EL device)
As shown in FIG. 1, the organic EL device of the present embodiment includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and a direction parallel to the signal lines 102. A plurality of power supply lines 103 extending in a line are respectively wired, and a pixel region P is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102.

Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101.
Further, in each pixel region P, a switching thin film transistor 122 to which a scanning signal is supplied to the gate electrode via the scanning line 101, and a pixel signal supplied from the signal line 102 via this switching thin film transistor 122. A storage capacitor cap that holds the pixel signal, a driving thin film transistor 123 to which a pixel signal held by the storage capacitor cap is supplied to the gate electrode, and the power supply line 103 via the driving thin film transistor 123 A pixel electrode (electrode) 111 into which a driving current flows from the power line 103 and an organic EL layer 110 sandwiched between the pixel electrode 111 and the cathode (counter electrode) 12 are provided. The electrode 111, the counter electrode 12, and the organic EL layer 110 constitute a light emitting element.

  When the scanning line 101 is driven and the switching thin film transistor 122 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and the driving thin film transistor 123 is turned on / off according to the state of the holding capacitor cap. The off state is determined. Then, current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving thin film transistor 123, and further current flows to the cathode 12 through the organic EL layer 110. In the organic EL layer 110, light emission occurs according to the amount of current flowing.

As shown in FIG. 3, the organic EL device of the present embodiment includes a transparent substrate 2 made of glass or the like, and a light emitting element unit 11 formed on the substrate 2 including light emitting elements arranged in a matrix. And a cathode 12 formed on the light emitting element portion 11. Here, the display element 10 is configured by the light emitting element portion 11 and the cathode 12.
The substrate 2 is a transparent substrate such as glass, for example, and as shown in FIG. 2, a display region 2a located at the center of the substrate 2 and a non-display region 2c that is located at the periphery of the substrate 2 and surrounds the display region 2a. It is divided into. The display area 2a is an area formed by light emitting elements arranged in a matrix.

  Further, the aforementioned power supply lines 103 (103R, 103G, 103B) are wired in the non-display area 2c. On the both sides of the display area 2a, the above-described scanning side drive circuits 105 and 105 are arranged. Further, on both sides of the scanning side driving circuits 105 and 105, a driving circuit control signal wiring 105a and a driving circuit power wiring 105b connected to the scanning side driving circuits 105 and 105 are provided. On the upper side of the display area 2a in the figure, an inspection circuit 106 for inspecting the quality and defects of the display device during manufacturing or at the time of shipment is arranged.

In the cross-sectional configuration diagram of FIG. 3, three pixel regions A are illustrated. In the organic EL device of this embodiment, a circuit element unit 14 in which circuits such as TFTs are formed, a light emitting element unit 11 in which an organic EL layer 110 is formed, and a cathode 12 are sequentially stacked on a substrate 2. The light emitted from the organic EL layer 110 to the substrate 2 side passes through the circuit element unit 14 and the substrate 2 and is emitted to the lower side (observer side) of the substrate 2 and from the organic EL layer 110. Light emitted to the opposite side of the substrate 2 is reflected by the cathode 12, passes through the circuit element unit 14 and the substrate 2, and is emitted to the lower side (observer side) of the substrate 2.
If a transparent material is used for the cathode 12, light emitted from the cathode side can be emitted. Examples of the transparent cathode material include ITO (indium tin oxide), Pt, Ir, Ni, or Pd.

  In the circuit element portion 14, a base protective film 2c made of a silicon oxide film is formed on the substrate 2, and an island-shaped semiconductor film 141 made of polycrystalline silicon is formed on the base protective film 2c. In the semiconductor film 141, a source region 141a and a drain region 141b are formed by high concentration phosphorus ion implantation. A portion where the phosphorus ions are not introduced is a channel region 141c.

  Further, a transparent gate insulating film 142 covering the base protective film 2c and the semiconductor film 141 is formed, and a gate electrode 143 (scanning line 101) made of Al, Mo, Ta, Ti, W or the like is formed on the gate insulating film 142. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. In addition, contact holes 145 and 146 are formed through the first and second interlayer insulating films 144a and 144b and connected to the source and drain regions 141a and 141b of the semiconductor film 141, respectively.

  On the second interlayer insulating film 144b, a transparent pixel electrode 111 made of ITO or the like is formed by patterning into a predetermined shape, and one contact hole 145 is connected to the pixel electrode 111. The other contact hole 146 is connected to the power supply line 103. In this way, the driving thin film transistor 123 connected to each pixel electrode 111 is formed in the circuit element unit 14.

  The light emitting element unit 11 includes an organic EL layer 110 stacked on each of the plurality of pixel electrodes 111... And a bank unit that is provided between each pixel electrode 111 and the organic EL layer 110 to partition each organic EL layer 110. 112 as a main component. A cathode 12 is disposed on the organic EL layer 110. The pixel electrode 111, the organic EL layer 110, and the cathode 12 constitute a light emitting element. Here, the pixel electrode 111 is made of, for example, ITO, and is patterned in a substantially rectangular shape in plan view. Bank sections 112 are provided so as to partition the pixel electrodes 111.

As shown in FIG. 3, the bank 112 includes an inorganic bank layer (first bank layer) 112a as a first partition located on the substrate 2 side, and an organic substance as a second partition located away from the substrate 2. A bank layer (second bank layer) 112b is stacked. The inorganic bank layer 112a is formed of, for example, TiO ₂ or SiO ₂ , and the organic bank layer 112b is formed of, for example, an acrylic resin or a polyimide resin.

