JP4479582B2 - Manufacturing method of electronic component mounting body - Google Patents

Description

  The present invention relates to a method of manufacturing an electronic component mounting body that is connected via a fine conductor formed on an electrode terminal of an electronic component or a connection terminal of a wiring board.

  In recent years, with the demand for higher functionality and lighter and shorter electronic devices such as portable terminals, there is a demand for high-density integration and high-density mounting of electronic components such as semiconductor chips, and semiconductors used as these electronic components. The package has been further reduced in size and increased in pin count. Furthermore, with the miniaturization of semiconductor packages, there is a limit to miniaturization in the form using a conventional lead frame.

  Therefore, recently, an area-mounting type semiconductor package such as a BGA (Ball Grid Array) or a CSP (Chip Scale Package) is mainly used as a semiconductor chip mounted on a circuit board. In these semiconductor packages, there are a wire bonding method, a TAB (Tape Automated Bonding) method, an FC (Flip Chip) connection method, etc. as an electrical connection method between a semiconductor chip and electrodes of a substrate composed of conductor wiring. Are known.

  In particular, BGA and CSP structures using an FC connection method that is advantageous for miniaturization of semiconductor packages have been proposed.

  For example, the FC connection method is generally a method in which bump electrodes called bumps are formed in advance on the electrodes of a semiconductor chip, and the bumps and terminals on the substrate are aligned and connected by thermocompression bonding or the like.

  As a method of forming bumps in advance on the semiconductor chip, there are a method using electrolytic plating and a method using stud bumps. In the method of forming bumps by electrolytic plating, the bumps are formed in a desired size using only solder, and thus there is a problem that manufacturing time and manufacturing cost are increased. Moreover, since it is difficult to make the current distribution in the plating tank completely uniform in electrolytic plating, the size of the formed bumps varies. The variation in the size of the bumps becomes more prominent as the plating time is longer. Therefore, it is difficult to solve the problems such as the manufacturing time and the manufacturing cost by the method of forming the bumps with only the solder. In addition, bumps having a metal core such as copper have been developed in order to ensure moisture resistance reliability of the bump connection parts, but there is a problem that the manufacturing process is further complicated and the manufacturing cost is further increased. It was.

  On the other hand, the stud bump is formed by bonding a gold wire to an electrode of a semiconductor chip and cutting it. In this method, since bumps are formed one by one on the electrodes of the semiconductor chip, it takes a long manufacturing time. Furthermore, since the price of the gold wire used for the bump is high, there is a problem that the manufacturing cost is increased.

  Therefore, in order to solve the above problems, a transfer bump method has been developed in which bumps are collectively formed on electrodes of a semiconductor chip. This discloses that the bumps on the transfer bump sheet side are collectively transferred to the semiconductor chip side by aligning the transfer bump sheet on which the solder bumps are formed on the sheet-like base and the semiconductor chip, and applying heat and pressure. (For example, see Patent Document 1 and Patent Document 2).

In addition, there is also disclosed a method in which a copper core solder bump performs batch transfer while ensuring moisture resistance reliability of a solder connection portion (see, for example, Patent Document 3).
JP-A-5-166880 JP-A-9-153495 JP 2000-286282 A

  However, as shown in FIG. 8A, the bumps 900 shown in Patent Document 1 and Patent Document 2 are formed in a spherical shape on the electrode 920 of the substrate 910 due to the surface tension of the solder. Therefore, when the amount of solder before melting varies, or when the area of the formed electrodes is different, there is a problem that the shape (particularly, height) of the bump 900 varies.

  Further, as shown in FIG. 8B, since the bump 900 has a spherical shape, when it is connected to the connection electrode 940 of the electronic component 930, a drum shape 950 is obtained. Therefore, there is a problem that stress concentrates on the connection portion between the bump 900 and the connection electrode 940 of the electronic component 930, and peeling or cracking occurs at the interface of the connection electrode 940.

  Furthermore, since the bump 900 has a drum shape 950, there is a possibility that the adjacent bumps 900 may be short-circuited 960 as shown in FIG. 8C, so that the distance between the electrodes 920 cannot be reduced. In addition, when the pitch of the electrodes 920 to be connected is reduced, it is possible to reduce the shape of the bump 900. However, the warp of the electronic component 930 such as a semiconductor chip cannot be absorbed. It is difficult to ensure reliability.

  Moreover, in the solder bump shown in the above-mentioned Patent Document 3, the conductive terminal in which the metal layer and the solder layer are laminated on the transfer sheet is heated and connected to the connection electrode such as a semiconductor chip to the solder layer side of the conductive terminal. Pressurize. Then, after the solder layer is melted so that the solder layer wraps around the metal layer, the transfer sheet is removed, and solder bumps are collectively formed. However, since the shape of the solder bump becomes large due to melting of the solder layer, there is a problem in forming a fine solder bump. Further, when the solder layer does not go around the metal layer, it is difficult to connect the substrate electrode with a metal such as copper, for example, and it is difficult to ensure connection reliability.

