JP4400877B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus that supplies a coating liquid such as a resist solution to a surface of a substrate to be processed such as a liquid crystal display (LCD) substrate. It is.

  In general, in a semiconductor device manufacturing process, a resist film is formed by applying a resist solution as a coating solution to a liquid crystal display (LCD) substrate or the like (hereinafter referred to as a substrate) as a substrate to be processed, and using a photolithography technique. The circuit pattern is reduced and transferred to the resist film, and a series of processes for developing the circuit pattern is performed.

  Conventionally, as a method of applying a coating solution such as a resist solution to the substrate in the coating / developing process, an aluminum alloy holding table that holds the substrate in a substantially horizontal position is rotated at a high speed, and the resist solution is applied to the center of the substrate. A so-called “spin coating method” is used in which the substrate is supplied (dropped), applied to the entire substrate by the centrifugal force of the substrate, and excess resist solution is shaken off by the centrifugal force. Further, by rotating the cup with a lid for housing the substrate synchronously with the substrate, adverse effects due to the air current and adhesion of particles and the like from the outside are prevented.

  However, when the holding table is formed of an aluminum alloy material, the coating effect that the film thickness of the resist film is locally reduced due to the thermal influence from the holding table reaching the surface of the substrate occurs in the final product. There has been a problem that “transfer marks” that are image defects appearing in spots or lines on the LCD screen are produced, which adversely affects the quality.

Therefore, in order to solve this problem, a holding base is formed of an insulating synthetic resin member is known (for example, see Patent Document 1).
JP-A-10-254146 (Claims, FIG. 6)

  However, the technique described in Japanese Patent Application Laid-Open No. 10-254146 has a problem that the holding base made of synthetic resin is charged with the use time, the substrate is charged, and the substrate is damaged by electrostatic breakdown. As a method for solving this problem, a method of irradiating the substrate with a gas ionized by an ionizer is conceivable. However, since a thinner is used as a solvent in the resist coating process, there is a risk of explosion, which is not preferable.

  Also, since the conventional synthetic resin holding table is weak, it is necessary to increase the thickness and diameter of the holding table, especially on a substrate that tends to be large, and there is a risk that the size of the apparatus will increase accordingly. In addition, there is a problem that the coating spots (transfer marks) as described above are generated due to the thermal effect between the holding table and the cup, and the quality of the final product is adversely affected.

  This invention is made | formed in view of the said situation, and makes it a subject to provide the substrate processing apparatus which suppresses generation | occurrence | production of a coating spot and suppresses electrification of a holding stand and a board | substrate.

In order to solve the above-mentioned problem, the invention described in claim 1 includes a holding table for horizontally holding a substrate to be processed, suction means for sucking and holding the substrate to be processed on the holding table, and rotation for rotating the holding table. A driving means; a coating liquid supply means for supplying a predetermined coating liquid to a substrate to be processed held by the holding table; and a substrate to be processed held by the holding table, and rotating in synchronization with the holding table. And a container that includes a lid that closes the lower cup. The holding table is formed of a conductive resin material, and the conductive resin material is made of carbon. A polyacetal resin in which the material is uniformly dispersed, a metal plate is pasted on the back surface, and the surface resistivity is 1 × 10 ¹ to 1 × 10 ¹² (Ω / sq.). The object to be processed held by the holding table in A portion located below the substrate is formed of a conductive resin material. The lower cup includes a cup body that surrounds the holding table and the lower side of the substrate to be processed, and a first screw on the bottom surface of the cup body. A plate made of a conductive resin, which is fixed by a member and surrounds the lower side and the side of the substrate to be processed, and the first screw member, and is fixed to the bottom surface of the cup body by a second screw member A cover made of a conductive resin, wherein the plate has a concave inward flange on the inner periphery, and the inward flange is connected to the cup body by the first screw member. The cover covers the inward flange, extends outwardly from the convex flange located on the same plane as the upper surface of the plate, and extends to the inner peripheral side of the outward flange. 2 screw member Includes a cover base portion being secured, to the cup body Te, characterized in that.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, an inclined surface having a downward slope is formed on the outer peripheral portion of the holding table, and the lower end of the inclined surface and the holding table are formed. The height of the lower cup in the vicinity of the outer periphery of the lower cup is the same.