  The inorganic and organic bank layers 112 a and 112 b are formed on the peripheral edge of the pixel electrode 111. In plan view, the periphery of the pixel electrode 111 and the inorganic bank layer 112a are arranged so as to partially overlap. The same applies to the organic bank layer 112b, and the organic bank layer 112b is disposed so as to overlap a part of the pixel electrode 111 in a planar manner. The inorganic bank layer 112a is formed so as to protrude further toward the center of the pixel electrode 111 than the edge of the organic bank layer 112b. In this manner, each first stacked portion (projecting portion) 112e of the inorganic bank layer 112a is formed inside the pixel electrode 111, so that a lower opening 112c corresponding to the formation position of the pixel electrode 111 is provided. Yes.

  An upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided so as to correspond to the formation position of the pixel electrode 111 and the lower opening 112c. As shown in FIG. 3, the upper opening 112 d has a wider opening than the lower opening 112 c and is narrower than the pixel electrode 111. In some cases, the upper position of the upper opening 112d and the end of the pixel electrode 111 are substantially the same position. In this case, as shown in FIG. 3, the upper opening 112d of the organic bank layer 112b has an inclined cross section. In this way, the bank 112 has an opening 112g in which the lower opening 112c and the upper opening 112d communicate with each other.

  In the bank portion 112, a region showing lyophilicity and a region showing liquid repellency are formed. The regions showing lyophilicity are the first stacked portion 112e of the inorganic bank layer 112a and the electrode surface 111a of the pixel electrode 111. These regions are surface-treated lyophilically by plasma treatment using oxygen as a processing gas. ing. The regions exhibiting liquid repellency are the wall surface of the upper opening 112d and the upper surface 112f of the organic bank layer 112. These regions are formed by using tetrafluoromethane, tetrafluoromethane, or carbon tetrafluoride as a processing gas. The surface is fluorinated (treated to be liquid repellent) by the plasma treatment.

The organic EL layer 110 includes a hole injection / transport layer 110a laminated on the pixel electrode 111 and a light emitting layer 110b formed adjacent to the hole injection / transport layer 110a.
The hole injection / transport layer 110a has a function of injecting holes into the light emitting layer 110b and a function of transporting holes inside the hole injection / transport layer 110a. By providing such a hole injecting / transporting layer 110a between the pixel electrode 111 and the light emitting layer 110b, device characteristics such as light emitting efficiency and life of the light emitting layer 110b are improved. In the light emitting layer 110b, the holes injected from the hole injection / transport layer 110a and the electrons injected from the cathode 12 are recombined in the light emitting layer to emit light.

  The hole injection / transport layer 110a is located in the lower opening 112c and formed on the pixel electrode surface 111a, and the flat portion 110a1 is formed in the upper opening 112d. The first stacked portion 112e of the inorganic bank layer is located in the upper opening 112d. It is comprised from the peripheral part 110a2 formed on top. Further, depending on the structure, the hole injection / transport layer 110a is formed only on the pixel electrode 111 and between the inorganic bank layers 110a (the lower opening 110c) (on the flat portion described above). Some forms are only formed).

  The light emitting layer 110b is formed over the flat portion 110a1 and the peripheral portion 110a2 of the hole injection / transport layer 110a, and the thickness on the flat portion 112a1 is in the range of 50 nm to 80 nm. The light emitting layer 110b has three types, a red light emitting layer 110b1 that emits red (R), a green light emitting layer 110b2 that emits green (G), and a blue light emitting layer 110b3 that emits blue (B). As shown in FIG. 5, the light emitting layers 110b1 to 110b3 are arranged in stripes.

Since the peripheral portion 110a2 having a non-uniform thickness is formed on the first stacked portion 112e of the inorganic bank layer, the peripheral portion 110a2 is insulated from the pixel electrode 111 by the first stacked portion 112e, and the peripheral portion 110a2 is formed. Thus, holes are not injected into the light emitting layer 110b. Thereby, current from the pixel electrode 111 flows only in the flat portion 112a1, holes can be transported uniformly from the flat portion 112a1 to the light emitting layer 110b, and only the central portion of the light emitting layer 110b can emit light. The light emission amount in the light emitting layer 110b can be made constant.
Further, since the inorganic bank layer 112a extends further to the center side of the pixel electrode 111 than the organic bank layer 112b, the shape of the joint portion between the pixel electrode 111 and the flat portion 110a1 is trimmed by the inorganic bank layer 112a. Thus, variation in the emission intensity between the light emitting layers 110b can be suppressed.

Furthermore, since the electrode surface 111a of the pixel electrode 111 and the first laminated portion 112e of the inorganic bank layer are lyophilic, the organic EL layer 110 is uniformly adhered to the pixel electrode 111 and the inorganic bank layer 112a, and the inorganic bank layer 112a. As a result, the organic EL layer 110 is not extremely thin, and a short circuit between the pixel electrode 111 and the cathode 12 can be prevented.
Further, since the upper surface 112f of the organic bank layer 112b and the wall surface of the upper opening 112d exhibit liquid repellency, the adhesion between the organic EL layer 110 and the organic bank layer 112b is lowered, and the organic EL layer 110 is removed from the opening 112g. There is no overflow.

  In addition, as a hole injection / transport layer forming material, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrene sulfonic acid can be used. Examples of the material of the light emitting layer 110b include (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyfluorene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, or polymers thereof. The material can be used by doping with rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like.