  The conductive terminal is formed by applying a resin layer serving as a transfer sheet on the copper foil, and after curing, forming a solder layer by electrolytic plating after the steps of laminating a dry film on the copper foil, exposure, and development. Then, the columnar conductive terminals are formed by peeling the dry film and etching the copper foil. Therefore, the manufacturing process becomes complicated, and there are problems in terms of productivity and manufacturing cost. In addition, since the etching process is performed, problems such as waste liquid processing also occur.

  The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide a method of manufacturing an electronic component mounting body in which a wiring board and an electronic component are connected with a fine conductor.

  In order to solve the problems as described above, the electronic component mounting body manufacturing method of the present invention includes a wiring board provided with a plurality of connection terminals, and a plurality of electrode terminals corresponding to the connection terminals. A method for manufacturing an electronic component mounting body for electrically connecting an electronic component to a transfer type, wherein a conductive material is filled in a concave portion of a transfer mold having concave portions having two or more steps corresponding to a plurality of connection terminals. And heating the conductive material and then curing to form a conductor, forming a space in the recess by curing shrinkage of the conductive material, and filling the space with the first insulating resin And a step of positioning and placing the concave portion of the transfer mold so as to face the connection terminal, a step of heating at a temperature at which at least the first insulating resin is in a semi-cured state, and a step of peeling the transfer die The second surface of the wiring board on which the conductor is formed is A step of forming an insulating resin, a step of positioning an electrode terminal of an electronic component opposite to the conductor, a connection terminal and the electrode terminal are connected via the conductor, and a second insulating resin And a step of curing.

  The method for manufacturing an electronic component mounting body according to the present invention electrically connects a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals. A method for manufacturing an electronic component mounting body, comprising: filling a transfer-type recess having a recess having two or more steps corresponding to a plurality of electrode terminals with a conductive material; and heating the conductive material A step of forming a conductor by curing, a step of forming a space in the recess by curing shrinkage of the conductive material, a step of filling the space with the first insulating resin, and a transfer facing the electrode terminal A step of aligning and placing the concave portion of the mold, a step of heating at a temperature at which at least the first insulating resin is in a semi-cured state, a step of peeling the transfer mold, and electrode terminals of the wiring board are formed. Forming a second insulating resin on the opposite surface; Conductor and oppositely, aligning the connection terminals of the wiring board, through a conductor, thereby connecting the connection terminal and the electrode terminal, and a step of curing the second insulating resin.

  The method for manufacturing an electronic component mounting body according to the present invention electrically connects a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals. A method of manufacturing an electronic component mounting body, comprising: filling a transfer-type recess having a recess of two or more stages corresponding to a plurality of connection terminals with a conductive material; and heating the conductive material A step of forming a conductor by curing, a step of forming a space in the recess by curing shrinkage of the conductive material, a step of filling the space with the first insulating resin, and a transfer facing the connection terminal A step of aligning and placing the concave portion of the mold, a step of heating at a temperature at which at least the first insulating resin is in a semi-cured state, a step of peeling the transfer mold, an electron facing the conductor, The process of aligning the electrode terminals of the component and the conductor Through it, a step of connecting the connection terminal and the electrode terminal, the gap between the connection terminal and the electrode terminal, a second insulating resin is injected, and a step of curing the second insulating resin.

  The method for manufacturing an electronic component mounting body according to the present invention electrically connects a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals. A method for manufacturing an electronic component mounting body, comprising: filling a transfer-type recess having a recess having two or more steps corresponding to a plurality of electrode terminals with a conductive material; and heating the conductive material A step of forming a conductor by curing, a step of forming a space in the recess by curing shrinkage of the conductive material, a step of filling the space with the first insulating resin, and a transfer facing the electrode terminal A step of aligning and placing the concave portion of the mold, a step of heating at a temperature at which at least the first insulating resin is in a semi-cured state, a step of peeling the transfer mold, and a wiring facing the conductor Step of aligning the connection terminals of the substrate and the conductor Through it, a step of connecting the connection terminal and the electrode terminal, the gap between the connection terminal and the electrode terminal, a second insulating resin is injected, and a step of curing the second insulating resin.

  Furthermore, the concave portion may have a countersunk screw shape.

  By these methods, the conductor can be transferred in a state of being temporarily fixed to the first insulating resin, so that an electronic component mounting body connected at a fine pitch can be easily manufactured. Further, the height of the conductor can be made uniform by the transfer-type recess, and a conductor having a large aspect ratio can be freely formed.

