JP4585255B2 - Phenol aralkyl resin and method for producing the same - Google Patents
Phenol aralkyl resin and method for producing the same Download PDFInfo
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- JP4585255B2 JP4585255B2 JP2004239321A JP2004239321A JP4585255B2 JP 4585255 B2 JP4585255 B2 JP 4585255B2 JP 2004239321 A JP2004239321 A JP 2004239321A JP 2004239321 A JP2004239321 A JP 2004239321A JP 4585255 B2 JP4585255 B2 JP 4585255B2
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- Prior art keywords
- phenol aralkyl
- aralkyl resin
- reaction
- phenol
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- 239000011347 resin Substances 0.000 title claims description 46
- 229920005989 resin Polymers 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 24
- -1 aralkyl compound Chemical class 0.000 claims description 17
- 150000002989 phenols Chemical class 0.000 claims description 16
- DAJPMKAQEUGECW-UHFFFAOYSA-N 1,4-bis(methoxymethyl)benzene Chemical group COCC1=CC=C(COC)C=C1 DAJPMKAQEUGECW-UHFFFAOYSA-N 0.000 claims description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- 239000013638 trimer Substances 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- 239000000539 dimer Substances 0.000 claims description 9
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 7
- 150000005846 sugar alcohols Polymers 0.000 claims description 6
- 238000001641 gel filtration chromatography Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 150000004292 cyclic ethers Chemical class 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 238000002523 gelfiltration Methods 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 3
- 150000003462 sulfoxides Chemical class 0.000 claims description 3
- 239000006184 cosolvent Substances 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 125000003158 alcohol group Chemical group 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 20
- 235000011007 phosphoric acid Nutrition 0.000 description 17
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 239000012071 phase Substances 0.000 description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 8
- 150000003016 phosphoric acids Chemical class 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 6
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000005191 phase separation Methods 0.000 description 6
- 150000001298 alcohols Chemical class 0.000 description 5
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229940078552 o-xylene Drugs 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- VDFVNEFVBPFDSB-UHFFFAOYSA-N 1,3-dioxane Chemical compound C1COCOC1 VDFVNEFVBPFDSB-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- ZCONCJFBSHTFFD-UHFFFAOYSA-N 2,3,5-triethylphenol Chemical compound CCC1=CC(O)=C(CC)C(CC)=C1 ZCONCJFBSHTFFD-UHFFFAOYSA-N 0.000 description 1
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- UITUMGKYHZMNKN-UHFFFAOYSA-N 2-methyl-4-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=C(O)C(C)=C1 UITUMGKYHZMNKN-UHFFFAOYSA-N 0.000 description 1
- QVQDALFNSIKMBH-UHFFFAOYSA-N 2-pentoxyethanol Chemical compound CCCCCOCCO QVQDALFNSIKMBH-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 1
- VBIKLMJHBGFTPV-UHFFFAOYSA-N 3-ethoxyphenol Chemical compound CCOC1=CC=CC(O)=C1 VBIKLMJHBGFTPV-UHFFFAOYSA-N 0.000 description 1
- YYMPIPSWQOGUME-UHFFFAOYSA-N 3-propoxyphenol Chemical compound CCCOC1=CC=CC(O)=C1 YYMPIPSWQOGUME-UHFFFAOYSA-N 0.000 description 1
- CYEKUDPFXBLGHH-UHFFFAOYSA-N 3-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC(O)=C1 CYEKUDPFXBLGHH-UHFFFAOYSA-N 0.000 description 1
- JAGRUUPXPPLSRX-UHFFFAOYSA-N 4-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=C(O)C=C1 JAGRUUPXPPLSRX-UHFFFAOYSA-N 0.000 description 1
- KIIIPQXXLVCCQP-UHFFFAOYSA-N 4-propoxyphenol Chemical compound CCCOC1=CC=C(O)C=C1 KIIIPQXXLVCCQP-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-MZCSYVLQSA-N Deuterated methanol Chemical class [2H]OC([2H])([2H])[2H] OKKJLVBELUTLKV-MZCSYVLQSA-N 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-N Metaphosphoric acid Chemical compound OP(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical group OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- YWMLORGQOFONNT-UHFFFAOYSA-N [3-(hydroxymethyl)phenyl]methanol Chemical group OCC1=CC=CC(CO)=C1 YWMLORGQOFONNT-UHFFFAOYSA-N 0.000 description 1
- BWVAOONFBYYRHY-UHFFFAOYSA-N [4-(hydroxymethyl)phenyl]methanol Chemical group OCC1=CC=C(CO)C=C1 BWVAOONFBYYRHY-UHFFFAOYSA-N 0.000 description 1
- YDHWWBZFRZWVHO-UHFFFAOYSA-N [hydroxy(phosphonooxy)phosphoryl] phosphono hydrogen phosphate Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(=O)OP(O)(O)=O YDHWWBZFRZWVHO-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- DENRZWYUOJLTMF-UHFFFAOYSA-N diethyl sulfate Chemical compound CCOS(=O)(=O)OCC DENRZWYUOJLTMF-UHFFFAOYSA-N 0.000 description 1
- 229940008406 diethyl sulfate Drugs 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229940030980 inova Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000008442 polyphenolic compounds Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- 229940048102 triphosphoric acid Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
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Description
本発明は、フェノールアラルキル樹脂及びその製造方法に関するものである。 The present invention relates to a phenol aralkyl resin and a method for producing the same.