The invention of claim 3, wherein, in the substrate processing apparatus according to claim 1, wherein the supporter includes a plurality of annular suction grooves formed concentrically on the holding surface of the substrate, the plurality of annular suction A plurality of suction grooves extending non-radially from the central portion to the peripheral portion of the holding surface so as to communicate with the groove, and a plurality of suction holes communicating with the suction means and opening in the annular suction groove or the suction groove The upper surface between the annular suction grooves on the holding surface is formed into a rough surface, and the peripheral portion of the holding surface is formed into a smooth surface.

(1) According to the first aspect of the invention, the surface resistivity of the conductive resin material constituting the holding table for holding a substrate to be processed ^{horizontally, 1 × 10 1 ~1 × 10} 12 (Ω / sq. ), It is possible to suppress the thermal influence from the holding table from reaching the surface of the substrate, and to reduce the charge amount of the substrate. Therefore, the occurrence of coating spots (transfer marks) can be prevented, and the occurrence of electrostatic breakdown due to charging can be prevented.

(2) According to the first aspect of the present invention, the substrate to be processed is held a holder for holding a substrate to be processed horizontally, to form a conductive resin material, by the holding table in the lower cup of the container By forming the portion located below the conductive resin material, it is possible to reduce the charging of the holding base and the substrate to be processed and to suppress the thermal influence from the lower cup. Therefore, the occurrence of coating spots (transfer marks) can be prevented, and the occurrence of electrostatic breakdown due to charging can be prevented.

(3) Further, according to the first aspect of the invention, the first screw member for fastening a plate made of a conductive resin to surround the lower and side of the substrate to the cup body, conductive resin By covering with the cover and positioning the cover and the upper surface of the plate on the same surface, the thermal influence from the lower cup can be further reliably suppressed.

(4) According to the second aspect of the present invention, an inclined surface having a downward slope is formed on the outer peripheral portion of the holding table, and a lower cup near the lower end of the inclined surface and the outer periphery of the holding table. In addition to the above (2) to (3), coating spots (transfer marks) due to thermal influences can be prevented by making the height of the shoulders in the same.

(5) According to the invention described in claim 3 , the holding table is held by forming the upper surface between the annular suction grooves on the holding surface of the holding table as a rough surface and forming the peripheral edge of the holding surface as a smooth surface. The contact area between the surface and the substrate to be processed can be reduced, the occurrence of peeling electrification can be reduced, and a stable state can be maintained. Moreover, when peeling a to-be-processed substrate from a holding stand, it can peel easily with little force.

( 6 ) According to the invention described in claim 1 , since the conductive resin material is formed by sticking the polyacetal resin in which the carbon material is uniformly dispersed and the metal plate, in addition to the above (1), the coating spots (Transfer trace) can be prevented, electrostatic breakdown due to charging can be prevented, and the rigidity of the holding table can be increased.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described in detail with reference to the accompanying drawings. Here, a case where the substrate processing apparatus according to the present invention is applied to a resist coating processing apparatus in an LCD substrate resist coating / development processing system will be described.

  As shown in FIG. 1, the resist coating / development processing system includes a loading / unloading unit 1 on which a cassette C that houses a plurality of substrates to be processed, which is an LCD substrate G (hereinafter referred to as a substrate G), and a substrate G Includes a processing unit 2 having a plurality of processing units for performing a series of processes including resist coating and development, and an interface unit 3 for transferring the substrate G to and from the exposure apparatus 4. The loading / unloading unit 1 and the interface unit 3 are disposed at both ends of the processing unit 2, respectively. In FIG. 1, the longitudinal direction of the resist coating / developing system is defined as the X direction, and the direction orthogonal to the X direction in plan view is defined as the Y direction.