  Furthermore, the step of connecting the connection terminal and the electrode terminal may be crimping, pressure welding, or ultrasonic bonding.

  By this method, the connection between the connection terminal and the electrode terminal is easy, and an electronic component mounting body can be manufactured with high productivity.

  Further, the step of connecting the connection terminal and the electrode terminal may be performed by remelting the conductor.

  Further, the conductive material may be a solder powder or a solder paste.

  By these methods, it is possible to produce an electronic component mounting body that realizes strong connection and is excellent in reliability such as connection stability.

  Furthermore, the first insulating resin and the second insulating resin may be made of a thermosetting resin.

  Furthermore, the first insulating resin and the second insulating resin may be made of the same resin material.

  By these methods, since the conductor can be fixed and at the same time, the wiring board and the electronic component can be electrically connected to each other, so that the electronic component mounting body can be manufactured with high productivity.

  Furthermore, at least one of the first insulating resin and the second insulating resin may include a flux.

  Thereby, the wettability at the time of remelting of a conductor can be secured.

  Further, the transfer mold may be a transfer resin having a low elastic modulus and a high releasability.

  Further, the transfer resin may be a thermosetting silicone resin.

  By these methods, a conductor having a fine and uniform shape can be easily formed.

  According to the present invention, there is a great effect that a fine conductor can be formed on an electrode terminal of an electronic component or a connection terminal of a wiring board using a transfer mold. In addition, there is a great effect that a large number of connection terminals and electrode terminals can be connected with high reliability at a narrow pitch via the conductor.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
1 and 2 are process cross-sectional views illustrating a method for manufacturing an electronic component mounting body according to Embodiment 1 of the present invention.

  First, as shown in FIG. 1 (a), a transfer mold 100 is prepared in which a recess 110 having a cross section having two or more steps such as a countersunk screw shape is formed. The recess 110 of the transfer mold 100 includes a conductor forming hole 120 and a conductor holding hole 130. Furthermore, the transfer mold 100 is formed of a transfer resin having a low elastic modulus and a high releasability, such as a thermosetting silicone resin. The reason for this is that, since it is a silicone resin, it is excellent in releasability from conductive resin and solder. Secondly, because of its low elasticity, even a complex-shaped transfer formed in the recess can be peeled without being damaged by deformation or the like. Further, this is because it has an advantage that it can be easily deformed and transferred in accordance with the warp even on a warped substrate.

  Here, the concave portion 110 of the transfer mold 100 is formed by using a mold having a convex portion corresponding to the concave portion 110 formed in a shape having two or more steps such as a countersunk screw shape, an imprint method on the transfer mold resin, or the like. It can be formed by a casting method. Specifically, for example, it can be formed by pouring a transfer type resin such as a thermosetting silicone resin into a mold and curing it at a temperature of 150 ° C. for 0.5 hours.

  The recess 110 has, for example, a diameter of 10 μm to 300 μm, a height of 10 μm to 300 μm, and an aspect ratio of about 0.2 to 10. Furthermore, in order to further improve the releasability, at least the concave portion 110 of the transfer mold 100 may be coated with, for example, a silicone-based release agent or a fluorine-based release agent.

  Next, as shown in FIG. 1B, a conductive material 140 made of, for example, solder powder or paste solder so that at least the conductor forming hole 120 is filled in the recess 110 of the transfer mold 100. A certain amount is filled with a squeegee 150, for example. As a result, as shown in FIG. 1C, the transfer mold 100 in which the conductive material 140 is charged in the recess 110 of the transfer mold 100 is manufactured. The conductive material 140 may be a conductive resin made of a thermosetting resin mainly composed of a conductive filler.

  Next, as shown in FIG.1 (d), it heats to the temperature (about 150 to 250 degreeC) more than melting | fusing point of an electroconductive material, and fuses an electroconductive material. For example, in the case of solder powder made of In—Sn, it can be melted by heating to about 150 ° C. As a result, the conductor 160 is formed in which the free surface is hemispherical due to surface tension after being once melted in the recess 110. At this time, due to the volume shrinkage of the conductive material, a space portion 170 that is about the conductor holding hole 130 of the recess 110 of the transfer mold 100 is formed. In addition, when a conductive material is a conductive resin, it heats more than the hardening temperature. For example, when the thermosetting resin is an epoxy resin, the heating temperature is 160 ° C. and the heating time is about 60 minutes.

  Next, as shown in FIG. 1E, the space 170 is filled with the first insulating resin 180, for example, with a squeegee 150 or the like. Here, the curing temperature of the first insulating resin 180 is preferably lower than the melting point or the curing temperature of the conductor 160. For the first insulating resin 180, for example, an adhesive containing a thermosetting resin is used. And as a thermosetting resin, 1 type, or 2 or more types of mixed systems, such as an epoxy resin, a phenol resin, a polyimide resin, a polyurethane resin, a melamine resin, a urea resin, are used, for example.