  The cathode 12 is formed on the entire surface of the light emitting element portion 11 and plays a role of flowing a current through the organic EL layer 110 in a pair with the pixel electrode 111. For example, the cathode 12 is formed by laminating a calcium layer and an aluminum layer. At this time, it is preferable to provide a cathode having a low work function on the cathode near the light emitting layer, and in this embodiment, in particular, it plays a role of injecting electrons into the light emitting layer 110b in direct contact with the light emitting layer 110b.

  In some cases, LiF for increasing the light emission efficiency is formed between the light emitting layer 110 b and the cathode 12. The red and green light emitting layers 110b1 and 1110b2 are not limited to lithium fluoride, and other materials may be used. Therefore, in this case, a layer made of lithium fluoride may be formed only on the blue (B) light emitting layer 110b3, and layers other than lithium fluoride may be laminated on the other red and green light emitting layers 110b1 and 110b2. Alternatively, only calcium may be formed on the red and green light emitting layers 110b1 and 110b2 without forming lithium fluoride.

The aluminum forming the cathode 12 reflects light emitted from the light emitting layer 110b toward the substrate 2, and is preferably made of an Ag film, an Al / Ag laminated film, or the like in addition to the Al film. Furthermore, an antioxidant protective layer made of SiO, SiO ₂ , SiN or the like may be provided on aluminum.

  In the actual organic EL device, a sealing portion is provided on the light emitting element portion 11 shown in FIG. The sealing portion can be formed by, for example, applying a sealing resin in a ring shape around the substrate 2 and further sealing with a sealing can. The sealing resin is made of a thermosetting resin, an ultraviolet curable resin, or the like, and is particularly preferably made of an epoxy resin that is a kind of thermosetting resin. This sealing portion is provided for the purpose of preventing oxidation of the light emitting layer formed in the cathode 12 or the light emitting element portion 11. Further, a getter agent that absorbs water, oxygen, or the like may be provided inside the sealing can so that water or oxygen that has entered the sealing can can be absorbed.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device will be described with reference to the drawings.
The manufacturing method of this embodiment includes (1) a bank portion forming step, (2) a hole injection / transport layer forming step, (3) a light emitting layer forming step, (4) a cathode forming step, and (5) a sealing step. Have In addition, the manufacturing method demonstrated here is an example, Comprising: Another process is added as needed, A part of said process is removed. The (2) hole injection / transport layer forming step and (3) light emitting layer forming step are performed by a liquid discharge method (inkjet method) using a droplet discharge device.

(1) Bank Part Formation Step In the bank part formation step, the bank part 112 is formed at a predetermined position on the substrate 2. The bank part 112 has a structure in which an inorganic bank layer 112a is formed as a first bank layer, and an organic bank layer 112b is formed as a second bank layer. Note that the circuit element portion 14 including the thin film transistor 123 and the first interlayer insulating layer 144, the pixel electrode 111, and the like are formed in advance on the substrate 2.

(1) -1 Formation of Inorganic Bank Layer 112a First, as shown in FIG. 4, the inorganic bank layer 112a is formed at a predetermined position on the substrate. The position where the inorganic bank layer 112 a is formed is on the second interlayer insulating film 144 b and the pixel electrode 111. The second interlayer insulating film 144b is formed on the circuit element portion 14 in which a thin film transistor, a scanning line, a signal line, and the like are arranged. The inorganic bank layer 112a can be made of an inorganic material such as SiO ₂ or TiO ₂ , for example. These materials are formed by, for example, a CVD method, a coating method, a sputtering method, a vapor deposition method, or the like. Furthermore, the film thickness of the inorganic bank layer 112a is preferably in the range of 50 nm to 200 nm, particularly 150 nm.

  The inorganic bank layer 112a is formed to have an opening by forming an inorganic film on the entire surface of the interlayer insulating layer 144 and the pixel electrode 111 and then patterning the inorganic material film by a photolithography method or the like. This opening corresponds to the formation position of the electrode surface 111a of the pixel electrode 111, and is provided as a lower opening 112c as shown in FIG. At this time, the inorganic bank layer 112a is formed so as to partially overlap with the peripheral edge of the pixel electrode 111, whereby the planar light emitting region of the light emitting layer 110 is controlled.

(1) -2 Formation of Organic Bank Layer 112b Next, an organic bank layer 112b as a second bank layer is formed.
Specifically, as shown in FIG. 4, the organic bank layer 112b is formed on the inorganic bank layer 112a. As the material constituting the organic bank layer 112b, a material having heat resistance and solvent resistance such as acrylic resin and polyimide resin is used. Using these materials, the organic bank layer 112b is formed by patterning using a photolithography technique or the like. When patterning, an upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided at a position corresponding to the electrode surface 111a and the lower opening 112c.

As shown in FIG. 4, the upper opening 112d is preferably formed wider than the lower opening 112c formed in the inorganic bank layer 112a. Furthermore, the organic bank layer 112b preferably has a tapered cross-sectional shape. The bottom surface of the organic bank layer 112b is narrower than the width of the pixel electrode 111, and the top surface of the organic bank layer 112b is substantially the same as the width of the pixel electrode 111. It is preferable to form in the width.
As a result, the first stacked portion 112e surrounding the lower opening 112c of the inorganic bank layer 112a protrudes toward the center of the pixel electrode 111 from the organic bank layer 112b. In this manner, the upper opening 112d formed in the organic bank layer 112b and the lower opening 112c formed in the inorganic bank layer 112a are communicated to each other, thereby opening the inorganic bank layer 112a and the organic bank layer 112b. 112g is formed.