  The loading / unloading unit 1 includes a transport mechanism 5 for loading / unloading the substrate G between the cassette C and the processing unit 2, and the loading / unloading unit 1 loads / unloads the cassette C to / from the outside. . The transport mechanism 5 has a transport arm 5a and can move on a transport path 6 provided along the Y direction, which is the arrangement direction of the cassettes C. The transport arm 5a allows the cassette C and the processing unit 2 to move. The substrate G is loaded and unloaded between the two.

  The processing unit 2 basically has two parallel rows of transport lines A and B for transporting the substrate G extending in the X direction. A scrub cleaning processing unit (SCR) 11, a first thermal processing unit section 16, a resist processing unit 13, and a second thermal processing unit section 17 are arranged. Further, a second thermal processing unit section 17, a development processing unit (DEV) 14, an i-ray UV irradiation unit (i-UV) 15, and the like from the interface unit 3 side toward the carry-in / out unit 1 along the transport line B A third thermal processing unit 18 is arranged. An excimer UV irradiation unit (e-UV) 12 is provided on a part of the scrub cleaning unit (SCR) 11. In this case, an excimer UV irradiation unit (e-UV) 12 is provided to remove organic substances on the substrate G prior to scrubber cleaning. An i-ray UV irradiation unit (i-UV) 15 is provided for performing a decoloring process for development.

  The first thermal processing unit section 16 has two thermal processing unit blocks (TB) 31 and 32 configured by stacking thermal processing units that perform thermal processing on the substrate G. The thermal processing unit block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 11 side, and the thermal processing unit block (TB) 32 is provided on the resist processing unit 13 side. A first transport mechanism 33 is provided between the two thermal processing unit blocks (TB) 31 and 32.

  The second thermal processing unit section 17 has two thermal processing unit blocks (TB) 34 and 35 formed by stacking thermal processing units for performing thermal processing on the substrate G. The thermal processing unit block (TB) 34 is provided on the resist processing unit 13 side, and the thermal processing unit block (TB) 35 is provided on the development processing unit 14 side. A second transport mechanism 36 is provided between the two thermal processing unit blocks (TB) 34 and 35.

  The third thermal processing unit section 18 includes two thermal processing unit blocks (TB) 37 and 38 configured by stacking thermal processing units that perform thermal processing on the substrate G. The thermal processing unit block (TB) 37 is provided on the development processing unit (DEV) 14 side, and the thermal processing unit block (TB) 38 is provided on the cassette station 1 side. A third transport mechanism 39 is provided between the two thermal processing unit blocks (TB) 37 and 38.

  The interface unit 3 includes an extension / cooling stage (EXT / COL) 41, an external device block 42 in which a peripheral exposure device (EE) and a TITRA are stacked, a buffer stage (BUF) 43, A fourth transport mechanism 44 is provided.

  In the interface unit 3 configured as described above, the substrate G transported by the second transport mechanism 36 is transported to the extension / cooling stage (EXT / COL) 41, and the external device block 42 is transported by the fourth transport mechanism 44. To the peripheral exposure apparatus (EE), exposure for removing the peripheral resist is performed, and then the fourth transport mechanism 44 transports the exposure apparatus 4 to expose the resist film on the substrate G. A predetermined pattern is formed. In some cases, the substrate G is accommodated in the buffer stage (BUF) 43 and then transferred to the exposure apparatus 4. After the exposure is finished, the substrate G is carried into the TITRA of the external device block 42 by the fourth transport mechanism 44, and predetermined information is written on the substrate G, and then the extension / cooling stage (EXT / COL). ) 41 and transported to the processing unit 2 again.