  Through the above steps, as shown in FIG. 1 (f), the intermediate portion of the transfer mold in which the concave portion 110 of the transfer mold 100 is filled with the conductor 160 and the first insulating resin 180 for holding the conductor 160. A structure 190 is produced.

  Hereinafter, a manufacturing method after the transfer type intermediate structure 190 shown in FIG. 1F is manufactured will be described with reference to FIG.

  Next, as shown in FIG. 2A, the connection terminals 210 of the wiring board 200 on which the plurality of connection terminals 210 are formed and the surface of the recess 110 of the transfer-type intermediate structure 190 are aligned.

  Next, as shown in FIG. 2B, a transfer-type intermediate structure 190 is placed facing the connection terminal 210 of the wiring board 200. In this state, the first insulating resin 180 is heated at a temperature equal to or lower than the curing temperature of the first insulating resin 180 to make the first insulating resin 180 semi-cured. For example, when the first insulating resin 180 is an epoxy resin, the heating temperature is 120 ° C. and the heating time is about 60 minutes. These conditions vary depending on the material of the first insulating resin 180, but are preferably not higher than the curing temperature of the first insulating resin 180 and not higher than the melting point of the conductor 160. In addition, the semi-cured state of the first insulating resin 180 is a state in which the conductor 160 and the first insulating resin 180 have adhesion strength to which the connection terminal 210 is transferred when the transfer mold 100 is peeled off.

  Next, as shown in FIG. 2C, the conductor 160 held by the semi-cured first insulating resin 180 is formed on the connection terminals 210 of the wiring board 200 by peeling the transfer mold. Transcribed.

  Next, as shown in FIG. 2D, the second insulating property is formed on the connection terminal 210 of the wiring board 200 onto which the conductor 160 held by the semi-cured first insulating resin 180 is transferred. Resin 220 is formed. The second insulating resin 220 is preferably formed to a thickness at least about the height of the conductor 160. This is because if it is thinner than the height of the conductor 160, for example, it cannot be used as an underfill material for fixing the semiconductor chip and the wiring board. Here, as the second insulating resin 220, an adhesive containing, for example, a thermosetting resin, similar to the first insulating resin 180, can be used. And as a thermosetting resin, 1 type, or 2 or more types of mixed systems, such as an epoxy resin, a phenol resin, a polyimide resin, a polyurethane resin, a melamine resin, a urea resin, are used, for example.

  Next, as shown in FIG. 2 (e), a conductor having a plurality of electrode terminals 240 and holding the electrode terminals 240 of an electronic component 230 such as a semiconductor chip on the connection terminals 210 of the wiring board 200. Align and place on 160. Then, the electrode terminal 240 of the electronic component 230 and the connection terminal 210 of the wiring board 200 are pressurized so as to be connected via the conductor 160, and are pressed or pressed. At this time, since the tip end portion of the conductor 160 is mountain-shaped or hemispherical, it can be connected to the connection terminal 210 and the electrode terminal 240 with low pressure, for example. Further, since the applied pressure concentrates on the tip of the conductor 160 and the connection terminal 210 and the electrode terminal 240 are bitten, stable connection is possible.

  Then, as shown in FIG. 2 (f), the first insulating resin and the second insulating resin are bonded in a state where the electrode terminal 240 of the electronic component 230 and the connection terminal 210 of the wiring board 200 are pressed through the conductor 160. Heat and cure above the curing temperature of the insulating resin. Thereby, the electronic component mounting body 250 in which the electronic component 230 and the wiring board 200 are electrically connected is manufactured.

  According to Embodiment 1 of the present invention, since the conductor can be transferred by temporarily fixing to the semi-cured first insulating resin, it is possible to easily manufacture the electronic component mounting body connected at a fine pitch. In addition, since the conductor is formed by melting the solder powder in the transfer type recess, a conductor having a uniform shape can be formed. Furthermore, the shape of the conductor can be freely designed by the shape of the concave portion of the transfer mold. Therefore, for example, by making the tip of the conductor into a mountain shape, connection with a low load is possible, and the occurrence of cracks in electronic components or the like can be significantly reduced during pressure welding.

  Although Embodiment 1 of the present invention has been described with an example in which the first insulating resin and the second insulating resin are formed of different resin materials, the present invention is not limited thereto. For example, the first insulating resin and the second insulating resin may be the same. Thereby, since it can produce without considering the difference in adhesiveness or a curing temperature, it can be made excellent in productivity.

  Further, in the first embodiment of the present invention, the transfer-type concave portion has been described as an example of a two-stage shape such as a countersunk screw shape, but the present invention is not limited to this. For example, a cone or a pyramid shape may be used, and there is no particular limitation as long as a plurality of conductors can be formed uniformly.