熱硬化性樹脂組成物は、耐熱性、耐衝撃性、耐クラック性、耐湿性、作業性、電気特性において優れており、積層板、成型材料、鋳型材料、接着材料、注型材料など、広く利用されている。特にIC封止用成型材料には好適に用いられている。 Thermosetting resin compositions are excellent in heat resistance, impact resistance, crack resistance, moisture resistance, workability, and electrical properties, and are widely used in laminates, molding materials, mold materials, adhesive materials, casting materials, etc. It's being used. In particular, it is suitably used as a molding material for IC sealing.
近年、封止材、成型材料分野において高耐熱性が求められる傾向があり、無機フィラーの配合量を増やし、有機バインダーを減らすことで耐熱性を上げる方法がとられているが、この場合に接着性を確保するためには、有機バインダーに、無機フィラーの隙間に流れ込むような流動性が要求される。 In recent years, there is a tendency for high heat resistance to be demanded in the fields of sealing materials and molding materials, and a method of increasing heat resistance by increasing the blending amount of inorganic filler and reducing organic binder has been adopted. In order to ensure the property, the organic binder is required to have fluidity so as to flow into the gaps of the inorganic filler.
この様な有機バインダーとして、通常のフェノール樹脂に比べ耐熱性に優れると共に、フェノール樹脂と同様に、エポキシ樹脂等と反応し、熱硬化性樹脂組成物を与ることができ、エポキシ樹脂用ベースレジンとしても利用することができるフェノールアラルキル樹脂が注目されている(特許文献1,2)。 As such an organic binder, it has excellent heat resistance compared to ordinary phenol resins, and, like phenol resins, can react with epoxy resins and give thermosetting resin compositions. Attention has been focused on phenol aralkyl resins that can also be used as (Patent Documents 1 and 2).
しかし、特許文献1,2に記載されたフェノールアラルキル樹脂は、3量体および4量体の含有量が低いため、耐熱性と流動性のバランスが充分ではないという問題があった。
However, the phenol aralkyl resins described in
本発明は、耐熱性と流動性のバランスに優れたフェノールアラルキル樹脂、及びその様なフェノールアラルキル樹脂を高収率で製造することができる製造方法を提供することを目的とする。 An object of this invention is to provide the manufacturing method which can manufacture such a phenol aralkyl resin excellent in the balance of heat resistance and fluidity | liquidity, and such a phenol aralkyl resin with a high yield.
即ち、本発明のフェノールアラルキル樹脂の製造方法は、フェノール類と、フェノール類1モルに対して0.5〜0.85モルの下記一般式(1)で示されるアラルキル化合物とを、りん酸類及び反応補助溶媒としての非反応性含酸素有機溶媒(但し、メタノール、アセトン、ブタノール、プロパノールを除く)の存在下で不均一系反応させる工程を有することを特徴とし、本発明のフェノールアラルキル樹脂は、当該製造方法により製造されたフェノールアラルキル樹脂であって、ゲル濾過クロマトグラフの面積法による測定で、3量体成分と4量体成分の合計含有量が35%以上であることを特徴とする。 That is, the method for producing a phenol aralkyl resin of the present invention comprises phenols and 0.5 to 0.85 mol of an aralkyl compound represented by the following general formula (1) per mol of phenol, phosphoric acid and The phenol aralkyl resin of the present invention is characterized by having a heterogeneous reaction in the presence of a non-reactive oxygen-containing organic solvent (excluding methanol, acetone, butanol, and propanol) as a reaction auxiliary solvent . A phenol aralkyl resin produced by the production method, wherein the total content of the trimer component and the tetramer component is 35% or more as measured by an area method of gel filtration chromatography.
本発明のフェノールアラルキル樹脂は、3量体及び4量体の含有量が高く、耐熱性と流動性のバランスに優れる。 The phenol aralkyl resin of the present invention has a high content of trimers and tetramers, and is excellent in the balance between heat resistance and fluidity.
また、本発明の製造方法は、3量体及び4量体の含有量が高く、しかも、揮発性が高く作業環境を悪化させる未反応モノマー、耐熱性向上に寄与しにくい2量体及び流動性向上に寄与しにくい高次縮合物の含有量が低く、耐熱性と流動性のバランスに優れたフェノールアラルキル樹脂を高収率で製造することができる。しかも、本発明の製造方法は、反応選択率が高く、パラ結合率の高いフェノールアラルキル樹脂を製造することができる。 In addition, the production method of the present invention has high content of trimer and tetramer, unreacted monomer having high volatility and deteriorating working environment, dimer and fluidity that hardly contribute to improvement of heat resistance. A phenol aralkyl resin having a low content of a high-order condensate that hardly contributes to improvement and an excellent balance between heat resistance and fluidity can be produced in a high yield. Moreover, the production method of the present invention can produce a phenol aralkyl resin having a high reaction selectivity and a high para bond rate.
本発明のフェノールアラルキル樹脂は、ゲル濾過クロマトグラフの面積法による測定で、3量体成分と4量体成分の合計含有量が35%以上、好ましくは40%以上である。3量体成分と4量体成分の合計含有量が35%以上であれば、硬化の際に3次元架橋をしやすいため耐熱性に優れると共に、流動性も良い。 The phenol aralkyl resin of the present invention has a total content of a trimer component and a tetramer component of 35% or more, preferably 40% or more, as measured by an area method of gel filtration chromatography. If the total content of the trimer component and the tetramer component is 35% or more, it is excellent in heat resistance and good in fluidity because it is easy to perform three-dimensional crosslinking during curing.