  The resist processing unit 13 includes a resist coating processing apparatus 20 according to the present invention and a vacuum drying process for drying the resist film formed on the substrate G by the resist coating processing apparatus 20 under reduced pressure in a vacuum container (not shown). The apparatus (VD) 21 and the substrate remover (VD) 21 on which the resist film (coating film) is applied by the resist processing apparatus 20 are dried under reduced pressure (VD) 21 and the edge remover (ER) that removes the resist on the periphery of the substrate G 100. In the resist processing unit 13, the substrate G coated with the resist by the resist coating processing device 20 is carried into the reduced pressure drying processing device 21 by a pair of transfer arms (not shown), and is dried by the reduced pressure drying processing device 21. It has become so.

  As shown in FIGS. 2 and 3, the resist coating apparatus 20 is held by the spin chuck 50, which is a horizontally rotating and elevating holder that holds the substrate G by suction, and the spin chuck 50 and the spin chuck 50. A bottom cup 60a formed of, for example, an aluminum alloy material having a bottomed cylindrical shape that surrounds the substrate G and is open at the upper end, and an upper and lower cover 61 that closes the upper end opening of the lower cup 60a. And a drain cup 62 fixedly arranged so as to surround the outer periphery of the lower cup 60a. The drain cup 62 is disposed outside the drain cup 62 and is disposed above the center of the substrate G during processing. A resist supply nozzle 70 that is a movable coating solution supply means, and a resist solution supply that is provided adjacent to the resist supply nozzle 70 and is used during processing. Discharge) mainly consists of a thinner supply nozzle 71 for supplying a solvent (thinner) on the surface center of the substrate G (discharge) before.

The spin chuck 50 is formed of a conductive resin material in which a carbon material is uniformly dispersed in a base polymer such as polyphenylene sulfide (PPS) or polyacetal resin (POM). In this case, the diameter of the spin chuck 50 is, for example, 700 to 1,200 mm. When the spin chuck 50 is formed of conductivity (PPS), the surface resistivity of the conductive resin material constituting the spin chuck 50 is 1 × 10 ⁶ to 1 × 10 ⁷ (Ω / sq.), The flexural modulus can be 9,000 (MPa).

Thus, the surface resistivity of the conductive resin material constituting the spin chuck 50 is set to 1 × 10 ⁶ to 1 × 10 ⁷ (Ω / sq.), And the flexural modulus is set to 9,000 (MPa). Accordingly, the charge amount of the spin chuck 50 and the substrate G can be reduced, and the spin chuck 50 itself can be provided with rigidity.

  Further, as shown in FIGS. 4 and 5, the spin chuck 50 communicates the plurality of annular suction grooves 81 concentrically provided on the holding surface 80 of the substrate G with the plurality of annular suction grooves 81. A plurality of suction grooves 82 that extend non-radially from the center to the peripheral edge of the holding surface, communicate with suction means (not shown), and are open in the annular suction grooves 81 or the suction grooves 82 (in FIG. 5, the annular suction grooves 81). And a plurality of suction holes 83 that are opened). In this case, the width a of the annular suction groove 81 is 0.5 mm, the width c of the suction groove 82 is 0.5 mm, and the depth b of the annular suction groove 81 and the suction groove 82 is 0. It is formed to 3 mm.

  As described above, a plurality of annular suction grooves 81 provided concentrically on the holding surface 80 of the substrate G, and a non-radial shape from the center of the holding surface to the peripheral portion so as to communicate with the plurality of annular suction grooves 81 The substrate G is rotated at a predetermined number of revolutions by providing a plurality of suction grooves 82 extending in the direction and an annular suction groove 81 or a plurality of suction holes 83 that open in the suction grooves 82. It is possible to prevent the occurrence of radial coating spots (transfer marks) on the substrate G while securing a sufficient suction force so that the substrate G does not come off even when it is applied.