  Below, the modification of the manufacturing method of the electronic component mounting body which concerns on Embodiment 1 of this invention is demonstrated using FIG.

  In FIG. 3, the first embodiment is different from the first embodiment in that the conductor is transferred to the electrode terminal of the electronic component in the manufacturing process shown in FIG. The other steps are the same as those in FIG.

  That is, first, as shown in FIG. 3A, an electronic component 300 such as a semiconductor chip, on which a concave surface of the transfer-type intermediate structure 190 of FIG. 1F and a plurality of electrode terminals 310 are formed. The electrode terminal 310 is aligned.

  Next, as shown in FIG. 3B, the electrode terminal 310 of the electronic component 300 and the concave portion 110 surface of the transfer-type intermediate structure 190 are placed facing each other. In this state, the first insulating resin 180 is heated at a temperature equal to or lower than the curing temperature of the first insulating resin 180 to make the first insulating resin 180 semi-cured. For example, when the first insulating resin 180 is an epoxy resin, the heating temperature is 120 ° C. and the heating time is about 60 minutes.

  Next, as shown in FIG. 3C, the conductor 160 held by the semi-cured first insulating resin 180 is formed on the electrode terminal 310 of the electronic component 300 by peeling the transfer mold. Transcribed.

  Next, as shown in FIG. 3D, a second insulating resin 320 on the connection terminal 410 of the wiring board 400 is formed.

  Next, as shown in FIG. 3 (e), it is held on the electrode terminal 310 of the electronic component 300 through the second insulating resin 320 on the wiring board 400 having the plurality of connection terminals 410. The conductor 160 and the connection terminal 410 are aligned and placed. Further, the electrode terminal 310 of the electronic component 300 and the connection terminal 410 of the wiring board 400 are pressurized so as to be connected via the conductor 160, and are pressed or pressed. At this time, since the tip of the conductor 160 has a mountain shape or a hemispherical shape, it can be connected to, for example, the connection terminal 410 or the electrode terminal 310 with a low pressure. In addition, since the applied pressure is concentrated on the front end portion of the conductor 160, the connection with the connection terminal 410 and the electrode terminal 310 biting in is possible.

  Then, as shown in FIG. 3 (f), the first insulating resin 180 and the second insulating resin 180 are connected in a state where the electrode terminal 310 of the electronic component 300 and the connection terminal 410 of the wiring board 400 are pressed through the conductor 160. The insulating resin 320 is cured at a temperature equal to or higher than the curing temperature. Thereby, the electronic component mounting body 450 in which the electronic component 300 and the wiring board 400 are electrically connected is manufactured.

  According to the modification of the first embodiment of the present invention, the same effect as in the first embodiment can be obtained.

(Embodiment 2)
Below, the manufacturing method of the electronic component mounting body which concerns on Embodiment 2 of this invention is demonstrated using FIG.

  In FIG. 4, the method for forming the second insulating resin is different from that of the first embodiment in the manufacturing process shown in FIG. Other steps are the same as those in the first embodiment, and a description thereof will be omitted.

  That is, first, as shown in FIG. 4A, a wiring board 200 having a conductor 160 held by a semi-cured first insulating resin 180 on a connection terminal 210 of the wiring board 200 is prepared. To do. This wiring board 200 is shown in FIG. 2C of the electronic component mounting body 250 formed by the manufacturing method of the first embodiment.

  Next, as shown in FIG. 4B, the electrode terminal 510 of the electronic component 500 and the conductor 160 are positioned and placed facing each other. Then, the electrode terminal 510 of the electronic component 500 and the connection terminal 210 of the wiring substrate 200 are pressurized so as to be connected via the conductor 160, and are pressed or pressed. At this time, since the tip of the conductor 160 has a mountain shape or a hemispherical shape, it can be connected to the connection terminal 210 and the electrode terminal 510 with a low pressure, for example. Further, since the applied pressure concentrates on the tip of the conductor 160 and the connection terminal 210 and the electrode terminal 510 are bitten, stable connection is possible.

  Next, as shown in FIG. 4C, the second insulating resin 520 is placed in a state in which the conductor 160 is bitten into the connection terminal 210 of the wiring board 200 and the electrode terminal 510 of the electronic component 500, for example. Injecting into the gap 540 from, for example, the outer peripheral side surface of the electronic component 500 using an injection device 530 such as a dispenser. Here, the gap 540 is a space in which the electronic component 500 and the wiring board 200 are formed via the conductor 160. Note that the second insulating resin 520 may be injected by utilizing a capillary phenomenon, or may be injected by reducing the pressure on the portion other than the injection side.

  Further, in a state where the injection is completed, the first insulating resin 180 and the second insulating resin 520 are heated and cured at a temperature equal to or higher than the curing temperature. For example, when the first insulating resin 180 and the second insulating resin 520 are epoxy resins, the heating temperature is about 160 ° C. and the heating time is about 60 minutes.