本発明のフェノールアラルキル樹脂は、メチレン基のオルソ/パラ結合比が0.46以下であることが好ましく、より好ましくは0.44以下、さらに好ましくは0.43以下である。ここで、オルソ/パラ結合比とは、メチレン基のフェノール水酸基に対する結合位置を示す、オルソ結合メチレン基数とパラ結合メチレン基数との比(オルソ結合/パラ結合)であり、13C−NMRにより測定された値である。オルソ/パラ結合比が0.46を超えると、メチレン基のオルソ結合の比率が高くなるため、嵩高いアラルキル基によってブロックされる立体障害が発生し、エポキシ樹脂の原料として用いた場合にエポキシ化反応を阻害する可能性、及びエポキシ樹脂の硬化剤として用いた場合にエポキシ基との反応を阻害する可能性がある。 In the phenol aralkyl resin of the present invention, the ortho / para bond ratio of the methylene group is preferably 0.46 or less, more preferably 0.44 or less, and further preferably 0.43 or less. Here, the ortho / para bond ratio is the ratio (ortho bond / para bond) between the number of ortho-bonded methylene groups and the number of para-bonded methylene groups, which indicates the bonding position of the methylene group to the phenolic hydroxyl group, measured by 13 C-NMR. Value. If the ortho / para bond ratio exceeds 0.46, the ratio of the ortho bond of the methylene group increases, resulting in steric hindrance blocked by bulky aralkyl groups, and epoxidation when used as a raw material for epoxy resins. The reaction may be inhibited, and when used as a curing agent for an epoxy resin, the reaction with an epoxy group may be inhibited.
また、ゲル濾過クロマトグラフの面積法による測定で、2量体成分の含有量が35%以下であることが好ましく、より好ましくは30%以下である。2量体は反応点が2箇所しかなく、硬化の際に3次元架橋をすることができないため、この様な2量体成分の含有量が35%を超えると、耐熱性が充分でない可能性がある。 Moreover, it is preferable that content of a dimer component is 35% or less by measurement by the area method of a gel filtration chromatograph, More preferably, it is 30% or less. The dimer has only two reactive sites and cannot be three-dimensionally crosslinked during curing. If the content of such a dimer component exceeds 35%, the heat resistance may not be sufficient. There is.
さらには、ゲル濾過クロマトグラフ測定による重量平均分子量(Mw)と数平均分子量(Mn)との分散比(Mw/Mn)が1.7以下であることが好ましく、より好ましくは1.5以下、さらに好ましくは1.3以下である。分散比(Mw/Mn)が1.7を超えると、耐熱性と流動性との両立ができなくなる可能性がある。 Furthermore, the dispersion ratio (Mw / Mn) of the weight average molecular weight (Mw) and the number average molecular weight (Mn) by gel filtration chromatography is preferably 1.7 or less, more preferably 1.5 or less, More preferably, it is 1.3 or less. If the dispersion ratio (Mw / Mn) exceeds 1.7, it may be impossible to achieve both heat resistance and fluidity.
この様なフェノールアラルキル樹脂を高収率で製造できる本発明の製造方法は、原料としてフェノール類及びアラルキル化合物、酸触媒としてリン酸類を必須とし、これらから形成される二相分離状態を機械的攪拌、超音波等によりかき混ぜ混合して、二相(有機相と水相)が交じり合った白濁状の不均一反応系において、フェノール類とアラルキル化合物との反応を進めて縮合物(樹脂)を合成する。 The production method of the present invention capable of producing such a phenol aralkyl resin in a high yield requires phenols and an aralkyl compound as raw materials, and phosphoric acids as an acid catalyst, and mechanically stirs the two-phase separation state formed therefrom. In a heterogeneous reaction system of white turbidity in which two phases (organic phase and aqueous phase) are mixed by mixing with ultrasonic waves, etc., the reaction between phenols and aralkyl compounds proceeds to synthesize a condensate (resin). To do.
反応原料として用いるフェノール類としては、例えば、フェノール、m−クレゾール、p−クレゾール、o−クレゾール、2,3−キシレノール、2,5−キシレノール、3,5−キシレノール、3,4−キシレノールなどのキシレノール類、m−エチルフェノール、p−エチルフェノール、o−エチルフェノール、2,3,5−トリメチルフェノール、2,3,5−トリエチルフェノール、4−tert−ブチルフェノール、3−tert−ブチルフェノール、2−tert−ブチルフェノール、2−tert−ブチル−4−メチルフェノール、2−tert−ブチル−5−メチルフェノール、6−tert−ブチル−3−メチルフェノールなどのアルキルフェノール類、p−メトキシフェノール、m−メトキシフェノール、p−エトキシフェノール、m−エトキシフェノール、p−プロポキシフェノール、m−プロポキシフェノールなどのアルコキシフェノール類、o−イソプロペニルフェノール、p−イソプロペニルフェノール、2−メチル−4−イソプロペニルフェノール、2−エチル−4−イソプロペニルフェノールなどのイソプロペニルフェノール類、4,4’−ジヒドロキシビフェニル、ビスフェノールA、フェニルフェノール、レゾルシノール、ヒドロキノン、ピロガロールなどのポリヒドロキシフェノール類などを挙げることができる。 Examples of phenols used as a reaction raw material include phenol, m-cresol, p-cresol, o-cresol, 2,3-xylenol, 2,5-xylenol, 3,5-xylenol, and 3,4-xylenol. Xylenols, m-ethylphenol, p-ethylphenol, o-ethylphenol, 2,3,5-trimethylphenol, 2,3,5-triethylphenol, 4-tert-butylphenol, 3-tert-butylphenol, 2- alkylphenols such as tert-butylphenol, 2-tert-butyl-4-methylphenol, 2-tert-butyl-5-methylphenol, 6-tert-butyl-3-methylphenol, p-methoxyphenol, m-methoxyphenol P-Ethoxy Alkoxyphenols such as enol, m-ethoxyphenol, p-propoxyphenol, m-propoxyphenol, o-isopropenylphenol, p-isopropenylphenol, 2-methyl-4-isopropenylphenol, 2-ethyl-4- Examples thereof include isopropenylphenols such as isopropenylphenol, polyhydroxyphenols such as 4,4′-dihydroxybiphenyl, bisphenol A, phenylphenol, resorcinol, hydroquinone and pyrogallol.