The thickness of the organic bank layer 112b is preferably in the range of 0.1 μm to 3.5 μm, and particularly preferably about 2 μm. The reason for this range is as follows.
That is, when the thickness is less than 0.1 μm, the organic bank layer 112b becomes thinner than the total thickness of the hole injection / transport layer and the light emitting layer, which will be described later, and the light emitting layer 110b may overflow from the upper opening 112d. It is not preferable. On the other hand, if the thickness exceeds 3.5 μm, the step due to the upper opening 112d becomes large, and step coverage of the cathode 12 in the upper opening 112d cannot be secured, which is not preferable. Further, if the thickness of the organic bank layer 112b is 2 μm or more, it is preferable in that the insulation between the cathode 12 and the driving thin film transistor 123 can be enhanced.

Further, the surface of the formed bank portion 112 and the pixel electrode 111 is preferably subjected to an appropriate surface treatment by plasma treatment. Specifically, the surface of the bank portion 112 is made lyophobic and the pixel electrode 111 is made lyophilic. Process.
First, the surface treatment of the pixel electrode 111 can be performed by O ₂ plasma treatment using oxygen gas, for example, plasma power 100 kW to 800 kW, oxygen gas flow rate 50 ml / min to 100 ml / min, plate conveyance speed 0.5 mm / min. By processing under conditions of sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the region including the surface of the pixel electrode 111 can be made lyophilic. Moreover, the cleaning of the surface of the pixel electrode 111 and the adjustment of the work function are simultaneously performed by this O ₂ plasma treatment.
Next, the surface treatment of the bank portion 112 can be performed by CF ₄ plasma treatment using tetrafluoromethane, for example, plasma power 100 kW to 800 kW, tetrafluoromethane gas flow rate 50 ml / min to 100 ml / min, substrate transport speed 0 By performing the treatment under conditions of 5 mm / sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the upper opening 112d and the upper surface 112f of the bank 112 can be made liquid repellent.

(2) Hole Injection / Transport Layer Formation Step Next, in the light emitting element formation step, a hole injection / transport layer is first formed on the pixel electrode 111.
In the hole injection / transport layer forming step, a liquid composition containing a hole injection / transport layer forming material is discharged onto the electrode surface 111a by using, for example, an ink jet device as a droplet discharge device. Thereafter, a drying process and a heat treatment are performed to form a hole injection / transport layer 110a on the pixel electrode 111 and the inorganic bank layer 112a. Here, the hole injection / transport layer 110a may not be formed on the first stacked portion 112e, that is, the hole injection / transport layer may be formed only on the pixel electrode 111.

The manufacturing method by inkjet is as follows.
That is, as shown in FIG. 5, a liquid composition containing a hole injection / transport layer forming material is discharged from a plurality of nozzles formed in the inkjet head H1. Here, the composition is filled for each pixel by scanning the ink jet head, but it is also possible to scan the substrate 2. Further, the composition can be filled by moving the inkjet head and the substrate 2 relatively. In addition, in the process performed using the inkjet head after this, said point is the same.

The ejection by the inkjet head is as follows.
That is, the discharge nozzle H2 formed on the ink jet head H1 is disposed to face the electrode surface 111a, and the liquid composition is discharged from the nozzle H2. A bank 112 that defines a lower opening 112c is formed around the pixel electrode 111, and the inkjet head H1 is opposed to the pixel electrode surface 111a located in the lower opening 112c. , The liquid composition droplet 110c of which liquid amount per droplet is controlled is discharged from the discharge nozzle H2 onto the electrode surface 111a.

  As the liquid composition used in this step, for example, a composition obtained by dissolving a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS) in a polar solvent can be used. Examples of the polar solvent include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivatives, carbitol acetate And glycol ethers such as butyl carbitol acetate.

  As a more specific composition, a PEDOT / PSS mixture (PEDOT / PSS = 1: 20): 12.52% by weight, IPA: 10% by weight, NMP: 27.48% by weight, DMI: 50% by weight It can be illustrated. The viscosity of the liquid composition is preferably about 1 mPa · s to 20 mPa · s, particularly about 4 mPa · s to 15 mPa · s.

  By using the above liquid composition, the discharge nozzle H2 can be stably discharged without clogging. The hole injection / transport layer forming material may be the same for each of the red (R), green (G), and blue (B) light emitting layers 110b1 to 110b3, and may be changed for each light emitting layer. May be.

  The discharged droplets 110c of the composition spread on the lyophilic electrode surface 111a and the first stacked portion 112e, and are filled in the lower and upper openings 112c and 112d. Even if the first composition droplet 110c deviates from the predetermined ejection position and is ejected onto the upper surface 112f, the upper surface 112f is not wetted by the first composition droplet 110c, and the repelled first composition droplet 110c. Rolls into the lower and upper openings 112c and 112d.

  The amount of the composition discharged onto the electrode surface 111a is the size of the lower and upper openings 112c and 112d, the thickness of the hole injection / transport layer to be formed, and the hole injection / transport layer in the liquid composition. It is determined by the concentration of the forming material.