  Through the above process, as shown in FIG. 4D, an electronic component mounting body 550 in which the electronic component 500 and the wiring board 200 are electrically connected by the conductor 160 is manufactured.

  Below, the modification of the manufacturing method of the electronic component mounting body which concerns on Embodiment 2 of this invention is demonstrated using FIG.

  In FIG. 5, the second embodiment is different from the second embodiment in that the conductor held by the first insulating resin is formed on the electrode terminal of the electronic component. The other steps are the same as those in FIG.

  According to the second embodiment of the present invention and the modification thereof, the electrode terminal of the electronic component or the connection terminal of the wiring board and the conductor are directly connected by pressure contact, so that the second insulating resin or the like is not interposed. . As a result, it is possible to manufacture an electronic component mounting body with further improved connection reliability.

(Embodiment 3)
Below, the manufacturing method of the electronic component mounting body which concerns on Embodiment 3 of this invention is demonstrated using FIG.

  In FIG. 6, the first embodiment is different from the first embodiment in that the conductor in pressure contact state is remelted to connect the electrode terminal of the electronic component and the connection terminal of the wiring board.

  That is, first, as shown in FIG. 6A, a wiring substrate 700 having a conductor 160 held by a semi-cured first insulating resin 180 on a connection terminal 710 of the wiring substrate 700 is prepared. To do. This wiring board 700 is the same as FIG. 2C of the electronic component mounting body 250 formed by the manufacturing method of the first embodiment.

  Next, as shown in FIG. 6B, the second insulating property is formed on the connection terminal 710 of the wiring board 700 onto which the conductor 160 held by the semi-cured first insulating resin 180 is transferred. Resin 720 is formed. The second insulating resin 720 is preferably formed to a thickness at least about the height of the conductor 160. This is because if it is thinner than the conductor 160, it does not function as an underfill material with a semiconductor chip, for example. Here, as the second insulating resin 720, for example, an adhesive containing a thermosetting resin similar to the first insulating resin 180 can be used. And as a thermosetting resin, 1 type, or 2 or more types of mixed systems, such as an epoxy resin, a phenol resin, a polyimide resin, a polyurethane resin, a melamine resin, a urea resin, are used, for example.

  Next, as shown in FIG. 6 (c), a conductor having a plurality of electrode terminals 810 and holding the electrode terminals 810 of an electronic component 800 such as a semiconductor chip on the connection terminals 710 of the wiring board 700. Align and place on 160. Further, pressure is applied so that the electrode terminal 810 of the electronic component 800 and the connection terminal 710 of the wiring board 700 are in contact with each other through the conductor 160. At this time, since the conductor 160 has a mountain shape or a hemispherical shape, it can be connected to, for example, the connection terminal 710 or the electrode terminal 810 with a small applied pressure. In addition, since the applied pressure is concentrated on the tip of the conductor 160, connection in a state where the connection terminal 710 and the electrode terminal 810 are bitten is possible. In this case, since the conductor 160 is remelted and electrically connected, it is not always necessary to apply a pressing force to bring the conductor 160 into a bite state.

  6D, the electrode terminal 810 of the electronic component 800 and the connection terminal 710 of the wiring board 700 are brought into contact with each other through the conductor 160, and the first insulation is maintained while maintaining the distance therebetween. The resin is heated at a temperature equal to or higher than the curing temperature of the conductive resin and the second insulating resin and equal to or higher than the melting point of the conductor. Thereby, for example, the conductor 160 made of solder tends to spread on each terminal surface because it has high wettability with the electrode terminal of the electronic component and the connection terminal of the wiring board. And since the space | interval of an electronic component and a wiring board is kept constant, the drum-shaped conductive layer 820 is formed. At the same time, the first insulating resin and the second insulating resin are cured to produce an electronic component mounting body 850 in which the electronic component and the wiring board are fixed.

  Note that the relationship between the melting point of the conductor and the curing temperatures of the first insulating resin and the second insulating resin is not particularly limited. However, when the drum-shaped conductive layer is formed, it is preferable that the melting point of the conductor is lower than the curing temperature of the first insulating resin and the second insulating resin. This is because, when the first insulating resin and the second insulating resin are cured first, even if the conductor is melted, it cannot spread on each terminal surface.

  According to the third embodiment of the present invention, the electrode terminal of the electronic component and the connection terminal of the wiring board can be reliably connected by the conductive layer.

  In addition, since the conductor is melted and connected, the applied pressure at the time of pressure contact between the conductor, the electrode terminal, and the connection terminal can be applied with a low load. As a result, it is possible to manufacture a highly reliable electronic component mounting body that is unlikely to cause damage to the electronic component.