  In this case, as shown in FIG. 6, the upper surface 80 a between the annular suction grooves 81 on the holding surface of the spin chuck 50 is formed into a rough surface by, for example, concentric concave and convex strips 84, and the peripheral edge of the holding surface 80 is formed. The portion 80b may be formed on a smooth surface. As described above, the upper surface 80a between the annular suction grooves 81 on the holding surface of the spin chuck 50 is formed into a rough surface, and the peripheral edge 80b of the holding surface 80 is formed into a smooth surface. The contact area with the substrate G can be reduced, generation of peeling electrification can be reduced, and a stable state can be maintained. Further, when the substrate G is peeled off from the spin chuck 50, it can be easily peeled off with a small force. Note that the upper surface 80a of the spin chuck 50 does not necessarily have to be roughened by the concave and convex strips 80b, but may be roughened by other than the concave and convex strips 80b, for example, by a dotted concavo-convex pattern or a cross-shaped concavo-convex pattern.

  The spin chuck 50 can be moved up and down by a rotating shaft 51 extending in the vertical direction supported by a spline bearing 52 so that the rotating shaft 51 can slide in the vertical direction. Is formed. In this case, the rotating shaft 51 is slidably connected to a spline bearing 52 that is fitted to the inner peripheral surface of the rotating inner cylinder 56 that is rotatably mounted to the inner peripheral surface of the fixed collar 54 via a bearing 55a. ing. A driven pulley 57a is attached to the spline bearing 52, and a timing belt 59a is stretched between the driven pulley 57a and a driving pulley 58b attached to a driving shaft 58a of a driving motor 58 that is a rotating means. ing. Therefore, the rotation shaft 51 is rotated through the timing belt 59a by the drive motor 58, and the spin chuck 50 is horizontally rotated. The lower side of the rotating shaft 51 is disposed in a cylinder (not shown), and the rotating shaft 51 is connected to the elevating cylinder 53 via a vacuum seal portion 51a.

  The spin chuck 50 is grounded (grounded) to the outside of the apparatus via a rotating shaft 51 and an apparatus casing (not shown).

  The lower cup 60 is attached to the outer peripheral surface of the fixed collar 54 via a rotating outer cylinder 68 that is mounted via a bearing 55 b, and between the bottom 60 a of the lower cup 60 and the lower surface of the spin chuck 50. In addition, the sealing O-ring 63 is interposed, and the spin chuck 50 is lowered so that the air-tightness is maintained in close contact with the O-ring 63. The lower cup 60 is formed of an aluminum alloy member, for example. In addition, the drive from the drive motor 58 is transmitted to the lower cup 60 by the driven belt 57b attached to the rotating outer cylinder 68 and the timing belt 59b stretched over the drive pulley 58b attached to the drive motor 58. Is configured to rotate horizontally. In this case, the diameter of the driven pulley 57b is the same as the diameter of the driven pulley 57a attached to the rotating shaft 51, and the timing belts 59a and 59b are stretched over the same drive motor 58, so that the lower cup 60 And the spin chuck 50 rotate synchronously. Note that a labyrinth seal 64 is interposed between the fixed collar 54 and the rotating inner cylinder 56 and the rotating outer cylinder 68 facing each other, so that dust is transferred from the lower driving system into the rotating cup and from the lower driving system into the rotating cup when rotating. Is prevented from entering.

  The lid 61 is provided with a lifting shaft 65 projecting at the center upper portion, and is connected to a lid lifting mechanism 67 via a lifting arm 66 that rotatably supports the lifting shaft 65. With such a configuration, the lid lifting mechanism 67 is driven by the lid lifting mechanism 67 so that the lifting shaft 65 can be lifted and lowered so that the lid 61 opens and closes the upper end opening of the lower cup 60.

  The resist supply nozzle 70 and the thinner supply nozzle 71 are positioned above the central portion of the substrate G and outside the drain cup 62 by a nozzle arm 72 driven by a nozzle moving mechanism 73 disposed outside the drain cup 62. It is formed to be movable to the other standby position.

  The elevating cylinder 53, the drive motor 58, the lid elevating mechanism 67, and the nozzle moving mechanism 71 are each electrically connected to a control means such as a central processing unit 90 (hereinafter referred to as CPU 90). Drive control is performed based on the control signal.