As for the structure of the inkjet head, a head H as shown in FIG. 14 can be used. Further, the arrangement of the substrate and the ink jet head is preferably arranged as shown in FIG.
In FIG. 14, reference numeral H7 denotes a support substrate that supports the inkjet head H1, and a plurality of inkjet heads H1 are provided on the support substrate H7.
A plurality of ejection nozzles (for example, 1) are arranged on the ink ejection surface (surface facing the substrate) of the inkjet head H1 in rows along the length direction of the head and in two rows at intervals in the width direction of the head. 180 nozzles in a total of 360 nozzles). In addition, the inkjet head H1 has the discharge nozzle directed toward the substrate side, is inclined in a predetermined angle with respect to the X axis (or Y axis), is arranged in a row along the X axis direction, and at a predetermined interval in the Y direction. A plurality (6 in a row, 12 in total in FIG. 14) are positioned and supported on a support plate 20 having a substantially rectangular shape in a plan view in a state of being arranged in two rows.

  In the ink jet apparatus shown in FIG. 15, reference numeral 1115 denotes a stage on which the substrate 2 is placed, and reference numeral 1116 denotes a guide rail that guides the stage 1115 in the x-axis direction (main scanning direction) in the drawing. The head H can be moved in the y-axis direction (sub-main scanning direction) in the figure by the guide rail 1113 via the support member 1111, and the head H can be rotated in the θ-axis direction in the figure. H1 can be inclined at a predetermined angle with respect to the main scanning direction. As described above, the nozzle pitch can be made to correspond to the pixel pitch by arranging the inkjet head to be inclined with respect to the scanning direction. Further, any pixel pitch can be accommodated by adjusting the tilt angle.

  A substrate 2 shown in FIG. 15 has a structure in which a plurality of chips are arranged on a mother substrate. That is, one chip area corresponds to one display device. Here, three display areas 2a are formed, but the present invention is not limited to this. For example, when the composition is applied to the left display area 2 a on the substrate 2, the head H is moved to the left side in the drawing via the guide rail 1113 and the substrate 2 is shown in the drawing via the guide rail 1116. Application is performed while moving the substrate 2 and scanning the substrate 2. Next, the head H is moved to the right side in the drawing to apply the composition to the display area 2a at the center of the substrate. The same applies to the display area 2a at the right end. The head H shown in FIG. 14 and the ink jet apparatus shown in FIG. 15 are used not only for the hole injection / transport layer forming step but also for the light emitting layer forming step.

Hereinafter, the scanning aspect and the ejection aspect of the inkjet head will be described.
FIG. 11 is an explanatory view showing the ejection region 132 formed on the substrate 2 in a plan view, and an inkjet head H1 (here, three heads H1a, H1b, H1c are shown) on the ejection region 132. It is explanatory drawing which showed the discharge aspect at the time of scanning. FIG. 16 is an explanatory diagram showing modes ((a) to (c)) in which the discharge nozzle positions of the heads H1a, H1b, and H1c change with scanning. In addition, FIG. 17 is explanatory drawing which showed the conventional discharge aspect.

  As shown in FIG. 11, the heads H1a, H1b, and H1c scan in a direction that intersects the parallel direction of the heads H1a, H1b, and H1c. When performing such scanning, for example, as shown in FIG. 17, simply by arranging a plurality of heads H1a, H1b, and H1c in parallel and performing uniform ejection from the nozzles of the heads H1a, H1b, and H1c, each head H1a, A straight discharge unevenness M occurs between H1b and H1c, and this may cause a straight film thickness unevenness or coating unevenness in the hole injection / transport layer formed. In the organic EL device having such a straight film thickness unevenness and coating unevenness, light emission unevenness due to this occurs, and as a result, a problem of visually recognizing streaky display unevenness may occur.

  However, in the present embodiment, the position of the nozzles discharged along with the scanning is shifted, so that the discharge unevenness M occurs in a zigzag shape (preferably random or non-linear) as shown in FIG. As a result, it is possible to prevent or suppress the occurrence of defects in which the streak-like display unevenness as described above is visually recognized. That is, as shown in FIG. 16, when the heads H1a, H1b, and H1c scan in order from (a) to (c), the effective nozzle group H21 that performs ejection effectively in each of the heads H1a, H1b, and H1c. Since the position of the nozzle is shifted stepwise or steplessly, the discharge unevenness does not become linear.

  Specifically, adjacent heads overlap each other at both ends of each head H1a, H1b, H1c, and in the overlapping region, the effective nozzle group H21 in which the nozzles of each head H1a, H1b, H1c are in a discharge state; It is divided into an ineffective nozzle group H22 in a non-ejection state. Then, the division position changes momentarily in the overlap area with scanning, and for example, the division position of the second head H1b changes along with the change of the division position of the first head H1a. It should be noted that the total number of nozzles in the effective nozzle group H21 where the current ejection is performed and the total number of nozzles in the non-effective nozzle group H22 where the current ejection is not performed are invariable in the scanning process.

  In the present embodiment, the heads H1a, H1b, and H1c are long, and the major axis direction is inclined by a predetermined angle with respect to the scanning direction. For example, as shown in FIG. The heads H1a, H1b, and H1c may be arranged so as to be substantially orthogonal to each other. Further, when scanning is performed by reciprocating a plurality of times within the discharge region 132, as shown in FIG. 13, the discharge mode (b) at the subsequent scan is different from the discharge mode (a) at the previous scan. It can also be made. Specifically, as shown in (a) and (b), the division position of the effective nozzle and the ineffective nozzle of the first head H1a at a predetermined position in the scanning direction is different for each scan.