  Below, the modification of the manufacturing method of the electronic component mounting body which concerns on Embodiment 3 of this invention is demonstrated using FIG.

  In FIG. 7, the second insulating resin is formed differently from the third embodiment.

  That is, first, as shown in FIG. 7A, a wiring board 700 having a conductor 160 held by a first insulating resin 180 in a semi-cured state on a connection terminal 710 of the wiring board 700 is prepared. To do. This wiring board 700 is shown in FIG. 2C of the electronic component mounting body 250 formed by the manufacturing method of the first embodiment.

  Next, as shown in FIG. 7B, the electrode terminal 810 of the electronic component 800 and the conductor 160 are aligned and placed facing each other. Then, pressure is applied so that the electrode terminal 810 of the electronic component 800 and the connection terminal 710 of the wiring board 700 are in contact with each other through the conductor 160.

  Further, in a state where the connection terminal 710 of the wiring substrate 700 and the electrode terminal 810 of the electronic component 800 are in contact with each other through the conductor 160, the second insulating resin 720 is used using an injection device 830 such as a dispenser. Inject into gap 840. Here, the gap 840 is a space in which the electronic component 800 and the wiring board 700 are formed by the conductor 160. Note that the second insulating resin 720 may be injected using a capillary phenomenon, or may be injected by reducing the pressure on the other side than the injection side. As a result, as shown in FIG. 7C, the electronic component 800 and the wiring board 700 are connected by the second insulating resin 720 via the conductor 160.

  7D, the electrode terminal 810 of the electronic component 800 and the connection terminal 710 of the wiring board 700 are brought into contact with each other through the conductor 160, and the first insulation is maintained while maintaining the distance therebetween. The resin is heated at a temperature equal to or higher than the curing temperature of the conductive resin and the second insulating resin and equal to or higher than the melting point of the conductor. Thereby, for example, a conductor made of solder has high wettability with the electrode terminals 810 of the electronic component 800 and the connection terminals 710 of the wiring board 700, and therefore tends to spread over the entire terminal surfaces. At this time, if the wettability with each terminal is higher than the surface tension of the solder, the interval between the electronic component 800 and the wiring board 700 is kept constant, so that the drum-shaped conductive layer 820 is formed. At the same time, by curing the first insulating resin and the second insulating resin, the electronic component mounting body 850 to which the electronic component 800 and the wiring board 700 are fixed is manufactured.

  In addition, since at least one of the first insulating resin and the second insulating resin can further improve the wettability with each terminal at the time of remelting a conductor such as solder, the one containing, for example, a flux or the like preferable.

  According to the modification of the third embodiment of the present invention, the same effect as in the third embodiment can be obtained. Furthermore, since the electrode terminal of the electronic component or the connection terminal of the wiring board and the conductor are directly connected by pressure contact, the second insulating resin or the like is not interposed. As a result, it is possible to manufacture a highly reliable electronic component mounting body in which variation in contact resistance is small and stable connection is realized.

  INDUSTRIAL APPLICABILITY According to the present invention, it is useful in the technical field of mounting electronic components such as large-scale integrated circuits and large-area semiconductor elements typified by imaging elements or packages on which these are mounted on a wiring board.

Process sectional drawing explaining the manufacturing method of the electronic component mounting body which concerns on Embodiment 1 of this invention Process sectional drawing explaining the manufacturing method of the electronic component mounting body which concerns on Embodiment 1 of this invention Process sectional drawing explaining the modification of the manufacturing method of the electronic component mounting body which concerns on Embodiment 1 of this invention Process sectional drawing explaining the manufacturing method of the electronic component mounting body which concerns on Embodiment 2 of this invention Process sectional drawing explaining the modification of the manufacturing method of the electronic component mounting body which concerns on Embodiment 2 of this invention Process sectional drawing explaining the manufacturing method of the electronic component mounting body which concerns on Embodiment 3 of this invention Process sectional drawing explaining the modification of the manufacturing method of the electronic component mounting body which concerns on Embodiment 3 of this invention Sectional drawing explaining the conventional protruding electrode

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Transfer mold 110 Recessed part 120 Conductor formation hole 130 Conductor holding hole 140 Conductive material 150 Squeegee 160 Conductor 170 Space part 180 First insulating resin 190 Transfer type intermediate structure 200, 400, 700 Wiring board 210, 410, 710 Connection terminal 220, 320, 520, 720 Second insulating resin 230, 300, 500, 800 Electronic component 240, 310, 510, 810 Electrode terminal 250, 450, 550, 850 Electronic component mounting body 530 , 830 Injection device 540, 840 Gap 820 Conductive layer

Claims (13)