  Next, the operation mode of the resist coating apparatus 20 will be described with reference to FIGS. First, as shown in FIG. 3, the lid 61 is raised and the spin chuck 50 is lowered and waits. In this state, the substrate G is carried above the spin chuck 50 by the transfer arm (not shown), and the spin chuck 50 is lifted to receive the substrate G from the transfer arm. Thereafter, the transfer arm is retracted from above the spin chuck 50 to the outside of the lower cup 60. Next, the spin chuck 50 is lowered and positioned in the lower cup 60. Next, the nozzle moving mechanism 73 is driven so that the thinner supply nozzle 71 is moved above the center of the substrate G, while the drive motor 58 is driven to rotate the substrate G together with the spin chuck 50 from the thinner supply nozzle 71. Thinner is supplied (discharged) to the center of the substrate G to improve the wettability of the surface of the substrate G to the resist solution. Thereafter, the substrate G is temporarily stopped, and a resist solution is supplied (discharged) from the resist supply nozzle 70 to the center of the substrate G, and then the resist supply nozzle 70 and the thinner supply nozzle 71 are placed at a standby position outside the lower cup 60. evacuate. At the same time, with the lid 61 descending and closing the lower cup 60, the drive motor 58 is driven and the spin chuck 50 and the rotary cup 60A rotate synchronously so that the resist solution is diffused over the entire surface of the substrate G. Thus, a resist film is formed. After the resist film is formed, the lid 61 is raised, the spin chuck 50 is raised, and the substrate G is transferred to the transfer arm that has moved inward of the lower cup 60. The transfer arm that has received the substrate G is transferred to the reduced-pressure drying processing device 21 and dried.

  Thereafter, the same operation as described above is repeated, and a resist film is sequentially formed on the plurality of substrates G. At this time, the spin chuck 50 is charged by increasing the number of treatments. However, since the spin chuck 50 is formed of a conductive resin material, the charge of the spin chuck 50 can be released to the ground to suppress charging. .

  In the above embodiment, the case where the lower cup 60 is formed of an aluminum alloy member has been described. However, a portion of the lower cup 60 that is positioned below the substrate G held by the spin chuck 50 is defined as the spin chuck 50. It is preferable to form the same conductive resin material.

  That is, as shown in FIG. 7, the lower cup 60 includes a cup body 85 that surrounds the lower side and the side of the spin chuck 50 and the substrate G, and a first screw member that is a first screw member on the bottom surface of the cup body 85. The conductive resin plate 87 is fixed by the fixing screw 86 and surrounds the lower side and the side of the substrate G. The first fixing screw 86 is covered, and a second screw member is provided on the bottom surface of the cup body 85. The cover is made of a conductive resin cover 88 fixed by a second fixing screw 89.

  At this time, the plate 87 has a concave inward flange 87a on the inner periphery, and a first fixing screw 86 penetrating through a stepped hole 87b provided in the inward flange 87a is screwed to the cup body 85. Then, the plate 87 is fixed. At this time, the head portion 86a of the first fixing screw 86 is accommodated in the large-diameter portion of the stepped hole 87b and does not protrude from the surface of the inward flange 87a.

  The cover 88 covers the inward flange 87a and the first fixing screw 86, and has a convex outward flange 88a located on the same plane as the upper surface of the plate 87, and an inner peripheral side of the outward flange 88a. And a cover base portion 88b fixed to the cup body 85 by a second fixing screw 89 that is a second screw member.

  With the configuration described above, the portion located below the substrate G held by the spin chuck 50 in the lower cup 60 is formed of a conductive resin material without exposing the first fixing screw 86. be able to. Therefore, since the lower side of the substrate G is unified by the spin chuck 50 and the lower cup 60 made of the conductive resin material, coating spots (transfer marks) can be suppressed by thermal influence.