  After performing the material application process as described above, a drying process as shown in FIG. 6 is performed. That is, the first composition after discharge is dried, the solvent contained in the first composition is evaporated, and the hole injection / transport layer 110a is formed. When the drying process is performed, the evaporation of the solvent contained in the liquid composition mainly occurs near the inorganic bank layer 112a and the organic bank layer 112b, and the hole injection / transport layer forming material is concentrated along with the evaporation of the solvent. To precipitate. As a result, as shown in FIG. 6, a peripheral edge portion 110a2 made of a hole injection / transport layer forming material is formed on the first stacked portion 112e. The peripheral edge 110a2 is in close contact with the wall surface (organic bank layer 112b) of the upper opening 112d. The thickness of the peripheral edge 110a2 is thin on the side close to the electrode surface 111a, and the side remote from the electrode surface 111a, that is, the organic bank layer 112b. It is thicker on the side closer to.

  At the same time, the evaporation of the solvent also occurs on the electrode surface 111a by the drying process, thereby forming the flat portion 110a1 made of the hole injection / transport layer forming material on the electrode surface 111a. Since the evaporation rate of the solvent is almost uniform on the electrode surface 111a, the material for forming the hole injection / transport layer is uniformly concentrated on the electrode surface 111a, thereby forming a flat portion 110a1 having a uniform thickness. . In this way, the hole injection / transport layer 110a composed of the peripheral portion 110a2 and the flat portion 110a1 is formed. Note that the hole injection / transport layer may be formed only on the electrode surface 111a without being formed on the peripheral edge portion 110a2.

  The drying process is performed, for example, in a nitrogen atmosphere at room temperature and a pressure of, for example, about 133.3 Pa (1 Torr). If the pressure is too low, the composition droplets 110c will bump, which is not preferable. On the other hand, if the temperature is higher than room temperature, the evaporation rate of the polar solvent increases and a flat film cannot be formed. After the drying treatment, it is preferable to remove the polar solvent and water remaining in the hole injecting / transporting layer 110a by performing heat treatment in nitrogen, preferably in vacuum, at 200 ° C. for about 10 minutes.

  In the hole injecting / transporting layer forming step, the discharged composition droplet 110c is filled in the lower and upper openings 112c and 112d, while the liquid repellent treated organic bank layer 112b is used as a liquid composition. Objects are repelled and roll into the lower and upper openings 112c and 112d. Thus, the discharged droplets 110c of the composition can be surely filled in the lower and upper openings 112c and 112d, and the hole injection / transport layer 110a can be formed on the electrode surface 111a.

(3) Light emitting layer forming step The light emitting layer forming step includes a light emitting layer forming material discharging step and a drying step.
Similar to the hole injection / transport layer forming step described above, the liquid composition for forming the light emitting layer is discharged onto the hole injection / transport layer 110a by the ink jet method. Thereafter, the discharged liquid composition is dried (and heat-treated) to form the light emitting layer 110b on the hole injection / transport layer 110a.

In FIG. 7, the discharge process of the liquid composition containing the light emitting layer forming material by inkjet is shown. As shown in the figure, the inkjet head H5 and the substrate 2 are moved relative to each other, and a liquid composition containing a light emitting layer forming material for each color (for example, blue (B) here) is ejected from an ejection nozzle H6 formed on the inkjet head. Is done.
At the time of discharge, the liquid composition is discharged while the discharge nozzle is opposed to the hole injection / transport layer 110a located in the lower and upper openings 112c and 112d and the inkjet head H5 and the substrate 2 are relatively moved. The The amount of liquid discharged from the discharge nozzle H6 is controlled per drop. Thus, the liquid (liquid composition droplet 110e) whose liquid amount is controlled is discharged from the discharge nozzle, and the liquid composition droplet 110e is discharged onto the hole injection / transport layer 110a.

  In the present embodiment, following the arrangement of the liquid composition droplets 110e, another liquid composition for the light emitting layer is discharged. That is, as shown in FIG. 8, the liquid composition droplets 110f and 110g are ejected and arranged without drying the liquid composition droplets 110e dropped on the substrate 2. When the liquid composition droplets 110e to 110g for forming the light emitting layers 110b1 to 110b3 for the respective colors are dropped as described above, a plurality of ejection heads respectively filled with the liquid compositions for the respective colors are independently scanned. The liquid composition droplets 110e to 110g may be arranged on the substrate 2 and the liquid compositions 110e to 110f can be arranged almost simultaneously by scanning the plurality of ejection heads integrally. Also good.

  As shown in FIG. 8, the discharged liquid compositions 110e to 110g spread on the hole injection / transport layer 110a and fill the lower and upper openings 112c and 112d. On the other hand, even if the liquid composition droplets 110e to 110g are removed from the predetermined discharge position and discharged onto the upper surface 112f on the upper surface 112f subjected to the liquid repellent treatment, the upper surface 112f gets wet with the liquid composition droplets 110e to 110g. The liquid composition droplets 110e to 110g roll into the lower and upper openings 112c and 112d. The amount of the liquid composition discharged onto each hole injection / transport layer 110a is the size of the lower and upper openings 112c and 112d, the thickness of the light emitting layer 110b to be formed, and the concentration of the light emitting layer material in the liquid composition. Etc. are determined. Also in the light emitting layer forming step, ejection is performed by head scanning as shown in FIGS. 11 and 16 as in the hole injecting / transporting layer forming step.

  Examples of the light emitting layer forming material include polyfluorene polymer derivatives, (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, and organic polymers described above. An EL material can be used after being doped. For example, it can be used by doping rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like. The same kind of solvent is used for each color light emitting layer as a solvent for dissolving or dispersing these light emitting layer forming materials.