A method of manufacturing an electronic component mounting body for electrically connecting a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals,
A step of filling a conductive material in the concave portion of the transfer mold provided with a concave portion having a shape of two or more stages corresponding to the plurality of connection terminals;
Heating the conductive material and then curing it to form a conductor, and forming a space in the recess by curing shrinkage of the conductive material;
Filling the space with a first insulating resin;
A step of aligning and placing the concave portion of the transfer mold facing the connection terminal;
Heating at least at a temperature at which the first insulating resin is in a semi-cured state;
Peeling the transfer mold;
Forming a second insulating resin on the surface of the wiring board on which the conductor is formed;
Facing the conductor and aligning the electrode terminals of the electronic component;
A method of manufacturing an electronic component mounting body, comprising: connecting the connection terminal and the electrode terminal via the conductor, and curing the second insulating resin. A method of manufacturing an electronic component mounting body for electrically connecting a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals,
A step of filling a conductive material into the concave portion of the transfer mold provided with concave portions of two or more steps corresponding to the plurality of electrode terminals;
Heating the conductive material and then curing it to form a conductor, and forming a space in the recess by curing shrinkage of the conductive material;
Filling the space with a first insulating resin;
A step of aligning and placing the concave portion of the transfer mold facing the electrode terminal;
Heating at least at a temperature at which the first insulating resin is in a semi-cured state;
Peeling the transfer mold;
Forming a second insulating resin on the surface of the wiring board on which the electrode terminals are formed;
Facing the conductor, aligning the connection terminals of the wiring board;
A method of manufacturing an electronic component mounting body, comprising: connecting the connection terminal and the electrode terminal via the conductor, and curing the second insulating resin. A method of manufacturing an electronic component mounting body for electrically connecting a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals,
A step of filling a conductive material in the concave portion of the transfer mold provided with a concave portion having a shape of two or more stages corresponding to the plurality of connection terminals;
Heating the conductive material and then curing it to form a conductor, and forming a space in the recess by curing shrinkage of the conductive material;
Filling the space with a first insulating resin;
A step of aligning and placing the concave portion of the transfer mold facing the connection terminal;
Heating at least at a temperature at which the first insulating resin is in a semi-cured state;
Peeling the transfer mold;
Facing the conductor and aligning the electrode terminals of the electronic component;
Connecting the connection terminal and the electrode terminal via the conductor;
The manufacturing method of the electronic component mounting body characterized by including the process of inject | pouring 2nd insulating resin in the clearance gap between the said connection terminal and the said electrode terminal, and hardening | curing said 2nd insulating resin. A method of manufacturing an electronic component mounting body for electrically connecting a wiring board provided with a plurality of connection terminals and an electronic component provided with a plurality of electrode terminals corresponding to the connection terminals,
A step of filling a conductive material into the concave portion of the transfer mold provided with concave portions of two or more steps corresponding to the plurality of electrode terminals;
Heating the conductive material and then curing it to form a conductor, and forming a space in the recess by curing shrinkage of the conductive material;
Filling the space with a first insulating resin;
A step of aligning and placing the concave portion of the transfer mold facing the electrode terminal;
Heating at least at a temperature at which the first insulating resin is in a semi-cured state;
Peeling the transfer mold;
Facing the conductor, aligning the connection terminals of the wiring board;
Connecting the connection terminal and the electrode terminal via the conductor;
The manufacturing method of the electronic component mounting body characterized by including the process of inject | pouring 2nd insulating resin in the clearance gap between the said connection terminal and the said electrode terminal, and hardening | curing said 2nd insulating resin. The method for manufacturing an electronic component mounting body according to any one of claims 1 to 4, wherein the concave portion has a countersunk screw shape. The method for manufacturing an electronic component mounting body according to any one of claims 1 to 4, wherein the step of connecting the connection terminal and the electrode terminal is pressure bonding, pressure welding, or ultrasonic bonding. The method for manufacturing an electronic component mounting body according to any one of claims 1 to 4, wherein the step of connecting the connection terminal and the electrode terminal is performed by remelting the conductor. The method for manufacturing an electronic component mounting body according to any one of claims 1 to 4, wherein the conductive material is solder powder or solder paste. The method for manufacturing an electronic component package according to any one of claims 1 to 4, wherein the first insulating resin and the second insulating resin are made of a thermosetting resin. The method for manufacturing an electronic component mounting body according to any one of claims 1 to 4, wherein the first insulating resin and the second insulating resin are made of the same resin material. 5. The method of manufacturing an electronic component mounting body according to claim 1, wherein at least one of the first insulating resin and the second insulating resin contains a flux. 6. The method for manufacturing an electronic component mounting body according to any one of claims 1 to 4, wherein the transfer mold is a transfer resin having a low elastic modulus and a high releasability. 13. The method of manufacturing an electronic component package according to claim 12, wherein the transfer resin is a thermosetting silicone resin.

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