フェノール類は、上記の例示に限定はされず、またそれぞれ単独で使用してもよいし、2種類以上を併用してもよい。尚、オルソ/パラ結合比が0.46以下であるフェノールアラルキル樹脂を製造する場合には、水酸基に対してパラ位に置換基を有するフェノール類の全フェノール類に占める割合を15質量%以下とするのが好ましい。 The phenols are not limited to the above examples, and may be used alone or in combination of two or more. In the case of producing a phenol aralkyl resin having an ortho / para bond ratio of 0.46 or less, the proportion of phenols having a substituent at the para-position to the hydroxyl group in the total phenols is 15% by mass or less. It is preferable to do this.
フェノール類の添加方法は、原料と共に一括して仕込む方法、あるいは反応の進行と共に分割して加えていく方法など、目的に適した方法を採用してよい。 As a method for adding phenols, a method suitable for the purpose, such as a method in which the raw materials are added together with the raw materials or a method in which the phenols are added in a divided manner as the reaction proceeds, may be employed.
反応原料として用いるアラルキル化合物は、下記一般式(1)で示される。 The aralkyl compound used as a reaction raw material is represented by the following general formula (1).
具体的には、例えば、α,α’−ジヒドロキシ−p−キシレン、α,α’−ジヒドロキシ−m−キシレン、α,α’−ジヒドロキシ−o−キシレン等のアラルキルアルコール、α,α’−ジメトキシ−p−キシレン(PXDM)、α,α’−ジメトキシ−m−キシレン、α,α’−ジメトキシ−o−キシレン、α,α’−ジエトキシ−p−キシレン、α,α’−ジエトキシ−m−キシレン、α,α’−ジエトキシ−o−キシレン、α−ヒドロキシ−α’−メトキシ−p−キシレン、α−ヒドロキシ−α’−メトキシ−m−キシレン、α−ヒドロキシ−α’−メトキシ−o−キシレン、α−エトキシ−α’−ヒドロキシ−p−キシレン、α−エトキシ−α’−ヒドロキシ−m−キシレン、α−エトキシ−α’−ヒドロキシ−o−キシレン、α−エトキシ−α’−メトキシ−p−キシレン、α−エトキシ−α’−メトキシ−m−キシレン、α−エトキシ−α’−メトキシ−o−キシレン等のアラルキルエーテルが挙げられ、これらのうちでも、α,α’−ジメトキシ−p−キシレン(PXDM)が好ましい。 Specifically, for example, aralkyl alcohol such as α, α′-dihydroxy-p-xylene, α, α′-dihydroxy-m-xylene, α, α′-dihydroxy-o-xylene, α, α′-dimethoxy -P-xylene (PXDM), α, α'-dimethoxy-m-xylene, α, α'-dimethoxy-o-xylene, α, α'-diethoxy-p-xylene, α, α'-diethoxy-m- Xylene, α, α'-diethoxy-o-xylene, α-hydroxy-α'-methoxy-p-xylene, α-hydroxy-α'-methoxy-m-xylene, α-hydroxy-α'-methoxy-o- Xylene, α-ethoxy-α'-hydroxy-p-xylene, α-ethoxy-α'-hydroxy-m-xylene, α-ethoxy-α'-hydroxy-o-xylene, α-ethoxy-α'-methoxy Examples include aralkyl ethers such as cis-p-xylene, α-ethoxy-α′-methoxy-m-xylene, α-ethoxy-α′-methoxy-o-xylene, and among these, α, α′-dimethoxy -P-xylene (PXDM) is preferred.
アラルキル化合物は、上記の例に限定はされず、また、それぞれ単独で使用してもよいし、2種類以上を併用してもよい。 Aralkyl compounds are not limited to the above examples, and may be used alone or in combination of two or more.
アラルキル化合物の添加方法は、原料と共に一括して仕込む方法、反応の進行と共に分割して加えていく方法など、目的に適した方法を採用してよい。 As a method for adding the aralkyl compound, a method suitable for the purpose, such as a method in which the aralkyl compound is added together with the raw material or a method in which the aralkyl compound is added in a divided manner as the reaction proceeds, may be employed.
フェノール類とアラルキル化合物との配合比(フェノール類/アラルキル化合物)はモル基準で0.5〜0.85、好ましくは0.55〜0.7である。配合比が0.5未満では、2量体以下の成分の含有量を減少させることが難しくなり、逆に0.85を超えると3量体、4量体の含有量が減少する。 The compounding ratio of phenols to aralkyl compounds (phenols / aralkyl compounds) is 0.5 to 0.85, preferably 0.55 to 0.7 on a molar basis. When the blending ratio is less than 0.5, it is difficult to reduce the content of components below the dimer, and conversely when it exceeds 0.85, the content of trimer and tetramer decreases.