  Next, after the liquid compositions 110e to 110g for the respective colors have been disposed at predetermined positions, the light emitting layers 110b1 to 110b3 are formed by collectively drying. That is, the solvent contained in the liquid composition droplets 110e to 110g evaporates by drying to form a red (R) light emitting layer 110b1, a green (G) light emitting layer 110b2, and a blue (B) light emitting layer 110b3 as shown in FIG. Is done. In FIG. 9, one light emitting layer emitting red, green, and blue is shown one by one. However, as apparent from FIG. 1 and other figures, the light emitting elements are originally formed in a matrix. There are a large number of light-emitting layers (corresponding to each color) not shown.

  Moreover, it is preferable to dry the liquid composition of the light emitting layer by vacuum drying. To give a specific example, it is performed under a condition in which a pressure is set to about 133.3 Pa (1 Torr) in a nitrogen atmosphere at room temperature. it can. If the pressure is too low, the liquid composition will be bumped, which is not preferable. Further, if the temperature is higher than room temperature, the evaporation rate of the solvent is increased, and a large amount of the light emitting layer forming material adheres to the wall surface of the upper opening 112d.

Next, when the vacuum drying is completed, it is preferable to anneal the light emitting layer 110b using a heating means such as a hot plate. This annealing process is performed at a common temperature and time that can maximize the light emission characteristics of each organic EL layer.
In this manner, the hole injection / transport layer 110a and the light emitting layer 110b are formed on the pixel electrode 111.

In addition, prior to the light emitting layer forming material discharge step, a surface modification step may be performed in order to modify the surface of the hole injection / transport layer 110a.
In the light emitting layer forming step, in order to prevent re-dissolution of the hole injection / transport layer 110a, a solvent insoluble in the hole injection / transport layer 110a is used as a solvent for the liquid composition used in forming the light emitting layer. It is preferable to use it. However, since the hole injection / transport layer 110a has low affinity for the solvent, the hole injection / transport layer 110a can be used even when a liquid composition containing a solvent is discharged onto the hole injection / transport layer 110a. And the light emitting layer 110b cannot be brought into close contact with each other, or the light emitting layer 110b may not be uniformly applied. Therefore, in order to increase the affinity of the surface of the hole injection / transport layer 110a with respect to the solvent and the light emitting layer forming material, it is preferable to perform a surface modification step before forming the light emitting layer.

  In the surface modification step, a surface modifying material that is the same solvent as the solvent of the liquid composition used for forming the light emitting layer or a similar solvent is applied by an inkjet method (droplet discharge method), a spin coating method, or a dip method. It can be performed by drying after coating on the hole injection / transport layer 110a. Examples of the surface modifier used here include cyclohexylbenzene, isopropylbiphenyl, trimethylbenzene and the like as the same solvent as the liquid composition, and examples of the surface modifier include tetramethyl. Examples thereof include benzenetoluene, toluene, xylene and the like.

(4) Cathode Formation Step Next, as shown in FIG. 10, the cathode 12 that forms a pair with the pixel electrode (anode) 111 is formed. That is, the cathode 12 having a structure in which, for example, a calcium layer and an aluminum layer are sequentially stacked is formed on the entire surface of the substrate 2 including the light emitting layers 110b and the organic bank layers 112b. Thereby, the cathode 12 is laminated | stacked on the whole formation area of each color light emitting layer 110b, and the organic EL element corresponding to each color of red, green, and blue is each formed.

The cathode 12 is preferably formed by, for example, an evaporation method, a sputtering method, a CVD method, or the like, and particularly preferably formed by an evaporation method in terms of preventing damage to the light emitting layer 110b due to heat. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 12 to prevent oxidation.

(5) Sealing process Finally, the board | substrate 2 with which the organic EL element was formed, and the sealing substrate prepared separately are sealed via sealing resin. For example, a sealing resin made of a thermosetting resin or an ultraviolet curable resin is applied to the peripheral portion of the substrate 2 and the sealing substrate is disposed on the sealing resin. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. If it is carried out in the air, when a defect such as a pinhole has occurred in the cathode 12, water or oxygen may enter the cathode 12 from the defective portion and the cathode 12 may be oxidized, which is not preferable.

  Thereafter, the cathode 12 is connected to the wiring of the substrate 2, and the wiring of the circuit element unit 14 is connected to a driving IC (driving circuit) provided on or outside the substrate 2, whereby the organic EL device of the present embodiment. Complete.

According to the manufacturing method as described above, a discharge pattern in which the discharge boundary between the adjacent head H1a and the head H1b is non-linear is formed when droplets are discharged using the ink jet apparatus. Compared with the case where the boundary is formed, it is possible to reduce the influence that may be caused by the ejection unevenness between the heads.
That is, in the film formed by the droplet discharge method using the ink jet apparatus, streak-like discharge unevenness is difficult to occur, and even if it occurs, the discharge unevenness in a zigzag or random state is generated. The influence on the properties of the film to be formed can be mitigated. As a result, an organic EL device having excellent optical characteristics can be manufactured.

  In the present embodiment, the organic EL device and the manufacturing method thereof have been described. However, the present invention includes a manufacturing method of a color filter substrate in which color material layers of a plurality of colors are arranged and a semiconductor device such as an organic TFT. The present invention can also be applied to a device manufacturing method, and in these color filter manufacturing method and device manufacturing method of the present invention, an effect of improving the flatness of a color material layer and a functional layer to be formed can be obtained. Of course.