  Further, an inclined surface 50 a that is inclined downward is formed on the outer peripheral portion of the spin chuck 50, and a lower end of the inclined surface 50 a and a shoulder portion 60 b near the outer periphery of the spin chuck 50 in the lower cup 60. And the same height. Thus, by forming the lower end of the inclined surface 50a having a downward slope formed in the outer peripheral portion of the spin chuck 50 and the height of the shoulder portion 60b in the vicinity of the outer periphery of the spin chuck 50 in the lower cup 60, It is possible to suppress a thermal effect caused by a step between the spin chuck 50 and the lower cup 60 and to suppress coating spots (transfer marks).

  In the above-described embodiment, the case where the spin chuck 50 is formed of conductive PPS has been described. However, instead of the spin chuck 50, a chuck upper body 501 made of conductive POM as shown in FIG. You may use the spin chuck 50A which adheres a board, for example, the chuck lower body 502 made from an aluminum alloy, for example by fixing means, such as an adhesive agent and a fixing screw.

  In this case, the diameter D of the spin chuck 50A is 700 to 1,200 mm as in the spin chuck 50, the thickness T1 of the chuck upper body 501 is 4 mm, and the thickness T2 of the chuck lower body 502 is 3.5 mm. Yes. Thus, the reason for setting the dimensions of the spin chuck 50A is that when a spin chuck having a diameter of 700 to 1,200 mm and a thickness of 5 to 8 mm is manufactured, a conventional spin chuck made of PPS or a spin made of conductive POM is used. This is because the chuck has a small bending elastic modulus, and thus the substrate is not held in a stable state due to bending. In order to solve such a problem, in the present invention, as described above, the diameter D of the spin chuck 50A is set to 700 to 1,200 mm, the thickness T1 of the chuck upper body 501 is 4 mm, and the thickness T2 of the chuck lower body 502 is set. By forming the thickness of 3.5 mm, the substrate G is prevented from being charged and the rigidity is improved.

  Next, an experiment for measuring the substrate charge amount by changing the material of the spin chuck in the present invention will be described.

In the experiment, a sample having the characteristics shown in Table 1, that is, Comparative Example 1 {polyphenylene sulfide (PPS)}, Example 1 {conductive polyacetal resin (POM)}, Example 2 {conductive PPS}, and Comparative Example 2 {Aluminum alloy} is prepared.

The above samples, that is, Comparative Examples 1 and 2, Examples 1 and 2, the thickness, suction shape, suction method, chuck-cup gap and chuck suction force were set to substantially the same conditions, and the treatment was performed multiple times. When the average value of the substrate charge amount (kV) and the chuck charge amount (kV) was examined, the results shown in Table 2 were obtained.

  As a result of the above experiment, it was found that the material of Comparative Example 1 was an insulating material, but it increased with the number of treatments and still tends to increase. Further, since the material of Comparative Example 2 was a conductive aluminum alloy, the substrate charge amount was −7.16 kV. On the other hand, in Example 1, the substrate charge amount was −2.08 kV within the allowable range, and in Example 2, the substrate charge amount was −0.67 kV, which was much smaller.

  Moreover, since the thing of the comparative example 1 has a bending elastic modulus of 3,300 (MPa) and is insufficient in strength, the holding surface of the spin chuck is bent and the substrate cannot be held in a stable state. On the other hand, in Example 1, the conductive POM chuck upper body 501 and the aluminum alloy chuck lower body 502 are attached, and in Example 2, the bending elastic modulus is 9, Since it was 000 (MPa), it was found that the holding surface does not bend and that even a large substrate can be held in a stable state.

The same applies to the case where the material of the spin chuck is a conductive resin material as in the above embodiment and the surface resistivity is 1 × 10 ¹ (Ω / sq.) And 1 × 10 ¹² (Ω / sq.). As a result of the above experiment, it was found that the substrate charge amount was -2.94 (kV) and +2.96 (kV), and could be within the allowable range of ± 3.00 (kV).