反応触媒として用いられるリン酸類は、フェノール類とアラルキル化合物との相分離反応(不均一系反応)の場を形成する重要な役割を果すものであり、このようなリン酸類の例としては、例えばメタリン酸、ピロリン酸、オルトリン酸、三リン酸、四リン酸等のポリリン酸、無水リン酸及びこれらの混合物などが挙げられるが、低コストで入手し易いオルトリン酸水溶液、例えば75質量%リン酸、89質量%リン酸等が一般的に用いられる。 Phosphoric acids used as a reaction catalyst play an important role in forming a phase separation reaction (heterogeneous reaction) between phenols and aralkyl compounds. Examples of such phosphoric acids include, for example, Examples thereof include polyphosphoric acid such as metaphosphoric acid, pyrophosphoric acid, orthophosphoric acid, triphosphoric acid, and tetraphosphoric acid, phosphoric anhydride, and a mixture thereof. An orthophosphoric acid aqueous solution that is easily available at a low cost, for example, 75% by mass phosphoric acid. 89 mass% phosphoric acid is generally used.
リン酸類の配合量は、フェノール類100質量部に対して40質量部以上が好ましく、その上限量は特に制限されるものではないが、反応容積効率、安全性、相分離効果などを勘案すると、好ましくは50〜300質量部、より好ましくは60〜200質量部である。配合量が40質量部未満では、高分子量成分の生成が促進される一方で、低分子量成分とりわけ2量体成分が低減しない傾向がある。 The blending amount of phosphoric acids is preferably 40 parts by mass or more with respect to 100 parts by mass of phenols, and the upper limit is not particularly limited, but considering reaction volume efficiency, safety, phase separation effect, etc. Preferably it is 50-300 mass parts, More preferably, it is 60-200 mass parts. When the blending amount is less than 40 parts by mass, the production of a high molecular weight component is promoted, while the low molecular weight component, particularly the dimer component, tends not to be reduced.
リン酸類の添加方法は、原料と共に一括して仕込む方法、反応の進行と共に分割して加えていく方法など、目的に適した方法を採用してよい。 As a method for adding phosphoric acids, a method suitable for the purpose, such as a method in which the raw materials are added together with a raw material or a method in which the phosphoric acid is added in a divided manner as the reaction proceeds, may be employed.
相分離反応の促進という観点から、反応補助溶媒としての非反応性含酸素有機溶媒を用いることが好ましい。反応補助溶媒としては、アルコール類、多価アルコール系エーテル、環状エーテル類、多価アルコール系エステル、ケトン類、スルホキシド類からなる群から選ばれる少なくとも一種を用いることが好ましい。 From the viewpoint of promoting the phase separation reaction, it is preferable to use a non-reactive oxygen-containing organic solvent as a reaction auxiliary solvent. As the reaction auxiliary solvent, it is preferable to use at least one selected from the group consisting of alcohols, polyhydric alcohol ethers, cyclic ethers, polyhydric alcohol esters, ketones, and sulfoxides.
アルコール類としては、例えば、メタノール、エタノール、プロパノール等の一価アルコール、ブタンジオール、ペンタンジオール、ヘキサンジオール、エチレングリコール、プロピレングリコール、トリメチレングリコール、ジエチレングリコール、ジエチレングリコール、ジプロピレングリコール、トリエチレングリコール、トリプロピレングリコール、ポリエチレングリコール等の二価アルコール、グリセリン等の三価アルコール等が挙げられる。 Examples of alcohols include monohydric alcohols such as methanol, ethanol, and propanol, butanediol, pentanediol, hexanediol, ethylene glycol, propylene glycol, trimethylene glycol, diethylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, and triethylene glycol. Examples thereof include dihydric alcohols such as propylene glycol and polyethylene glycol, and trihydric alcohols such as glycerin.
多価アルコール系エーテルとしては、例えばエチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノブチルエーテル、エチレングリコールモノペンチルエーテル、エチレングリコールジメチルエーテル、エチレングリコールメチルエチルエーテル、エチレングリコールモノフェニルエーテル等のグリコールエーテル類が挙げられる。 Examples of the polyhydric alcohol ether include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monopentyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether, ethylene glycol mono Examples include glycol ethers such as phenyl ether.
環状エーテル類としては、例えば、1,3−ジオキサン、1,4−ジオキサン等が挙げられ、多価アルコール系エステルとしては、例えばエチレングリコールアセテート等のグリコールエステル類等が挙げられ、ケトン類としては、例えば、アセトン、メチルエチルケトン、メチルイソブチルケトン等が挙げられ、スルホキシド類としては、例えばジメチルスルホキシド(DMSO)、ジエチルスルホキシド等が挙げられる。 Examples of the cyclic ethers include 1,3-dioxane and 1,4-dioxane. Examples of the polyhydric alcohol ester include glycol esters such as ethylene glycol acetate. Examples of ketones include Examples include acetone, methyl ethyl ketone, and methyl isobutyl ketone. Examples of sulfoxides include dimethyl sulfoxide (DMSO) and diethyl sulfoxide.
これらの中でも、メタノール、エチレングリコールモノブチルエーテル、エチレングリコール、ポリエチレングリコール、1,4−ジオキサン、ジメチルスルホキシドなどが特に好ましい。 Among these, methanol, ethylene glycol monobutyl ether, ethylene glycol, polyethylene glycol, 1,4-dioxane, dimethyl sulfoxide and the like are particularly preferable.
反応補助溶媒は、これらに限定されず、上記の特質を有しかつ反応時に液状を呈するものであれば固体でも使用することができるし、またそれぞれを単独で使用してもよいし、2種類以上を併用してもよい。 The reaction auxiliary solvent is not limited to these, and can be used as a solid as long as it has the above-mentioned characteristics and exhibits a liquid state at the time of the reaction. You may use the above together.