(Electronics)
FIG. 18 shows an embodiment of an electronic apparatus according to the invention. The electronic apparatus of this embodiment includes the above-described organic EL device as a display unit. Here, an example of a mobile phone is shown in a perspective view, reference numeral 1000 indicates a mobile phone main body, and reference numeral 1001 indicates a display unit using the organic EL device 1 described above. As described above, in an electronic apparatus including the organic EL device according to this embodiment as a display unit, good light emission characteristics can be obtained.

1 is a circuit diagram of an organic EL device according to an embodiment. FIG. The cross-sectional block diagram of a display area same as the above. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Explanatory drawing which shows the scanning aspect of a head, and the discharge aspect of a droplet. Explanatory drawing which shows the scanning aspect and discharge aspect at the time of using a head different from FIG. Explanatory drawing which shows the modification of a scanning aspect and a discharge aspect. FIG. 3 is a plan configuration diagram of a head according to the embodiment. 1 is a plan configuration diagram of an ink jet apparatus according to an embodiment. FIG. 3 is an explanatory diagram showing the position of a discharge nozzle in the head. Explanatory drawing which shows the conventional scanning aspect and discharge aspect. The perspective view which shows an example of an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate, 110 ... Organic EL layer (electro-optic layer), 110a ... Hole injection / transport layer, 110b ... Light emitting layer, 111 ... Pixel electrode, 112 ... Bank part (partition wall part), 112a ... Inorganic bank layer (first layer) 1 partition wall), 112b... Organic bank layer (second partition wall), 112e... First laminated portion (projection), H1... Inkjet head (droplet discharge head), H1a... Inkjet head (first head), H1b ... inkjet head (second head), H2 ... nozzle, H21 ... effective nozzle group (first nozzle group), H22 ... ineffective nozzle group (second nozzle group)

Claims (4)

A droplet discharge apparatus including a plurality of droplet discharge heads,
The plurality of droplet discharge heads are reciprocally scanned a plurality of times and scanned in the same direction each time, and the droplet discharge heads are arranged in a row in a direction crossing the scanning direction, Each having a plurality of nozzles arranged in a row in a predetermined direction intersecting with the scanning direction, each of which is formed in a longitudinal shape and arranged so that the longitudinal direction forms a predetermined inclination angle with respect to the scanning direction, A part of the first head and a part of the second head are provided so as to overlap each other in the scanning direction at a boundary portion between the adjacent first head and second head among the heads arranged in a row. ,
The plurality of droplet discharge heads includes a first nozzle group in which the plurality of nozzles of the first head and the second head are in an effective discharge state in an overlapping region where the first head and the second head overlap. It is formed so as to be divided into a second nozzle group in an ineffective discharge state,
In the plurality of droplet discharge heads, the division position of the first nozzle group and the second nozzle group changes within the overlap region, and the division position is the first nozzle group of the first head and the first nozzle group. The first nozzle group in the first head is continuous with the first nozzle group of two heads in the predetermined direction, and the number of first nozzle groups in the effective ejection state in the first head is unchanged. As the position of one end of the nozzle group changes, the position of the other end changes, and the division position is in one direction along the predetermined direction and in the other direction opposite to the one direction, respectively. Stepwise and periodically changing, and the stepwise movement amount and movement period of the division position in the one direction and the other direction are equal for each scan, and the division position is the scan each time. Multiple scans to make it different for each Droplet discharge apparatus characterized by being formed on Migihitsuji. A droplet discharge method using a droplet discharge apparatus including a plurality of droplet discharge heads,
The plurality of droplet discharge heads are reciprocally scanned a plurality of times and scanned in the same direction each time, and the droplet discharge heads are arranged in a row in a direction crossing the scanning direction, Each having a plurality of nozzles arranged in a row in a predetermined direction intersecting with the scanning direction, each of which is formed in a longitudinal shape and arranged so that the longitudinal direction forms a predetermined inclination angle with respect to the scanning direction, A part of the first head and a part of the second head are provided so as to overlap each other in the scanning direction at a boundary portion between the adjacent first head and second head among the heads arranged in a row. ,
The plurality of droplet discharge heads includes a first nozzle group in which the plurality of nozzles of the first head and the second head are in an effective discharge state in an overlapping region where the first head and the second head overlap. It is formed so as to be divided into a second nozzle group in an ineffective discharge state,
In the plurality of scans, the division position of the first nozzle group and the second nozzle group changes within the overlap region, and the division position is changed between the first nozzle group and the second nozzle of the first head. The first nozzles in the first head such that the number of the first nozzle groups in the first head is continuous with the first nozzle group in the head and the number of the first nozzle groups in the effective ejection state in the first head is unchanged. As the position of one end of the group changes, the position of the other end changes, and the division position is stepped in one direction along the predetermined direction and in another direction opposite to the one direction. And the stepwise movement amount and movement period of the division position in the one direction and the other direction are equal for each scan, and the division position is for each scan. Multiple scans so that Droplet discharge method, characterized in that the Hare. A method of manufacturing a color filter substrate comprising a plurality of colored layers of a plurality of colors in a predetermined pattern,
A method of manufacturing a color filter substrate, wherein the pattern of each colored layer is formed using the droplet discharge device according to claim 1. A method of manufacturing an electro-optical device including a plurality of types of electro-optical layers in a predetermined pattern,
A method of manufacturing an electro-optical device, wherein the pattern of each electro-optical layer is formed using the droplet discharge device according to claim 1.

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