1 is a schematic plan view showing a resist coating / development processing system to which a substrate processing apparatus according to the present invention is applied. It is a schematic sectional drawing which shows the resist coating processing apparatus to which the substrate processing apparatus concerning this invention is applied. It is a schematic sectional drawing which shows the resist supply state of the said resist coating processing apparatus. It is the schematic sectional drawing (a) which shows the spin chuck in this invention, and the expanded sectional view (b) of the I section of (a). FIG. 2 is a schematic plan view (a) of the spin chuck and an enlarged view (b) of a II part in (a). It is a principal part expanded sectional view (a) which shows another form of the said spin chuck, and the top view (b) of (a). It is principal part sectional drawing (a) which shows another form of the substrate processing apparatus which concerns on this invention, and the expanded sectional view (b) of the III section of (a). It is a schematic sectional drawing which shows another form of the spin chuck in this invention.

G Substrate 50, 50A Spin chuck (holding stand)
50a Inclined surface 58 Drive motor (rotation drive means)
60A rotating cup (container)
60 Lower cup 60b Shoulder 61 Lid 70 Regis supply nozzle (application liquid supply means)
80 holding surface 80a upper surface 80b peripheral edge 81 annular suction groove 82 suction groove 83 suction hole 84 uneven strip 85 cup body 86 first fixing screw (first screw member)
87 Plate 87a Inward flange 88 Cover 88a Outward flange 88b Cover base 89 Second fixing screw (second screw member)
501 Conductive POM chuck upper body 502 Aluminum alloy chuck lower body

Claims (3)

A holding table for holding the substrate to be processed horizontally;
Adsorption means for adsorbing and holding the substrate to be treated on the holding table;
Rotation driving means for rotating the holding table;
A coating solution supply means for supplying a predetermined coating solution to the substrate to be processed held on the holding table;
While accommodating the to-be-processed substrate hold | maintained by the said holding stand, it comprises the lower cup which can rotate synchronizing with a holding stand, and the receiving container which consists of a cover body which obstruct | occludes this lower cup,
The holding base is formed of a conductive resin material, and the conductive resin material is a polyacetal resin in which a carbon material is uniformly dispersed, and a metal plate is attached to the back surface, and the surface resistivity is 1 × 10 ¹ to 1 × 10 ¹² (Ω / sq.)
A portion located below the substrate to be processed held by the holding base in the lower cup of the containing container is formed of a conductive resin material,
The lower cup is fixed to the bottom surface of the cup body surrounding the holding base and the substrate to be processed and the side by a first screw member, and surrounds the lower and sides of the substrate to be processed. A plate made of conductive resin, and a cover made of conductive resin that covers the first screw member and is secured to the bottom surface of the cup body by the second screw member,
At this time, the plate has a concave inward flange on the inner periphery, and the inward flange is fixed to the cup body by the first screw member,
The cover covers the inward flange and extends outwardly from the convex outer flange located on the same plane as the upper surface of the plate, and to the inner peripheral side of the outward flange. A substrate processing apparatus comprising: a cover base fixed to the cup body. The substrate processing apparatus according to claim 1 ,
In the outer periphery of the holding table, an inclined surface having a downward slope toward the outside is formed, and the lower end of the inclined surface and the height of the shoulder in the lower cup near the outer periphery of the holding table are made the same. A substrate processing apparatus. The substrate processing apparatus according to claim 1 ,
The holding table includes a plurality of annular suction grooves provided concentrically on the holding surface of the substrate to be processed, and a non-radial extending from the center of the holding surface to the peripheral portion so as to communicate the plurality of annular suction grooves. A plurality of existing suction grooves, and a plurality of suction holes communicating with the suction means and opening in the annular suction groove or the suction groove,
The substrate processing apparatus characterized by forming the upper surface between the said annular adsorption grooves in the said holding surface into a rough surface, and forming the peripheral part of a holding surface in a smooth surface.

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