反応補助溶媒の配合量としては、フェノール類100質量部に対して、好ましくは5〜1000質量部であり、より好ましくは20〜500質量部である。配合量が5質量部未満では溶媒添加効果が認められない可能性があり、また1000質量部を超えると反応速度及び容積効率の点から生産性が低下する可能性がある。 The blending amount of the reaction auxiliary solvent is preferably 5 to 1000 parts by mass and more preferably 20 to 500 parts by mass with respect to 100 parts by mass of the phenols. If the blending amount is less than 5 parts by mass, the effect of adding a solvent may not be recognized, and if it exceeds 1000 parts by mass, the productivity may decrease in terms of reaction rate and volumetric efficiency.
反応補助溶媒の添加方法は、原料と共に一括して仕込む方法、反応の進行と共に分割して加えていく方法など、目的に適した方法を採用してよい。 As a method for adding the reaction auxiliary solvent, a method suitable for the purpose may be employed, such as a method in which the reaction auxiliary solvent is added together with the raw material or a method in which the reaction auxiliary solvent is added in a divided manner as the reaction proceeds.
本発明の製造方法においては、相分離効果の観点から、反応を始める前にあらかじめ系内の水分量を30質量%以下、好ましくは20質量%以下にしておくことが好ましい。反応温度は、反応効率及び相分離効果の観点から、一般に70℃以上の温度が採用されるが、好ましくは80℃以上であり、より好ましくは還流温度である。反応時間は、反応温度、リン酸類の配合量、反応系の含水量、生成物の縮合状況などを考慮しながら決定されるが一般的には1〜50時間程度である。 In the production method of the present invention, from the viewpoint of the phase separation effect, the water content in the system is preferably 30% by mass or less, preferably 20% by mass or less in advance before starting the reaction. From the viewpoint of reaction efficiency and phase separation effect, the reaction temperature is generally 70 ° C or higher, preferably 80 ° C or higher, and more preferably reflux temperature. The reaction time is determined in consideration of the reaction temperature, the amount of phosphoric acid, the water content of the reaction system, the condensation state of the product, etc., but is generally about 1 to 50 hours.
反応終了後には、洗浄工程を有することが好ましい。具体的には、非水溶性有機溶媒(例えばメチルエチルケトン、メチルイソブチルケトン等)を添加混合して縮合物(フェノールアラルキル樹脂)を溶解したのち、静置して有機層(非水溶性有機溶媒、縮合物を含む)と水層(反応補助溶媒、リン酸類を含む)に分離させる。次に、水層は系外に除去した後、リン酸類及び反応補助溶媒を回収し、一方、有機層は湯水洗及び/又は中和した後、減圧蒸留により非水溶性有機溶媒を除去する。 After completion of the reaction, it is preferable to have a washing step. Specifically, a water-insoluble organic solvent (for example, methyl ethyl ketone, methyl isobutyl ketone, etc.) is added and mixed to dissolve the condensate (phenol aralkyl resin), and then allowed to stand to leave an organic layer (a water-insoluble organic solvent, condensation) And a water layer (including a reaction cosolvent and phosphoric acids). Next, after removing the aqueous layer from the system, the phosphoric acids and the reaction auxiliary solvent are recovered, while the organic layer is washed with hot water and / or neutralized, and then the water-insoluble organic solvent is removed by distillation under reduced pressure.
次に、本発明を実施例により更に詳細に説明するが、本発明はこれらの例によってなんら限定される物ではない。なお、実施例に記載の「部」及び「%」は、特に断らない限り「質量部」及び「質量%」を示す。 EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not a thing limited at all by these examples. In the examples, “parts” and “%” indicate “parts by mass” and “% by mass” unless otherwise specified.
また得られたフェノールアラルキル樹脂については下記の試験法により測定した。なお、フェノールアラルキル樹脂の収率は、フェノールアラルキル樹脂の理論収量に対する百分率(質量基準)で表示した。 The obtained phenol aralkyl resin was measured by the following test method. The yield of the phenol aralkyl resin was expressed as a percentage (mass basis) with respect to the theoretical yield of the phenol aralkyl resin.
(1)重量平均分子量(Mw)、数平均分子量(Mn)、分散度(Mw/Mn)
東ソー株式会社製GPC(ゲル濾過クロマトグラフSC−8020、カラム(TSKgel):G2000HXL+G4000HXL、検出器UV‐8011(λ:254nm)、キャリヤー:テトラヒドロフラン1ml/min、カラム温度:38℃)の測定により標準ポリスチレン換算の重量平均分子量(Mw)及び数平均分子量(Mn)を求めて分散度(Mw/Mn)を算出し、数値の小さく1.00に近いことは分子量分布が狭い樹脂であると評価した。
(1) Weight average molecular weight (Mw), number average molecular weight (Mn), dispersity (Mw / Mn)
Measurement of Tosoh Corporation GPC (gel filtration chromatograph SC-8020, column (TSKgel): G2000H XL + G4000H XL , detector UV-8011 (λ: 254 nm), carrier: tetrahydrofuran 1 ml / min, column temperature: 38 ° C.) By calculating the weight average molecular weight (Mw) and the number average molecular weight (Mn) in terms of standard polystyrene, the degree of dispersion (Mw / Mn) is calculated, and a value close to 1.00 means that the resin has a narrow molecular weight distribution. evaluated.
(2)分子量分布
GPC測定で得られた分子量分布の全面積に対する2量体、3量体、4量体、高次縮合体(5量体以上)の面積を百分率で表示する面積法によって算出しそれぞれの成分含有量とした。
(2) Molecular weight distribution Calculated by the area method that displays the area of dimer, trimer, tetramer, and higher-order condensate (pentamer or higher) as a percentage of the total area of the molecular weight distribution obtained by GPC measurement. The content of each component was determined.
(3)軟化点(℃)
JIS−K6910に記載された環球法に準拠し、株式会社メイテック製環球式自動軟化点測定装置ASP−MGK2を使用して測定した。
(3) Softening point (° C)
Based on the ring and ball method described in JIS-K6910, measurement was performed using a ring and ball automatic softening point measuring apparatus ASP-MGK2 manufactured by Meitec Co., Ltd.
(4)コーンプレート溶融粘度(Pa・s/150℃)
コーンプレート溶融粘度計(東亜工業株式会社製CONE PLATE VISCOMETER MODEL CV−1)により測定した。
(4) Cone plate melt viscosity (Pa · s / 150 ° C)
It was measured with a cone plate melt viscometer (CON PLATE VISCOMETER MODEL CV-1 manufactured by Toa Kogyo Co., Ltd.).
(5)オルソ/パラ結合比
核磁気共鳴装置(バリアン社製:INOVA 400)を用い、13C−NMR(100MHz、溶媒:重メタノール−d4)を測定し、次式により算出した。
オルソ/パラ結合比=(a+1/2×b)/(c+1/2×b)
a:オルソ−オルソ結合メチレン吸収帯(29.6〜33.2ppm)の積分値
b:オルソ−パラ結合メチレン吸収帯(34.3〜38.5ppm)の積分値
c:パラ−パラ結合メチレン吸収帯(39.5〜42.9ppm)の積分値
(5) Ortho / para bond ratio 13 C-NMR (100 MHz, solvent: deuterated methanol-d4) was measured using a nuclear magnetic resonance apparatus (manufactured by Varian: INOVA 400), and calculated according to the following formula.
Ortho / para bond ratio = (a + 1/2 × b) / (c + 1/2 × b)
a: integral value of ortho-ortho bond methylene absorption band (29.6-33.2 ppm) b: integral value of ortho-para bond methylene absorption band (34.3-38.5 ppm) c: para-para bond methylene absorption Integrated value of band (39.5-42.9ppm)
<実施例1(参考例)>
温度計、攪拌装置、還流冷却器を備えた反応容器内に、フェノール(P)を94部、α,α’−ジメトキシ−p−キシレン(PXDM)を116部(モル基準:PXDM/P=0.70)、89%リン酸を94部(100%/P)仕込んだ後、攪拌混合により形成される白濁状態(二相混合物)のもとで、120℃まで昇温し、さらに同温度で10時間縮合反応を行ってから反応を停止した。
<Example 1 (reference example) >
In a reaction vessel equipped with a thermometer, a stirrer and a reflux condenser, 94 parts of phenol (P) and 116 parts of α, α′-dimethoxy-p-xylene (PXDM) (molar basis: PXDM / P = 0) 70) and 94 parts (100% / P) of 89% phosphoric acid, and then heated to 120 ° C. under a cloudy state (two-phase mixture) formed by stirring and mixing. After 10 hours of condensation reaction, the reaction was stopped.
次いで攪拌混合しながらメチルイソブチルケトンを添加して縮合物を溶解させた後、攪拌を停止して内容物を分液フラスコ内に移して静置し、メチルイソブチルケトン溶液相(上相)とリン酸水溶液相(下相)に分離させた。次いで、リン酸水溶液相を除去し、メチルイソブチルケトン溶液相を5回水洗してリン酸を除去した後、再び内容物を反応容器内に戻し、減圧蒸留によりメチルイソブチルケトンを完全に除去してフェノールアラルキル樹脂157部(理論収率95%)を得た。 Next, methyl isobutyl ketone is added with stirring and mixing to dissolve the condensate, and stirring is stopped and the contents are transferred into a separatory flask and allowed to stand, and the methyl isobutyl ketone solution phase (upper phase) and phosphorus are mixed. Separated into aqueous acid phase (lower phase). Next, the phosphoric acid aqueous solution phase is removed, and the methyl isobutyl ketone solution phase is washed 5 times with water to remove phosphoric acid. Then, the contents are returned to the reaction vessel again, and methyl isobutyl ketone is completely removed by distillation under reduced pressure. 157 parts of phenol aralkyl resin (theoretical yield 95%) were obtained.
得られたフェノールアラルキル樹脂については冒頭記述の試験法により、樹脂特性を測定した。それらの結果を表1に示す。また、得られたフェノールアラルキル樹脂のGPCチヤートを図1に示す。 About the obtained phenol aralkyl resin, the resin characteristic was measured by the test method described at the beginning. The results are shown in Table 1. Moreover, the GPC chart of the obtained phenol aralkyl resin is shown in FIG.
<実施例2〜3(実施例3は参考例)>
反応条件を表1のように変更した以外は、実施例1と同様にしてフェノールアラルキル樹脂を得、測定した。結果を表1に示す。
<Examples 2-3 (Example 3 is a reference example) >
A phenol aralkyl resin was obtained and measured in the same manner as in Example 1 except that the reaction conditions were changed as shown in Table 1. The results are shown in Table 1.
実施例1と同様の反応容器内に、フェノール(P)を94部、PXDMを116部(モル基準:PXDM/P=0.70)、硫酸ジエチルを0.1部(0.5%/P)を仕込んだ後、徐々に140℃まで昇温して同温度で6時間縮合反応を行った。次いで常圧脱水、引き続き減圧脱水してフェノールアラルキル樹脂131部(理論収率79%)を得た。 In the same reaction vessel as in Example 1, 94 parts of phenol (P), 116 parts of PXDM (molar basis: PXDM / P = 0.70), 0.1 part of diethyl sulfate (0.5% / P ), The temperature was gradually raised to 140 ° C., and a condensation reaction was carried out at the same temperature for 6 hours. Subsequently, normal pressure dehydration and subsequent dehydration under reduced pressure yielded 131 parts of phenol aralkyl resin (theoretical yield 79%).
得られたフェノールアラルキル樹脂については冒頭記述の試験法により、樹脂特性を測定した。それらの結果を表1に示す。また、得られたフェノールアラルキル樹脂のGPCチヤートを図2に示す。 About the obtained phenol aralkyl resin, the resin characteristic was measured by the test method described at the beginning. The results are shown in Table 1. Moreover, the GPC chart of the obtained phenol aralkyl resin is shown in FIG.
<比較例2>
実施例1と同様の反応容器内に、フェノール(P)を94部、PXDMを116部(モル基準:PXDM/P=0.70)、1−ヒドロキシエチリデン−1,1’−ジホスホン酸を70部(60%/P)仕込んだ後、攪拌混合により形成される白濁状態(二相混合物)のもとで、170℃まで昇温し、さらに同温度で9時間縮合反応を行った。次いで常圧脱水、引き続き減圧脱水してフェノールアラルキル樹脂152部(理論収率92%)を得た。
<Comparative example 2>
In the same reaction vessel as in Example 1, 94 parts of phenol (P), 116 parts of PXDM (molar basis: PXDM / P = 0.70), 70 of 1-hydroxyethylidene-1,1′-diphosphonic acid After charging part (60% / P), the mixture was heated to 170 ° C. under a cloudy state (two-phase mixture) formed by stirring and mixing, and further subjected to a condensation reaction at the same temperature for 9 hours. Subsequently, normal pressure dehydration and subsequent dehydration under reduced pressure gave 152 parts of phenol aralkyl resin (theoretical yield: 92%).
得られたフェノールアラルキル樹脂については冒頭記述の試験法により、樹脂特性を測定した。それらの結果を表1に示す。また、得られたフェノールアラルキル樹脂のGPCチヤートを図3に示す。 About the obtained phenol aralkyl resin, the resin characteristic was measured by the test method described at the beginning. The results are shown in Table 1. Moreover, the GPC chart of the obtained phenol aralkyl resin is shown in FIG.
1 2量体成分(フェノール類2分子を、一般式(1)で示されるアラルキル化合物1分子で架橋した構造と思われるピーク)
2 3量体成分(フェノール類3分子を、一般式(1)で示されるアラルキル化合物2分子で架橋した構造と思われるピーク)
3 4量体成分(フェノール類4分子を、一般式(1)で示されるアラルキル化合物3分子で架橋した構造と思われるピーク)
4 高次縮合体(フェノール類5分子以上を、一般式(1)で示されるアラルキル化合物4分子以上で架橋した構造と思われるピーク)
1 Dimer component (peak that seems to be a structure in which two molecules of phenol are cross-linked with one molecule of an aralkyl compound represented by the general formula (1))
2 Trimer component (peak which seems to be a structure in which 3 molecules of phenol are cross-linked with 2 molecules of aralkyl compound represented by general formula (1))
3 Tetramer component (peak which seems to be a structure in which 4 molecules of phenol are cross-linked with 3 molecules of aralkyl compound represented by general formula (1))
4 Higher-order condensate (peak that seems to be a structure in which 5 or more molecules of phenol are cross-linked with 4 or more molecules of aralkyl compound represented by general formula (1))
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JPS63238129A (en) * | 1987-03-26 | 1988-10-04 | Mitsui Toatsu Chem Inc | Phenol aralkyl resin and production thereof |
JPH0625392A (en) * | 1992-07-10 | 1994-02-01 | Mitsui Toatsu Chem Inc | Phenolic aralkyl resin and its production |
JPH06116370A (en) * | 1992-10-02 | 1994-04-26 | Mitsui Toatsu Chem Inc | Production of phenolic aralkyl resin |
JPH08283536A (en) * | 1995-04-18 | 1996-10-29 | Mitsui Toatsu Chem Inc | Epoxy resin composition, its cured item, and semiconductor device using it |
JP2001213946A (en) * | 2000-02-01 | 2001-08-07 | Sumikin Chemical Co Ltd | Phenol aralkyl resin and its manufacturing method |
JP2005154612A (en) * | 2003-11-27 | 2005-06-16 | Sumitomo Bakelite Co Ltd | Method for manufacturing phenol aralkyl resin |
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JPS63238129A (en) * | 1987-03-26 | 1988-10-04 | Mitsui Toatsu Chem Inc | Phenol aralkyl resin and production thereof |
JPH0625392A (en) * | 1992-07-10 | 1994-02-01 | Mitsui Toatsu Chem Inc | Phenolic aralkyl resin and its production |
JPH06116370A (en) * | 1992-10-02 | 1994-04-26 | Mitsui Toatsu Chem Inc | Production of phenolic aralkyl resin |
JPH08283536A (en) * | 1995-04-18 | 1996-10-29 | Mitsui Toatsu Chem Inc | Epoxy resin composition, its cured item, and semiconductor device using it |
JP2001213946A (en) * | 2000-02-01 | 2001-08-07 | Sumikin Chemical Co Ltd | Phenol aralkyl resin and its manufacturing method |
JP2005154612A (en) * | 2003-11-27 | 2005-06-16 | Sumitomo Bakelite Co Ltd | Method for manufacturing phenol aralkyl resin |
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